LG U990/KU990 mobile phone Service Manual

Service Manual
Internal Use Only
Service Manual
U990/KU990
Model : U990/KU990
Date: November, 2007 / Issue 1.0
Table Of Contents
1. INTRODUCTION.................................. 5
1.1 Purpose ...................................................... 5
1.2 Regulatory Information ............................... 5
2. PERFORMANCE ..................................7
2.1 System Overview.........................................7
2.2 Usable environment.....................................8
2.3 Radio Performance......................................8
2.4 Current Consumption.................................16
2.5 RSSI BAR ..................................................17
2.6 Battery BAR ...............................................17
2.7 Sound Pressure Level ...............................18
2.8 Charging ....................................................18
4.11 Micro SD trouble ....................................122
4.12 Audio trouble..........................................123
4.13 Camera trouble ......................................136
4.14 Main LCD trouble...................................142
4.15 Bluetooth trouble....................................145
4.16 Bluetooth RF Test..................................146
4.17 Touch Screen trouble ............................147
5. DOWNLOAD.....................................148
5.1 Introduction ..............................................148
5.2 Downloading Procedure ..........................148
5.3 Troubleshooting Download Errors ..........161
5.4 Caution ....................................................166
3. TECHNICAL BRIEF............................19
6. BLOCK DIAGRAM ...........................167
3.1 General Description ...................................19
3.2 GSM Mode.................................................21
3.3 UMTS Mode...............................................25
3.4 LO generation and distribution circuits ......27
3.5 Off-chip RF Components ...........................27
3.6 Digital Baseband (DBB/MSM6280) ...........37
3.7 Subsystem(MSM6280) ..............................40
3.8 Power Block...............................................48
3.9 External memory interface.........................53
3.10 H/W Sub System .....................................55
3.11 Feature List..............................................72
3.12 Multimedia Chip Interface ........................78
3.13 Touch Screen Interface ...........................85
3.14 Main Features..........................................86
6.1 GSM & UMTS RF Block ..........................167
6.2 Interface Diagram ....................................169
4. TROUBLE SHOOTING.......................93
4.1 RF Component ..........................................93
4.2 SIGNAL PATH ...........................................94
4.3 Checking VCTCXO Block ..........................96
4.4 Checking Front-End Module Block ............98
4.5 Checking UMTS Block.............................101
4.6 Checking GSM Block...............................106
4.7 Power on trouble......................................112
4.8 SIM detect trouble....................................117
4.9 Key sense trouble ( KEYPAD ) ................118
4.10 Keypad backlight trouble .......................120
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-3-
7. CIRCUIT DIAGRAM..........................171
8. BGA IC PIN MAP..............................183
9. PCB LAYOUT ...................................191
10. Calibration......................................199
10.1 Usage of Hot-Kimchi..............................199
11. EXPLODED VIEW & REPLACEMENT
PART LIST ..................................... 203
11.1 EXPLODED VIEW ................................ 203
11.2 Replacement Parts
<Mechanic component> ....................... 205
<Main component> ............................... 208
11.3 Accessory ............................................. 226
LGE Internal Use Only
LGE Internal Use Only
-4-
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of commoncarrier telecommunication service of facilities accessed through or
connected to it. The manufacturer will not be responsible for any charges that result from such
unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
Following information is ESD handling:
sign.
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
LGE Internal Use Only
-6-
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item
Shape
Size
Specification
GSM900/1800/1900 and WCDMA2100 - Bar type Handset
103.5 X 54.4 X 14.8 mm
Weight
Under 112 g (with 1000mAh Battery)
Power
3.7 V normal, 1000 mAh Li-Ion
Talk Time
Over 170 min (WCDMA, Tx=10 dBm, Voice)
with 1000mAh)
Over 200 min (GSM, Max Tx-29dBm, Voice)
Standby Time
Over 250 Hrs (WCDMA, DRX=1.28)
(with 1000mAh)
Antenna
LCD
LCD Backlight
Over 250 Hrs (GSM, Paging period=5)
Internal type
Main 3” TFT, WQVGA, 262K
White LED Back Light
Camera
5.0 Mega pixel + VGA Video Call Camera
Vibrator
Yes (Coin Type)
LED Indicator
No
MIC
Yes
Receiver
Yes
Earphone Jack
Yes (18 pin)
Connectivity
Bluetooth, USB
External Memory
Yes(Micro SD)
I/O Connect
18 Pin
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
LGE Internal Use Only
2. PERFORMANCE
2.2 Usable environment
1) Environment
Item
Specification
Voltage
3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]
Operation Temp
-20 ~ +60°C
Storage Temp
-30 ~ +80°C
Humidity
85 % (Max)
2) Environment (Accessory)
Reference
Spec.
Min
Typ.
Max
Unit
TA Power
Available power
100
220
240
Vac
* CLA : 12 ~ 24 V(DC)
2.3 Radio Performance
1) Transmitter - GSM Mode
No
Item
GSM
100k~1GHz
DCS & PCS
MS allocated
Channel
1G~12.75GHz
-39dBm
1G~[A]MHz
-33dBm
[A]M~[B]MHz
-39dBm
[B]M~12.75GHz
-33dBm
-33dBm
Conducted
1
9k ~ 1GHz
-39dBm
Spurious
100k~880MHz
-60dBm
100k~880MHz
-60dBm
Emission
880M~915MHz
-62dBm
880M~915MHz
-62dBm
915M~1GHz
-60dBm
915M~1GHz
-60dBm
1G~[A]MHz
-50dBm
1G~[A]MHz
-50dBm
[A]M~[B]MHz
-56dBm
[A]M~[B]MHz
-56dBm
[B]M~12.5GHz
-50dBm
[B]M~12.5GHz
-50dBm
Idle Mode
* In case of DCS : [A] -> 1710, [B] -> 1785
LGE Internal Use Only
* In case of PCS : [A] -> 1850, [B] -> 1910
-8-
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
No
Item
GSM
30M ~ 1GHz
DCS & PCS
MS allocated
Channel
1G ~ 4GHz
-36dBm
1G~[A]MHz
-30dBm
[A]M~[B]MHz
-36dBm
[B]M~4GHz
-30dBm
-30dBm
Radiated
2
30M~1GHz
-36dBm
Spurious
30M ~ 880MHz
-57dBm
30M~880MHz
-57dBm
Emission
880M ~ 915MHz
-59dBm
880M~915MHz
-59dBm
915M~1GHz
-57dBm
915M~1GHz
-57dBm
1G~[A]MHz
-47dBm
1G~[A]MHz
-47dBm
[A]M~[B]MHz
-53dBm
[A]M~[B]MHz
-53dBm
[B]M~4GHz
-47dBm
[B]M~4GHz
-47dBm
Idle Mode
3
Frequency Error
4
Phase Error
±0.1ppm
±0.1ppm
±5(RMS)
±5(RMS)
±20(PEAK)
±20(PEAK)
3dB below reference sensitivity 3dB below reference sensitivity
5
Frequency Error
RA250 : ±200Hz
RA250: ±250Hz
Under Multipath and
HT100 : ±100Hz
HT100: ±250Hz
Interference Condition
TU50 : ±100Hz
TU50: ±150Hz
TU3 : ±150Hz
TU1.5: ±200Hz
Due to
modulation
0 ~ 100kHz
+0.5dB
0 ~ 100kHz
+0.5dB
200kHz
-30dB
200kHz
-30dB
250kHz
-33dB
250kHz
-33dB
400kHz
-60dB
400kHz
-60dB
600 ~ 1800kHz
-66dB
600 ~ 1800kHz
-60dB
1800 ~ 3000kHz
-69dB
1800 ~ 6000kHz
-65dB
3000 ~ 6000kHz
-71dB
≥6000kHz
-73dB
≥6000kHz
-77dB
400kHz
-19dB
400kHz
-22dB
600kHz
-21dB
600kHz
-24dB
1200kHz
-21dB
1200kHz
-24dB
1800kHz
-24dB
1800kHz
-27dB
Output RF
6
Spectrum
Due to
Switching
transient
** In case of DCS : [A] -> 1710, [B] -> 1785
* In case of PCS : [A] -> 1850, [B] -> 1910
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-9-
LGE Internal Use Only
2. PERFORMANCE
No
Item
GSM
DCS & PCS
Frequency offset
800kHz
Intermodulation product should
7
Intermodulation attenuation
–
be Less than 55dB below the
level of Wanted signal
Power control Power Tolerance Power control Power Tolerance
8
9
Transmitter Output Power
Burst timing
LGE Internal Use Only
Level
(dBm)
(dB)
Level
(dBm)
(dB)
5
33
±3
0
30
±3
6
31
±3
1
28
±3
7
29
±3
2
26
±3
8
27
±3
3
24
±3
9
25
±3
4
22
±3
10
23
±3
5
20
±3
11
21
±3
6
18
±3
12
19
±3
7
16
±3
13
17
±3
8
14
±3
14
15
±3
9
12
±4
15
13
±3
10
10
±4
16
11
±5
11
8
±4
17
9
±5
12
6
±4
18
7
±5
13
4
±4
19
5
±5
14
2
±5
15
0
±5
Mask IN
- 10 -
Mask IN
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2) Transmitter - WCDMA Mode
No
Item
Specification
1
Maximum Output Power
Class 3 : +24dBm(+1/-3dB)
2
Frequency Error
±0.1ppm
3
Open Loop Power control in uplink
±9dB@normal, ±12dB@extreme
Adjust output(TPC command)
4
Inner Loop Power control in uplink
cmd
1dB
2dB
3dB
+1
+0.5/1.5
+1/3
+1.5/4.5
0
-0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1
-0.5/-1.5
-1/-3
-1.5/-4.5
Group (10 equel command group)
+1
5
Minimum Output Power
+8/+12
+16/+24
-50dBm(3.84MHz)
Qin/Qout : PCCH quality levels
6
Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7
Transmit OFF Power
8
Transmit ON/OFF Time Mask
-56dBm(3.84MHz)
±25us
PRACH,CPCH,uplinlk compressed mode
±25us
Power varies according to the data rate
9
Change of TFC
DTX : DPCH off
(minimize interference between UE)
10
Power setting in uplink compressed
±3dB(after 14slots transmission gap)
11
Occupied Bandwidth(OBW)
5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M
12
Spectrum emission Mask
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M
-49dBc@∆f=8.5~12.5MHz,1M
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
2. PERFORMANCE
No
Item
Specification
33dB@5MHz, ACP>-50dBm
13
Adjacent Channel Leakage Ratio(ACLR)
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1K BW
-36dBm@f=50KHz~30MHz, 10K BW
-36dBm@f=30MHz~1000MHz, 100K BW
Spurious Emissions
-30dBm@f=1~12.5GHz, 1M BW
(*: additional requirement)
(*)-41dBm@f=1893.5~1919.6MHz, 300K
14
(*)-67dBm@f=925~935MHz, 100K BW
(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW
-31dBc@5MHz,Interferer -40dBc
15
Transmit Intermodulation
-41dBc@10MHz, Interferer -40dBc
17.5%(>-20dBm)
16
Error Vector Magnitude (EVM)
(@12.2K, 1DPDCH+1DPCCH)
-15dB@SF=4.768Kbps, Multi-code
17
Transmit OFF Power
transmission
3)Receiver - GSM Mode
LGE Internal Use Only
- 12 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
3) Transmitter - HSDPA Mode
No
Item
Specification
Sub-Test
1
Maximum Output Power
1=1/15,
2=12/15
21~25dBm / 3.84 MHz
3=13/15
4=15/8
20~25dBm / 3.84 MHz
5=15/7
6=15/0
19~25dBm / 3.84 MHz
Sub-test
Power Start of Ack/Nack Power Transmitter
in table
step
boundary
C.10.1.4
2
Spectrum Emission Mask
power step
size, P tolerance
[dB]
HS-DPCCH
5
3
step
[dB]
1
Start of Ack/Nack 6
+/- 2.3
2
Start of CQI
1
+/- 0.6
3
Middle of CQI
0
+/- 0.6
4
End of CQI
5
+/- 2.3
Sub-Test : 1=1/15, 2=12/15, 3=13/15,
4=15/8, 5=15/7, 6=15/0
4
Frequency offset
Minimum
Measurement
from carrier ∆f
requirement
Bandwidth
2.5 ~ 3.5 MHz
-35-15(∆f-2.5)dBc
30 kHz
3.5 ~ 7.5 MHz
-35-1(∆f-3.5)dBc
1 MHz
7.5 ~ 8.5 MHz
-35-10(∆f-7.5)dBc
1 MHz
8.5 ~ 12.5 MHz
-49dBc
1 MHz
Adjacent Channel Leakage
Sub-Test : 1=1/15, 2=12/15, 3=13/15,
Power Ratio (ACLR)
4=15/8, 5=15/7, 6=15/0
> 33 dB @ ±5 MHz
> 43 dB @ ±10 MHz
5
Error Vector Magnitude
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3GPP Not Complete
- 13 -
LGE Internal Use Only
2. PERFORMANCE
4)Receiver - GSM Mode
No
Item
GSM
DCS & PCS
1
Sensitivity (TCH/FS Class II)
-105dBm
-105dBm
C/Ic=7dB
Storage -30 ~ +85
Co-Channel Rejection
2
(TCH/FS Class II, RBER, TU high/FH)
3
4
Adjacent Channel
200kHz
C/Ia1=-12dB
C/Ia1=-12dB
Rejection
400kHz
C/Ia2=-44dB
C/Ia2=-44dB
Wanted Signal :-98dBm 1st
Wanted Signal :-96dBm 1st
interferer:-44dBm 2nd
interferer:-44dBm 2nd
interferer:-45dBm
interferer:-44dBm
Blocking Response
Wanted Signal :-101dBm
Wanted Signal :-101dBm
(TCH/FS Class II, RBER)
Unwanted : Depend on Frequency
Unwanted : Depend on Frequency
Intermodulation Rejection
5
LGE Internal Use Only
- 14 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
5) Receiver - WCDMA Mode
No
1
Item
Specification
Reference Sensitivity Level
-106.7 dBm(3.84 MHz)
-25dBm(3.84MHz)
2
Maximum Input Level
-44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(Class3)
33dB
3
Adjacent Channel Selectivity (ACS)
UE@+20dBm output power(Class3)
-56dBm/3.84MHz@10MHz
4
In-band Blocking
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@f=2050~2095 and
2185~2230MHz
UE@+20dBm output power(Class3)
-30dBm/3.84MHz@f=2025~2050 and
5
Out-band Blocking
2230~2255MHz
UE@+20dBm output power(Class3)
-15dBm/3.84MHz@f=1~2025 and
2255~12500MHz
UE@+20dBm output power(Class3)
-44dBm CW
6
Spurious Response
UE@+20dBm output power(Class3)
-46dBm CW@10MHz
7
Intermodulation Characteristic
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(Class3)
-57dBm@f=9KHz~1GHz, 100K BW
8
Spurious Emissions
-47dBm@f=1~12.5GHz, 1M BW
-60dBm@f=1920MHz~1980MHz, 3.84M BW
-60dBm@f=2110MHz~2170MHz, 3.84M BW
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
2. PERFORMANCE
6) Receiver - HSDPA Mode
No
1
Item
Specification
Maximum Input Level
Sub-Test : 1=1/15, 2=12/15, 3=13/15,
(BLER or R), 16QAM Only
4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
2.4 Current Consumption
1) KU990/U990 Current Consumption
WCDMA
GSM
Stand by
Voice Call
VT
Under 4.00 mA
Under 350 mA
Under 550mA
(DRX=1.28)
(Tx=10dBm)
(Tx=10dBm)
Under 4.00 mA
Under 300 mA
Paging=5 period
(Tx=29dBm)
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test
Condition : Speaker off, LCD backlight On)
LGE Internal Use Only
- 16 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.5 RSSI BAR
Level Change
WCDMA
GSM
BAR 4 → 3
-88 ± 2 dBm
-90 ± 2 dBm
BAR 3 → 2
-98 ± 2 dBm
-95 ± 2 dBm
BAR 2 → 1
-108 ± 2 dBm
-100 ± 2 dBm
BAR 1 → 0
-112 ± 2 dBm
-106 ± 2 dBm
2.6 Battery BAR
Indication
Standby
Bar 4
Over 3.81 ± 0.03V
Bar 4 → 3
3.80 ± 0.03V
Bar 3 → 2
3.70 ± 0.03V
Bar 2 → 1
3.61 ± 0.03V
Bar 1 → Empty
3.49 ± 0.03V
Low Voltage,
3.49 ± 0.03V (Stand-by) / 3.49 ± 0.03V (Talk)
Warning message+ Blinking
[Interval : 3min(Stand-by) / 1min(Talk)]
3.20 ± 0.03V (Stand-by)
Power Off
3.10 ± 0.03V (Talk)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
LGE Internal Use Only
2. PERFORMANCE
2.7 Sound Pressure Level
No
1
Test Item
Sending Loudness Rating (SLR)
2
Receiving Loudness Rating (RLR)
3
4
5
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Idle Noise-Sending (INS)
6
Idle Noise-Receiving (INR)
7
Sending Loudness Rating (SLR)
8
Receiving Loudness Rating (RLR)
9
10
11
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Idle Noise-Sending (INS)
12
Idle Noise-Receiving (INR)
MS
Headset
Nor
Specification
8 ±3 dB
-4 ± 3 dB
-15 ± 3 dB
17 dB
40 dB
-64 dBm0p
Under -47 dBPA
Under -36 dBPA
8±3dB
-1 ±3 dB
Max
Min
Min
Max
Nor
Max
-12 ±3 dB
25 dB
40 dB
-55 dBm0p
Under -45 dBPA
Under -40 dBPA
Max
Under -62 dBm
Nor
Max
Min
Min
Max
Nor
Max
TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
MS and
Headset
13
-. Acoustic (Max Vol.)
MS/Headset SLR : 8 ± 3dB
MS/Headset RLR : -15 ± 3dB/-12dB
(SLR/RLR : Mid-value setting)
2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage)
• Maximum Charging Voltage : 4.2 V
• Maximum Charging Current : 600 mA
• Normal Battery Capacity : 1000 mAh
• Charging Time : Max 3 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current) : 80 mA
• Cut-off voltage : 3.20 V (Stand-By), 3.10V (Talk)
LGE Internal Use Only
- 18 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 General Description
The U990 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based
GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF
architecture to eliminate intermediate frequencies, directly converting signals between RF and
baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset
phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.
[Fig 1.1] Block diagram of RF part
1
QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19 -
LGE Internal Use Only
3. TECHNICAL BRIEF
A generic, high-level functional block diagram of U990 is shown in Figure 1-1. One antenna collects
base station forward link signals and radiates handset reverse link signals. The antenna connects with
receive and transmit paths through a FEM(Front End Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that
translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx
analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx
baseband outputs share the same inputs to the MSM IC.
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM
device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The
RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then
amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge
from the RTR6275 transceiver.
In the GSM receive path, the received RF signals are applied through their band-pass filters and
down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are
shared with the UMTS receiver and routed to the MSM IC for further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency,
is divided into phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated
signal, to a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power
amplifier from a DAC within the MSM
U990 power supply voltages are managed and regulated by the PM6650 Power Management IC. This
versatile device integrates all wireless handset power management, general housekeeping, and user
interface support functions into a single mixed signal IC. It monitors and controls the external power
source and coordinates battery recharging while maintaining the handset supply voltages using low
dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for
monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip
variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter
circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout
and crystal oscillator signal presence are monitored to protect against detrimental conditions.
LGE Internal Use Only
- 20 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode U990’s receiver functions are split between the three RFICs as follows:
• GSM-900, DCS-1800, PCS-1900 and UMTS-2100 modes both use the RTR6275 IC only. Each
mode has independent front-end circuits and down-converters, but they share common baseband
circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2controlled parameters.
