DMC | TSC-34/U-L | Specifications | DMC TSC-34/U-L Specifications

TENTATIVE DOCUMENT
Analog Resistive Touch Screen Controller
TSC-40/IC product specification
TSC-40/IC Product Specification
Table of Contents
1. PRODUCTS OUTLINE ............................................................................................................. 2
1-1. Scope of Application ........................................................................................................................2
1-2. Outline ...............................................................................................................................................2
1-3. Features ............................................................................................................................................2
1-4. General specification ........................................................................................................................3
2. Pin layout and representation................................................................................................ 4
3. Pin functions............................................................................................................................ 5
4. Initial setting ............................................................................................................................ 7
4-1. EEPROM setting ..............................................................................................................................7
4-2. Touch screen mode setting.............................................................................................................7
4-3. Power supply voltage setting ..........................................................................................................7
5. Data sheet ................................................................................................................................ 8
5-1. Absolute maximum rating ................................................................................................................8
5-2. Recommended operational conditions.............................................................................................9
5-3. Timing requirement.........................................................................................................................10
5-4. DC standards..................................................................................................................................11
6. Packaging Specification ....................................................................................................... 12
6-1. Outline .............................................................................................................................................12
6-2. Notes on storage/handling .............................................................................................................12
6-3. Basic packaging .............................................................................................................................12
6-4. Small group packaging ..................................................................................................................13
6-5. Tray specification............................................................................................................................14
6-6. Product name label specification ..................................................................................................14
7. Storage Specification............................................................................................................ 15
7-1. Storage Conditions .........................................................................................................................15
7-2. Baking .............................................................................................................................................15
8. Implementation Temperature Specification ....................................................................... 16
9. Cleaning ................................................................................................................................. 17
10. Changes and improvements .............................................................................................. 18
10-1. Version history..............................................................................................................................18
11. Warranty ............................................................................................................................... 19
11-1. Warranty Period............................................................................................................................19
11-2. Warranty Target............................................................................................................................19
11-3. Warranty Exceptions.....................................................................................................................19
12. Notes on use ........................................................................................................................ 20
12-1. Overall handling............................................................................................................................20
12-2. Others............................................................................................................................................20
Dimensional Drawing
Circuit Diagram
1
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
1. PRODUCTS OUTLINE
1-1. Scope of Application
This specification applies to the TSC-40/IC.
1-2. Outline
TSC-40/IC is an analog touch screen control IC that performs A/D conversion on analog signal for the
4-wire and 5-wire resistive analog touch screen, and transmits coordination data with 10bit resolution to
the host in a 9600bps serial (asynchronous).
The serial communication enables a connection with PC’s serial port via RS-232C I/F circuit or TTL level.
At the coordinate detection, internal filtering process provides a stabilized coordinate value. By using the
correction function, in addition to the losses that occur in the circuit, display deflection between touch
screen input point that occur in each element and indicator cursor can be corrected to adjust the display
position.
1-3. Features
§
Two coordinate output modes are provided and selected per application: “Coordinate data mode”
where coordinate information is sent with 10bit resolution as it is, and “correction data mode” where
read coordinate is converted to the indicator’s display coordinate and sent.
§
“Correction data mode“ is available after EEPROM is externally attached. It enables to set up to nine
correction points. Coordinate data can be corrected with the base of correction points. Using this
function allows the host driver to make the implementation of correction function unnecessary. In
addition, by placing correction points at the touch screen center and center points of four edges of
touch screen, resistance value deviation of transparent electrode film can be corrected.
§
Two external switch functions are always available in the coordinate (correction) data mode. Two
pieces of external switch information are, at the transmission of coordinate data, included in the
coordinate data as pen-down/pen-up information. Since in the pen-up mode, pen-up data can be
always output to the host, this switch is available as a function switch.
§
At the touch screen input, buzzer and LED outputs are available. Input confirmation via display and
sound is available.
§
When no touch screen input is performed, the state moves to “power-save mode“ so that such
application can be supported that requests a low power consumption.
§
Seven types of coordinate output rates are provided and either can be selected per application among
seven types: six types from 30 to 150p/s plus one type, a point mode that outputs the coordinate only
one time when pen-down is performed.
