Intel Xeon E5-1600 v3, Xeon E5-2600 v3, Xeon E5-4600 v3 processor Thermal Mechanical Specification and Design Guide
Below you will find brief information for Xeon E5-1600 v3, Xeon E5-2600 v3, Xeon E5-4600 v3. These processors are designed for server and workstation applications and provide high performance, energy efficiency, and reliability. The guide provides specifications and guidelines for the design of thermal and mechanical solutions for the Intel Xeon processor E5-1600, E5-2600, and E5-4600 v3 product families.
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Revision History—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Revision History
Revision
Number
001
002
003
Description
Initial release
Added Intel ® Xeon ® processor E5-4600 v3 product families.
Updated a socket part number on
Date
September 2014
June 2015
October 2015
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Contents
Contents
3.4 ILM Mechanical Design Considerations and Recommendations.....................................25
and DTS-Based Thermal Specification Implementation........................................34
and DTS Based Thermal Specifications.................................................37
4.3.3 Server Processor Thermal Profiles and Form Factors..................................... 38
4.3.4 Server 4S Processor Thermal Profiles and Form Factors.................................40
4.3.5 Workstation Processor Thermal Profiles and Form Factors..............................41
4.3.6 Embedded Server Processor Thermal Profiles...............................................42
5.1 Processor Boundary Conditions for Shadowed and Spread Core Layouts....................... 47
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Contents—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
5.7.4 Workstation Tower Active Heatsink Performance........................................... 60
7.1.1 Available Boxed Thermal Solution Configurations...........................................67
7.1.2 Intel ® Thermal Solution STS200C (Passive/Active Combination Heat Sink
7.1.3 Intel ® Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall
Passive Heat Sink Solutions)......................................................................68
®
Reference Component Validation....................................................................73
8.2.3 Recommended BIOS/Processor/Memory Test Procedures................................74
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Contents
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Figures—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Figures
) Measurement Location for Large Package ..............................45
) Measurement Location for Small Package.............................. 46
® processor E5-1600 and E5-2600 v3 product families Small
® processor E5-1600 and E5-2600 v3 product families Large
36 STS200C Active / Passive Combination Heat Sink (with Removable Fan) ........................ 68
37 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks ....................................... 68
Processor v3 Product Families Large Package Mechanical Drawing Page 1.... 79
Processor v3 Product Families Large Package Mechanical Drawing Page 2.... 80
Processor v3 Product Families Small Package Mechanical Drawing Page 1.... 81
Processor v3 Product Families Small Package Mechanical Drawing Page 2.... 82
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Figures
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Tables—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Tables
12 DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN ................ 36
13 Intel ® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families Stack T
Processor E5-4600 v3 Product Families Stack Product Family T case
® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families 1S Workstation
and DTS Thermal Profiles and Correction Factors......................................... 41
17 Processor Boundary Conditions for Shadowed and Spread Core Layouts.......................... 48
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Introduction
1.0
1.1
Table 1.
Introduction
This document provides specifications and guidelines for the design of thermal and mechanical solutions for the Intel ® Xeon ® processor E5-1600, E5-2600, and E5-4600 v3 product families.
The components and information described in this document include:
• Thermal profiles and other processor specifications and recommendations
• Processor Mechanical load limits
The goals of this document are:
• To assist board and system thermal mechanical designers
• To assist designers and suppliers of processor heatsinks
Definition of Terms
Terms and Descriptions
Term
Bypass
DTS
FSC
IHS
Square ILM
Narrow ILM
LGA2011-3 Socket
PECI
Description
Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.
Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
Fan Speed Control
Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.
Independent Loading Mechanism provides the force needed to seat the 2011-LGA package onto the socket contacts and has 56 × 94mm heatsink mounting hole pattern
Independent Loading Mechanism provides the force needed to seat the 2011-LGA package onto the socket contacts and has 56 × 94mm heatsink mounting hole pattern
The processor mates with the system board through this surface mount, 2011-contact socket.
The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices.
continued...
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Introduction—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Term
Ψ
CA
Ψ
CS
Ψ
SA
T case
Tcase-Max
TCC
T
CONTROL
TDP
Thermal Monitor
Thermal Profile
TIM
T
LA
T
SA
U
LCC
MCC
HCC
Description
Case-to-ambient thermal characterization parameter
(psi). A measure of thermal solution performance using total package power. Defined as (T specified for Ψ measurements.
CASE
– T
LA
) /
Total Package Power. Heat source should always be
Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T
Total Package Power.
CASE
– T
S
) /
Sink-to-ambient thermal characterization parameter.
A measure of heatsink thermal performance using total package power. Defined as (T
Package Power.
S
– T
LA
) / Total
The case temperature of the processor measured at the geometric center of the topside of the IHS.
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the
TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.
T
CONTROL
is a static value below TCC activation used as a trigger point for fan speed control. When DTS >
T
CONTROL profile.
, the processor must comply to the thermal
Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate.
A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.
Line that defines case temperature specification of a processor at a given power level.
Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.
The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, and so forth.
Low Core Count, refers to silicon die size
Mid Core Count, refers to silicon die size
High Core Count, refers to silicon die size
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Overview
2.0 LGA2011-3 Socket Overview
Figure 1.
This section describes a surface mount, LGA (Land Grid Array) socket intended for the
Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families processor-based platform. The socket provides I/O, power and ground contacts for processor operation.
The socket contains 2011 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.
The LGA2011-3 uses a hexagonal area array ball-out which provides many benefits:
• Socket contact density increased by 12% while maintaining 40 mil minimum via pitch requirements. as compared to a linear array
• Corresponding square pitch array’s would require a 38mil via pitch for the same package size.
LGA2011-3 has 1.016 mm (40 mil) hexagonal pitch in a 58x43 grid array with 24x16 grid depopulation in the center of the array and selective depopulation elsewhere.
Hexagonal Array in LGA2011-3
Table 2.
LGA2011-3 Socket Attributes
Component Size
Pitch
Ball Count
LGA2011-3 Socket Attributes
58.5 mm (L) X 51 mm (W)
1.016 mm (Hex Array)
2011
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2.1
Figure 2.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). Internal keying posts ensure socket processor compatibility. An external socket key ensures ILM and socket compatibility. The ILM reference design includes a back plate; an integral feature for uniform loading on the socket solder joints and contacts.
Socket Components
The socket has two main components, the socket body: composed of a housing solder balls, and processor contacts, and Pick and Place (PnP) cover. The socket is delivered as a single integral assembly. Below are descriptions of the integral parts of the socket.
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260°C for 40 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, are such that the integrity of the socket is maintained for the environmental conditions listed in the
TMSDG.
The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems. A labeled representation of the socket can be seen in the figure below.
Socket with Labeled Features
Solder Balls
A total of 2011 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard.
The socket has the following solder ball material:
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Overview
Figure 3.
• Lead free SAC305 (SnAgCu) solder alloy with a silver (Ag) content 3%, copper
(Cu) 0.5%, tin (Sn) 96.5% and a melting temperature of approximately 217°C.
The immersion silver (ImAg) motherboard surface finish and solder paste alloy must be compatible with the SAC305 alloy solder paste.
Contacts
The base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 mm [0.015 inches] minimum gold plating over 1.27 mm [0.05 inches] minimum nickel underplate. No contamination by solder in the contact area is allowed during solder reflow. All socket contacts are designed such that the contact tip lands within the substrate pad boundary before any actuation load is applied and remain within the pad boundary at final installation, after actuation load is applied.
The contacts are laid out in two L-shaped arrays as shown in the figure below. The detailed view of the contacts indicate the wiping orientation of the contacts in the two regions to be 29.6°.
Contact Wiping Direction
The contact between substrate land and socket contact are offset. The following diagram shows contact offset from solder ball location and orientation of contact tip.
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Figure 4.
Contact Tip Offset with Respect to Solder Ball
Socket Standoffs
Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow. The following diagram highlights each feature of the socket-processor stack up.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Overview
Figure 5.
Processor Socket Stack Up
Figure 6.
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The proceeding diagram labels key features of the Pick and Place cover.
Pick and Place Cover with Labeled Features
The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260°C for 40 seconds (typical reflow/rework profile) and the environmental conditions listed in the TMSDG.
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Figure 7.
The following figure diagrams the PnP and socket assembly. To reduce risk of damage to socket contacts the pick and place (PnP) cover remains on the socket during ILM installation.
PnP Cover and Socket Assembly
2.2
Once the ILM with its cover is installed Intel is recommending the PnP cover be removed to help prevent damage to the socket contacts. To reduce the risk of bent contacts the PnP Cover and ILM Cover were designed to not be compatible. Covers can be removed without tools.
The pick and place covers are designed to be interchangeable between socket suppliers.
Socket Land Pattern Guidance
The land pattern guidance provided in this section applies to printed circuit board design. Recommendation for Printed Circuit Board (PCB) Land Patterns is to ensure solder joint reliability during dynamic stresses, often encountered during shipping and handling and hence to increase socket reliability.
LGA 2011-3 Land Pattern
The land pattern for the LGA2011-3 socket is 40 mils hexagonal array see the following figure for detailed location and land pattern type.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Overview
Note:
Figure 8.
There is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent.
Socket 2011-3 Land Pattern
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Table 3.
PIN Count By Pad Definition
Pad Definition / Padstack
20 X 17 Oblong Partially SMD / O17X20
20 X 17 Oblong Partially SMD / O17X20
17 mil Ø MD / C17
RED Pins
LIGHT BLUE Pins
GREY Pins
Color
43
123
1845
Quantity
Notes: 1. RED Pins: Corner nCTF pads (43 total) are all designed as 20 X 17 mil oblong partially soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is oriented at 45° from the center of the socket. All nCTF pads require thick traces ideally oriented at 45° toward the package corner.
2. LIGHT BLUE Pins: Edge CTF pads (total) are all designed as 20 X 17 mil oblong partially soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is oriented at 90° to the socket edge.
3. GREY Pins: Critical to function pins are all designed as 17 mil circular MD (Metal Defined) pads.
Pad Type Recommendations
Intel defines two types of pad types based on how they are constructed. A metal defined (MD) pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it. The solder mask defined (SMD) pad is typically a pad in a flood plane where the solder mask opening defines the pad size for soldering to the component. In thermal cycling a MD pad is more robust than a SMD pad type. The solder mask that defines the SMD pad can create a sharp edge on the solder joint as the solder ball / paste conforms to the window created by the solder mask. For certain failure modes the MD pad may not be as robust in shock and vibration (S&V). During
S&V, the predominant failure mode for a MD pad in the corner of the BGA layout is pad craters and solder joint cracks. A corner MD pad can be made more robust and behave like a SMD pad by having a wide trace enter the pad. This trace should be 10 mil minimum wide but not to exceed the pad diameter and exit the pad at a 45 degree angle (parallel to the diagonal of the socket). During board flexure that results from shock & vibration, a SMD pad is less susceptible to a crack initiating due to the larger surface area. Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing.
The signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.
The following figure diagrams shape and location of solder pad types for socket
2011-3.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Overview
Figure 9.
Socket 2011-3 Pad Types and Locations
Notes:
2.3
1. When ordering PCBs with the Socket R (LGA2011) footprint, it is important to specify the following verbiage on the FAB drawing as well as within the purchase requisition: All BGA pads, Soldermask or Metal defined, min/max size tolerance, should comply with Intel PCB specification, current revision. Nominal BGA pad size, Soldermask or Metal defined, is Ø +/- 1 mil. This pad size is critical to function on socket locations.
2. The solder paste stencil aperture recommendation for Socket R (LGA2011) is: 24 mil Ø circular aperture opening with a stencil thickness of 5 mils.
Socket Loading Requirements
The socket must meet the mechanical loading and strain requirements outlined in the table below. All dynamic requirements are under room temperature conditions while all static requirements are under product use condition temperature. Specifically, ILM and HS load range may vary for different LGA 2011 derivatives (e.g. 2011-0, 2011-1) due to the package form factor, and the design of loading mechanism and thermal solution (e.g., HS mass).
