TI Wireless Solutions Guide

TI Wireless Solutions Guide
Wireless Handsets
Solutions Guide
2008
Wireless Handsets Solutions Guide
2
Table of Contents
Technologies
Overview of Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
DRP™ Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
M-Shield™ Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
SmartReflex™ Power and Performance Management Technology . . . . . . . . . . . . . . . . . . .7
TCS Chipset Solutions
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
TCS2010 (GSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
TCS2110 (GPRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
TCS2200 (GPRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
TCS2300 LoCosto™ Solution (GSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
TCS2310 LoCosto™ Solution (GPRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
TCS2305 LoCosto™ Solution (GSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
TCS2315 LoCosto™ Solution (GPRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
TCS2600 (GPRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
TCS2700 (GPRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
OMAP850 (EDGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
OMAPV1030 (EDGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
OMAPV1035 (EDGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Chipset Reference Designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Engaging the Wireless User
From the entry-level mobile phone to the most intelligent smartphone,
today’s wireless devices must contain a full range of multimedia
capabilities. A user experience that engages consumers will be part
instant gratification, part perpetual connectivity and part business
necessity. TI provides system-level solutions and a keen understanding
of the wireless industry, while fulfilling its customers’ requirements.
For instance, the flexible OMAP™ platform can scale its multimedia
and application processing capabilities. TI’s system expertise and track
record as a reliable, on-time supplier demonstrates its commitment to
provide flexible and open solutions to its customers and partners.
OMAP™ Platform
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Integrated Modem and Applications Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
OMAP730 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
OMAP750 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
OMAP850 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
OMAP-Vox™ Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
OMAPV1030 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
OMAPV1035 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
OMAP-DM Coprocessors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
OMAP-DM510 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Multimedia Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
OMAP331 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
High-Performance Multimedia-Rich Applications Processors . . . . . . . . . . . . . . . . . . . . . .40
OMAP1610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
OMAP1621 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
OMAP1710 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
OMAP2420 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
OMAP2430/OMAP2431 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
OMAP™ 3 Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
OMAP3440 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
OMAP3430 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
OMAP3420 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
OMAP3410 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
OMAP™ Platform Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
OMAP™ Platform Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Wireless Application Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Application Suite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
OMAP™ Gaming Development Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
OMAP™ Developer Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
OMAP™ Technology Centers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Software Development Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Mobile Connectivity Solutions
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
BlueLink™ 7.0 Bluetooth® and FM Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
BlueLink™ 6.0 Bluetooth® and FM Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
BlueLink™ 5.0 Bluetooth® Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
BRF6150 Bluetooth Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
WiLink™ 6.0 WLAN, Bluetooth® and FM Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
WiLink™ 5.0 WLAN Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
WiLink™ 4.0 WLAN Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
WLAN and Bluetooth® Coexistence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
NaviLink™ 6.0 GPS Solutjion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
NaviLink™ 5.0 GPS Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
NaviLink™ 4.0 GPS Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
Hollywood™ Mobile DTV Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
High-Performance Analog
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Wireless Handsets Solutions Guide
Texas Instruments 2008
Overview
From entry-level users to high-end technophiles, mobile device
consumers across the globe are seeking an unparalleled user
experience. At a time when mobile entertainment on handsets has
become critical, TI technology can meet the requirements of the most
demanding applications, such as GPS, 2D and 3D video gaming, stereo
FM radio, multi-megapixel digital photography, CD-quality music and
others. TI’s proven portfolio is comprised of a comprehensive selection
of wireless chipsets, low-power baseband, modem and applications
processors, digital RF technology, power management, security,
high-performance analog, mobile connectivity functions such as
single-chip Bluetooth®, Wireless LAN (WLAN) and GPS. TI wireless
solutions have always started with the broadest set of technology
building blocks, such as the OMAP™ platform with its numerous
multimedia capabilities. TI’s commitment to developing
partner relationships with its customers has led to shipments of
billions of digital basebands and other wireless solutions.
When it was introduced, the OMAP platform defined wireless
applications processing offering manufacturers a high-performance
engine to drive differentiation in multimedia for every market segment
and region. LoCosto™ solutions for entry-level mobile devices, OMAP
and OMAP-Vox™ solutions for the mid-tier to high-end devices attest to
the scalability of the technology and TI’s understanding of the distinct
needs of the industry. The OMAP platform supports all high-level operating
systems, providing flexible and open solutions to manufacturers and
third-party developers. The applications, software and tools available
through the extensive OMAP Developer Network help reduce
development time and resources for handset manufacturers.
3
Wireless Handsets Solutions Guide
TI’s DRP™ single-chip technology fulfills user demands for less expensive,
more power efficient, sleeker mobile devices. By aggressively integrating
handset electronics, DRP technology significantly reduces board space
in TI’s modem technology and mobile connectivity solutions.
TI’s system-level expertise as well as its scalable platforms facilitate
software re-use across product lines, maximizing manufacturers’
research and development.
TI provides high-performance analog products, applications knowledge
and local technical support to help you get to market faster with a
winning design. TI offers reliable, scalable and power-efficient power
management, audio, touch-screen and logic solutions for mobile
handsets.
TI’s commitment to fulfilling customer requirements has been driven
by continuous innovations in product and process technologies, as
well as a business model that includes supplying custom and chipset
solutions. TI’s process innovations include advancements to the
45-nanometer (nm) process node and new packaging techniques, both
of which effectively meet our customers’ requirements for smaller form
factors and longer battery life. TI’s scalable manufacturing capabilities
effectively manage supply-chain demands.
Texas Instruments’ wireless portfolio is a direct result of its commitment
to the growth of the wireless industry and, more importantly, to the
success of its customers.
Ingredients for Success
Digital RF Processor
Applications
Processing
System Design
and Algorithms
Mixed
Signal
Process
A/D
Mixed
Signal
Process
A/D
Digital
BB
Digital Filtering and Control
DRP™ Technology:
RF, Baseband,
Power Management,
Analog
Advanced Silicon
Technology
(90 nm - 45 nm and beyond)
Advanced
Modems
Mobile
Connectivity
Technologies
Texas Instruments 2008
Wireless Handsets Solutions Guide
Technologies
4
Overview
M-Shield™ Mobile Security Technology
To Know More
TI’s foundational innovations featured in this issue:
DRP™ Single-Chip Technology
5
M-Shield™ Security Technology
6
SmartReflex™ Power and Performance Management Technology 7
TI long ago demonstrated that true breakthrough innovations often
cross over the neat lines imposed by conventional solutions. Innovation
knows no boundaries between product categories or end equipment
market segments. Because of the breadth of its expertise and core
competencies in many divergent technologies, TI has been able to
develop innovations that are foundational to a broad range of
technologies. These innovations stretch across product lines and defy
the demarcations between markets. In the end, these innovations
render a diverse spectrum of technologies and products that are more
efficient and effective. Innovations like DRP™ technology,
SmartReflex™ power and performance optimization techniques
and M-Shield™ security capabilities are being applied across many
wireless technologies in a wide variety of handsets.
DRP™ Single-Chip Technology
TI’s DRP technology has emerged from the demands placed on
wireless handset manufacturers for higher levels of integration.
Manufacturers are faced with providing greater, more compelling
functionality while at the same time lowering costs, improving
power efficiency and enabling smaller, lighter mobile devices.
TI has applied its digital expertise to migrate much of the RF analog
content, which often accounts for as much as 30 to 40 percent of a
handset, to the digital domain. By doing so, DRP technology frees up
board space for added functionality. Digital technology can be much
more power efficient than many analog devices, so standby and talk
times can be extended. With DRP technology, handsets are able
to take advantage of the efficiencies and cost-reductions inherent in
each new submicron digital process node.
DRP technology has been deployed in several wireless technologies,
such as TI’s single-chip cell phone platforms, LoCosto™, OMAP-Vox™,
BlueLink™ Bluetooth® solutions, NaviLink™ GPS single-chip
solution, single-chip WiLink™ wireless LAN (WLAN) devices and
Hollywood™ mobile digital television (DTV) solution.
Wireless Handsets Solutions Guide
M-Shield technology is one of the industry’s most robust security
solutions for mobile devices. Its hardware and software features
include a complete security infrastructure with on-chip cryptographic
keys, as well as a secure execution environment, protected storage
mechanisms, and secure chip-to-chip interconnects, among other
features. M-Shield technology enables a system-level security
architecture with standard application programming interfaces
(APIs) that ensure faster development of security applications and
streamlines deployment across OMAP™ platforms.
M-Shield capabilities such as a public-key infrastructure strengthens
the security of the mobile device itself and the protection of the
sensitive personal information or high-value creative content transmitted
or stored on the device. M-Shield offers a hardware-strengthened
secure environment for the safe execution of sensitive applications
and the secure storage of important data. Secure on-chip keys (e-fuse)
give manufacturers one-time programmable keys that are accessible
only in secure mode for authentication and encryption.
M-Shield technology is the keystone security technology for the
complete line of OMAP processors.
SmartReflex™ Power and Performance
Management Technology
Now in its second generation, SmartReflex technology optimizes
wireless handset performance and power consumption through
advanced process techniques. Reducing power consumption and
optimizing performance involves intelligent and adaptive silicon IP,
advanced system-on-a-chip architectural techniques and innovative
software. The recently introduced SmartReflex 2 technology adds to
these techniques and automates their application within the design
process. These features address power consumption challenges that
include optimizing leakage versus power at submicron process
geometries and many others.
In the wireless industry, SmartReflex technology is having far-reaching
effects on lowering power consumption without sacrificing system
functionality. TI has shipped more than 1 billion devices that
incorporate SmartReflex technology innovations. Moving forward,
SmartReflex technology will leverage the momentum it has gained
from its application in wireless handsets into other high-performance,
power-sensitive segments.
Texas Instruments 2008
Technologies
DRP™ Single-Chip Technology
5
DRP™ Single-Chip Technology
Key Benefits
TI’s DRP™ technology is a direct response to the dilemma wireless
handset manufacturers confront: attract new users by delivering
compelling functionality to all segments of the marketplace while
at the same time fulfilling user demand for less expensive, more
power-efficient, smaller and lighter mobile devices. Achieving these
two seemingly opposed objectives is only possible by aggressively
integrating handset electronics. DRP technology does just that by
targeting the analog content of devices, which often accounts for
as much as 30 to 40 percent of total board real estate.
• Migrating RF processing from the analog to the digital domain
makes higher levels of integration possible in wireless handsets
• Highly integrated single-die RF and baseband processors reduce
design complexity, size, power consumption and cost while
enabling greater functionality
• Takes advantage of the ongoing advances in digital CMOS
fabrication to smaller submicron process nodes
• Simplifies testing procedures and increases manufacturing yields
TI’s digital radio frequency (RF) processor architecture applies
digital techniques to simplify RF processing and dramatically cut
the cost and power consumption of transmitting and receiving
information wirelessly. The processing of radio signals with digital
logic can significantly shift the paradigm for embedding wireless
communications by making it easier to implement and to scale.
For handset manufacturers, DRP technology delivers many
benefits including:
DRP technology oversamples analog signals and processes them in
the digital domain, capturing all of the benefits of digital CMOS
fabrication and the advancements to smaller submicron process
geometries.
TI’s DRP architecture has been successfully integrated onto a single
chip such as LoCosto™ and OMAP-Vox™ platforms as well as the
WiLink™ WLAN platform, BlueLink™ Bluetooth® products, NaviLink™
GPS solutions and the Hollywood™ mobile TV solution.
• Lower solution cost and bill of materials (BOM)
• Increased system performance
• Longer battery life – better active and stand-by times
• Smaller form factor to enable small, sleek mobile devices
• Flexibility to integrate multiple radios if the market
conditions warrant
• Easier design and test for wireless designers due to turn-key,
ready-to-manufacture solutions
LoCosto
TCS2305/TCS2315
GSM/GPRS
TM
Single-Chip Solutions Based on DRP Technology
More
to come...
OMAPV1035
GSM/GPRS/EDGE
LoCosto
GSM/GPRS
Hollywood
mDTV
TM
TM
WiLink
Wi-Fi®
TM
NaviLink
GPS
TM
BlueLink
Bluetooth®
TM
LoCosto GSM/GPRS Solution
Texas Instruments 2008
Wireless Handsets Solutions Guide
6
Technologies
M-Shield™ Security Technology
M-Shield™ Mobile Security Technology
Key Benefits
M-Shield™ mobile security technology is a system-level solution that
consists of intimately interleaved hardware and software mechanisms
to provide a high level of terminal and services security in the wireless
industry. Moreover, M-Shield technology sets the benchmark for the
security considered necessary for wireless content protection, access
control, and financial transactions. This security technology is the
keystone for TI’s OMAP™ wireless platform and its wireless chipsets.
• Highly robust security solution includes a complete security
infrastructure with on-chip cryptographic keys, secure execution
environment, secure storage, secure chip-interconnects and other
features
• TrustZone™ standard-based APIs that enable interoperability
and a faster development and streamlining of security-based
applications
• Flexible security framework includes a Secure Middleware
Component to support third-party software and applications
• Tampering detection triggers effective protective actions
• Compelling user experience through high-performance hardwarebased cryptographic accelerators that reduce latencies and
deliver rapid system-level response
• Low power consumption maintains extended battery life
M-Shield technology provides an infrastructure that supports
platform-level security for the mobile device itself, and protects
high-value content transmitted or stored on the device. A hardwareenforced secure environment is responsible for the safe execution of
sensitive applications and the secure storage of important data. For
example, a public-key infrastructure with secure on-chip keys (e-fuse)
gives manufacturers one-time programmable keys that are accessible
only in secure mode for authentication and encryption.
Central to M-Shield technology is the industry’s first hardware-based
secure execution environment. A secure state machine (SSM) applies
and guarantees the system’s security policy rules while entering,
executing and exiting from the secure environment. Eliminating the
vulnerability of chip-interconnects is also critical to the overall
protection of M-Shield technology. Access to certain peripherals and
partitions of the system, such as keyboards, displays, fingerprint
sensors, smartcard physical interfaces can be disabled to ensure that
sensitive information cannot be accessed and stolen. Secure memory
storage and memory access further safeguard the device and its content.
Complementing M-Shield technology’s hardware-based system-level
solution is a secure environment that includes a security framework
and TrustZone™ Standard-based APIs that enable interoperability and
a faster development and streamlining of security-based applications.
In addition, this software framework interfaces the cryptography
engine to higher levels of the system, such as the operating system
(OS), industry-standard security protocols and security interfaces like
OMA DRM, OMA BCast, WM-DRM, CPRM, SSL, TLS, IPSec and Public
Key Cryptography Standards. Third-party security applications are
available from a wide range of TI partners.
User Application
File
System
Secure
Storage
Open Application
Environment
Secure Middleware
Component API
Secure Middleware
Component
Root Public Key
Random Key
Secure Environment
Secure State
Machine
Secure ROM
Code
Secure RAM
Protected
Application
RNG
SHA/MD5
DES/3DES
AES
PKA
Secure
DMA
Secure Chip
Interconnect
Other Security
Features
Secret Data
M-Shield™ Mobile Security Technology
Wireless Handsets Solutions Guide
Texas Instruments 2008
Technologies
SmartReflex™ Power and Performance Management Technology
7
SmartReflex™ Power and Performance
Management Technology
Key Benefits
Now in its second generation, SmartReflex™ technology is a holistic
approach to reducing power without sacrificing performance. More
so than the piecemeal power reduction techniques of the past, the
rich, product-proven portfolio of SmartReflex technologies takes a
comprehensive, system-wide perspective on the interrelated issues
of power and performance in mobile devices and offers a pathway
to future solutions.
• Optimized performance with lowest possible power consumption
• Lower power with high performance enables smaller, sleeker
mobile devices with less heat dissipation
• Lengthens standby time, talk time and battery life without
sacrificing performance
• Drastically limits chip-level power leakage that is exacerbated
as process geometries shrink
• SmartReflex 2 technology automates application of SmartReflex
techniques within design process
SmartReflex technology has three facets: silicon intellectual property
(IP); techniques that can be applied at the system-on-a-chip (SoC)
architectural design level; and system software that manages many
of the hardware-enabled SmartReflex technologies while seamlessly
interfacing to other power management techniques based in operating
systems (OS) or third-party software subsystems. The recently
introduced SmartReflex 2 technology enhances these features while
automating their use within designs. SmartReflex technologies
are leveraged by TI for industry-leading power and performance
management in custom and standard devices.
SmartReflex Silicon IP
TI has developed a significant number of sophisticated power
reduction solutions at the chip level, many of which have transitioned
into SmartReflex technology. One emerging power challenge relevant
to wireless handsets is static leakage power. Leakage becomes
a significantly greater part of a device’s total power consumption at
the smaller submicron fabrication process nodes, such as 90, 65 and
45 nanometers (nm). Several SmartReflex technologies can be applied
to significantly limit leakage from a device, and these techniques have
already been implemented in many of TI’s wireless components.
SmartReflex technology also includes a library of power management
cells to facilitate a granular approach to partitioning a device’s power
domains. These cells can be used to architect multiple power domains
so the device’s functional blocks can be independently powered down
or put into a standby power mode, significantly reducing power.
SmartReflex 2 technology adds retention ‘til access (RTA) and adaptive
body biasing (ABB). RTA puts unused memory banks in lower voltage
states, so that power is optimized in memory as well as logic, while
ABB can dynamically adjust transistors in operation in order to
optimize performance and power consumption.
SmartReflex SoC Architectural and Design Technologies
Beyond established power reduction techniques such as low power
modes and clock gating, SmartReflex technology includes innovative
techniques at the architectural level of SoC design that reduce both
Texas Instruments 2008
dynamic and static power consumption. For example, adaptive voltage
scaling (AVS), dynamic voltage and frequency scaling (DVFS), dynamic
power switching (DPS) and static leakage management (SLM) are
innovative technologies in the SmartReflex portfolio.
SmartReflex System Software
The SmartReflex technology portfolio includes intelligent software
that controls lower-level hardware technologies to optimize power
consumption and performance. For example, workload predictor,
resource manager and device driver power management software
are a few of the system-level capabilities of SmartReflex technology.
Additionally, SmartReflex technology features DSP/BIOS™ power
management software for DSP resources.
SmartReflex technology crosses over traditional boundary lines to
support power reduction across multiple cores, hardware accelerators,
functional blocks, peripherals and other system components. And
system-level SmartReflex technology is open to OS-based and
third-party power management software, developing a collaborative
and cooperative environment with regards to power and performance.
With its SmartReflex PriMer tool, SmartReflex 2 technology goes a
step beyond system software to automate the application of power
management within the design process. SmartReflex PriMer integrates
SmartReflex techniques with the RTL design description, providing
a bug-free implementation that optimizes power consumption and
performance while saving time to market for designers.
SmartReflex Technology’s Pathway to the Future
Today, more than 1 billion components with SmartReflex technology
have been shipped by TI. The roadmap for SmartReflex technology
stretches far into the future, penetrating deeper into mobile devices
and leveraging the application of SmartReflex technology into other
high-performance, power-sensitive industry segments.
Wireless Handsets Solutions Guide
TCS Chipset and OMAP-Vox™ Solutions
8
Overview
To Know More
TCS chipset and OMAP-Vox solutions featured in this issue
TCS2010 (GSM)
10
TCS2110 (GPRS)
12
TCS2200 (GPRS)
14
TCS2300 LoCosto™ (GSM)
16
TCS2310 LoCosto™ (GPRS)
17
TCS2305 LoCosto™ (GSM)
18
TCS2315 LoCosto™ (GPRS)
19
TCS2600 (GPRS)
20
TCS2700 (GPRS)
22
OMAP850 (EDGE)
24
OMAPV1030 (EDGE)
26
OMAPV1035 (EDGE)
27
Chipset Reference Designs
28
TI’s TCS and OMAP-Vox™ solutions give mobile device manufacturers
complete, scalable platforms that meet the requirements of all leading
market segments and standards, including GSM, GPRS, EDGE and
WCDMA. TI’s solutions help our customers to bring differentiated
mobile devices to market fast, including a broad range of hardware,
software, reference designs, development tools and support. Digital
and analog baseband processors, applications processors capable
of real-time multimedia processing, power management ICs, RF
transceivers and more are also part of TI’s broad range of TCS
chipset offerings.
Highly integrated TCS chipsets give manufacturers:
• Real-time multimedia processing
• High-performance processing
• Low power consumption
• Small form factors
From entry-level handsets to high-end multimedia-rich smartphones,
TCS chipsets support leading mobile operating systems (OSs).
Standards-compliant protocol stacks, high-level programming
In Production
Announced/Sampling
Complementary
Connectivity Products
GPS
NL5500
GPS
NaviLink™ 6.0
OMAP3430
OMAP2430
OMAP2420
NL5350
OMAP-DM510
OMAP2431
GPS
NaviLink™ 5.0
OMAP3420
GPS5300
GPS
NaviLink™ 4.0
Software Compatible
VALUE PHONE
ULTRA LOW-COST PHONE
SMARTPHONE
FEATURE PHONE
ADVANCED
MULTIMEDIA
SMARTPHONE
OMAP3440
DRP™
Technology
WLAN
OMAP850
EDGE
OMAP-DM299
Future
OMAP-Vox™
3G Single Chip
3G WCDMA
OMAP3410
OMAP730
OMAP-DM290
OMAP1710
WL1273
WLAN/
Bluetooth®/ FM
WiLink™ 6.0
OMAPV1035
GSM/GPRS
EDGE
Single Chip
OMAPV1030
EDGE
DRP™
Technology
WL1251
WLAN
WiLink™ 4.0
WL1250
WLAN
DRP™
Technology
TCS2310
LoCosto™
Single-Chip
GPRS
TCS21xx
GSM/GPRS
Chipsets
TCS2300
LoCosto™
Single-Chip
GSM
DRP™
Technology
TCS2305
LoCosto™
Single-Chip
GSM
BL6450
Future
Single Chip
Bluetooth® /FM
BlueLink™ 7.0
BRF6350
Bluetooth® /FM
BlueLink™ 6.0
DRP™
Technology
BRF6300
Software Compatible
Wireless Handsets Solutions Guide
Bluetooth®
TCS2315
LoCosto™
Single-Chip
GPRS
Bluetooth®
BlueLink™ 5.0
DRP™
Technology
Texas Instruments 2008
Overview
languages, easy-to-use APIs and development tools are part of the
fully validated and tested reference designs. Incorporating OMAP™
applications processors within many TCS chipset solutions allows TI
to deliver the most highly integrated modems, baseband and dedicated
smartphone solutions available.
TI’s TCS chipsets offer advanced real-time and general purpose
processing for the most premium applications, including streaming
media, graphics, high-end stereo, polyphonic audio, interactive
3D gaming and entertainment, speech processing, location-based
services and more. The advanced integration of TI’s TCS chipsets
reduces part count and size, delivering a low BOM and continuing
TI’s industry-leading track record of low power consumption and
long battery life.
More recent generations of TCS chipsets address the growing
importance of security, providing a comprehensive set of hardwarebased security features, software libraries and services that allow
manufacturers to add enhanced protection. TI’s built-in M-Shield™
security technology enables phone manufacturers and mobile
operators to support value-added services including:
• Content protection
• Transaction security
• Secure network access
• Terminal security functions
• Flashing and booting
• Terminal identity protection
• Network lock protection
Value-added software and services are available as part of TCS
chipsets and reference designs. The application software suite
enables an easy-to-use PC-based software development environment,
optimized JAVA™ Sun KVM, MIDI, MP3, WAP2.0 stack and browser,
EMS and MMS KVM messaging clients, Bluetooth® wireless
technology and more. TI’s OMAP Developer Network and OMAP
Technology Centers (OTCs) serve as additional resources for quickly
deploying compelling 2G, 2.5G and 3G devices.
Texas Instruments 2008
9
TCS Chipset and OMAP-Vox™ Solutions
TI’s Family of Single-Chip Handset Solutions
TI’s integration capabilities are shown in its unique LoCosto™ and
OMAP-Vox™ platforms, the industry’s first architectures to provide
single-chip solutions for entry to mid-range wireless handsets.
Using TI’s advanced DRP™ technology, LoCosto and OMAP-Vox
solutions combine radio and baseband processing into one highly
integrated device. The result is a lower BOM and savings in board
space, power consumption and system cost. Utilizing LoCosto and
OMAP-Vox technology, wireless handsets can be designed in sleeker
form factors and at costs affordable to new markets.
OMAP-Vox™ Solutions: Offering Scalable
and Flexible Roadmaps
OMAP-Vox™ integrated solutions merge both modem and applications
functionality onto the existing OMAP architecture. These solutions
share a common software platform that can be re-used for a variety
of growing market requirements, thus saving manufacturers years of
software design effort and reducing overall development costs. TI’s
OMAP-Vox modem technology is optimized to efficiently run a dynamic
mixture of applications and baseband communications on the same
hardware. The scalable OMAP-Vox hardware architecture has enough
performance to run modem and applications on the same processing
core sharing hardware resources and is designed to easily extend
from 2.5G to 3G and beyond. And to meet the stringent security
requirements set by mobile operators, manufacturers, content providers
and financial services, TI’s OMAP-Vox solutions include embedded
security technology, a set of hardware accelerators including terminal
security, financial transaction security and content security, without
the latencies and risks associated with software-only solutions.
Wireless Handsets Solutions Guide
10
TCS Chipset and OMAP-Vox™ Solutions
GSM
TCS2010 Chipset
Key Benefits
Designed for low power, TI’s TCS2010 chipset offers a full Class 12
GSM/GPRS platform with applications processing abilities. The
solution combines a dual-core digital baseband processor based on
TI’s low-power TMS320C54x™ DSP and ARM® general-purpose
processing cores, along with an analog baseband that uses powerdown sleep modes to reduce power consumption and increase standby
time of mobile devices.
• Complete GSM/GPRS handset reference design
• Dual-core digital baseband with TI proven GSM/GPRS
modem architecture
• Reduced BOM costs for high-volume low-cost handsets
• Low power consumption with twice the standby time
of previous generation
• Pin compatibility with TBB2100 GSM/GPRS modem
• Integrated quad-band, direct conversion, single-chip
RF transceiver
• Software compatible with TCS2200 and TCS2110
GSM/GPRS chipsets
• Class 12 GPRS support
• Adaptive MultiRate Narrow Band (AMR-NB) vocoders
• Integrated EOTD location determination
• Optimized interface to OMAP™ applications processors
• Full range of software applications through
TCS wireless software suite
TCS2010 components include:
• TBB2010 dual-core digital baseband processor
• TWL3014 analog baseband with sleep modes for
reduced power consumption
• TRF6151 direct conversion, quad-band RF transceiver
When additional application processing is required, the TCS2010 is
optimized to interface with TI OMAP™ applications processors. The
combination of the TCS2010 and an OMAP processor delivers the
processing performance needed for advanced multimedia applications.