RF Front end consists of antenna, antenna switch module (LSHS-M090UH) which includes three RX
saw filters (GSM-900, DCS-1800 and PCS-1900). The antenna switch module allows multiple
operating bands and modes to share the same antenna. In U990, a common antenna connects to one
of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS1800, PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires
simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that
separates receive and transmit signals. GSM900, DCS1800, and PCS1900 operation is time division
duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not
required.
Control Logic (L : 0 ~ 0.1V, H : 2.6 ~ 2.8V)
Vc3
Vc2
Vc1
Vdd
GSM900 Tx
L
H
H
H
DCS1800/PCS1900 Tx
L
L
H
H
UMTS Tx/Rx
H
L
H
H
GSM 900 Rx
L
L/H
L
H
DCS 1800 Rx
H
L/H
L
H
PCS 1900 Rx
L
L/H
L
H
L/H : L and H are acceptable
[Table 1.1] Antenna Switch Module Control logic
2
The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application
Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS
Software documentation for details.
Copyright © 2007 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
The GSM900, DCS1800, and PCS1900 receiver inputs of RTR6275 are connected directly to the
transceiver front-end circuits(filters and antenna switch module). GSM900, DCS1800, and PCS1900
receiver inputs use differential configurations to improve common-mode rejection and second-order
non-linearity performance. The balance between the complementary signals is critical and must be
maintained from the RF filter outputs all the way into the IC pins
Since GSM900, DCS1800, and PCS1900 signals are time-division duplex (the handset can only
receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency
duplexers - this is accomplished in the switch module.
The GSM900, DCS1800, and PCS1900 receive signals are routed to the RTR6275 through band
selection filters and matching networks that transform single-ended 50-Ωsources to differential
impedances optimized for gain and noise figure. The RTR input uses a differential configuration to
improve second-order inter-modulation and common mode rejection performance. The RTR6275 input
stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The
downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)
having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter
circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6280 IC
for further processing (an interface shared with the RFR6275 UMTS receiver outputs)
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Copyright © 2007 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
[Fig 1.2] RTR6275 RX feature
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 23 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.2.2 GSM Transmitter
The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT) include on-chip output matching
inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The
capacitor value may be optimized for specific applications and PCB characteristics based on pass-band
symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.
6pF
68Ω
91Ω
5pF
120Ω
91Ω
51Ω
120Ω
[Fig 1.3] GSM Transmitter matching
The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design
guideline shows a tri-band GSM application.
Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented
to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter
to remove noise-spurious components and noise that would be amplified by the PA and appear in the
GSM Rx band
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Only for training and service purposes
3. TECHNICAL BRIEF
3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx
input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides
differential downconverter. This second stage input is configured differentially to optimize second-order
intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and
the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic
range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass
filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter
circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with
GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is
downconverting GSM signals and on when the UMTS is operating.
3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These
analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The
AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated
matching inductor that simplifies the external matching network to a single series capacitor to achieve
the desired 50-Ω interface.
The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly
high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer
to the antenna through the switch module.
The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip
loop filter components and the VC-TCXO. This provides a simplified design for multimode applications.
The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital
logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals
for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to
translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC
design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS
2100/1900 and UMTS 850 mode transmitting.
This design guideline shows only UMTS 2100 applications.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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LGE Internal Use Only
3. TECHNICAL BRIEF
[Figure 1.4] RTR6275 IC functional block diagram
LGE Internal Use Only
- 26 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.4 LO generation and distribution circuits
The integrated LO generation and distribution circuits are driven by internal VCOs to support various
modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE and UMTS band
upconverters and downconverters; with the help of these LO generation and distribution circuits, true
zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the
signal directly from RF to baseband and from baseband to RF.
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the
RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS
2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM850,
GSM900, DCS1800, and PCS1900. The second synthesizer (PLL2) provides the LO for the UMTS
2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer
frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates
most of PLL loop filter components onchip except two off-chip loop filter series capacitors, and
significantly reduces off-chip component requirement. With the integrated fractional-N PLL
synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time,
and low-integrated phase error.
3.5 Off-chip RF Components
3.5.1 UMTS PAM (U105: AWT6277R)
The UMTS PA output power is monitored by power detector circuits (U101 : RTR6275) . This detector
voltage can be used for transmitter calibration and monitor to meet RF system specification.
FL104
1
GND1
4
GND2
8
GND3
8.2p
C160
22u
C162
0.01u
L126
8.2nH
1
2
3
4
5
COUP
56p
L122
NA
PA_R1
VREG_TCXO_2.85V
PA_ON
1
5
PWR_DET
WCDMA_2100_TX_OUT
C165
NA
Q100
C173
100p
R123
2
3.3nH
AWT6277R
R124
51
3
3
IN
4.7nH
L128
20dB
VCC1
RFIN
GND1
VMODE
VREF
1
G2 G1
2
2
1.8p
3
4
50OHM
OUT
1
SCDY0003403
GND5
VCC2
GND4
RFOUT
GND3
GND2
L123
15nH
C161
5
IN
U105
11
10
9
8
7
6
C170
4
O1 G3
L124
U104
C169 5.6p
C164
1u
C163
100p
4
TX
5
7
RX
SAYZY1G95EB0B00
3
GND6
6
GND5
9
GND4
FL103
ANT
2
EFCH1950TDF1
C159
+VPWR
KRX102E
68
R126
100
R125
100
8 dB
[Figure 1.5] UMTS PAM, Duplexer, Coupler
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 27 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.5.2 VCTCXO (X100 : TG-5010LH(19.2M))
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the
reference frequency for all RFIC synthesizers as well as clock generation functions within the
MSM6280 IC. The oscillator frequency is controlled by the MSM6280 IC.s TRK_LO_ADJ pulse density
modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC
lowpass filter is recommended on this control line.
The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up
interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller
functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output
voltage is used to power the VCTCXO and is enabled before most other regulated outputs.
Any GSM mode power control circuits within the MSM6280 IC require a reference voltage for proper
operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6275 IC
GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF low
frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both
sides, plus ground above and below if routed on internal layers.
3.5.3 Front-End Module (FL100 : LSHS-M090UH)
This equipment uses a single antenna to support all handset operating modes, with an antenna switch
module select the operating frequency and band. UMTS operation requires simultaneous reception
and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and
transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10],
and GPIO[11]). These GPIOs are programmed to be ANT_SEL0, ANT_SEL1, and ANT_SEL2
respectively.
Vc3
Vc2
Vc1
Vdd
GSM900 Tx
L
H
H
H
DCS1800/PCS1900 Tx
L
L
H
H
UMTS Tx/Rx
H
L
H
H
GSM 900 Rx
L
L
L
H
DCS 1800 Rx
H
L
L
H
PCS 1900 Rx
L
L
L
H
[Table 1.2] Front End Module control logic
LGE Internal Use Only
- 28 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.5.4 PMIC Functional Block Diagram (U501 : PM6650-2M)
• Input power management
- Valid external supply attachment and removal detection
- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources
- Supports lithium-ion main batteries
- Trickle, constant current, constant voltage, and pulsed charging of the main battery
- Supports coin cell backup battery (including charging)
- Battery voltage detectors with programmable thresholds
- VDD collapse protection
- Charger current regulation and real-time monitoring for over-current protection
- Charger transistor protection by power limit control
- Control drivers for two external pass transistors and one external battery MOSFET MOSFET is optional
- Voltage, current, and power control loops
- Automated recovery from sudden momentary power loss
• Output voltage regulation
- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG
- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA
(or second MSMC) supply voltages
- Supports dynamic voltage scaling (DVS) for MSMC and PA
- Eleven low dropout regulator circuits with programmable output voltages, implemented using three
different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power
MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits.
- All regulators can be individually enabled/disabled for power savings
- Low power mode available on MSMA and MSMP regulators
- All regulated outputs are derived from a common bandgap referenceclose tracking
• Integrated handset-level housekeeping functions reduces external parts count, size, cost
- Analog multiplexer selects from 8 internal and up to 18 external inputs
- Multiplexer outputs offset and gain are adjusted, increasing the effective ADC resolution
- Adjusted multiplexer output is buffered and routed to an MSM device ADC
- Dual oscillators -32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock
- Crystal oscillator detector and automated switch-over upon lost oscillation
- Real time clock for tracking time and generating associated alarms
- On-chip adjustments minimize crystal oscillator frequency errors
- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal
- TCXO buffer control for optimal QPH/catnap timing
- Three-stage over-temperature protection (smart thermal control)
• Integrated handset-level user interfaces
- Four programmable current sinks recommended as keypad backlight, LCD backlight,
camera flash, and general-purpose drivers
- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments
- Speaker driver with programmable gain, turn-on time, and muting; differential operation
(drives external 8 Ω speakers with volume controlled 500 mW)
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LGE Internal Use Only
3. TECHNICAL BRIEF
• IC-level interfaces
- MSM device-compatible 3-line SBI for efficient initialization, status, and control
- Supports the MSM devices interrupt processing with an internal interrupt manager
- Many functions monitored and reported through real-time and interrupt status signals
- Dedicated circuits for controlled power-on sequencing, including the MSM devices reset signal
- Several events continuously monitored for triggering power-on/power-off sequences
- Supports and orchestrates soft resets
- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to
computers as a USB peripheral, or connecting the MSM device to other peripherals
- RUIM level translators enable MSM device interfacing with external modules
• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current
sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an
LED driver, and a reference voltage buffer.
• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical
ground, mechanical stability, and thermal relief
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- 30 -
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3. TECHNICAL BRIEF
[Figure 1.7] PM6650 Block Diagram
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Only for training and service purposes
- 31 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.5.5 GSM PAM (U101:TQM7M5003)
The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset applications. This
module has been optimized for excellent EDGE efficiency and Pout in a Polar Loop environment at
EDGE class E2+ operation while maintaining high GSM/GPRS efficiency.
The small size and high performance is achieved with high-reliability 3 rd generation InGaP HBT
technology. With 50ߟ and output, no external matching or bias components are required.
The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller.
Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q
passives technology for optimal performance. The CMOS controller implements a fully integrated
power control within the module for GSM operations, and serves as the AM/AM path in EDGE
operations. This eliminates the need for any external couplers, power detectors, current sensing etc.,
to assure the output power level. The module has Tx enable and band select inputs. Module
construction is a low-profile overmolded landgrid array on laminate.
14
GND6
DCS_PCS_IN
GND5
BS
R111
1
DCS_PCS_TX
68
C136
8p
10
C138
9
L112
NA
15nH
8
VCC
GND4
GND3
GSM_OUT
GND2
TX_EN
U101
TQM7M5003
VBATT
DCS_PCS_OUT
11
GND7
12
GND8
13
GND1
VRAMP
GSM_IN
2
GSM_PA_BAND
3
R112
91
+VPWR
C137
1u
5
C135
33u
FL101
6
3
EFCH897MTDB1
7
2
R114
G2 G1
IN
15
16
17
4
R117
2.2K
GSM_PA_RAMP
C142
0.75p
R113
91
GSM_PA_EN
4
O1 G3
C146
10 dB
5
1
GSM_TX
51
8 dB
R118
120
R119
120
C143
68p
10p
L113
4.7nH
GSM_PA_BAND
LOW
PQ
HIGH
MODE
GSM
DCS/PCS
[Figure 1. 8] GSM PAM Schematic
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3. TECHNICAL BRIEF
3.5.6 UMTS Duplexer(FL103:SAYZY1G95EB0B00)
A UMTS duplexer splits a single operating band into receive and transmit paths. Important
performance requirements include;
• Insertion loss, this component is also in the receive and transmit paths ;
In the U990 typical losses : UMTS2100_ Tx = 1.5 dB, UMTS2100_ Rx = 1.8 dB
• Out-of-band rejection or attenuation, the duplexer provides input selectivity for the receiver, output
filtering for the transmitter, and isolation between the two. Rejection levels for both paths are
specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver
performance:
• Rx-band isolation, the transmitter is specified for out-of-band noise falling into the Rx band. This
noise leaks from the transmit path into the receive path, and must be limited to avoid degrading
receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and
Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7
dB.
• Tx-band isolation, the transmit channel power also leaks into the receiver. In this case, the leakage is
outside the receiver passband but at a relatively high level. It combines with Rx band jammers to
create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band
isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum
duplexer Tx-band isolation value is about 51.7dB.
• Passband ripple, the loss of this fairly narrowband device is not flat across its passband. Passband
ripple increases the receive or transmit insertion loss at specific frequencies, creating performance
variations across the band.s channels, and should be controlled.
• Return loss, minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
• Power handling, high power levels in the transmit path must be accommodated without degraded
performance. The specified level depends on the operating band class and mobile station class (per
the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics
depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be
used between the UMTS PA and duplexer to assure proper performance.
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3. TECHNICAL BRIEF
3.5.7 UMTS Rx RF filter (FL102 : EFCH2140TDE1)
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical
as losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the
last band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still
presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must
provide rejection of this Tx-band leakage.
- Other frequencies of particular concern . bands known to include other wireless transmitters that
may deliver significant power levels to the receiver input.
[Table 1.3] UMTS Rx SAW Filter Specification
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- 34 -
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Only for training and service purposes
3. TECHNICAL BRIEF
3.5.8 Bluetooth (M800 : LBRQ-2B43A)
The MSM6280 includes BT baseband embedded BT 1.1 compliant baseband core, so the other
bluetooth components are bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system
architecture in the U990.
[Figure 1.9] Bluetooth system architecture
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- 35 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.5.9 FM Radio (U103 : TEA5766UK)
This FM Module is a single chip, electronically tuned, FM stereo radio with RDS/RBDS demodulator
and decoder for low voltage applications, with fully integrated IF selectivity and demodulation. This
equipment tunes the European, US, and Japanese FM bands.
Figure1.10 shows the FM Radio system architecture in the U990.
[Figure 1.10] FM Radio system architecture in the U990
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- 36 -
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Only for training and service purposes
3. TECHNICAL BRIEF
3. BB Technical Description
3.6 Digital Baseband (DBB/MSM6280)
3.6.1 General Description
A. Features (MSM6280)
• Support for multimode operation - HSDPA, tri-band WCDMA (UMTS), quad GSM/GPRS/EDGE
• Support for HSDPA downlink up to 7.2Mbps (initial commercial release will support 3.6Mbps
• HSDPA. Later releases will have support for 7.2 Mbps HSDPA)
• Support for WCDMA (UMTS) uplink data rate up to 384 kbps
• High-performance ARM926EJ-S running at up to 225 MHz (later at 270 MHz for 7.2 Mbps HSDPA)
• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets
• QDSP4000 high-performance DSP cores
• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals
• QcameraTM with 15 fps QVGA viewfinder resolution, and support for 4 MP camera sensors
• Direct interface to digital camera module with video front end (VFE) image processing
• True 3D graphics for advanced wireless gaming
• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI
integrity. Support for Q-fuse.
• Audio on par with portable music players
• Vocoder support (AMR, FR, EFR, HR)
• Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology
• SD/SDIO hardware support
Copyright © 2007 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
Figure. Simplified Block Diagram of Baseband
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- 38 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Figure. Simplified Block Diagram of RF
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 39 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.7 Subsystem(MSM6280)
3.7.1. ARM Microprocessor Subsystem
The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM, including control of the
external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a
QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the
functionality of the RTR6275, RFR6275 and PM6650 devices.
3.7.2 WCDMA R99 features
The MSM6280 device supports release 99 June 2004 of the W-CDMA FDD standard, including the
following features:
■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following
restrictions:
❏ The downlink supports the following specifications:
- Up to four physical channels, including the broadcast channel (BCH), if present
- Up to three dedicated physical channels (DPCHs)
- Spreading factor (SF) range support from 4 to 256
- The following transmit diversity modes are supported:
Space time transmit diversity (STTD)
Time-switched transmit diversity (TSTD)
Closed-loop feedback transmit diversity (CLTD)
■ The uplink supports the following specifications:
❏ The uplink provides the following UE support:
- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary
- A maximum data rate of 384 kbps
❏ Full SF range support from 4 to 256
■ SMS (CS and PS)
■ PS data rate - 384 kbps DL / 384 kbps UL
■ CS data rate - 64 kbps DL / 64 kbps UL
■ AMR (all rates)
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3. TECHNICAL BRIEF
3.7.3 HSDPA features
The MSM6280 device supports the HSDPA release 5 standard:
■ Supports HS-DSCH (HS-SCCH, HS-PDSCH and HS-DPCCH) in addition to the R99 transport
channels as defined in 3GPP specifications.
■ Supports a maximum of four simultaneous HS-SCCH channels as defined in 3GPP specifications.
■ Supports a maximum of 10 HS-PDSCH channels and supports both QPSK and 16 QAM modulation.
It supports UE category 6 in SW release 2.0 and category 8 in SW release 4.0.
■ Supports CQI, and ACK/NACK on HS-DPCCH channel as defined in 3GPP specifications.
■ Supports all incremental redundancy versions for HARQ, as defined in 3GPP specifications.
■ Can switch between HS-PDSCH and DPCH channel resources, as directed by the network.
■ Can be configured to support any of the two power classes 3 or 4 as defined in 3GPP R5
specifications (25.101).
■ Supports network activation of compressed mode by SF/2 or HLS on the DPCH for conducting interfrequency or inter-RAT measurements when the HS-DSCH is active.
■ Supports STTD on both associated DPCH and HS-DSCH simultaneously.
■ Supports CLTD mode 1 on the DPCH when the HS-PDSCH is active.
■ Supports STTD on HS-SCCH when either STTD or CLTD Mode 1 are configured on the associated
DPCH.
■ Supports TFC selection limitation on the UL factoring in the transmissions on the HS-DPCCH as
required in TS 25.133.
Copyright © 2007 LG Electronics. Inc. All right reserved.
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- 41 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.7.4 GSM features
The following GSM modes and data rates are supported by the MSM6280 device hardware. Support
modes conform to release '99 specifications of the sub-feature.
■ Voice features
❏ FR
❏ EFR
❏ AMR
❏ HR
❏ A5/1, A5/2, and A5/3 ciphering
■ Circuit-switched data features
❏ 9.6k
❏ 14.4k
❏ Fax
❏ Transparent and non-transparent modes for CS data and fax
❏ No sub-rates are supported.
3.7.5 GPRS features
■ Packet switched data (GPRS)
❏ DTM (Simple Class A) operation
❏ Multi-slot class 12 data services
❏ CS schemes: CS1, CS2, CS3, and CS4
❏ GEA1, GEA2, and GEA3 ciphering
■ Maximum of four Rx timeslots per frame
3.7.6 EDGE features
■ EDGE E2 power class for 8 PSK
■ DTM (simple Class A), multi-slot class 12
■ Downlink coding schemes - CS 1-4, MCS 1-9
■ Uplink coding schemes - CS 1-4, MCS 1-9
■ BEP reporting
■ SRB loopback and test mode B
■ 8-bit, 11-bit RACH
■ PBCCH support
■ 1 phase/2 phase access procedures
■ Link adaptation and IR
■ NACC, extended UL TBF.
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3. TECHNICAL BRIEF
3.7.7 MSM6280 device audio processing features
■ Integrated wideband stereo CODEC
❏ 16-bit DAC with typical 88 dB dynamic range
❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path
■ VR- Voice mail + voice memo
■ Acoustic echo cancellation
■ Audio AGC
■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8
(G2)
■ Internal vocoder supporting AMR, FR, EFR, and HR
3.7.8 MSM6280 microprocessor subsystem
■ Industry standard ARM926EJ-S embedded microprocessor subsystem
❏ 16 kB instruction and 16 kB data cache
❏ Instruction set compatible with ARM7TDMI®
❏ ARM version 5TEJ instructions
❏ Higher performance 5 stage pipeline, Harvard cached architecture
❏ Higher internal CPU clock rate with on-chip cache
■ Java hardware acceleration
■ Enhanced memory support
Please note that NOR/PSRAM will not be supported on MSM6280.