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2.3.1 Socket Loading Specifications
The table below provides load specifications for the socket. These mechanical limits should not be exceeded during component assembly, mechanical stress testing, or standard drop and shipping conditions. All dynamic requirements are under room temperature conditions while all static requirements are under 100 °C conditions.
Table 4.
Parameter
Socket Load Values
Static Compressive per Contact
Load Limits,
SI Units
Min Max
15 (gf) 38 (gf)
Min
0.53
(ozf)
Load Limits,
Imperial Units
Max
1.34 (ozf)
Definition
Static Compressive
(ILM)
445 (N) 712 (N) 100 (lbf) 160 (lbf)
50 (lbf) 90 (lbf)
The compressive load applied by the package on the
LGA contacts to meet electrical performance. This condition must be satisfied throughout the life of the product
The total load applied by the enabling mechanism onto the socket as transferred through the package, contacts and socket seating plane.
The total load applied by the heatsink mechanism onto the socket as transferred through the package, contacts and socket seating plane. Measured at Beginning of Life
Static Compressive
Beginning of Life
(HS)
Static Compressive
End of Life
(HS)
Static Total
Compressive
222 (N) 400 (N)
178 (N) 400 (N)
667 (N) 1068 (N )
40 (lbf) 90 (lbf)
150 (lbf) 240 (lbf)
The total load applied by the heatsink mechanism onto the socket as transferred through the package, contacts and socket seating plane. Measured at End of Life
Dynamic
Compressive
Board Transient
Bend Strain
NA
NA
588 (N)
500 (ue) for 62
(mil);
400 (ue) for 100
(mil)
NA
NA
132 (lbf)
500 (ue) for 62
(mil);
400 (ue) for 100
(mil)
The total load applied by enabling mechanism and heat sink onto the socket as transferred through the package, contacts and socket seating plane.
Quasi-static equivalent compressive load applied during the mechanical shock from heatsink, calculated using a reference 600g heatsink with a 25G shock input and an amplification factor of 3 (600g x 25G x 3 =441N=99 lbf). This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this value. Intel reference system shock requirement for this product family is 25G input as measured at the chassis mounting location.
This is the strain on boards near to socket BGA corners during transient loading events through manufacturing flow or testing. The test guidance can be found in Board
Flexure Initiative (BFI) strain guidance from your local
CQE.
2.4 Socket Maximum temperature
The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket <78 °C
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Overview
• The specific via used for temperature measurement is located on the bottom of the motherboard between pins BC1 and BE1.
• The socket maximum temperature is defined at Thermal Design Current (TDC). In addition, the heatsink performance targets and boundary conditions must be met to limit power dissipation through the socket.
To measure via temperature:
1. Drill a hole through the back plate corresponding to the location of pins BC1 and
BE1.
2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the specific measurement via on the underside of the motherboard.
3. Once the glue dries, reinstall the back plate and measure the temperature
Figure 10.
Socket Temperature Measurement
2.5
Note:
Strain Guidance for Socket
Intel provides manufacturing strain guidance commonly referred to as Board Flexure
Initiative or BFI Strain Guidance. The BFI strain guidance apply only to transient bend conditions seen in board manufacturing assembly environment with no ILM, for example during In Circuit Test. BFI strain guidance limits do not apply once ILM is installed. It should be noted that any strain metrology is sensitive to boundary conditions. Intel recommends the use of BFI to prevent solder joint defects from occurring in the test process. For additional guidance on BFI, see Manufacturing With
Intel ® Components - Strain Measurement for Circuit Board Assembly, also referred as
BFI MAS ( Manufacturing Advantage Services) and BFI STRAIN GUIDANCE SHEET
(LGA2011-3 socket). Consult your Intel Customer Quality Engineer for additional guidance in setting up a BFI program in your factory.
When the ILM is attached to the board, the boundary conditions change and the BFI strain limits are not applicable. The ILM, by design, increases stiffness in and around the socket and places the solder joints in compression. Intel does not support strain metrology with the ILM assembled.
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Independent Loading Mechanism (ILM) Specifications—Intel ®
2600 / 4600 v3 Product Families
Xeon ® Processor E5-1600 /
3.0 Independent Loading Mechanism (ILM)
Specifications
The Independent Loading Mechanism (ILM) provides the force needed to seat the land
LGA package onto the socket contacts. See image below for total processor stack consisting of all relevant mechanical components.
Figure 11.
Processor Stack
The ILM is physically separate from the socket body. The assembly of the ILM is expected to occur after attaching the socket to the board. The exact assembly location is dependent on manufacturing preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be "built to print" from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from
Intel's detailed studies and may not incorporate critical design parameters.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
3.1
Table 5.
Table 6.
The ILM has two critical functions: evenly deliver and distribute the force to seat the processor onto the socket contacts and ultimately through the socket solder joints.
Another purpose of ILM is to ensure electrical integrity/performance of the socket and package.
Socket LGA2011-3 has two POR (Plan of Record) ILMs:
1. Square ILM - This ILM has 80x80mm heatsink mounting hole pattern.
2. Narrow ILM - This ILM has 56x94mm heatsink mounting hole pattern.
ILM Load Specifications
The Independent Loading Mechanism (ILM) provides the force needed to seat the package onto the socket contacts.
Maximum Allowable Loads
The table below provides load specifications for the processor package. These maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure or other damage to the system. The processor substrate should not be used as a mechanical reference or load bearing surface for thermal solutions.
LGA 2011-3 Maximum Allowable Loads
Item
Static Pre-Load Compressive (ILM load)
Static Pre-Load Compressive (HS load)
Total Socket Static Compressive (ILM+HS=Socket)
Maximum
712N (160 lbf)
400N (90 lbf)
1068N (240 lbf)
Minimum Allowable Loads
The ILM is designed to achieve the minimum Socket Static Pre-Load Compressive load specification. The thermal solution (heatsink) should apply additional load. The combination of an ILM and HS will be used to achieve the load targets shown in the table below.
LGA 2011-3 Minimum Allowable Loads
Item
Static Pre-Load Compressive (ILM load)
Static Pre-Load Compressive (HS load)
Total Socket Static Compressive (ILM+HS=Socket)
Minimum
445N (100 lbf)
222N (50 lbf)
667N (150 lbf)
End of Life Load Targets
The ILM is designed to achieve the minimum end of life loads for the socket. The thermal solution (heatsink) should apply a portion of the end of life load. The combination of an ILM and HS will be used to achieve the load targets shown in the table below.
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Table 7.
3.2
Table 8.
3.3
3.4
LGA 2011-3 Minimum End of Life Loads
Item
Static Pre-Load Compressive (ILM load)
Static Pre-Load Compressive (HS load)
Total Socket Static Compressive (ILM+HS=Socket)
ILM Keepout Zones (KOZ)
The table below lists envelope dimensions for ILM KOZ , both topside and backplate.
For detailed views, refer to dimensioned drawings in
78.
LGA 2011-3 ILM General Keepout Dimensions
Keepout Type
Topside envelope
ILM Hole Location
Backplate Envelope
Square ILM Narrow ILM
93x93 mm (3.6x3.7in) 80x107.5 mm (3.15x4.2in)
46x69.2 mm (1.8x2.7 in)
78x84 mm (3.1x3.3 in)
Independent Loading Mechanism (ILM)
End of Life Minimum
311N (70 lbf)
178N (40 lbf)
490N (110 lbf)
The Independent Loading Mechanism (ILM) provides the force needed to seat the package onto the socket contacts. The ILM is a mechanical assembly that is physically separate from the socket body. The assembly of the ILM to the motherboard is expected to occur after attaching the socket to the board. The exact assembly location is dependent on manufacturing preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be "built to print" from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from
Intel's detailed studies and may not incorporate critical design parameters.
The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts resulting in even load transfer through the socket solder joints.
Another purpose of ILM is to ensure electrical integrity/performance of the socket and package.
ILM Mechanical Design Considerations and
Recommendations
An retention/loading mechanism must be designed to support the processor heatsink and to ensure processor interface with the socket contact is maintained since there are no features on the socket for direct attachment of the heatsink or retaining the processor. In addition to supporting the processor heatsink over the processor, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular:
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3.5
Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
• Ensuring that thermal performance of the TIM applied between the IHS and the heatsink is achievable. TIMs, especially those based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Designs should consider the impact of shock and vibration events on
TIM performance as well as possible decrease in applied pressure over time due to potential structural relaxation in enabled components.
• Ensuring that system electrical, thermal, and structural integrity is maintained under shock and vibration events. The mechanical requirements of the attach mechanism depend on the weight of the heatsink, as well as the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink and ILM attach mechanism. Their design should provide a means for protecting the socket solder joints as well as preventing package pullout from the socket.
• The load applied by the attachment mechanism and the heatsink must comply with the package specifications, along with the dynamic load added by the mechanical shock and vibration requirements of the package and socket.
• Load induced onto the package and socket by the ILM may be influenced with heatsink installed. Determining the performance for any thermal/mechanical solution is the responsibility of the customer.
A potential mechanical solution for heavy heatsink is the use of a supporting mechanism such as a backer plate or the utilization of a direct attachment of the heatsink to the chassis pan. In these cases, the strength of the supporting component can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.
Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess the shock for their designs as heatsink retention (back plate), heatsink mass and chassis mounting holes may vary.
ILM Features
The ILM is defined by four basic features
1. ILM Loadplate: Formed sheet metal that when closed applies four point loads onto the IHS seating the processor into the socket
2. ILM Frame: Single piece or assembly that mounts to PCB board and provides the hinge locations for the levers the ILM frame also contains captive mounts for heatsink attach. An insulator is pre applied by the vendor to the bottom side of the ILM frame.
3. ILM Actuation levers: Formed loading levers designed to place equal force on both ends of the ILM load plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints
4. ILM Backplate: A flat steel back plate with threaded studs to attach to the ILM frame. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. Two additional cut-outs on the backplate provide clearance for backside voltage regulator components. An insulator is pre applied by the vendor to the side with the threaded studs.
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Heatsink mounting studs on ILM frame allow for topside thermal solution attach to a rigid structure. This eliminates the motherboard thickness dependency from the heatsink mechanical stackup. ILM assembly provides a clamping force between the
ILM frame, backplate and board, resulting in reduced board bending leading to higher solder joint reliability. ILM lever design provides an interlocking mechanism to ensure proper opening or closing sequence for the operator. This has been implemented in both square and narrow ILM.
ILM Load Plate Design
Four point loading contributes to minimizing package and socket warpage under non uniformly distributed load. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints. The load plate design is common between the two POR ILMS and is shown in the figure below.
Figure 12.
ILM Load Plate
Lever Actuation/Release Forces
Maximum allowable force to actuate the levers not to exceed 4.7 lbf (21 N) at the point of typical finger placement.
ILM Back Plate Design
The backplate assembly consists of a supporting plate and captive standoffs. It provides rigidity to the system to ensure minimal board and socket deflection. Four externally threaded (male) inserts which are press fit into the back plate are for ILM attachment. Three cavities are located at the center of the plate to allow access to the baseboard test points and backside capacitors. An insulator is pre-applied to prevent shorting the board.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
Figure 13.
ILM Backplate
3.6
3.6.1
Intel
®
ILM Reference Designs
Intel has designed and validated two ILMs compatible with Socket LGA2011-3 :
1. Square ILM - 80x80 mm heat sink mounting hole pattern.
2. Narrow ILM - 56x94 mm heat sink mounting hole pattern.
The two POR ILMs share most components, only the top plate and active lever differ between the two assemblies.
Square ILM
The square ILM consists of two sub assemblies that will be procured as a set from the enabled vendors. These two components are the ILM assembly and back plate. The square ILM assembly consists of several pieces as shown and labeled in the following diagram. The hinge lever, active lever, load plate, top plate,clevises, and the captive fasteners. For clarity the ILM cover is not shown in this view.
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Figure 14.
Exploded Square ILM
An assembled view is shown in the following figure.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
Figure 15.
