NXP BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Data Sheet

BGA7124

400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier

Rev. 3 — 9 September 2010 Product data sheet

1.1 General description

The BGA7124 MMIC is a one-stage amplifier, available in a low-cost leadless surface-mount package. It delivers 25 dBm output power at 1 dB gain compression and superior performance up to 2700 MHz. Its power saving features include easy quiescent current adjustment enabling class-AB operation and logic-level shutdown control to reduce the supply current to 4

μA.

1.2 Features and benefits

400 MHz to 2700 MHz frequency operating range

16 dB small signal gain at 2 GHz

25 dBm output power at 1 dB gain compression

Integrated active biasing

External matching allows broad application optimization of the electrical performance

3.3 V or 5 V single supply operation

All pins ESD protected

1.3 Applications

Wireless infrastructure (base station, repeater, backhaul systems)

Broadband CPE/MoCA

Industrial applications

E-metering

Satellite Master Antenna TV (SMATV)

WLAN/ISM/RFID

1.4 Quick reference data

Table 1.

Quick reference data

Input and output impedances matched to 50

Ω

, SHDN = HIGH (shutdown disabled). Typical values at V

CC

= 5 V; I

CC

= 130 mA; T case

= 25

°

C; unless otherwise specified.

Symbol Parameter Conditions f

I

CC supply current frequency

V

CC

= 5.0 V

Min Typ Max Unit

[1]

50 170 mA

[2]

400 2700 MHz

G p

P

L(1dB)

IP3

O power gain f = 2140 MHz 14.5 16 17.5

dB output power at 1 dB gain compression f = 2140 MHz output third-order intercept point

23.5 24.5 f = 2140 MHz

[3]

34.5 37.5 dBm dBm

[1] The supply current is adjustable; see

Section 8.1 “Supply current adjustment”

.

[2] Operation outside this range is possible but not guaranteed.

[3] P

L

= 11 dBm per tone; spacing = 1 MHz.

NXP Semiconductors

BGA7124


2.1 Pinning terminal 1 index area n.c.

1

V

CC(RF)

2

V

CC(RF)

3 n.c.

4

BGA7124

GND PAD

014aab046

Transparent top view

Fig 1.

HVSON8 package pin configuration

8 ICQ_ADJ

7 RF_IN

6 SHDN

5 V

CC(BIAS)

2.2 Pin description

Table 2.

Pin description

Symbol Pin Description n.c.

V

CC(RF)

1, 4

2, 3 not connected

RF output for the power amplifier and DC supply input for the

RF transistor collector [1] bias supply voltage [2]

V

CC(BIAS)

SHDN

RF_IN

5

6

7 shutdown control function enabled/disabled

RF input for the power amplifier

[1]

ICQ_ADJ 8

GND quiescent collector current adjustment controlled by an external resistor

GND pad

RF and DC ground [3]

[1] This pin is DC-coupled and requires an external DC-blocking capacitor.

[2] RF decoupled.

[3] The center metal base of the SOT908-1 also functions as heatsink for the power amplifier.

Table 3.

Ordering information

Type number Package

BGA7124

Name

HVSON8

Description plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3

× 3 × 0.85 mm

Version

SOT908-1

BGA7124

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 9 September 2010

© NXP B.V. 2010. All rights reserved.

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BGA7124


SHDN 6

V

CC(BIAS)

5

BIAS

ENABLE

ICQ_ADJ

8

BANDGAP

V/I

CONVERTER

R2

R1

V

CC

INPUT MATCH

RF_IN 7 2, 3

V

CC(RF)

OUTPUT MATCH

RF_OUT

GND

014aab047

Fig 2.

Functional diagram

Table 4.

Shutdown control settings

Mode Mode description Function description

Idle

TX medium power MMIC fully off; minimal supply current shutdown control enabled medium power MMIC transmit mode shutdown control disabled

Pin

SHDN

0

1

V ctrl(sd)

Min

0

(V)

Max

0.7

2.5

V

CC(BIAS)

-

I ctrl(sd)

(

μA)

Min Max

2

9

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Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V

CC(RF)

V

CC(BIAS)

I

CC

V ctrl(sd)

P i(RF)

T case

T j

V

ESD

Parameter

RF supply voltage bias supply voltage supply current shutdown control voltage

RF input power case temperature junction temperature

Conditions electrostatic discharge voltage Human Body Model (HBM);

According JEDEC standard 22-A114E

Charged Device Model (CDM);

According JEDEC standard 22-C101B

[1]

-

[1]

-

-

-

-

Min Max

6.0

6.0

[1][2]

50

[3]

200

0.0

V

CC(BIAS)

20

−40

+85

150

2000

500

Unit

V

V mA

V dBm

°C

°C

V

V

[1] See

Figure 3 for safe operating area.



.

[3] If V ctrl(sd)

exceeds V

CC(BIAS)

, the internal ESD circuit can be damaged. To prevent this, it is recommended that the I ctrl(sd)

is limited to

20 mA. If the SHDN function is not used, the SHDN pin should be connected to the V

CC(BIAS)

pin.

014aab048

250

I

CC

(mA)

200

150

100

50

2 3 4 5 6

V

CC(RF)

(V)

7

Exceeding the safe operating area limits may cause serious damage to the product.