2
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
1-4. General specification
Item
Rating
Power supply voltage
DC 2.4V to 5.5V
Power consumption
29.5mW (standard)
Operating Temp
Temperature range at storing
Communication
scheme
Notes
-20 ˚C to +85 ˚C
(No dew condensation)
-40 ˚C to +125 ˚C
(No dew condensation)
Communication scheme
Asynchronous, serial
Communication rate
9600bps
Data length
8bits
Stop bit
1bit
Parity
None
Each setting is fixed
Operation frequency
6MHz
Fixed to 6MHz
Coordinate output rate (point / second)
(1) Point mode
(2) 30p/s
(3) 50p/s
(4) 80p/s
(5) 100p/s
(6) 130p/s
(7) 150p/s
Point Mode: Only when touch screen is
input, pen-down ID is sent once. After
input ends, no pen-up ID is sent.
Linearity error
±3 LSB
Input response time
-
-
Coordinate resolution
10bit (1024×1024)
In the correction data function,
resolution follows the setting value
Dimension (mm)
9×9×1.7
3
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
THI
THO
SXR/LR
SXL/UR
SYU/UL
SYD/LL
23
22
21
20
19
18
17
RxD_I
####
8
32
VCC
AN1
7
31
CNVSS
AN0
INDEX
6
30
RST
BEEP
xxx
5
29
VREF
SW0
4
28
EEP-DO
SW1
3
27
SEL1
TxD
TSC-40x
2
26
AN3
RxD
1
25
AN2
SEL0
24
2. Pin layout and representation
16
SEL4/EEP-CS
15
SEL3/EEP-CLK
14
SEL2/EEP-DI
13
LED1
12
P30
11
VSS
10
XOUT
9
XIN
Marking specification
TSC-40x
Product number x: version number
xxx
ROM number
####
Lot number
4
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
3. Pin functions
Pin
number
Pin name
I/O
1
AN2
I/O
Touch screen XL/UR input pin.
2
AN3
I/O
Touch screen XR/LL input pin.
3
SEL1
I
Transition select pin.
H = Auto transition*1 after reset. L = transition by command.
4
EEP-DO
I
EEPROM DO input pin; At using no EEPROM, Vcc or GND is connected.
5
VREF
I
A/D converter reference voltage input pin; Vcc is connected.
6
RST
I
Reset input pin (active L).
7
CNVSS
I
Operation mode control pin; Vss is connected.
8
VCC
I
Power supply input pin; Vcc is connected.
Functional description
9
XIN
I
Clock input pin; When using external clock, clock is input to this pin.
10
XOUT
O
Clock output pin; When using external clock, this pin is opened.
11
VSS
I
Power supply input pin (GND); GND is connected.
12
P30
O
Opened*2.
13
LED1
O
LED output pin; ON = Lo, OFF = Hi.
14*3
SEL2/EEP-DI
I/O
15*3
SEL3/EEP-CLK
I/O
16*3
SEL4/EEP-CS
I/O
17
EEPROM DI signal output pin; When using EEPROM, EEPROM DI is connected.
Whether or not EEPROM is used, connect with GND via resistance.
EEPROM SK signal output pin; When using EEPROM, EEPROM SK is connected.
Touch screen mode setting pin. (L=4-wire, H=5-wire)
Whether or not EEPROM is used, connect with Vcc or GND via resistance.
EEPROM setting pin shared with EEPROM CS signal output pin.
EEPROM is set via resistance and Vcc or GND is connected. (L = Used, H = Not
used).
When using EEPROM, EEPROM CS is connected.
O
Unused pin; Opened.
SYD/LL
O
Touch screen LL control pin.
19
SYU/UL
O
Touch screen UL control pin.
20
SXL/UR
O
Touch screen UR control pin.
21
SXR/LR
O
Touch screen LR control pin.
22
THO
O
Touch screen control pin.
23
THI
I
Touch screen control pin.
24
RxD_I
I
Touch screen control pin; In serial mode, RxD is connected.
25
SEL0
I
If power supply voltage is 4.0 to 5.5V, GND is connected. If power supply voltage is
2.4 to 4.0V, Vcc is connected.
26
RxD
I/O
27
TxD
I/O
28
SW1
I
SW1 input pin *4; H = ON = 1, L = OFF = 0.