Assembled Square ILM
Table 9.
3.6.2
Square ILM Component Thickness and materials
Component
ILM Frame
ILM Load Plate
ILM Back Plate
1.20 mm
1.50 mm
2.20 mm
Thickness Material
310 Stainless Steel
310 Stainless Steel
S50C low Carbon Steel
The square ILM supports the legacy 80x80 mm heat sink mounting patterns used in some form factors.
Narrow ILM
The narrow ILM consists of two sub assemblies that will be procured as a set from the enabled vendors. These two components are the ILM assembly and back plate. The
ILM assembly is shown in the following figure.
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Figure 16.
Exploded Narrow ILM
The narrow ILM assembly consists of several pieces as shown and labeled above. The hinge lever, active lever, load plate, top plate, clevises, ILM cover, and the captive fasteners. For clarity the ILM cover is not shown in this view. An assembled view is shown in the following figure. The Narrow ILM maintains the structure and function of the square ILM but utilizes separate clevises riveted onto the ILM frame.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
Figure 17.
Assembled Narrow ILM
Table 10.
3.7
Narrow ILM Component Thickness and materials
Component
ILM Frame
ILM Clevis
ILM Load Plate
ILM Back Plate
1.50 mm
0.80 mm
1.50 mm
2.20 mm
Thickness Material
310 Stainless Steel
301 Stainless Steel
310 Stainless Steel
S50C low Carbon Steel
The narrow ILM supports a smaller east west dimension constraint conducive for use in space constrained form factors.
ILM Cover
Intel has developed a cover that will snap on to the ILM for the LGA2011 socket family.
The ILM cover is intended to reduce the potential for socket contact damage from the operator / customer fingers being close to the socket contacts to remove or install the pick and place cover. By design the ILM cover and pick and place covers can not be installed simultaneously. This cover is intended to be used in place of the pick and place cover once the ILM is assembled to the board. The ILM will be offered with the
ILM cover pre assembled as well as a discrete part.
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Figure 18.
ILM cover
Note:
3.8
• Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a discrete component.
• The ILM cover will pop off if a processor is installed in the socket.
• Maintain inter-changeability between validated ILM vendors for LGA2011-3 socket.
• The ILM cover for the LGA2011-3 socket will have a flammability rating of V-0 per
UL 60950-1.
Intel recommends removing the Pick and Place cover (PnP) of the socket body in manufacturing as soon as possible at the time when ILM is being installed.
ILM Cover Attach/Removal Force
The required force to remove the ILM cover shall not exceed 7.6 N when the load is applied by finger at the center of cover.
ILM Allowable Board Thickness
The ILM components described in this document will support board thickness in the range of 1.5748 - 2.54 mm (0.062" - 0.100"). Boards (PCBs) not within this range may require modifications to the back plate or other ILM components retention.
Contact the component suppliers (
Component Suppliers on page 76) for
modifications.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families— Processor Thermal
Specifications and Features
4.0 Processor Thermal Specifications and Features
4.1
4.1.1
T
case
and DTS-Based Thermal Specification
Implementation
Thermal solutions should be sized such that the processor complies to the T
CASE thermal profile all the way up to TDP, because, when all cores are active, a thermal solution sized as such will have the capacity to meet the DTS thermal profile, by design. When all cores are not active or when Intel Turbo Boost Technology is active, attempting to comply with the DTS thermal profile may drive system fans to speeds higher than the fan speed required to comply with the T
CASE
thermal profile at TDP.
In cases where thermal solutions are undersized, and the processor does not comply with the T
CASE lower power.
thermal profile at TDP, compliance can occur when the processor power is kept lower than TDP, AND the actual T
CASE
is below the T
CASE
thermal profile at that
In most situations, implementation of DTS thermal profile can reduce average fan power and improve acoustics, as compared to T
DTS < T
CONTROL be ignored.
CONTROL
, the processor is compliant, and T
CASE
-based fan speed control. When
and DTS thermal profiles can
Margin to Thermal Specification (M)
To simplify processor thermal specification compliance, the processor calculates and reports margin to DTS thermal profile (M) using the following method.
Processor reads firmware programmable values:
1. TCC_OFFSET: In-band: TEMPERATURE_TARGET[27:24]. BIOS must write in a value before CPL3.
Processor gathers information about itself:
1. Processor stores the intercept and slope terms (T
LA
and Ψ
PA
Thermal Profile for that particular SKU (one-time read only)
) from the DTS
2. Processor reads its own energy consumption and calculates power, P
3. Processor reads its own temperature, DTS
Finally, processor calculates the margin value (M) to the specification (solid black line in the graph below). The PECI command for reading margin (M) is RdPkgConfig(),
Index 10.
M < 0 indicates gap to spec, processor needs more cooling (for example, increase fan speed)
M > 0 this indicates margin to spec, processor is sufficiently cooled
Graphically, this is represented below. T
CONTROL_OFFSET
is not writable to a register.
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Figure 19.
Margin to Thermal Spec (M)
DTS 2.0 processor Margin values can be obtained via PECI or Processor register see documentation below as well as Intel ® Xeon ® Processor E5-1600 and E5-2600 v3
Product Families, Volume 2 of 2, Registers Datasheet and Intel ® Xeon ® Processor
E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet
Table 11.
DTS 2.0 Margin From PECI
Service Index
Value
(IV)
(decimal)
Parameter
Value
(word)
RdPkgConfig()
Data
(dword)
WrPkgConfi g()
Data
(dword)
Description
Thermal Margin 10 0x0000 15:0--Package
Temperature margin in 8.8
format, 32:16--
Reserved
N/A Package temperature margin with regards to
DTS Thermal Profile.
Positive indicates thermal margin, and package is less than DTS thermal profile
Note: Refer to Intel
Intel details
® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and
® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for further
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Specifications and Features
Table 12.
DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN
Bus:1
Bit Attr
Device:30
Default
Function:0
Reserved--Protected
Description
Offset:E0
31:16 RSVD-P 0000h
15:0 R0-V 0000h THERM_MARGIN--This field provides Platform
Firmware with running average of the instantaneous temperature margin above Tspec in 2's complement
8.8 format. This is the recommended field for
Platform firmware to use for fan control. When this value is negative, it indicates a firmware must increase the fan speed. With a positive value, firmware may decrease the speed of the fan
Note: • Refer to Intel
Intel ® Xeon ®
® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and
Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for full documentation of registers and field descriptions
4.2 Processor Thermal Features
4.2.1
4.2.2
4.3
Absolute Processor Temperature
The processor has a software readable field in the TEMPERATURE_TARGET register that contains the minimum temperature at which the Thermal Control Circuit (TCC) will be activated and PROCHOT_N will be asserted.
Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature could be misleading.
Short Duration TCC Activation
Systems designed to meet thermal capacity may encounter short durations of throttling, also known as TCC activation, especially when running nonsteady processor stress applications. This is acceptable and is functionally within the intended temperature control parameters of the processor. Such short duration TCC activation is not expected to provide noticeable reductions in application performance, and is typically within the normal range of processor to processor performance variation.
Processor Thermal Specifications
The processor requires a thermal solution to maintain temperatures within operating limits. Any attempt to operate the processor outside these limits may result in permanent damage to the processor and potentially other components within the system. Maintaining the proper thermal environment is key to reliable, long-term system operation.
A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting.
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4.3.1
4.3.2
For more information on designing a component level thermal solution, refer to
on page 47.
Thermal Specifications
To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must remain between the minimum and maximum case temperature
(T
CASE
) specifications as defined in the tables in the following sub-sections. Thermal solutions that do not provide sufficient thermal cooling may affect the long-term reliability of the processor and system.
Thermal profiles ensure adherence to Intel reliability requirements.
Intel assumes specific system boundary conditions (system ambient, airflow, heatsink performance / pressure drop, preheat, etc.) for each processor SKU to develop T case and DTS thermal specifications. For servers each processor will be aligned to either 1U or 2U system boundary conditions. Customers can use other boundary conditions (for example a better thermal solution with higher ambient) providing they are compliant to those specifications. Furthermore, implementing a thermal solution that violates the thermal profile for extended periods of time may result in permanent damage to the processor or reduced life. The upper point of the thermal profile consists of the
Thermal Design Power (TDP) and the corresponding T
CASE_MAX
T
CASE_MAX
) represents a thermal solution design point.
value (x = TDP and y =
For embedded servers, communications and storage markets, Intel has SKUs that support thermal profiles with nominal and short-term conditions designed to meet
NEBS level 3 compliance. For these SKUs, operation at either the nominal or shortterm thermal profiles should result in virtually no TCC activation. Thermal profiles for these SKUs are found in this chapter as well.
Intel recommends that thermal solution designs target the Thermal Design Power
(TDP). The Adaptive Thermal Monitor feature is intended to help protect the processor in the event that an application exceeds the TDP recommendation for a sustained time period. The Adaptive Thermal Monitor feature must be enabled for the processor to remain within its specifications.
T
CASE
and DTS Based Thermal Specifications
To simplify compliance to thermal specifications at processor run time, the processor has a Digital Thermal Sensor (DTS) based thermal specification. Digital Thermal
Sensor outputs a relative die temperature from TCC activation temperature. T
CASE
based specifications are used for heatsink sizing while DTS-based specs are used for acoustic and fan speed optimizations while the server is operating. Some SKUs may share the same T
CASE
thermal profiles but have distinct DTS thermal profiles.
All thermal profiles, whether based on T
CASE format namely, y = mx + b. Where,
or DTS, follow the straight-line equation
y = temperature (T) in °C
m = slope (Ψ)
x = power (P) in Watts
b = y-intercept (T
LA
) (LA = local ambient)
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
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Figure 20.
Typical Thermal Profile Graph (Illustration Only)
4.3.3
Table 13.
Server Processor Thermal Profiles and Form Factors
Intel ® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families Stack T case and DTS Thermal Profiles and Correction Factors
T
CASE
(°C)
Thermal Profiles
DTS
(°C)
DTS max at TDP
Note: 5
E5-2690 v3 Small
(MCC)
E5-2680 v3 Small
(MCC)
E5-2670 v3 Small
(MCC)
E5-2660 v3 Small
(MCC)
E5-2650 v3 Small
(MCC)
E5-2640 v3 Small
(LCC)
E5-2630 v3 Small
(LCC)
E5-2620 v3 Small
(LCC)
90
85
85
135 12
120 12
120 12
105 10
105 10
8
8
6
1U
Square
1U
Square
1U
Square
1U
Square
1U
Square
1U
Square
1U
Square
1U
Square
0
0
0
0
0
0
0
0
18
10
10
10
10
10
10
10
T
C
=[0.235*P]
+58.2
T
C
=[0.235*P]
+56.3
T
C
=[0.235*P]
+56.3
T
C
=[0.236*P]
+54.2
T
C
=[0.235*P]
+54.2
T
C
=[0.246*P]
+52.2
T
C
=[0.243*P]
+51.4
T
C
=[0.248*P]
+51.5
T
DTS
=[0.299
*P]+58.2
99
T
DTS
=[0.311
*P]+56.3
T
DTS
=[0.310
*P]+56.3
95
95
T
DTS
=[0.329
*P]+54.2
90
T
DTS
=[0.324
*P]+54.2
90
T
DTS
=[0.363
*P]+52.2
86
T
DTS
=[0.392
*P]+51.4
86
T
DTS
=[0.371
*P]+51.5
85 continued...