The impact on I

CC

due to the spread of the external ICQ resistor (R2) should be taken into account.

The product-spread on I

CC

should be taken into account (see

Section 8 “Static characteristics” ).

Fig 3.

BGA7124 DC safe operating area

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Table 6.

Thermal characteristics

Symbol Parameter

R th(j-mb) thermal resistance from junction to mounting base

Conditions

I

T case

CC

= 85

°C; V

= 130 mA

CC

= 5 V;

[1] defined as thermal resistance from junction to GND paddle.

Typ Max Unit

[1]

32 K/W

Table 7.

Characteristics


Ω

, pin SHDN = HIGH (shutdown disabled). Typical values at V

CC

= 3.3 V or V

CC

= 5 V; T case

= 25

°

C; unless otherwise specified.

Symbol Parameter Conditions

I

CC supply current V

CC

= 3.3 V

R1 = 0

Ω; R2 = 1330 Ω

R1 = 2.2

Ω; R2 = 1070 Ω

V

CC

= 5.0 V

R1 = 0

Ω; R2 = 1960 Ω

R1 = 2.2

Ω; R2 = 1650 Ω during shutdown; pin

SHDN = LOW (shutdown enabled)

Min Typ Max Unit

[1]

50 200 mA

[2]

115 130 145 mA

[2]

135 160 185 mA

[1]

50

[2]

110

-

130

170

150 mA mA

[2]

-

125 150 175 mA

4 6

μA



.

[2] See

Section 12 “Application information”

.

8.1 Supply current adjustment

The supply current can be adjusted by changing the value of external ICQ resistor (R2);

(see Figure 4

).

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170

I

CC

(mA)

130

90

V

CC

= 5 V; R1 = 0

014aab049

50

1.6

2.0

2.4

2.8

3.2

3.6

4.0

R2 (k

Ω)

4.4

a. 5 V supply voltage.

Fig 4.

Supply current as a function of the value of R2

V

CC

= 3.3 V; R1 = 0

014aab050

200

I

CC

(mA)

170

140

110

80

50

0.9

1.4

1.9

b. 3.3 V supply voltage

2.4

2.9

R2 (k

Ω)

3.4

Table 8.

Characteristics at V

CC

= 5 V


Ω


I

CC

= 130 mA; T case

= 25

°

C; see

Section 12 “Application information”

; unless otherwise specified.

CC

= 5 V;

Symbol Parameter Conditions Min Typ Max Unit f frequency

[1]

400 2700 MHz

G p

P

L(1dB)

IP3

O

NF power gain for small signals f = 940 MHz f = 1960 MHz f = 2140 MHz f = 2445 MHz output power at 1 dB gain compression f = 940 MHz f = 1960 MHz f = 2140 MHz output third-order intercept point noise figure f = 2445 MHz f = 940 MHz f = 1960 MHz f = 2140 MHz f = 2445 MHz f = 940 MHz f = 1960 MHz f = 2140 MHz f = 2445 MHz

22.7

-

[2]

-

16.4

-

14.5

16.0

17.5

14.2

-

25.0

-

24.5

-

23.5

24.5

-

[2]

23.5

-

[3]

[3]

[3]

[2][3]

-

[4]

-

[4]

-

34.5

37.5

-

36.0

5.2

4.6

-

-

-

[4]

-

38.0

-

4.8

6.5

[2][4]

-

38.5

-

5.4

dBm dBm dBm dBm dBm dB dB dB dB dB dB dB dB dBm dBm dBm

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Table 8.


CC

= 5 V …continued


Ω


I

CC

= 130 mA; T case

= 25

°

C; see Section 12 “Application information” ; unless otherwise specified.

CC

= 5 V;

Symbol Parameter Conditions

RL in

RL out input return loss output return loss f = 940 MHz f = 1960 MHz f = 2140 MHz f = 2445 MHz f = 940 MHz f = 1960 MHz f = 2140 MHz f = 2445 MHz

[2]

[2]

-

-

-

-

-

-

-

-

Min Typ Max

−8

−12

−15

−25

−15

−11

−17

−13

-

-

-

-

-

-

-

-

Unit dB dB dB dB dB dB dB dB


[2] I

CC

= 150 mA; see


.

[3] P

L


[4] Defined at P i

=

−40 dBm; small signal conditions.

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Table 9.


CC

= 3.3 V


Ω


I

CC

= 130 mA; T case

= 25

°

C, see

Section 12 “Application information”

; unless otherwise specified.

CC

= 3.3 V; f

Symbol Parameter frequency

Conditions Min Typ Max Unit

[1]

400 2700 MHz

G p

P

L(1dB)

IP3

O

NF

RL in

RL out power gain for small signals f = 940 MHz f = 2445 MHz output power at 1 dB gain compression f = 940 MHz output third-order intercept point noise figure f = 2445 MHz f = 940 MHz f = 2445 MHz f = 940 MHz input return loss output return loss f = 2445 MHz f = 940 MHz f = 2445 MHz f = 940 MHz f = 2445 MHz

[2]

-

-

[2]

-

-

[3]

-

[2][3]

-

[4]

-

[2][4]

-

[2]

-

-

[2]

-

-

22.5

-

13.8

-

23.5

-

22.0

-

36.4

-

35.2

-

5.5

-

5.5

−15

-

−10

-

−9

−25

-

-

dB dB dBm dBm dBm dBm dB dB dB dB dB dB


[2] I

CC

= 160 mA; see


.