TBB2010 Digital Baseband
TWL3014 Analog Baseband
32 kHz QUARTZ
TCXO
Baseband
Serial Port
SLICER
Asynchronous
WAKE-UP
CLKM
SRAM
Watchdog
SPI
RTC
ULPD
CK 32 KHz
TPU
INTH
SRAM
I2C
Timer 1
ARM7™ MCU
Core
Voltage
Regulation
APC
AFC
ADAC
MCU
Serial Port
Timer 2
SIM
TMS320C54x™
DSP
Subchip
ARM® IO
PWL
uWIRE
UART
RIF
Die ID
Voiceband
Serial Port
Clock Gen
Auxilary
Drivers
Baseband
Codec
IRDA
UART
MODEM
Dual
BandPA
Phase
Comp
Q
GSM1800/GSM1900
Serial
Interface
M
Div.
Timing
Serial
Port
PWT
DMA
GSM850/GSM900
I
PAD
Test
Access
Port
TSP
LPG
Backup
TRF6151 RF Transceiver (GSM/GPRS)
R
Div.
3.6 GHz
Phase
Comp
N Divide
Voltage
Regulators
Switchplexer
:2/:4
LNA850/LNA900
I
LNA1800
Voltage
Reference
Power
Control
Voiceband
Codec
Q
LNA1900
MCSI
VBAT
CRYPT
JTAG
Battery VBACKUP
SIM CARD Charger VCHG Monitoring
Interface Interface ICHG
ADC
EEPROM
External
Memory
LCD
Keyboard
SIM Card
Battery
LED
Buzzer
Vibrator
Wireless Handsets Solutions Guide
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
11
GSM
TBB2010 Digital Baseband
TRF6151 RF Transceiver
Based on TI’s leading TMS320C54x™ DSP for wireless-centric
applications, the TBB2010 is extremely efficient. The baseband’s
on-chip memory and fast, four-channel DMA controller allow for
quick data transfers. Page mode with external memory access also
facilitates data movement.
The TRF6151 is a single-chip transceiver with quad-band support based
on a direct conversion (DC) architecture. This device integrates several
external components to reduce complexity, part count and cost of the RF
subsystem, including vocoders and vocoder tanks. By integrating what
was previously several external filtering devices, the DC architecture of
the TRF6151 reduces a manufacturer’s BOM by approximately 30 percent
from RF devices with the super heterodyne architecture.
Key Features
• Dual-core architecture combining TI’s C54x™ DSP and an
ARM7TDMI® core
• On-chip memory
• Four-channel DMA controller
• Page mode for external memory access
TWL3014 Analog Baseband
The TWL3014 analog baseband integrates all the power management
and analog functions on a single chip, reducing board space
requirements, chip count and development costs. The device includes
voiceband and baseband codecs and features programmable
low-dropout voltage regulators.
Key Features
• Single-chip transceiver with quad-band support
• Direct conversion architecture
• GPRS Class 12/CS4 compliant
• Full integration of VCO and VCO tanks
• Integrated voltage regulators, PA control loop, PLL loop
filters and VCXO
• N-fractional synthesizer
• 7 mm x 7 mm QFP package
Key Features
• Single-chip solution integrates power management functions
• Voice band codecs
• Single/multi-slot baseband codecs
• I/Q RF interface and GMSK modulator in UL path
• LDO voltage regulators with programmable voltage
• Battery charger interface; control of either 1-cell Li-ion
or 3-series Ni-MH/Ni-CD cell batteries
• 1.8-V or 3-V automatic frequency control/power
control SIM interface
• 1.8-V or 3.3-V external memory
• Headset audio interface, LED drivers
• 10 mm x 10 mm MicroStar BGA™ package
Texas Instruments 2008
Wireless Handsets Solutions Guide
12
TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2110 Chipset
Key Benefits
The TCS2110 chipset and complete reference design support
Class 12 GPRS and offer software compatibility with TI’s TCS2010
and TCS2200 GSM/GPRS chipset solutions. It provides MIPS
processing headroom for manufacturers to add features and
applications and also incorporates a power-split technique for
delivering low power consumption.
• Complete hardware and software solution for GPRS handset
• Class 12 GPRS with headroom for additional applications
and features
• Reduced BOM cost through high integration levels
• Software compatible with TCS2200 and TCS2010
GSM/GPRS chipsets
• Integrated EOTD location determination
• Optimized interface to OMAP™ applications processors
for multimedia applications
• Easy-to-use software development environment for
embedded applications
TCS2110 components include:
• TBB2110 digital baseband combines TMS320C54x™ DSP with
ARM7TDMI® processor
• TWL3014 analog baseband with power-split technique for
low power consumption
• TRF6151 single-chip, quad-band RF transceiver with
dual-conversion architecture
A complete set of communication software is provided as part of
the TCS2110 solution, along with a comprehensive TCS wireless
software suite that provides a range of embedded applications
including WAP2.0 stack and browser, EMS and MMS messaging
clients, Bluetooth® protocol stack and profiles.
TWL3014 Analog Baseband
TBB2110 Digital Baseband
32-kHz Crystal
TCXO
SLICER
WIDOG
INTH
ULPD
MCU
Serial Port
TPU
Test
Access
Port
SPI
GEA
ARM7™ MCU
Core
SRAM
SRAM
Timer 2
W
r
i
t
e
B
u
f
f
e
r
APC
AFC
ADAC
Timing
Serial
Port
TSP
SIM
ARM® I/O
PWL
Micro
WIRE
UART
IRDA
DMA (4+)
PWT
TMS320C54x™
DSP
Subchip
CRYPT
RIF
LPG
I2C
MCSI
UART
Modem
JTAG
EEPROM
Voiceband
Serial Port
Phase
Comp
Q
GSM1800/GSM1900
Serial
Interface
PAD
M
Div.
3.6 GHz
Clock Gen
Auxilary
Drivers
R
Div.
Baseband
Codec
Phase
Comp
N Divide
Voltage
Reference
Power
Control
DualBand
PA
GSM850/GSM900
I
Die ID
Timer 1
SRAM
Backup
RTC
DIV-2
DPLL & CLKM
SRAM
TRF6151 RF Transceiver (GSM/GPRS)
Voltage
Regulation
Baseband
Serial Port
Voltage
Regulators
Switchplexer
:2/:4
LNA850/LNA900
Voiceband
Codec
VBAT
Battery
Charger VBACKUP
VCHG
Interface
ICHG
SIM CARD
Interface
I
LNA1800
Q
Monitoring
ADC
LNA1900
Battery
Buzzer
External
Memory
Keyboard
LCD
Wireless Handsets Solutions Guide
SIM Card
LED
Vibrator
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
13
GPRS
TBB2110 Digital Baseband
TRF6151 RF Transceiver
The TBB2110 is a dual-core, high-performance digital baseband that
includes a powerful shared-memory architecture. It combines TI’s
low-power TMS320C54x™ DSP with an ARM7TDMI® RISC processor
to support multi-slot GPRS Class 12 with the corresponding data
throughput and extra processing headroom for manufacturers to
deliver their own value through added applications and features.
The TRF6151 delivers GSM/GPRS reception as part of the TCS2110
chipset. It is a single-chip transceiver with quad-band support based on
a direct conversion (DC) architecture. This device brings together several
external components to reduce complexity, part count and cost of the RF
subsystem, including vocoders and vocoder tanks. By integrating what
was previously several external filtering devices, the DC architecture of
the TRF6151 reduces a manufacturer’s BOM by approximately 30 percent
from RF devices with the super heterodyne architecture.
Key Features
• TMS320C54x DSP with data/program memory on-chip
• ARM7TDMIE™ running internal SRAM
• 130-nm CMOS technology
• 3.3-V I/Os, 1.8-V cores
• Memory protection unit
• DMA controller
• Real time clock (RTC)
• GSM ultra-low power device
• HW accelerator for GPRS encryption
• Die-ID cell
• Two UARTS, one supporting IRDA control
• SIM interface (3.3-V and 1.8-V compliant)
• 12 mm x 12 mm MicroStar BGA™ package
Key Features
• Single-chip transceiver with quad-band support
• Direct conversion architecture
• GPRS Class 12/CS4 compliant
• Full integration of VCO and VCO tanks
• Integrated voltage regulators, PA control loop, PLL loop
filters and VCXO
• N-fractional synthesizer
• 7 mm x 7 mm QFP package
TWL3014 Analog Baseband
The TWL3014 analog baseband integrates all the power management
and analog functions on a single chip, reducing board space
requirements, chip count and development costs. The device includes
voiceband and baseband codecs and features programmable
low-dropout voltage regulators.
Key Features
• Single-chip solution integrates power management functions
• Voice band codecs
• Single/multi-slot baseband codecs
• I/Q RF interface and GMSK modulator in UL path
• LDO voltage regulators with programmable voltage
• Battery charger interface; control of either single-cell Li-Ion
or 3-series Ni-MH/Ni-CD cell batteries
• 1.8-V or 3-V automatic frequency control/power control SIM
interface
• 1.8-V or 3.3-V external memory
• Headset audio interface, LED drivers
• 10 mm x 10 mm MicroStar BGA™ package
Texas Instruments 2008
Wireless Handsets Solutions Guide
14
TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2200 Chipset
Key Benefits
Targeted at multimedia Java™ handsets, TI’s TCS2200 chipset
solution and reference design deliver the enhanced performance
and low power consumption required for processing-intense
multimedia applications.
• Integrated applications processor and digital
baseband leverage proven dual-core modem architecture
• Enhanced application processing with color display,
music and security
• Low system power consumption through split
power-down techniques
• Security protection through hardware features and
third-party security library
• Fast data movement and extended memory resourced
with DMA
• Page-mode interface for external memory
• Location determination through integrated EOTD
• Full peripheral set including USB, MMC, Memory Stick®,
Bluetooth® wireless technology and others
TCS2200 components include:
• TBB2200 digital baseband with integrated TI DSP and ARM® cores
• TWL3016 analog baseband with integrated power management
• TRF6151 quad-band RF transceiver
Storage and fast data movement facilities are gained through the
TCS2200’s extended memory resources and fast direct memory access
(DMA) controller. The solution is software compatible with the
TCS2110 and TCS2010, includes a L1/L2/L3 GSM/GPRS protocol stack
and a full peripheral set with USB, MMC, Memory Stick®, Bluetooth®
wireless technology and others. The fully type-approved TCS2200
reference design includes a full BOM, detailed board design with
schematics and layout. A complete set of development tools allows
manufacturers to easily differentiate capabilities.
TWL3016 Analog Baseband
and Power Management
TBB2200 Digital Baseband
RAM
Rhea
32 K TMS320C54x™
DSP
MCSI
EDGE
McBSP
Bluetooth®
ARM7TDMI® Rhea
Core
UART
Bluetooth®
MMC/SD
UART
IrDA
I2C
MEM I/F
Page Mode CRYPTO
FLASH
USB Client
LCD I/F
SRAM
Wireless Handsets Solutions Guide
Baseband
Serial Port
Backup
Regulation
Clock
Generator
APC, AFC
ADAC
MCU
Serial Port
Internal
BUS
Controller
GSM850/GSM900
I
Voltage Regulation
McBSP-128
MP3
Controller
DMA
SRAM
5 MB
TRF6151 RF Transceiver (GSM/GPRS)
Phase
Comp
Q
Serial
Interface
Baseband
Codec
Auxiliary
Drivers
Voiceband
Codec
Voltage
Reference
Power Control
Stereo
DAC
GSM1800/GSM1900
PAD
M
Div.
Timing
Serial Port
Voiceband
Serial Port
R
Div.
3.6 GHz
I
Voltage
Regulators
Phase
Comp
N Divide
SIM Card
Interface
DualBand
PA
Switchplexer
:2/:4
LNA850/LNA900
LNA1800
Battery Charger
Interface
Q
LNA1900
Monitoring
ADC
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
15
GPRS
TBB2200 Digital Baseband
TRF6151 RF Transceiver
The TBB2200 provides the connectivity and capabilities required
for the latest multimedia applications. It features TI’s proven digital
baseband architecture, integrating TI’s leading, low-power
TMS320C54x™ DSP and the ARM7TDMI® core. The TBB2200 runs a
complete Class 12 modem and includes a TCS wireless software suite.
Specifically designed for GSM/GPRS reception as part of the TCS2200
chipset, the TRF6151 transceiver is a single-chip transceiver with
quad-band support based on a direct conversion (DC) architecture. This
device integrates several external components to reduce complexity, part
count and cost of the RF subsystem. By integrating what was previously
several external filtering devices, the DC architecture of the TRF6151
reduces a manufacturer’s BOM by approximately 30 percent from RF
devices with the super heterodyne architecture.
Key Features
• Dual core architecture including C54x™ DSP and ARM7TDMI core
• ARM® processor with DMA and page-mode access
• Complete Class 12 modem
• Full suite of Java™ and embedded multimedia applications
• USB client port
• Parallel port for color LCDs
• Interfaces for Smart Card, Bluetooth® wireless technology
• External NAND flash
• 12 mm x 12 mm MicroStar BGA™ package
• 130-nm CMOS technology
Key Features
• Single-chip transceiver with quad-band support
• Direct conversion architecture
• GPRS Class 12/CS4 compliant
• Full integration of VCO and VCO tanks
• Integrated voltage regulators, PA control loop, PLL loop
filters and VCXO
• N-fractional synthesizer
• 7 mm x 7 mm QFP package
TWL3016 Analog Baseband
The TWL3016 analog baseband integrates all analog and power
management functionality on a single chip. Through power-down
sleep modes, the TWL3016 extends system standby time significantly,
contributing to the overall battery savings the TCS2200 provides. The
device also includes a D/A converter for applications like MP3 music,
and an 8-Ω amplifier for hands-free speaker phone operation.
Key Features
• Integrated high-fidelity audio DAC
• Integrated hands-free and headphone amplifiers
• Overall clock input reduction of 50 percent
• 10 mm x 10 mm MicroStar BGA™ package
Texas Instruments 2008
Wireless Handsets Solutions Guide
16
TCS Chipset and OMAP-Vox™ Solutions
GSM
TCS2300 LoCosto™ Single-Chip Handset Solution
Key Benefits
TI’s unique TCS2300 LoCosto™ solution is the industry’s first
architecture to provide single-chip solutions for ultra low-cost to
entry-level wireless handsets. Using TI’s advanced DRP™ technology
and 90-nm process technology, the TCS2300 solution combines radio
and all baseband processing into one highly integrated solution,
reducing component count, board space, power consumption and
system cost. With the TCS2300 solution, wireless handsets can be
made as compact as match boxes and affordable for emerging
economies.
• GSM only
• Voice codecs F/R, H/R, EF/R, AMR
• Dual band: 850/1900, 900/1800, 850/1800 or 900/1900
• Black and white LCD (96 x 96 pixels) and color LCD support
(up to 65,000, 128 x 128 pixels)
• SAIC and TTY support
• MIDI ringtone and playback - 16 polyphonics
• Headset, handsfree, vibrator
• FM connectivity
• Hardware security (Flash content protection, ME personalization,
IMEI protection) OMTP1.0 compliant
• No external SRAM needed and 2-MB NOR flash (B&W) or
4-MB NOR flash (color 128 x 128, 65,000 colors)
• Up to 64 MB external flash and up to 6 MB external SRAM
The TCS2300 solution combines an ARM7™ general-purpose RISC
processor core with a TMS320C54x™ DSP core, both operating at
104 MHz, for high performance with low power consumption. An
improved memory interface with DMA supports a variety of external
memory types efficiently. Reference designs are available for the
solutions and come with extensive software support for codecs,
testing and other standards to help simplify design.
The TCS2300 solution supports standard voice codecs in dual-band
phones. Support for both color and monochrome displays, MIDI 16
polyphonic ringtones, system security and highly optimized memory
footprint offering provides the normal complement of features
demanded in basic phones.
The TCS2300 solution offers a scalable platform enabling costeffective development of handsets ranging from ultra low-cost GSM
handsets with a black-and-white display to a slightly more expensive
device including a color display and FM radio. These sub-$30 handsets
lower the threshold for mass market adoption – especially in
emerging markets.
TCS2300 LoCosto™ Solution
Keyboard
LCD
TWL3031
32 Khz
On/Off
13 MHz
Power
Sources
Voice
Audio
USB
Power
Management
On_nOff
Aux
ADC INÃs
CDD
SPI
ULPD
ARM7TDMIE
®
Cport
CDSP
Subchip
USIM
Sim Card
DMA
Wakeup_int.
Audio
Codec
VSP
Bus
Control
USB
Transceiver
Vibrator
LED
LCD
32 KHz
RTC
White LED
Boost
I 2S
VSP
USB
USB
12C
DRP™
Technology
EMIF
Nand Flash
Interface
Frontend + PA
UART
Mcsi
I2C
Start ADC
26 MHz
NOR
FLASH
MADC
RAM
BCI
Battery
Wireless Handsets Solutions Guide
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
17
GPRS
TCS2310 LoCosto™ Single-Chip Handset Solution
Key Benefits
Integrating TI’s groundbreaking DRP™ technology and 90-nm
process technology, the TCS2310 LoCosto™ solution successfully
incorporates functions that previously have not been combined in a
single device. With the RF section included in the device designs save
space and components while requiring less interconnect for greater
reliability. The digitization of what was formerly analog functionality
improves testability, enables built-in calibration, reduces drift effects
and allows for auto-compensation for process and temperature
variances. All of these advantages add to the cost savings and the
potential to create phones in new sleeker form factors.
• GPRS Class 10
• SAIC and TTY support
• WAP/SMS/EMS/MMS
• Dual-color displays
• MP3/AAC player and ringers
• MIDI 32 polyphonics player and ringer
• Integrated camera support up to 1.3 megapixel
• Video MPEG-4/H.263 support up to QCIF15 frames per second (fps)
• TI Bluetooth® protocol stack and profiles include stereo
headset and A2DP
• Advanced connectivity support including WLAN and GPS
• Hardware security (Flash content protection, ME personalization,
IMEI protection) OMTP1.0 compliant
• Non-removable and removable mass storage interface
The TCS2310 solution adds support for MP3/AAC ringers and players,
camera and video, MIDI 32 polyphonic ringtones, Bluetooth®,
non-removable and removable mass storage media, additional external
program and data memory, peripheral interfaces and a complete set
of functionality required for entry-level handsets.
The scalable TCS2310 solution enables cost-effective development
of differentiated handsets addressing multiple market segments, from
low-cost GPRS handsets with a black-and-white screen to entry-level
GPRS devices featuring a basic VGA camera and MP3 player, to
high-end GPRS devices with features including 1-megapixel camera,
video, and advanced connectivity such as Bluetooth, WLAN or GPS.
TCS2310 LoCosto™ Solution
RS MMC/T-FLASH
Camera
LCD
Secondary LCD
TWL3031
Keyboard
32 Khz
On/Off
13 MHz
Power
Sources
Power
Management
Voice
Audio
USB
On_nOff
Aux
ADC INÌs
Keyboard
CDD
SPI
ULPD
ARM7TDMIE
Cport
Wakeup_int.
Audio
Codec
®
CDSP
Subchip
USIM
Sim Card
DMA
VSP
Bus
Control
USB
Transceiver
Vibrator
LED
LCD
32 KHz
RTC
White LED
Boost
I2S
VSP
USB
USB
12C
Frontend + PA
DRP™
Technology
EMIF
Nand Flash
Interface
UART
Mcsi
I2C
Bluetooth®
IrDA
Start ADC
Companion
NOR
FLASH
MADC
RAM
NAND
FLASH
26 MHz
BCI
Battery
Texas Instruments 2008
Wireless Handsets Solutions Guide
18
TCS Chipset and OMAP-Vox™ Solutions
GSM
TCS2305 GSM LoCosto™ Single-Chip for ULC market
Key Benefits
The TCS2305 (GSM) is a member of TI’s next-generation LoCosto™
family single-chip solutions which have set a new standard for
features and a compelling user experience in the ultra low-cost (ULC)
handset segment. By combining advanced 65-nm process technology,
a TMS320C54x™ DSP with a powerful ARM7™ core, and integrating
TI’s market-leading DRP™ technology, the TCS2305-based handsets
with high performance, robust functionality and innovative form factors
are possible in the most price-sensitive handsets.
TCS2305 GSM Solution:
• Leverages 65-nm process with advanced DSP and ARM®
technologies
• Integrated DRP™ technology, single-chip solution
• Delivers a compelling next-generation user experience
in ULC handsets
– Lowest cost color handset with no additional external SRAM
memory (128 x 160 and 65,000 color displays)
– Fast CPU processing for smooth user interface processing
– CD-quality (44.1 kHz) MP3 ringers and polyphonic ringers
– High-end full-duplex voice quality
– FM connectivity with integrated stereo support
– Record FM for on-the-fly ringers
• Optimized system design reduces component count and PCB
board size relative to previous generation
– Over 25 percent reduction in eBOM
– Lower overall component count by approximately 40 percent
– Smaller modem by as much as 35 percent reduces PCB board size
• Easy charger access and compliant to USB Chinese charger
interface
• Lower power consumption for longer talk (30 percent) and
standby (60 percent) times
• Innovative handset form factors and larger batteries enabled by
smaller PCB requirements
The TCS2305 LoCosto solution is optimized for emerging regions such
as India, China, Brazil and Russia. In addition to enabling lowest cost
color phones, these highly flexible and scalable solutions also address
value-conscious segments in more mature markets.
Sustainable Low Cost Structure
Several chip- and system-level factors contribute to the sustainable
low cost structure of the next generation of LoCosto solutions. Starting
with 65-nm process technology, additional cost-optimization techniques
include an approximate 25 percent reduction in a handset’s electronic
eBOM, reduced PCB area caused by smaller chips and greater silicon
integration, and a cost-optimized PCB technology. Integration of power
management with the digital baseband into a single chip also yields
reduction in the modem PCB area. With the RF section included in one
device, space requirements and component counts are reduced.
Reduced chip count, smaller PCBs, increased integration and advanced
packaging enable handsets in innovative and fashionable form factors.
A smaller PCB means that the size of the handset’s battery can be
increased, giving the device a longer battery life with extended
standby and talk times.
TCS2305 LoCosto™ GSM Solution
Emulator
Pod
NOR
Flash
Memory Interface
JTAG/
Emulation
I/F
Display
FM
SPI
pSRAM
GPIO
DRP™ Technology Integrated
GSM only
I2C, MCSI
UART
Timers, Interrupt Controller, Mailbox
M-Shield™ Security Technology:
DRP™
GSM
SIM
TMS320C54x™
DSP
ARM7TDMI®
Subsystem
Boot/Secure ROM
RF PA/Front End
SIM/
USIM
Keys, RNG, SHA1/MD5, DES/3DES, Secure ROM/RAM
Battery
Charger
Chinese Charger
Power Manager
Audio/Voice
Codec
White-LED
Boost
On/Off
Battery
Audio
Speaker
USB Connector
In/Out
Vibrator
LED
DMA
DUAL-BAND
Keypad
Wireless Handsets Solutions Guide
Key Pad
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
19
GPRS
TCS2315 LoCosto™ Single-Chip for Richest Feature Set GPRS
Handsets
Key Benefits
TCS2315 GPRS Solution:
• All of the benefits of the TCS2305 GSM solution plus the
following:
– GPRS Class 10
– Built-in 2-megapixel camera support, with JPEG encode/decode
and advanced imaging functions such as rotation, zoom, etc.
– Support for video MPEG4/H263, QCIF 15 fps
– CD-quality MP3/AAC stereo playback capability for rich music
– USB connectivity for data transfer between PC and phone
– Mass storage capability (SD/MMC, micro memory stick,
Micro-SD) to store MP3 music and ringers, pictures, data,
and contacts
– Bluetooth® connectivity (with multiple profiles includes stereo
headset)
– MP3/AAC/stereo playback
– Video MPEG-4/H263 support, QCIF 15 fps
The TCS2315 solution has the powerful processing capabilities required
for an affordable feature set far richer than previously possible.
Enhanced capabilities now possible in affordable feature phones
include a high-resolution QVGA 256,000 colors display, high-end
full-duplex voice quality, near CD-quality MP3 and polyphonic ringers,
longer talk time and standby time, stereo FM radio connectivity, up to
2-megapixel camera support, MP3/AAC playback and mass storage
(SD/MMC, micro memory stick, Micro-SD) support, USB connectivity
and charging, handsfree speakerphone operation, vibration ringer,
headset support, Bluetooth®, as well as WLAN and GPS connectivity
and other functionality.
The TCS2315 LoCosto solutions extend the established performance
of TI’s successful first generation of TCS2310 LoCosto single-chip wireless handset solutions. The software portability from one
generation of LoCosto solution to the next gives manufacturers and
operators the ability to rapidly and cost-effectively differentiate
products and service offerings for both emerging and mature markets,
crossing over every language, region and subscriber type.
Feature rich but low-cost handsets are also afforded the protection of
TI’s scalable and hardware-based M-Shield™ security technology. The
M-Shield capabilities of the LoCosto solutions safeguard the handset
owner’s sensitive personal information and defeat attempts to unlock
the handset’s SIM lock code.
TCS2315 LoCosto™ GPRS Solution
SD/MMC
Secondary
Display
NOR
Flash
Memory
Stick
Emulator
Pod
NAND
MS
JTAG/
Emulation
I/F
NAND
Interface
pSRAM
Memory Interface
SPI
GPIO
Camera
Serial or Parallel
ARM7TDMI®
Subsystem
TMS320C54x™
DSP
DRP™ Technology Integrated
GSM/GPRS
I2C, MCSI
UART
Boot/Secure ROM
M-Shield™ Security Technology:
DRP™
GSM/GPRS
Battery
Charger
Power Manager
Audio/Voice
Codec
Keys, RNG, SHA1/MD5, DES/3DES, Secure ROM/RAM
USB
Transceiver
DMA
White-LED
Boost
QUAD-BAND
Display Controller
Parallel-Serial
VGA or
2 megapixel
Camera
Module
Hardware
JPEG
Accelerator
USB Charger
Timers, Interrupt Controller, Mailbox
RF PA/Front End
SIM
SD/MMC
IrDA
Bluetooth®
FM
SIM/
USIM
Keypad
On/Off
Audio
Battery
Speaker
USB Connector
In/Out
Vibrator
LED
Key Pad
Primary Display
Texas Instruments 2008
Wireless Handsets Solutions Guide
20
TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2600 Chipsets
Key Benefits
The TCS2600 is a complete hardware/software reference design for
high-performance multimedia smartphones, delivering twice the
performance of TI’s previous generation while extending battery life.