29
SW0
I
SW0 input pin *4; H = ON = 1, L = OFF = 0.
30
BEEP
O
BEEP output pin; Hi output; Output frequency =2.5kHz, Output time =50ms.
31
AN0
I
Touch screen YD/LL input pin.
32
AN1
I
Touch screen YU/Sense input pin.
18
Data receive pin.
Data send pin.
5
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
*1:
Auto transition = Mode changes by a command are not performed. It becomes a “Coordinate Data
Mode (150pps)” immediately after reset.
*2:
Always open. If connected with VCC, VSS, or other circuit, an error operation may occur.
*3:
About pin number 14, 15 and 16, immediately after a power supply injection, it works as an input
terminal and becomes an output terminal after that. Do not open these terminals.
*4:
If neither SW0 nor SW1 function is used, connect 28 and 29 pins to GND directly.
6
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
4. Initial setting
4-1. EEPROM setting
Depending on that calibration is performed in either TSC-40/IC or host, you can select whether EEPROM
is used or not to store the correction data. EEPROM selection can be set via pin number 16, where
hardware reset release enables the setting.
(TSC-40/IC)
VCC
(EEPROM)
H= Not used
SEL4/EEP-CS
L= Used
CS
4-2. Touch screen mode setting
Touch screen mode setting for 4-wire/5-wire is performed by setting pin number 15 to “H” or “L”. When
power supply is turned on, or hardware reset is released, pin number 15 is read to turn on in either
4-wire/5-wire mode.
Mode
Pin number 15
4-wire touch screen
GND
5-wire touch screen
Vcc
4-3. Power supply voltage setting
Power supply mode setting for 3.3V/5V is performed by setting pin number 25 to “H” or “L”. When power
supply is turned on, or hardware reset is released, pin number 25 is read to turn on in either 3.3V mode/5V
mode.
Power supply voltage
Mode
Pin number 25
2.4 to 4.0V
3.3V mode
Vcc
4.0 to 5.5V
5V mode
GND
*When you operate it with 3.3V mode, the inside frequency of CPU works at 3MHz, and the sampling rate
is 80pps max in calibration data mode.
7
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
5. Data sheet
5-1. Absolute maximum rating
Item
Power supply voltage
Symbol
VCC
Rating
Minimum
Maximum
-0.3
6.5
Unit
V
Input voltage
VI
-0.3
Vcc+0.3
V
Output voltage
VO
-0.3
Vcc+0.3
V
Power consumption
PD
200
mW
Operation temperature
TOPR
-20
+85
˚C
Storage temperature
TSTG
-40
+125
˚C
8
Description
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
5-2. Recommended operational conditions
(Vcc=2.4 to 5.5V, Vss=0V, Ta=-20 to 85˚C, unless otherwise noted)
Item
Rating
Symbol
Unit
Minimum
Standard
Maximum
2.4
5.0
5.5
Power supply voltage
VCC
Power supply voltage
VSS
Analog reference voltage
VREF
1.8
VCC
V
VIH
0.8VCC
VCC
V
VIH
2.0
Vcc
V
VIH
0.8VCC
VCC
V
VIL
0
0.2VCC
V
VIL
0
0.8
V
VIL
0
0.2VCC
V
VIL
0
0.16VCC
V
ΣIOH (peak)
-80
mA
ΣIOL (peak)
80
mA
ΣIOL (peak)
80
mA
ΣIOH (avg)
-40
mA
ΣIOL (avg)
40
mA
ΣIOL (avg)
40
mA
IOH (peak)
-10
mA
IOH (peak)
10
mA
IOH (avg)
-5
mA
IOL (avg)
5
mA
XIN
6.0
MHz
“H” input voltage
(Pin number 1 - 4, 12 - 32)
0
Description
V
V
“H” input voltage *1
(TTL input level selected)
(Pin number 17, 26, 28, 29)
“H” input voltage
RST, XIN
“L” input voltage
(Pin number 1 - 4, 12 - 32)
“L” input voltage *1
(TTL input level selected)
(Pin number 17, 26, 28, 29)
“L” input voltage
RST, CNVSS
“L” input voltage
XIN
“H” total peak output current *2
(Pin number 1 - 4, 12 - 32)
“L” total peak output current *2
(Pin number 1 -4, 26 - 32)
“L” total peak output current *2
(Pin number 12 - 25)
“H” total average output current*2
(Pin number 1 - 4, 12 - 32)
“L” total average output current*2
(Pin number 1 - 4, 26 - 32)
“L” total average output current*2
(pin number 12 - 25)
“H” peak output current *3
(Pin number 1 - 4, 12 - 32)
“L” peak output current *3
(Pin number 1 - 4, 12 - 32)
“H” average output current *4
(Pin number 1 - 4, 12 - 32)
“L” average output current *4
(Pin number 1 - 4, 12 - 32)
Vibration frequency
*1 Vcc = 4.0 to 5.5V
*2 The total output current is the sum of all the currents flowing through all the applicable ports. The total
average current is an average value measured over 100ms. The total peak current is the peak value of
all the currents.
