Migration to S29GL

Migration to S29GL
Migrating to the Spansion® S29GL-P
Flash Family from Numonyx 130 nm
Embedded Flash Memory (J3)/130 nm
StrataFlash® Embedded Memory (P30)
Devices
Application Note
1. Introduction
This application note provides conversion guidelines to Spansion S29GL-P flash family devices from
Numonyx Embedded Memory (J3) and Numonyx StrataFlash® Embedded Memory (P30) devices.
This application note is based on information available to date from data sheets and other application notes
publicly available from both Spansion and Numonyx. There may be specification updates that are not
incorporated in this document. Please verify all relevant specifications (i.e. Data Sheets and Specification
Bulletins) before finalizing any designs.
2. Feature Comparison
Spansion flash family devices are 3.0 V single power (VCC = 2.7-3.6V) flash memory manufactured using
90 nm MirrorBit® technology. The S29GL-P product family includes densities from 128 Mb to 1 Gb.
Key attributes of Spansion S29GL-P products are
 Ease-of-Use: Seamless package and pinout transition between densities.
 High Performance: Fast Read, Program and Erase times.
 Advanced Sector Protection: Robust security feature allows for complete and total control of security levels
for each and every sector.
 Enhanced Versatile I/O™: Wide I/O voltage range from 1.65V to 3.6V to support various applications.
Publication Number Migration_to_S29GL-P_AN
Revision 01
Issue Date July 1, 2010
A pplication
Note
Table 2.1 Feature Comparisons between Spansion S29GL-P Flash Family and
Numonyx Embedded Flash Memory (J3 - 130 nm)
Product Specification
Feature
Spansion S29GL-P Flash Family
Numonyx Embedded Flash Memory
(J3 - 130 nm)
128 Mb, 256 Mb, 512 Mb, 1 Gb
Density
(For 32 Mb and 64 Mb, please refer to
Spansion S29GL-N data sheet)
Package (Pinout Style)
56-Pin TSOP
(Spansion, 128 Mb to 1 Gb)
56-lead TSOP
(J3, 32 Mb to 256 Mb)
64-ball
(Spansion, 128 Mb to 1 Gb)
11 x 13 x 1.4 mm
64-ball Easy BGA
(J3, 32 Mb to 256 Mb)
10 x 13 x 1.2 mm
Fortified BGA
Operating Voltage
Range
VCC (Core)
VIO (I/O)
Data Bus
Sector Architecture
32 Mb, 64 Mb, 128 Mb, 256 Mb
3.0 - 3.6V, 2.7 - 3.6V
2.7 - 3.6V
1.65 - 3.6V
2.7 - 3.6
x8/x16
x8/x16
Uniform 128-KByte
Uniform 128-KByte
128 Mb: 90/100/110 ns
Asynchronous Initial
Access
Read
Synchronous
Erase
Temperature Range
2
32-128 Mb: 75 ns
256 Mb: 95 ns
1 Gb: 110/120/130 ns
Asynchronous Page
Access
Program
256 Mb: 90/100/110 ns
512 Mb: 100/110/120 ns
25 ns (8 word)
NA
15 µs (32-Word Write Buffer - Per Word)
60 µs (Single Word)
25 ns (4/8 word)
NA
8 µs (16-Word Write Buffer - Per Word)
40 µs (Single Word)
0.5 sec per sector
1.0 sec per sector
0°C to +70°C, –40°C to +85°C
–40°C to +85°C
Intel J3/P30 to Spansion S29GL-P
Migration_to_S29GL-P_AN_01 July 1, 2010
Ap pl ic atio n
No t e
Table 2.2 Feature Comparisons between Spansion S29GL-P Flash Family and
Numonyx StrataFlash Embedded Memory (P30 - 130 nm)
Product Specification
Feature
Spansion S29GL-P Flash Family
128 Mb, 256 Mb, 512 Mb, 1 Gb
Density
(For 64 Mb, please refer to
Spansion S29GL-N data sheet)
56-Pin
(Spansion, 128 Mb to 1 Gb)
TSOP
64-ball
Fortified BGA
(Spansion, 128 Mb to 1 Gb)
11 x 13 x 1.4 mm