[3] P

L


[4] Defined at P i

=

−40 dBm; small signal conditions.

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9.1 Scattering parameters

1200

1300

1400

1500

1600

1700

1800

1900

500

600

700

800

900

1000

1100

2000

2100

2200

2300

2400

2500

2600

2700

Table 10.

Scattering parameters at 5 V, MMIC only

V

CC

= 5 V; I

CC

= 130 mA; T case

= 25

°

C.

f (MHz) s

11

Magnitude

(ratio)

Angle

(degree) s

21

Magnitude

(ratio)

Angle

(degree)

400 0.85

161.56

22.94

82.35

0.87

0.86

0.86

0.86

0.86

0.86

0.86

0.86

0.90

0.90

0.89

0.88

0.87

0.87

0.87

0.86

0.86

0.86

0.86

0.86

0.86

0.86

0.85

114.18

107.68

100.86

94.14

87.48

80.83

74.14

67.39

159.44

152.15

145.75

139.33

133.19

127.07

120.67

60.70

53.97

47.78

41.57

35.43

29.74

24.79

19.58

82.58

73.86

66.00

58.86

51.66

45.11

38.20

31.60

25.08

18.49

11.74

5.25

−1.50

−8.13

−14.94

−21.68

−28.68

−35.14

−41.70

−48.11

−54.19

−60.06

−66.14

5.19

4.82

4.51

4.23

3.99

3.77

3.56

3.37

11.82

9.98

8.59

7.55

6.74

6.14

5.61

3.19

3.02

2.85

2.69

2.54

2.39

2.27

2.15

0.03

0.03

0.03

0.03

0.03

0.03

0.03

0.03

0.03

0.04

0.04

0.04

0.02

0.02

0.02

0.02

0.02

0.02

0.02

s

12

Magnitude

(ratio)

0.01

0.01

0.01

0.01

0.02

14.00

11.25

7.99

4.20

0.31

−4.01

−8.65

−13.15

−18.16

−23.28

−28.54

−33.68

−39.37

−44.84

−50.27

−55.62

−60.71

−65.48

−70.66

Angle

(degree)

17.02

27.08

24.10

21.41

18.47

0.63

0.62

0.62

0.62

0.63

0.63

0.63

0.64

0.64

0.65

0.65

0.66

0.65

0.65

0.65

0.64

0.64

0.63

0.63

s

22

Magnitude

(ratio)

0.46

0.63

0.64

0.64

0.65

99.01

93.58

88.17

83.06

78.10

73.31

68.64

64.16

139.60

134.85

130.13

125.02

120.13

114.98

109.78

104.46

Angle

(degree)

−156.50

176.13

169.61

164.34

159.29

154.44

149.58

144.25

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Table 11.

Scattering parameters at 3.3 V, MMIC only

V

CC

= 3.3 V; I

CC

= 130 mA; T case

= 25

°

C.

f (MHz) s

11

Magnitude

(ratio)

Angle

(degree) s

21

Magnitude

(ratio)

Angle

(degree)

1100

1200

1300

1400

1500

1600

1700

1800

400

500

600

700

800

900

1000

1900

2000

2100

2200

2300

2400

2500

2600

2700

0.87

0.87

0.87

0.87

0.86

0.86

0.86

0.86

0.84

0.91

0.90

0.90

0.89

0.88

0.88

0.86

0.86

0.86

0.86

0.86

0.86

0.85

0.85

0.85

120.46

113.94

107.48

100.69

93.93

87.28

80.71

74.00

161.94

159.25

151.98

145.57

139.18

132.87

126.78

67.27

60.64

53.84

47.60

41.43

35.35

29.64

24.72

19.59

36.53

30.05

23.62

17.15

10.48

4.05

−2.66

−9.21

−15.97

−22.71

−29.68

−36.12

−42.66

−49.01

−55.12

−60.91

−66.91

73.81

79.01

70.71

63.37

56.54

49.74

43.30

5.39

4.97

4.62

4.32

4.05

3.81

3.61

3.40

21.25

11.56

9.67

8.29

7.26

6.48

5.90

3.22

3.05

2.89

2.72

2.57

2.42

2.28

2.16

2.04

10. Reliability information

Table 12.

Reliability

Life test Conditions

HTOL According JESD85; confidence level 60 %; T j

= 55

°C; activation energy = 0.7 eV; acceleration factor determined according Arrhenius

0.03

0.03

0.03

0.03

0.03

0.04

0.04

0.04

0.04

0.02

0.02

0.02

0.02

0.02

0.03

0.03

0.03

0.01

0.01

0.02

0.02

0.02

s

12

Magnitude

(ratio)

0.01

0.01

Angle

(degree)

17.66

28.15

24.80

21.89

19.04

15.35

11.89

8.33

4.50

0.35

−3.92

−8.62

−13.28

−18.26

−23.51

−28.87

−34.22

−39.95

−45.44

−51.06

−56.53

−61.72

−66.76

−71.84

144.88

140.03

135.35

130.48

125.46

120.31

115.13

109.99

Angle

(degree)

−154.41

178.05

171.32

165.59

160.37

155.28

150.23

104.66

99.36

93.93

88.55

83.38

78.44

73.56

68.80

64.30

0.63

0.64

0.64

0.64

0.65

0.65

0.66

0.66

0.67

0.66

0.65

0.65

0.64

0.64

0.64

0.64

0.64

0.66

0.66

0.66

0.66

0.66

s

22

Magnitude

(ratio)

0.57

0.65

Intrinsic failure rate

4

11. Moisture sensitivity

Table 13.