*3 The peak output current is the peak current flowing in each port.
*4 The average output current IOL(avg), IOH(avg) in an average value measured over 100ms.
*5 When the oscillation frequency has a duty cycle of 50%.
9
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
5-3. Timing requirement
§
Reset
(Vcc = 2.4 to 5.5V , Vss = 0V , Ta = -20 to 85°C)
Item
Symbol
RST L width
tw
Rating
Minimum
Maximum
2
Unit
Description
μs
tw
RST
0.8Vcc
0.8Vcc
0.2Vcc
§
0.2Vcc
External clock timing
Rating
Item
Symbol
Input cycle
Clock pulse width
tC
tWH, tWL
Minimum
Maximum
166
70
Unit
Description
ns
ns
Clock frequency: Fixed to 6MHz
tC
tWH
tWL
0.8VCC
0.2VCC
XIN
§
Clock input circuit
Using ceramic vibrator
External clock input circuit
CIN
XIN
XIN
XOUT
Open
XOUT
COUT
10
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
5-4. DC standards
(Vcc=2.4 to 5.5V, Vss=0V, Ta=-20 to 85˚C, unless otherwise noted)
Item
Symbol
Rating
Condition
Minimum
IOH = -5mA
Output “H” voltage *1
(Pin number 1-4, 12-32)
VOH
Vcc = 4.0 to 5.5V
IOH = -1.0mA
Vcc = 2.4 to 5.5V
Standard
Vcc-1.5
V
Vcc-1.0
IOL = 5mA
1.5
VCC = 4.0 to 5.5V
Output “L” voltage *1
(Pin number1-4, 12-32)
VOL
IOL = 1.5mA
0.3
VCC = 4.0 to 5.5V
IOL = 1.0mA
IOL = 15mA
(Pin number. 12 - 16)
VOL
VCC = 4.1 to 5.5V
IOL = 1.5mA
VCC = 4.1 to 5.5V
Hysteresis
(Pin number 12, 15, 17-26, 30)
Hysteresis
(Pin number 26, 28)
Hysteresis
(Pin number 6)
Input “H” current
(Pin number 1-4, 12-32)
Input “H” current
(Pin number 6)
Input “H” current
(Pin number 9)
Input “L” current
(Pin number 1-4, 12-32)
Input “L” current
(Pin number 6)
Input “L” current
(Pin number 9)
Power supply current
V
1.0
VCC = 2.4 to 5.5V
Output “L” voltage
Unit
Maximum
2.0
V
0.3
V
VT+ - VT-
0.4
V
VT+ - VT-
0.5
V
VT+ - VT-
0.5
V
IIH
VI = VCC
5.0
μA
IIH
VI = VCC
5.0
μA
IIH
VI = VCC
IIL
VI = VSS
-5.0
μA
IIL
VI = VSS
-5.0
μA
IIL
VI = VSS
-4.0
Icc
STOP mode
0.1
11
4.0
μA
μA
1.0
uA
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
6. Packaging Specification
6-1. Outline
With a basic packaging unit of 2000, TSC-40/IC is packaged for the number of 2000 and its multiple using
damp-proof aluminum laminate bags (Basic packaging). If the delivery quantity is less than 2000 or not
multiple of 2000, or the product can not be packaged with a unit of 2000, then no damp-proof packaging
specification is applicable (Small group packaging).