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T
CASE
(°C)
Thermal Profiles
DTS
(°C)
DTS max at TDP
Note: 5
E5-2609 v3 Small
(MCC)
E5-2603 v3 Small
(LCC)
E5-2699 v3 Large
(HCC)
E5-2698 v3 Large
(HCC)
E5-2697 v3 Large
(HCC)
E5-2695 v3 Large
(HCC)
E5-2683 v3 Large
(HCC)
E5-2685 v3 Small
(MCC)
E5-2667 v3 Small
(LCC)
E5-2643 v3 Small
(LCC)
E5-2637 v3 Small
(LCC)
E5-2623 v3 Small
(LCC)
E5-2687W v3
Note: 3
Small
(MCC)
85
85
6
6
145 18
135 16
145 14
120 14
120 14
120 12
135 8
135 6
135 4
105 4
160 10
1U
Square
1U
Square
2U
Square
1U
Square
2U
Square
1U
Square
1U
Square
1U
Square
2
0
0
4
0
0
0
0
2U
Square
2U
Square
3
2
2U
Square
2
1U Square 0
WS
Passive
Tower
0
10
10
18
18
10
10
10
18
18
18
18
10
10
T
C
=[0.231*P]
+51.3
T
C
=[0.250*P]
+51.5
T
C
=[0.175*P ]
+51.0
T
C
=[0.221*P]+
58.2
T
C
=[0.177*P]
+51.0
T
C
=[0.221*P]+
56.1
T
C
=[0.220*P]
+56.1
T
C
=[0.235*P]
+56.3
T
C
=[0.202*P]
+50.5
T
C
=[0.205*P]
+49.6
T
C
=[0.205*P]
+48.9
T
C
=[0.250*P]
+53.9
T
C
=[0.190*P]
+44.3
T
DTS
=[0.325
*P]+51.3
80
T
DTS
=[0.353
*P]+51.5
T
DTS
=[0.243
*P]+51.0
83
88
T
DTS
=[0.277
*P]+58.2
97
T
DTS
=[0.276
*P]+51.0
93
T
DTS
=[0.314
*P]+56.1
95
T
DTS
=[0.285
*P]+56.1
92
T
DTS
=[0.304
*P]+56.3
94
T
DTS
=[0.336
*P]+50.5
97
T
DTS
=[0.369
*P]+49.6
97
T
DTS
=[0.402
*P]+48.9
T
DTS
=[0.433
*P]+53.9
T
DTS
=
[0.299*P]
+44.3
97
101
94
E5-2650L v3
E5-2630L v3
Small
(MCC)
Small
65
55
12
8
1U Square 0
1U Square 0
10
10
T
C
=[0.232*P]
+48.5
T
C
=[0.240*P]
+47.2
T
DTS
=[0.320
*P]+48.5
71
T
DTS
=[0.372
*P]+47.2
69 continued...
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Thermal Mechanical Specification and Design Guide
39
Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Specifications and Features
T
CASE
(°C)
Thermal Profiles
DTS
(°C)
DTS max at TDP
Note: 5
(LCC)
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design. Processor power may exceed TDP for short durations. Please see
Intel ® Turbo Boost Technology on page 50
3. This SKU is intended for dual processor workstations only and uses workstation specific use conditions for reliability assumptions.
4. Disabling C1E will result in an automatic reduction of DTSmax so that reliability is still protected. DTSmax will be reduced by the value shown 'C1E Disable Offset’. If thermal design has not been optimized to the reduced DTSmax value, throttling may result. Tcontrol is already an offset to DTSmax, therefore the absolute temp at which the
Tcontrol threshold is reached will shift by the same amount.
5. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later.
6. Tcase Minimum is 0°C
4.3.4 Server 4S Processor Thermal Profiles and Form Factors
Table 14.
Intel
T case
® Xeon ® Processor E5-4600 v3 Product Families Stack Product Family
and DTS Thermal Profiles and Correction Factors
Thermal Profiles
T
CASE
(°C)
DTS
(°C)
DTS max at
TDP
Note: 5
Correction
Factors
E5-4669 v3
E5-4667 v3
Large
(HCC)
Large
(HCC)
135 18
135 16
1U
Square
1U
Square
0
0
10
10
T
C
=[0.219*P
]+58.1
T
DTS
=[0.280
*P]+58.1
T
C
=[0.219*P
]+58.1
T
DTS
=[0.276
*P]+58.1
97
97
-0.007
-0.014
-0.007
-0.014
E5-4655 v3
E5-4627 v3
Small
(MCC
)
Small
(MCC
)
135 6
135 10
1U
Square
0
1U
Square
0
10
10
T
C
=[0.233*P
] + 56.3
T
DTS
=[0.352
*P] + 56.3
100
T
C
=[0.237*P
] + 56.9
T
DTS
=[0.332
*P] + 56.9
100
0.009
0.002
0.013
0.006
continued...
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40
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Processor Thermal Specifications and Features—Intel ® v3 Product Families
Xeon ® Processor E5-1600 / 2600 / 4600
Thermal Profiles
T
CASE
(°C)
DTS
(°C)
DTS max at
TDP
Note: 5
Correction
Factors
E5-4660 v3
E5-4650 v3
E5-4640 v3
E5-4620 v3
E5-4610 v3
Large
(HCC)
Large
(HCC)
Large
(HCC)
Large
(HCC)
Large
(HCC)
120
105
105
105
105
14
12
12
10
10
1U
Square
1U
Square
1U
Square
1U
Square
1U
Square
0
0
0
0
0
10
10
10
10
10
T
C
=[0.221*P
]+56.1
T
C
=[0.224*P
]+54.0
T
C
=[0.224*P
]+54.0
T
C
=[0.225*P
]+54.0
T
C
=[0.224*P
]+54.0
T
DTS
=[0.312
*P]+56.1
T
*P]+54.0
T
DTS
=[0.280
*P]+54.0
T
*P]+54.0
T
DTS
DTS
DTS
=[0.288
=[0.289
=[0.283
*P]+54.0
95
86
85
86
85
-0.005
-0.001
-0.001
0.000
0.000
-0.012
-0.008
-0.008
-0.007
-0.007
8
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design. Processor power may exceed TDP for short durations. Please see
Intel ® Turbo Boost Technology on page 50
3. These specifications may be updated as further characterization data becomes available.
4. Minimum T case
Specification is 0°C
5. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later. See doc 550666 for further details
4.3.5
Table 15.
Workstation Processor Thermal Profiles and Form Factors
Intel ® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families 1S
Workstation Stack T case
and DTS Thermal Profiles and Correction Factors
Thermal Profiles
T
CASE
(°C)
DTS
(°C)
DTS max at
TDP
Note: 5
E5-1680 v3
E5-1660 v3
E5-1650 v3
E5-1630 v3
Small
(LCC)
Small
(LCC)
Small
(LCC)
Small
(LCC)
140
140
140
140
8
8
6
4
WS Active
Tower
WS Active
Tower
WS Active
Tower
WS Active
Tower
3
0
2
5
10
10
10
10
T
C
=[0.175*P]+
41.7
T
C
=[0.173*P]+
41.7
T
C
=[0.178*P]+
41.8
T
C
=[0.177*P]+
41.4
T
DTS
= [0.321*P]
+ 41.7
T
DTS
= [0.352*P]
+ 41.7
T
DTS
= [0.364*P]
+ 41.8
88
92
94
T
DTS
= [0.428*P]
+ 41.4
103 continued...
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41
Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Specifications and Features
Thermal Profiles
T
CASE
(°C)
DTS
(°C)
DTS max at
TDP
Note: 5
E5-1620 v3
E5-1607 v3
E5-1603 v3
Small
(LCC)
Small
(LCC)
Small
(LCC)
140
140
140
4
4
4
WS Active
Tower
WS Active
Tower
WS Active
Tower
5
2
0
10
10
10
T
C
=[0.177*P]+
41.4
T
C
=[0.176*P]
+41.4
T
C
=[0.181*P]
+41.8
T
DTS
= [0.428*P]
+ 41.4
T
+41.4
T
DTS
DTS
=[0.423*P]
=[0.336*P]
+41.8
103
102
90
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design. Processor power may exceed TDP for short durations. Please see
Intel ® Turbo Boost Technology on page 50
3. This SKU is intended for single processor workstations only and uses workstation specific use conditions for reliability assumptions.
4. Minimum T case
Specification is 0°C
5. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later.
4.3.6 Embedded Server Processor Thermal Profiles
Embedded Server processor SKUs target higher case temperatures and/or Network
Equipment Building System (NEBS) thermal profiles for embedded communications server and storage form factors. The following thermal profiles pertain only to those specific SKUs. Network Equipment Building System is the most common set of environmental design guidelines applied to telecommunications equipment in the
United States.
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Xeon ® Processor E5-1600 / 2600 / 4600
Table 16.
Embedded Server Processor Thermal Profiles
T
CASE
Thermal
Profile
T
CASE
(°C)
(Nominal)
T
CASE
(°C)
(Short
Term)
105 12 0 18 91 T
C
=[0.228
*P] + 52.0
T
C
=[0.22
8 *P] +
67.0
DTS Thermal
Profile
T
DTS
(°C)
(Nominal
)
T
DTS
52.0
=[0.2
96 *P] +
DTS max at
TDP
(nomi nal)
Note: 7
85
T
DTS
(°C)
(Short
Term)
T
DTS
67.0
=[0.2
96 *P] +
DTS max at
TDP
(Short
Term)
Note: 7
100
105 12 0 18 87 T
C
=[0.190
* P] + 52.0
T
C
=[0.190 *
P] + 67.0
T
DTS
=
[0.258 *
P] + 52.0
81
75 12 0 18 87 T
C
= [0.267
* P] + 52.0
T
C
=
[0.267 *
P] + 67.0
T
DTS
=
[0.350 *
P] + 52.0
80
T
DTS
=
[0.258 *
P] + 67.0
96
T
DTS
=
[0.350 *
P] + 67.0
95
75 10 0 18 87 T
C
= [0.267
* P] + 52.0
T
C
=
[0.267 *
P] + 67.0
T
DTS
=
[0.352 *
P] + 52.0
80 T
DTS
=[0.352 *
P] + 67.0
95 continued...
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Specifications and Features
75 8 0 18 87
T
CASE
(°C)
T
CASE
Thermal
Profile
(Nominal)
T
CASE
(°C)
(Short
Term)
T
C
= [0.267
* P] + 52.0
T
C
=
[0.267 *
P] + 67.0
DTS Thermal
Profile
T
DTS
(°C)
(Nominal
)
T
DTS
=
[0.378 *
P] + 52.0
DTS max at
TDP
(nomi nal)
Note: 7
82
T
DTS
(°C)
(Short
Term)
T
DTS
=
[0.378 *
P] + 67.0
DTS max at
TDP
(Short
Term)
Note: 7
97
52 6 0 18 88 T
C
= [0.404
* P] + 52.0
T
C
=
[0.404 *
P] + 67.0
T
DTS
=[0.509 *
P] + 52.0
81 T
DTS
=[0.509 *
P] + 67.0
96
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design at maximum T
CASE
Processor power may exceed TDP for short durations. Please see
Intel ® Turbo Boost Technology
on page 50.
.
3. Power specifications are defined at all VIDs found in the Intel ® Xeon ®
Families, Volume 2 of 2, Registers Datasheet and Intel ® Xeon ®
Processor E5-1600 and E5-2600 v3 Product
Processor E5-1600 and E5-2600 v3 Product
Families, Volume 1 of 2, Electrical Datasheet . Processors may be delivered under multiple VIDs for each frequency.
4. The Nominal Thermal Profile must be used for all normal operating conditions or for products that do not require
NEBS Level 3 compliance.
5. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances per year, as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durations exceeding 360 hours per year violate the processor thermal specifications and may result in permanent damage to the processor.
6. Minimum T case
Specification is 0°C
7. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later.
4.3.7 Thermal Metrology
The minimum and maximum case temperatures (T
CASE
) specified are measured at the geometric top center of the processor integrated heat spreader (IHS). The following figures illustrate the location where T thermocouple probe.
CASE
temperature measurements should be made. The figures also include geometry guidance for modifying the IHS to accept a
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Xeon ® Processor E5-1600 / 2600 / 4600
Figure 21.
Case Temperature (T
CASE
) Measurement Location for Large Package
B
Grantley Large Package
Units are mm
0.790 ±0.150
0.380 ±0.030
1.020 ±0.250
A
26.250
DETAIL A
Package Center
0.381 ±0.038
0.510 ±0.080
SECTION B
Pin 1 Indicator
25.500
B
Note: Figure is not to scale and is for reference only.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Specifications and Features
Figure 22.