Its reduced part count and integrated set of peripherals on-chip lower
BOM costs and free up space for additional functionality.
• Proven GSM/GPRS modem technology and EDGE upgradeable
• Complete reference design includes S60 Platform and
Microsoft® Windows Mobile®
• Twice the performance over previous generation,
including 70 percent audio performance improvement
and 8X Java™ processing increase
• High-level mobile OS support
• Software compatible with OMAP™ processors
and applications
• OMAP Developer Network and OMAP Technology
Centers support
• Highly integrated with reduced smartphone BOM
and chip count
• Memory protection on flash and SDRAM interface
• Hardware acceleration for Java
• Complete peripherals set: USB On-the-Go, SD/MMC/SDIO,
dedicated 802.11 a/b/g high-speed interface, Fast IrDA
and more
Designed for security, the TCS2600 includes 48-kB secure ROM and
16-kB secure RAM with dedicated NOR/NAND flash memory and write
production. A true random number generator (TRNG) aids in encryption
and authentication standards. The numerous software modules and
hardware features of the chipsets ensure a secure mode of operation
where information stored on the device is safeguarded and ownership
rights of content and programs are protected.
TCS2600 components include:
• OMAP730 with integrated Class 12 GSM/GPRS digital baseband
and dedicated ARM926™ applications processor
• TWL3016 analog baseband with complete power management
• TRF6151 quad-band RF transceiver
TWL3016 Analog Baseband
and Power Management
OMAP730 Integrated Digital Baseband
and Dedicated Applications Processor
SDRAM
NOR/NAND
SRAM
9-Channel
DMA
Traffic
Controller/
Memory
I/G
GSM/GPRS
DSP Modem
Class 12 (AMR)
ARM9®
Application
Processors
OMAP™
Core Processor
LCD
Ctrl
Frame
Buffer
192 KB
TSP Voice
Baseband
SIM/SPI
OP/O
UART/IrDA
UART/PWMs
Mailbox
Timer (3)
WDT/RTC
Int Ctrl
I2C Host
µWire/UART
Keyboard
UART
USB Client/OTG
AC97/I2S
MMC
Voltage Regulation
Baseband
Serial Port
Clock
Generator
MCU
Serial Port
Test Access
Port
GSM1800/GSM1900
Serial
Interface
PAD
M
Div.
Timing
Serial Port
Voiceband
Codec
Auxiliary
Drivers
3.6 GHz
R
Div.
Voltage
Regulation
Phase
Comp
N Divide
Switchplexer
:2/:4
LNA850/LNA900
I
LNA1800
Voltage
Reference
Power Control
SIM Card
Interface
APC,AFC
ADAC
DualBand
PA
Phase
Comp
Q
Baseband
Codec
Voiceband
Serial Port
GSM850/GSM900
I
Backup
Regulation
Internal
BUS
Controller
TRF6151 RF Transceiver (GSM/GPRS)
Stereo
DAC
Battery Charger
Interface
Q
LNA1900
Monitoring
ADC
See OMAP™ Processor information on page 31
Wireless Handsets Solutions Guide
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
21
GPRS
OMAP730 and OMAP733 Integrated Digital Baseband
and Dedicated Applications Processors
TI’s OMAP730 combines an ARM926EJ-S™ applications processing
core with TI’s GSM/GPRS digital baseband modem, delivering twice
the application performance of its predecessor (OMAP710), and
doubling standby time for handsets and smartphones.
The OMAP733 includes the same features as the OMAP730 and adds
support for 256-MB stacked SDRAM. The result is less power
consumption versus traditional external memory configurations,
making the OMAP733 an ideal engine for space-constrained systems
or small, light mobile devices.
Over 40 on-chip integrated peripherals reduce board space by half,
as compared with the previous generation, saving cost and providing
space for added functionality. An SRAM frame buffer delivers faster
streaming media and application performance. The OMAP73x includes
a standard interface to 54-Mbps WLAN technology, along with
accelerated Java™ processing, web browsing, personal information
management (PIM) applications, location-based services and more.
A comprehensive hardware-based security system features
bootloaders, secure RAM and ROM, a secure mode of operation,
and hardware accelerators to address security standards.
Key Features
• Low-voltage 130-nm technology
• 1.1-V to 1.5-V core, 1.8-V to 2.75 V I/O
• Extremely low power consumption: less than 10 µA in
standby mode
• Split power supplies for application processing, digital baseband
and real-time clock enable precise control over power consumption
• Optimized clocking and power management: only two clocks
required at 13 MHz and 32 kHz
Texas Instruments 2008
TWL3016 Analog Baseband
The TWL3016 analog baseband integrates all analog and power
management functionality on a single chip. Through power-down
sleep modes, the TWL3016 is able to extend system standby time
significantly, contributing to the overall battery savings the TCS2600
provides. The device also includes a D/A converter for applications like
MP3 music and an 8-Ω amplifier for hands-free speakerphone operation.
Key Features
• Integrated high-fidelity audio DAC
• Integrated hands-free and headphone amplifiers
• Overall TCS2600 clock input reduction of 50 percent
TRF6151 RF Transceiver
Specifically designed for GSM/GPRS reception as part of the TCS2600
chipset, the TFR6151 transceiver is a single-chip transceiver with
quad-band support based on a direct conversion (DC) architecture. This
device integrates several external components to reduce complexity,
part-count and cost of the RF subsystem, including vocoders and vocoder
tanks. By integrating what was previously several external filtering
devices, the DC architecture of the TRF6151 reduces a manufacturer’s
BOM by approximately 30 percent from RF devices with the super
heterodyne architecture.
Key Features
• Single-chip transceiver with quad-band support
• Direct conversion architecture
• GPRS Class12/CS4 compliant
• Full integration of VCO and VCO tanks
• Integrated voltage regulators, PA control loop,
PLL loop filters and VCXO
• N-fractional synthesizer
• 7 mm x 7 mm, 48-pin QFP package
Wireless Handsets Solutions Guide
22
TCS Chipset and OMAP-Vox™ Solutions
GPRS
TCS2700 Chipset
Key Benefits
The TCS2700 chipset solution and reference design includes a range
of features that deliver improved multimedia applications performance
to wireless handsets, smartphones and other Internet access devices.
Based on the OMAP750 applications processor, the TCS2700 chipset’s
improved throughput and faster memory options enhance the
processing speed of applications including streaming video and
high-end imaging.
• Ideal for Class 12 GSM/GPRS wireless handsets,
smartphones and Internet access devices
• Leverages OMAP750 processor for enhanced performance
of streaming video and high-end imaging applications
• D/A converter in analog baseband enables longer MP3 music
playback and better hands-free speaker phone operation
• Extended standby time and battery savings through
integrated analog baseband and power management devices
• Compatibility across all OMAP™ applications processors
• OMAP Developer Network and OMAP Technology
Centers support
• Complete reference design and set of peripherals
• Mobile OS support
The TCS2700 is designed for Class 12 GSM/GPRS and includes three
components as part of the chipset, providing battery savings, reduced
board space and lower cost.
TCS2700 components include:
• OMAP750 integrates a GPRS modem baseband and ARM926™
core for applications processing
• TWL3016 analog baseband with integrated power management
• TRF6151 RF transceiver based on direct conversion (DC) architecture
TWL3016 Analog Baseband
and Power Management
OMAP750 Integrated Digital Baseband
and Dedicated Applications Processor
SDRAM/
Mobile DDR
NOR/NAND
Flash
9-Channel
DMA
Traffic
Controller/
Memory
I/G
GSM/GPRS
DSP Modem
Class 12 (AMR)
ARM9®
Applications
Processor
™
OMAP
Processor Core
LCD
Ctrl
Frame
Buffer
192 KB
TSP Voice
Baseband
SIM/SPI
OP/O
UART/IrDA
UART/PWMs
Mailbox
Timer (3)
WDT/RTC
Int Ctrl
I2C Host
µWire/UART
Keyboard
UART
USB Client/OTG
AC97/I2S
MMC
Voltage Regulation
Baseband
Serial Port
Clock
Generator
MCU
Serial Port
Test Access
Port
GSM1800/GSM1900
Serial
Interface
PAD
M
Div.
Timing
Serial Port
R
Div.
3.6 GHz
Phase
Comp
N Divide
Voiceband
Codec
Auxiliary
Drivers
Voltage
Regulators
Switchplexer
:2/:4
LNA850/LNA900
I
Voltage
Reference
Power Control
SIM Card
Interface
APC, AFC
ADAC
DualBand
PA
Phase
Comp
Q
Baseband
Codec
Voiceband
Serial Port
GSM850/GSM900
I
Backup
Regulation
Internal
BUS
Controller
TRF6151 RF Transceiver (GSM/GPRS)
Stereo
DAC
Battery Charger
Interface
LNA1800
Q
LNA1900
Monitoring
ADC
See OMAP™ Processor information on page 32
Wireless Handsets Solutions Guide
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
23
GPRS
OMAP750 Integrated Communication and Dedicated
Applications Processor
The OMAP750 extends capabilities of the OMAP73x devices while
including a range of features that improve multimedia application
performance. The single-chip OMAP750 integrates an ARM926™
core dedicated to applications processing with a complete Class12
GSM/GPRS modem baseband subsystem that consists of an ARM7™
core with TI’s low-power TMS320C54x™ DSP core.
The OMAP750 incorporates faster memory options, including support
of double data rate (DDR) memory that increases processing speed
over the OMAP730, which supports SDRAM. Improved throughput
from an internal frame buffer also enhances processing of multimedia
applications, including streaming video and high-end imaging functions.
Key Features
• Improved multimedia and application performance
• Class 12 GSM/GPRS modem baseband and ARM926 core for
applications processing
• Increased processing speeds through DDR memory option
and internal frame buffer
• Security protection through hardware-based security platform
• Extended list of peripherals, including parallel Open Core Protocol
(OCP) camera interface for high-resolution imaging
• GPS, WLAN and Bluetooth® wireless technology
• 2.0-megapixel camera
• Pin-to-pin compatible with OMAP730
Texas Instruments 2008
TWL3016 Analog Baseband
The TWL3016 analog baseband integrates all analog and power
management functionality on a single chip. Through power-down
sleep modes, the TWL3016 is able to extend system standby time
significantly, contributing to the overall battery savings the TCS2700
provides. The device also includes a D/A converter for applications
like MP3 music and an 8-Ω amplifier for hands-free speakerphone
operation.
Key Features
• Integrated high-fidelity audio DAC
• Integrated hands-free and headphone amplifiers
• Overall TCS2700 clock input reduction of 50 percent
TRF6151 RF Transceiver
The TRF6151 delivers GSM/GPRS reception as part of the TCS2700
chipset. It is a single-chip transceiver with quad-band support based on
a direct conversion (DC) architecture. This device brings together several
external components to reduce complexity, part-count and cost of the RF
subsystem, including vocoders and vocoder tanks. By integrating what
was previously several external filtering devices, the DC architecture of
the TRF6151 reduces a manufacturer’s BOM by approximately 30 percent
from RF devices with the super heterodyne architecture.
Key Features
• Single-chip transceiver with quad-band support
• Direct conversion architecture
• GPRS Class12/CS4 compliant
• Full integration of VCO and VCO tanks
• Integrated voltage regulators, PA control loop, PLL loop filters
and VCXO
• N-fractional synthesizer
• 7 mm x 7 mm, 48-pin QFP package
Wireless Handsets Solutions Guide
24
TCS Chipset and OMAP-Vox™ Solutions
EDGE
OMAP850 Chipset
Key Benefits
The OMAP850 EDGE chipset and complete reference design are
targeted at wireless smartphones and PDAs. It serves as the ideal
migration path to EDGE for manufacturers using the TCS2600
GSM/GPRS chipset.
• Complete pre-FTA certified, smartphone EDGE
Class 12 reference design
• Data rates of 3X the throughput of GSM/GPRS devices
• Applications including MPEG-4 video and Windows
Media® video, MP3, 2-megapixel camera, etc.
• Software compatible with TCS2600 GSM/GPRS chipset
• Modules available for camera, GPS and WLAN
• TI’s highly integrated BRF6150 Bluetooth® wireless
technology based on TI’s patented DRP™ technology
• High-level mobile OS support, including Symbian OS™,
S60, Microsoft® Windows Mobile® and Linux®
• OMAP™ Developer Network and OMAP Technology
Centers support
OMAP850 chipset components include:
• OMAP850 applications processor with quad-band EDGE modem
• TWL3027 integrated analog baseband with full power
management and audio codec
• BRF6150 Bluetooth® single chip featuring TI’s patented
DRP™ technology
• Fully optimized third-party RF
The OMAP850 chipset is a flexible, scalable solution with the
performance and low power required for systems addressing EDGE
applications, including multimedia, gaming and camera functionality.
In addition to the solution’s components, modules are also available
for incorporating camera, GPS and WLAN capabilities to bring added,
optional capabilities.
OMAP850 Integrated Digital Baseband
and Dedicated Applications Processor
SDRAM/
Mobile DDR
NOR/NAND
Flash
9-Channel
DMA
Traffic
Controller/
Memory
I/G
GSM/EDGE
DSP Modem
ARM9®
Applications
Processor
OMAP™
Processor Core
LCD
Ctrl
Frame
Buffer
192 KB
TSP Voice
Baseband
SIM/SPI
OP/O
UART/IrDA
UART/PWMs
Mailbox
Timer (3)
WDT/RTC
Int Ctrl
I2C Host
µWire/UART
Keyboard
UART
USB Client/OTG
AC97/I2S
MMC
TWL3027 Analog Baseband
and Power Management
Voltage Regulation
Baseband
Serial Port
Clock
Generator
MCU
Serial Port
Backup
Regulation
Internal
BUS
Controller
Test Access
Port
APC,AFC
ADAC
Timing
Serial Port
Audio
Serial Port
GSM/GPRS/
EGPRS
Baseband
Codec
Auxiliary
Drivers
Audio
Codec
Voltage
Reference
Power Control
Stereo
DAC
SIM
Interface
Battery Charger
Interface
Optimized
Quad-band
EDGE RF
Monitoring
ADC
See OMAP™ Processor information on page 33
Wireless Handsets Solutions Guide
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
25
EDGE
OMAP850 Integrated Digital Baseband and Dedicated
Applications Processor
The OMAP850 high-performance applications processor is integrated with
a digital baseband and EDGE co-processor. It is based on the OMAP750
applications processor for GSM/GPRS with added EDGE capabilities. It
enables applications including MPEG-4 video and Microsoft® Windows
Media® video, MP3, 2-megapixel camera and more.
Key Features
• Based on previous generation OMAP750 applications processor
• EDGE Class 12
• Quad vocoders for AMR, EFR, RF and HR
• Camera sensors and support for up to 2.0 megapixels
• Enhanced frame-buffer interface data rate
• DDR support addition
• Secure boot, secure mode and hardware encryption accelerators
• Complete peripheral set
• Complete reference design, hardware and software
TWL3027 Analog Baseband
The TWL3027, an analog baseband device combined with a digital
baseband device, is part of a TI DSP solution intended for mobile
applications including GSM900, DCS1800 and PCS1900 standards
(dual-band capability).
The TWL3027 includes a complete set of baseband functions to
perform the interface and processing of voice signals, interface and
processing of baseband in-phase (I) and quadrature (Q) signals which
support single-slot and multi-slot mode for both GMSK and 8-PSK
modulations. The TWL3027 also includes associated auxiliary RF
control features, supply voltage regulation, battery charging controls,
and switch ON/OFF system analysis.
BRF6150 Bluetooth® Solution
TI’s BRF6150 is a highly integrated Bluetooth v1.2 single-chip solution
that integrates TI’s baseband with Bluetooth® wireless technology, RF,
ARM7TDMI® and power management into a single device for enhanced
performance, reduced cost and reduced board space. The BRF6150
is optimized for mobile handsets where performance and space are
critical. The device leverages TI’s 130-nm digital CMOS process while
incorporating of DRP™ technology in a board layout of 50 mm2.
Key Features
• Full Bluetooth® wireless technology Specification v1.2, including
eSCO, AFH and faster connection
• Direct connection to battery at 2.7 V to 5.5 V; 1.65 V to
3.6 V via LDO
• RF TX: 25 µA; RF RX: 27 µA; Deep-sleep 30 µA
• Improved RF performance with sensitivity of –85 dBm, TX Power +
7 dBm and Class 1 ready
• Blocking ~0 dBm at GSM bands
• Direct connection to battery with 8 external passives and a PCB
layout area of 50 mm2
• Collaborative interface with WLAN and Bluetooth wireless
technology v1.2 AFH
• Complete reference designs with TI’s TCS chipsets and
OMAP™ platform
• Manufactured in TI’s 130-nm CMOS process
• Packaging: 4.5 x 4.5 x 0.8 ROM; or 4.5 x 4.5 stacked flash
prototypes
Third-Party RF Transceiver
A third-party RF transceiver has been fully optimized to work with the
other above components in the OMAP850 chipset smartphone solution.
Key Features
• Applications include EGPRS, GSM900 and PCS1900
DSC1800 cellular telephones
• Baseband codec single and multi-slot
• GMSK/8PSK with I/Q RF interface
• Auxiliary RF converters
• SIM card interface
• Five channel analog to digital converter
• Audio DAC based on I2S format
• Voice codec
• Six low-dropout low-noise linear voltage regulators
• Dedicated low quiescent current mode on regulators
• High voltage (20 V), Li-Ion or NiMH battery charging control
• Voltage detectors (with power-off delay)
• Dedicated very low quiescent current supply domain
• 143-ball MicroStar Junior BGA™ package
Texas Instruments 2008
Wireless Handsets Solutions Guide
26
TCS Chipset and OMAP-Vox™ Solutions
EDGE
OMAPV1030 Integrated GSM/GPRS/EDGE Solution
Key Benefits
The OMAPV1030 solution is one of the industry’s most highly integrated
and optimized EDGE solutions (UMA-ready), combining applications
and modem on a single device to enable handset manufacturers to
reduce costs and speed time to market. The baseband processor
design expands on TI’s proven GSM/GPRS technology and leverages
TI’s advanced high-volume, 90-nm digital CMOS process technology.
The OMAPV1030 processor is based on the OMAP™ architecture and
runs both GSM/GPRS/EDGE modem and applications processing on
a single OMAP core, ensuring a high-quality multimedia mobile
experience. The combination of the ARM926EJ-S™ and TI DSP is used
to improve performance while reducing costs and power consumption,
resulting in longer battery life and usage times for consumers. Because
all OMAP-Vox™ solutions share a common software platform, this
solution maximizes software re-use to bring overall development costs
down and provides a natural and affordable roadmap from
GSM/GPRS/EDGE to WCDMA.
The OMAPV1030 solution is specifically designed to bring multimedia
functionality to mass market mobile phones and delivers advanced
capabilities to mid-range wireless handsets. The OMAPV1030 solution
includes best-in-class, advanced multimedia performance including:
SDRAM
SDR/DDR
GSM/GPRS/EDGE RF
• Video:
– Capture, playback and streaming MPEG-4/H.263 (QVGA) up to
25-fps QVGA display
– H.264 (QVGA) playback at 15-fps QVGA display
• 2D and 3D gaming 100,000 polygons per second, 2-megapixel
rasterization, 15 fps
The OMAPV1030 solution supports all form factor requirements,
including PDAs, clamshells, bar-types and other mechanical designs.
TI’s open-platform architecture provides manufacturers the flexibility
and choice needed to differentiate their products to emerging
markets worldwide.
• Comprehensive audio/video codecs and imaging algorithms
• Ringtones: 64-polyphonic MIDI
• Audio: MP3, stereo, AAC, AAC+, enhanced AAC+, WMA
• Still image: Camera up to 2 megapixel with 1.3 second
shot-to-shot imaging: JPEG, GIF, EXIF, PNG, BMP
• Dual LCD support (main LCD up to QVGA 256,000 color)
Radio
(Digital Interface)
• Integrated modem and applications processing on a single core
• EDGE Class 10 support, Class 12 capable, UMA ready
• High-performance Java™ (including Java acceleration)
• Ability to support HLOSs and Nucleus™ applications suites
• Support for external memory cards including MMC/SD
• Connectivity includes Wi-Fi®, Bluetooth® 2.0/EDR, IrDA
and USB OTG
• Embedded security via hardware accelerators supporting
terminal security, transactions security, and content security
• Re-usable APIs for maximum re-use across OMAP-Vox family
improving time-to-market
• Complete TI system solution offering
NOR/NAND
Flash
IrDA
USIM
OMAPV1030
EDGE Digital Baseband Processor
GSM/GPRS/
EDGE
Peripherals
TMS320C55x™
DSP
ARM926EJ-S™
Subsystem
Connectivity
Peripherals
BlueLink™
Bluetooth®
NaviLink™
GPS
LED
Speakerphone
Hi-Fi
TWL3029 Analog,
Power Management,
Audio
Microphone
Battery
Wireless Handsets Solutions Guide
USB-OTG
Connector
Sub-LCD
Display
Camera
Sensor
MMC/SD/MS
WiLink™
mWLAN
Hollywood™
Mobile TV
Texas Instruments 2008
TCS Chipset and OMAP-Vox™ Solutions
27
EDGE
OMAPV1035 Single-Chip Handset Solution
Key Benefits
The OMAPV1035 solution is the first to integrate GSM/GPRS/EDGE
modem, digital RF and applications processor functionality onto the
same silicon, leveraging the LoCosto™ single-chip cell phone solution
and the multimedia capabilities of the OMAP-Vox™ platform.
• Single chip with integrated RF, digital baseband and application
processor for affordable EDGE multimedia devices
• EDGE Class 12 release 4/5 compliant, DTM Class 11
• 65-nm process for smallest footprint and circuit board costs
• Leverages TI’s innovative DRP™ technology
• Extensive connectivity options: BlueLink™ Bluetooth®,
WiLink™ WLAN, NaviLink™ GPS and Hollywood™ DTV
• USB high-speed and USB OTG support for high-speed
connectivity
• TV-out support
• SD/MMC/MS-Pro/Micro-SD support for external storage
• Embedded TI’s M-Shield™ technology for strong HW-assisted
security and SmartReflex™ technologies for advanced power
reduction
• Complete TI system software offering with seamless migration
from the OMAPV1030 solution
• Lower power consumption compared to previous generation
OMAPV1030 solution
Sharing the same platform with the OMAP-Vox family ensures software
re-use for faster and more cost-effective feature phone development.
Integrating the innovative RF capabilities of TI’s DRP technology with
the powerful processing of the OMAP-Vox architecture yields
significant cost savings. As a result, mobile device manufacturers
can bring compelling multimedia applications to entry and mid-range
wireless devices worldwide.
The OMAPV1035 is the first 65-nm single-chip solution to support
EDGE, as well as to integrate modem, applications processor and RF
into a single offering. A powerful multimedia platform, the OMAPV1035
leverages the capabilities of advanced ARM® and DSP technologies to
deliver the following:
• 30-fps video playback and record with QVGA display
• A full 256,000 palette of colors
• 3-megapixel resolution camera support with sub-second delay
• User responsiveness as fast as 0.3 seconds shot-to-shot
• “See What I See“ at 15 fps, 2D/3D gaming, audio/video codecs
and imaging algorithms (MP3, AAC+, eAAC+, WMA/WMV, Real)
• 3D graphic processing up to 200,000 polygons per second
maximum software re-use, improving time to market and easing the
processing of porting application suites. TI’s open-platform architecture
provides manufacturers the flexibility and choice needed to
differentiate their products to markets worldwide.
The OMAPV1035 is scalable and adaptable to customer needs with
a wide range of configuration and connectivity capabilities. The
common software foundation used across TI solutions allows for
Fast
IrDA
NaviLink™
GPS
Hollywood™
Mobile DTV
WiLink™
mWLAN
Trace
Analyzer
Emulator
Pod
Trace
JTAG/
Emulation
I/F
IrDA
NOR
FLASH
NAND
Flash
pSRAM
Mobile
DDR
Memory Interface
OMAPV1035
I2C
ARM926EJ-S™
Subsystem
SPI
TMS320C55x™
DSP
DRP™ Technology Integrated
GSM/GPRS/EDGE RF
SDIO
Coexistence
Timers, Interrupt Controller, Mailbox
BRF6300
BlueLink™
BlueLink™
®
Bluetooth
5.0
Solution
Boot/Secure ROM
I2C, MCSI
UART
SIM/
USIM
SIM
Camera I/F
Serial Parallel
I2C
System Interface
Power Reset
Clock Manager
USB 2 OTG Controller
Camera
Sensor
TWL3034
Battery
Charger
Audio/Voice
Codec
In/Out
LED
M-Shield™ Security Technology: SHA-1/MD5,
DES/3DES, RNG, AES, PKA, Secure WDT, Keys
USB Connector
Battery
Shared Memory Controller/DMA
DRP™ GSM/
GPRS/EDGE
MS/MMC/SD/SDIO
MS/MMC/
SD/SDIO
CARD
Texas Instruments 2008
Audio
Power Manager
Vibrator
RF PA/Front End
On/Off
32 kHz Crystal
Display Controller
Parallel-Serial
QVGA
Color TFT
Display
Keypad
Key Pad
Sub Display
Wireless Handsets Solutions Guide
28
TCS Chipset and OMAP-Vox™ Solutions
Chipset Reference Designs
Chipset Reference Designs
Key Benefits
TI’s chipset family and supporting reference designs speed
manufacturers’ new product development and time to market,
and address market segments ranging from voice-centric phones
to application-rich smartphones. In some cases, manufacturers can
leverage a reference design to deliver a new product to market in
less than six months.
Because they are fully tested and type-approved, TI’s wireless
reference designs allow manufacturers to focus on product
differentiation and product development. They come with a complete
BOM and component list, along with board design and layout.
A complete and fully validated wireless software suite includes
communication protocol stacks for 2G, 2.5G and 3G, along with
support for major mobile OS and the applications suite for the
wireless chipsets.