❏ 75 MHz and 90 MHz bus clock for SDRAM
❏ 32-bit SDRAM
❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed
peripherals (EBI2) such as LCD panels
❏ 1.8 V or 2.6 V memory interface support (excluding EBI1)
❏ NAND FLASH memory interface
- 8/16-bit data I/O width NAND flash support
- 1- or 4-bit ECC
- 512-byte/2KB page-size support
- 2 chip selects supported for NAND Flash
❏ Boot from NAND
❏ Low-power SDRAM (LP-SDRAM) interface
■ Internal watchdog and sleep timers
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3. TECHNICAL BRIEF
3.7.9 Supported interface features
■ USB On-the-Go core supports both slave and host functionality
■ Three universal asynchronous receiver transmitter (UART) serial ports
■ USIM controller (via UART)
■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards
■ Parallel LCD interface
■ General-purpose I/O pins
■ External keypad interface
3.7.10 Supported multimedia features
■ Provide additional general purpose MIPS by using:
❏ Two QDSP4000s
❏ Dedicated hardware accelerators and compression engines
■ Improve Java, BREW, and game performance
❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine
■ Enable various accessories via USB host connectivity.
❏ Integrated USB host controller functionality
■ Enable compelling visual and audio applications.
QcameraTM
■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 4-megapixel
with 15 fps capture rate
■ 15 fps QVGA viewfinder
QtvTM
■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.
■ Audio Codecs supported: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows® Audio v9,
RealAudio® v8
■ Integrated stereo wideband Codec for music/digital clips
■ CMX
■ Video Codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10
Video telephony services: QvideophoneTM
■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF
■ Video Codecs supported: MPEG-4 and H.263
■ Audio Codecs supported: AMR-NB.
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3. TECHNICAL BRIEF
QcamcorderTM
■ Real time mobile video encoder
■ Video Codecs supported: MPEG-4, H.263.H.264
■ Audio Codecs supported: AMR-NB, AAC
■ Recording performance: 15 fps @ QVGA, 384 kbps
gpsOneTM
■ Integrated gpsOne processing
■ Standalone gpsOne mode in which the handset acts as a GPS receiver
CMXTM (MIDI and still image, animation, text, LED/vibrate support)
■ 72 simultaneous polyphonic tones
■ 44 kHz sampling rate
■ 512 kB wave table
■ Support of universal file formats
❏ Standard MIDI Format (SMF)
❏ SP-MIDI
❏ SMAF Audio playback (MA-2, MA-3, MA-5)
❏ XMF/OLS
❏ MFil (requires Docomo license)
■ PNG decoder
■ Pitch bend range support
■ LED/vibrate support
■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)
■ MLZ decoder
■ Integrated PNG/SAF A.T.
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.7.11 Serial Bus Interface(SBI)
The MSM6280 device’s SSBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMM’s RTR6275, RFR6275 and PM6650 ASICs. Using the SSBI, the RTR6275, RFR6275,
and PM6650 devices can be configured for different operating modes and for minimum power
consumption, extending battery life in Standby mode. The SSBI also controls DC baseband offset
errors.
3.7.12 Wideband CODEC
The MSM6280 device integrates a wideband voice/audio CODEC into the mobile station modem
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one
single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the
microphone and earphone amplifiers into the MSM6280 device, reducing the external component
count to just a few passive components. The microphone (Tx) audio path consists of a two-stage
amplifier with the gain of the second stage set interally. The Rx/Tx paths are designed to meet the
ITU-G.712 requirements for digital transmission systems.
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Copyright © 2007 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
3.7.13 Vocoder Subsystem
The MSM6280 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has
modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx
volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal
Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable,
13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6280 device’s integrated ARM9TDMI
processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the
desired functionality.
3.7.14 ARM Microprocessor subsystem
The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM device, including control of
the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices.
Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the
functionality of the RFR6275, RTR6275, and PM6650 devices.
3.7.15 Mode Select and JTAG Interfaces
The mode pins to the MSM6280 device determine the overall operating mode of the ASIC. The options
under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,
ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6280
device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used
to test digital interconnects between devices within the mobile station during manufacture.
3.7.16 General-Purpose Input/Output Interface
The MSM6280 device has general-purpose bidirectional input/output pins. Some of the GPIO pins
have alternate functions supported on them. The alternate functions include USB interface, additional
RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function
of these pins is documented in the various software releases.
3.7.17 UART
The MSM6280 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3
share multiplexed pins.
■ UART1 for data
■ UART2 (can be used for USIM interface)
■ UART3 for data
3.7.18 USB
The MSM6280 device integrates a universal serial bus (USB) controller that supports both
unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral
communicating with the USB host.
Copyright © 2007 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
3.8 Power Block
3.8.1 General
MSM6280, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of
MSM6280, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :
PM6650 : Phone power supply
AAT3169 : LCD Backlight/Flash charge pump
3.8.2 PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power
management portion accepts power from all the most common sources - battery, external charger,
adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate
handset electronics. It monitors and controls the power sources, detecting which sources are applied,
verifying that they are within acceptable operational limits, and coordinates battery and coin cell
recharging while maintaining the handset electronics supply voltages. Eight programmable output
voltages are generated using low dropout voltage regulators, all derived from a common trimmed
voltage reference.
A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental
conditions.
MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI)
supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface
circuit monitors multiple trigger events and controls the power-on sequence.
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- 48 -
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3. TECHNICAL BRIEF
Figure 1-1. PM6650 Functional Block Diagram
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.8.3 Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for
the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this
pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or
not. For additional accuracy or to capture variations over time, this voltage is routed internally to the
housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and
ICHARGE pins to determine which supply should be used and when to switch between the two
supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the
pass transistor respectively.
4.2V~3.81V
100~70 (%)
3.80V~3.71V
69~45 (%)
3.70V~3.62V
44~20 (%)
3.61V~3.50V
19~3 (%)
3.49V~3.28V
2~0 (%)
KU990 Battery Bar Display(Stand By Condition)
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- 50 -
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3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided
by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current
from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with
its performance specified below (3.2V). The charging current is set to 80mA.
Parameter
Min
Typ
Max
Unit
Trickle Current
60
80
100
mA
Copyright © 2007 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger pass
transistor and the battery transistor. The constant current charging continues until the battery reaches
its target voltage, 4.2V.
Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of
constant voltage charging is commonly detected 10% of the full charging current.
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 1000mAh
• Charger Voltage : 5.1V
• Charging time : Max 3h (Except time trickle charging)
• Full charge indication current (icon stop current) : 100mA
• Low battery POP UP : Idle - 3.49V, Dedicated(GSM/WCDMA) - 3.49V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.20V(idle), 3.1V(call)
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- 52 -
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3. TECHNICAL BRIEF
3.9 External memory interface
The MSM6280 device was designed to provide two distinct memory interfaces. EBI1 was targeted for
supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower
asynchronous devices such as LCD, NAND flash, SRAM, etc. In addition, MSM6280 provide SD bus
interface. KU990 supports 512MByte free user memory using SD interface.
• EBI1 Features
- 16 bit static and dynamic memory interface
- 32 bit dynamic memory interface
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select
- Synchronous burst memories supported (burst NOR, burst PSRAM)
- Synchronous DRAM memories supported
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses
- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).
• 2Gb NAND(16bit, Large Block ) flash memory + 1Gb SDRAM (32bit)
• 1-CS(Chip Select) are used.
• The SD bus allows the dynamic configuration of the number of data line from 1 to 4 Bidirectional data
signal. After power up by default, the Device will use only DAT0. After initialization, host can change
the bus width.
Interface Spec
Device
Part Name
Maker
Read Access Time
Write Access Time
NAND
TYA000BC00DOGG
Toshiba
50 ns
30 ns
SDRAM
TYA000BC00DOGG
Toshiba
15 ns
15 ns
Table#1. External memory interface
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3. TECHNICAL BRIEF
EBI1
EBI2
ADDRESS[14: 0]
NAND_CS*
DATA[31:0]
NAND_RE*
SDRAM
NAND_WE*
WE*
CS*
MSM6280
NAND_CLE
NAND
1Gbit
CAS*
NAND_WP*
2Gb
(512M x 2)
RAS*
NAND_ALE
(256MB)
CLK_EN
NAND_READY
CLK
DATA[15:0]
DQM[3:0]
Figure. Simplified Block Diagram of Memory Interface
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- 54 -
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3. TECHNICAL BRIEF
3.10 H/W Sub System
3.10.1 RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM6280 controls RF part(RTR6275) using these signals.
• SBST : SSBI I/F signals for control Sub-chipset
• PA_ON1 : Power AMP on RF part
• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
• DAC_REF : Reference input to the MSM Tx data DACs
SBDT1_GPIO1
PA_ON1_GPIO2
GRFC9_GPIO12
CAMCLK_PO_GP_MN_GPIO13
GPIO28
USB_RX_DATA_GPIO29
XMEM2_CS_N2_GPIO35
XMEM2_CS_N3_GPIO36
LCD_EN_GPIO37
GPIO43
SYNTH2_GPIO65
GPIO66
XMEM1_CS_N1_GPIO76
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
UART3_RFR_N_GPIO87
UART2_DP_RX_DATA_GPIO89
SYNTH0_GP_PDM0_GPIO92
SBST1_GPIO93
H11
LIN_INVERTER
LIN_MOTOR_EN
CAM_MCLK
LCD_IF_MODE
USB_SELECT_N
CAM_MODE3_N
VGA_CAM_PWDN
LCD_LDO_EN
MICROSD_DETECT
HOOK_SENSE_N
RMT_INT
D5
J21
A6
N19
W15
AA15
AE13
H9
B6
F8
AA1
Y6
L25
H6
F18
H18 R215
0
HP_AMP_EN
CAM_SELECT_N
LCD_RESET_N
MMP_INT_N
H13
TX_AGC_ADJ
L13
TRK_LO_ADJ
F19
TCXO_EN_GPIO94
F17
PA_ON0
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
DAC_REF
Q_IM_CH1
Q_IP_CH1
I_IM_CH1
I_IP_CH1
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
A12
B12
A13
B13
F12
GRFC8_GPIO11
GRFC7_GPIO10
GRFX6_GPIO9
GRFC5_AUX_SBST_GPIO8
GRFC4_AUX_SBCK_GPIO7
GRFC3_GPIO6
GRFC2_GPIO5
GRFC1_AUX_SBDT_GPIO4
GRFC0_GPIO3
BT_CLK_GPIO25
BT_SBST_GPIO24
BT_SBCK_GPIO23
BT_SBDT_GPIO22
BT_TX_RX_N_GPIO21
BT_DATA_GPIO20
C223
33nF
V23
V25
W25
AA25
Y25
AB25
AC25
D17
AUX_PCM_CLK_GRFC14_GPIO80
AUX_PCM_DIN_GRFC13_GPIO14
AUX_PCM_DOUT_GRFC12_GPIO103
AUX_PCM_SYNC_GRFC11_GPIO102
TX_ON_GRFC10
TX_AGC_ADJ
TRK_LO_ADJ
2K
W23
GP_PDM2_PA_RAN_GE1
H17
GP_PDM1_PA_RAN_GE0
TRST_N
TCK
TMS
TDI
TDO
RTCK
R211
TCXO_EN
PA_ON
(WCMDA 2100 PAM Enable)
TX_QM
TX_QP
TX_IM
TX_IP
DAC_REF
RX_QM
RX_QP
RX_IM
RX_IP
PA_R1
LIN_PWM_MAG
H15
D16
F15
D15
A17
H16
K19
N21
G4
J8
H12
B4
T23
T19
D11
H10
F10
D9
MMP_HPCM_CLK
MMP_HPCM_DI
MMP_HPCM_DO
MMP_HPCM_FSYNC
TX_ON
ANT_SEL2
ANT_SEL1
ANT_SEL0
CAM_MODE1_N
FM_INTX
FM_BUSEN
GSM_PA_BAND
GSM_PA_EN
A8
B8
G23
F23
E26
E25
H21
R19
VGA_CAM_RESET_N
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
R213
NA
A22
Figure. Schematic of RF Interface of MSM6280
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3. TECHNICAL BRIEF
B. the others
• TRK_LO_ADJ : TCXO(19.2M) Control
• PA_ON : WCDMA(2100) TX Power Amp Enable
• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp
• GSM_PA_RAMP : Power Amp Gain Control of APC_IC
• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC
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3. TECHNICAL BRIEF
3.10.2 MSM Sub System
3.10.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
VREG_UIM 2.85V
USIM CLK
USIM Reset
MSM6280
USIM CLK
PM6650
USIM Data
USIM Reset
USIM
USIM Data
Figure. SIM Interface
3.10.2.2 UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
GPIO_Map
Name
Note
GPIO_96
UART_RXD
Data_Rx
GPIO_95
UART_TXD
Data_Tx
Table. UART Interface
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3. TECHNICAL BRIEF
3.10.2.3 USB
The MSM6280 device contains a Universal Serial Bus (USB) interface to provide an efficient
interconnect between the mobile phone and a personal computer (PC). The USB interface of the
MSM6280 was designed to comply with the definition of a peripheral as specified in USB Specification,
Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB
Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation,
namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the
MSM6280.
Name
Note
USB_DAT
Data to/from MSM
USB_SE0
Data to/from MSM
USB_OE_N
Out-Put Enable of Transceiver
USB_VBUS
USB_Power From Host(PC)
USB_D+
USB Data+ to Host
USB_D
USB Data- to Host
16
47K
USB_DAT
MSM_USB_D+
USB_SE0
MSM_USB_D-
17
18
19
20
21
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(M
ICROSD_CMD
OSD_DATA[0]
MICROSD_CLK
USB_DAT
USB_SE0
USB_OE_N
PM_INT_N
PS_HOLD
C540
4.7u
USB_VBUS
R514
MMC_CMD_GPIO
MMC_DATA_SDC
M16
MMC_CLK_SDCC
L14
H14
USB_DAT_VP
USB_SE0_VM
N25
USB_OE_TP_N
N23
N26
D7
D6
GPIO40
GPIO42
Table. USB Signal Interface
Figure. Schematic of USB block(MSM6280 Side & PM6650 Side)
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3. TECHNICAL BRIEF
3.10.3 HKADC(House Keeping ADC)
The MSM6280 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to
digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF
power levels. The MSM6280 device has six analog input pins which are multiplexed to the input of the
internal HKADC.
Figure. MSM6280HKADC Block diagram
Channel
Note
Signal
HKADC0
AMUX_OUT
RF PAM Temperature Check
HKADC1
VBATT_SENSE
Battery voltage level
HKADC2
REF_ADC
ADC Reference voltage
HKADC3
TTY_ADC_DET
Ear jack Detection for TTY
HKADC4
PCB_Rev_ADC
PCB Version Check
HKADC5
Battery_THERM
Battery Temperature Check
Table. HKADC channel table
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 59 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.10.4 Key Pad
There are 5 key buttons. Shows the Key Matrix & Keypad circuit.
‘END’ Key is connected to PMIC(PM6650).
ROW(0)
COL(0)
COL(1)
Lock
Capture
AF
ROW(1)
ROW(2)
SEND
CLR
Table. Key Matrix Mapping Table
51K
R701
VREG_MSMP_2.7V
700
701
SEND
CLR
KEY_ROW[2]
KEY_COL[0]
EVLC14S02050
EVLC14S02050
VA702
VA703
VA701
EVLC14S02050
KEY_COL[1]
Figure. Main Keypad Circuit
LGE Internal Use Only
- 60 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
1100
SW1100
KEY_ROW[0]
LOCK KEY
CAMERA
FOCUS
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
Figure. Side Keypad Circuit
END
PM_ON_SW_N
VA700
EVL14K02200
END
ON_SW KEY
Figure. END Keypad Circuit
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 61 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.10.5 Camera Interface
U990 Installed a 5M Pixel and 0.3Mega Camera.
Below figure shows the camera board to board connector and camera I/F signal.
CAM_VDD_AF_2.7V
CAM_VDD_SA_2.7V
CAM_VDD_CORE_1.2V
CAM_VDD_SD_1.8V
CAM_VDD_IO_2.7V
C600
10u
GB042-30S-H10-E3000
CN600
R603
R604
10
10
R607
5M_CAM_MCLK
C607
0.1u
MMP_CAM_INT
5M_CAM_DATA[7]
5M_CAM_DATA[5]
5M_CAM_DATA[3]
5M_CAM_DATA[1]
R608
10
MMP_CAM_PCLK
ICVL0518100Y500FR
VA602
C610 C611 C612 C613
10p 10p 10p 10p
EVLC18S02015
ICVL0518100Y500FR
VA600
33
C606
0.1u
VA601
MMP_I2C_SCL
MMP_I2C_SDA
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_RESET_N
STROBE_TRIGGER
5M_CAM_DATA[6]
5M_CAM_DATA[4]
5M_CAM_DATA[2]
5M_CAM_DATA[0]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
R601 10
R602 10
C609
0.1u
C605
0.1u
1u
C602
1u
C608
C601
0.1u
C614
0.1u
VGA_VDD_2.7V
VGA_VDD_1.8V
CN701
10
R718
MMP_CAM_PCLK
VGA_CAM_DATA[0]
VGA_CAM_DATA[1]
VGA_CAM_DATA[2]
VGA_CAM_DATA[3]
VGA_CAM_DATA[4]
VGA_CAM_DATA[5]
MOTOR+
MOTOR-
R719 10
R720 10
R724
R725
10
10
NA
VGA_CAM_RESET_N
I2C_SCL
I2C_SDA
MMP_CAM_HSYNC
MMP_CAM_VSYNC
VGA_CAM_DATA[7]
VGA_CAM_DATA[6]
x+
Y+
xY-
R729
VA714
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
C710
0.1u
resistor
ICVL0518100Y500FR
EVLC18S02015
VA713
RCV+
RCV-
10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VA715
R717
C711
0.1u
C712 C713 C709
10p 10p
0.1u
EVLC18S02015
VGA_CAM_PWDN
VGA_CAM_MCLK
C714 C715
10p 10p
Figure. Camera PCB Board to Board Connector
LGE Internal Use Only
- 62 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
The MEGA Camera module is connected to Main PCB with 30pin Board to Board connector Its
interface is dedicated camera interface port in Multimedia chip. The camera port supply 13MHz master
clock to camera module, vertical sync signal, horizontal sync signal, reset signal and 8bits data from
camera module. The camera module is controlled by I2C port from Multimedia chip.
[ Pin Description ]
Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 63 -
LGE Internal Use Only
3. TECHNICAL BRIEF
The VGA Camera module is connected to FPCB with 20pin Board to Board connector (AXK720147G).
Its interface is dedicated camera interface port in MSM6280. The camera port supply 13.MHz master
clock to camera module and receive 13MHz pixel clock (15fps), vertical sync signal, horizontal sync
signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port
from MSM6280.