Case Temperature (T
CASE
) Measurement Location for Small Package
Grantley Small Package
Units are mm
B
0.790 ±0.150
0.380 ±0.030
1.020 ±0.250
A
DETAIL A
PACKAGE CENTER
0.381 ±0.038
0.510 ±0.080
SECTION B
PIN 1 INDICATOR
22.500
B
Note: Figure is not to scale and is for reference only.
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Processor Thermal Solutions—Intel ®
Families
Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product
5.0 Processor Thermal Solutions
5.1 Processor Boundary Conditions for Shadowed and Spread
Core Layouts
Intel's processors go into a variety of board layouts and form factors. Boundary conditions for the SSI EEB layout (sometimes referred to as "shadowed layout") are included in the table below for 1U, 2U and Workstation systems. A typical shadowed layout with a 1U heat sink is shown below.
Figure 23.
Typical Shadowed Layout
Airflow Direction
Another approach is the "spread core" layout, where neither processor is "shadowed" by the other, as shown below.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Solutions
Figure 24.
Typical Spread Core Layout
Table 17.
Processor Boundary Conditions for Shadowed and Spread Core Layouts
T
LA
for each TDP SKU (°C) 6
1U
1U
2U
Spread core,
24
DIMMs
SSI
EEB,
16
DIMMs
SSI
EEB,
16
DIMMs
70 x 106 x
25.5mm
(Narrow)
[STS200PNR]
91.5 x 91.5 x
25.5mm
(Square)
[STS200P]
91.5 x 91.5 x
64mm
(Square)
[STS200C]
Copper base
Aluminum fin
(Passive)
Copper base
Aluminum fin
(Passive)
Copper base
Aluminum fin with
Heatpipe
(Passive)
10.2
15.2
26.0
0.233
0.382
0.138
0.256 41.5 41.5 41.5 41.5 41.5 41.5 N/A
0.250 47.4 48.6 49.1 51.4 53.1 54.8 N/A
N/A
N/A
N/A
N/A
0.201 42.8 43.5 43.9 45.3 46.4 47.5 47.9 48.2 N/A
WS SSI
EEB,
16
DIMMs
100 x 70 x
123.2mm
(Tower)
Copper base
Aluminum fin with
Heatpipe
(Active)
2600
RPM
Not meaningful for Active
Heatsink
0.197 38.2 38.5 38.7 39.3 39.7 40.1 40.3 40.5 40.9
Note:
1. 1U = 1.75" which is the outside-to-outside dimension of the server enclosure.
2. SSI Specification is found at https://ssiforum.org/ .
continued...
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T
LA
for each TDP SKU (°C) 6
3. Refer to Intel Reference Design Heat Sink
on page 55. Dimensions of heat sink do not include socket or processor.
4. Airflow through the heat sink fins with zero bypass. Max target for pressure drop (ΔP) measured in inches H
2
O.
5. Mean + 3σ performance for a heat sink on top of the Thermal Test Vehicle (TTV). These estimates are not necessarily the thermal performance targets needed to meet processor thermal specifications. Includes thermal performance of Honeywell*
PCM45F.
6. System ambient T
SA
= 35°C. Increase in air temperature inside the chassis (from the front grill to the downstream, or shadowed, processor heatsink). Includes preheat from hard drives, VRs, front processor, etc. as shown below.
5.2 Heatsink Design Considerations
To remove the heat from the processor, three basic parameters should be considered:
• The area of the surface on which the heat transfer takes place - Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is to attach a heatsink to the IHS. A heatsink can increase the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base.
• The conduction path from the heat source to the heatsink fins - Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink. In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict. Thermal interface material (TIM) is used to fill in the gap between the IHS and the bottom surface of the heatsink, and thereby improves the overall performance of the thermal stackup (IHS-TIM-Heatsink).
With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as well as the pressure load applied to it.
• The heat transfer conditions on the surface upon which heat transfer takes place -
Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air, TLA, and the local air velocity over the surface. The higher the air velocity over the surface, the more efficient the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes the fin faces and the heatsink base.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Solutions
5.3
5.3.1
5.3.2
An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink.
Passive heatsink solutions require in-depth knowledge of the airflow in the chassis.
Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are typically larger (and heavier) than active heatsinks due to the increase in fin surface necessary to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases; it is more likely that the air will travel around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins.
Thermal Design Guidelines
Intel
®
Turbo Boost Technology
Intel ® Turbo Boost Technology is a feature available on certain Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families SKUs that opportunistically, and automatically allows the processor to run faster than the marked frequency if the part is operating below certain power and temperature limits. With Turbo Boost enabled, the instantaneous processor power can exceed TDP for short durations resulting in increased performance.
System thermal design should consider the following important parameters (set via
BIOS):
• POWER_LIMIT_1 (PL1) = average processor power over a long time window
(default setting is TDP)
• POWER_LIMIT_2 (PL2) = average processor power over a short time window above TDP (short excursions). Maximum allowed by the processor is 20% above
TDP for all SKUs (1.2 * TDP). Note that actual power will include IMON inaccuracy.
• POWER_LIMIT_1_TIME (Tau) = time constant for the exponential weighted moving average (EWMA) which optimizes performance while reducing thermal risk. (dictates how quickly power decays from its peak)
Please note that although the processor can exceed PL1 (default TDP) for a certain amount of time, the exponential weighted moving average (EWMA) power will never
exceed PL1.
A properly designed processor thermal solution is important to maximizing Turbo
Boost performance. However, heatsink performance (thermal resistance, Ψ
CA
) is only one of several factors that can impact the amount of benefit. Other factors are operating environment, workload and system design. With Turbo Mode enabled, the processor may run more consistently at higher power levels, and be more likely to operate above T
CONTROL in higher acoustics.
, as compared to when Turbo Mode is disabled. This may result
Thermal Excursion Power
Under fan failure or other anomalous thermal excursions, processor temperature
(either T
CASE
or DTS) may exceed the thermal profile for a duration totaling less than
360 hours per year without affecting long term reliability (life) of the processor. For
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5.3.3
more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the processor to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred.
Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below thermal profile by TCC activation, then data integrity is not assured. At some higher thresholds, THERMTRIP_N will enable a shut down in an attempt to prevent permanent damage to the processor.
A designer can check anomalous power ratio of an individual part by reading register
PWR_LIMIT_MISC_INFO and dividing the value of PN_POWER_OF_SKU by the sku
TDP. Please refer to Intel ® Xeon ® Processor E5-1600 and E5-2600 v3 Product
Families, Volume 2 of 2, Registers Datasheet and Intel ® Xeon ® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet
Thermal Characterization Parameters
The case-to-local ambient Thermal Characterization Parameter ( Ψ
CA
) is defined by:
Ψ
CA
= (T case
- T
LA
) / TDP
Where:
T
CASE
= Processor case temperature (°C)
T
LA
= Local ambient temperature before the air enters the processor heatsink (°C)
TDP = TDP (W) assumes all power dissipates through the integrated heat spreader.
This inexact assumption is convenient for heatsink design.
Ψ
CA
= Ψ
CS
+ Ψ
SA
Where:
Ψ
CS
= Thermal characterization parameter of the TIM (°C/W) is dependent on the thermal conductivity and thickness of the TIM.
Ψ
SA
= Thermal characterization parameter from heatsink-to-local ambient (°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.
The following figure illustrates the thermal characterization parameters.
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Figure 25.
Thermal Characterization Parameters
5.4 Thermal Interface Material (TIM) Considerations
Thermal Interface Material between the processor IHS and the heatsink base is necessary to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier without the need for a separate TIM dispense or attachment process in the final assembly factory.
All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures that the entire area is covered. It is important to compensate for heatsink-to-processor positional alignment when selecting the proper TIM size.
When pre-applied material is used, it is recommended to have a protective cover.
Protective tape is not recommended as the TIM could be damaged during its removal step.
Thermal performance usually degrades over the life of the assembly and this degradation needs to be accounted for in the thermal performance. Degradation can be caused by shipping and handling, environmental temperature, humidity conditions, load relaxation over time, temperature cycling or material changes (most notably in the TIM) over time. For this reason, the measured T
CASE
value of a given processor may increase over time, depending on the type of TIM material.
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5.5
5.5.1
Table 18.
Mechanical Recommendations and Targets
Thermal solutions should be designed to meet the mechanical requirements described in this section.
Keep in mind that the heatsink retention will need to apply additional load in order to achieve the minimum Socket Static Total Compressive load. This load should be distributed over the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation.
F
ILM
+ F
HEATSINK
= F
SOCKET
Processor / Socket Stackup Height
The table below provides the stackup height of a processor and LGA2011-3 socket with processor fully seated. This value is the root sum of squares summation of: (a) the height of the socket seating plane above the motherboard after reflow, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances given in the processor, socket and
ILM drawings
Target Stackup Heights From Top of Board to Top of IHS
Intel ® Xeon ® Processor E5-1600 and
E5-2600 v3 Product Families 1,2,4
Integrated Stackup Height From Top of Board to Top of ILM
Stud (Dimension A)
Integrated Stackup Height From Top of Board to Top of IHS
Load Lip (Dimension B)
4.678 (+0.367)/(-0.231mm )
6.581±0.289
Integrated Stackup Height From Top of Board to Top of IHS
(Dimension C)
8.481±0.279
Notes: 1. Tolerance Stackus are a Root Sum of Squares (RSS) of all components in stack calculation using mother board surface as the reference point
2. Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Stackup targets are inclusive of all package sizes (large and small)
3. All packages are compatible with reference retention solutions and will meet mechanical specifications
Figure 26.
Integrated Stack Up Height
Note: ILM components removed for clarity
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Table 19.
The table below provides the available surface dimensions for cooling the processor when fully seated in LGA2011-3 socket. This value is the X and Y dimensions for the flat top of the IHS.
Available Cooling Area for Large and Small IHS
Available Area Large package
Small package
45.5 mm x 36.74 mm (1.791 in x 1.446 in)
40.5 mm x 36.74 mm (1.594 in x 1.446 in)
Figure 27.
Available Cooling Area for Top of Large and Small IHS
5.5.2
Table 20.
Processor Heatsink Mechanical Targets
Heatsink Mechanical Targets
Parameter
Heatsink Mass (includes retention)
Heatsink Applied Static
Compressive Load
Heatsink Applied Dynamic only
Compressive load
Min
222 N (50 lbf)
Max
600 g (1.32 lbm)
400 N (90 lbf)
445 N (100 lbf)
3
1,2
1,4,5
Notes
Notes: 1. These specifications apply to uniform compressive loading in a direction perpendicular to the processor top surface (IHS).
2. This is the minimum and maximum static force that can be applied by the heatsink retention to the processor top surface (IHS).
3. This specification prevents excessive baseboard deflection during dynamic events.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.
5. An experimentally validated test condition used a heatsink mass of 1.32 lbm (600g) with 25 G acceleration measured on a shock table with a dynamic amplification factor of 3. This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated dynamic load (1.32 lbm x 25 G x 3= 100 lbf).
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5.6
5.7
Heatsink Mechanical and Structural Considerations
An attachment mechanism must be designed to support the heatsink because there are no features on the socket on which to directly attach a heatsink. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the performance of the system, in particular:
• Ensuring thermal performance of the TIM applied between the IHS and the heatsink. TIMs, especially those based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Designs should consider the possible decrease in applied pressure over time due to potential structural relaxation in enabled components.
• Ensuring system electrical, thermal, and structural integrity under shock and vibration events, particularly the socket solder joints. The mechanical requirements of the attachment mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink attachment mechanism. Their design should provide a means for protecting socket solder joints, as well as preventing package pullout from the socket.
Please note that the load applied by the attachment mechanism must comply with the processor mechanical specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as discussed in
on page 63.
A potential mechanical solution for heavy heatsinks is the use of a supporting mechanism such as a backer plate or the utilization of a direct attachment of the heatsink to the chassis pan. In these cases, the strength of the supporting component can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.