If packaged with small group packaging, the products may be dampened. Before packaging, the product
shall take the baking process as specified in [Baking] defined in “TSC-40/IC Storage/Implementation
Specification”.
6-2. Notes on storage/handling
(1) Handle the packages with care and avoid throwing and dropping them. Or, a large impact may be
imposed, causing packaging material’s damage, broken package or bending lead.
(2) Cardboard box may be deteriorated in its strength and deformed due to storage site’s humidity,
stacking condition and storage duration. It is desirable to keep the storage under normal
temperature/humidity (5 to 35 °C, 45 to 75%RH). For warehousing, follow the FIFO principle.
(3) After unpacking, be careful in handling the product to avoid electrostatic breakdown.
6-3. Basic packaging
6-3-1. Packaging type
Damp-proof packaging (Aluminum laminate bag)
6-3-2. Packaging quantity specification
Quantity per tray
Number of trays
250
8 + 1(cover)
Desiccant
Quantity per packages
2000
Tray
Product name label
Aluminum laminate bag
Humidity indicator
Packaging label
Packaging label
Product name
label
Packaging box
12
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
6-3-3. Diagram for packaging box sizes
L: 330 W: 152 D: 75 (mm)
6-4. Small group packaging
6-4-1. Packaging type
General packaging (No damp-proof processing)
6-4-2. Packaging quantity specification
Quantity per tray
Number of trays
250
1 to 8 +1(cover)
Desiccant
Quantity per packages
1 - 1999
Number of trays: 1 to 8
(Additionally, one dummy tray pl
aced at the top for reinforcing)
Air cap
Product name label
Antistatic bag
* No sizes specified for packaging box (Cardboard
box) used for transportation.
13
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
6-5. Tray specification
This tray is heat-proof type, allowing the heating with 125 °C for 24 hours. During heating/cooling process,
however, bending may occur. In baking process, to minimize the bending, heat and cool the tray by placing
it on a flat plate.
6-6. Product name label specification
DMC P/N:
Product number (TSC-40/IC)
QTY:
Quantity
DAC:
DMC Control Number
14
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
7. Storage Specification
7-1. Storage Conditions
For storing the product until its implementation, it is recommended that the following storage conditions are
applied:
1. Before unpacking the damp-proof package (Aluminum laminate bag)
Temperature and humidity:
5 to 40 °C, 20 - 80%RH
Duration:
Two years or less
2. After unpacking the damp-proof package (Aluminum laminate bag)
For the storing duration after the damp-proof package is unpacked and before the implementation, it is
recommended that the following storage conditions is to be applied:
One week or less under the ambient condition:
30 °C, 70%RH or less
(2) Wave soldering method: One week or less under the ambient condition:
30 °C, 70%RH or less
(1) Reflow method:
3. Temporary storage after damp-proof package is unpacked
To store again temporarily the once unpacked and unused damp-proof package, it is recommended to
pack it again into another damp-proof bag with desiccant within a shorter time after opened (Around 10
minutes) as far as possible, and fold the bag’s opening, followed by sealing with adhesive material
such as adhesive tape, then store it under the following conditions:
Temperature, humidity:
5 to 40 °C, 20 - 80%RH
Duration:
One month or less
7-2. Baking
If any condition among those 1 to 3 listed below is applicable, it is recommended to apply the baking as
described below to dry the moisture the package absorbs.
You may place the tray used for damp-proof packaging directly into the thermostatic chamber since the
tray is heat-proof type. When placing into the chamber or after removing from it, to avoid deformation, cool
the tray by placing it on the flat plate such as surface table.
1. Any condition among 1 to 3 in [7-1. Storage condition] is unsatisfied
2. Indicator’s 30% Humidity Check section changes the color to lavender or pink
3. Blue color indicator of desiccant (Silica gel) changes to pink or white
Baking method
Temperature:
125 °C
Duration:
20 to 24 hours
Frequency:
Four times or less (Upper limit: 96 accumulative hours)
15
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
8. Implementation Temperature Specification
1. Reflow method (Infrared reflow, air reflow)
Frequency:
Three times or less
Temperature:
The following device surface temperature profile is recommended.
260 °C max.
Package’s surface temperature
255 °C or higher, 10-16s max.
220 °C or higher, 60s max.