Moisture sensitivity level

Test methodology

JESD-22-A113

Class

1

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12. Application information

12.1 5 V applications

12.1.1 920 MHz to 960 MHz

V

CC

J3

C10

R1

C8

C7

C9

J1

50 Ω MSL1 C1 MSL2

C2

MSL3

RF_IN

V

CC(BIAS)

V

CC(RF)

MSL4

L1

MSL5

L2

MSL6

C3

MSL7

C4

C6 MSL8 50 Ω

J2

RF_OUT

C5

ICQ_ADJ

BGA7124

SHDN

R2

014aab051 enable

See

Table 14

for a list of components.

PCB board specification: Rogers RO4003C; Height = 0.508 mm;

ε r

= 3.38; Copper thickness = 35

μm.

Fig 5.

5 V/130 mA application schematic; 920 MHz to 960 MHz

014aab052

30

P

L(1dB)

(dBm)

28

28

G p

(dB)

26

26

(1)

(2) 24

24 (3) 22

(1)

(2)

(3)

014aab053

22 20

20

0.92

0.93

0.94

0.95

f (GHz)

0.96

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.

Fig 6.

Output power at 1 dB gain compression as a function of frequency

18

0.92

0.93

0.94

0.95

f (GHz)

0.96

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.

Fig 7.

Power gain as a function of frequency

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11 of 33


0

RL in

, RL out

, ISL

(dB)

−10

RL out

RL in

−20

014aab054

−30

0.92

0.93

ISL

0.94

T case

= 25

°C.

0.95

f (GHz)

0.96

Fig 8.

Input return loss, output return loss and isolation as a function of frequency

BGA7124


42

IP3

O

(dBm)

40

38

(1)

(2)

(3)

014aab055

36

0.92

0.93

0.94

0.95

f (GHz)

0.96

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.

Fig 9.

Output third-order intercept point as a function of frequency

J1

RF in

MSL1 C1

MSL2

C3

MSL3

C2

J I H G F E D C B A

C9

R1

C8

J2

C10

C7 MSL6 MSL7

L1

C4

L2

C5

1 2 3 4 5 6 7 8 9 10

MSL4 MSL5

11

12

13

C6 MSL8

RF out

R2

014aab056

See

Table 14


Fig 10. 5 V/130 mA application reference board; 920 MHz to 960 MHz

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Table 14.

5 V/130 mA application list of components; 920 MHz to 960 MHz

See

Figure 5

and Figure 10

for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35

μ m.

Component Description

C1, C6 capacitor

Value

68 pF

Function

DC blocking

Remarks

Murata GRM1885C1H680JA01D

J3

L1

L2

MSL1 [1]

MSL2 [1]

MSL3 [1]

MSL4 [1]

MSL5 [1]

MSL6 [1]

MSL7 [1]

MSL8 [1]

R1

R2

C2, C3

C4

C5

C7

C8

C9

C10

J1, J2 capacitor capacitor capacitor capacitor capacitor capacitor capacitor

RF connector

DC connector inductor inductor micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline resistor resistor

(trimmer)

3.3 pF

3.9 pF

1.0 pF

68 pF

100 nF

10

μF

12 pF

SMA input match output match output match

RF decoupling

Murata GRM1885C1H3R3CZ01D




DC decoupling

DC decoupling

AVX 0603YC104KAT2A

AVX 1206ZG106ZAT2A noise decoupling Murata GRM1555C1H120JZ01D

Emerson Network Power

142-0701-841

6-pins

2.2 nH output match

MOLEX

Tyco electronics 36501J2N2JTDG

22 nH DC feed

1.14 mm

× 0.8 mm × 10.95 mm input match

1.14 mm


1.14 mm


1.14 mm

× 0.8 mm × 23.4 mm output match

1.14 mm


Tyco electronics 36501J022JTDG

1.14 mm


1.14 mm


1.14 mm


0

Ω

2 k

Ω bias adjustment

Multicomp MC 0.063W 0603 0R

Bourns 3214W-1-202E

[1] MSL1 to MSL8 dimensions specified as Width (W), Spacing (S) and Length (L).

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12.1.2 1930 MHz to 1990 MHz

V

CC

J3

R1

C6

C5

C7

J1

50 Ω MSL1 C1 MSL2

C2

RF_IN

V

CC(BIAS)

V

CC(RF)

ICQ_ADJ

BGA7124

SHDN

R2

MSL3

L1

MSL4 MSL5 C4 MSL6 50 Ω

J2

RF_OUT

C3 enable

See

Table 15



ε r


μm.