[ Pin Description ]
No
Name
Port
Note
1
CAM_PWDN
i
Camera power down
2
CAM_MCLK
I
Master Clock(24M)
3
GND
GND
GND
4
CAM_PCLK
O
Clock for Camera Data Out(13M)
5
CAM_DATA(0)
O
Data
6
CAM_DATA(1)
O
Data
7
CAM_DATA(2)
O
Data
8
CAM_DATA(3)
O
Data
9
CAM_DATA(4)
O
Data
10
CAM_DATA(5)
O
Data
11
CAM_DATA(6)
O
Data
12
CAM_DATA(7)
O
Data
13
CAM_VSYNC
O
Vertical Synch
14
CAM_HSYNC
O
Horizontal Sync
15
GND
GND
GND
16
I2C_SCD
I
I2C Clock
17
I2C_SCL
I
I2C Clock
18
CAM_RESET_N
I
Camera reset signal
19
VREG_MSMP_2.8V
I
Camera I/O Power
20
VREG_CAM_2.8V
I
Camera I/O Power
Table. Interface between VGA Camera Module and FPCB (in camera module)
LGE Internal Use Only
- 64 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.10.6 LCD Module (LS030B3UX01 : SHARP)
- The IM220DBN2A model is a Color TFT Main supplied by SHARP.
This LCD Module has a 3.0 inch diagonally measured active display area with 240(RGB)X400
resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in
vertical stripes.
* Features
- Display mode(Main LCD) : Normally Black, Transmissive VA mode 265K colors
- LCD Driver IC: LS030B3UX01(Magnachip)
- Driving Method : A-Si TFT Active Matrix
- 16 bit CPU interface Parallel
LCD_RESET_N
MSM6280
MMP_CS_N
MMP_LCD_CS_N
EBI2_OE_N
MMP_LCD_RD_N
EBI2_WE_N
MMP_LCD_WE_N
EBI2_ADDR[11]
Multimedia
Chip
EBI2_DATA[0:15]
LCD 3.0î
TFT(WQVGA)
MMP_LCD_ADS
MMP_LCD_DATA[0:15]
LCD_MAKER_ID
LCD_IF_MODE
Figure. LCD Module Block Diagram
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 65 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.10.7 Display
LCD module is connected to Main PCB with 40 pin B TO B connector The LCD module is controlled by
16-bit EBI2 in MSM6280 via Multimedia Chip.
LCD_VDD_2.8V
VA300
C320
NA
C321
0.1u
ICVN0505X150FR
CN300
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
MMP_LCD_VSYNC_IN
LCD_MAKER_ID
WLED_PWR
WLED_1
WLED_2
WLED_3
WLED_4
WLED_5
LCD_IF_MODE
R314
R315
R316
R317
22p
22p
C325
22p
C324
22p
ENBY0036001
1.0T, Socket
GB042-40S-H10-E3000
MMP_LCD_ADS
MMP_LCD_CS_N
LCD_RESET_N
MMP_LCD_RD_N
MMP_LCD_WE_N
MMP_LCD_VSYNC_OUT
51
51
51
51
R318
C323
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
LCD_DATA[4]
LCD_DATA[5]
LCD_DATA[6]
LCD_DATA[7]
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
C322
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
VA301
0
OTP Program Pin
LCD_VSYNC_OUT
C326
22p
FL300 ICVE10184E150R500FR
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
8
7
6
10
5
9
G2
1
G1
MMP_LCD_DATA[0]
MMP_LCD_DATA[1]
MMP_LCD_DATA[2]
MMP_LCD_DATA[3]
FL301 ICVE10184E150R500FR
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
LCD_DATA[4]
LCD_DATA[5]
LCD_DATA[6]
LCD_DATA[7]
8
6
10
5
9
7
G2
1
G1
MMP_LCD_DATA[4]
MMP_LCD_DATA[5]
MMP_LCD_DATA[6]
MMP_LCD_DATA[7]
FL302 ICVE10184E150R500FR
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
8
7
6
10
5
9
G2
1
G1
MMP_LCD_DATA[8]
MMP_LCD_DATA[9]
MMP_LCD_DATA[10]
MMP_LCD_DATA[11]
FL303 ICVE10184E150R500FR
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
8
7
6
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
10
5
LGE Internal Use Only
9
G2
1
G1
MMP_LCD_DATA[12]
MMP_LCD_DATA[13]
MMP_LCD_DATA[14]
MMP_LCD_DATA[15]
- 66 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.10.7.1 Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path.
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal
and then transmits it to DBB Chip (MSM6280).
This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset.
The downlink path amplifies the signal from DBB chip (MSM6280) and outputs it to receiver (or
speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary
output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are
differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a
headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input
and a two-stage audio amplifier.
Figure. Audio Interface Detailed Diagram(MSM6280)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 67 -
LGE Internal Use Only
LINE_ON
LINE_OP
HPH_R
HPH_L
EAR1ON
EAR1OP
MICBIAS
AUXOUT
HPH_VREF
LINE_L_IP
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP
LGE Internal Use Only
- 68 AA20
AE20
C203
NA
C235
MIC1N
MIC1P
0.1u
10p
AF20
C236 0.1u
HP_R
HP_L
SPK_R
SPK_L
RCVRCV+
MICBIAS
C200
AF22
AF21
AE19
AF19
AC20
AC19
AC21
AC22
AA19
AA18
T15
AF18
AE18
W17
AA17
AC17
AC18
MIC2P
3. TECHNICAL BRIEF
MSM6280 Audio CODEC pins
L200
100nH
SDCC_DAT
SDCC DAT2
Figure . Audio part schematics
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
MICBIAS
C564
47p
C563
SPM0204HE5-PB-3
10u
P
4
G2
3
G1
2
O
1
MIC500
C567
C568
MIC1N
22n
22n
C569
NA
MIC1P
C575
33p
R904
MIC
C576
10p
100K
NCS2200SQ2T2G
U902
2
VIN+
R905
3
GND
OUT
1
VCC
1M
EAR_MIC_P
4
HOOK_SENSE_N
5
R906
10K
VIN-
5.1K
VREG_MSMP_2.7V
C905
0.1u
R907
Headset Hook Switch
Figure . Audio part schematics
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 69 -
LGE Internal Use Only
3. TECHNICAL BRIEF
VREG_5V
R533
VREG_WM_2.7V
C514 C513
0.1u 10u
0
C516 C517
4.7u 0.1u
MIDI_3.3V
C518 C519
4.7u 0.1u
VREG_MSME_1.8V
C520 C521
4.7u 0.1u
U502
13
DCVDD
14
DBVDD
26
AVDD2
31
AVDD1
C533
R511
1K
4.7n
18K
C535
1u
1u
C539
1u
C536
FM_AUDIO_L
C541
1u
R516
C542
R517
MID_MICP
SPK_L
1K
C548
1u
C549
1u
4.7n
C547
12n
18K
AGND2
LRC
BCLK
ADCDAT
DACDAT
MCLK
VMID
MICBIAS
4
RIP
5
RIN
6
FM_AUDIO_R
AGND1
3
ROUT1
LOUT1
20
L2_GPIO2
ROUT2
LOUT2
24
C524
0.1u
C525
10u
C531
NA
27
32
MIC_PWR
29
30
HP_EAR_R
HP_EAR_L
23
FB500
SPK_OUT+
25
SPK_OUTFB501
OUT3
OUT4
AUXL
AUXR
MODE
15
CSB_GPIO1
16
SCLK
17
SDIN
CODEC_I2C_SCL
CODEC_I2C_SDA
28
R2_GPIO3
1
LIP
2
LIN
19
12
PGND
22
21
MIC2P
C543 C544
NA NA
18
33
100K
R510
SPK_R
DGND
R519
1u
C534
1u
C530
12n
C532
7
8
9
10
11
MMP_A_LRCLK
MMP_A_BCLK
MMP_ADI_ADCDAT
MMP_ADO_DACDAT
MMP_A_MCLK
WM8983
HP_L
HP_R
C550
NA
C551
NA
AUDIO DAC/ADC, AMP etc. (WM8983)
VREG_MSMP_2.7V
100K
L504
2.2uH
R528
CN500
21
19
1
2
3
4
5
6
7
FB504
FM_ANT
EAR_MIC_P
TV_OUT
MIDI_EAR_L
MIDI_EAR_R
RMT_INT-USB_D+
Figure . Audio part schematics
LGE Internal Use Only
- 70 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.10.7.2 Audio Mode
There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE
Voice Call
Speaker phone
Device
Description
Receiver Mode
Receiver Voice Call
Loud Mode
Speaker Phone
Headset
Headset Voice Call
Loud Mode
Speaker Phone
Loud Mode
Speaker MIDI Bell
Headset
Headset MIDI Bell
Loud Mode
Speaker MP3
Headset
Headset MP3
MIDI
MP3
Table. Audio Mode
Audio & Sound Main Component
There are 8 main components in KU990.
Component
Maker Part No.
Note
1
MSM6280
MSM6280
Base-Band Modem
2
Audio Codec
WM8983
ADC/DAC, AB class SPK AMP
3
Analog Switch
NC7SB3157L6X
Analog Switch for MIC BIAS
4
Speaker
EMS1634APB1
8 ohm Speaker
5
Receiver
EMR0906SP
32 ohm receiver
6
Main MIC
SPM0204HE5-PB
-42 dB microphone
7
CAM MIC
SPOB-413S42RC3310BC
-42 dB microphone
8
Ear MIC
HC-MQD-LG059
Ear MIC
Table. Audio main component list
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 71 -
LGE Internal Use Only
3. TECHNICAL BRIEF
# Multimedia Chip
3.11 Feature List
3.11.1 IC Characteristics
• MCP with Internal SDRAM, no need for external memory.
• Package: 180-pin TFBGA (8 x 8 mm)
• 90nm process
• Core voltage - 1.0 V
• IO voltage - Eleven strips, separate voltage between 1.8 and 3.3 V
3.11.2 Multimedia Performance
• Digital Still Camera support with ISP on chip up to 5M pixel.
- Photo-album and photo-editing capabilities.
- Superior quality, (e.g. including lens shading).
- Camera controls for flash, optical zoom,focus, shutter and iris.
• Camcorder operation as a DivX recorder /player at 30 fps CIF, VGA resolution.
AVI file format with MP3 audio.
• Player for general DivX content, up to 30 fps CIF resolution. MP3 or WMA audio.
• 3GPP MMS compliant video clip recorder, supporting CIF/QCIF H.263, MPEG4 recording with AMR
voice or AAC audio.
• Player for 3GPP MMS / streaming video clips, up to 30 fps CIF H.263, MPEG4, and H.264 with AMR
voice or AAC/Enhanced AACPlus audio.
• 3GPP-compliant videophone, with H.263 or MPEG4 video at QCIF 15 fps (full-duplex).
• MIDI player (for ring tones, melodies).
Compliant with 3GPP standards, including
support for Mobile XMF for melodies with custom instruments.
LGE Internal Use Only
- 72 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
• Audio stereo recorder player MP3/WMA
• ID3 tags display
• Spectral bars
• Lyrics display
• Equalizer
• 3D Surround Audio
3.11.3 DRM
• MDTV Conditional access compliant to JSR-177 (AES and TDES)
• Key exchange support
• True RNG (Random Number Generator)
3.11.4 3D Graphics
• 3D hardware + software accelerator targeting VGA 30 fps games with PlayStationTM-1 enhanced
quality.
- Setup and viewport transforms
- Bilinear and Trilinear texturing
- Multi-texturing
- Flat and Gourard shading
- 24-bit ARGB support
- Compressed textures (2 bits/texel)
- Mipmaping
- Full scene anti-aliasing (x4 / x16)
- 16-bit Z-buffer
- 4-bit stencil buffer
- Fog
- Alpha blending
- Dot3 bump mapping
• Fill rate: 120M pixels/sec
• Polygon rate 0.8M triangles/sec
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 73 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.11.5 Image Sensor
• 10/12/14/16-bit RGB - Bayer Grid
- CMOS up to 5MP
- CCD up to 5MP
- Pixel clock - Up to 90 MHz.
- Active pixel rate - up to 75M pixels/sec:
- 15fps @ 5MP
- 25fps @ 3MP
- 30fps @ 2MP
- Black-level evaluation and correction
- Defective pixel correction
- Auto exposure and White-balance
- Edge enhancement and auto focus.
- Lens shading correction
- Polyphase image scaling.
- Digital zoom up to X4 in 16 steps
- 8/16-bit YCbCr - 4:2:2
- Input streaming bus - as CCIR601
- Progressive (CMOS/CCD sensors) or interlaced (PAL/NTSC decoders) mode
- Pixel clock - Up to 120 MHz (8-bit), 60Mhz (16-bit)
- Input resolution - Up to 5M pixels
- Auto focus
- Polyphase image scaling
- Digital zoom up to X4 in 16 steps
3.11.6 LCD Port
• Output resolution - up to VGA
• Supports dual-panels (two LCDs)
• Bypass from Host port to LCD CPU bus
• Up to 18-bit color depth (262K colors)
• CPU bus 8/9/16/18 bit compliant to all known vendors.
• RGB bus 3/6/18 bit up to 30Mhz clock
3.11.7 TV-out Port
• Composite analog interface
- NTSC-M
- PAL-B,D,G,H,I
LGE Internal Use Only
- 74 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.11.8 Video and Graphics Postprocessing
• Handles Video (YUV) and Graphic (RGB)
• Video de-blocking
• Blending of video and graphics - up to 256 levels of blending
• Resizing (upscale and downscale) using quality polyphase filter
• Rotation and flip - 90, 180 and 270 degrees
• Picture brightness, contrast, and saturation control
• Display gamma adjustment
• Color space reduction
3.11.9 Serial Audio Ports
• ZR3453X has two audio/voice ports: one port is used for host bypass connection, and another for
connecting to a codec or to a Bluetooth voice port.
- PCM master/slave
- I2S master/slave (5 lines including clock)
- AC’97 master (5 lines including AC-Link reset)
- Audio output master clock (I2S), up to 48 MHz
- Supports sample rates of 8, 11.025, 16, 22.05, 24, 32, 44.1 or 48 kHz
3.11.10 Serial Data Ports
• I2C Multiple device support 100 and 400 kHz
• UART with flow control up to 3Mb/sec
• SPI port with Bit clock up to 40 MHz
- (Motorola, National microwire, TI synchronous serial interface )
3.11.11 Mass Storage
• High-speed SD/MMC I/F
• NAND-flash storage
• SPI-flash
• CE-ATA HDD.
• SDIO peripherals
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 75 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.11.12 USB
• USB 2.0 High speed/full speed
• USB On The Go
• USB applications:
- USB mass storage
- PictBridge
- Webcam
3.11.13 Host Port
• Two flavors:
- Generic interface 8/16-bit Intel style.
Connects as memory map (4-bit address)
- LCD like 8/9/16 bit multiplexed bus.
Connects as an LCD (1-bit address)
3.11.14 Clocks
• Main clock input frequency, 10 to 31 MHz:
- Directly from system PMU main clock and bypass its control
- Embedded crystal oscillator (12Mhz)
- Optional GPS TCXO
• Four configurable clock-out pins to drive external components:
(e.g. Audio codec, Sensor, PWM)
3.11.15 Boot
• Host boot
• Standalone boot
3.11.16 Debug
• JTAG for code debug
• UART for fast system ramp up
3.11.17 Power
• Very low power consumption, smaller than150mW for all intense multimedia applications.
• Low power sleep mode 100 µW
- Host can control display audio and peripherals via bypass
• Light sleep mode 500uW
- Specifically for GPS accurate off-line tracking
LGE Internal Use Only
- 76 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Figure 1-1 presents a typical multimedia cellular phone system where ZR3453X is used as a cocoprocessor. In this system, ZR3453X is connected to the following devices:
• Baseband chip (the host)
• CCD/CMOS Image Sensor for capturing video and still
• LCD panel(s)for displaying video
• Audio CODEC (A2D, D2A) for capturing voice and playing voice/music
• Media Flash (SmartMedia, NANDFlash, MMC or SD) to store media data (two active I/F, e.g. one
NAND and one SD)
• Connector to TV
[ Figure 1-1 ]
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 77 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.12 Multimedia Chip Interface
3.12.1 Host Interface
3.12.1.1 Host Interface
The HOST interface connects the ZR3453X and the host processor
(a handset baseband
chip) in two optional modes:
• On the host memory bus.
• On the host LCD bus.
R309
MMP_LCD_BYPASS_CS_N
NA
VREG_MSMP_2.7V
R310
10K
MMP_CS_N
NAND_ALE
EBI2_OE_N
EBI2_WE_N
R311
R313
0
NA
MMP_INT_N
EBI2_ADDR[11]
EBI2_ADDR[12]
EBI2_ADDR[13]
EBI2_ADDR[14]
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
EBI2_DATA[9]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
[ Block Diagram ]
B8
A8
B7
B9
A7
A10
A9
C8
C7
D12
C10
C12
C13
C14
B14
C11
B13
A14
A13
B12
A12
B11
A11
C9
B10
L13
M13
EBI2_DATA[0:15]
HCS0N
HCS1N
HRDN
HWRN
HGINTN
HA11
HA12
HA13
HA14
HD0
HD1
HD2
HD3
HD4
HD5
HD6
HD7
HD8
HD9
HD10
HD11
HD12
HD13
HD14
HD15
NCSN
[ Schematics ]
LGE Internal Use Only
- 78 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12.2 Host - LCD - Bypass mode
The Host-LCD Bypass bypasses the host interface pins to the LCD pins.
This means that the bus transactions performed by the host are transferred to the LCD pins, enabling
the host to have full control over one or two LCD panels, even when the ZR3453X is in sleep mode.
This is the default mode.
3.12.3 Camera interface
ZR3453X connects with the CCD or CMOS Image Sensor (CIS) via its image sensor port.
ZR3453X supports several system configurations:
• CCD bayer 10,12,14,16 bit (ZR34532 only)
• CMOS bayer 10,12,14,16 bit
• YCbCr 8 bit
• YCbCr 8 bit with pixel valid
• YCbCr 16 bit
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 79 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.12.4 LCD Interface
The ZR3453X LCD port supports mobile LCD panels of upto VGA size and upto 60fps refresh rate.
There are various bus formats and color depth up to 18-bit (262K colors).
VIDH
VIDI
VIDJ
VIDK
VIDL
VIDM
VIDN
VIDO
VIDP
LD0
LD1
LD2
LD3
LD4
LD5
LD6
LD7
LD8
LD9
LD10
LD11
LD12
LD13
LD14
LD15
LD16
LD17
[ Block Diagram ]
LCS0N
LCS1N
LRDN
LWRN
LA0
LCK
LHS
LVS
LACT
P11
N12
N7
L8
P13
L9
N13
M11
M9
MMP_CAM_DATA[0]
MMP_CAM_DATA[1]
MMP_CAM_DATA[2]
MMP_CAM_DATA[3]
MMP_CAM_DATA[4]
MMP_CAM_DATA[5]
MMP_CAM_DATA[6]
MMP_CAM_DATA[7]
B5
A5
B6
B4
A4
C3
A3
A2
A1
B2
B1
B3
C1
C2
C5
C6
D3
D1
A6
D2
D5
C4
D4
E1
E4
E3
E2
MMP_LCD_DATA[0]
MMP_LCD_DATA[1]
MMP_LCD_DATA[2]
MMP_LCD_DATA[3]
MMP_LCD_DATA[4]
MMP_LCD_DATA[5]
MMP_LCD_DATA[6]
MMP_LCD_DATA[7]
MMP_LCD_DATA[8]
MMP_LCD_DATA[9]
MMP_LCD_DATA[10]
MMP_LCD_DATA[11]
MMP_LCD_DATA[12]
MMP_LCD_DATA[13]
MMP_LCD_DATA[14]
MMP_LCD_DATA[15]
MMP_LCD_CS_N
MMP_LCD_RD_N
MMP_LCD_WE_N
MMP_LCD_ADS
TP300
TP301
MMP_LCD_VSYNC_IN
MMP_LCD_VSYNC_OUT
[ Schematics ]
LGE Internal Use Only
- 80 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12.5 TV out Interface
C331
G14
F13
[ Block Diagram ]
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
C335
330p
390
392ohm 1%
TVDATA
TVREF
E13
2.2uH
C334
330p
75
L300
TV_OUT
R339
R338
22p
VENBYPIN
The display data is converted to video with video-encoder according to CCIR-601 and sampled by 10bit DAC and transmitted over an analog pad as a composite video signal.