Numonyx StrataFlash Embedded Memory
(P30 - 130 nm)
64 Mb, 128 Mb, 256 Mb
512 Mb (2 x 256 Mb Die)
56-lead TSOP
(P30, 64 Mb to 512 Mb)
10 x 13 x 1.2 mm
(P30, 64 Mb to 256 Mb)
64-ball Easy BGA
10 x 13 x 1.3 mm
(P30, 512 Mb)
Package (Pinout Style)
(P30, 512 Mb)
8 x 11 x 1.2mm
NA
(P30, 256 Mb)
8 x 11 x 1.0mm
Quad+ SCSP
(P30, 64 Mb, 128 Mb)
8 x 10 x 1.2mm
Operating Voltage
Range
VCC (Core)
VIO (I/O)
Data Bus
3.0 - 3.6V, 2.7 - 3.6V
1.7 - 2.0V
1.65 - 3.6V
1.7 - 3.6V
x8/x16
Sector Architecture
Uniform 128-KByte
x16
128-Kbyte (Main Blocks)
4 x 32-Kbyte (Parameter Blocks)
128 Mb: 90/100/110 ns
Asynchronous
Initial Access
Read
256 Mb: 90/100/110 ns
64–128 Mb: 85 ns
512 Mb: 100/110/120 ns
256-512 Mb: 88/95 ns
1 Gb: 110/120/130 ns
Asynchronous
Page Access
Synchronous
Program
Erase
Temperature Range
July 1, 2010 Migration_to_S29GL-P_AN_01
25 ns (8 word)
25 ns (4/8 word)
NA
40 MHz
15 µs (32-Word Write Buffer - Per Word)
13.8 µs (32-Word Write Buffer - Per Word)
60 µs (Single Word)
90 µs (Single Word)
0.5 sec per sector
1.2 sec per sector
0°C to +70°C, –40°C to +85°C
–40°C to +85°C
Intel J3/P30 to Spansion S29GL-P
3
A pplication
3.
Note
Security Feature
Spansion S29GL-P Flash Family devices feature Advanced Sector Protection, which allows robust and
complete user-defined security level. Spansion Advanced Sector Protection replaces less secure hardware
lock-hard methods; and removes the possibility of hardware hacking, where secure data may be
compromised with the application of either high or low voltage on certain flash pins.
Spansion Advanced Sector Protection also includes a unique Password Protection method, allowing an even
higher level of security. The Password Protection Method is a highly sophisticated protection method that
requires a 64-bit, user-defined password before any sectors can be unlocked.
Table 3.1 Security Comparisons between Spansion S29GL-P Flash Family and
Numonyx Embedded Flash Memory (J3) and Numonyx StrataFlash Embedded Memory (P30)
Spansion S29GL-P Flash Memory
Numonyx Embedded Flash Memory
(J3)
Numonyx StrataFlash Embedded
Memory (P30)
Software Locking and
Unlocking of
Individual Sectors
Spansion Advanced Sector Protection:
Locking individual sector is allowed
Unlocking individual sector is allowed
Password Protection (optional feature)
further increases sector protection
Locking individual block is allowed via
software
Unlocking individual block is not allowed.
All locked blocks must be unlocked in
parallel.
Locking individual block is allowed
Unlocking individual block is not allowed.
All locked blocks must be unlocked in
parallel.
Hardware Protection
WP# locks highest or lowest sector
(Spansion offers Advanced Sector
Protection for even greater security)
VPEN = GND
WP# hardware locks any Locked-Down
Blocks
VPP = GND
OTP Space
128 Word Secure Silicon Region
(Factory lock or customer lock option)
128 bit Protection Register
(64 bit User Programmable)
(64 bit Unique Device Identifier)
17 x 128 bit OTP Registers
(64 bits programmed at Numonyx factory)
Additional Options
Password Protection
NA
4 optional OTP blocks in the main array
Security Features
4
Intel J3/P30 to Spansion S29GL-P
Migration_to_S29GL-P_AN_01 July 1, 2010
Ap pl ic atio n
4.