Fig 11. 5 V/130 mA application schematic; 1930 MHz to 1990 MHz

014aab058

30

P

L(1dB)

(dBm)

28

20

G p

(dB)

18

26

(1)

(2)

16

(1)

(2)

(3)

24 14

014aab057

014aab059

(3)

22 12

20

1.93

1.95

1.97

f (GHz)

1.99

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.

Fig 12. Output power at 1 dB gain compression as a function of frequency

10

1.93

1.95

1.97

f (GHz)

1.99

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.

Fig 13. Power gain as a function of frequency

BGA7124





14 of 33


0

RL in

, RL out

, ISL

(dB)

−10 RL out

RL in

−20

ISL

−30

1.93

T case

= 25

°C.

1.95

014aab060

1.97

f (GHz)

1.99

Fig 14. Input return loss, output return loss and isolation as a function of frequency

BGA7124


40

IP3

O

(dBm)

38

36

(2)

(1)

(3)

014aab061

34

1.93

1.95

1.97

f (GHz)

1.99

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.

Fig 15. Output third-order intercept point as a function of frequency

J1

RF in

MSL1 C1 MSL2

C2

J I H G F E D C B A

C7

R1

C6

J2

C5 MSL4 MSL5

L1

MSL3

C3

1 2 3 4 5 6 7 8 9 10

11

12

13

C4 MSL6

RF out

R2

See

Table 15



BGA7124




014aab062


15 of 33


BGA7124


C2

C3

C5

C6

C7

J1, J2

J3

L1

MSL1 [1]

MSL2 [1]

MSL3 [1]

MSL4 [1]

MSL5 [1]

MSL6 [1]

R1

R2

Table 15.


See Figure 11

and Figure 16


μ m.


C1, C4 capacitor

Value

15 pF

Function

DC blocking

Remarks

Murata GRM1885C1H150JA01D capacitor capacitor capacitor capacitor capacitor

RF connector

2.2 pF

1.2 pF

15 pF

100 nF

10

μF

SMA input match output match

RF decoupling

DC decoupling

DC decoupling




AVX 0603YC104KAT2A

AVX 1206ZG106ZAT2A


142-0701-841

DC connector 6-pins MOLEX inductor 22 nH DC feed Tyco electronics 36501J022JTDG micro stripline micro stripline micro stripline micro stripline

1.14 mm


1.14 mm


1.14 mm

× 0.8 mm × 5.8 mm

1.14 mm

× 0.8 mm × 2.2 mm output match output match micro stripline micro stripline

1.14 mm


1.14 mm

× 0.8 mm × 10.95 mm output match resistor 0

Ω resistor (trimmer) 2 k

Ω bias adjustment


Bourns 3214W-1-202E


12.1.3 2110 MHz to 2170 MHz

V

CC

J3 R1

C6

C5

C7

J1

50 Ω MSL1 C1 MSL2

C2

RF_IN

V

CC(BIAS)

V

CC(RF)

ICQ_ADJ

BGA7124

SHDN

R2

MSL3

L1

MSL4

C3

MSL5 C4 MSL6 50 Ω

J2

RF_OUT enable

See

Table 16



ε r


μm.


014aab063

BGA7124





16 of 33


BGA7124


(1)

(2)

(3)

014aab064

20

G p

(dB)

18

16

14

12

(1)

(2)

(3)

014aab065

30

P

L(1dB)

(dBm)

28

26

24

22

20

2.11

2.13

2.15

f (GHz)

2.17

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


014aab066

0

RL in

, RL out

, ISL

(dB)

10

2.11

2.13

2.15

f (GHz)

2.17

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


40

IP3

O

(dBm)

014aab067

−10

38

−20

RL out

RL in

ISL

36

(3)

(2)

(1)

−30

2.11

T case

= 25

°C.

2.13

2.15

f (GHz)

2.17


34

2.11

2.13

2.15

f (GHz)

2.17

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


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17 of 33


BGA7124


J1

RF in

MSL1 C1 MSL2

C2

J I H G F E D C B A

C7

R1

C6

J2

C5 MSL4 MSL5

L1

MSL3

C3

1 2 3 4 5 6 7 8 9 10

11

12

13

C4 MSL6

RF out

R2

014aab068

See

Table 16



Table 16.


See Figure 17

and Figure 22


μ m.


C1, C4 capacitor

C2

C3 capacitor capacitor

C5

C6

C7

J1, J2

J3

L1

MSL1 [1]

MSL2 [1]

MSL3 [1]

MSL4 [1]

MSL5 [1]

capacitor capacitor capacitor

Value

15 pF

2.7 pF

1.5 pF

15 pF

100 nF

10

μF

RF connector SMA

Function

DC blocking input match output match

RF decoupling

DC decoupling

DC decoupling

DC connector 6-pins inductor 22 nH DC feed micro stripline 1.14 mm

× 0.8 mm × 10.95 mm input match micro stripline 1.14 mm

× 0.8 mm × 10.8 mm input match micro stripline 1.14 mm

× 0.8 mm × 5.8 mm micro stripline 1.14 mm

× 0.8 mm × 2.5 mm micro stripline 1.14 mm

× 0.8 mm × 3.5 mm output match output match output match

Remarks





AVX 0603YC104KAT2A

AVX 1206ZG106ZAT2A

Emerson Network Power 142-0701-841

MOLEX


BGA7124





18 of 33


BGA7124


Table 16.