TI’s best-in-class customer support guides manufacturers from
design start through full-scale production. Worldwide locations are
based in Europe, USA, China, Taiwan and Japan.
OMAP850
Reference Design
Wireless Handsets Solutions Guide
TCS2600 GSM/GPRS Chipset
Reference Design
• Manufacturing quality, with competitive BOM costs and
full component list
• Designs tailored to all market segments
• Low power consumption
• Board design and layout
• Complete and fully-validated wireless software suite
includes communication protocol stacks and leading OS support
• Customizable-ready user interface
• Multimedia and PIM applications
• Worldwide support structure
TI Chipset Reference Designs
• TCS2010 GSM/GPRS
• TCS2110 GSM
• TCS2200 GSM/GPRS
• TCS2300 GSM LoCosto™ Solution
• TCS2310 GPRS LoCosto™ Solution
• TCS2305 GSM LoCosto™ Solution
• TCS2315 GPRS LoCosto™ Solution
• TCS2600 GSM/GPRS
• TCS2700 GSM/GPRS
• OMAP850 EDGE
• OMAPV1030 OMAP-Vox™ Solution GSM/GPRS/EDGE
• OMAPV1035 OMAP-Vox™ Solution GSM/GPRS/EDGE
• BRF6100 Bluetooth®
• And more
LoCosto™ GSM/GPRS
Reference Design
BlueLink™ 6.0
Bluetooth® Solution
Texas Instruments 2008
OMAP™ Platform
29
To Know More
OMAP™ processors featured in this issue:
Integrated Modem and Applications Processors
31-33
OMAP-Vox™ Solutions
34-36
OMAP-DM Coprocessors
37-38
Multimedia Processors
39
High-Performance Multimedia-Rich Applications Processors 40-49
OMAP Platform Resources
Texas Instruments 2008
50-56
Wireless Handsets Solutions Guide
30
OMAP™ Platform
Overview
For designers looking to deliver the most differeniated,
multimedia-rich applications that will attract users to next-generation
devices and services, TI’s OMAP™ platform is the answer. Its
comprehensive mix of processors, software and support deliver the
real-time processing and low power consumption necessary for
advanced applications, including streaming media, security, interactive
gaming, multi-megapixel imaging, location-based services and more.
The OMAP platform includes applications processors and integrated
baseband and applications processors suited for a wide range
of mobile devices including general-purpose handsets to high-end,
power-efficient multimedia smartphones and other portable Internet
access devices. TI has maximized software re-use and incorporated
a high level of compatibility, making the OMAP platform an effective
choice for implementing a complete multi-line product family for
multiple market segments.
Optimized software, including the operating system port, is an
essential element of the OMAP platform. TI delivers differentiated
software solutions on the OMAP platform addressing all high-level
operating systems with key driver support and hardware-accelerated
multimedia codecs. An extensive selection of integrated peripherals
and manufacturing-ready reference designs reduces a system’s
bill-of-materials (BOM) cost and board space and accelerates time
to market.
A comprehensive, open-software infrastructure makes the OMAP
platform an ideal complement to TCS wireless chipset solutions.
TI provides support for the most prevalent OSs (Symbian, Linux and
Microsoft), high-level programming languages, third-party applications,
multimedia components, basic building block algorithms and a host of
software development tools. In addition, TI’s OMAP Developer
Network of third-party application developers includes an extensive
selection of innovative applications and media components that
manufacturers can easily integrate into products for differentiation.
Wireless Handsets Solutions Guide
TI also offers support with its full complement of reference designs.
Wireless design centers in the Americas, Europe and Asia provide
quick access to TI expertise. Additionally, the worldwide OMAP
Technology Centers are staffed by development experts who provide
system integration, development and other critical support for OMAP
processor-based product development. Finally, TI offers training,
technical documentation, an online knowledge base and interactive
discussion groups—all designed to speed the development process
and work with manufacturers to quickly get to market.
OMAP™ 3 Platform
TI’s OMAP 3 platform builds on the robust multimedia performance
of TI’s OMAP 2 processors and adds a new realm of support for even
higher-performance entertainment and productivity applications.
As the industry’s first architecture to be based on the ARM®
Cortex™-A8 processor, the OMAP 3 platform can triple the ARM
performance of ARM11™-based processors. In addition, the
DSP-based IVA™ 2+ accelerator provides up to 4X the performance
of previous OMAP multimedia processing. Software-compatible with
previous generations of OMAP technology, the OMAP 3 platform
introduces a new level of performance that enables laptop-like
productivity and advanced entertainment in 3G and beyond handsets.
The OMAP 3 platform is a complete system solution for advanced
graphics standards including OpenGL® ES 2.0 and OpenVG™. Support
for these open graphic standards gives developers the tools to create
effects that deliver a level of cinematic realism rivaling that of
Hollywood movies. Rich effects such as facial features and textured
backgrounds that previously were only possible with PCs and gaming
consoles will be brought to the mobile environment.
Texas Instruments 2008
OMAP™ PlOMAP™ Platform
31
Integrated Modem and Applications Processors
OMAP730 Processor
Key Benefits
The OMAP730 builds on the proven foundation of previous
processors and offers twice the application performance and double
the standby time for handsets, smartphones and PDAs. It includes a
dedicated TI-enhanced ARM926™ processor for applications processing,
and TI’s Class 12 GSM/GPRS digital baseband that incorporates an
ARM7TDMI® and TMS320C54x™ DSP core. The ARM926 applications
processor enables applications like high-quality streaming audio,
hardware-based security, accelerated Java™ processing, web browsing,
personal information management (PIM) applications, location-based
services and more. The OMAP730’s integrated SRAM frame buffer
boosts streaming media performance and lowers IDLE-mode power.
• Twice the application performance over the
previous generation
• Double the standby time for handsets, smartphones
and PDAs
• Half the board space over the previous generation
and reduced system cost
• Enables applications including accelerated Java™
processing, web browsing, personal information management,
location-based services and more
• Increased space for adding functionality including
WLAN, GPS or Bluetooth® wireless technology
• Security protection through hardware security subsystem
• Integrated peripherals including USB On-the-Go and VLYNQ™
communications interface
• 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch
Forty integrated on-chip peripherals included as part of the OMAP730
reduce board space by half over the previous generation and overall
system cost by one-third. This integration provides additional space for
functionality such as WLAN, GPS or Bluetooth® wireless technology.
A comprehensive hardware security subsystem is also included and
consists of a secure bootloader, secure execution environment with
secure RAM and ROM, and hardware accelerators for encryption and
authentication. The OMAP730 processor is available as part of the
TCS2600 chipset and reference design.
WiLink™
mWLAN
Compact
FLASH
Emulator
Pod
NAND
FLASH
FLASH
Debug Messaging
Serial
BlueLink™
Bluetooth® Data
JTAG/
Emulation
I/F
High Speed WLAN
a/b/g
UART
Voice
TRF6151
GSM/GPRS
Quad-band
Direct
Conversion
RF
TWL3016
Analog
Baseband
Voice/High
Fidelity
Audio
Codec
Power
Management
Voice/
Audio
In/Out
GSM
Subscriber
Identity
Module
Texas Instruments 2008
Fast
IrDA
Mobile
SDRAM
EMIF/CF
UART/IrDA
I2C
Keypad
OMAP730
GSM/GPRS
Digital Baseband
ARM7™ MCU
GPIO
LPG
LPG
ARM926™
Control/
Data
GSM
Real-Time
Control
GPIO
LED
LED
μWire
Secondary
LCD
PWT
Buzzer
TMS320C54x™
Shared Memory Controller/DMA
EMT9
2D Graphic Accelerator
13 MHz
Audio
Enhanced
Audio
Controller
I2S/AC97
NavilInk™
GPS
Camera I/F
Debugger
CMOS
Sensor
RIF/SPI
Frame Buffer/Internal SRAM
SD/MMC
SDIO
MMC Flash Card,
SD Flash Card
GSM Clock
Management
Timers, Interrupt Controller, RTC
HDQ/1 wire
Battery
SIM
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RNG
SPI
USB OTG
TSC2046
Optical or
Touch Screen
Controller
Client/Host
LCD
Controller
Liquid
Crystal
Display
Clock
and
Reset Mgt.
PWL
32 kHz
Reset
LCD
Light
Controller
Wireless Handsets Solutions Guide
32
OMAP™ Platform
Integrated Modem and Applications Processors
OMAP750 Processor
Key Benefits
Targeted at wireless handsets, smartphones, PDAs and Internet
access devices, the OMAP750 extends capabilities of the OMAP73x
device while including a range of features that improve multimedia
application performance. The OMAP750 integrates an ARM926™ core
dedicated to applications processing. The processor is a complete
Class12 GSM/GPRS modem baseband subsystem which consists
of an ARM7™ core with TI’s low power TMS320C54x™ core.
• Improved multimedia and application performance
• Class 12 GSM/GPRS modem baseband and ARM926 core
for applications processing
• Increased processing speeds through DDR memory option
and internal frame buffer
• Protection through hardware-based security platform
• Extended list of peripherals, including parallel OCP camera
interface for high resolution imaging
• GPS, WLAN and Bluetooth® wireless technology-capable
• 2-megapixel camera
• Pin-to pin compatible with OMAP730
• 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch
The OMAP750 incorporates faster memory options, including
support of double data rate (DDR) memory that increases processing
speed over the OMAP730, which supports SDRAM. Improved
throughput from an internal frame buffer also enhances processing
of multimedia applications, including streaming video and high-end
imaging functions.
The OMAP750 provides strong security safeguards, as its hardwarebased measures offer a higher degree of protection over software-only
features. A secure bootloader, secure memory (ROM and RAM)
and random number generators are included. Security hardware
accelerators also address popular security standards like MD5/SHA1
and DES/3DES.
NAND
FLASH
WiLink™
mWLAN
Emulator
Pod
FLASH
Debug Messaging
Serial
BlueLink™
Bluetooth® Data
JTAG/
Emulation
I/F
High-Speed WLAN
a/b/g
UART
Voice
TRF6151
GSM/GPRS
Quad-band
Direct
Conversion
RF
TWL3016
Analog
Baseband
Voice/
Audio
Voice/High
Fidelity
Audio
Codec
Control/
Data
Power
Management
GSM
Real-Time
Control
13 MHz
Audio
In/Out
GSM
Subscriber
Identity
Module
Wireless Handsets Solutions Guide
Enhanced
Audio
Controller
2
I S/AC97
NaviLink™
GPS
Fast
IrDA
Mobile
DDR
EMIF/CF
UART/IrDA
I2C
Keypad
OMAP750
GSM/GPRS
Digital Baseband
ARM7™ MCU
GPIO
LPG
LPG
ARM926™
TMS320C54x™
Shared Memory Controller/DMA
Secondary
LCD
PWT
Buzzer
OCP Camera I/F
RIF/SPI
Frame Buffer/Internal SRAM
GSM Clock
Management
Timers, Interrupt Controller, RTC
TSC2046
Optical or
Touch Screen
Controller
Client/Host
LCD
Controller
Liquid
Crystal
Display
CMOS
Sensor
MMC Flash Card,
SD Flash Card
HDQ/1 wire
Battery
Clock
and
Reset Mgt.
SIM
USB OTG
Debugger
SD/MMC
SDIO
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RNG
SPI
LED
μWire
EMT9
2D Graphic Accelerator
GPIO
LED
PWL
32 kHz
Reset
LCD
Light
Controller
Texas Instruments 2008
OMAP™ Platform
33
Integrated Modem and Applications Processors
OMAP850 Processor
Key Benefits
The OMAP850 integrated modem and applications processor offers the
high performance and low power required for GSM/GPRS and EDGE
applications including multimedia, gaming and camera functionality.
Software compatible with other OMAP™ applications processors, it
serves as an ideal choice for upgrading wireless smartphones and
PDAs to meet the EDGE standard requirements.
• Enables multimedia, gaming and camera functions in
high-performance smartphones and PDAs
• Based on previous generation OMAP730 applications processor
• GSM/GPRS/EDGE capable
• Software compatible with family of OMAP™ applications
processors
• Support for various software standards including MPEG-4 video,
Microsoft® Windows Media® Video, MP3, 2-megapixel
camera and others
• HLOSs support
• Broad range of applications through OMAP Developer Network
• 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch
The OMAP850 processor integrates into a single package an ARM9®based applications processor and a GSM/GPRS/EDGE digital baseband.
The OMAP850 supports MPEG-4 video, Windows Media® Video, MP3,
up to 2.0 megapixel still image capture and more.
TI includes a security hardware platform as part of the OMAP850
that includes secure mode, secure boot and hardware encryption
accelerators. It supports high-level mobile OSs, such as Symbian OS™,
Microsoft® Windows Mobile®, S60 and Linux®.
WiLink™
mWLAN
NAND
FLASH
Emulator
Pod
JTAG/
Emulation
I/F
High-Speed WLAN
a/b/g
UART
Voice
EDGE
RF
TWL3016
Analog
Baseband
Voice/High
Fidelity
Audio
Codec
Power
Management
Audio
In/Out
GSM
Subscriber
Identity
Module
Texas Instruments 2008
Voice/
Audio
Enhanced
Audio
Controller
I2S/AC07
I2C
UART/IrDA
EMIF/CF
Keypad
OMAP850
Serial
BlueLink™
Bluetooth® Data
Fast
IrDA
Mobile
DDR
FLASH
Debug Messaging
NaviLink™
GPS
EDGE
Co-processor
GSM/GPRS/EDGE
Digital Baseband
ARM7™ MCU
TMS320C54x™
GPIO
LPG
ARM926™
μWire
PWT
Shared Memory Controller/DMA
EMT9
2D Graphic Accelerator
Control/
Data
GSM
Real-Time
Control
13 MHz
LPG
OCP Camera I/F
GPIO
LED
LED
Secondary
LCD
Buzzer
Debugger
CMOS
Sensor
RIF/SPI
Frame Buffer/Internal SRAM
SD/MMC
SDIO
MMC Flash Card,
SD Flash Card
GSM Clock
Management
Timers, Interrupt Controller, RTC
HDQ/1 wire
Battery
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RNG
Clock
and
Reset Mgt.
SIM
SPI
USB OTG
TCS2046
Optical or
Touch Screen
Controller
Client/Host
LCD
Controller
Liquid
Crystal
Display
PWL
32 kHz
Reset
LCD
Light
Controller
Wireless Handsets Solutions Guide
34
OMAP™ Platform
OMAP-Vox™ Solutions
OMAP-Vox™ Solutions
One important aspect of 2.5G and 3G success is the ability to bring
advanced services to the broadest possible population of mobile users.
TI’s OMAP-Vox™ platform is the answer. With OMAP-Vox solutions, TI
adds modem functionality to its successful OMAP™ architecture.
Leveraging software compatibility across the platform, customers can
easily scale across multiple market segments from GSM/GPRS/EDGE
to WCDMA. OMAP-Vox solutions are optimized to efficiently run a
dynamic mix of application and communication functions on the same
hardware. They integrate proven modem, multimedia and applications
processing onto a single chip with a compatible software foundation
that can be re-used for evolving market segment requirements.
Designed to scale from feature phones to advanced multimedia
smartphones, the OMAP-Vox platform continues TI’s legacy of software
compatibility and re-use, saving years of software design effort. This
software serves as the foundation for applications, multimedia and
communications development on all OMAP-Vox solutions, saving
manufacturers time and money.
The OMAP-Vox family includes the OMAPV1030 (GSM/GPRS/EDGE)
and OMAPV1035 GSM/GPRS/EDGE integrated solutions. Optimized
to enable mid-range multimedia devices, the OMAPV1030 supports
applications such as high-quality video capture and playback, video
streaming and downloads, megapixel digital still cameras and
interactive 2D/3D gaming.
A powerful multimedia solution, the OMAPV1035 was the first
65-nm single-chip solution to support EDGE, and to integrate modem,
applications processor and RF into a single offering.
Customers using TI’s wireless chipsets will also be able to
re-use the GSM/GPRS protocol stack software when migrating to the
OMAP-Vox platform. These complete, scalable solutions deliver the
necessary elements allowing manufacturers to bring differentiated
mobile devices to market fast, including a broad range of hardware,
software, reference designs, development tools and support.
The OMAP-Vox platform offers complete system solutions
encompassing an integrated modem and applications processor,
RF, analog and power management functions, complete field-tested
protocol stack software, high-performance multimedia codecs and
functions, applications software suite via ecosystem partners, a
competitive handset reference design and a complete development
toolkit.
Wireless Handsets Solutions Guide
Texas Instruments 2008
35
OMAP-Vox™ Solutions
OMAPV1030 Integrated GSM/GPRS/EDGE Solution
OMAP™ Platform
Key Benefits
The OMAPV1030 solution is one of the industry’s most highly integrated
and optimized EDGE solutions (UMA-ready), combining applications and
modem on a single device to enable handset manufacturers to reduce
costs and speed time to market. The baseband processor design
expands on TI’s proven GSM/GPRS technology and leverages TI’s
high-volume, 90-nm digital CMOS process technology.
The OMAPV1030 processor is based on the OMAP™ platform
and runs both GSM/GPRS/EDGE modem and applications processing
on a single OMAP core, ensuring a high-quality multimedia mobile
experience. The combination of the ARM926EJ-S™ and TI DSP is used
to improve performance while reducing costs and power consumption,
resulting in longer battery life and usage times for consumers. Because
all OMAP-Vox™ solutions share a common software platform, this
solution maximizes software re-use to bring overall development costs
down and provides a natural and affordable roadmap from
GSM/GPRS/EDGE to WCDMA.
The OMAPV1030 solution is specifically designed to bring multimedia
functionality to mass market mobile phones and delivers advanced
capabilities to mid-range wireless handsets. The OMAPV1030 solution
includes best-in-class, advanced multimedia performance including:
• Comprehensive audio/video codecs and imaging algorithms
• Ringtones: 64-polyphonic MIDI
• Audio: MP3, AAC, AAC+, enhanced AAC+, WMA, stereo sound
• Still image: Camera up to 2 megapixel with 1.3 second shot-to-shot
imaging: JPEG, GIF, EXIF, PNG, BMP
• Dual LCD support (main LCD up to QVGA 256,000 palette of color)
SDRAM
SDR/DDR
Radio
(Digital Interface)
• Integrated modem and applications processing on a single core
• EDGE Class 10 support, Class 12 capable, UMA ready
• High-performance Java™ (including Java acceleration)
• Ability to support HLOSs and Nucleus™ applications suites
• Support for external memory cards including MMC/SD
• Connectivity includes Wi-Fi®, Bluetooth® 2.0/EDR, IrDA
and USB OTG
• Embedded security via hardware accelerators supporting
terminal security, transactions security and content security
• Re-usable APIs for maximum re-use across OMAP-Vox family,
improving time to market
• Complete TI system solution offering
• Video:
– Capture, playback and streaming MPEG-4/H.263 (QVGA) up to
25-fps QVGA display
– H.264 (QVGA) playback at 15-fps QVGA display
– 2D and 3D gaming 100,000 polygons per second, 2-megapixel
rasterization, 15 fps
The OMAPV1030 solution supports all form factor requirements,
including PDAs, clamshells, bar-types and other mechanical designs.
TI’s open-platform architecture provides manufacturers the flexibility
and choice needed to differentiate their products to emerging markets
worldwide.
NOR/NAND
Flash
IrDA
USIM
OMAPV1030
EDGE Digital Baseband Processor
GSM/GPRS/
EDGE
Peripherals
TMS320C55x™
ARM926EJ-S®
Subsystem
Connectivity
Peripherals
GSM/GPRS/EDGE RF
BlueLink™
Bluetooth®
NaviLink™
GPS
LED
Speakerphone
Hi-Fi
TWL3029 Analog,
Power Management,
Audio
Microphone
Battery
Texas Instruments 2008
USB-OTG
Connector
Sub-LCD
Display
Camera
Sensor
MMC/SD/MS
WiLink™
mWLAN
Hollywood™
Mobile TV
Wireless Handsets Solutions Guide
36
OMAP™ Platform
OMAP-Vox™ Solutions
OMAPV1035 Single-Chip Handset Solution
Key Benefits
The OMAPV1035 solution is the first to integrate GSM/GPRS/EDGE
modem, digital RF and applications processor functionality onto the
same silicon. The device builds on the LoCosto™ single-chip cell phone
solution and the multimedia capabilities of the OMAP-Vox™ platform.
• Single chip with integrated RF, digital baseband and application
processor for affordable EDGE multimedia devices
• EDGE Class 12 release 4/5 compliant, DTM Class 11
• 65-nm process for smallest footprint and circuit board costs
• Leverages TI’s innovative DRP™ technology
• Extensive connectivity options: BlueLink™ Bluetooth®,
WiLink™ WLAN, NaviLink™ GPS and Hollywood™ DTV
• USB High-Speed and USB OTG support for high-speed
connectivity
• TV-out support
• SD/MMC/MS-Pro/Micro-SD support for external storage
• Embedded TI’s M-Shield™ technology for strong HW-assisted
security and SmartReflex™ technologies for advanced power
reduction
• Complete TI system software offering with seamless migration
from the OMAPV1030
• Lower power consumption compared to previous
generation, OMAPV1030
Sharing the same platform with the OMAP-Vox family ensures software
re-use for faster and more cost-effective feature phone development.
Integrating the innovative RF capabilities of TI’s DRP technology with
the powerful processing of the OMAP-Vox architecture yields
significant cost savings. As a result, mobile device manufacturers
can bring differentiated multimedia applications to entry- and
mid-range wireless devices worldwide.
The OMAPV1035 was the first 65-nm single-chip solution to support
EDGE, as well as to integrate modem, applications processor and RF
into a single offering. A powerful multimedia platform, the OMAPV1035
leverages the capabilities of advanced ARM® and DSP technologies to
deliver the following:
• 30-fps video playback and record with QVGA display
• A full 256,000 palette of colors
• 3-megapixel resolution camera support with sub-second delay
• User responsiveness as fast as 0.3 seconds shot-to-shot
• “See What I See“ at 15 fps, 2D/3D gaming, audio/video codecs
and imaging algorithms (MP3, AAC+, eAAC+, WMA/WMV, Real)
• 3D graphic processing up to 200,000 polygons per seconds
maximum software re-use, improving time to market and easing the
processing of porting application suites. TI’s open-platform architecture
provides manufacturers the flexibility and choice needed to differentiate
their products to emerging markets worldwide.
The OMAPV1035 is scalable and adaptable to customer needs with
a wide range of configuration and connectivity capabilities. The
common software foundation used across TI solutions allows for
Fast
IrDA
NaviLink™
GPS
Hollywood™
Mobile DTV
WiLink™
mWLAN
Trace
Analyzer
Emulator
Pod
Trace
JTAG/
Emulation
I/F
IrDA
NOR
FLASH
NAND
Flash
pSRAM
Mobile
DDR
Memory Interface
OMAPV1035
I2C
ARM926EJ-S™
Subsystem
SPI
TMS320C55x™
DSP
DRP™ Technology Integrated
GSM/GPRS/EDGE RF
SDIO
Coexistence
Timers, Interrupt Controller, Mailbox
BRF6300
BlueLink™
BlueLink™
®
Bluetooth
5.0
Solution
Boot/Secure ROM
I2C, MCSI
UART
SIM/
USIM
SIM
Camera I/F
Serial Parallel
I2C
System Interface
Power Reset
Clock Manager
USB 2 OTG Controller
Camera
Sensor
TWL3034
Battery
Charger
Audio/Voice
Codec
In/Out
LED
M-Shield™ Security Technology: SHA-1/MD5,
DES/3DES, RNG, AES, PKA, Secure WDT, Keys
USB Connector
Battery
Shared Memory Controller/DMA
DRP™ GSM/
GPRS/EDGE
Keypad
MS/MMC/SD/SDIO
MS/MMC/
SD/SDIO
CARD
Wireless Handsets Solutions Guide
Audio
Power Manager
Vibrator
RF PA/Front End
On/Off
32 kHz Crystal
Key Pad
Display Controller
Parallel-Serial
QVGA
Color TFT
Display
Sub Display
Texas Instruments 2008
As wireless services drive forward into advanced 3G and 4G technologies,
handsets themselves continue to grow in capabilities such as higher-resolution cameras and displays. Today, camera phones are moving to 5- and
8-megapixel image sensors and beyond, with displays that show a corresponding increase in resolution. As a result, baseband and application
processors that were designed for lower resolutions are beginning to
strain to keep up with the demand for increased multimedia performance.
Handset manufacturers need solutions that can help them upgrade their
existing designs quickly and with minimal development investment in
order to provide users the latest advanced features in imaging and video.
OMAP-DM coprocessors address the need for increased multimedia performance in the cellular handset market. Integrating a high-performance
ARM microprocessor with a dedicated image signal processor (ISP) and a
video processor, the OMAP-DM devices allow system developers to quickly adapt their current architectures to meet market requirements and differentiate their products. The coprocessors are streamlined to provide all
the necessary interfaces to camera sensors and hosts, operating side by
side with OMAP™ application processors or directly with baseband
modem processors to provide media-centric handsets. By complementing
the standalone OMAP processor or other host, the OMAP-DM coprocessors support higher camera resolutions while speeding multimedia operation to enhance the user’s experience of video and still images in a variety
of applications.
High performance, flexibility and ease of use are key to the design of
OMAP-DM products. Devices support a number of widely used imaging
and video standards up to D1 (720 x 480) resolutions. A variety of interfaces
make system hardware connections straightforward, and stacked memory
options and small form factor packages keep space to a minimum.
Software is ready to use and operation is transparent to the developer: the
phone operating system, media applications and graphical user interface
remain on the host processor while the OMAP-DM device accelerates
handset imaging and video. The framework and codecs that form the
Texas Instruments 2008
37
OMAP-DM Coprocessors
OMAP-DM Coprocessors
OMAP™ Platform
Key Benefits
• Simplifies design of new and existing mobile systems with
high-resolution imaging and video capabilities
• Seamlessly supports OMAP™ application processors, with a
variety of host interfaces for added flexibility
• Full support of multiple image sensors utilizing various
interfaces to maximize compatibility
• Advanced image signal processor (ISP) for fast JPEG compression
• Supports multiple video algorithms for encode and decode at
high mobile display resolutions
• Ready to use without coprocessor programming, minimizing risk
and saving development time
• Includes TI baseline imaging and video processing software,
with many additional advanced still imaging and video features
available from third parties
• Low power consumption, small form factor aid long battery
operation and mobility
• Leverages TI expertise in both digital still cameras and wireless
technologies
baseline software are included by TI along with the product. In addition,
advanced still imaging and video features and applications are available
from third parties. The OMAP-DM family provides memory and feature
sets for a wide range of handsets, and future introductions will address
market trends toward cameras and displays with even higher resolutions.