No t e
Package and Pinout
Spansion S29GL-P Flash Family devices allow flexibility between densities with seamless package and
pinout offerings. Spansion S29GL-P is also pinout and package compatible to other Spansion flash families,
such as the S29AL016J and S29GL-N. Contact your local Spansion representative or respective data sheets
for further details.
By comparison, Numonyx devices vary package types and sizes as well as pinouts depending on density.
4.1
56 Pin TSOP Pinout Comparison
The 56-pin TSOP pinouts of Spansion and Numonyx are different. Migration from Numonyx products in
56-pin TSOP to the Spansion S29GL-P will require a board-level change.
Figure 4.1 56 Pin TSOP Pinout Comparisons between Spansion S29GL-P Flash Family and Numonyx
Embedded Flash Memory (J3) and Numonyx StrataFlash Embedded Memory (P30)
Intel
StrataFlash
Embedded
Memory
(P30)
A16
A15
A14
A13
A12
A11
A10
A9
A23
A22
A21
VSS
VCC
WE#
WP#
A20
A19
A18
A8
A7
A6
A5
A4
A3
A2
A24
A25
VSS
Spansion
S29GL-P
Flash
Family
Spansion
Intel
StrataFlash S29GL-P
Memory
Flash
(J3)
Family
A22
CE1
A21
A20
A19
A18
A17
A16
VCC
A15
A14
A13
A12
CE0
VPEN
RP#
A11
A10
A9
A8
GND
A7
A6
A5
A4
A3
A2
A1
A23
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RESET#
A21
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Spansion
S29GL-P
56-Tpin
TSOP
Standard
Pinout
Top View
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
Intel
StrataFlash
Memory
(J3)
A24
A25
A16
BYTE#
VSS
DQ15 /A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
NC
VIO
A24
WE#
OE#
STS
DQ15
DQ7
DQ14
DQ6
GND
DQ13
DQ5
DQ12
DQ4
VCCQ
GND
DQ11
DQ3
DQ10
DQ2
VCC
DQ9
DQ1
DQ8
DQ0
A0
BYTE#
A23
CE2
Intel
StrataFlash
Embedded
Memory
(P30)
WAIT
A17
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
ADV#
CLK
RST#
VPP
DQ11
DQ3
DQ10
DQ2
VCCQ
DQ9
DQ1
DQ8
DQ0
VCC
OE#
VSS
CE#
VIO
Notes for the S29GL-P:
1. Pin 1 is NC on the S29GL128P.
2. Pin 56 is NC on the S29GL256P, and S29GL128P.
3. Pin 55 is NC on the S29GL512P, S29GL256P, and S29GL128P.
July 1, 2010 Migration_to_S29GL-P_AN_01
Intel J3/P30 to Spansion S29GL-P
5
A pplication
4.2
Note
BGA Pinout Comparisons
Spansion offers Spansion pinout Fortified BGA which allows backwards and forward compatibility within the
S29GL-P family as well as other Spansion flash families.
Easy BGA pinouts are different from Spansion's Fortified BGA packages. Migration from Easy BGA products
to the Spansion S29GL-P will require a board-level change.