This mode is used in a system where ZR3453X is connected gluelessly to a TV screen that requires
real-time display data. ZR3453X generates TV signal according to the NTSC and PAL standards.
The TVDATA pin can drive a full video level signal directly into a 75 terminated TV cable.
[ Schematics ]
- 81 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.12.6 Audio Interface
In this configuration ZR3453X is connected to an external audio codec.
There are three possible configurations:
• Audio/Voice codec with two ports: PCM and I2S
• Audio/Voice codec with one port: I2S
• Audio/voice/data codec with one port: AC97
In all configurations ZR3453X connects its external audio ports to the codec single or two
ports.
The host uses its internal voice codec for voice communication. There is no bypass of voice.
The host controls the codec configuration via I2C bus directly. The host codec analog audio output is
connected to the external audio codec and muxed with the codec audio path from the ZR3453X on the
way is to the speaker.
The microphone is connected to the external audio codec and the baseband internal codec.
ZR3453X appears in Figure 3-35 as a master on the bit clock and frame sync. This is only one of the
possible configurations. In external audio configuration ZR3453X can run all the Audio/voice
applications including conversation recording .
LGE Internal Use Only
- 82 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12.7 USB interface
ZR3453X is a USB 2.0 Device or On-the-Go dual-role device (OTG) with the following
characteristics:
• Complies with USB (Universal Serial Bus) 2.0 specifications
• Complies with On-the-Go Supplement 1.0a
• Integrated 45-ohm termination, 1.5Kilohm pull-up and 15-Kilohm pull-down resistors.
• Supports 480-Mbps high-speed, 12-Mbps full-speed and 1.5Mbps low-speed (Host mode only) data
transmission rates.
• Control + 4 endpoints:
P3
P4
J4 R335
P6
M7
0
MMP_USB_D+
MMP_USB_DVREG_5V
3.3K
UDP
UDN
UVBUS
UID
URSET
R340
AGND_VDAC
F12
K5
AGND_USBT
L5
AGND_USBC
- EP0 - two-way Control
- 2-input , 2-output - Bulk, INT or ISO
• Suspend, resume, reset and SOF signaling
+VPWR
3.4K
1%
C336
0.01u
FSUSB30UMX U304
1
10
SEL HSD1+
USB_SELECT_N
R345
9
100K
8
MSM_USB_DMMP_USB_D-
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 83 -
7
6
VCC HSD2+
_OE
D+
HSD1- GND
HSD2-
D-
2
3
MSM_USB_D+
MMP_USB_D+
USB_D+
4
5
USB_D-
LGE Internal Use Only
3. TECHNICAL BRIEF
3.12.8 MMC interface
ZR3453X has a dedicated port for multimedia cards. It can support SD (Secure Digital) cards and
SecureMMC (standard multimedia cards with security functions).
The same port can be used for HDD CE_ATA connection or SDIO to peripheral devices
(e.g.; MDTV front-end).
MMC
• MMC v4
• Dual voltage (separate IO power domain, host GPIO control)
• 1 or 4 bit cards
• Multiple cards support (if dual-voltage or high-speed interface are not used)
• Up to 43 MHz bit clock
SD
• 1 or 4 bit bus support
• High-Speed SD, up to 43 MHz bit clock
SDAT0
SDAT1
SDAT2
SDAT3
SCMD
SCLK
SWP
F1
F2
E5
F3
H2
G1
G3
R312
MMP_MICROSD_DATA[0]
MMP_MICROSD_DATA[1]
MMP_MICROSD_DATA[2]
MMP_MICROSD_DATA[3]
MMP_MICROSD_CMD
MMP_MICROSD_CLK
33
P12
VMCLK
P10
VPCLK
M12
VHREF
K12
VVS
MMP_CAM_MCLK
MMP_CAM_PCLK
MMP_CAM_HSYNC
MMP_CAM_VSYNC
3.12.9 Power Domain
LGE Internal Use Only
- 84 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.13 Touch Screen Interface
The TSC2007 device has a 12-bit analog-to-digital resistive touch screen converter including drivers
and the control logic to measure touch pressure. The TSC2007 device is controlled by I2C port from
MSM6280.
Touch Screen interface scheme is shown in Figure.
And, there control signals are followed
• TOUCH_I2C_SCL : I2C CLOCK
• TOUCH_I2C_SDA : I2C DATA
• TOUCH_PENIRQ_N : DETECT
UART3_CTS_N_GPIO86
UART3_DP_RX_DATA_GPIO85
UART3_DP_TX_DATA_GPIO84
D6
GPIO40
TOUCH_PENIRQ_N
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2.7K
R704
2.7K
U700
A1
A2
A3
B1
B2
B3
R703
0.1u
R702
C701
1u
NA
R700
0
C700
D7
M19
L23
M21
LCD_VDD_2.8V
VGA_CAM_PWR_EN
TOUCH_I2C_SCL
TOUCH_I2C_SDA
PM_INT_N
UART2_RFR_N_GPIO91
UART2_CTS_N_GPIO90
UART2_DP_TX_DATA_GPIO88
E4
F4
TP200 G6
USIM_CLK
USIM_RST_N
USIM_DATA
F7
F14
TOUCH_PENIRQ_N
CAM_MODE2_N
UART_TXD
D8
GPIO44
GPIO39
GPIO64
Figure. Touch Screen Interface
TSC2007IYZGR
AUX
VDD_REF
X+
PENIRQA0
Y+
SDA
A1
XSCL
GND
Y-
C1
C2
C3
D1
D2
D3
TOUCH_I2C_SDA
TOUCH_I2C_SCL
X+
Y+
XY-
- 85 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.14 Main Features
1. Main features of KU990
- BAR Type
- WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode
- Main LCD: 240x400/3.0”/262K TFT
- 5.1M Pixel AF Camera
- VGA CMOS Camera
- φ16 module speaker
- Stereo Headset
- Video telephony in WCDMA with camera
- HSDPA up to 3.6 Mbps
- Loud Speaker phone(in GSM and WCDMA)
- 64 Poly Sound
- Audio: MP3, AAC, AAC+,AAC++, WMA, WAV
- MPEG4 encoder/decoder and play/save
- H.263 decoder
- Video Recording: VGA 30 fps
- JPEG en/decoder
- Support Bluetooth, USB
- FM Radio
- touch screen, touch feedback
- 103 x 54 x 15.6 mm
- 1000mAh soft pack
LGE Internal Use Only
- 86 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
2. Main Components of KU990
MAIN Top Side
VGA camera
MAIN Bottom Side
5M camera
5M Camera FPCB
VGA Camera FPCB
Sub PCB
Intenna
Strobe Flash
LCD
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 87 -
LGE Internal Use Only
3. TECHNICAL BRIEF
2.1 Main Top Side
U700
U103
U504
U506
U503
U507
U304
U505
U601
U602
U604
U607
U600
U301
U300
U303
U400
U401
SideKey
701
END
700
Reference
Description
Reference
Description
U103
FM Radio IC
700
Send Key
U504
Headphone AMP IC
701
Clear Key
U506
CAM/HP MIC SEL IC
END
End Key
U503
Audio AMP LDO
SideKey
Side Key FPCB
U507
USB/REMOCON SEL IC
U303
U304
Switch IC for USB2.0
U300
U505
Over Voltage Protection IC
U301
LCD Backlight Charge
Pump IC
U600
VGA CAM LDO IC
LCD LOD IC
U601
5M CAM LDO IC
U602
U607
Switch IC for 5M VT Call
U400
U401
LGE Internal Use Only
U604
MicroSD Select MSM and
MMP IC
U700
- 88 -
Touch Screen Driver IC
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
2.2 Main Bottom Side
CN500
CN701
U502
SW600
U606
CN603
CN600
CN601
U501
X500
CN300
U500
U701
U200
OUT PAD
U302
X300
U402
X100
U100
U105
FL103
J400
U101
SW100
FL100
MIC500
ANT PAD
Reference
Description
Reference
Description
CN701
VGA CAM FPCB Connector
CN500
TA and USB Connector
SW600
Mode Switch
U502
WM8983 Audio DAC/ADC AMP IC
U606
Linear Motor Driver IC
CN603
Main-Sub B-to-B Connector
CN600
5M CAM FPCB Connector
U501
PM6650 PMIC
CN601
Strobe Flash Connector
X500
32.768KHz Crystal Oscillator
CN300
LCD Connector
U500
Charging IC
U701
DC-DC Converter IC
OUT PAD
Battery Connector PAD
U200
MSM6280 Modem IC
U402
Memory IC
U302
ZR3453 DSP IC
X100
19.2MHz Crystal Oscillator for TCXO
X300
27Mhz Crystal Oscillator
U105
PAM IC for WCDMA
U100
RTR6275 RF IC
FL103
Duplexer IC for WCDMA
J400
USIM Connector
U101
PAM IC for GSM
SW100
RF Switch
FL100
Antenna Switching Module
MIC500
MIC
ANT PAD
Main Intenna Connection PAD
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 89 -
LGE Internal Use Only
3. TECHNICAL BRIEF
2.3 Sub PCB
BT PAD
MIC900
U900
M800
U902
BAT900
CN800
CN801
SPEAKER
S800
Reference
Description
Reference
Description
BT PAD
Bluetooth Antenna PAD
SPEAKER
Module Speaker
MIC900
CAM MIC
S800
T-Flash Connector
U900
5MP Camera Power IC
M800
Bluetooth Driver IC
U902
Headset Hook Switch IC
BAT900
Backup Battery
CN800
Wheel Switch Connector
CN801
Main-Sub B-to-B
Connector
LGE Internal Use Only
- 90 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
2.4 VGA Camera FPCB
CN102
CN101
Vibrator
CN100
Receiver
Reference
Description
Vibrator
Vibrator PAD
Receiver
Receiver PAD
CN100
VGA_CAMERA Connector
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reference
Description
CN101
Main B-to-B Connector
(FPCB to Main PCB)
CN102
Touch Window Connector
- 91 -
LGE Internal Use Only
3. TECHNICAL BRIEF
2.5 5M Camera FPCB
CN601
CN602
Reference
Description
Reference
Description
CN601
5M Camera Module
Connector
CN602
Main PCB Connector
(FPCB to Main PCB)
LGE Internal Use Only
- 92 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
X100
FL104
U100
U105
FL103
U104
FL102
FL101
FL100
U101
SW100
Reference
Descri ption
Reference
Description
U100
GSM/UMTS Transceiver (RTR)
X100
VCTCXO(19.2MHz)
FL103
UMTS Duplexer
FL104
UMTS TX SAW
FL102
UMTS RX SAW
U105
UMTS PAM
U104
Coupler
FL101
GSM900 TX SAW
U101
GSM/EDGE PAM
FL100
SW100
Front -End-Module
RF Antenna Connector
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 93 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.2 SIGNAL PATH
4.2.1 UMTS PATH
COMMON TX/RX PATH
UMTS TX PATH
UMTS RX PATH
LGE Internal Use Only
- 94 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.2.2 GSM PATH
COMMON TX/RX PATH
GSM RX PATH
DCS/PCS TX PATH
PCS RX PATH
GSM TX PATH
DCS RX PATH
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 95 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.3 Checking VCTCXO Block
The reference frequency (19.2MHz) from X100 (VCXO) is used UMTS TX part, GSM part and BB part.
TCXO
X100
TP1
3
OUT
TP2
GND
2
R115
VREG_TCXO_2.85V
4
C139
0.1u
C140
1000p
VCC VCONT
100ohm
TRK_LO_ADJ
1
19.2MHz
C141
0.01u
TP4
VREG_BT_2.85V
C144
1000p
C147
1000p
R120 100K
TCXO_PM
C145
1000p
C148 8200p
RTR6275_TCXO
TCXO_BT
U102
TP3
TC7SH04FS
Schematic of the TCXO Block
TP4
TP1
TP2
TP3
Test Point of the TCXO Blcok
LGE Internal Use Only
- 96 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Check TP1
VCC of VCXO
VCC ≥ 2.8V
No
Check PMIC
Yes
Check TP2
TRK_LO_ADJ
3V≥ Voltage≥ 0V
No
Check MSM
Yes
Check TP3, TP4
With Oscilloscope
19.2MHz Signal
No
Check soldering
and components
Yes
VCXO is OK
Check other part
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 97 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.4 Checking Front-End Module Block
TP4
TP1
TP3
VREG_RF_SMPS
5
VC1
4
VC2
3
VC3
ANT_SEL0
ANT_SEL1
ANT_SEL2
C113
47p
TP2
1
2
9
11
12
14
15
17
18
25
26
C115
47p
C114
47p
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
PGND1
PGND2
ANT
10
C109
47p
6
VDD
7
NC
8
UMTS_TX_RX
13
DCS_PCS_TX
16
EGSM_TX
DCS_RX2
DCS_RX1
PCS_RX2
PCS_RX1
EGSM_RX2
EGSM_RX1
19
20
21
22
23
24
LSHS-M090UH
Schematic of the Front-End Module Block
TP3
TP2
TP1
TP4
Test Point of Front-End Module Block
LGE Internal Use Only
- 98 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Vc3
Vc2
Vc1
Vdd
GSM900 Tx
L
H
H
H
DCS1800/PCS1900 Tx
L
L
H
H
UMTS Tx/Rx
H
L
H
H
GSM 900 Rx
L
L/H
L
H
DCS 1800 Rx
H
L/H
L
H
PCS 1900 Rx
L
L/H
L
H
Logic Table of the FEM
- UMTS Tx/Rx
- GSM900 Tx
TP1 (Vc1)
TP1 (Vc1)
TP2 (Vc2)
TP2 (Vc2)
TP3 (Vc3)
TP3 (Vc3)
- DCS1800/PCS1900 Tx
- GSM Rx / PCS1900 Rx
TP1 (Vc1)
TP1 (Vc1)
TP2 (Vc2)
TP2 (Vc2)
TP3 (Vc3)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TP3 (Vc3)
- 99 -
LGE Internal Use Only
4. TROUBLE SHOOTING
- DCS1800 Rx
TP1 (Vc1)
TP2 (Vc2)
TP3 (Vc3)
Checking Switch Block power source
Check Soldering
ANT_SEL0, 1, 2 High Level
2.5V < Voltgae < 3.0V
NO
Check VDD
TP4 VREG_RF_SMPS
YES
Check the Logic
in each mode
LGE Internal Use Only
- 100 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.5 Checking UMTS Block
4.5.1 Checking TX level
KMS-518
TP1
G2
C
A
G1
SW100
C101 120p
L102
NA
FL100
5
VC1
4
VC2
3
VC3
1
2
9
11
12
14
15
17
18
25
26
ANT
10
6
VDD
7
NC
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
PGND1
PGND2
TP2
8
UMTS_TX_RX
13
DCS_PCS_TX
16
EGSM_TX
DCS_RX2
DCS_RX1
PCS_RX2
PCS_RX1
EGSM_RX2
EGSM_RX1
19
20
21
22
23
24
C152
3.9p
TP4
LSHS-M090UH
2.2p
C156
2.2nH
L121
FL104
1
GND1
4
GND2
8
GND3
8.2p
C160
22u
C162
0.01u
U105
L126
8.2nH
20dB
GND5
VCC2
GND4
RFOUT
GND3
GND2
VCC1
RFIN
GND1
VMODE
VREF
1
2
3
4
5
PWR_DET
R126
100
56p
L122
NA
PA_ON
1
VREG_TCXO_2.85V
KRX102E
68
8 dB
WCDMA_2100_TX_OUT
C165
NA
PA_R1
5
R123
R125
100
2
Q100
AWT6277R
C173
100p
R124
51
3
3
2
1
50OHM
4
PQ
4.7nH
L128
IN
OUT
56p
L125
1.2nH
1.8p
1
G2 G1
2
11
10
9
8
7
6
C170
SCDY0003403
COUP
C169 5.6p
C161
5
IN
L123
15nH
3.3nH
3
C168
56p
4
O1 G3
L124
U104
C167
C164
1u
C163
100p
4
ANT
TX
5
7
RX
SAYZY1G95EB0B00
C159
+VPWR
3
GND6
6
GND5
9
GND4
2
EFCH1950TDF1
FL103
TP3
Schematic of the WCDMA Tx Block
TP4
TP3
TP2
TP1
Test Point of the WCDMA Tx Block
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 101 -
LGE Internal Use Only
4. TROUBLE SHOOTING
For testing, Max power of UMT 2100 is needed.
Run a FTM program
set RF mode to IMT
set uplink freq. To
9750 click Tx on and
WCDMA set PA range
R1 on set Tx AGC to
410
Check coupler U104
Check Tx SAW
Filter
FL104
Check Duplexer
FL103
Check PAM block
U105
LGE Internal Use Only
Check FEM FL100
- 102 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.5.2 Checking UMTS PAM Control Block
• PAM control signal
1. PWR_DET : UMTS Tx Power Detected value (Check R123)
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control
3. VREG_TCXO_2.85V : UMTS PAM enable (about 2.85V)
4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)
5. PA_ON : Turns the PA on and off
6. PA_R1 : Control signals that step the active PA mode and bias
+VPWR
R123
VREG_TCXO_2.85V
UMTS2100
Coupler
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 103 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.5.3 Checking RX level
TP3
Vbias
TP4
TP2
TP1
KMS-518
TP1
ANT100 ANT101 ANT102
G2
C
L101
L100
C101 120p
0
4.7nH
C102
C104
12nH
1.2p
L102
NA
PQ
LGE Internal Use Only
A
G1
SW100
- 104 -
FL100
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Vbias
VDD_RX
C149
22p
EFCH2140TDE1
FL102
L114
1.5nH
TP2
C153
WCDMA_MIX_IN_M
3
C155
0.5p
G1 O1
WLNA_OUT
C152
3.9p
L116
1nH
2
C154
L115
1nH
1
56p
56p
IN
G2 O2
5
4
L117
1.8nH
L118
L119
WCDMA_MIX_IN_P
1nH
1nH
PQ
2.2nH
L121
2.2p
C156
TP4
TP3
FL104
1
GND1
4
GND2
8
GND3
8.2p
C160
22u
C162
0.01u
4.7nH
L128
L126
8.2nH
20dB
3.3nH
VCC1
RFIN
GND1
VMODE
VREF
1
2
3
4
5
COUP
R123
PWR_DET
56p
PA_R1
C173
100p
R124
51
C165
NA
Q100
AWT6277R
5
4
PQ
1.8p
3
50OHM
L125
1.2nH
IN
OUT
56p
2
1
56p
GND5
VCC2
GND4
RFOUT
GND3
GND2
2
3
11
10
9
8
7
6
C170
SCDY0003403
3
VREG_TCXO_2.85V
2
C169 5.6p
1
G2 G1
PA_ON
1
C168
L123
15nH
C161
5
IN
U105
RX_WCDMA_2100
4
O1 G3
L124
U104
C167
C164
1u
C163
100p
4
TX
5
7
RX
SAYZY1G95EB0B00
3
GND6
6
GND5
9
GND4
FL103
ANT
2
EFCH1950TDF1
C159
+VPWR
KRX102E
68
R126
100
R125
100
8 dB
Check Vbias over 2V?
Check the RF S/W
Check TP2
Signal exist?
Check FEM
FL100
Check TP3
Signal exist?
Check the Duplexer
FL103
Check TP4
Signal exist?