175±15 °C
1 to 4 °C/s
110±30s
Time
Figure 1:
Infrared reflow, air reflow temperature profile
2. Wave soldering method (Flow soldering, solder dip method)
Frequency:
One time or less
Temperature:
Following temperature profile is recommended (Set the optimal preheat temperature
according to the flux type)
Temperature
10s max. (Primary + Secondary flow
passage duration)
260 °C max.
80 to 150 °C (Package surface temperature)
Time
Figure 2:
Wave soldering temperature profile
3. Soldering iron (Manual soldering)
Soldering bit’s temperature:
Soldering time:
370 °C or lower
Five seconds or less/terminal
16
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
9. Cleaning
In case of cleaning boards with solvents after soldering, following items should be taken attention.
*Administrative guidance and regulation.
*Residual ionic (non ionic) contamination.
*Solvent resistance of parts.
17
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
10. Changes and improvements
10-1. Version history
§
TSC-40/IC
Ver0.1 (October 3, 2007)
Draft release
Ver0.2 (December 10, 2007)
5-3. Timing requirement
External clock timing
Clerk mistake was corrected.
Input cycle 500ns → 166ns
Clock pulse 200ns → 70ns
6-6. Product name label specification
“Pb Free” was added.
18
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
11. Warranty
11-1. Warranty Period
§ The warranty period is limited to 1 year from the date of shipping. The warranty for the initial defection
such as appearance defection is limited to 1 month.
§ Any defected parts under proper use will be examined by the supplier and replaced by the new parts if
the defection is considered to be caused by the supplier.
§ The replacement is subject to be included in the next lot.
11-2. Warranty Target
§ The warranty only covers the product itself and does not cover any damage to others caused by using
this product. Onsite repair or replacement is not supported.
§ We will do our best for delivery problem and product defections, but the warranty for the production line
is not covered.
11-3. Warranty Exceptions
Following conditions are not covered with the warranty and subject to charge.
§ Any malfunctions and damages during transportation and transfer by the user.
§ Any malfunctions and damages caused by a natural disaster or a fire.
§ Any malfunctions and damages caused by static electricity
§ Any malfunctions and damages caused by the failure of the associated equipment.
§ If the product is remodeled, disassembled or repaired by the user.
§ If the product is glued onto the equipment and uninstalled.
§ Any malfunctions and damages caused by an improper usage and handling against the specifications
and notes.
19
Version 0.2 ©2007 DMC Co., Ltd.
TSC-40/IC Product Specification
12. Notes on use
12-1. Overall handling
§ When using the product, do not place it close to, or make it contact with, the conductive materials such
as metal.
§ Do not touch the metal part in the product directly with your hands. Or, it may be destructed by the static
electricity. If you contact, or may contact, it directly with your hand, prepare in advance the measure
against static electricity.
§ To store the product, use an appropriate packing box and keep the storage temperature range with no
overload on it.
§ In using the product or storing it, avoid the following conditions:
- Conditions where water is, or may be, attached to the product.
- Conditions where condensation takes place, or may take place.
- In the ambience of organic solvent or acidity or contact, or where the product contacts them.
§ Do not alter or disassemble the product.
12-2. Others
§ This specification may be changed for improvement without prior notices.
§ No liabilities are taken by us for any damage caused by use of this product.
§ This product intends to be used for the standard applications (e.g. office equipment and OA devices,
industrial use, communication devices, household equipment). Avoid its use where failure or malfunction
directly may affect the human body or special applications where extremely high reliability is required
(e.g. airline and space industries, nuclear controls, medical use for life-sustaining).
§ Semi-conductor devices may fail in a certain possibility. Keep the safety design in your mind so that
possible failure in this product shall not cause physical accidents such as injury and death, fire and other
social damages.
TSC-40/IC Product Specification
Version 0.2: Issued at December 10, 2007
©2007 DMC Co., Ltd.
This document is allowed to redistribute but no alteration, part or all, is prohibited.
http://www.dmccoltd.com/english/
9F Kanda Sent-Building 1-2-4, Yushima, Bunkyo-ku, Tokyo, 113-0034 Japan
Phone: +81-3-5209-7131 (Japanese), 7135 (English) Fax: +82-3-5209-7130
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Version 0.2 ©2007 DMC Co., Ltd.
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