4.3
Spansion 64-ball Fortified BGA Pinout vs. J3 Easy BGA Pinout
Figure 4.2 Spansion S29GL-P Fortified BGA
Figure 4.2 Numonyx Embedded Flash Memory
(J3 - 130 nm) Easy BGA
64-ball Fortified BGA
Top View, Balls Facing Down
A8
B8
C8
D8
E8
F8
G8
NC
A22
A231
VI0
VSS
A242
A253
NC
A7
B7
C7
D7
E7
F7
G7
H7
A13
A12
A14
A15
A16
A6
B6
C6
D6
E6
F6
G6
H6
BYTE# DQ15/A-1
H8
VSS
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
A5
B5
C5
D5
E5
F5
G5
H5
WE#
RESET#
A21
A19
DQ5
DQ12
VCC
DQ4
A4
B4
C4
D4
E4
F4
G4
H4
A18
A20
DQ2
DQ10
DQ11
DQ3
C3
D3
E3
F3
G3
H3
RY/BY# WP#/ACC
A3
B3
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A2
B2
C2
D2
E2
F2
G2
H2
A3
A4
A2
A1
A0
CE#
OE#
VSS
A1
B1
C1
D1
E1
F1
G1
H1
NC
NC
NC
NC
NC
VI0
NC
NC
A22
CE1#
A21
A17
STS
OE#
WE#
A24
256M
A18
A19
A20
A16
D15
RFU
D14
D7
VCC
RFU
RFU
RFU
RFU
RFU
D6
VSS
A13
A14
A15
RFU
D4
D12
D5
D13
VPEN
CEO#
A12
RP#
D3
D11
VCCQ
VSS
A8
A9
A10
A11
D9
D10
D2
VCC
A6
VSS
A7
A5
D1
D0
A0
RFU
A1
A2
A3
A4
D8
BYTE#
B
C
D
E
F
A23
128M
G
CE2#
A
H
Notes:
1. NC on S29GL128P.
2. NC on S29GL128P and S29GL256P.
3. NC on S29GL128P, S29GL256P and S29GL512P.
Table 4.1 Work-around to Convert from Numonyx Embedded Flash Memory (J3 - 130 nm) to Spansion S29GL-P
Spansion
Numonyx
Numonyx J3 Description
Work-Around
WP#/ACC
VPEN
VIH enables erasing, programming or configuring lock-bits. With
VIL, memory contents cannot be altered.
CE#
CE0#
Chip enable activates the device.
N/A
N/A
CE1#
Chip enable activates the device. Selects multiple devices—can
be tied to ground for single Flash.
N/A for single Flash device. PCB change required to
support multiple Spansion Flash.
N/A
CE#2
Chip enable activates the device. Selects multiple devices—can
be tied to ground for single Flash.
N/A for single Flash device. PCB change required to
support multiple Spansion Flash.
RESET#
RP#
Reset/Power-Down Pin. VIL resets and places the device in
power-down mode. VIH enables normal operation.
N/A
RY/BY#
STS
Provides the status of the device. In default mode, acts as RY/
BY# signal. Can be configured to generate an interrupt when a
program/erase operation is complete.
N/A if used as RY/BY#. No work-around available for
interrupt.
DQ15/A-1
A0
Byte-Select Address is the lowest order bit in x8 mode. Not used
in x16 mode.
VIO
VCCQ
I/O Power Supply supports 2.7 V-3.6V (tied to VCC).
6
Intel J3/P30 to Spansion S29GL-P
Set the PPB Lock Bit. (Global Volatile Sector Protection
Freeze Command)
N/A: For Spansion model numbers 01 and 02.