Intel Reference Design Heat Sink
Intel has several reference heat sinks for the Grantley platform. This section details the design targets and performance of each. These heat sinks are also productized as part of Intel's Boxed Processors retail program (product codes shown in parentheses).
For more information please goto Boxed Processor Specifications on page 67.
Below are the 1U Square and 1U Narrow heatsinks (STS200P and STS200PNRW respectively).
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Figure 28.
1U Form Factor Heat Sinks
Below are the 2U Square active and passive heatsinks (STS200C).
Figure 29.
2U Form Factor Heat Sinks
Below is the Tower Active heatsink.
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Figure 30.
Workstation Form Factor Heat Sink
5.7.1
Heat Sink Performance
The graphs below show mean thermal resistance (Ψ
CA
) and pressure drop (ΔP) as a function of airflow. Best-fit equations are also provided. The sample calculations
match the boundary conditions given in the Processor Boundary Conditions for
Shadowed and Spread Core Layouts on page 47.
2U Square Heatsink Performance
The following performance curves are based on the Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV).
Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note for details.
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• Ψ
CA
TTV
(mean), µ = 0.127 + (1.3901)*(CFM) -0.9862
(°C/W). This is based on Lukeville
• Ψ
CA
(mean), µ = 0.134 + (1.3901)*(CFM)
Looneyville TTV
-0.9862
(°C/W). This is based on
• Ψ
CA
(variance), σ = 0.0062 (°C/W)
• ΔP = (6.91E-05)*(CFM) 2 + (3.50E-3)*(CFM) (in. H
2
O)
5.7.2
Sample calculation when airflow = 26 CFM
• Ψ
CA
Based on Lukeville TTV
— Ψ
CA
(µ) = 0.127 + (1.3901)*(26) -0.9862
= 0.183 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.183 + 3 * (0.0062) = 0.202 (°C/W)
• Ψ
CA
Based on Looneyville TTV
— Ψ
CA
(µ) = 0.134 + (1.3901)*(26) -0.9862
= 0.190 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.190 + 3 * (0.0062) = 0.209 (°C/W)
• ΔP = (6.91E-05)*(26) 2 + (3.50E-3)*(26) = 0.138 (in. H
2
O)
1U Square Heatsink Performance
The following performance curves are based on the Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV).
Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note for details.
• Ψ
CA
(mean), µ = 0.147 + (1.60914)*(CFM) -1.03664
(°C/W). This is based on
Lukeville TTV
• Ψ
CA
(mean), µ = 0.154 + (1.60914)*(CFM) -1.03664
(°C/W). This is based on
Looneyville TTV
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• Ψ
CA
(variance), σ = 0.0024 (°C/W)
• ΔP = (2.41E-04)*(CFM) 2 + (2.15E-02)*(CFM) (in. H
2
O)
5.7.3
Sample calculation when airflow = 15.2 CFM.
• Ψ
CA
Based on Lukeville TTV
— Ψ
CA
(µ) = 0.147 + (1.60914)*(15.2) -1.03664
= 0.243 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.243 + 3 (0.0024) = 0.250 (°C/W)
• Ψ
CA
Based on Looneyville TTV
— Ψ
CA
(µ) = 0.154 + (1.60914)*(15.2) -1.03664
= 0.250 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.250 + 3 (0.0024) = 0.257 (°C/W)
• ΔP = (2.41E-04)*(15.2) 2 + (2.15E-02)*(15.2) = 0.382 (in. H
2
O)
1U Narrow Heatsink Performance
The following performance curves are based on the Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV).
Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note for details.
• Ψ
CA
TTV
(mean), µ = 0.151 + (1.254)*(CFM) -0.874
(°C/W). This is based on Lukeville
• Ψ
CA
TTV
(mean), µ = 0.158 + (1.254)*(CFM) -0.874
(°C/W). This is based on Looneyville
• Ψ
CA
(variance), σ = 0.0056 (°C/W)
• ΔP = (5.12E-04)*(CFM) 2 + (1.76E-02)*(CFM) (in. H
2
O)
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5.7.4
Sample calculation when airflow = 10.2 CFM.
• Ψ
CA
Based on Lukeville TTV
— Ψ
CA
(µ) =0.151 + (1.254)*(10.2) -0.874
= 0.316 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.316 + 3 (0.0056) = 0.333 (°C/W)
• Ψ
CA
Based on Looneyville TTV
— Ψ
CA
(µ) =0.158 + (1.254)*(10.2) -0.874
= 0.323 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.323 + 3 (0.0056) = 0.340 (°C/W)
• ΔP = (5.12E-04)*(10.2) 2 + (1.76E-02)*(10.2) = 0.233 (in. H
2
O)
Workstation Tower Active Heatsink Performance
The following performance curves are based on the Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV).
Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note for details.
• Ψ
CA
TTV
(mean), µ = 0.102 + (1.559)*(CFM) -1.011
(°C/W). This is based on Lukeville
• Ψ
CA
TTV
(mean), µ = 0.109 + (1.559)*(CFM) -1.011
(°C/W). This is based on Looneyville
• Ψ
CA
(variance), σ = 0.0101 (°C/W)
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5.7.5
5.7.6
Sample calculation when airflow = 23.2 CFM.
• Ψ
CA
Based on Lukeville TTV
— Ψ
CA
(µ) =0.102 + (1.559)*(23.2) -1.011
= 0.167 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.167 + 3 (0.0101) = 0.197 (°C/W)
• Ψ
CA
Based on Looneyville TTV
— Ψ
CA
(µ) =0.109 + (1.254)*(23.2
-0.874
= 0.174 (°C/W)
— Ψ
CA
(µ + 3σ) = 0.174 + 3 (0.0101) = 0.204 (°C/W)
Mechanical Load Range
Intel's reference heat sinks are thermally validated for the load range described in the
Processor Heatsink Mechanical Targets
on page 54.
Thermal Interface Material (TIM)
Honeywell PCM45F material was chosen as the interface material for analyzing boundary conditions and processor specifications. The recommended minimum activation load for PCM45F is ~15 PSI [103 kPA]. Meeting the minimum heat sink load targets described in
Processor Heatsink Mechanical Targets
on page 54 ensures that this is accomplished. The largest package has a usable area of ~ 2.6 in 2 which translates to a pressure of 19 PSI [131 kPA] at minimum load of 50 lbf [222 N].
Please refer to
Thermal Interface Material (TIM) on page 68 which outlines the TIM
for Boxed Heat Sinks which may be different.
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6.0 Processor Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that interfaces with the baseboard via an LGA2011-3 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Diagram below shows a sketch of the processor package components and how they are assembled together.
The package components shown below include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 31.
Processor Package Assembly Sketch
Notes:
6.1
• Socket and baseboard are included for reference and are not part of processor package.
• Processor package land count may be greater than socket contact count
Package Size
The processor has two different form factors Small and Large. Both form factors are compatible with socket 2011-3 (R3) and the reference ILMs. Size of IHS and dimensions of package substrate vary between the two form factors. For detailed
drawings see Mechanical Drawings
on page 78. For Sku specific identification of package for factors see
Processor Thermal Specifications on page 36. All Low Core
Count (LCC) and Mid Core Count (MCC) SKUs are Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Small form factor. All High Core Count (HCC) SKUs are Intel factor.
® Xeon ® processor E5-1600 and E5-2600 v3 product families Large form
Substrate X-Y geometries for each package are:
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• Intel ® Xeon x 45mm
® processor E5-1600 and E5-2600 v3 product families Small: 52.5mm
• Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Large: 52.5mm
x 51mm
Figure 32.
Rendering of Intel ® Xeon ® families Small Form Factor
processor E5-1600 and E5-2600 v3 product
Figure 33.
Rendering of Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families Large Form Factor
6.2 Package Loading Specifications
The following table provides load specifications for the processor package. These maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The processor substrate should not be used as a mechanical reference or load bearing surface for thermal solutions.
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Table 21.
6.3
6.4
Table 22.
6.5
Processor Loading Specifications
Parameter Maximum Notes
Static Compressive Load 1068 N (240 lbf) This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism (ILM).
Dynamic Load 540 N (121 lbf) Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. This load will be a function of the geometry and mass of the enabling components used.
Note: • These specifications apply to uniform compressive loading in a direction normal to the processor
IHS.
Processor Mass Specification
The typical mass of the processor is currently 45 grams. This mass [weight] includes all the components that are included in the package.
Processor Materials
The table below lists some of the package components and associated materials.
Processor Materials
Component
Integrated heat Spreader
Substrate
Substrate lands
Material
Nickel Plated Copper
Halogen Free, Fiber Reinforced Resin
Gold Plated Copper
Processor Markings
Labeling locations and information are shown for Intel ® Xeon ® processor v3 product families Small and Large packages in the diagrams below.
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Figure 34.
Small Package Labeling
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Figure 35.
Large Package Labeling
6.6
Table 23.
Package Handling Guidelines
The processor can be inserted into and removed from a socket 15 times. The following table includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.
Load Limits for Package Handling
Parameter
Shear
Tensile
Torque
356 N (80 lbf)
156 N (35 lbf)
3.6 N-m (31.5 in-lbf)
Maximum Recommended
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7.0
7.1
7.1.1
7.1.2
Boxed Processor Specifications
Intel boxed processors are intended for system integrators who build systems from components available through distribution channels. The Intel ® Xeon ® processor
E5-1600 and E5-2600 v3 product families will be offered as Intel boxed processors.
Thermal solutions, however, will be sold separately.
Boxed Processor Thermal Solutions
Available Boxed Thermal Solution Configurations
Intel will offer three different Boxed Heat Sink solutions to support LGA2011-3 Boxed
Processors
1. Boxed Intel Thermal Solution STS200C (Order Code BXSTS200C): A Passive /
Active Combination Heat Sink Solution that is intended for processors with a 160W
TDP or lower in a pedestal or 145W in 2U+ chassis with appropriate ducting.
2. Boxed Intel Thermal Solution STS200P (Order Code BXSTS100P): A 25.5 mm Tall
Passive Heat Sink Solution that is intended for processors with a 135W TDP or lower in 1U, or 2U chassis with appropriate ducting. This heat sink is compatible with the square integrated load mechanism (Square ILM). Check with Blade manufacturer for compatibility.
3. Boxed Intel Thermal Solution STS200PNRW (Order Code BXSTS200PNRW): A 25.5
mm Tall Passive Heat Sink Solution that is intended for processors with a 135W
TDP or lower in 1U, or 2U chassis with appropriate ducting. This heat sink is compatible with the narrow integrated load mechanism (Narrow ILM). Check with
Blade manufacturer for compatibility.
Intel
®
Thermal Solution STS200C (Passive/Active Combination
Heat Sink Solution)
The STS200C, based on a 2U passive heat sink with a removable fan, is intended for a
160W TDP or lower in active configuration and 145W TDP in passive configuration.
This heat pipe-based solution is intended to be used as either a passive heat sink in a
2U or larger chassis, or as an active heat sink for pedestal chassis. Although the active combination solution with the fan installed mechanically fits into a 2U keepout, its use has not been validated in that configuration. The active fan configuration is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present.
The STS200C with the fan removed, as with any passive thermal solution, will require the use of chassis ducting and is targeted for use in rack mount or ducted-pedestal servers. The recommended retention for these heat sinks is the Square ILM. Refer to
Intel ® ILM Reference Designs on page 28 for more info.
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Figure 36.
STS200C Active / Passive Combination Heat Sink (with Removable Fan)
7.1.3 Intel
®
Thermal Solution STS200P and STS200PNRW (Boxed
25.5 mm Tall Passive Heat Sink Solutions)
The STS200P and STS200PNRW are available for use with boxed processors that have a 135W TDP and lower. These 25.5 mm tall passive solutions are designed to be used in SSI Blades, 1U, and 2U chassis where ducting is present. The use of a 25.5 mm tall heatsink in a 2U chassis is recommended to achieve a lower heatsink T flexibility in system design optimization. The recommended retention for the STS200P is the Square ILM. The recommended retention for the STS200PNRW is the Narrow
ILM. Refer to
Intel ® ILM Reference Designs on page 28 for more info.