For nearly a decade, TI has been applying its leadership in digital signal
processor technology to provide highly integrated solutions for digital still
cameras (DSCs). Not long after releasing its first DSC products, TI redefined wireless multimedia technology with the introduction of the OMAP
platform. OMAP-DM coprocessors combine TI’s expertise in imaging and
wireless technologies, helping extend the capabilities of media-centric
handsets with higher resolutions and more features than ever.
Wireless Handsets Solutions Guide
38
OMAP™ Platform
OMAP-DM Coprocessors
OMAP-DM510
Key Benefits
The highly integrated OMAP-DM510 multimedia coprocessor combines
low-power hardware and programmable image processing capability
to provide high still image and video quality in camera phones. As 3G
phones add cameras with ever higher resolutions, application processors
that are already in use need the boost of a coprocessor to speed
multimedia performance. The OMAP-DM510 permits manufacturers to
integrate increased performance from a coprocessor with little
redesign into systems with existing platforms in order to improve
camera and video quality.
• TI’s latest image signal processor (ISP) technology
• Supports up to 30-fps encode and decode at D1 resolution
• Full support of multiple image sensors utilizing various interfaces to
maximize compatibility
• High-quality video capture supported with high-resolution advanced
video codecs
• Integrate output to TV with digital overlay
• Seamless interface to OMAP™ application processors and other
baseband and application processors
• Ready to use without coprocessor programming, minimizing risk
and saving development time
• Includes TI baseline imaging and video processing software, with
additional advanced still imaging and video features available from
third parties
• Low power consumption, small form factor aid long battery
operation and mobility
• Leverages TI expertise in both digital still cameras and wireless
technologies
The OMAP-DM510 device features an ARM processor and TI’s most
advanced Image Signal Processor (ISP) technology. With its best-inclass imaging and video, the device supports camera image sensors
up to 5 and 8 megapixels, content output to TV displays, JPEG
compression, and D1 (720 x 480 pixels) video encode and decode for
multiple codec standards. Internal processing improves picture quality
with features such as defect pixel correction, lens shading compensation, color
filter array interpolation, white balancing, Gamma correction, color
space conversion and image scaling.
Flexible interfaces support various types of CMOS sensor interfaces,
signal conditioning circuits, power management, mobile DDR-SDRAM,
and auto-focus motor controls. The coprocessor also offers a seamless
interface to application and baseband processors. Low power
consumption, optimized by TI’s unique SmartReflex™ power-saving
technologies, helps prolong time between battery charges in mediacentric handsets.
investment in development. Software management for the OMAPDM510 device’s programmable and dedicated image processing functions and peripherals is performed through the high-level operating
system on the host processor. As part of the product, TI provides the
framework and codecs that make up the baseline software. In addition,
advanced still imaging and video features and applications are available from third parties.
The OMAP-DM510 device comes ready-to-use with software, enabling
coprocessor enhancement to new and existing systems with minimal
DDR Memory
Interface
Stacked
mDDR-SDRAM
OMAP-DM510
Host
Host Port
Interface
Video Port
Interface
Image
Coprocessor
ARM926®
Camera I/F
Serial - Parallel
I2C x 3
Video
Coprocessor
Image Signal Processor (ISP)
GPIO
Sensor CLKC x 2
Camera - Serial
Wireless Handsets Solutions Guide
Audio
Interface
Video DAC
S-Video
Audio
Codec
TV
NTSC/PAL
Camera Module
Clock and Control
SPI x 1
Sub Camera
Texas Instruments 2008
39
Multimedia Processors
OMAP331 Processor
OMAP™ Platform
Key Benefits
The OMAP331 processor provides a feature-rich platform for
price-sensitive 2.5G and 3G handsets, PDAs and other mobile devices.
Based on an ARM926™ processing core, the OMAP331 processor
delivers multimedia functionality while maintaining power efficiency.
Software re-use and compatibility with higher end OMAP™ devices
provide manufacturers a migration path to higher performing smartphones, Internet and multimedia devices.
• 17 percent faster performance and enhanced features
over the previous generation
• Low power consumption
• Software re-use and compatibility with other OMAP™ devices
• On-chip frame buffer and 2D-graphics accelerator speeds
multimedia performance
• High-resolution imaging through OCP camera port
• Hardware-based security platform
• 802.11 capable up to 54 Mbps
• 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch
Features found in the OMAP331 processor include robust multimedia
performance, fast processing speeds, a 2D-graphics accelerator engine,
a high-throughput direct memory access interface and much more. An
on-chip frame buffer improves performance of multimedia applications
like streaming video and graphics. Enhanced, high-resolution imaging
is possible through a parallel Open Core Protocol (OCP) camera port.
The OMAP331 processor includes a hardware-based security engine
and random number generator (RNG) for transparent security algorithm
processing. Hardware accelerators are also included to address
industry security standards such as MD5/SHA1 and DES/3DES.
Emulator
Pod
Compact
FLASH
WiLink™
mWLAN
NAND
FLASH
FLASH
JTAG/
Emulation
I/F
High-Speed WLAN
a/b/g
NaviLink™
GPS
Fast
IrDA
Mobile
DDR
UART/IrDA
EMIF/CF
OMAP331
I2 C
I2C Peripheral
Keypad
Keypad
GPIO
ARM926™
LED
LPG
LED
PWT
Buzzer
Shared Memory Controller/DMA
EMT9
2D Graphic Accelerator
Voice
TCS
Modem
Chipset
Control
Data
MCSI
Timers, Interrupt Controller, RTC
UART
Frame Buffer/Internal SRAM (750 k-bit)
CMOS
Sensor
Memory Stick
MMC-SD
Memory Stick
MMC-SD
Memory Stick Card,
MMC-SD Card
Memory Stick Card,
MMC-SD Card
HDQ/1Wire
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RNG
McBSP
TSC2301
TLC320AIC23
Audio CodecAudio
Touch Screen Controller
Codec
Audio Amplifier
USB OTG
Client/Host
LCD
Controller
Liquid
Crystal
Display
Debugger
OCP Camera I/F
McBSP
SPI
GPIO
LPG
Battery
12 MHz
Clock
and
Reset Mgt.
PWL
32 kHz
Reset
LCD
Light
Controller
In/Out
Audio
Texas Instruments 2008
Wireless Handsets Solutions Guide
40
OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP1610 Processor
Key Benefits
The OMAP1610 applications processor features a dual-core architecture
based on TI’s TMS320C55x™ DSP and TI-enhanced ARM926™ cores.
Each core has processing capabilities of up to 200 MHz, resulting in
enhanced performance for processing multimedia applications, including
videoconferencing, interactive gaming, speech processing, locationbased services, video streaming and others. Manufacturers benefit from
scalability across the OMAP™ processor family and gain a path to higher
end market segments.
• Multimedia applications including videoconferencing,
interactive gaming, speech processing, m-commerce,
location-based services and others
• Supports all cellular standards
• Migration path to high-end market segments
through scalability of the OMAP™ platform
• Reduced power consumption through hardware-based
accelerators
• Secure mode of operation with wireless security hardware
• Dedicated on-chip 2D-graphics engine
• TI-enhanced ARM926™ core
• Leverages TI’s TMS320C55x™ DSP and TI-enhanced
200 MHz processing capabilities
• 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch
The high-speed DSP and ARM® engines include hardware-based
application accelerators such as a dedicated on-chip 2D-graphics engine
that eliminates the need for discrete graphic chips and multimedia
acceleration. Java™ program accelerators are also incorporated into
the OMAP1610 processor, with a hardware-based security system which
provides protection of creative content or software, guarding
confidential information and securing information transmission.
The OMAP1610 applications processor maintains standby power
consumption levels of less than 10 µA, which is among the lowest in
the industry. It supports all cellular standards and complements any
modem technology.
WiLink™
mWLAN
Emulator
Pod
Debug Messaging
Compact
FLASH
Flash
Data
Voice
NaviLink™
GPS
Fast
IrDA
Mobile
DDR
EMIF
JTAG/
Emulation
I/F
UART/IrDA
OMAP1610
Serial
BlueLink™
Bluetooth®
NAND
Flash
TMS320C55x™
DSP
UART
TCS
Modem
Chipset
Control
Data
Keypad
Keypad
GPIO
LPG
LED
LPG
LED
PWT
Buzzer
ARM926™
MCSI
EMT9
UART
Timers, Interrupt Controller, RTC
McBSP
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RNG
Debugger
CMOS
Sensor
Camera I/F
2D Graphic Accelerator
MCSI
I 2C Peripheral
GPIO
Shared Memory Controller/DMA
Voice
I2 C
Memory Stick
MMC-SD
Memory Stick
MMC-SD
HDQ/1Wire
Memory Stick Card,
MMC-SD Card
Memory Stick Card,
MMC-SD Card
Battery
12 MHz
μWire
McBSP
TSC2301
TLC320AIC23
Audio CodecAudio
Touch Screen Controller
Codec
Audio Amplifier
USB OTG
Client
Host
LCD
Controller
Liquid
Crystal
Display
Clock
and
Reset Mgt.
PWL
32 kHz
Reset
LCD
Light
Controller
In/Out
Audio
Wireless Handsets Solutions Guide
Texas Instruments 2008
OMAP™ Platform
41
High-Performance Multimedia-Rich Applications Processors
OMAP1621 Processor
Key Benefits
The OMAP1621 applications processor is a software-compatible
upgrade to the OMAP1610 processor. The OMAP1621 processor boasts
improved ARM® and DSP performance versus previous devices to meet
the increasing performance demands of multimedia-enabled handsets.
Additionally, the OMAP1621 processor adds 2 MB of internal SRAM
optimized to act as a frame buffer, enabling higher graphics and
streaming media performance. To support higher resolution cameras,
the OMAP1621 processor includes an enhanced camera port interface
bus that results in higher throughput.
• The OMAP1621 processor enjoys all the same features,
functionality and benefits of the OMAP1610 processor and more
• Increased DSP and ARM® performance
• Improved graphics and streaming media performance
• Improved support for higher resolution camera via an enhanced
camera port interface bus
• Support of all cellular standards
• WLAN-capable to speeds up to 54-Mbps data throughput with
integrated VLYNQ™ communications interface
• Scalable solution provides path to high-end market segments
• Reduced power consumption through hardware-based
accelerators
• Secure mode of operation through wireless security hardware
• 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch
The OMAP1621 processor includes several hardware-based application
accelerators that eliminate the need for discrete graphic chips and
multimedia accelerators. Java™ acceleration is also included in
the ARM with a hardware-based security system, enabling secure
e-commerce applications and the replay of copyright-protected digital
media content.
The OMAP1621 and other OMAP16xx applications processors maintain
standby power consumption levels of less than 10 µA and are among
the lowest in the industry. The processors support all cellular standards
and complement any modem technology.
Emulator
Pod
Compact
FLASH
WiLink™
mWLAN
NAND
FLASH
FLASH
Debug Messaging
JTAG/
Emulation
I/F
High-Speed WLAN
a/b/g
Data
Voice
Fast
IrDA
Mobile
DDR
UART/IrDA
EMIF/CF
OMAP1621
Serial
BlueLink™
Bluetooth®
NaviLink™
GPS
I2 C
I2C Peripheral
Keypad
Keypad
GPIO
UART
TMS320C55x™
DSP
MCSI
Shared Memory Controller/DMA
ARM926™
2D Graphic Accelerator
GPIO
LPG
LED
LPG
LED
PWT
Buzzer
EMT9
Debugger
CMOS
Sensor
Camera I/F
TCS
Modem
Chipset
Voice
Control
Data
MCSI
Timers, Interrupt Controller, RTC
UART
Frame Buffer/Internal SRAM (2 Mb)
McBSP
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RNG
μWire
McBSP
TSC2301
TLC320AIC23
Audio CodecAudio
Touch Screen Controller
Codec
Audio Amplifier
USB OTG
Client
Host
LCD
Controller
Liquid
Crystal
Display
Memory Stick
MMC-SD
Memory Stick
MMC-SD
HDQ/1Wire
Memory Stick Card,
MMC-SD Card
Memory Stick Card,
MMC-SD Card
Battery
12 MHz
Clock
and
Reset Mgt.
PWL
32 kHz
Reset
LCD
Light
Controller
In/Out
Audio
Texas Instruments 2008
Wireless Handsets Solutions Guide
42
OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP1710 Processor
Key Benefits
The OMAP1710 applications processor combines an ARM926™
processor with a TMS320C55x™ DSP core operating at 220 MHz.
Manufactured on TI’s 90-nm CMOS process technology, the
OMAP1710 processor provides up to 40 percent more performance for
a variety of applications, while consuming half the power of previous
TI applications processors in active mode.
• 90-nm CMOS process technology
• 40 percent performance improvement in a variety
of mobile applications compared to previous generations
• TMS320C55x™ DSP and ARM926 at 220 MHz
• Software re-use due to compatibility and flexibility
across other OMAP devices
• Multiple engines enable concurrent features and
service without quality degradation
• High-performance camera interface supports up to
2 megapixels
• 802.11 capable up to 54-Mbps data throughput
with integrated VLYNQ™ communications interface
• Integrated hardware and software security
• Improved multimedia and graphics
• Optimized for TI’s TCS wireless chipsets
• High-level OS support
• Broad range of applications through
OMAP Developer Network
• Development support and access to open
programming interfaces and development tools
• 12 mm x 12 mm, 289-ball MicroStar BGA™, 0.5-mm pitch
A range of software and hardware accelerators are included as part
of the OMAP1710 processor, including video encode and decode,
still picture compression, Java™ and security. TI’s advanced security
hardware provides a secure execution environment and an ideal
platform to address a range of security threats. Security-based features
include a secure bootloader, secure mode of operation, secure RAM
and ROM and various accelerators.
The OMAP1710 processor is designed to handle a variety of applications
in parallel for concurrent features and service. This unique approach
ensures that applications are not interrupted or degraded when
additional operations are launched or run simultaneously.
For manufacturers looking to increase performance and multimedia
capabilities of their product line, the OMAP1710 processor offers an
easy migration path due to software compatibility with previous
generations of OMAP™ applications processors.
Emulator
Pod
Debug Messaging
WiLink™
mWLAN
Compact
FLASH
Flash
High-Speed WLAN
JTAG/
a/b/g
Emulation
I/F
Serial
BlueLink™
Bluetooth®
Data
Voice
NAND
Flash
Mobile
DDR
EMIF
UART/IrDA
OMAP1710
TMS320C55x™
DSP
UART
Fast
IrDA
NaviLink™
GPS
Voice
Control
Data
Keypad
GPIO
LPG
LED
LPG
LED
PWT
Buzzer
ARM926™
MCSI
EMT9
Debugger
CMOS
Sensor
OCP Camera I/F
2D Graphic Accelerator
MCSI
Memory Stick
MMC-SD
Timers, Interrupt Controller, RTC
UART
HDQ/1Wire
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RNG
McBSP
μWire
I2C Peripheral
GPIO
Shared Memory Controller/DMA
TCS
Modem
Chipset
I2 C
Keypad
McBSP
TSC2301
TLC320AIC23
Audio CodecAudio
Touch Screen Controller
Codec
Audio Amplifier
USB OTG
Client
Host
LCD
Controller
Liquid
Crystal
Display
Memory Stick Card,
MMC-SD Card
Battery
12 MHz
Clock
and
Reset Mgt.
PWL
32 kHz
Reset
LCD
Light
Controller
In/Out
Audio
Wireless Handsets Solutions Guide
Texas Instruments 2008
OMAP™ Platform
43
High-Performance Multimedia-Rich Applications Processors
OMAP2420 Processor
Key Benefits
The OMAP2420 processor, software compatible with previous
OMAP™ processors, adds features for further enhancing the
“All-in-One Entertainment” features that the OMAP 2 architecture
brings to smartphones and wireless PDAs.
• Dedicated 2D/3D graphics accelerator at 2-million polygons
per second
• IVA™ accelerator enables high-resolution still image capture,
larger screen sizes and higher video frame rates
• Supports high-end features including 4+ megapixel cameras,
VGA-quality video, high-end interactive gaming functionality
and analog/digital TV video output
• 5-MB internal SRAM boosts streaming media performance
• Software compatibility with previous OMAP processors
• Parallel processing ensures no interruptions or degradation
of service with simultaneously running applications
• Optimized power management companion chip: TWL92230
• 14 mm x 14 mm, MicroStar BGA™, memory stackable package
• 12 mm x 12 mm MicroStar BGA package
The OMAP2420 processor includes the benefits of the OMAP 2
architecture’s parallel processing, giving users the ability to instantly
run applications and operate multiple functions simultaneously without
compromising quality of service. The OMAP2420 processor includes an
integrated ARM1136™ processor (330 MHz), a TI TMS320C55x™ DSP
(220 MHz), 2D/3D graphics accelerator, IVA™ imaging accelerator,
high-performance system interconnects and industry-standard peripherals.
Multimedia enhancements made in the OMAP2420 processor include
an imaging and video accelerator for higher resolution still capture
applications, multi-megapixel cameras and full-motion video encode
and decode with VGA resolution up to 30 fps. An added TV video
output supports connections to television displays for displaying
images and video captured from the handset. Streaming media
performance is boosted by 5-MB internal SRAM.
Client
Host
USB 2.0 High-Speed
Host/Peripheral/OTG
Trace
Analyzer
NaviLink™
GPS
UART/IrDA
Hollywood™
Mobile DTV
Data
TMS320C55x™
DSP
2D/3D Graphics
Accelerator
IVA™
Accelerator
McBSP
SPI
EAC AC
TSC2301TLC320AIC23
Audio CodecAudio
Touch Screen Controller
Codec
Audio Amplifier
Audio
Texas Instruments 2008
Camera I/F
Serial Parallel
HDQ/1Wire
System Interface
Power Reset Clock Mgr
MS/MMC/SD/SDIO
Controller
M-Shield™ Security Technology:
SHA-1/MD5 DES/3DES RN, AES, PKA,
Secure WDT, Keys
UART
TV
ARM11™
Internal SRAM, Boot/Secure ROM
EAC MD
Control
GPIO
Timers, Interrupt Controller, Mailbox
EAC BT
Voice
I2 C
Keypad GPIO
Shared Memory Controller/DMA
UART
Voice
SDRC
OMAP2420
High-Speed
WLAN a/b/g
BlueLink™ Data
Bluetooth®
Mobile
DDR
NAND
GPMC
JTAG/
Emulation
I/F
SPI
WiLink™
mWLAN
NAND
Flash
NOR
Trace
TCS
Modem
Chipset
NOR
FLASH
Emulator
Pod
Fast
IrDA
USB
OTG
TV Out (DAC)
Client
Host
TV
PAL/NTSC
I2C Peripheral
Keypad
GPIO
Camera
Module
Battery
TWL92230
Reset
Power
Manager
On/off
Media Card
Transceivers
Power
Regulators
I2C
Real-Time
Clock (RTC)
Display
Controller
MS/MMC/SD/SDIO
Card
MS/MMC/SD/SDIO
Card
LED
32k Hz Crystal
VGA Color QVGA Color
TFT
TFT
Display
Display
In/Out
Wireless Handsets Solutions Guide
44
OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP2430 and OMAP2431 Processors
Key Benefits
The OMAP2430 and OMAP2431 high-performance applications
processors deliver best-in-class performance to multimedia-enabled
handsets and wireless PDAs. Based on TI’s enhanced OMAP™ 2
multi-engine parallel processing architecture and high-performance,
low-leakage 90-nm CMOS process technology, the OMAP2430 and
OMAP2431 processors balance multimedia performance, flexibility,
power and cost. IVA™ 2 technology, TI’s latest-generation imaging,
video and audio accelerator (OMAP2430 only), boosts mobile video
playback performance to DVD quality. The processors also integrate an
ARM1136® RISC processor core (up to 450 MHz), dedicated 2D/3D
graphics hardware acceleration, high-speed system interconnect,
numerous peripherals, and camera, display and memory subsystems.
• Advanced IVA™ 2 accelerator boosts video performance in
mobile phones by up to 4X and imaging performance by
up to 1.5X
• Delivering a multimedia experience with consumer electronics
quality to the handset
• Multi-engine parallel processing architecture for supporting
complex usage scenarios
• Embedded M-Shield™ mobile security technology enables
value-added services and terminal security
• Support for all major HLOSs aids applications development
• Optimized power management companion chip: TWL4030
• 14 mm x 14 mm, MicroStar BGA™, memory stackable package
Multimedia features supported include:
• Downloadable media playback and digital TV decode: MPEG-4,
H.264, Windows Media® Video (VC-1), RealVideo® version 10
decode up to D1 (720 x 480) 30 fps
• Still image capture: > 5 megapixel with 1 second shot-to-shot delay
• Motion video capture: MPEG-4, H.264 encoding up to VGA 30 fps
• Video teleconferencing: H.263, H.264 videoconferencing with
simultaneous recording of VTC session up to CIF 30 fps
• 2D/3D gaming: rasterization up to 1-million polygons per second
(OMAP2430 processor only)
Fast
IrDA
NaviLink™
GPS
Hollywood™
Mobile DTV
WiLink™
mWLAN
Trace
Analyzer
Emulator
Pod
Trace
JTAG/
Emulation
I/F
UART/IrDA
I2C
The OMAP2430 and OMAP2431 processors support HLOSs, including
Linux®, Microsoft® Windows Mobile® and Symbian™. The processors’
high performance allows for the use of more highly compressed
codecs that bring spectral efficiency and cost savings. Embedded
M-Shield™ security technology enables value-added services for
content protection, transaction security and secure network access,
as well as terminal security functions such as secure flashing and
booting, terminal identity protection and network lock protection.
NOR
FLASH
NAND
Flash
Mobile
DDR
GPMC
SDRC
OMAP2430/OMAP2431
SPI
2D/3D Graphics
Accelerator
Camera
Module
Camera-Serial
Sub Camera
SDIO
IVA™ 2
Accelerator
I2C
(OMAP2430 only)
Shared Memory Controller/DMA
UART
TCS
Modem Control/Data
Chipset
Voice
McBSP
McBSP
M-Shield™ Security Technology: SHA-1/MD5,
DES/3DES, RNG, AES, PKA, Secure WDT, Keys
MS/MMC/SD/SDIO
MS/MMC/SD/SDIO
Card
Wireless Handsets Solutions Guide
High-Speed (HS)
USB2 OTG Controller
McBSP
McBSP
Battery
Charger
Power Manager
Timers, Interrupt Controller, Mailbox
McBSP
USB
TWL4030
System Interface
Power Reset
Clock Manager
Boot/Secure ROM
Flashing
GPIO
Camera I/F
Serial Parallel
ARM1136™
Coexistence
BlueLink™ Data
Bluetooth®
Voice
GPIO
TV Out (DAC)
TV
PAL/NTSC
Display
Controller
Parallel-Serial
QVGA
VGA
Color TFT Color TFT
Display
Display
Voice
Audio
Audio/Voice
Codec
On/Off
Reset
32 kHz Crystal
Audio
In/Out
HS USB
Transceiver
USB
Connector
LED
SPI
TSC2046 Touch
Screen Controller
Key Pad
Keypad
Battery
Texas Instruments 2008
OMAP™ Platform
45
High-Performance Multimedia-Rich Applications Processors
OMAP™ 3 Applications Processors
The OMAP™ 3 family of multimedia applications processors introduces
a new level of performance that enables laptop-like productivity
and advanced entertainment in multimedia-enabled handsets. For
manufacturers designing multimedia–enabled handsets, the OMAP 3
family offers a range of high-level performance and productivity
capabilites. TI’s OMAP 3 family of applications processors integrates
the ARM® Cortex™-A8 superscalar microprocessor core, delivering up
to 3X gain in performance over ARM11-based processors. These new
processors leverage industry-leading technologies to extend mobile
phone battery life together with the performance needed for laptopcomparable productivity software and an audio/video experience
equivalent to that of consumer electronics devices.
The OMAP 3 applications processors are the industry’s first to be
designed in a 65-nm CMOS process technology, reflecting TI’s
commitment to providing advanced silicon technology that drives a
revolution in mobile communications. The device can operate at a
higher frequency than previous generation OMAP processors, increasing
its clock speed over the OMAP 2 platform, while lowering the core
voltage and adding power reduction features to help prolong battery
life. Multimedia applications benefit from faster, higher-quality image
capture and processing for cameras, exceptional audio/video
performance, enhanced support for external displays and high-speed
connectivity interfaces. Compatible with a wide range of modems,
the OMAP 3 family helps manufacturers develop compelling new
mobile applications that will revolutionize handheld communications
in both work and play.
The OMAP 3 family of applications processors integrates the most
advanced and effective power management techniques in the market.
The chips make extensive use of TI’s SmartReflex™ technologies,
Texas Instruments 2008
Key Features and Benefits
• Proven OMAP™ 3 architecture combines mobile entertainment
with high performance productivity applications to meet the
needs of all multimedia-enabled handsets
• Advanced superscalar ARM® Cortex™-A8 RISC core
• 65-nm CMOS process technology adds processing performance
while reducing power consumption
• Seamless connectivity to Hard Disk Drive (HDD) devices for
mass storage
• Leverages SmartReflex™ technologies for advanced power
reduction and performance enhancement
• M-Shield™ mobile security enhanced with ARM TrustZone™
support
• Software-compatible with OMAP 2 and OMAP 3 processors
• HLOS support for customizable interface
• Optimized power management companion chip: TWL5030
which include a broad range of intelligent and adaptive hardware and
software techniques that dynamically control voltage, frequency and
power based on device activity, modes of operation and temperature.
The OMAP 3 processors support HLOSs including Linux®, Microsoft®
Windows Mobile® and Symbian™. Built-in M-Shield™ security
technology enables value-added services for content protection,
transaction security and secure network access, plus terminal security
functions such as secure flashing and booting, terminal identity
protection and network lock protection. Enhanced with ARM
TrustZone™ support, OMAP 3 security is based on open APIs, providing
an environment for secure applications that deliver robust performance
and interoperability.