5 V/130 mA application list of components; 2110 MHz to 2170 MHz …continued

See Figure 17 and Figure 22 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35

μ m.

Remarks Component Description

MSL6

R1

R2

[1]

Value Function micro stripline 1.14 mm

× 0.8 mm × 10.95 mm output match resistor 0

Ω resistor

(trimmer)

2 k

Ω bias adjustment


Bourns 3214W-1-202E


12.1.4 2405 MHz to 2485 MHz

V

CC

J3 R1

C7

C6

C8

MSL1 C1 MSL2

L1

J1

50 Ω

RF_IN

V

CC(BIAS)

V

CC(RF)

MSL3

C4

MSL4 C5 MSL5 50 Ω

J2

RF_OUT

C2

ICQ_ADJ

BGA7124

SHDN

R2

C3 enable

See

Table 17



ε r


μm.


014aab069

BGA7124





19 of 33


BGA7124


(3)

(2)

(1)

014aab070

G p

(dB)

20

18

16

14

12

(1)

(2)

(3)

014aab071

26

P

L(1dB)

(dBm)

24

22

20

18

16

2.405

2.425

2.445

2.465

f (GHz)

2.485

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


014aab072

0

RL in

, RL out

, ISL

(dB)

−10

RL in

10

2.405

2.425

2.445

2.465

f (GHz)

2.485

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


38

IP3

O

(dBm)

36

(3)

(2)

(1)

014aab073

−20

−30

2.405

2.425

T case

= 25

°C.

ISL

RL out

2.445

2.465

f (GHz)

2.485


34

32

2.405

2.425

2.445

2.465

f (GHz)

2.485

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


BGA7124





20 of 33


BGA7124


J1

RF in

MSL1 C1 MSL2

C2

J I H G F E D C B A

C8

R1

C7

J2

C6

MSL3

C3

L1

MSL4

C4

1 2 3 4 5 6 7 8 9 10

11

12

13

C5 MSL5

RF out

R2

014aab074

See

Table 17



Table 17.


See Figure 23

and Figure 28


μ m.

Component Description Value Function Remarks

C1, C5

C2

C3

C4

C6

C7

C8

J1, J2

J3

L1

MSL1 [1]

MSL2 [1]

MSL3 [1]

MSL4 [1]

capacitor capacitor capacitor capacitor capacitor capacitor capacitor

RF connector

DC connector inductor micro stripline micro stripline micro stripline micro stripline

12 pF

2.2 pF

0.82 pF

0.68 pF

DC blocking input match output match output match



Murata GRM1885C1HR82CZ01D


12 pF

100 nF

10

μF

SMA

RF decoupling

DC decoupling


AVX 0603YC104KAT2A

DC decoupling AVX 1206ZG106ZAT2A


142-0701-841

MOLEX 6-pins

22 nH DC feed

1.14 mm


1.14 mm


1.14 mm

× 0.8 mm × 7.3 mm

1.14 mm

× 0.8 mm × 4.3 mm output match output match


BGA7124





21 of 33


BGA7124


Table 17.

5 V/130 mA application list of components; 2405 MHz to 2485 MHz …continued


μ m.


MSL5

R1

R2

[1]

Value Function Remarks micro stripline resistor

1.14 mm


2.2


Ω

Multicomp MC 0.063W 0603 2R2 bias adjustment Bourns 3214W-1-202E


12.2 3.3 V applications

12.2.1 920 MHz to 960 MHz

V

CC

J3 R1

C8

C7

C9

J1

50

Ω

MSL1 C1 MSL2

C2 C3

MSL3

RF_IN

V

CC(BIAS)

V

CC(RF)

BGA7124

ICQ_ADJ

SHDN

R2

MSL4 L1 MSL5

L2

MSL6

C4

MSL7 C6 MSL8 50

Ω

J2

RF_OUT

C5 enable

See

Table 18



ε r


μm.

Fig 29. 3.3 V/130 mA application schematic; 920 MHz to 960 MHz

014aab075

BGA7124





22 of 33


BGA7124


30

P

L(1dB)

(dBm)

28

26

24

22

014aab076

(1)

(2)

(3)

28

G p

(dB)

26

24

22

20

(1)

(2)

(3)

014aab077

20

0.92

0.93

0.94

0.95

f (GHz)

0.96

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


014aab078

0

RL in

, RL out

, ISL

(dB)

−10

RL out

RL in

18

0.92

0.93

0.94

0.95

f (GHz)

0.96

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


40

IP3

O

(dBm)

38

014aab079

−20

−30

0.92

0.93

ISL

0.94

T case

= 25

°C.

0.95

f (GHz)

0.96


36

(2)

(3)

(1)

34

0.92

0.93

0.94

0.95

f (GHz)

0.96

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


BGA7124





23 of 33


BGA7124


J1

RF in

MSL1 C1

MSL2

C3

MSL3

C2

J I H G F E D C B A

C9

R1

C8

J2

MSL4

C7 MSL6 MSL7

L1

L2

C4 C5

C6

1 2 3 4 5 6 7 8 9 10

11

MSL5

12

13

MSL8

RF out

R2

014aab080

See

Table 18


Fig 34. 3.3 V/130 mA application reference board; 920 MHz to 960 MHz

Table 18.