LA
and more
Figure 37.
STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks
7.1.4 Thermal Interface Material (TIM)
These heat sinks will come pre-applied with Dow Corning TC-1996. Please consult your Intel representative or Dow Corning for more information.
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7.2
7.3
Boxed Processor Cooling Requirements
Meeting the processor's temperature specifications is a function of the thermal design
of the entire system. The processor temperature specifications are found in Processor
Thermal Specifications on page 36 of this document. Meeting the processor's
temperature specification is the responsibility of the system integrator.
STS200C (Passive/Active Combination Heat Sink Solution)
The active configuration should help meet the thermal processor requirements particularly for pedestal chassis designs. Some form of ducting is recommended to meet memory cooling and processor T
LA
temperature requirements. Use of the active configuration in a 2U rack mount chassis is not recommended, however.
In the passive configuration a chassis duct should be implemented.
The active solution can be used with a 160W TDP or lower. The passive solution can be used with a 145W TDP or lower.
STS200P and STS200PNRW (25.5 mm Tall Passive Heat Sink Solution)
These passive solutions are intended for use in SSI Blade, 1U or 2U rack configurations. It is assumed that a chassis duct will be implemented in all configurations.
These thermal solutions should be used with a 135W TDP or lower.
For a list of processor and thermal solution boundary conditions for common layouts, such as Ψ ca
, T
LA
, airflow, flow impedance, please refer to the section on Processor
Boundary Conditions for Shadowed and Spread Core Layouts
on page 47.
Mechanical Specifications
Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones
The boxed heat sink (thermal solution) is sold separately from the boxed processor.
Clearance is required around the thermal solution to ensure unimpeded airflow for
proper cooling. Baseboard keepout zones are shown in Mechanical Drawings on page
78 which detail the physical space requirements for each of the boxed heat sinks.
None of the heat sink solutions exceed a mass of 550 grams. See
on page 63 for processor loading specifications.
Boxed Heat Sink Support with ILM
Baseboards designed for Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families processors should include holes that are aligned with the ILM. Please refer to
Independent Loading Mechanism (ILM) Specifications on page 23 chapter for more
information.
Boxed heat sinks will require a #2 Phillips screwdriver to attach to the ILM. The screws should be tightened until they no longer turn easily. This is approximately 8 inch-pounds [0.90 N-m]. Exceeding this recommendation may damage the screw or other components.
Please refer the Grantley Manufacturing Advantage Service Document.
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7.4
Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Boxed Processor
Specifications
Fan Power Supply [STS200C]
The 4-pin PWM controlled thermal solution is offered to help provide better control over pedestal chassis acoustics. Fan RPM is modulated through the use of an ASIC located on the baseboard that sends out a PWM control signal to the 4th pin of the connector labeled as Control. This thermal solution requires a constant +12 V supplied to pin 2 of the active thermal solution and does not support variable voltage control or
3 ‑pin PWM control.
The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power header identification and location must be documented in the suppliers platform documentation, or on the baseboard itself. The baseboard fan power header should be positioned within 7 in. [177.8 mm ] from the center of the processor socket.
Description
PWM Control Frequency Range
Min
Frequency
21,000
Nominal
Frequency
25,000
Max
Frequency
28,000
Unit
Hz
Description
+12 V: 12 volt fan power supply
IC: Fan Current Draw
SENSE: SENSE frequency
10.8
N/A
2
Min
12
1.25
2
Typical
Steady
12
1.5
2
Max
Steady
13.2
2.2
2
Max
Startup
Unit
V
A
Pulses per fan revolution
Intel
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Boxed Processor Specifications—Intel ®
Families
Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product
Figure 38.
Fan Cable Connector Pin Out for 4-Pin Active Thermal Solution
7.5
3
4
1
2
Pin Number Signal
Ground
Power: (+12 V)
SENSE: 2 pulses per revolution
Control: 21 - 28 KHz
Boxed Processor Contents
The Boxed Processor and Boxed Thermal Solution contents are outlined below.
Boxed Processor
• Intel ® Xeon ® processor E5-1600 and E5-2600 v3 product families
• Installation and warranty manual
• Intel Inside ® Logo
Boxed Thermal Solution
• Thermal solution assembly
• Thermal interface material (pre-applied)
• Installation and warranty manual
Color
Black
Yellow
Green
Blue
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Quality Reliability and
Ecological Requirements
8.0 Quality Reliability and Ecological Requirements
8.1 Use Conditions
Intel evaluates reliability performance based on the use conditions (operating environment) of the end product by using acceleration models.
The use condition environment definitions provided in the tables below are based on speculative use condition assumptions, and are provided as examples only.
Based on the system enabling boundary condition, the solder ball temperature can vary and needs to be comprehended for reliability assessment.
Use
Environment
Slow small internal gradient changes due to external ambient (temperature cycle or externally heated) Fast, large gradient on/off to max operating temp. (power cycle or internally heated including power save features)
High ambient moisture during low-power state
(operating voltage)
High Operating temperature and short duration high temperature exposures
Speculative
Stress
Condition
Bake
Example
Use
Condition
Temperature
Cycle
D T = 35 - 44°C
(solder joint)
THB/HAST
Example
7 yr.
Stress
Equivalent
550-930 cycles
Temp Cycle
(-25°C to 100°C)
Example
10 yr.
Stress
Equivalent
780-1345 cycles
Temp Cycle
(-25°C to 100°C)
T = 25 -30°C 85%RH
(ambient)
T = 95 - 105°C
(contact)
110-220 hrs at 110°C 85%RH
700 - 2500 hrs at 125°C
145-240 hrs at 110°C 85%RH
800 - 3300 hrs at 125°C
Use
Environment
Shipping and
Handling
Shipping and
Speculative Stress Condition
Mechanical Shock
• System-level
• Unpackaged
• Trapezoidal
• 25 g
• velocity change is based on packaged weight
Product Weight (lbs)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
≥120
Non-palletized Product Velocity
Change (in/sec)
250
225
205
175
145
125
Change in velocity is based upon a 0.5 coefficient of restitution.
Random Vibration
• System Level
Total per system:
• 10 minutes per axis
Example Use
Condition
Total of 12 drops per system:
• 2 drops per axis
• ± direction continued...
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Xeon ® Processor E5-1600 / 2600 / 4600
Use
Environment
Handling
Speculative Stress Condition
• Unpackaged
• 5 Hz to 500 Hz
• 2.20 g RMS random
• 5 Hz @ 0.001 g 2 /Hz to 20 Hz @ 0.01 g 2 /Hz (slope up)
• 20 Hz to 500 Hz @ 0.01 g 2 /Hz (flat)
• Random control limit tolerance is ± 3 dB
• 3 axes
8.2
8.2.1
8.2.2
Example Use
Condition
Intel
®
Reference Component Validation
Intel tests reference components individually and as an assembly on mechanical test boards and assesses performance to the envelopes specified in previous sections by varying boundary conditions.
While component validation shows a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess performance for specific conditions.
Board Functional Test Sequence
Each test sequence should start with components (baseboard, heatsink assembly, and so on) that have not previously endured any reliability testing.
Prior to the mechanical shock and vibration test, the units under test should be preconditioned for 72 hours at 45°C. The purpose is to account for load relaxation during burn-in stage.
The test sequence should always start with a visual inspection after assembly, and
BIOS/processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/processor/memory test.
Post-Test Pass Criteria Examples
The post-test pass criteria examples are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification can be met.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Quality Reliability and
Ecological Requirements
8.2.3
8.3
Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or connected:
• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC
Diags is an example of software that can be utilized for this test.
Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.
Cadmium shall not be used in the painting or plating of the socket. CFCs and HFCs shall not be used in manufacturing the socket.
Any plastic component exceeding 25 gm should be recyclable per the European Blue
Angel recycling standards.
Supplier is responsible for complying with industry standards regarding environmental care as well as with the specific standards required per supplier's region. More specifically, supplier is responsible for compliance with the European regulations related to restrictions on the use of Lead and Bromine containing flame-retardants.
Legislation varies by geography, European Union (RoHS/WEEE), China, California, and so forth.
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.
Halogen flame retardant free (HFR-Free) PCB: Current guidance for the socket pad layout supports FR4 and HFR-Free designs. In future revisions of this document,
Intel will be providing guidance on the mechanical impact to using a HFR-free laminate in the PCB. This will be limited to workstations.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/ pending exemption applies.
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Xeon ® Processor E5-1600 / 2600 / 4600
Note: RoHS implementation details are not fully defined and may change.
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Component Suppliers
Appendix A Component Suppliers
Customers can purchase the Intel reference or collaboration thermal solutions from the suppliers listed in the following table.
Table 24.
Item
1U Square Heatsink
Assy with TIM
(91.5x91.5x25.5)
1U Narrow Heatsink
Assy with TIM
(70x106x25.5)
2U Active/Combo
Heatsink Assy w/TIM,
Fan Guard
Delrin eRing retainer
Intel ® Reference or Collaboration Thermal Solutions
Intel Part Number
E89205-001
G16539-001
Supplier PN contact supplier contact supplier
Delta Supplier
Contact Info
Jason Tsai
Delta Products Corp
Portland, Oregon [email protected]
971-205-7074
E62452-004
G13624-001 contact supplier
FT1008-A ITW Electronics
Business Asia Co., Ltd.
Foxconn Supplier
Contact Info
Cary Huang 黃寬裕
Foxconn Technology
Co, Inc.
2525 Brockton Dr.,
Suite 300
Austin, TX 78758
Phone: 512-670-2638 [email protected]
om
Thermal Interface
Material (TIM)
N/A PCM45F
TC-5022
Honeywell
Dow Corning
Chak Chakir [email protected]
m
512-989-7771
Judy Oles [email protected]
om
+1-509-252-8605
Ed Benson e.benson@dowcorning.
com
+1-617-803-6174
Table 25.
Item
LGA 2011-3
Socket POR
LGA 2011-3
Square ILM
LGA 2011-3
Narrow ILM
LGA 2011-3
Backplate
Supplier
Contact Info
Customers can purchase the Intel LGA2011-3 sockets and reference LGA2011-3 ILMs from the suppliers listed in the following table.
LGA2011-3 Socket and ILM Components
Intel PN
G64443-001
G63449-005
Foxconn (Hon
Hai)
PE201127-435
5-01H
PT44L11-4711
Tyco
2201838-1
2229339-2
G43051-006
E91834-001
PT44L12-4711
PT44P41-4401
Eric Ling
2229339-1
2134440-1
Alex Yeh
Lotes
AZIF0001-
P004C
AZIF0018-
P001C
AZIF0019-
P001C
DCA-HSK-182-
T02
Cathy Yang
NA
Amtek
ITLG63449001
ITLG43051002
ITLE91834001
Alvin Yap
NA
Molex
105274-2000
105274-1000
105142-7000
Edmund Poh continued...
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Component Suppliers—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Item Intel PN Foxconn (Hon
Hai) eric.ling@foxco nn.com
503-693-3509 x225
Tyco [email protected]
m
Tel:
+886-2-21715
280
Lotes Amtek Molex
m.cn
Tel:
+1-86-20-8468
6519 x219 alvinyap@amte k.com.cn
Tel
+(86)752-2634
562
Cathy Yu cathy_yu@amt ek.com.cn
Tel
+(86)752-2616
809 edmund.poh@mol ex.com
Tel
+1-630-718-5416
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
Appendix B Mechanical Drawings
Table 26.
The following sections contain mechanical drawings of reference retention designs, processor package geometry and reference heat sink designs.