Check the RTR6275
U100
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 105 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.6 Checking GSM Block
3
2
1
4.6.1 Checking Front-End Module
Refer to chapter 3.4
LGE Internal Use Only
- 106 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.6.2 Checking RF Tx Level
TP1
KMS-518
G2
C
L101
L100
C101 120p
0
4.7nH
L102
NA
FL100
5
VC1
4
VC2
3
VC3
ANT_SEL0
ANT_SEL1
ANT_SEL2
C113
47p
1
2
9
11
12
14
15
17
18
25
26
C115
47p
C114
47p
TP2
ANT
10
6
VDD
7
NC
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
PGND1
PGND2
8
UMTS_TX_RX
13
DCS_PCS_TX
16
EGSM_TX
DCS_RX2
DCS_RX1
PCS_RX2
PCS_RX1
EGSM_RX2
EGSM_RX1
14
13
19
20
21
22
23
24
12
11
C136
8p
10
C138
9
L112
LSHS-M090UH
NA
15nH
DCS_PCS_IN
GND5
VCC
GND4
BS
GND3
GSM_OUT
GND2
C146
TP3
TX_EN
U101
TQM7M5003
17
8
GND6
VBATT
DCS_PCS_OUT
PQ
GND7
12nH
1.2p
GND1
VRAMP
GSM_IN
1
2
3
4
5
6
7
15
C104
16
C102
GND8
ANT100 ANT101 ANT102
A
G1
SW100
10p
C142
0.75p
L113
4.7nH
PQ
Schematic of the GSM Tx Block
TP1
TP2
TP3
Test Point of GSM Tx Block
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 107 -
LGE Internal Use Only
4. TROUBLE SHOOTING
START
Check TP1
If GSM over 31 dBm?
If DCS/PCS over 28dBm?
Yes
GSM/DCS/PCS Tx is OK
Check other part
Yes
Check Front-End
Module
Refer to chapter 3.4
No
Check TP2, TP3
If TP2 over 29dBm?
If TP3 over 25dBm?
No
Yes
Check PAM Block OK?
Refer to chapter 3.6.3
Check the RTR6275
No
Check Soldering of PAM (U101)
If problem still exist,
replace the PAM
Yes
Problem resolved ?
GSM/DCS/PCS Tx is OK
No
Change the Board
LGE Internal Use Only
- 108 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.6.3 Checking PAM Block
TP2
14
GND6
DCS_PCS_IN
GND5
BS
TP3
R111
1
DCS_PCS_TX
68
10
9
8
VCC
GND4
GND3
GSM_OUT
GND2
TX_EN
U101
TQM7M5003
VBATT
DCS_PCS_OUT
11
GND7
12
GND8
13
GND1
VRAMP
GSM_IN
2
GSM_PA_BAND
3
R112
91
GSM_PA_EN
4
+VPWR
C137
1u
5
C135
33u
FL101
6
3
EFCH897MTDB1
7
2
R114
G2 G1
IN
15
16
O1 G3
17
10 dB
R113
91
4
R117
1
5
2.2K
GSM_PA_RAMP
GSM_TX
51
8 dB
R118
120
R119
120
C143
68p
TP1
GSM_PA_BAND
LOW
HIGH
MODE
GSM
DCS/PCS
Schematic of PAM Block
TP3
TP2
TP1
Test Point of PAM Block
Test Point
Net name
Description
TP1
GSM_PA_RAMP
Power Amp Gain Control. Typically, 0.2 ~1.6V
TP2
GSM_PA_EN
Power Amp Enable (ON : >2.5V, OFF : <0.7V)
TP3
+VPWR
PAM Supply Voltage (Vcc > 3V)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 109 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.6.4 Checking RF Rx Level
KMS-518
G2
C
A
G1
SW100
C101 120p
L102
NA
L103 5.6nH
VREG_RF_SMPS
FL100
5
VC1
4
VC2
3
VC3
1
2
9
11
12
14
15
17
18
25
26
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
PGND1
PGND2
ANT
10
L104
15nH
DCS
C109
47p
TP3
L105 5.6nH
6
VDD
7
NC
8
UMTS_TX_RX
13
DCS_PCS_TX
16
EGSM_TX
DCS_RX2
DCS_RX1
PCS_RX2
PCS_RX1
EGSM_RX2
EGSM_RX1
19
20
21
22
23
24
L106
5.6nH
L108
5.6nH
L107
15nH
PCS
TP2
LSHS-M090UH
L109 22nH
L110
22nH
GSM
L111
TP1
22nH
Schematic of GSM-900, DCS-1800, PCS-1900 Rx Block
TP1
TP2
TP3
Test Point of Rx Block
LGE Internal Use Only
- 110 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 111 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.7 Power on trouble
Power on sequence of KU990 is :
PWR key press → PM_ON_SW_N go to low (VA700, PM6650-2M KPDPWR_N pin#24) → PM66502M Power Up → VREG_MSMC_1.2V(C560), VREG_MSME_1.8V(R520), VREG_MSMP_2.7V(R513),
VREG_MSMA_2.6V(R508), VREG_TCXO_2.85V(C510) power up → PON_RESET_N assert to MSM
→ Phone booting & PS_HOLD(D500) assert High to PMIC(PM6650-2M)
Start
Battery voltg. higher
than 3.2V?
NO
Change or charging the
Battery
YES
Press PWR key
Keypad LED on?
NO
Follow the LED trouble
shoot
YES
NO
VA700 high to low
when key press?
Check open Pattern
of power button
Check Dome Sheet
YES
VREG_MSMC_1.2V,
VREG_MSMP_2.7V, VREG_MSME_1.8V
VREG_TCXO_2.85V,
VREG_MSMA_2.6V power up?
YES
Is clock ok?
X100 : 19.2M
X500 : 32.768Khz
NO
Change the Main board
NO
Check the TXCO and SLEEP CRYSTAL
YES
Change the Main board
LGE Internal Use Only
- 112 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
VREG_TCXO_2.75V(C510)
VREG_MSMA_2.6V(R508)
VREG_MSMP_2.7V(R513)
SLEEP CRYSTAL(32.768KHz)
VREG_MSMC_1.2V(C560)
VREG_MSME_1.8V(R520)
TCXO ( 19.2MHz )
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 113 -
LGE Internal Use Only
4. TROUBLE SHOOTING
RESET_IN_N(R208)
PS_HOLD(D500)
PM_ON_SW_N (D700)
LGE Internal Use Only
- 114 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.7.1 USB trouble
USB Initial sequence of KU990 is :
USB connected to KU990 → USB_VBUS(C540) go to 5V
→ USB_D+(VA202) go to 3.3V → 48M Crystal on → USB_DATA is triggered → USB work
Start
NO
Cable insert
Cable is insert?
YES
NO
USB_VBUS is about
to 5V?
Check C540, R514,U500
USB cable
YES
NO
USB_D+ is about to 3.3V?
Check VA500,U507,U304
YES
NO
48MHz is run?
Check X200
YES
Change the Main board
VA500(USB_D+)
X200(48MHz)
R514(USB_VBUS)
C540(USB_VBUS)
U500(USB_VBUS)
U507(USB_D+)
U304(USB_D+)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 115 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.7.2 UMS(USB MASS STORAGE) trouble
UMS Initial sequence of KU990 is :
USB connected to KU990 → VREG_5V(R335, UMS) go to 5V → VREG_USB_3.3V(R301) go to 3.3V
→ USB_DATA is triggered → USB work
Start
NO
Cable insert
Cable is insert?
YES
VREG_5V is about
to 5V?
NO
Check R335, D501
YES
VREG_USB_3.3V is
about to 3.3V?
NO
Check R301,C529, USB CABLE
YES
NO
MICRO SD function OK?
Follow the micro sd trouble
YES
Change the Main board
< TOP SIDE >
R335(VREG_5V)
D501(VREG_5V) C529 (VREG_USB_3.3V)
LGE Internal Use Only
- 116 -
R301(VREG_USB_3.3V)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.8 SIM detect trouble
USB Initial sequence of KU990 is :
VREG_USIM_3.0V(C552 of PM6650) go to 3.0V → USIM clock, reset and data triggered → USIM IF
work (Schematic and place are refer to SIM technical brief)
Start
Re-insert the SIM card
Work well?
Yes
End
No
VREG_USIM_3.0V is 3.0V?
USIM_P_CLK is run?
NO
Check J400, D400,C552
YES
Change SIM card
Yes
Work well?
End
No
Change the Main board
USIM_P_RST_N
USIM_P_CLK
USIM_P_DATA
J400
C552(VREG_USIM_3.0V)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 117 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.9 Key sense trouble ( KEYPAD )
Key Sense sequence of KU990 is :
Default condition ROW(0-2) is 2.7V → Press the key → Corresponding ROW(x) and COL(x) go to 0V
→ Scan pulse( Col => Row ) → MSM sense what key pressed.
START
Check the R701,R705,R706 with no key press
ROW(0-2) is 2.7V?
NO
Check R701,R705,R706
Yes
Check the R701,R705,R706 with key press
ROW(0-2),
COL(0-1) is 0V?
Yes
Change the Main board
NO
Side Key
Change the DOME SHEET
Work well?
NO
YES
Change SIDE KEY
NO
Work well?
YES
NO
Check VA700~ VA707, R707~R710
Work well?
YES
NO
Change the Main board
Dome sheet
End
LGE Internal Use Only
- 118 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
VREG_MSMP_2.7V
PM_ON_SW_N
701
SEND
CLR
END
KEY_ROW[2]
KEY_COL[0]
VA700
700
EVL14K02200
51K
R701
END
EVLC14S02050
EVLC14S02050
ON_SW KEY
VA701(ROW2)
VA703
VA702
VA701
EVLC14S02050
KEY_COL[1]
VA702(COL0)
VA703(COL1)
SEND
CLR
END
VREG_MSMP_2.7V
51K
51K
CN700
1
2
3
4
5
R706
R705
LOCK
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
SHOT
VA707
EVLC14S02050
VA706
470
470
470
470
EVLC14S02050
EVLC14S02050
EVLC14S02050
VA704
VA705
R707
R708
R709
R710
SIDE KEY
Schematic of key sense part
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 119 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.10 Keypad backlight trouble
Key Pad Back Light is on as below :
Key pressing → PM6650 KYPD_LED_EN go to Low → LED On (Key Pad LED controlled by PM6650)
Start
Key press
+VPWR is OK?
NO
Check device short :
LD700~705 and R711~716 (Main)
Yes
Signal KYPD_LED_EN
is Low?
NO
Change the main board
Yes
Some LED
is not work?
Yes
Check device open :
LD700~705 and R711~716 (Main)
NO
Work well?
NO
Change the main board
Yes
End
R711~716 (Main)
VA708 (KYPD_LED_EN)
LD703 (+VPWR)
LD700~705 (Main)
LGE Internal Use Only
- 120 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
SSC-FR104-II1
LD703
R714
200
SSC-FR104-II1
LD701
200
SSC-TWH104-HL
LD700
LD703 (+VPWR)
R712
R715
R711
47
SSC-TWH104-HL
LD704
47
LEGG-S14G
47
R713
LD702
47
R716
LD705
LEGG-S14G
+VPWR
KYPD_LED_EN
Rev. 1.1
VA708
LD700~705 and R711~716 (Main)
EVL14K02200
(GREEN) (WHITE)
(RED)
VA708 (KYPD_LED_N)
Schematic of keypad backlight part
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 121 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.11 Micro SD trouble
Micro SD is worked as below :
Micro SD insertion → MICROSD_DETECT(R804) goes to low → go working
Start
Insert the Micro SD Card
MICROSD_DETECT(R804))
is low ?
NO
Change the SUB board
YES
YES
Work well?
NO
Check VREG_MMC_3.0V
is over 2.85V?
NO
Change the MAIN board
YES
Work well?
NO
YES
End
R804(DETECT)
C807(VREG_MMC_3.0V)
- 122 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SOCKET
LGE Internal Use Only
4. TROUBLE SHOOTING
4.12 Audio trouble
4.12.1 Receiver path
Voice Receiver path as below:
MSM6280 Ear1ON/Ear1OP → CN701(VGA CAM FPCB connector) → Receiver
Start
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Hear the tone to the receiver?
NO
YES
Change the Receiver
END
Check connector pin
or change the VGA CAM FPCB
Can you hear the tone?
YES
END
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 123 -
LGE Internal Use Only
4. TROUBLE SHOOTING
VGA CAM
FPCB
connector
Receiver
Receiver
pads
MSM6280
LGE Internal Use Only
- 124 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.12.2 Voice path for headset
Voice path for Head_Set as below:
MSM6280 HPH_R, HPH_L → C548,C549 U502(audio codec) → C578,C562 → R529,C522 →
U504(Headset AMP) → FB502, FB503 → R525, R524 → #4, #5 pin of CN500 headset Jack
Start
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
And insert head_Set
Headset insertion detection
in the Main LCD Display OK?
NO
Check #8 pin of CN500
or change the Main bíd
YES
The sine wave appear at
C548,C549 ?
NO
Change the Main board
YES
The sine wave appear at
C578,C562 ?
NO
Check the U502
or change the Main bíd
NO
Check the U504
or change the Main bíd
YES
The sine wave appear at
R525,R524 ?
YES
NO
Can you hear the tone?
Check the CN500 or change the
Main bíd
YES
END
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 125 -
LGE Internal Use Only
4. TROUBLE SHOOTING
21
19
CN500
CN500
1
2
3
4
5
6
7
8
9
10
11
12
13
FB504
R524
R525
R528
100K
TV_OUT
FM_ANT
EAR_MIC_P
MIDI_EAR_L
MIDI_EAR_R
RMT_INT-USB_D+
RMT_ADC-USB_D-
EAR_SENSE_N
VBATT
RMT_PWR_ON_N
Schematic of voice path
LGE Internal Use Only
- 126 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
U502
C548
C549
VREG_5V
R533
VREG_WM_2.7V
C514 C513
0.1u 10u
0
C516 C517
4.7u 0.1u
MIDI_3.3V
C518 C519
4.7u 0.1u
VREG_MSME_1.8V
C520 C521
4.7u 0.1u
U502
13
DCVDD
14
DBVDD
26
AVDD2
31
AVDD1
C533
R511
1K
4.7n
18K
C535
1u
C536
1u
C539
1u
FM_AUDIO_L
C541
1u
R516
C542
R517
MID_MICP
SPK_L
1K
C548
1u
C549
1u
4.7n
C547
12n
18K
AGND2
3
20
L2_GPIO2
AUXL
VMID
MICBIAS
ROUT1
LOUT1
ROUT2
LOUT2
C524
0.1u
C525
10u
C531
NA
27
32
MIC_PWR
29
30
HP_EAR_R
HP_EAR_L
23
FB500
SPK_OUT+
25
SPK_OUTFB501
OUT3
OUT4
AUXR
15
CSB_GPIO1
16
SCLK
17
SDIN
CODEC_I2C_SCL
CODEC_I2C_SDA
24
R2_GPIO3
1
LIP
2
LIN
19
28
U502
LRC
BCLK
ADCDAT
DACDAT
MCLK
4
RIP
5
RIN
6
FM_AUDIO_R
AGND1
12
MODE
PGND
22
21
MIC2P
C543 C544
NA NA
18
33
100K
R510
SPK_R
DGND
R519
1u
C534
1u
C530
12n
C532
7
8
9
10
11
MMP_A_LRCLK
MMP_A_BCLK
MMP_ADI_ADCDAT
MMP_ADO_DACDAT
MMP_A_MCLK
WM8983
HP_L
HP_R
C550
NA
C551
NA
Schematic of voice path
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 127 -
LGE Internal Use Only
4. TROUBLE SHOOTING
FB502
FB503
U504
C578
R529
C562
R522
C562
0.22u
HP_AMP_EN
15K
R522
HP_EAR_L
13
SVDD1
U504
R524
MIDI_EAR_L
68
11
FB503
600
R525
10
MIDI_EAR_R
PQ
C573
INR_
PRSB6.8C
SVDD2
68
9
PRSB6.8C
C574
14
INL_
15
INL+
_SHDN
SVSS
OUTR
600
12
8
C1N
FB502
OUTL
U504
MAX9722BETE
INR+
4
C1P
PGND
SGND
3
5
C570
1u
7
2
PVDD
PVSS
1
6
17
C566
1u
P_G
C565
4.7u
16
MIDI_3.3V
15K
C578
0.22u
C577
1u
R529
PQ
HP_EAR_R
Schematic of voice path
LGE Internal Use Only
- 128 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.12.3 Loud speaker path (voice speaker phone/VT)
Loud speaker path as below:
MSM6280 SPK_R, SPK_L → C532,C541 → R510,R516 → C533,C542 → R511,R517 →
U502(audio codec) → FB500,FB501 → CN603(B’toB connector) → OUT800, OUT801 (SPK PAD) →
Speaker
Start
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Set phone with speaker phone mode
The sine wave appear at
C532,C541?
NO
Change the Main board
YES
The sine wave appear at
FB500, FB501?
NO
Check the U502 or
Change the Main board
NO
Check the CN603
YES
The sine wave appear at
pads of speaker?
YES
Can you hear the tone?
NO
Change the speaker
YES
END
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 129 -
LGE Internal Use Only
4. TROUBLE SHOOTING
AC18
HP_R
HP_L
SPK_R
SPK_L
RCVRCV+
MICBIAS
AE18
AF18
T15
C530
12n
C532
1u
R510
7
8
9
10
11
MMP_A_LRCLK
MMP_A_BCLK
MMP_ADI_ADCDAT
MMP_ADO_DACDAT
MMP_A_MCLK
C533
R511
SPK_R
1K
4.7n
C535
1u
C536
1u
4
RIP
5
RIN
18K
6
FM_AUDIO_R
3
C539
1u
FM_AUDIO_L
C541
1u
R516
C542
R517
4.7n
C547
12n
18K
19
20
MICBIAS
ROUT1
LOUT1
ROUT2
LOUT2
C524
0.1u
C525
10u
C531
NA
27
32
MIC_PWR
29
30
HP_EAR_R
HP_EAR_L
23
FB500
SPK_OUT+
25
SPK_OUTFB501
AUXL
OUT3
OUT4
AUXR
MODE
+VPWR
VREG_MSMP_2.7V
VREG_BT_2.85V
L2_GPIO2
15
CSB_GPIO1
16
SCLK
CODEC I2C SCL
VMID
24
R2_GPIO3
1
LIP
2
LIN
MID_MICP
SPK_L
1K
AGND2
LRC
BCLK
ADCDAT
DACDAT
MCLK
22
21
MIC2P
C543 C544
NA NA
18
9
W17
K
AA17
VREG_MMC_3.0V
AC17
C534
1u
LINE_ON
LINE_OP
HPH_R
HPH_L
EAR1ON
EAR1OP
MICBIAS
CN603
G1
EAR_MIC_P
BT_SBST
BT_TX_RX_N
TCXO_BT
BT_CLK
BT_SBCK
BT_SBDT
BT_DATA
V_BACK_UP
HOOK_SENSE_N
CAM_VDD_AF_2.7V
CAM_VDD_SD_1.8V
SPK_OUTSPK_OUT+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
MICROSD_CLK
MICROSD_DETECT
MICROSD_CMD
MICROSD_DATA[0]
MICROSD_DATA[1]
MICROSD_DATA[2]
MICROSD_DATA[3]
CAM_MIC+
WHEEL_SW_R
WHEEL_SW_L
MMP_CAM_PWR_EN
G2
AXK740327G
LGE Internal Use Only
- 130 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Pads of Speaker
C532,C541
C722
MSM
U502 (audio codec)
FB500, FB501
CN603
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 131 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.12.4 Microphone for main MIC
Main Microphone path as below:
MIC → C567,C568 → MSM internal CODEC
MICBIAS
C564
47p
SPM0204HE5-PB-3
C563
10u
P
4
G2
3
G1
2
O
1
MIC500
22n
22n
MIC1N
C569
NA
C200
C576
10p
0.1u
C575
33p
10p
MIC1N
MIC1P
MIC1P
NA
C204
C237
NA
NA
C203
C236 0.1u
C235
MIC
C567
C568
C238
0.1u
AA20
AE20
AF20
AF22
AF21
AE19
AF19
AC20
AC19
LINE_L_IP
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP
AC21
10%
F25
SDCC_DAT1_GPIO99
M25
SDCC_DAT2_GPIO100
M26
SDCC_DAT3_GPIO101
Start
Place near
MSM pin W18
(CODEC VSS)
MSM
MSM
MSM
Make a call
MIC_BIAS(R221) is 1.8V?