Migration_to_S29GL-P_AN_01 July 1, 2010
Ap pl ic atio n
4.4
No t e
Spansion 64-ball Fortified BGA Pinout vs. P30 Easy BGA Pinout
Figure 4.3 Numonyx StrataFlash Embedded Memory
(P30 - 130 nm) Easy BGA
Figure 4.3 Spansion S29GL-P Fortified BGA
512 Mb
256 Mb
64-ball Fortified BGA
Top View, Balls Facing Down
A8
B8
C8
D8
E8
F8
G8
H8
NC
A22
A231
VI0
VSS
A242
A253
NC
A7
B7
C7
D7
E7
F7
G7
H7
A13
A12
A14
A15
A16
A6
B6
C6
D6
E6
F6
G6
H6
BYTE# DQ15/A-1
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
B5
C5
D5
E5
F5
G5
H5
WE#
RESET#
A21
A19
DQ5
DQ12
VCC
DQ4
A4
B4
C4
D4
E4
F4
G4
H4
A18
A20
DQ2
DQ10
DQ11
DQ3
A3
B3
C3
D3
E3
F3
G3
H3
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A2
B2
C2
D2
E2
F2
G2
H2
A3
A4
A2
A1
A0
CE#
OE#
VSS
A1
B1
C1
D1
E1
F1
G1
H1
NC
NC
NC
NC
NC
VI0
NC
NC
A22
RFU
A21
A17
RFU
OE#
WE#
A24
A18
A19
A20
A16
DQ15
WAIT
DQ14
DQ7
VCC
A25
WP#
VCCQ
CLK
ADV#
DQ6
VSS
A13
A14
A15
VCCQ
DQ4
DQ12
DQ5
DQ13
VPP
CE#
A12
RST#
DQ3
DQ11
VCCQ
VSS
A8
A9
A10
A11
DQ9
DQ10
DQ2
VCC
A6
VSS
A7
A5
DQ1
DQ0
RFU
VSS
A1
A2
A3
A4
DQ8
RFU
A23
RFU
A
B
C
D
E
F
G
H
7
VSS
A5
RY/BY# WP#/ACC
8
6
5
4
3
2
1
128 Mb
Notes:
1. NC on S29GL128P.
2. NC on S29GL128P and S29GL256P.
3. NC on S29GL128P, S29GL256P and S29GL512P.
Table 4.2 Work-around to Convert from Numonyx StrataFlash Embedded Memory (P30 - 130 nm) to Spansion S29GL-P
Spansion
Numonyx
Numonyx P30 Description
Work-Around
WP#/ACC
VPP
VPP = GND memory contents cannot be altered.
Set the PPB Lock Bit. (Global Volatile Sector Protection Freeze
Command)
WP#/ACC
WP#
Hardware locks any Locked-Down Blocks
Spansion At VIL, disables program and erase functions in the
outermost sectors. Use Advance Sector Protection to lock and
unlock any sectors
RESET#
RST#
Reset: VIL resets and places the device. VIH enables normal
operation
N/A
VIO
VCCQ
Output Power Supply
If I/O's need to be <VCC, use Spansion model numbers V1 and V2.
N/A
N/A
CLK
Clock to synchronous operations
RY/BY#
N/A
Function not supported.
N/A
N/A
ADV#
I/O Power Supply supports 2.7V-3.6V (tied to VCC).
N/A
N/A
WAIT
Address Valid: Address are latched on the rising edge of
ADV# for synchronous operations
N/A
N/A
BYTE#
N/A
Drive BYTE# to VIH
July 1, 2010 Migration_to_S29GL-P_AN_01
Intel J3/P30 to Spansion S29GL-P
7
A pplication
5.
Note
Spansion Software Support
The J3 and P30 command sets are proprietary and will require SW redesign to an industry standard Flash
command set.
Spansion is dedicated to providing customers with world-class technical service and support. To assist
development of Spansion Flash memory, Spansion offers a full range of software and support tools which
simplifies design and shorten time to market.
Spansion royalty free software tools include:
 Low Level Drivers (LLD)
 Enhanced Flash Driver (EFD)
 Data Management Software (DMS)
 Spansion File System (SSP)
For more information, ask your Spansion representative or visit the Spansion web site at
http://www.spansion.com/support/.
Technical software support is available by e-mail to [email protected]
8
Intel J3/P30 to Spansion S29GL-P
Migration_to_S29GL-P_AN_01 July 1, 2010
App l ic atio n
No t e
6. Revision History
Section
Description
Revision 01 (July 1, 2010)
Initial release
July 1, 2010 Migration_to_S29GL-P_AN_01
Intel J3/P30 to Spansion S29GL-P
9
A pplication
Note
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2010 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, EcoRAM™
and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names
used are for informational purposes only and may be trademarks of their respective owners.
10
Intel J3/P30 to Spansion S29GL-P
Migration_to_S29GL-P_AN_01 July 1, 2010
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