3.3 V/130 mA application list of components; 920 MHz to 960 MHz

See Figure 29

and Figure 34


μ m.


J3

L1

L2

MSL1 [1]

MSL2 [1]

MSL3 [1]

MSL4 [1]

MSL5 [1]

C1, C6

C2, C3

C4

C5

C7

C8

C9

J1, J2 capacitor capacitor capacitor capacitor capacitor capacitor capacitor

RF connector

DC connector inductor inductor micro stripline micro stripline micro stripline micro stripline micro stripline

68 pF

3.3 pF

3.9 pF

1.0 pF






68 pF

100 nF

10

μF

SMA

6-pins

RF decoupling Murata GRM1885C1H680JA01D

DC decoupling AVX 0603YC104KAT2A



142-0701-841

MOLEX

Tyco electronics 36501J2N2JTDG


2.2 nH output match

22 nH DC feed

1.14 mm


1.14 mm


1.14 mm


1.14 mm


1.14 mm


BGA7124





24 of 33


BGA7124


Table 18.

3.3 V/130 mA application list of components; 920 MHz to 960 MHz …continued


μ m.


MSL6

MSL7

MSL8

R1

R2

[1]

[1]

[1]

Value Function Remarks micro stripline micro stripline micro stripline resistor

1.14 mm

× 0.8 mm × 2.4 mm

1.14 mm

× 0.8 mm × 2.3 mm

1.14 mm


0


Ω output match output match bias adjustment


Bourns 3214W-1-202E


12.2.2 2405 MHz to 2485 MHz

V

CC

J3 R1

C7

C6

C8

J1

50 Ω MSL1

C1

MSL2

C2

RF_IN

V

CC(BIAS)

V

CC(RF)

ICQ_ADJ

BGA7124

SHDN

R2

MSL3

C3

L1

C4

MSL4 C5 MSL5

50 Ω

RF_OUT

J2 enable

See

Table 19



ε r


μm

Fig 35. 3.3 V/130 mA application schematic; 2405 MHz to 2485 MHz

014aab081

BGA7124





25 of 33


BGA7124


26

P

L(1dB)

(dBm)

24

22

20

18

014aab082

(3)

(2)

(1)

G p

(dB)

20

18

16

14

12

014aab083

(1)

(2)

(3)

16

2.405

2.425

2.445

2.465

f (GHz)

2.485

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


014aab084

0

RL in

, RL out

, ISL

(dB)

RL in

−10

10

2.405

2.425

2.445

2.465

f (GHz)

2.485

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


38

IP3

O

(dBm)

36

014aab085

34

(2)

(1)

(3)

−20

−30

2.405

2.425

T case

= 25

°C.

ISL

RL out

2.445

2.465

f (GHz)

2.485


32

2.405

2.425

2.445

2.465

f (GHz)

2.485

(1) T case

=

−40 °C.

(2) T case

= 25

°C.

(3) T case

= 85

°C.


BGA7124





26 of 33


BGA7124


J1

RF in

MSL1 C1 MSL2

C2

J I H G F E D C B A

C8

R1

C7

J2

C6

MSL3

C3

L1

MSL4

C4

1 2 3 4 5 6 7 8 9 10

11

12

13

C5 MSL5

RF out

R2

014aab086

See

Table 19


Fig 40. 3.3 V/130 mA application reference board; 2405 MHz to 2485 MHz

Table 19.

3.3 V/130 mA application list of components; 2405 MHz to 2485 MHz

See Figure 35

and Figure 40


μ m.


C1, C5

C2

C3

C4

C6

C7

C8

J1, J2

J3

L1

MSL1 [1]

MSL2 [1]

MSL3 [1]

MSL4 [1]

capacitor capacitor capacitor capacitor capacitor capacitor capacitor

RF connector

DC connector inductor micro stripline micro stripline micro stripline micro stripline

12 pF

2.2 pF

0.82 pF

0.68 pF






12 pF

100 nF

10

μF

SMA

RF decoupling

DC decoupling


AVX 0603YC104KAT2A



142-0701-841

MOLEX 6-pins

22 nH DC feed

1.14 mm


1.14 mm


1.14 mm


1.14 mm



BGA7124





27 of 33


BGA7124


Table 19.

3.3 V/130 mA application list of components; 2405 MHz to 2485 MHz …continued


μ m.


MSL5

R1

R2

[1]

Value Function Remarks micro stripline resistor

1.14 mm


2.2


Ω bias adjustment

Multicomp MC 0.063W 0603 2R2

Bourns 3214W-1-202E


12.3 PCB stack through via

RF and analog routing 35 μm (1 oz.) copper + 0.3 μm gold plating

RO4003C, 0.51 mm (20 mil)

RF and analog ground analog routing

RF and analog ground

(1) Pre-pregnated

RO4003Cdielectric constant

ε r

= 3.38

Fig 41. PCB stack

35 μm (1 oz.) copper

(1)

0.2 mm (8 mil)

35

μm (1 oz.) copper

FR4, 0.15 mm (6 mil)

35 μm (1 oz.) copper

014aab087

BGA7124





28 of 33


BGA7124


13. Package outline

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm SOT908-1

0 1 scale

2 mm

X

D B A

E A

A

1 c detail X terminal 1 index area terminal 1 index area

L

1 e e

1 b

4

v

M

w

M

C

C

A B y

1

C

C y exposed tie bar (4

×)

E h exposed tie bar (4 ×)

8 5

D h

DIMENSIONS (mm are the original dimensions)

UNIT

A

(1) max.