NO
Change the Main B'd
YES
make some sound or
voice to MIC
Can you scoping some
sound signal at C567,C568?
NO
Change the MIC or
Change the Main B'd
YES
YES
END
Work well?
LGE Internal Use Only
- 132 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
MSM
C567, C568
MIC500 (MIC for Handset)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 133 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.12.5 Microphone for headset
MIC for Head_Set path as below:
Insert Headset → EAR_SENSE_N(pin8) go 0V → MSM6280 sense Head_Set insertion →
MIC signal → U502(audio codec) → MSM6280.
VREG_MSMP_2.7V
100K
L504
2.2uH
R528
TV_OUT
MIDI_EAR_L
MIDI_EAR_R
RMT_INT-USB_D+
RMT_ADC-USB_D-
7
8
9
10
11
MMP_A_LRCLK
MMP_A_BCLK
MMP_ADI_ADCDAT
MMP_ADO_DACDAT
MMP_A_MCLK
EAR_SENSE_N
VBATT
RMT_PWR_ON_N
4
RIP
5
RIN
6
USB_VBUS
UART TXD
MID_MICP
AGND2
LRC
BCLK
ADCDAT
DACDAT
MCLK
3
20
ROUT2
LOUT2
C531
NA
27
32
MIC_PWR
29
30
HP_EAR_R
HP_EAR_L
FB500
23
SPK_OUT+
25
SPK_OUTFB501
OUT3
OUT4
AUXL
AUXR
15
CSB_GPIO1
16
SCLK
MODE
22
21
C543 C544
NA NA
MIC2P
18
MIC2P
CODEC I2C SCL
ROUT1
LOUT1
C525
10u
C524
0.1u
R2_GPIO3
L2_GPIO2
1
LIP
2
LIN
19
VMID
MICBIAS
24
9
FM_ANT
EAR_MIC_P
C534
1u
FB504
C539
1u
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
K
CN500
21
19
Start
Make a call
L200
END
NA
NA
YES
make some sound or
vo ice t o MIC
C203
Change the Main b'd
C204
C235
NO
MIC_BIAS is 2.7V ?
Can y ou s coping s ome
sound signal at C539?
C236 0.1u
Change the Main b'd
NO
Change the MIC
AA20
AE20
AF20
AF21
AE19
AF19
AC20
AC21
C2
AC19
YES
10p
NO
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP
EAR_SENSE_N is 0V?
0.1u
C200
NO
AF22
Try ch ange the head set
MIC1N
MIC1P
100nH
YES
SDCC_DAT1_GPIO99
SDCC_DAT2_GPIO100
SDCC DAT3 GPIO101
YES
Can y ou s coping s ome
sound signal at C235,L20 0?
NO
Check t he U502 or
Change the Main Bíd
YES
YES
Work w ell?
LGE Internal Use Only
END
- 134 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C535
#8 pin of ear connector
to check EAR_SENSE_N
MSM
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 135 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.13 Camera trouble
Camera control signals are generated by ZORAN (Multimedia Chip)
and directly connected with ZORAN.
KU990 has two cameras. The one is a 5 Mega Camera, the other is VGA camera.
5M START
Check the camera conn. and
reconnect the camera
Yes
End
Camera is OK?
NO
NO
ZORAN output signal check
(MMP_CAM_RESET_N, MMP_
CAM_PWR_EN))
Yes
NO
Change the LDO (U601, U602, U701, U900, U901)
Yes
NO
Check master clock
5M_CAM_MCLK
(CN600)
Change the Analog Switch (U604, U607)
Yes
Yes
Check MMP_CAM_PCLK
(CN600)
Check the EMI/ESD filter
(FL600, FL601)
No
No
Yes
Change the camera
Change the Filter
Yes
Camera is OK
End
NO
Change the Main board
LGE Internal Use Only
- 136 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
MMP_CAM_PWR_EN
CAM_VDD_SA_2.7V
CAM_VDD_SD_1.8V
CAM_VDD_IO_2.7V
FL600
U604
U607
FL601
MMP_CAM_RESET_N
CAM_VDD_CORE_1.2V 5M_CAM_MCLK
MMP_CAM_PCLK
CAM_VDD_AF_2.7V
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 137 -
LGE Internal Use Only
4. TROUBLE SHOOTING
C609 : CAM_VDD_SA_2.7V
CAM_VDD_AF_2.7V
C601 : CAM_VDD_AF_2.7V
C606 : CAM_VDD_IO_2.7V
CAM_VDD_SA_2.7V
CAM_VDD_CORE_1.2V
CAM_VDD_SD_1.8V
CAM_VDD_IO_2.7V
0.1u
C605
0.1u
C609
GB042-30S-H10-E3000
CN600
R603
R604
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
10
10
R607
5M_CAM_MCLK
MMP_CAM_INT
10
TP302
MICROSD_DETECT
R333
NA
TP303
6
7
8
9
5
10
MMP_CAM_DATA[7]
MMP_CAM_DATA[6]
MMP_CAM_DATA[5]
MMP_CAM_DATA[4]
G1
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
G2
P2
M3
P7
N1
P1
M5
N6
M6
P5
N5
MMP_CAM_PCLK
SCL
SDA
INOUT_B4 INOUT_A4
INOUT_B3 INOUT_A3
INOUT_B2 INOUT_A2
INOUT_B1 INOUT_A1
ICVE10184E070R100FR
4
3
2
1
5M_CAM_DATA[7]
5M_CAM_DATA[6]
5M_CAM_DATA[5]
5M_CAM_DATA[4]
FL600
FL600
VGA_CAM_MCLK
U604 NC7SB3157L6X
6
1
S
B1
5
2
GND VCC
3
4
A
B0
5M_CAM_MCLK
U607 NC7SB3157L6X
1
6
B1
S
2
5
GND VCC
4
3
A
B0
CAM_SELECT_N
+VPWR
CAM_MCLK
G2
U607
C621
0.1u
+VPWR
MMP_CAM_MCLK
MMP_CAM_DATA[3]
MMP_CAM_DATA[2]
MMP_CAM_DATA[1]
MMP_CAM_DATA[0]
6
7
8
9
5
U604
10
100K
R608
VA602
N14
P14
MMP_CAM_PWR_EN
R331
5M_CAM_DATA[7]
5M_CAM_DATA[5]
5M_CAM_DATA[3]
5M_CAM_DATA[1]
R608 : 5M_CAM_PCLK
MMP_CAM_RESET_N
MMP_STROBE_CHARGE
5M_CAM_MCLK
MMP_CAM_INT
C614
0.1u
MMP_I2C_SCL
MMP_I2C_SDA
R331 : MMP_CAM_PWR_EN
C607
0.1u
G1
R607 : 5M_CAM_MCLK
C610 C611 C612 C613
10p 10p 10p 10p
EVLC18S02015
ICVL0518100Y500FR
VA600
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
C606
0.1u
VA601
R601 10
MMP_I2C_SCL
R602 10
MMP_I2C_SDA
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_RESET_N
STROBE_TRIGGER
5M_CAM_DATA[6]
5M_CAM_DATA[4]
5M_CAM_DATA[2]
5M_CAM_DATA[0]
C607 :
CAM_VDD_SD_1.8V
C600
10u
ICVL0518100Y500FR
C602
1u
1u
C601
0.1u
C608
C605 : CAM_VDD_CORE_1.2V
INOUT_B4 INOUT_A4
INOUT_B3 INOUT_A3
INOUT_B2 INOUT_A2
INOUT_B1 INOUT_A1
4
3
2
1
5M_CAM_DATA[3]
5M_CAM_DATA[2]
5M_CAM_DATA[1]
5M_CAM_DATA[0]
ICVE10184E070R100FR FL601
FL601
C622
0.1u
Schematic of 5M camera part
LGE Internal Use Only
- 138 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
VGA START
Check the camera & 30-pin conn.
And reconnect these connectors
(Main & FPCB connector)
Yes
End
Camera is OK?
NO
NO
MSM6280 output signal check
(VGA_CAM_RESET_N, V
VGA_CAM_PWDN)
Yes
NO
Check VGA_VDD_2.7,
VGA_VDD_1.8V
Change the LDO (U600)
Yes
NO
NO
Check master clock
(VGA_CAM_MCLK : R717)
Change the Analog Switch (U604, U607)
Yes
NO
Check the EMI/ESD filter
Change the Filter (FL700, FL701)
Yes
Yes
No
NO
Check the VGA_CAM_PCLK
(R718)
Change the slider FPCB
Yes
Change the camera
Yes
Camera is OK
End
NO
Change the Main board
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 139 -
LGE Internal Use Only
4. TROUBLE SHOOTING
VGA_CAM_PWDN
VGA_CAM_PCLK
FL700, FL701 : EMI FILTER
VGA_CAM_PCLK
VGA_CAM_RESET_N
VGA_VDD_1.8V
U607
U604
LGE Internal Use Only
VGA_VDD_2.7V
- 140 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
R718 : VGA_CAM_PCLK
VGA_VDD_2.7V
VGA_VDD_1.8V
R717 : VGA_CAM_MCLK
CN701
R717
10
R718
MMP_CAM_PCLK
VGA_CAM_DATA[0]
VGA_CAM_DATA[1]
VGA_CAM_DATA[2]
VGA_CAM_DATA[3]
VGA_CAM_DATA[4]
VGA_CAM_DATA[5]
MOTOR+
MOTOR-
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
R719 10
R720 10
R724
R725
10
10
VGA_CAM_RESET_N
I2C_SCL
I2C_SDA
MMP_CAM_HSYNC
MMP_CAM_VSYNC
VGA_CAM_DATA[7]
VGA_CAM_DATA[6]
R729
VA715
x+
Y+
xY-
C710
0.1u
NA
C711
0.1u
C712 C713 C709
10p 10p
0.1u
resistor
EVLC18S02015
ICVL0518100Y500FR
VA713
VA714
RCV+
RCV-
10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VA713 : VGA_CAM_PWDN
C714 C715
10p 10p
EVLC18S02015
VGA_CAM_PWDN
VGA_CAM_MCLK
C709 : VGA_VDD_1.8V
VA713 : VGA_VDD_2.7V
VA713 : VGA_VDD_2.7V
FL700
FL701
ICVE10184E070R100FR
INOUT_A3 INOUT_B3
10
5
9
VGA_CAM_DATA[0]
VGA_CAM_DATA[1]
VGA_CAM_DATA[2]
VGA_CAM_DATA[3]
8
7
6
1
MMP_CAM_DATA[4]
MMP_CAM_DATA[5]
MMP_CAM_DATA[6]
MMP_CAM_DATA[7]
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
INOUT_A4 INOUT_B4
G1
4
INOUT_A2 INOUT_B2
5
3
INOUT_A1 INOUT_B1
FL700
10
2
G2
1
9
8
7
6
VGA_CAM_DATA[4]
VGA_CAM_DATA[5]
VGA_CAM_DATA[6]
VGA_CAM_DATA[7]
G2
ICVE10184E070R100FR
MMP_CAM_DATA[0]
MMP_CAM_DATA[1]
MMP_CAM_DATA[2]
MMP_CAM_DATA[3]
FL701
U604
VGA_CAM_MCLK
U604 NC7SB3157L6X
1
6
B1
S
2
5
GND VCC
3
4
A
B0
CAM_SELECT_N
+VPWR
CAM_MCLK
5M_CAM_MCLK
U607 NC7SB3157L6X
1
6
B1
S
2
5
GND VCC
4
3
A
B0
+VPWR
MMP_CAM_MCLK
5M_CAM_MCLK
U607
C621
0.1u
C622
0.1u
Schematic of VGA camera part
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 141 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.14 Main LCD trouble
Main LCD control signals are generated by MSM6280. Those signal’s path are :
MSM6280 → Z ORAN (Multimedia Chip) -> 40-pin connector(CN300 in Main PCB) -> 40-pin connector
(in LCD Module)
START
Press END key
to turn the power on
Is the circuit powered?
No
Follow the Power ON
trouble shooting
Yes
Disconnect and reconnect
40-pin B to B connector
Yes
LCD display OK?
No
Check LCD_VDD_2.8V, LCD_RESET_N,
LCD_DATA[0~15] in Main BD
No
Yes
Change the Main BD
Yes
Display OK?
No
Change the LCD module
The LCD works
End
LGE Internal Use Only
- 142 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Main BD
LCD_VDD_2.8V
LCD_NRESET
LCD_DATA[0~15]
SUB BD
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 143 -
LGE Internal Use Only
4. TROUBLE SHOOTING
LCD_VDD_2.8V
VA300
C320
NA
C321 : LCD_VDD_2.8V
C321
0.1u
ICVN0505X150FR
CN300
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
MMP_LCD_VSYNC_IN
LCD_MAKER_ID
WLED_PWR
WLED_1
WLED_2
WLED_3
WLED_4
WLED_5
LCD_IF_MODE
R314
R315
R316
R317
3
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
5
22p
22p
22p
C323
C325
9
8
7
6
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
10
G1
4
FL301
FL301 ICVE10184E150R500FR
2
3
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
5
9
8
7
6
LCD_DATA[4]
LCD_DATA[5]
LCD_DATA[6]
LCD_DATA[7]
10
G1
4
INOUT_A1 INOUT_B1
G2
1
FL302
FL302 ICVE10184E150R500FR
2
3
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
5
9
8
7
6
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
10
G1
4
INOUT_A1 INOUT_B1
G2
1
FL303
FL303 ICVE10184E150R500FR
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
8
7
6
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
10
5
9
G2
1
G1
MMP_LCD_DATA[12]
MMP_LCD_DATA[13]
MMP_LCD_DATA[14]
MMP_LCD_DATA[15]
OTP Program Pin
LCD_VSYNC_OUT
G2
2
MMP_LCD_DATA[8]
MMP_LCD_DATA[9]
MMP_LCD_DATA[10]
MMP_LCD_DATA[11]
0
C326
22p
FL300 ICVE10184E150R500FR
1
MMP_LCD_DATA[4]
MMP_LCD_DATA[5]
MMP_LCD_DATA[6]
MMP_LCD_DATA[7]
VA301
C326 : LCD_VDD_2.8V
FL300
MMP_LCD_DATA[0]
MMP_LCD_DATA[1]
MMP_LCD_DATA[2]
MMP_LCD_DATA[3]
C324
ENBY0036001
1.0T, Socket
GB042-40S-H10-E3000
MMP_LCD_ADS
MMP_LCD_CS_N
LCD_RESET_N
MMP_LCD_RD_N
MMP_LCD_WE_N
MMP_LCD_VSYNC_OUT
51
51
51
51
R318
22p
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
LCD_DATA[4]
LCD_DATA[5]
LCD_DATA[6]
LCD_DATA[7]
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
C322
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Schematic of LCD part
LGE Internal Use Only
- 144 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.15 Bluetooth trouble
Bluetooth supplied voltages are generated by the PM6650.
Those signal’s path are : PM6650 → VREG_MSMP_2.7V and VREG_BT_2.85V is asserted →
TCXO_BT 19.2MHz is asserted → Bluetooth ON → BT_TX_RX_N is High → BT serial interface
control is operated (SBST / SBCK / SBDT)
NA
BT_ANT
BT_GND
L800
NA
R800
0
C800
BLUETOOTH
16
SYNC_DET_TX_EN
VDD_MSM
RX_BB_TX_BB
VDD_BAT
XTAL_IN
PGND4
20
PGND3
19
PGND2
18
PGND1
17
14
VDD_INT
TP800
TP801
TP802
BT_SBST
BT_SBCK
BT_SBDT
5
BT_TX_RX_N
R807
13
7
C802
0
1000p
BT_DATA
TCXO_BT
10K
C804
1u
C803
1u
VCC_OUT
10K
2
10
CLK_REF
4
SBST
11
SBCK
12
SBDT
R809
3
LG INNOTEK
M800
R808
9
GND4
15
GND3
8
GND2
6
GND1
1
BT_CLK
1000p
ANT
LBRQ-2B43A
C801
VREG_MSMP_2.7V
VREG_BT_2.85V
C811
100p
C812
0.1u
C813 C814
100p 2.2u
TCXO
X100
3
OUT
GND
2
R115
VREG_TCXO_2.85V
4
C139
0.1u
C140
1000p
VCC VCONT
100ohm
TRK_LO_ADJ
1
19.2MHz
C141
0.01u
VREG_BT_2.85V
C144
1000p
C147
1000p
R120 100K
TCXO_PM
RTR6275_TCXO
C145
1000p
C148 8200p
U102
TCXO_BT
TC7SH04FS
Figure. Schematic of Bluetooth Interface
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 145 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.16 Bluetooth RF Test
TC-3000A (Bluetooth Tester)
1. Set phone to bluetooth test-mode.
- Enter Test Mode(3845#*990#) → Module Test Set → BT DUT → BT DUT ON
2. Insert a phone in a TEMSELL (in case of radiation test)
3. Set ‘discover’ after push menu button of the tester and select the link analyzer .
4. After ‘set test mode’, confirm the connection state.
5. Measure the power of full channel after hopping mode is selected to ‘ON’
6. You can select wanted test cases after getting an optimized power
TP801
M800 TP800
Set the bluet oot h ON
VREG_BT_2.85V
and
VREG_MSMP_2.7V
is ass erted?
No
Yes
XTAL_IN
is ass erted?
No
Yes
CLK_REF
is ass erted?
Check P MIC
(U501) Pin#64
Check Os ci llator
(X100)
An d
Check Buffer
(U102)
No
Check sol deri ng
of BT( M800)
No
Check sol deri ng
of BT( M800)
No
Check
TP800/TP801/ P802
No
Change
the main board
TP802
BT Antenna
Yes
SYNC_DET_TX_EN
is ass erted?
Yes
SBST/SBCK/SBDT
is ass erted?
BT_GND
Yes
Bluetoot h is work well?
Yes
R800 BT_ANT
END
LGE Internal Use Only
- 146 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.17 Touch Screen trouble
Touch Initial sequence of KU990 is:
LCD_VDD_2.8V(C701) goes to 2.8V → TOUCH_PENIRQ_N(R702),TOUCH_I2C_SCL(R703) &
TOUCH_I2C_SDA(R704) go to high Touch operation of KU990 is :
A finger is touching on the screen -> TOUCH_PENIRQ_N is low -> I2C is connected -> A finger is
took off from the Screen -> TOUCH_PENIRQ_N is high -> I2C is not connected.
Start
Touchpad Calibration
Work well?
Yes
End
No
NO
Connector Is insert?
Insert Connector, again
YES
Replace the Folder
Yes
Work well?
End
No
Replace the Main board
C701 (LCD_VDD_2.8V)
Touch Window Connector
U700
R702 (TOUCH_PENIRQ_N)
R704(TOUCH_I2C_SDA)
VGA FPCB Connector
R703 (TOUCH_I2C_SCL)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 147 -
LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
5.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a
download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple
to use and easy enough for the beginner to upload executable images to the handset. LGMDP
supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.
Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.
5.2 Downloading Procedure
• Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before
getting started, set up LGMDP preferences from the Preferences of the file menu the way you want.
Click on the File menu and select Preferences.
➢ Play a success sound
It will be played a .wav file when the download has been completed. To enable this simply check the
box.
➢ Always on Top
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.