Wireless Handsets Solutions Guide
46
OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP3440 Processor
Key Features and Benefits
Pushing mobile multimedia boundaries, TI introduces the OMAP3440
processor, the newest addition to the OMAP™ 3 platform. The
OMAP3440 processor offers increased performance and advanced
multimedia benefits targeting applications that require high
performance, such as the mobile Internet device (MID) market. TI’s
new OMAP3440 processor is the industry’s first applications processor
to bring full HD camcorder functionality to mobile devices, giving users
the ability to record high-definition (HD) video, as well as enjoy new
applications enabled by the large displays in the latest Smartphones
and Mobile Internet Devices (MIDs). The OMAP3440 processor
leverages TI’s high performance IVA™ 2+ multimedia accelerator to
support 720p HD video record and playback, unleashing user creativity
behind the lens. Additionally, at the heart of the OMAP3440 processor
is a PowerVR SGX 2D/3D graphics hardware accelerator that supports
OpenGL® ES and OpenVG® and provides outstanding graphic and
gaming capabilities.
• 65-nm CMOS process technology adds processing performance
• IVA™ 2+ (Image Video Audio) accelerator enables multi-standard
encode/decode at D1 30 fps
• Integrated image signal processor (ISP) for faster, higher-quality
image capture and lower system cost
• Flexible system support
– Composite and S-video TV output
– XGA, 16 M-color display support
– Flatlink™ 3G-compliant serial display and parallel display
support
– High Speed USB 2.0 On-The-Go support
• Seamless connectivity to Hard Disk Drive (HDD) devices for
mass storage
• Leverages SmartReflex™ technologies for advanced power
reduction
• M-Shield™ mobile security enhanced with ARM TrustZone™
support
• Software-compatible with OMAP™ 2 processors
• HLOS support for customizable interface
Productivity. Like the rest of the OMAP 3 product family, the OMAP3440
processor integrates the ARM Cortex-A8 superscalar microprocessor
core, which provides 800 MHz of performance to enhance applications
that take advantage of the larger displays used in MIDs. Combined
with TI’s technology in the OMAP3440 processor, the ARM Cortex-A8
enables faster user interfaces, faster data access and boosts
productivity and entertainment applications on the mobile phone,
while maintaining power efficiencies expected in a handset.
Fast
IrDA
NaviLink™
GPS
Hollywood™
Mobile DTV
WiLink™
mWLAN
Trace
Analyzer
Emulator
Pod
Trace
JTAG/
Emulation
I/F
UART/IrDA
NOR
FLASH
NAND
Flash
Mobile
DDR
GPMC
SDRC
OMAP3440
I 2C
SPI
ARM®
Cortex™-A8
IVA™ 2+
Accelerator
SDIO
2D/3D Graphics
Accelerator
Image Signal
Processor (ISP)
Shared Memory Controller/DMA
Coexistence
BlueLink™ Data
Bluetooth®
Voice
UART
GPIO
Camera I/F
Serial-Parallel
Camera
Module
Camera-Serial
Sub Camera
I2C
TCS
Modem Control/Data
Chipset
Voice
McBSP
McBSP
M-Shield™ Security Technology: SHA-1/MD5,
DES/3DES, RNG, AES, PKA, Secure WDT, Keys
MS/MMC/SD/SDIO
MS/MMC/SD/SDIO
Card
Wireless Handsets Solutions Guide
High-Speed (HS)
USB 2 OTG Controller
McBSP
McBSP
Battery
Charger
Power Manager
Timers, Interrupt Controller, Mailbox
McBSP
USB
TWL5030
System Interface
Power Reset
Clock Manager
Boot/Secure ROM
Flashing
GPIO
Video DAC
S-Video
TV
PAL/NTSC
Display
Controller
Parallel-Serial
QVGA
XGA
Color TFT Color TFT
Display
Display
Voice
Audio
Audio/Voice
Codec
On/Off
Reset
32 kHz Crystal
Audio
In/Out
HS USB
Transceiver
USB
Connector
LED
SPI
TSC2046 Touch
Screen Controller
Key Pad
Keypad
Battery
Texas Instruments 2008
OMAP™ Platform
47
High-Performance Multimedia-Rich Applications Processors
OMAP3430 Processor
Key Features and Benefits
The OMAP3430 applications processor with the ARM® Cortex™-A8
core delivers up to 3X the performance of ARM11-based processors,
enabling laptop-like productivity and advanced entertainment in 3G
handsets. The industry’s first applications processor to be designed in
a 65-nm CMOS process, the OMAP3430 combines the optimal mix of
advanced technology and innovation to provide the most advanced
applications processor in the market. Designed in a 65-nm CMOS
process, the OMAP3430 operates at a higher frequency than previous
generation OMAP processors, while lowering the core voltage and
adding power reduction features.
• Industry’s first processor with advanced superscalar ARM®
Cortex™-A8 RISC core, enabling 3X gain in performance
• Industry’s first processor designed in 65-nm CMOS process
technology adds processing performance
• IVA™ 2+ accelerator enables multi-standard (MPEG-4, WMV9,
RealVideo®, H.263, H.264) encode/decode at D1 (720 x 480 pixels)
30 fps and MPEG-4 decode at 720p (1280 x 720 pixels) 30 fps
• Integrated image signal processor (ISP) for faster, higher-quality
image capture and lower system cost
• Flexible system support
– Composite and S-video TV output
– XGA (1024 x 768 pixels), 16 M-color (24-bit definition)
display support
– Flatlink™ 3G-compliant serial display and parallel display support
– High-speed USB 2.0 OTG support
• Seamless connectivity to HDD devices for mass storage
• SmartReflex™ technologies for advanced power reduction
• M-Shield™ mobile security enhanced with ARM TrustZone™
support
• Software-compatible with OMAP™ 2 and OMAP 3 processors
• HLOS support for customizable interface
• Optimized power management companion chip: TWL5030
IVA™ 2+ accelerator, a second-generation, power-optimized version
of TI’s imaging, video and audio accelerator used in TI’s DaVinci™,
technology, provides up to 4X performance improvement in multimedia
processing versus previous OMAP processors. The increased
capabilities of the IVA 2+ accelerator enables multi-standard (MPEG-4,
H.264, Windows® Media Video®, RealVideo®, etc.) encode and decode
at DVD resolutions and 720p capability for video decode. With the
advanced multimedia capabilities, a multi-standard DVD-quality
camcorder can be added to a phone for the first time. In addition, the
ARM’s vector floating-point acceleration, coupled with the OMAP3430
processors dedicated PowerVR SGX 2D/3D graphics hardware
accelerator, supporting OpenGL® ES and OpenVG®, provides outstanding
graphic and gaming capabilities.
System features include an integrated image signal processor, support
for parallel and serial displays and cameras, composite and S-video TV
output, high-speed USB 2.0 OTG support and much more.
Fast
IrDA
NaviLink™
GPS
Hollywood™
Mobile DTV
WiLink™
mWLAN
Trace
Analyzer
Emulator
Pod
Trace
JTAG/
Emulation
I/F
UART/IrDA
NOR
FLASH
NAND
Flash
Mobile
DDR
GPMC
SDRC
OMAP3430
I2C
SPI
ARM®
Cortex™-A8
IVA™ 2+
Accelerator
SDIO
2D/3D Graphics
Accelerator
Image Signal
Processor (ISP)
Shared Memory Controller/DMA
Coexistence
BlueLink™ Data
Bluetooth®
Voice
UART
GPIO
Camera
Module
Camera-Serial
Sub Camera
I2C
TCS
Modem Control/Data
Chipset
Voice
McBSP
McBSP
M-Shield™ Security Technology: SHA-1/MD5,
DES/3DES, RNG, AES, PKA, Secure WDT, Keys
MS/MMC/SD/SDIO
MS/MMC/SD/SDIO
Card
Texas Instruments 2008
High-Speed (HS)
USB 2 OTG Controller
McBSP
McBSP
Battery
Charger
Power Manager
Timers, Interrupt Controller, Mailbox
McBSP
USB
TWL5030
System Interface
Power Reset
Clock Manager
Boot/Secure ROM
Flashing
GPIO
Camera I/F
Serial-Parallel
Video DAC
S-Video
TV
PAL/NTSC
Display
Controller
Parallel-Serial
QVGA
XGA
Color TFT Color TFT
Display
Display
Voice
Audio
Audio/Voice
Codec
On/Off
Reset
32 kHz Crystal
Audio
In/Out
HS USB
Transceiver
USB
Connector
LED
SPI
TSC2046 Touch
Screen Controller
Key Pad
Keypad
Battery
Wireless Handsets Solutions Guide
48
OMAP™ Platform
High-Performance Multimedia-Rich Applications Processors
OMAP3420 Processor
Key Features and Benefits
The OMAP3420 processor is designed to provide the right mix of
performance and cost to meet the needs of the mid-tier multimedia
enabled handsets market. The OMAP3420 processor is designed in
a 65-nm CMOS process to allow a higher operating frequency while
lowering core voltage and power consumption. The ARM® Cortex™-A8
superscalar microprocessor core provides exceptional performance
to deliver laptop-like productivity and entertainment at a price point
for the advanced multimedia-enabled handsets market.
• Advanced superscalar ARM® Cortex™-A8 RISC core
• 65-nm CMOS process technology adds processing performance
while reducing power consumption
• IVA™ 2 accelerator enables VGA resolution video playback for
multiple video standards
• Integrated image signal processor (ISP) for faster, higher-quality
image capture and lower system cost
• Flexible system support
– Composite and S-video TV output
– VGA (640 x 480 pixels), 16-M color (24-bit definition) display
support
– Flatlink™ 3G-compliant serial display and parallel display
support
– High-speed USB 2.0 OTG support
• Seamless connectivity to HDD devices for mass storage
• SmartReflex™ technologies for advanced power reduction
and performance enhancement
• M-Shield™ mobile security enhanced with ARM TrustZone™
support
• Software-compatible with OMAP™ 2 and OMAP 3 processors
• HLOS support for customizable interface
• Optimized power management companion chip: TWL5030
The IVA™ 2 imaging, video and audio accelerator in the OMAP3420
processor enables VGA quality video camcorder and playback for
multiple standards, including MPEG-4, H.264, Windows Media Video
processor and RealVideo®. The OMAP3420 device includes a PowerVR
SGX 2D/3D graphics hardware accelerator to provide high quality,
OpenGL® ES and OpenVG® graphic and gaming capabilities.
Additional system features include an image signal processor which
allows up to 5-megapixel still image capture, as well as support for
parallel and serial displays and cameras, composite and S-Video TV
output, high-speed USB 2.0 OTG support and seamless hard disk drive
(HDD) interfaces. In addition, the OMAP3420 processor is software
compatible with all OMAP 2 and OMAP 3 processors, allowing a fully
software scalable solution.
Fast
IrDA
NaviLink™
GPS
Hollywood™
Mobile DTV
WiLink™
mWLAN
Trace
Analyzer
Emulator
Pod
Trace
JTAG/
Emulation
I/F
UART/IrDA
NOR
FLASH
NAND
Flash
Mobile
DDR
SDRC
GPMC
OMAP3420
I2C
SPI
ARM®
Cortex™-A8
IVA™ 2+
Accelerator
SDIO
2D/3D Graphics
Accelerator
Image Signal
Processor (ISP)
Shared Memory Controller/DMA
Coexistence
BlueLink™ Data
Bluetooth®
Voice
UART
GPIO
Camera
Module
Camera-Serial
Sub Camera
I2C
TCS
Modem Control/Data
Chipset
Voice
McBSP
McBSP
M-Shield™ Security Technology: SHA-1/MD5,
DES/3DES, RNG, AES, PKA, Secure WDT, Keys
MS/MMC/SD/SDIO
MS/MMC/SD/SDIO
Card
Wireless Handsets Solutions Guide
High-Speed (HS)
USB2 OTG Controller
McBSP
McBSP
On/Off
Battery
Charger
Reset
Power Manager
Timers, Interrupt Controller, Mailbox
McBSP
USB
TWL5030
System Interface
Power Reset
Clock Manager
Boot/Secure ROM
Flashing
GPIO
Camera I/F
Serial-Parallel
Video DAC
S-Video
TV
PAL/NTSC
Display
Controller
Parallel-Serial
QVGA
VGA
Color TFT Color TFT
Display
Display
Voice
Audio
Audio/Voice
Codec
32 kHz Crystal
Audio
In/Out
HS USB
Transceiver
USB
Connector
LED
SPI
TSC2046 Touch
Screen Controller
Key Pad
Keypad
Battery
Texas Instruments 2008
OMAP™ Platform
49
High-Performance Multimedia-Rich Applications Processors
OMAP3410 Processor
Key Features and Benefits
The OMAP3410 processor is designed to meet the needs of the basic
multimedia enabled handsets market, which includes CIF quality video
capture and playback for multiple standards (MPEG-4, Window®
Media Video® 9, RealVideo®, H.264), up to 3-megapixel still image
capture, music playback and 3D gaming. The lowest cost member of
the OMAP™ 3 family, the OMAP3410 processor shares many of the
technologies that are present in the OMAP3430 and OMAP3420
devices, including a 65-nm CMOS process, the ARM® Cortex™-A8
superscalar microprocessor core as well as IVA™ 2 imaging, video
and audio accelerator, for a rich multimedia experience and targeted
general purpose processing. In addition, the OMAP3410 processor is
software compatible with all OMAP 2 and OMAP 3 processors,
allowing a fully software scalable solution.
Fast
IrDA
NaviLink™
GPS
Hollywood™
Mobile DTV
WiLink™
mWLAN
Trace
Analyzer
Emulator
Pod
Trace
JTAG/
Emulation
I/F
UART/IrDA
I2C
SPI
• Advanced superscalar ARM Cortex-A8 RISC core
• 65-nm CMOS process technology adds processing performance
while reducing power consumption
• IVA™ 2 accelerator enables CIF resolution video playback for
multiple video standards
• Seamless connectivity to HDD devices for mass storage
• SmartReflex™ technologies for advanced power reduction
and performance enhancements
• M-Shield™ mobile security enhanced with ARM TrustZone™
support
• Software-compatible with OMAP™ 2 and other OMAP 3
processors
• HLOS support for customizable interface
• Optimized power management companion chip: TWL5030
NOR
FLASH
NAND
Flash
Mobile
DDR
GPMC
SDRC
OMAP3410
ARM®
Cortex™-A8
Camera-Serial
Sub Camera
I2C
SDIO
Coexistence
UART
TCS
Modem Control/Data
Chipset
Voice
McBSP
McBSP
Texas Instruments 2008
M-Shield™ Security Technology: SHA-1/MD5,
DES/3DES, RNG, AES, PKA, Secure WDT, Keys
High-Speed (HS)
USB2 OTG Controller
McBSP
McBSP
Battery
Charger
Power Manager
Timers, Interrupt Controller, Mailbox
McBSP
USB
TWL5030
System Interface
Power Reset
Clock Manager
Boot/Secure ROM
Flashing
GPIO
Camera
Module
IVA™ 2
Accelerator
Shared Memory Controller/DMA
BlueLink™ Data
Bluetooth®
Voice
GPIO
Camera I/F
Serial-Parallel
MS/MMC/SD/SDIO
Display
Controller
Parallel-Serial
MS/MMC/SD/SDIO
Card
QCIF
QVGA
Color TFT Color TFT
Display
Display
Voice
Audio
Audio/Voice
Codec
On/Off
Reset
32 kHz Crystal
Audio
In/Out
HS USB
Transceiver
USB
Connector
LED
SPI
TSC2046 Touch
Screen Controller
Key Pad
Keypad
Battery
Wireless Handsets Solutions Guide
50
OMAP™ Platform
OMAP Platform Resources
Operating Systems Optimized for the OMAP™ Platform
Through close collaboration with OS providers and key third parties,
TI provides robust development packages for the OMAP™ platform
that support all wireless communications standards and the most
widely used high-level programming languages. Complete reference
designs, board support packages (BSP) and reference software
packages provide everything needed to get started with the OMAP
platform, including integrated development environments, driver
support, accelerated DSP software, JTAG emulators and more
depending on the selected OS. TI’s OMAP 2 and OMAP 3 platforms
include innovative power management and hardware acceleration for
multimedia codecs and graphics which provide a richer multimedia
experience with leading enterprise and entertainment applications.
These platform capabilities and tools, in addition to applications and
support available through the OMAP Developer Network and
OMAP Technology Centers (OTCs), enable developers to create and
optimize real-time execution of applications that leverage the processing
power and low power consumption of the OMAP platform.
Symbian OS™
Developing with the Symbian OS and the OMAP platform gives
developers an open, easy-to-develop software environment with
access to DSP-based hardware acceleration through a high-level API.
TI is a Symbian Platinum Partner and offers full support for Symbian
OS v8 and v9 ports. TI is also qualified to support S60 Software
Platform and has access to S60 APIs giving TI’s hardware platform
a higher level of integration with S60 Software Platform. Software
libraries from TI and the OMAP Developer Network provide
manufacturers with innovative software applications to further
differentiate devices. Also supported is UIQ, a user interface platform
for Symbian OS, especially designed for media rich mobile phones.
These user interface platforms are designed to offer easy access to
the wide variety of data services for networks supporting 2.5G, 3G
and beyond.
Linux®
A full board support package for Linux helps software developers get
started quickly with the performance and power efficiency of the
OMAP platform. The open source BSP includes the basics plus a set
of advanced and fully tested tools to accelerate development. This
BSP includes GNU Linux OS, source-level debugging tools, Linux trace
tools, language tools including C, C++ and Java™. Commercial support
is available from MontaVista, for both their MontaVista CEE 3.x and
Mobilinux 4.x products, Wind River also is offering commercial grade
Linux on the OMAP platform. These offerings include the Linux kernel,
software updates, utilities, development tools and technical support.
Additionally, there are partners including Trolltech and Access that
offer complete user interface (UI) and application platforms on the
OMAP platform with Linux.
Java™
TI, Sun Microsystems and other Java™ leaders have created a
complete Java solution and development environment for TI’s
wireless chipsets and the OMAP™ platform. Through Java virtual
machines (VMs) companies like Aplix, Esmertec and TAO Group
combine enhanced Java applications and services with TI’s TCS
wireless chipsets, OMAP-Vox™ chipsets and OMAP processors.
Enhanced Java features include MIDP and CDLC, which provide a
complete J2ME™ (Java 2 Micro Edition) application runtime
environment. TI’s OMAP platform supports Mobile Media APIs
(JSR-135), MPEG-4, MP3, MIDI and other MIME types.
Microsoft® Windows Mobile®
Collaboration with Microsoft has enabled TI to design optimized
solutions that get manufacturers to market fast. Windows Mobile
software is certified for OMAP processors, and TI will continue to
support further OS versions. TI offers DSP hardware accelerated
Windows Media in certain OMAP platforms. Platform reference
designs with software packages and BSPs for Microsoft Windows
Mobile-based devices on Pocket PC, Pocket PC Phone Edition, and
Microsoft Smartphone are included. A full range of easy-to-use
software development tools is also available through the OMAP
Developer Network and Microsoft’s mobile2market programs.
Wireless Handsets Solutions Guide
Texas Instruments 2008
OMAP™ Platform
51
OMAP Platform Resources
Wireless Applications Center
The Wireless Applications Center helps handset makers to see a
variety of solutions for cellular, Wireless LAN and Bluetooth® wireless
technology. Manufacturers use the applications center to gain firsthand
experience with new wireless software programs and services on the
market and under development from TI’s OMAP™ Developer Network.
Current locations include Dallas, Bangalore, Taipei and Nice.
Within each center are targeted areas to meet customer needs,
including a wireless demo area to see actual solutions in use. The
OMAP Developer Network Support Lab provides extensive support
tools and programs to assist design from the beginning of development
Texas Instruments 2008
through to customer demonstrations and volume manufacturing.
Additionally, several advanced test systems facilitate thorough and
rapid testing of new systems and subsystems.
Other offerings of the center include an application benchmarking
program to compare OMAP technology performance numbers with
those of competitive platforms; a device loan and support program
that gives customers access to tools and devices for development
and demonstrations at tradeshows and customer meetings; and a
website database where demos are accessible online.
Wireless Handsets Solutions Guide
52
OMAP™ Platform
OMAP Platform Resources
Application Suite Ecosystem
Broadening its commitment to accelerate wireless development in
high-growth markets worldwide, TI is working with leading application
software providers to offer a scalable, integrated application suite for
affordable feature phones. Partner application suites are integrated
onto TI’s LoCosto™ single-chip mobile phone solution and OMAP-Vox™
product family for a highly customizable application solution that
greatly reduces the overall handset development cycle. Working with
market-leading solutions including Motorola AJAR, OpenPlug’s ELIPS
and SKY MobileMedia’s SKY-MAP™, TI gives its customers the
flexibility to select an application suite that can be easily adapted
to the unique needs of handsets and specific operator and consumer
requirements.
Key Benefits
• All partner application suites available on TI’s LoCosto and
OMAPV1030 platforms
• Accelerated porting on OMAPV1035 solution
• Committed and aligned roadmap with all partners for
future TI products
• Ongoing commercial products development with several
application suites for second and third quarter 2008 shipments
Porting, validating and integrating software requires significant
monetary and time investment. Working with an ecosystem of
application software providers, TI handset customers have the
flexibility to choose a pre-integrated solution, simplifying the
development process. With the technical integration work complete,
handset manufacturers reduce time to market by approximately six
months, opening doors to quickly deliver new phone models, particularly for high-growth markets. A common TI software foundation built
with open industry standard application programming interfaces (APIs)
allows for software re-use and easy consistent migration across TI’s
roadmap of LoCosto solutions and OMAP-Vox platforms.
TI is committed to delivering solutions for emerging markets as they
require increasingly advanced technologies. TI and its applications
suite partners make efficient use of system resources and promote
seamless interaction between applications. These integrated offerings
reduce time to market, allowing mobile device manufacturers to
introduce new differentiated models faster and reduce costs.
Enabling Innovation in Multimedia Communications
Wireless Handsets Solutions Guide
Texas Instruments 2008
The OMAP™ Gaming Development Platform allows developers and
publishers to create a portfolio of mobile games with significantly
reduced time and monetary investments. With this gaming platform
based on Ideaworks3D’s Airplay™ and TI’s OMAP platform, developers
will be able to create games targeting a broad range of mobile
handsets. Developers will be able to create the majority of a game
before new handsets are available on the market, enabling prompt
availability of games on new mobile phones as they enter the market.
53
OMAP Platform Resources
OMAP™ Gaming Development Platform
OMAP™ Platform
Key Features
• Complete hardware and software package to enable developers
to optimize performance-, timing- and memory-related design
factors early in the game development process
• Based on the OMAP2430 processor and OMAP-Vox™ platform
with Ideaworks3D Airplay™ software
• Increases the target market for a game by increasing
the footprint
• Reduces mobile gaming fragmentation and developers costs
• Offers a complete single-game developer package enabling
3D development across multiple operating systems
The combined solution from TI and Ideaworks3D changes the current
mobile gaming development process by allowing developers to create
one game which runs on leading open operating systems (OSs),
including Symbian OS™, Linux® and Microsoft® Windows Mobile®.
As part of this effort, Ideaworks3D will optimize and integrate its
industry leading Airplay game software development kit (SDK) for
TI’s OMAP2430 and OMAP-Vox™ processors, which benefits
TI’s extensive OMAP ecosystem of leading game publishers and
developers, serving handset manufacturers and mobile operators
worldwide.
TI’s OMAP processor-based mobile gaming platform is a complete
hardware and software package that will enable developers to
optimize performance-, timing- and memory-related design factors
early in the game development process.
TI’s OMAP platform integrates advanced 3D graphics hardware
acceleration enabling mobile game developers to extract new levels
of performance and enhance the game-play experience. The new
OMAP Gaming Platform with Ideaworks3D allows developers to take
full advantage of the powerful 3D graphics capabilities of the OMAP
architectures for popular mobile operating systems.
TI’s mobile gaming website provides additional resources for
developers, handset manufacturers and operators. The site contains
information on all of TI’s mobile gaming developments and includes
downloadable SDK and tools, and market and standards information.
Visit www.ti.com/omapgaming to learn more about how TI is changing
the mobile gaming market.
Texas Instruments 2008
Wireless Handsets Solutions Guide
54
OMAP™ Platform
OMAP Platform Resources
OMAP Developer Network
Member Benefits/Product Exposure
Since 2000, TI’s OMAP™ Developer Network has provided innovative
applications, services and multimedia modules for TI’s OMAP
processors, OMAP-Vox™ cellular modem solutions and non-cellular
wireless technologies including WLAN, Bluetooth® and GPS.
Consisting of an extensive range of third party software developers
and hardware manufacturers, the optimized OMAP software and
algorithms deliver the latest, most compelling applications for
handsets in 2.5G and 3G and beyond.
As a member of the OMAP Developer Network, once your application,
service or reference design is available within TI Wireless Application
Centers (WACs), TI has the opportunity to expose your product to a
range of leading wireless OEMs and ODMs in the market. Prospective
customers will be exposed to developer product information through
a variety of marketing opportunities including:
TI Ecosystem seeks to engage key applications, service areas and
key players in the market to bring the richness of the solution onto
our platforms.
OMAP Developer Network members are continuously building new
multimedia-rich applications and services on the entire TI wireless
portfolio to enable product differentiation, quick time to market and
fast return on investment.
Just a few of the applications available through the OMAP Developer
Network include streaming media, HD multimedia, speech recognition,
3D console quality gaming, Java™ virtual machines, high-end audio,
image and video stabilization, videoconferencing, location-based
services and security. TI works with the industry’s most innovative
developers, including Access, Aricent, Beatnik, Discretix, Droplet,
HI Corp, Ideaworks3D, Ingenient, Motorola TTPCom, Movial, NXP
Software, Nexstreaming, Open-Plug, PacketVideo, SRS Labs, Sasken,
SKY MobileMedia, TAT, Trolltech, Trusted Logic, and hundreds more.
• OMAP Developer Network online catalog
• TI OMAP Developer Network collateral used by TI Business
Development and Marketing
• Wireless ACCESS e-newsletter
• Website promotions
• Online demos (internal)
• Customer showcase events
Network members may have their application demos selected for
use in one or more of TI’s regional Wireless Applications Centers for
direct exposure to TI customers. Members may also be invited to
participate at select tradeshows using TI booth properties and exhibit
space. Members may be included in OEM/ODM proposals and
requests for quotation to complement TI’s products.