List of Mechanical Drawings
Package Mechanical Drawing Page 1
on page 81
Large Package Mechanical Drawing Page 2 on page 80
Package Mechanical Drawing Page 1
on page 81
Package Mechanical Drawing Page 2
on page 82
ILM Backplate Keep Out Zone on page 83
ILM Mounting Hole Keep Out Zone
on page 84
Narrow ILM Keep Out Zone on page 85
on page 86
on page 89
on page 90
1U Narrow Heat Sink Geometry (Page 1) on page 92
1U Narrow Heat Sink Geometry (Page 2) on page 93
1U Narrow Heat Sink Assembly (Page 1) on page 94
1U Narrow Heat Sink Assembly (Page 2) on page 95
1U Square Heat Sink Geometry (Page 1)
on page 96
1U Square Heat Sink Geometry (Page 2)
on page 97
1U Square Heat Sink Assembly (Page 1)
on page 98
1U Square Heat Sink Assembly (Page 2)
on page 99
2U Square Heat Sink Geometry (Page 1)
on page 100
2U Square Heat Sink Geometry (Page 2)
on page 101
2U Square Heat Sink Assembly (Page 1)
on page 102
2U Square Heat Sink Assembly (Page 2)
on page 103
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.1 Large Package Mechanical Drawing Page 1
Figure 39.
Intel ® Xeon ® Processor v3 Product Families Large Package Mechanical
Drawing Page 1
1 REV 3
H
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
NOTES:
1
SUBSTRATE MARK AREA.
2
COMPONENT ALLOWABLE AREA.
B (B1)
(B3)
G 1
C
F
E
D
C
B
A
(B4)
A
(C5)
(B2) (C1)
G
PIN 1 SECTION
B-B
G2
FIDUCIAL
H2
J3
J2
SEE DETAIL
B
MILLIMETERS
52.5 0.07
51 0.07
45 0.3
45 0.1
47.5 0.1
38.14 0.1
49.2 0.1
49.9
3.181 0.202
5.081 0.208
50.24
43.18
25.12
21.59
0.881
1.016
0.508
0.231
0.553
0.104
0.13
0.875 0.04
0.574 0.04
60 $
SYMBOL
B1
B2
B3
B4
C1
J2
J3
H2
J1
M1
G1
G2
H1
C5
F2
F4
C2
C3
M4
M5
M2
M3
M6
M7
COMMENTS
j 1 C B
j 1 C A
j 0.2 C B-A
j 0.15 C G-B
H
G
F
E
D
(C2)
(C3)
SEE DETAIL
A
C
IHS LID
IHS SEALANT
PACKAGE SUBSTRATE
TBD C
ALL LGA LANDS
0.021
SOLDER RESIST
PIN 1
J1
0.203 C
0.125
H1
0.245 C
0.125
G1
F2
F4
FIDUCIAL
2X M1
M5
M7
2X M3
2X M2
6X RM4
C
SECTION
A-A
DETAIL
A C
DETAIL
2011X
SCALE 60
B
M6
B
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ±0
ANGLES ±0.5
DESIGNED BY
DRAWN BY
DATE
DATE
DEPARTMENT
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CHECKED BY DATE
PACKAGE MECHANICAL DRAWING
THIRD ANGLE PROJECTION
APPROVED BY
MATERIAL
DATE
FINISH
SIZE DRAWING NUMBER
A1
SCALE:
4
G57902
DO NOT SCALE DRAWING
8 7 6 5 4 3 2 1
1
OF
3
REV
3
A
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.2 Large Package Mechanical Drawing Page 2
Figure 40.
Intel ® Xeon ® Processor v3 Product Families Large Package Mechanical
Drawing Page 2
H
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
2 REV 3
H
G
0.23 C E A
J
K
J
R1
18.2
9.1
2
F
E
E
DETAIL
C
T2
R2 N
M
0.23 C E A
M
V1
T1
6.4
12.8
E
D
C
B
V2
DETAIL
D
D
E SEE DETAIL
C
SEE DETAIL
D
D
SYMBOL
R1
T2
V1
R2
T1
V2
MILLIMETERS
1.09
1.09
13
0.2
14
0.2
COMMENTS
1.5
MAX ALLOWABLE
COMPONENT HEIGHT
C
B
A
DEPARTMENT
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SIZE DRAWING NUMBER
A1
SCALE:
4
G57902
DO NOT SCALE DRAWING
8 7 6 5 4 3 2 1
2
OF
3
REV
3
A
D
C
G
F
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.3 Package Mechanical Drawing Page 1
Figure 41.
Intel ® Xeon ® Processor v3 Product Families Small Package Mechanical
Drawing Page 1
1 REV 2
H
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
NOTES:
1 COMPONENT ALLOWABLE AREA. 1.5 mm MAX ALLOWABLE COMPONENT HEIGHT.
B1
C1
2X C3
D
E
G
F
E
D
C
B
A
SEE DETAIL B
G1
C4
C2
B2
H2
42X
J3
85X
J2
V
U
R
P
N
L
K
H
G
E
D
C
BA
AW
AV
AT
AR
AN
AM
AL
AJ
AH
AG
AE
AD
AB
AA
W
CC
CA
BY
BV
BU
BT
BP
BN
BM
BK
BJ
BG
BF
BD
BC
BB
DE
DD
DB
DA
CY
CV
CU
CR
CP
CM
CL
CK
CH
CG
CF
CD
G2
FIDUCIAL X3
TOP VIEW
(SOME DRAWING GEOMETRY
REMOVED FOR VISUAL CLARITY)
PIN 1
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58
C
PIN 1
57X J1
1
FIDUCIAL X2
H1
IHS SEALANT
PACKAGE SUBSTRATE
0.245 C
0.125
F2
SEE DETAIL A
SECTION A-A
0.203 C
0.125
IHS LID
DETAIL A
SCALE 12
C
C
F4
SYMBOL
G1
G2
C3
C4
H1
C1
C2
B1
B2
J2
J3
H2
J1
SYMBOL
F2
F4
MILLIMETERS
52.5 0.07
45 0.07
49.2 0.1
42.5 0.1
38.14 0.1
28.5 0.1
50.24
43.18
25.12
21.59
0.881
0.508
1.016
MILLIMETERS
PACKAGE A
3.181 0.202
5.081 0.194
COMMENTS
1 C E
1 C D
0.15 C E D
PACKAGE B
3.101 # 0.186
5.001 # 0.177
2X (M1)
M5
2X (M3)
DETAIL B
SCALE 60
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ±0
ANGLES ±0.5
THIRD ANGLE PROJECTION
M6
M7
BOTTOM VIEW
2X (M2)
6X R(M4)
DESIGNED BY
-
DRAWN BY
-
-
-
CHECKED BY
APPROVED BY
-
MATERIAL
SEE NOTES
DATE
-
DATE
-
-
-
DATE
DATE
-
FINISH
SEE NOTES
SYMBOL
M1
M2
M5
M6
M3
M4
M7
MILLIMETERS
0.231
0.553
0.104
0.13
0.875 0.04
0.574 0.04
60 $
DEPARTMENT
-
TITLE
COMMENTS
0.15 C E D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PACKAGE MECHANICAL DRAWING
SIZE DRAWING NUMBER
A1
SCALE:
4
G63360
DO NOT SCALE DRAWING
8 7 6 5 4 3 2 1
1
OF
3
REV
2
H
G
F
E
D
C
B
A
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.4 Package Mechanical Drawing Page 2
Figure 42.
Intel ® Xeon ® Processor v3 Product Families Small Package Mechanical
Drawing Page 2
H
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
2 REV 2
H
G
F
E
2X V2
2X V1
2X T1
W
U
T
P
N
L
K
J
G
F
E
C
BA
AW
AV
AU
AR
AP
AN
AL
AK
AH
AG
AE
AD
AC
AA
Y
CC
CB
BY
BW
BV
BT
BR
BN
BM
BK
BJ
BH
BG
BE
BD
BB
DF
DD
DC
DA
CY
CV
CU
CT
CP
CN
CM
CK
CJ
CG
CF
CD
PIN #1
2X T2
( 18.2
)
( 9.1
)
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58
SEE DETAIL C SEE DETAIL D
G
( 6.4
)
( 12.8
)
F
C
1.5
MAX ALLOWABLE
COMPONENT HEIGHT
G
F
E
D D
C
B
A
J b K
K
J
R1
SYMBOL
R1
R2
T1
T2
V1
V2
MILLIMETERS
1.09
1.09
13
0.2
14
0.2
COMMENTS
R2
N
M b N
M
C
B
G
DETAIL C
2X
SCALE 8
DETAIL D
2X
SCALE 8
F
DEPARTMENT
-
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SIZE DRAWING NUMBER
A1
SCALE:
4
G63360
DO NOT SCALE DRAWING
8 7 6 5 4 3 2 1
2
OF
3
REV
2
A
Intel
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Thermal Mechanical Specification and Design Guide October 2015
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.5 ILM Backplate Keep Out Zone
Figure 43.
ILM Backplate Keep Out Zone
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.6 ILM Mounting Hole Keep Out Zone
Figure 44.
ILM Mounting Hole Keep Out Zone
Intel
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B.7 Narrow ILM Keep Out Zone
Figure 45.
Narrow ILM Keep Out Zone
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.8 Narrow ILM 3D Keep Out Zone
Figure 46.
Narrow ILM 3D Keep Out Zone
Intel
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Thermal Mechanical Specification and Design Guide October 2015
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.9 ILM Keep Out Zone
Figure 47.
Square ILM Keep Out Zone
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.10 3D Keep Out Zone
Figure 48.
Square 3D Keep Out Zone
Intel
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B.11 Heat Sink Retaining Ring
Figure 49.
Heat Sink Retaining Ring
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.12 Heat Sink Spring
Figure 50.
Heat Sink Spring
Intel
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Thermal Mechanical Specification and Design Guide October 2015
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B.13 Heat Sink Spring Cup
Figure 51.
Heat Sink Spring Cup
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.14 1U Narrow Heat Sink Geometry (Page 1)
Figure 52.
1U Narrow Heat Sink Geometry (Page 1)
Intel
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.15 1U Narrow Heat Sink Geometry (Page 2)
Figure 53.
1U Narrow Heat Sink Geometry (Page 2)
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Thermal Mechanical Specification and Design Guide
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.16 1U Narrow Heat Sink Assembly (Page 1)
Figure 54.
1U Narrow Heat Sink Assembly (Page 1)
Intel
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Thermal Mechanical Specification and Design Guide October 2015
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.17 1U Narrow Heat Sink Assembly (Page 2)
Figure 55.
1U Narrow Heat Sink Assembly (Page 2)
October 2015
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Thermal Mechanical Specification and Design Guide
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.18 1U Square Heat Sink Geometry (Page 1)
Figure 56.
1U Square Heat Sink Geometry (Page 1)
Intel
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Thermal Mechanical Specification and Design Guide October 2015
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.19 1U Square Heat Sink Geometry (Page 2)
Figure 57.
1U Square Heat Sink Geometry (Page 2)
October 2015
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.20 1U Square Heat Sink Assembly (Page 1)
Figure 58.
1U Square Heat Sink Assembly (Page 1)
Intel
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Thermal Mechanical Specification and Design Guide October 2015
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.21 1U Square Heat Sink Assembly (Page 2)
Figure 59.
1U Square Heat Sink Assembly (Page 2)
October 2015
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.22 2U Square Heat Sink Geometry (Page 1)
Figure 60.
2U Square Heat Sink Geometry (Page 1)
Intel
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Thermal Mechanical Specification and Design Guide October 2015
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.23 2U Square Heat Sink Geometry (Page 2)
Figure 61.
2U Square Heat Sink Geometry (Page 2)
October 2015
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
B.24 2U Square Heat Sink Assembly (Page 1)
Figure 62.
2U Square Heat Sink Assembly (Page 1)
Intel
102
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Thermal Mechanical Specification and Design Guide October 2015
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Mechanical Drawings—Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.25 2U Square Heat Sink Assembly (Page 2)
Figure 63.
2U Square Heat Sink Assembly (Page 2)
October 2015
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Intel ® Xeon ® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide
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Key Features
- High performance
- Energy efficiency
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- Thermal specifications
- Mechanical design guidelines
- Heatsink design considerations
- Thermal interface material considerations
- Processor mechanical specifications
- Boxed processor specifications
- Quality reliability and ecological requirements