A1 b c D

(1) Dh mm

1

0.05

0.00

0.3

0.2

0.2

3.1

2.9

2.25

1.95

E

(1)

3.1

2.9

Eh

1.65

1.35

e

0.5

e1

1.5

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

OUTLINE

VERSION

IEC

REFERENCES

JEDEC JEITA

SOT908-1 MO-229

L

0.5

0.3

v

0.1

w y y1

0.05

0.05

0.1

EUROPEAN

PROJECTION

ISSUE DATE

05-09-26

05-10-05

Fig 42. Package outline SOT908-1 (HVSON8)

BGA7124





29 of 33


BGA7124


14. Abbreviations

Table 20.

Abbreviations

Acronym

CPE

Description

Customer-Premises Equipment

DC

ESD

HTOL

ISM

Direct Current

ElectroStatic Discharge

High Temperature Operating Life

Industrial, Scientific and Medical

MMIC

MoCA

RFID

SMA

TX

WLAN

Monolithic Microwave Integrated Circuit

Multimedia over Coax Alliance

Radio Frequency IDentification

SubMiniature version A

Transmit

Wireless Local Area Network

15. Revision history

Table 21.

Revision history

Document ID

BGA7124 v.3

Modifications:

BGA7124 v.2

BGA7124 v.1

Release date Data sheet status Change notice

20100909 Product data sheet -

•

Figure 5 on page 11

: MSL symbols have been corrected.

•

Figure 11 on page 14 : MSL symbols have been corrected.

•


•


•


•




Supersedes

BGA7124 v.2

-

BGA7124 v.1

BGA7124





30 of 33


BGA7124


16. Legal information

Document status

[1][2]

Objective [short] data sheet

Product status

[3]

Development

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

Definition

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com

.

16.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the

Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

BGA7124



Rev. 3 — 9 September 2010 malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.


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Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

BGA7124





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BGA7124


18. Contents

4

5

6

1

1.1

1.2

1.3

1.4

2

2.1

2.2

3

7

8

8.1

9

9.1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

Pinning information . . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

Shutdown control . . . . . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Thermal characteristics . . . . . . . . . . . . . . . . . . 5

Static characteristics . . . . . . . . . . . . . . . . . . . . . 5

Supply current adjustment . . . . . . . . . . . . . . . . 5

Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

Scattering parameters . . . . . . . . . . . . . . . . . . . 9

14

15

16

16.1

16.2

16.3

16.4

10

11

Reliability information . . . . . . . . . . . . . . . . . . . 10

Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . 10

12 Application information. . . . . . . . . . . . . . . . . . 11

12.1 5 V applications . . . . . . . . . . . . . . . . . . . . . . . 11

12.1.1 920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . 11

12.1.2 1930 MHz to 1990 MHz . . . . . . . . . . . . . . . . . 14

12.1.3 2110 MHz to 2170 MHz . . . . . . . . . . . . . . . . . 16

12.1.4 2405 MHz to 2485 MHz . . . . . . . . . . . . . . . . . 19

12.2 3.3 V applications . . . . . . . . . . . . . . . . . . . . . . 22

12.2.1 920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . 22

12.2.2 2405 MHz to 2485 MHz . . . . . . . . . . . . . . . . . 25

12.3 PCB stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 29

17

18

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30

Legal information. . . . . . . . . . . . . . . . . . . . . . . 31

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Contact information. . . . . . . . . . . . . . . . . . . . . 32

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2010.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

Date of release: 9 September 2010

Document identifier: BGA7124

NXP BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Data Sheet

Assistant Bot

400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier

10. Reliability information

11. Moisture sensitivity

12. Application information

13. Package outline

14. Abbreviations

15. Revision history

16. Legal information

17. Contact information

18. Contents

Key Features

Frequently Answers and Questions

What is the output power of the BGA7124 amplifier at 1 dB gain compression?

What is the frequency operating range of the BGA7124 amplifier?

How can the supply current of the BGA7124 amplifier be adjusted?

What is the purpose of the shutdown control function on the BGA7124 amplifier?

What type of package does the BGA7124 amplifier come in?

Related manuals

NXP BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Data Sheet

Assistant Bot

400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier

10. Reliability information

11. Moisture sensitivity

12. Application information

13. Package outline

14. Abbreviations

15. Revision history

16. Legal information

17. Contact information

18. Contents

Key Features

Frequently Answers and Questions

What is the output power of the BGA7124 amplifier at 1 dB gain compression?

What is the frequency operating range of the BGA7124 amplifier?

How can the supply current of the BGA7124 amplifier be adjusted?

What is the purpose of the shutdown control function on the BGA7124 amplifier?

What type of package does the BGA7124 amplifier come in?

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