For more information visit www.ti.com/omapdevnet
Training
Various online and live workshop training opportunities are available
for software development, DSP algorithm development, development
tools and other subjects. TI also periodically holds targeted training
and interaction sessions on key topics such as graphics, multimedia
and security. As an OMAP Developer Network member, you will have
access to dedicated support resources within TI to assist you in
developing your applications and services successfully and ensuring
that they are optimized to the underlying TI platform.
Developer Catalog
TI’s online OMAP Developer Network catalog serves as an important
place to assist TI customers in identifying solutions offered by
Developer Network members. Application descriptions and services are
provided for additional information to aid in selecting an application
mix or to seek engineering assistance in a particular application area.
Wireless Handsets Solutions Guide
Texas Instruments 2008
Wireless manufacturers are seeking expert support for emerging
technologies and specialized techniques that are continually evolving.
While TI is the world leader in wireless expertise, the skills and
time-to-market requirements of manufacturers in the wireless industry
today are tremendously divergent. Manufacturers must consider
communications protocols, baseband processors and other wireless
design technologies, in addition to other requirements like security,
HLOSs, multimedia coders/decoders (codecs), consumer applications
and services, interactive gaming, location-based services, WLAN
(802.11), and Bluetooth® wireless technology.
To further streamline the development process, TI offers support
and service through its worldwide OMAP Technology Centers (OTCs).
Manufacturers may use OTCs to leverage leading expertise in
hardware design, embedded software development, HLOS support
and system integration. It’s possible to assemble a team of world
class experts locally for your project using OTCs.
TI’s global network of OTCs provides the diverse expertise that
wireless manufacturers need locally:
•
•
•
•
•
•
•
•
•
•
•
Systems integration
Full turnkey design (hardware and software)
Wireless systems architecture
Embedded software development
– Device drivers
– OS baseport development
– OS optimization
– Middleware
– Applications
Hardware design
RF and antenna design
Communication protocols and telephony
GSM/GPRS, EDGE, WCDMA protocols
WLAN 802.11x, Bluetooth® wireless technology
Multimedia codec development
ARM® and DSP algorithm development
55
OMAP Platform Resources
OMAP™ Technology Centers
OMAP™ Platform
OTCs are valued members of TI’s wireless offering with proven track
records. As wireless designs become more integrated and complex,
TI and its OTCs are working to ensure that manufacturers receive the
support and solutions they need to capitalize on the rapidly changing
wireless market in the locale they want it. When you plan your next
product development, consider the benefits of partnering with TI and
an OTC for support.
www.ti.com/otc
Symbian™ OS
Elektrobit
Fujitsu Broad Solution & Consulting
Hampex
Intrinsyc
MPC Data Limited
Sasken
SysOpen Digia
TapRoot Systems
Teleca
Wipro
Linux®
Elekrobit
Intrinsyc
Sasken
SysOpen Digia
TapRoot System
Teleca
Wipro
Microsoft® Windows Mobile®
BSQUARE
Fujitsu Broad Solution & Consulting
Intrinsyc
MPC Data Limited
Sasken
Teleca
TapRoot System
Wipro
Nucleus™
Elektrobit
Intrinsyc
MPC Data Limited
Sasken
SysOpen Digia
Wipro
Texas Instruments 2008
Wireless Handsets Solutions Guide
56
OMAP™ Platform
OMAP 2 and OMAP 3 Platform Resources
OMAP™ Software Development Tools
From early development to final optimization, TI and partners provide a
complete line of products that enable effective, efficient development
for architectures based on the OMAP™ platform. Even before silicon is
available, models allow you to simulate the device. Then, when
silicon is ready, development platforms aid you in coding and debugging
performance-critical applications.
TI’s highly optimized Code Composer Studio™ integrated development
environment (IDE) provides best-in-class support for development of
DSP-based codecs and multimedia functions. TI also includes ARM®
compilers with industry-standard ABI support that deliver fast, compact
executable files. For debugging, TI’s XDS-560 emulator allows you to
take advantage of the emulation capabilities designed into OMAP
processors. Finally, our innovative visualization and optimization tools
help you to achieve the greatest performance possible with your design.
OMAP2430 and OMAP3430 Software Development Platforms
(SDP)
The OMAP2430 and OMAP3430 SDPs offer an easy,
cost-effective way to develop, evaluate and test software for
next-generation advanced smartphones and converged portable
multimedia devices based on the OMAP™ 2 and OMAP™ 3
architectures. The SDPs provide a full range of software,
services and support, including board support packages for
access to HLOSs such as Symbian™, Linux® and Microsoft®
Windows Mobile®. Throughout development, designers have
flexible tools for developing all aspects of the system, including
peripheral drivers. Visibility into each software component
streamlines the debug process considerably. Tools for
debugging mobile connectivity capabilities such as Bluetooth®
or wireless LAN are also included.
Complementary tool solutions are also available from TI’s many
partners. Close support from the emulation developer community
helps third parties to develop their products early and effectively.
For example, companies such as Lauterbach and Sophia Systems
provide powerful products for OMAP devices.
The comprehensive toolset for OMAP developers gives TI customers
significant options to help system integrators solve the functional
requirements, performance goals and power constraints they face when
developing wireless handsets.
Analyze
and Tune
Application
Design
Integrate
Algorithm
Design
Partner
Code and
Build
Simulate
Debug
Model and
Evaluate
TI’s SDPs save time to market by providing all the hardware and
software needed for cost-effective development of OMAP 2 and
OMAP 3 processor-based systems.
TI tools and partner solutions provide a full circle of support for
developers of handheld products based on OMAP processors.
Wireless Handsets Solutions Guide
Texas Instruments 2008
Overview
802.11/WLAN – Innovative performance levels in hardware,
To Know More
Mobile Connectivity Solutions featured in this issue:
BlueLink™ 7.0 Bluetooth® and FM Solution
58
BlueLink 6.0 Bluetooth and FM Solution
59
BlueLink 5.0 Bluetooth Solution
60
BRF6150 Bluetooth Solution
61
WiLink™ 6.0 WLAN, Bluetooth and FM Platforms
62
WiLink 5.0 WLAN Platform
63
WiLink 4.0 WLAN Platform
64
WLAN and Bluetooth Coexistence
65
NaviLink™ 6.0 GPS Solution
66
NaviLink 5.0 GPS Solution
67
NaviLink 4.0 GPS Solution
68
Hollywood™ Mobile DTV Solution
69
Multi-Radio Connectivity Devices
TI offers leading multi-radio single-chip solutions for Bluetooth®
technology, mobile WLAN, GPS, FM radio and mobile digital TV using
TI’s DRP™ technology and 65-nm process technology. TI combines
Bluetooth®, FM (receive and transmit) and WLAN on the same chip
by coupling its proven connectivity technologies with high-level
integration expertise. TI’s mobile connectivity solutions are tightly
integrated with TI’s cellular modem solutions, OMAP™ processors
and OMAP-Vox™ solutions so manufacturers can get products to
market quickly.
GPS – TI addresses GPS with a highly integrated single-chip solution
that interfaces with TI’s wireless chipsets and delivers precision
location capabilities to markets ranging from voice-centric handsets to
highend multimedia smartphones. TI’s NaviLink™ 4.0 and NaviLink™
5.0 single-chip solutions are optimized for mobile phones. Through DRP
technology, TI is able to provide the smallest size and lowest cost
GPS discrete solution with low power and highperformance to mobile
phone manufacturers.
Bluetooth® Wireless Technology – Leveraging its innovative DRP
technology, TI’s single-chip Bluetooth wireless solutions integrate an
RF and Bluetooth processor that is optimized to mix with
cellular technology. TI’s single-chip Bluetooth solutions deliver high
performance with low power and lower system cost, enabling
manufacturers to provide optimized Bluetooth wireless personal area
networking (WPAN) connectivity to mobile devices. TI integrates into
one chip, the industry’s best performing Bluetooth with high-fidelity
FM stereo receive and transmit, with power optimization and ultra
low power (ULP) enabled.
Texas Instruments 2008
57
Mobile Connectivity Solutions
firmware and driver, TI brings to the industry low power and small
size solution with interoperability across mobile standards. TI also
offers support for Voice over WLAN (VoWLAN) and brings embedded
and battery powered applications a new level of functionality and
extended battery life.
TI has created a coexistence package for WLAN and Bluetooth
wireless technologies in co-located environments. This package
enables data and voice to be transmitted without interference while
optimizing system throughput, range, and responsiveness.
Additionally with no antennae isolation requirements, even providing
for shared antenna designs, it is ideal for mobile handsets.
Mobile Digital TV – Mobile digital TV (DTV) combines the two
best-selling consumer products in history – TVs and mobile phones.
TI technology is driving mobile digital TV with OMAP™ processors and
Hollywood™ mobile broadcast solution, the wireless industry’s first
digital TV on a single piece of silicon, which captures broadcast signals
and allows consumers to watch live TV programming on their handset.
Emerging Technologies
ULP (Ultra Low Power) Bluetooth® technology is a radio technology
for small devices that integrates easily with Bluetooth technology
and consumes a fraction of the power of classic Bluetooth
enabled products. ULP connects small devices within power and
battery lifetime constraints to mobile phones and personal computers.
TI’s 65-nm connectivity portfolio is designed to support ULP.
NFC (Near Field Communications) is an evolution of low data rate
contactless and short range RFID technologies. TI is part of the
NFC Forum and other organizations which are working to define
a standard approach to implementing NFC in a mobile phone.
NFC enables contactless purchasing, “tap on” advertising and
peer-to-peer information exchange.
High-Speed Bluetooth (Seattle) is the next step in extending
the data rate for Bluetooth solutions. Both UWB (Ultra Wide Band)
and 802.11 WLAN technologies are being examined for use in
applications where large amounts of data need to be transmitted in
a PAN or LAN scenario. Both technologies will leverage Bluetooth
for easy service discovery and the wideband capabilities of UWB
and WLAN for data transfer between mobile phones and other CE
devices or access points. TI is actively involved with the Bluetooth
SIG in developing the requirements for high speed Bluetooth
solutions.
Wireless Handsets Solutions Guide
58
Mobile Connectivity Solutions
BlueLink™ 7.0 Bluetooth® and FM Solution
BL6450 BlueLink™ 7.0 WPAN Solution: Bluetooth®
and FM RX/TX Single Chip
Key Benefits
The BL6450 BlueLink™ 7.0 single chip is the industry’s first Bluetooth®
solution manufactured in 65-nm CMOS and provides a complete
hardware and software solution for Bluetooth and FM receive and
transmit, enabling ease of design and expediting time to market for
mobile device manufacturers.
• Supports Bluetooth® Specification 2.1+ enhanced data rate (EDR)
• Fully embedded FM and radio data system (RDS) receiver and
transceiver, supporting U.S./European and Japanese FM band
and high-fidelity FM stereo and mono on a single chip
• Best-in-class Bluetooth (RF) performance (TX power, RX
sensitivity, blocking)
• Best-in-class FM receiver sensitivity level and audio quality
• Industry’s smallest Bluetooth and FM single-chip solution
based on TI’s 65-nm CMOS process and DRP™ technology
• Highly optimized for mobile phone systems with lowest BOM,
small solution size and direct connection to battery
• Advanced power management for extended battery life and
ease of design
• Supports multiple Bluetooth profile use-cases (complex
scenarios) working concurrently with FM
• Improved AFH algorithm with minimal adoption time
• Supports Class 1.5 - higher than Class 2 transmit power without
external PA, improving Bluetooth link robustness
• Easy integration into various host system topologies with shared
and separated interfaces for Bluetooth and FM functions
• Pre-integrated with TI OMAP™ application processors,
GSM/GPRS/EDGE/UMTS, GPS and WLAN solutions
• High throughput coexistence mechanism with TI's WLAN
devices operating on 2.4-GHz band
The solution’s Bluetooth function is based on TI’s fifth-generation
Bluetooth core, and its FM function presents state-of-the-art performance
in all critical FM parameters, such as current consumption, stereo
signal-to-noise ratio (SNR) and sensitivity.
Since both the Bluetooth and FM functions are integrated on the same
silicon, the solution ensures optimal RF coexistence. Consequently, the
two functions can work simultaneously so that the FM function
receives/scans/sends radio data system (RDS) information to a host,
while the Bluetooth function is in any operational mode.
Additionally, the BlueLink 7.0 solution adds support for FM transmit,
including a programmable gain power amplifier with levels compliant to
FCC and ETSI specifications and higher power levels. It also includes FM
analog and digital (I2S) data interfaces supporting voice quality sample
rate and MP3 audio quality sample rates.
TI’s power management hardware and software algorithms provide
significant power savings in the most commonly used Bluetooth modes
of operation, such as page and inquiry scan.
Leveraging TI’s DRP™ technology and 65-nm process technology, the
BL6450 is the industry’s smallest Bluetooth and FM single-chip solution.
These advancements allow customers to realize significant cost and size
savings due to:
• Significantly lower number of external components compared
to discrete Bluetooth and FM solutions
• Significantly smaller number of interfaces (for the FM function)
compared to discrete Bluetooth and FM solutions
Host
Clocks
Audio
Interfaces
The BL6450 BlueLink 7.0 single chip also incorporates TI’s
Bluetooth/WLAN coexistence hardware and software solution,
providing a collaborative interface with TI’s WiLink™ mobile WLAN
solutions for optimal bandwidth. TI’s coexistence solution enables
advanced usage scenarios such as VoIP over WLAN with Bluetooth
voice using a shared antenna.
2.4 GHz
Bluetooth®
MAC/BB
Bluetooth
Radio
Filter
Host I/F
SDIO/SPI
FM
Legacy Host I/F
FM
MAC/BB
FM Radio
Filter
BL6450 BlueLink™ 7.0 Solution
Wireless Handsets Solutions Guide
Texas Instruments 2008
• Supports Bluetooth® Specification 2.1, EDR and high-fidelity
FM stereo and mono receiver on a single chip
• Integration of Bluetooth and FM in the same silicon provides
25 percent solution size savings compared to discrete solutions
• Proven FM-Bluetooth RF coexistence
• Complete software stack support for Bluetooth and FM, enabling
ease of design and quick time to market
• On-chip power management adapted to cellular applications
• Incorporates TI’s Bluetooth and WLAN coexistence hardware
and software solution, providing a collaborative interface with
TI’s mobile WLAN solutions
• TI’s DRP™ single-chip technology delivers smallest and lowest
cost solution
Since both Bluetooth and FM functions are integrated on the same
silicon, the solution ensures optimal RF coexistence. Consequently, the
two functions can work simultaneously in such a way that the FM
function receives/scans/sends RDS information to a host, while the
Bluetooth function is in any operational mode.
BlueLink 6.0 platform software offers designers the flexibility to work
with various operating systems, including Linux®, Microsoft® Windows
Mobile®, Symbian™ and Nucleus. The BlueLink 6.0 software includes
TI’s Bluetooth Protocol Stack (BTIPS) running on Nucleus. BTIPS is
optimized to work with TI’s OMAP™ and OMAP-Vox™ platforms
and TCS wireless chipsets. In addition to BTIPS, the BlueLink 6.0
software package includes an FM protocol stack.
Leveraging TI’s DRP™ technology and 90-nm process, the BRF6350
BlueLink 6.0 single chip is an integrated Bluetooth and FM solution in a
small form factor. These advancements allow manufacturers to realize
significant cost, size and power savings due to:
UART HCI SDIO HCI
Clocks Interface Interface
BlueLink™ 6.0 Bluetooth® Solution
Key Benefits
The BlueLink™ 6.0 platform provides a complete hardware and software
solution, enabling ease of design and faster time to market. The BRF6350
BlueLink 6.0 single chip is the only 90-nm solution available in the WPAN
marketplace. The solution’s Bluetooth® function is based on TI’s fourth
generation Bluetooth core that has been shipped in millions of units
worldwide, while its FM function delivers state of the art performance
in all critical FM parameters, such as current consumption, stereo SNR
and sensitivity.
• 25 percent smaller device size compared to discrete Bluetooth
and FM solutions
59
BRF6350 BlueLink™ 6.0 Bluetooth® and FM Solution
Mobile Connectivity Solutions
• Lower number of external components compared to discrete
Bluetooth and FM solutions
• Lower number of balls (for the FM function) compared to discrete
Bluetooth and FM solutions
• Power savings in the most commonly used Bluetooth modes of
operation, such as page and inquiry scan, through hardware and
software algorithms
The BlueLink 6.0 single chip also incorporates TI’s Bluetooth /WLAN
coexistence hardware and software solution, providing a collaborative
interface with TI’s WiLink™ mobile WLAN solution for optimal
bandwidth. TI’s coexistence solution enables advanced usage scenarios
such as VoIP over WLAN with Bluetooth voice using a shared antenna.
PCM
WLAN
Coexistence Codec
FM
I2C HCI
Interface Interface Interrupt
Interface
Bluetooth
Baseband
Balun
Rx/Tx
Switch
ROM
ARM7TDMI
Bluetooth
Transceiver
RAM
Peripherals
I2S Codec
Interface
(Digital FM
Audio)
FM Receiver
Matching
Network
Analog
Audio
Outputs
Clock & Power
Management
FM Wakeup
Module
BRF6350 BlueLink™ 6.0 Functional Block Diagram
Texas Instruments 2008
Wireless Handsets Solutions Guide
60
Mobile Connectivity Solutions
BlueLink™ 5.0 Bluetooth® Solution
BRF6300 BlueLink™ 5.0 Bluetooth® Single-Chip Solution
Key Benefits
Optimized for mobile handsets, the BlueLink™ 5.0 platform from TI
is a highly integrated, digital CMOS, single-chip solution supporting
Bluetooth® Specification v2.0 and all software needed for Bluetooth
operation. The BRF6300 BlueLink 5.0 solution is based on TI’s prior
generation BRF6150, leveraging and exceeding its capabilities to provide
maximum enhanced data rate (EDR) support, lowest power consumption
in most Bluetooth scenarios and lowest cost and bill of materials (BOM).
• Supports Specification v2.0 and EDR
• Industry best power management including lowest power
consumption, direct connection to battery (up to 5.4 V) and
shut-down (6 µA) to enable market’s longest talk,
standby times
• Complete solution for faster time to market and integration
• Cost savings
– Complete set of reference designs with TI’s
OMAP™ processors and TCS chipsets
– WLAN coexistence solution
• TI’s 90-nm CMOS and DRP™ single-chip technology
TI’s BRF6300 BlueLink 5.0 solution integrates the Bluetooth baseband,
RF transceiver, ARM7TDMI®, memory (ROM and RAM) and power
management on one chip. The single chip utilizes TI’s DRP™ technology,
a revolution in RF technology offering major advantages over the existing
solutions based on analog RF. All-digital single-chip benefits include
increased scalability, lower power consumption, reduced size and
ultimately lower system cost.
The single-chip solution is optimized for mobile handsets delivering
the RF performance and ease of integration required by manufacturers.
TI’s advanced process and novel design enable the BRF6300 BlueLink
5.0 solution to connect directly to the battery (up to 5.4 V). This design
saves the cost and space of an external regulator and simplifies the
interface and integration with the host by separating their power
management entities.
OMAP™ processors. The single-chip solution includes TI’s proven
collaborative coexistence mechanism between WLAN and Bluetooth
networks. This feature, combined with Bluetooth Specification v2.0
adaptive frequency hopping (AFH) and extended Synchronous Connection
Oriented (eSCO), allows TI to deliver a high-quality Bluetooth voice and
enhanced data throughput when co-located in small mobile products
such as smartphones and wireless PDAs.
For ease of design, the BlueLink 5.0 platform is pre-integrated in
complete reference designs with TI’s cellular modem chipsets and
WLAN
GSM/GPRS
BRF6300
BlueLink™ 5.0
OMAP™
Applications
Processor
Digital
Baseband
RF
Analog
Clock
Smartphone application: BRF6300 BlueLink™ 5.0 solution interconnects
with the OMAP™ applications processor, GSM/GPRS chipset and WLAN.
Wireless Handsets Solutions Guide
Texas Instruments 2008
61
BRF6150 Bluetooth® Solution (WPAN)
BRF6150 Single-Chip Bluetooth® Wireless Technology
Mobile Connectivity Solutions
Key Benefits
Optimized for mobile handsets, TI’s BRF6150 is a highly integrated
Bluetooth® wireless technology Specification v1.2 solution that combines
TI’s Bluetooth wireless technology baseband, RF, ARM7TDMI® and power
management into a single chip. Its extreme levels of integration enhance
performance and lower power consumption while reducing cost and
minimizing board space.
• Direct connection to battery provides improved power
management (2.7 V to 5.5 V)
• Full Bluetooth® Specification v1.2, including AFH and
faster connection
• Low cost and part count due to high integration and
improved interfaces
• Reduced development time through availability of pin-to-pin
compatible stacked-flash prototypes (4.5 mm x 4.5 mm)
• Complete reference designs with TI’s OMAP™ platform and
GSM/GPRS chipsets provide fast time to market
• WLAN collaborative coexistence solution
The BRF6150 offers improved RF performance, and power management
capabilities, delivering higher integration and reduced package size,
resulting in a 50 mm2 PCB layout Bluetooth wireless technology solution
for mobile phones. The BRF6150 is tailored to suit mobile applications
requirements, including RF performance, power consumption, solution
size, ease of integration and cost. It connects directly to the battery,
saving cost and space of external regulators and simplifying the interface
with the host by separating power management entities.
The BRF6150, which utilizes adaptive frequency hopping (AFH), offers
an upgrade to the current coexistence solution. When manufacturers
combine the v1.2 compliant BRF6150 with TI’s Bluetooth/WLAN
coexistence hardware and software package and a TI WLAN solution,
improved coexistence performance is achieved. This combination
results in better utilization of the 2.4 GHz frequency band and solves
the most demanding coexistence scenarios for simultaneous
Bluetooth wireless technology voice/data and high speed Wi-Fi data. It
also enhances WLAN data throughput to maximum performance when
co-located into mobile devices such as smartphones and wireless PDAs.
The BRF6150 includes complete reference designs with TI’s GSM/GPRS
chipsets and OMAP™ platform.
WLAN
GSM/GPRS
BRF6150
OMAP™
Applications
Processor
Digital
Baseband
RF
Analog
Clock
Smartphone application: BRF6150 interconnects with the OMAP™
applications processor, GSM/GPRS chipset and WLAN.
Texas Instruments 2008
Wireless Handsets Solutions Guide
62
Mobile Connectivity Solutions
WiLink™ 6.0 WLAN Bluetooth® and FM Solution
WiLink™ 6.0 Single-Chip WLAN, Bluetooth®
and FM Solutions
Key Benefits
TI’s WiLink™ 6.0 mobile platform is a complete hardware and software
offering comprised of proven carrier-quality mobile WLAN, Bluetooth and
FM cores integrated onto a single chip.
• Single-chip mobile WLAN, Bluetooth® and FM solution
implemented in 65-nm CMOS process using TI’s DRP™
technology enables:
– Reduced power consumption for extended talk and
standby times
– Bill of material reduction
– Small form factor
• Highly integrated to enhance the user experience with
range-extended mobile WLAN (802.11 b/g), Bluetooth
Specification v2.1 and FM functional cores
• Sophisticated ELP™ low-power technology and VoWLAN
support with on-chip UMA and IMS acceleration for extended
talk time and battery life
• Coexistence features enable simultaneous operation of each
integrated function
There are two solutions in the WiLink 6.0 product offering. The WL1271
supports 802.11b/g/n (2.4 GHz) , while the WL1273 supports
802.11a/b/g/n (Both 2.4 and 5 GHz). Both single-chip solutions support
Bluetooth Lisbon Release and FM transmit and receive.
The WiLink 6.0 single-chip solutions are manufactured in 65-nm CMOS
process and use TI’s DRP™ technology to deliver low power, a small form
factor and low cost requirements of handset manufacturers worldwide.
TI’s WiLink 6.0 single-chip solution is designed to work with OMAP™ 2
and OMAP™ 3 processors and the OMAP-Vox™ platform to provide an
optimized modem, applications processor and mWLAN/Bluetooth/FM
solution for high-end smartphones, as well as entry- to mid-tier handsets.
The WiLink 6.0 solution includes TI’s proven, robust coexistence platform,
which addresses system-wide interference issues, encompassing radio
design, and hardware and software solutions. Coexistence expertise is
becoming increasingly important as more radios are being added to
the handset. TI leads the market in coexistence solutions for Bluetooth
and mWLAN with more than 30 handsets using its coexistence platform.
The WiLink Software Development Kit (SDK) 6.x included with the
WiLink 6.0 platform is optimized for mobile phone applications. This
SDK includes support for Linux®, Windows® WinCE™, Symbian™ and
real time operating systems, as well as lab testing and manufacturing
software. It is also partitioned to minimize host CPU loading and power
consumption in mobile applications.
WiLink™ 6.0 Single-Chip WLAN, Bluetooth®
and FM Solutions
Wireless Handsets Solutions Guide
Texas Instruments 2008
WiLink™ 5.0 WLAN Platform
Key Benefits
The WiLink™ 5.0 platform integrates mobile WLAN (mWLAN),
Bluetooth® and FM stereo audio all in a space-saving platform for
mobile phones. The WiLink™ 5.0 solution provides fast time to market
for handset manufacturers and caters to evolving consumer tastes for
rapid data access, mobile entertainment and seamless connectivity
between the WLAN and cellular networks.
TI brings seamless cellular and Wi-Fi® connectivity to consumers with
VoWLAN functionality, optimized on TI’s OMAP-Vox™ and WiLink
solutions, enabling UMA on the handset across multiple operating
systems such as Symbian™, Microsoft® Windows Mobile®, Linux® and
low level operating systems. UMA provides consumers on-the-go voice
access over WLAN or the cellular network using their mobile phones, and
will transition to IMS as the fixed mobile convergence market matures.
The WiLink 5.0 platform integrates TI’s WiLink 4.0 mWLAN single chip
with its BlueLink ™ 6.0 solution, which combines Bluetooth with
high-fidelity FM stereo and mono performance on a single chip. The
combination of mWLAN, Bluetooth and FM functionality allows users
to perform a variety of simultaneous tasks, such as listening to the radio
music on a Bluetooth headset while checking email via Wi-Fi.
Both devices in the WiLink 5.0 module are manufactured at the 90-nm
node, which cuts both solution size and power consumption by up to
20 percent over competitive solutions, in critical modes of operation.
With three co-located radios, efficient management of RF is required for
simultaneous operation of WLAN, Bluetooth and FM applications. The
WiLink 5.0 platform takes advantage of TI’s expertise from the
Battery
63
WiLink™ 5.0 Mobile WLAN Solution
Mobile Connectivity Solutions
Power
Management
• Integrates TI’s BlueLink™ 6.0 solution, which combines
Bluetooth® with high-fidelity FM stereo and mono performance
on a single chip
• VoWLAN functionality, optimized on TI’s OMAP-Vox™ and
WiLink solutions, enabling UMA on the handset
• 20 percent reduction in solution size and power consumption
through use of TI's innovative DRP™ technology at 90-nm
• Advanced Bluetooth and WLAN coexistence through use of TI’s
second generation of Bluetooth/WLAN hardware and software
co-existence package, enabling re-use of existing systems, quick
time to market, and antenna sharing, reducing the BOM
for manufacturers
• Support for multiple operating systems: Symbian™, Microsoft®
Windows Mobile®, Linux® and low level OSs
company’s previous generations of mobile WLAN solutions, which are
being shipped in more than 30 mobile handset devices and cellular
convergence products today. The platform uses the second generation
of TI’s Bluetooth/WLAN hardware and software coexistence package,
enabling re-use of existing systems, quick time to market and antenna
sharing, reducing the BOM for manufacturers.
WLAN
MAC/BB/RF
Front
End
2.4-GHz RF
Bluetooth
Coexistence
BlueLink™ 6.0
Bluetooth + FM
WiLink™ 5.0 Platform: WLAN, Bluetooth® + FM
Texas Instruments 2008
Wireless Handsets Solutions Guide
64
Mobile Connectivity Solutions
WiLink™ 4.0 WLAN Platform
WiLink™ 4.0 Mobile WLAN Single-Chip Solutions
Key Benefits
TI’s WiLink™ 4.0 mobile WLAN platform is a complete hardware and
software offering optimized for mobile phones. TI’s WiLink 4.0 platform
offers two different hardware single-chip implementations to provide
flexibility for OEMs to offer 802.11b/g or 802.11a/b/g operation. The
WL1251 802.11b/g solution and the WL1253 802.11a/b/g solution
are system-on-a-chip architecturers (SOCs) which integrate the media
access controller (MAC), baseband processor and RF transceiver.
The WL1251 and WL1253 WiLink 4.0 single-chip solutions are
manufactured in 90-nm process technology and extend TI’s leadership
in single-chip integrated solutions using TI’s DRP™ technology. Both
single-chip solutions are pin-for-pin compatible to simplify manufacturers’
product line strategies for 802.11b/g and 802.11a/b/g products. This SDK
compatibility enables just-in-time manufacturing options that are
responsive to marketplace demand and design re-use to speed time to
market of new products.
The WiLink Software Development Kit (SDK) 4.X included with the
WiLink 4.0 platform is optimized for embedded applications. This SDK
includes support for Linux®, Windows® WinCE™, Symbian™ and
real-time operating systems, as well as lab testing and manufacturing
software. It is also partitioned to minimize host CPU loading and power
consumption in mobile applications.
• Complete WLAN hardware and software solutions
optimized for mobile 802.11b/g, a/b/g applications
• Single-chip 802.11 Media Access Controller/Baseband/RF
transceiver WLAN solutions (WL1251 and WL1253)
reduce BOM, save PCB space and extend standby and talk times
• Voice over WLAN (VoWLAN)-ready: Sophisticated power-saving
sleep modes match traffic characteristics of VoWLAN
applications
• First WLAN solutions using 90-nm manufacturing process
to enable market leading physical size and low power
consumption, through use of TI’s innovative DRP™ technology
• Industry’s lowest power consumption with TI’s ELP™
technology extends battery life of handsets, wireless
PDAs and other mobile devices
• Bluetooth® coexistence technology ensures high quality
of service for voice and data use involving WLAN and
Bluetooth operations
• Robust solution shipping in volume in more than 30 handsets
models with over 9 OEMs
WL1253FE
Power
Amplifier
WL1251/WL1253
5-GHz
Antenna Filter
Host Clocks
WLAN Host I/F
WL1251FE
WLAN
Host
Interface
ADC
MAC
Baseband
Radio
DAC
Bluetooth® Coexistence
Power
Amplifier
2.4-GHz
Antenna Filter
Bluetooth
BRF6150/BRF6300
WiLink™ 4.0 Mobile WLAN Single-Chip Solutions
*Optional: The WL1253FE is only used in conjunction with the WL1253 for 802.11a operation
Wireless Handsets Solutions Guide
Texas Instruments 2008
65
WLAN and Bluetooth® Coexistence
WLAN and Bluetooth® Coexistence
Mobile Connectivity Solutions
Key Benefits
TI has developed a coexistence solution for simultaneous operation
of 802.11b/g WLAN and Bluetooth® personal area networking in
mobile devices. Because 802.11b/g and Bluetooth occupy the same
2.4-GHz ISM range of wireless communications spectrum, their RF
signals can cause interference for each other unless a coexistence
solution is deployed.
• Simultaneous 802.11 and Bluetooth operation for
data and voice applications
• Hardware and software solution
• Flexibility: supported by TI’s WLAN and Bluetooth
single-chip solutions
• Low power consumption for mobile battery-operated platforms
• No RF isolation requirements reduces board space
• Shared antenna design
• Intelligent MAC-layer coordination eliminates performance
penalties caused by allocating dedicated bandwidth
• Small footprint ideal for compact handheld devices
TI’s coexistence solution provides intelligent and seamless
coordination between TI’s WLAN and Bluetooth technologies at the
media access control (MAC) layer. With this level of time domain
coordination, no RF isolation is needed between the 802.11 and
Bluetooth antennas, simplifying designs and ensuring effective
operations in small form factors.
Designed for interoperability and coexistence, TI’s WLAN and
Bluetooth single-chip solutions are capable of cost-efficient
collaboration and effective coexistence with each other. For instance,
WLAN and Bluetooth technologies are able to share the same antenna
and antenna filter, reducing bill of materials (BOM) costs and circuit
board space. In addition, TI’s WLAN/Bluetooth coexistence technology
ensures effective simultaneous operations of voice and data.
2.4-GHz
Radio
WiLinkTM
Platform
or
BlueLink™ and WiLinkTM
Single Antenna Sharing
Coexistence BUS
WLAN
Host
Interface
BlueLink™
Solution
Bluetooth
Host
Interface
Coexistence Solution Architecture
Texas Instruments 2008
Wireless Handsets Solutions Guide
66
Mobile Connectivity Solutions
NaviLink™ 6.0 GPS Solution
NL5500 NaviLink™ 6.0 Single-Chip A-GPS/Bluetooth®/FM
Solution
Key Benefits
As the popularity of global positioning satellite (GPS) systems
continues to grow, mobile handset users are demanding similar
functionality on their mobile phones. In addition, the vast majority of
mobile handsets include Bluetooth® functionality to provide wireless
connectivity between devices. A growing segment of the mobile
handset market are incorporating FM radio receiver/transmitter (Rx/Tx)
to allow users to enjoy FM radio when not making phone calls. Built on
TI’s leadership positions in GPS and Bluetooth technologies, the
NL5500 NaviLink™ 6.0 solution incorporates all of these functions into
a single chip: GPS and assisted GPS (A-GPS), Bluetooth and FM Rx/Tx.
With the integration of these three functions into a single-chip, the
NL5500 can deliver applications such as mobile navigation, 3D maps,
location-based services, safety services and FM radio while allowing
the consumer to wirelessly connect their mobile devices to other
Bluetooth enabled devices.
• Single-chip solution integrating A-GPS, Bluetooth® and FM
radio Rx/Tx
• Offers significant solution size savings as a result of TI’s
DRP™ technology and 65-nm manufacturing process delivering
solution area savings of up to 40%
• Low power with integrated power-saving module that cuts
power requirements in half
• High A-GPS performance with weaker satellite signals
exceeding 3GPP and 3GPP2 requirements
• Optimized to interface with TI’s 3G and OMAP™ solutions to
deliver a complete solution for handset OEMs
The NL5500 NaviLink 6.0 A-GPS/Bluetooth/FM single-chip
solution is manufactured in 65-nm process technology and uses
TI’s DRP™ technology to provide the smallest size and highest value
while still delivering a low power and high performance discrete
A-GPS/Bluetooth/FM solution to mobile phone manufacturers. With
integrated Position Optimizer software to support inertial navigation
sensors, superior performance can be obtained in weak satellite
signal areas, such as downtown areas, enhancing the consumer’s
GPS experience.
• Low Power: With integrated power management on-chip, the
NL5500 NaviLink 6.0 solution simplifies design, further reduces
the BOM and provides industry leading low power consumption.
The single chip also allows direct connect to battery for easy
incorporation into mobile phone designs.
• Smallest Size: The NL5500 NaviLink 6.0 solution integrates a
complete A-GPS system as well as Bluetooth and FM Rx/Tx into
one chip, significantly reducing the board layout area required for
three discrete solutions. The single chip enables a significant
solution size savings of up to 40% over the previous discrete
Bluetooth/FM and A-GPS solutions from TI.
• High Value: As a single chip, the NL5500 significantly reduces
the number of external passives required, providing BOM savings
over competitor’s products.
• High Performance: The NL5500 NaviLink 6.0 solution enables a
rapid time to first fix (TTFF) from weak satellite signals, exceeding
the GPS requirements for 3GPP and 3GPP2 operation. TI’s Position
Optimizer software allows support for Inertial Navigation Sensors,
delivering even better GPS performance in weak signal areas,
such as downtown and heavily wooded areas.
With tens of millions of GPS units for handsets already deployed, the
NL5500 is a proven third generation solution that will save OEMs
power and size while increasing the performance of their product.
Further development and design support can be found through TI’s
Developer Network. The NL5500 is expected to be in products on the
market by the end of 2009.
2.4 GHz
1.575 GHz
GPS Antenna
NaviLink™
Platform
GPS
Host
Interface
87 MHz
BT Antenna
Coexistence Interface
FM Antenna
BlueLink™
Solution
Bluetooth-FM
Host
Interface
NaviLink 6.0
Wireless Handsets Solutions Guide
Texas Instruments 2008
67
NaviLink™ 5.0 GPS Solution
NL5350 NaviLink™ 5.0 Single-Chip GPS Solution
Mobile Connectivity Solutions
Key Benefits
Consumers are becoming accustomed to using global positioning
system (GPS) services on handheld devices and are demanding similar
functionality on their mobile phone. TI’s NL5350 NaviLink™ 5.0
single-chip solution for GPS and assisted GPS (A-GPS) applications
is optimized for mobile phones to deliver applications such as mobile
navigation, 3D maps, location-based services and safety services.
The NaviLink 5.0 GPS single-chip solution is manufactured in 90-nm
process technology and uses TI’s DRP™ technology. Through DRP
technology, TI is able to provide the smallest size, lowest cost, low
power, and high performance discrete GPS solution to mobile phone
manufacturers.
• Single chip using TI’s DRP™ technology and 90-nm
manufacturing process
• The smallest GPS solution with a board area around 25 mm2
• Lowest total BOM for a complete GPS system with only
11 external passives required
• Low power with integrated power management
• High GPS performance with weaker satellite signals, exceeding
3GPP and 3GPP2 requirements
• Optimized to interface with TI’s 3G and OMAP™ solutions to
deliver a complete solution for handset OEMs
• Smallest Size: The NL5350 NaviLink 5.0 solution integrates a
complete GPS system into one chip, significantly reducing the
board layout area for a discrete GPS engine. The single chip
enables a board area for the complete system of around 25 mm2.
• Lowest Cost: As a single chip, the NL5350 only requires
11 external passives, a significant reduction over existing
solutions which require up to 30 external passives. This level of
integration delivers a total BOM that is almost 50 percent less
than competition today.
• Low Power: The NL5350 NaviLink 5.0 solution has power
management integrated on-chip, which simplifies design and
further reduces the BOM. The single chip also allows direct connect
to battery for easy incorporation into mobile phone designs.
• High Performance: The NL5350 NaviLink 5.0 solution enables
a rapid time to first fix (TTFF) from weak satellite signals
exceeding the GPS requirements for 3GPP and 3GPP2 operation.
The NL5350 NaviLink 5.0 single-chip solution is expected to sample in
2Q 2008. Additionally, TI is collaborating with Murata to deliver a
small module to handset OEMs to speed time to market of NaviLink
solution-based GPS mobile phones.
Applications
HLOS
OS Location API
GPS
Controller
GPS
Engine Software
NL5350
NaviLink™ 5.0
Single Chip
Modem L1, 2,
3 stack
UART or I2C
UART or I2C
(alternative connection
to modem)
Cellular
Modem Chipset
OMAP™
Applications
Processor
Base Station
GPS
Server
NL5350 NaviLink™ 5.0 Single-Chip GPS Solution
Texas Instruments 2008
Wireless Handsets Solutions Guide
68
Mobile Connectivity Solutions
NaviLink™ 4.0 GPS Solution
GPS5300 NaviLink™ 4.0 GPS Single-Chip Solution
Key Benefits
Global positioning system (GPS) applications are increasing in popularity
in mobile phones worldwide for mobile navigation, mapping and safety
services. TI’s GPS5300 NaviLink™ 4.0 single-chip solution for assisted
global positioning system (A-GPS) and stand-alone GPS applications is
optimized for 3G mobile phones.
The NaviLink single-chip solution is manufactured in 90-nm process
technology and uses TI’s DRP™ technology. Through DRP technology, TI is
able to provide a small size, low cost, low power and high performance
discrete A-GPS solution to mobile phone manufacturers.
• Small Size: The GPS5300 NaviLink 4.0 solution integrates a complete
GPS system into one chip, significantly reducing the board layout area
for a discrete A-GPS engine. The single chip enables a board area for
the complete system of less than 50 mm2.
• Lowest Cost: As a single chip, the GPS5300 only requires 11 external
passives, a significant reduction over existing solutions which require
up to 30 external passives.
• Low Power: The GPS5300 NaviLink 4.0 solution has power
management integrated on-chip, which simplifies design and further
reduces the BOM. The single chip also allows direct connect to battery
for easy incorporation into mobile phone designs.
• Single chip using TI’s DRP™ technology and 90-nm
manufacturing process
• Small A-GPS solution with a board area less than 50 mm2
• Lowest total BOM for a complete A-GPS system with only
11 external passives required
• Low power with integrated power management
• High A-GPS performance with weaker satellite signals,
exceeding 3GPP and 3GPP2 requirements
• Optimized to interface with TI’s 3G chipsets and OMAP™
solutions to deliver a complete solution for handset OEMs
• Small module speeds time to market for A-GPS enabled phones
• High Performance: The GPS5300 NaviLink 4.0 solution enables a
rapid time to first fix (TTFF) from weak satellite signals exceeding the
A-GPS requirements for 3GPP and 3GPP2 operation.
To further speed time to market, manufacturers can work with members
of TI’s worldwide wireless ecosystem to assist in integrating the
NaviLink 4.0 solution into new GPS-enabled handsets. Additionally, TI
is collaborating with Murata to deliver a small module to handset OEMs
to speed time to market of NaviLink chip-based A-GPS mobile phones.
Applications
HLOS
OS Location API
GPS
Controller
GPS
Engine Software
GPS5300
NaviLink™ 4.0
Single Chip
Modem L1, 2,
3 stack
UART or I2C
Cellular
Modem Chipset
UART or I2C
(alternative connection
to modem)
OMAP™
Applications
Processor
Base Station
GPS
Server
GPS5300 NaviLink™ 4.0 Single-Chip Solution
Wireless Handsets Solutions Guide
Texas Instruments 2008
Mobile Connectivity Solutions
69
Hollywood™ Mobile DTV Single-Chip Solution
Hollywood™ Mobile DTV Single-Chip Solution
Key Benefits
TI’s Hollywood™ mobile DTV single chip is the first in the industry to
integrate the mobile TV tuner and demodulator into one piece of silicon
using standard 90-nm digital process. By using TI’s DRP™ technology, the
Hollywood solution delivers low cost and long battery life in the smallest
board area.
• First mobile DTV single chip solution–integrates RF,
demodulator, decoder and memory
• World’s smallest footprint package–less than 30 mm2
resulting in low-cost BOM
• Low-power design–90-nm RF CMOS design,
low 1-V core design
• Fast time to market: development platform, operating system
agnostic driver and API integration package
The DTV1000 Hollywood mobile DTV solution supports DVB-H (digital
video broadcast - handheld) operating at 470-750 MHz (UHF) and 1.6 GHz
(L-band) frequency ranges.
The DTV1000 chip interfaces with TI’s family of OMAP™ applications
processors and OMAP-Vox™ integrated processor and cellular modem
solutions to deliver crisp, clear video and stereo audio, offering
consumers the quality of a living room TV-viewing experience in the
palm of their hand.
Through TI’s innovative DRP technology, the DTV1000 device combines a
two-chip or system in package (SIP) solution into a single piece of silicon
in standard 90-nm digital process to deliver:
• Smallest Board Area: High degree of integration and low ball count
has led to a footprint of less than 1cm2 for the entire solution,
including all passive and power switch components, which is
significantly smaller than current solutions that require a separate
tuner, demodulator and external memory.
• Fast Time to Market: Significant value-added processing in the
DTV1000 results in a simple software driver and API package,
accelerating integration with host processors, such as OMAP
applications processors, and reducing time to market.
• High Performance: Multiple concurrent television channels
(elementary streams) can be supported and fast channel switching
times under 1.5 seconds are possible.
• Low Part Count and Lower Bill of Materials: High integration
has led to a small number of low cost external components, driving
the estimated BOM in volume under $10.
Analog
BB or
Switcher
TPS62300
• Low Power: Low 1-V RF CMOS process and low power design
techniques have resulted in only 30 mW of power consumption for
a typical category B DVB-H terminal. Combined with TI's low power
OMAP application processors, this technique can deliver four to
seven hours of view time depending on display size and battery rating.
1.8 V
VCore
ClockREF
Clock
Manager
RTCCLK
TS
DEMUX
DTV100x
OFDM
Demod
UHF-FE
ADC
DTV_CLK_REQ
OMAP2420
OMAP2430
OMAP-DM270
DTVNSHUTDOWN
OMAPV1030
WSPI/SDIO
WSPI/SDIOIRQ
UART
Antenna
Selection
MPE-FEC
Or Link
Layer Buffer
ARM966E
128 I-RAM
128 D-RAM
Optional
Debug to PC
Antenna
Module
PreSelect
Filter
1.6G-FE
GPIO0-2
Power, Reset
Clock
Management
GPIO3
GPIO9
PWM
Low Pass
Filter
VANT
Antenna
Tuning
5 or 3.3 V
Hollywood™ Mobile DTV Single-Chip Solution
Texas Instruments 2008
Wireless Handsets Solutions Guide
70
High-Performance Analog
Solutions for Handsets
Texas Instruments provides a broad portfolio of high-performance analog
and logic products, plus application knowledge, local technical support
and easy-to-use design tools to help you differentiate your handset design
and get to market faster. TI’s high-performance analog offers the greatest
amount of performance and efficiency from the smallest solution size.
Visit www.ti.com/analogportable for data sheets, samples and
evaluation modules. Visit www.ti.com/analoglit for a complete listing of TI literature including guides for Audio, Video, Amplifiers, Data
Converters, Interface, Power Management and RF.
Audio Power Amplifier - Speaker
Device
TPA2006D1
TPA2010D1
TPA2012D2
TPA2013D1
TPA6204A1
TPA6205A1
Description
1.45-W Mono, Fully Differential, Filter-Free Class-D
Audio Amplifier
2.5-W Mono, Fully Differential, Filter-Free Class-D
Audio Amplifier in WCSP
2.1-W Stereo Class-D Audio Amplifier in WCSP
2.7-W Mono Audio Class-D Amplifier with Integrated
Boost Converter
1.7-W Mono Fully Differential, Class-AB Audio Amplifier
1.25-W Mono, Fully Differential, Class-AB Audio
Amplifier
Audio Power Amplifier - Headphone
Device
TPA4411
TPA6130A2
TPA6100A2
TPA6110A2
Video and Interface
Device
Description
OPA360/1
SN65LVDS301/302
3-V Video Amplifier with 6dB Gain and Filter
subLVDS 24-Bit RGB Serdes for LCD Modules
Touch Screen Controller
Device
TSC2003
TSC2004
TSC2005
TSC2007
Audio Codec and DAC
Device
TLV320AIC31/2/3
Description
Low-Power Stereo Codec with HP/Speaker Amps
and 3D Effects
TLV320AIC3104/5/6 Low-Power Stereo Codec with HP Amp and
Enhanced Digital Effects
TLV320AIC34
Low-Power 4-Channel Audio Codec with Dual
Audio Buses
PCM3793A/4A
Very Low-Power Stereo Codec with HP/Class-D
Speaker Amplifier, Notch Filters, ALC and 3D Effects
TLV320DAC32
Low-Power Stereo DAC with 4 Outputs, HP/Speaker
Amps and 3D Effects
Wireless Handsets Solutions Guide
Description
80-mW DirectPath™ Stereo Headphone Driver
138-mW DirectPath™ Stereo Headphone Amplifier with
I2C Volume Control
50-mW Ultra-Low Voltage Stereo Headphone Audio
Amplifier
Stereo Headphone Audio Amplifier
TSC2100
TSC2101
Description
4-Wire Touch Screen Controller with I2C Interface
4-Wire Touch Screen Controller with Programmable
Pre-Processing, I2C Interface, 1.2V to 3.6V in CSP
4-Wire Touch Screen Controller with Programmable
Pre-Processing, SPI Interface, 1.6V to 3.6V in CSP
4-Wire Touch Screen Controller with Pre-Processing,
I2C Interface, 1.2V to 3.6V in CSP with Integrated Audio
Converters
Programmable 4-Wire Touch Screen Controller with
Stereo Audio Codec and Headphone/Speaker Amplifier
Programmable 4-Wire Touch Screen Controller with 6
Audio Inputs, Stereo Audio Codec and
Headphone/Speaker Amplifier
Texas Instruments 2008
High-Performance Analog
71
Solutions for Handsets
OLED and TFT Display Supply
DC/DC Converter and LDO
Device
Description
TPS61045
TPS61140
28-V, 0.4-A Switch Boost Converter for OLED
Dual-Output, Single Inductor Boost Converter for OLED
Sub- and WLED Main Display
27-V, 1.2-A Switch Boost Converter with Integrated
Power Diode
4-Channel Small Form Factor TFT Display Power Supply
Dual ±Output Driver for Active-Matrix OLED Displays
Device
TPS62270
TPS61081
TPS65120
TPS65130
White LED and Xenon Camera Flash
Device
TPS61050
TPS65560
TCA6507
Description
1.2-A High Power White LED Flashlight Driver with I2C
Integrated Photo Flash Charger and IGBT Driver for
Xenon Lamps
7-Bit, I2C and SMBus LED Driver with Intensity Control
and Shutdown
White LED Backlight Driver
Device
TPS60250
TPS61161
TPS61150
TPS75103
Description
Charge Pump for 7 WLEDs with 2 or 3 Banks and I2C
Interface
Inductive Boost Converter for 6-10 White LEDs with Digital
or PWM Dimming
Dual-Output, Single Inductor Boost Converter for up to 12
WLEDs
LDO-Based 2 x 2 Bank LED Driver with PWM Brightness
Control
Multi-Channel Power Management
Device
Description
TPS65020
6-Channel Power Mgmt IC with I2C for Li-Ion Powered
Systems
5-Channel Power Mgmt IC with GPIO control for Li-Ion
Powered Systems
9-Channel Fully Integrated Power Mgmt IC with Li-Ion
Charger for Li-Ion powered systems
Partner Products
Power Management IC for USB-OTG in CSP
USB 2.0 High-Speed On-the-Go Local Bus Interface Bridge
Controller
TPS65053
TPS65820
TPS65030
TUSB6010
Texas Instruments 2008
Description
400-mA, 2.25-MHz Step-Down Converter with
Selectable VOUT (2-Level) for DVS
TPS62400
400-mA and 600-mA Dual Output Step-Down Converter
with GPIO Interface for DVS
TPS62290
1000-mA Step-Down Converter in 2mm x 2mm SON
Package
TPS62356
1000-mA, 3-MHz Step-Down Converter with I2C for
Dynamic Voltage Scaling (DVS)
TPS63000
96% Efficient, 1.2-A Buck-Boost Converter in 3 x 3 QFN
TPS71701
150-mA, High-Bandwidth PSRR LDO in 1.5mm x 1.5mm
SON
TPS71918-12 2 x 200-mA Dual Output, High PSRR LDO in 2mm x 2mm
SON
TPS728185315 200-mA LDO with Dual Switchable Voltage Level
for DVS
TPS3808
Low Quiescent Current, Programmable-Delay
Supervisory Circuit (SVS)
Battery Management and Authentication
Device
bq24020
bq24070
bq26150
bq27500
bq24300
TLV3012
Description
1-Cell Li-Ion Fully Integrated Charger for AC/DC Adapter
and USB
Single-Chip Charge and System Power-Path
Management IC
CRC-Based Battery Authentication IC
System-Side, Impedance Track™ Fuel Gauge for Li-Ion
Powered Systems
Charger Front End Protection IC with 30-V Max VIN and
5.5-V LDO Output in 2 x 2 QFN
Low Battery Detector with 6µs Comparator and 1.242-V
1% Reference
Linear and Logic
Device
TXB0102/4
Description
2/4 - Bit Bidirectional Voltage-Level Translator with Auto
Direction Sensing and ±15-kV ESD Protection
TS3A24157
0.65 Ω Dual SPDT Analog Switch Dual-Channel 2:1
Multiplexer/Demultiplexer
TS3USB30
High-Speed USB 2.0 (480-Mbps) 1:2
Multiplexer/Demultiplexer Switch
TCA6408
Low-Voltage 8-Bit I2C and SMBus I/O Expander
SN74AUPIGxx Advanced Ultra-Low Power CMOS Single-Gate Logic
Wireless Handsets Solutions Guide
Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. Customers are advised to obtain the most
current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of
patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
The platform bar, OMAP, OMAP-Vox, LoCosto, TMS320C55x, TMS320C54x, MicroStar BGA, Auto-Band, DRP, M-Shield, SmartReflex, BlueLink, WiLink, NaviLink, FlatLink, ELP, Hollywood, IVA and VLYNQ are trademarks of
Texas Instruments. The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc., and any use of such marks by Texas Instruments is under license. All other trademarks are property of their
respective owners.
© 2008 Texas Instruments Incorporated
Printed Etheridge Printing, Dallas, Texas USA
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