➢ Automatically run Select Port When LGMDP starts
When LGMDP starts, it will automatically select Select Port button to download new image file.
LGE Internal Use Only
- 148 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5.2.1 Connecting to PC
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for
the port to be connected for downloading images. Then click on the Connect button.
(The port number(COM7) shall be different from that of the port number in the snapshot.)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 149 -
LGE Internal Use Only
5. DOWNLOAD
• The status Ready is displayed when the application is ready for downloading. While the images are
transmitted from PC to the handset, a progressive bar
(Red box) indicating the degree of transmission of data is displayed.
LGE Internal Use Only
- 150 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
1) Image Folder indicates loot path where all image files are placed. To change location of the default
image path, select Browse... button. The edit box shows the file path where images are located.
Please note that all images should be located in a selected folder.
2) Click on the Browse... button to select image files to be downloaded on the handset.
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.
Backup the NV data and restore the backed up NV data automatically.
1)
2)
3)
5)
4)
6)
7)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 151 -
LGE Internal Use Only
5. DOWNLOAD
4) Reset database & Contents:
User related data including the setting data on the EFS is reset in the handset. The user contents in
the handset will be erased. If you want to reset all the user data back to the way they were before
you started downloading new images, check the option.
Erase_EFS:
The calibration data, user contents, media, and module are erased. Only calibration data is kept when
NV backup/restore is checked. The user contents and file system physically are wiped out.
Keep All Contents
Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new
S/W images. User data stated above are maintained if this option is selected.
5) Additional Options:
Display Information is defaultly not selected and user cannot choose.
Override partition table is also also defaultly not selected and user cannot choose.
6) Clear: Clearing all directory paths of images in the dialog.
7) Start: Starting downloading the selected individual image.
LGE Internal Use Only
- 152 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5.2.2 Choosing image files
• Select the image folder, where all the image files are located, by clicking on the Browse....
(The folder name shall be different from that of the folder name in the snapshot. The folder name
indicates the path where the image files are located.)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 153 -
LGE Internal Use Only
5. DOWNLOAD
Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically
load images accordingly. Also you can select images by manually. For instance, select the path of
AMSS Modem Image file by clicking on the Browse... button. The selected AMSS image will be
downloaded to the handset from the path directory in the PC. Make sure that you have chosen
correct file. In case of wrong AMSS Modem file is selected, the phone may not work.
(The file name shall be different from that of the file name in the snapshot.)
LGE Internal Use Only
- 154 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the
desired NV file to be downloaded on the handset. To enable this simply check the box or select the
NV file from the LGMDP installation directory by clicking on the Browse... button.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 155 -
LGE Internal Use Only
5. DOWNLOAD
Click on the START button to start downloading. A summary of the selected images and option
information window will be displayed. Click on the No button if this is not the setting you are
downloading for. Otherwise click on the Yes button to continue downloading selected image file with
options.
Yes
LGE Internal Use Only
No
- 156 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5.2.3 Downloading
• This message box informs that a new file for
NV backup will be created in the displayed
file name in the LGMDP installation
directory.
• Backing up NV data and backed up NV data
will be stored in the LGMDP installation
directory.
• Erasing the existing directories and files
before the Module image is downloaded.
• Downloading the AMSS modem image
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 157 -
LGE Internal Use Only
5. DOWNLOAD
• Rebooting the handset and re-establishing
the connection
• Restoring NV data which backed up in the
Backing up process. User can also restore
NV data using NV Default image selection.
• Rebooting the handset and re-establishing
the connection
• Erasing the existing directories and files
before downloading the selected Media
image
LGE Internal Use Only
- 158 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
• Downloading Media image in progress
• Downloading Module image in progress
• Downloading process has completed
successfully
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 159 -
LGE Internal Use Only
5. DOWNLOAD
5.2.4 Tools
• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is
designed to monitor USB connectivity and check where the COM has been installed . Select Device
Manager from the Tools of the file menu.
LGE Internal Use Only
- 160 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5.3 Troubleshooting Download Errors
5.3.1 When the phone does not work
• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and
then try to download all the images up to AMSS. In the emergency mode, you can not download
media or module image.
The phone supports a special mode called emergency mode. In this mode, minimum units for
downloading is running so that users can download the images again in case of emergency
situation. (AMSS modem, Media, and Module images can not be running in this mode.)
• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.
Click on the Connect button to continue.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 161 -
LGE Internal Use Only
5. DOWNLOAD
• Choose Image file after clicking on the Browse... button. Make sure that you have chosen the right
image file. After choosing valid images, then click on the Start button to start downloading selected
images. The selected image will be downloaded to the handset from the path directory in the PC.
After downloading images successfully, it will boot to normal mode.
LGE Internal Use Only
- 162 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5.3.2 NV Restore Error
• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 163 -
LGE Internal Use Only
5. DOWNLOAD
• Connect the handset and Press the Connect button in the Select Port window.
(Enable state in the window indicates that the Phone has been detected and is ready to download.)
LGE Internal Use Only
- 164 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
• Click on Browse... . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will
be shown. These nv files were saved every time NV Backup option was selected, and the name of
the nv file is determined based on the time when NV Backup was done. Choose the desired NV file
to be downloaded on the handset, and click on Start.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 165 -
LGE Internal Use Only
5. DOWNLOAD
5.4 Caution
1) Multi-downloading using the USB hub is not recommendable.
2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image
(media and module) download.
3) The NV data saved at LGMDP folder as following format.
D:\LGMDP\004400-01-429926\_COM14_
LGMDP folder name
IMEI number
Port number
4) Recommended that the Module and Media Image have to be downloaded at the same time.
5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.
LGE Internal Use Only
- 166 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
6.1 GSM & UMTS RF Block
[Figure 2.1] UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 167 -
LGE Internal Use Only
6. BLOCK DIAGRAM
Block
Ref. Name
Part Name
Function
Comment
Common
FL100
LSHS-M090UH
Front End Module
ASM+Rx Saw
SW100
KMS518
Test Connector
Calibration, etc
TG-5010LH_19_2M
VCTCXO
19.2MHz
U100
RTR6275
RF Transceiver IC
TRX
Bluetooth
M800
LBRQ-2B43A
BT RF Transceiver
BT TRX
UMTS
FL103
SAYZ1G95EB0B00
Duplexer
TRX
FL102
EFCH2140TDE1
RX SAW Filter
RX
FL104
EFCH1950TDF1
TX SAW Filter
TX
TX PAM
TX
X100
U105
GSM
A WT6277R
U104
CP0402A1950DNTR
Coupler
TX
U101
TQM7M5003
TX Dual PAM
TX
FL101
EFCH897MTDB1
Tx SAW Filter
Tx
[Table 2.1] RF Block Component
LGE Internal Use Only
- 168 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
6.2 Interface Diagram
[Figure 2.2] U990 Interface Diagram
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 169 -
LGE Internal Use Only
6. BLOCK DIAGRAM
Main RF signal
Main RF signal
Description
GSM 900 TX
GSM 900 TX RF Signal
DCS TX
DCS TX RF Signal
PCS TX
PCS TX RF Signal
W- TX
UMTS2100 TX RF Signal
GSM 900 RX
GSM 900 RX RF Signal
DCS RX
DCS RX RF Signal
PCS RX
PCS RX RF Signal
W- RX
UMTS2100 RX RF Signal
TX_I/Q
I/Q for Tx of RF
RX_I/Q
I/Q for Rx of RF
Comment
Control signal
Control signal
Description
Comment
UMTS PA_CTL signal
PA_R1
UMTS Tx High/Low Power Control
PA_ON
Power Amp. Enable
GSM PA_CTL signal
GSM_PA_BAND
GSM_PA_EN
GSM_PA_RAMP
DCS or PCS /GSM Mode Selection
Power Amp. Gain Control Enable
Power Amp. Gain Control
RF Tranceiver_CTL signal
TX_ON
SSBDT_RTR
TX_AGC_ADJ
RF Enable Signal
Bidirectional SSBI Data
UMTS Transmit Gain Control
FEM_CTL signal
UMTS,
ANT_SEL 0,1,2
Ant Switch Module Mode Selection
GSM900Tx/Rx,
DCS Tx/Rx,
PCS Tx/Rx
LGE Internal Use Only
- 170 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
2
1
4
3
5
6
8
7
9
11
10
12
KMS-518
C100
180p
G2
C
A
G1
SW100
TX_IP
L101
C103
180p
C101 120p
4.7nH
C116
12p
L107
15nH
C117
22p
10
RX_QP
11
RX_QN
L109 22nH
31
GCELL_INP
30
GCELL_INN
VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
VDDA11
VDDA12
VDDA13
VDDA14
38
DCS_INP
39
DCS_INN
L110
22nH
GSM
36
GPCS_INP
37
GPCS_INN
22nH
22
CAL_INP
23
CAL_INN
26
WLNA_IN
29
RX_WCDMA_2100
RX_QP
RX_QM
40
PWD_DET_IN
21
TEST
32
EGSM_INP
33
EGSM_INN
LSHS-M090UH
L111
RTR6275
3
R_BIAS1
27
R_BIAS2
R101 (1%)
680
R102
4
6
8
9
15
16
19
20
28
41
45
47
48
49
NA
5.1
0
R107
2.7
22u
C118
PWR_DET
B
VREG_RF_SMPS
VREG_SYNTH_2.6V
C126
22p
C125
1u
C127
100p
VDD_RX
WLNA_OUT
C
R103
R104
0.1u
5.6nH
5.6nH
RX_IP
RX_IM
0.1u
L106
L108
PCS
RTR6275_TCXO
VTUNE-Connected directly to GND
12
RX_IP
13
RX_IN
U100
SBDT
TX_QM
3300p
1000p
C122
19
20
21
22
23
24
VCONTROL
DAC_REF
C111
C112
0.1u
14
R100
12K (1%)
7
5
VTUNE1
18
VTUNE2
0.1u
54
DAC_REF
SSBDT_RTR
TCXO
RF_ON
C119
B
TX_AGC_ADJ
8
UMTS_TX_RX
13
DCS_PCS_TX
16
EGSM_TX
DCS_RX2
DCS_RX1
PCS_RX2
PCS_RX1
EGSM_RX2
EGSM_RX1
56
C121
C114
47p
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
PGND1
PGND2
24
TX_ON
TX_QP
C110
180p
L105 5.6nH
6
VDD
7
NC
C120
1
2
9
11
12
14
15
17
18
25
26
C115
47p
C109
47p
10
A
C107
180p
51
TX_IP
50
TX_IN
53
TX_QP
52
TX_QN
43
LB_RF_OUT1
42
LB_RF_OUT2
VDDM
C113
47p
ANT
6p
5p
17
5
VC1
4
VC2
3
VC3
C106
C108
GSM_TX
25
GND
57
PGND
FL100
PQ
ANT_SEL0
ANT_SEL1
ANT_SEL2
L104
15nH
DCS
C128
22p
WCDMA_MIX_IN_P
R109
WCDMA_2100_TX_OUT
DCS_PCS_TX
L103 5.6nH
VREG_RF_SMPS
TX_IM
2
ENV_LNP
1
ENV_LNN
ENV_OUT
46
HB_RF_OUT1
44
HB_RF_OUT2
10
1.2p
12nH
56p
0.1u
55
C105
0.1u
L102
NA
WLNA_OUT
C104
C102
A
C124
0
C123
L100
34
WMIX_INP
35
WMIX_INN
ANT100 ANT101 ANT102
C
WCDMA_MIX_IN_M
VREG_RF_SMPS
C129
0.1u 22u
C130
C131
100p
ANTENNA SWITCH MODULE LOGIC
HIGH
HIGH
GSM 1800/GSM 1900 TX
HIGH
LOW
LOW
GSM 850 RX
LOW
LOW
LOW
GSM 900 RX
LOW
LOW
HIGH
GSM 1800 RX
LOW
HIGH
HIGH
GSM 1900 RX
14
HIGH
HIGH
LOW
12
11
C136
8p
10
C138
LOW
9
L112
NA
WCDMA
DCS_PCS_IN
GND5
BS
near to 48pin
R111
1
DCS_PCS_TX
68
13
LOW
GND6
SMPS circuit for RF
C134
1000p
C133
22p
C132
0.01u
LOW
HIGH
15nH
8
VCC
GND4
GND3
GSM_OUT
GND2
TX_EN
U101
TQM7M5003
VBATT
DCS_PCS_OUT
GSM 850/GSM 900 TX
VREG_MSMP_2.7V
ANT_SEL2
GND7
ANT_SEL1
GND8
D
ANT_SEL0
GND1
VRAMP
GSM_IN
2
GSM_PA_BAND
3
R112
91
TCXO
+VPWR
C135
33u
C137
1u
5
X100
FL101
6
3
EFCH897MTDB1
7
3
2
IN
4
R117
OUT
D
GND
2
R115
R114
G2 G1
15
16
17
R113
91
GSM_PA_EN
4
O1 G3
VREG_TCXO_2.85V
GSM_TX
1
51
8 dB
R118
5
2.2K
4
VCC VCONT
100ohm
TRK_LO_ADJ
1
19.2MHz
C140
1000p
C139
0.1u
R119
120
120
GSM_PA_RAMP
C146
10 dB
C141
0.01u
Thermistor circuit deleted
C143
68p
10p
VREG_BT_2.85V
C142
GSM
L113
4.7nH
0.75p
C144
1000p
C147
1000p
C145
1000p
R120 100K
TCXO_PM
GSM_PA_BAND
LOW
HIGH
PQ
MODE
GSM
C148 8200p
RTR6275_TCXO
TCXO_BT
U102
DCS/PCS
TC7SH04FS
E
E
FM RADIO
WCDMA
VDD_RX
C153
WCDMA_MIX_IN_M
IN
U103
4
L117
1.8nH
L118
A1
A2
L119
A3
Rev. 1.1
1nH
2.2nH
L121
A4
A5
C156
2.2p
FL104
FM_INTX
1
GND1
4
GND2
8
GND3
C163
100p
LO1
VREFDIG
LO2
CLOCK
VCCVCO
DATA
VREG_MSMP_2.7V
E2
TP100
E1
TP101
I2C_SCL
1
3
2
C1
WCDMA_2100_TX_OUT
C165
NA
56p
C2
FM_BUSEN
L122
NA
VCC
TMUTE
I2C_SDA
D6
SWPORT
ISS
INTX
DGND2
AGND
DGND1
RFIN1
VDD
FREQIN
RFIN2
BUSEN
RFGND
D5
D3
D2
D1
G
C6
C5
C166
FM_ANT
1
VCC1
2
RFIN
3
GND1
4
VMODE
5
VREF
100p
C171
56p
PA_R1
Q100
AWT6277R
COUP
C161
5
G2 G1
3.3nH
C172
27p
VREG_TCXO_2.85V
TP103
L127
100nH
SLEEP_CLK
2
C173
100p
R124
51
H
L126
8.2nH
20dB
4
R123
5
PQ
3
50OHM
L125
1.2nH
1.8p
4.7nH
L128
L123
15nH
3
2
IN
1
OUT
56p
GND5
VCC2
GND4
RFOUT
GND3
GND2
4
IN
U105
11
10
9
8
7
6
C170
SCDY0003403
B6
O1 G3
L124
RX_WCDMA_2100
56p
F
FM_AUDIO_L
E3
PWR_DET
H
KRX102E
68
R125
100
PA_ON
1
C169 5.6p
C164
1u
4
RX
8.2p
C162
0.01u
U104
C168
FM_AUDIO_R
E5
E4
0.1u
B1
B5
+VPWR
C160
22u
A6
B2
TP102
C159
3
GND6
6
GND5
9
GND4
2
ANT
5
7
TX
SAYZY1G95EB0B00
C167
MPXOUT
E6
C157
C158
1u
EFCH1950TDF1
FL103
LOOPSW
VAFL
47nH
VREG_MMC_3.0V
G
CPOUT
L120
WCDMA_MIX_IN_P
1nH
PQ
TEA5766UK
VAFR
G2 O2
5
C151
0.01u
C155
0.5p
10K
1
56p
56p
C150
0.1u
1nH
3
G1 O1
WLNA_OUT
C152
3.9p
F
C154
L116
1nH
2
R121
FL102
R122
EFCH2140TDE1
L114
1.5nH
100K
C149
22p
L115
R126
100
8 dB
1
2
3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4
5
6
7
- 171 -
8
9
10
11
12
LGE Internal Use Only
7. CIRCUIT DIAGRAM
2
1
4
3
5
6
7
6
8
9
1
11
10
0
12
PCB_Rev_ADC
MODE
USB 48M CLK
ADC
MODE2 MODE1
VREG_MSMP_2.7V
VREG_MSMP_2.7V
VREG_MSMP_2.7V
MIC1N
MIC1P
NA
NA
C237
C204
R206
AA20
AE20
AF20
AF22
AF21
AE19
AF19
AC20
AC19
AC22
AC21
AA19
AA18
T15
AF18
W17
AE18
AA17
AC17
AC18
LINE_ON
LINE_OP
HPH_R
HPH_L
EAR1ON
EAR1OP
MICBIAS
AUXOUT
HPH_VREF
LINE_L_IP
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP
AB23
Y21
V19
W21
AA23
V21
AE21
AE22
BOOT_MODE
BOOT_MODE2
BOOT_MODE3
HKAIN0
HKAIN1
HKAIN2
HKAIN3
HKAIN4
HKAIN5
T21
MODE2
U23
MODE1
Y23
MODE0
F13
NA
C235
C236 0.1u
HP_R
HP_L
SPK_R
SPK_L
RCVRCV+
MICBIAS
VBAT_TEMP
RMT_ADC
AMUX_OUT
VBAT_SENSE
NA
51K
51K
100K
NA
100K
R208
VREG_MSMA_2.6V
C233
10u
C239
4.7u
C234
1u
F26
H11
C
LIN_INVERTER
LIN_MOTOR_EN
CAM_MCLK
LCD_IF_MODE
USB_SELECT_N
CAM_MODE3_N
VGA_CAM_PWDN
LCD_LDO_EN
MICROSD_DETECT
HOOK_SENSE_N
RMT_INT
D5
J21
A6
N19
W15
AA15
AE13
H9
B6
F8
AA1
Y6
L25
HP_AMP_EN
CAM_SELECT_N
LCD_RESET_N
MMP_INT_N
H6
F18
H18 R215
0
A12
B12
A13
B13
F12
C210
0.01u
C211
0.01u
C217
1000p
C218
1000p
C212
0.1u
C219
0.01u
C213
0.01u
C220
0.01u
C215
0.1u
C214
0.01u
C221
0.01u
C216
0.1u
2200p cap => place between
D12(VDDA1) and F12(DAC_REF)
R211
C222
2200p
TX_AGC_ADJ
TRK_LO_ADJ
2K
TCXO_EN
PA_ON
(WCMDA 2100 PAM Enable)
TX_QM
TX_QP
TX_IM
TX_IP
DAC_REF
C223
33nF
C224
1u
C227
1000p
C226
1000p
C225
1u
DAC_REF
D
C229
0.1u
C228
0.1u
Near to B18 (VDD_PLL)
W23
V23
V25
R1
F15
D15
A17
AF6
AF11
H16
AF15
VDD_EF_USE
R16
MDDIH_STBN
MDDIH_STBP
B19
MDDIH_DATN
B20
MDDIH_DATP
A20
A19
VREG_MSMP_2.7V
R217
R218
2.2K
2.2K
AF17
AA16
AE23
AE24
AA26
Y26
U26
U25
P23
B21
B18
A3
B9
B15
D12
VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
VDD_PLL
VDD_MDDI
VDD_PAD4_0
K25
AE15
AE6
AE11
U2
R2
R25
VDD_PAD3_0
VDD_PAD3_1
VDD_PAD3_2
VDD_PAD3_3
VDD_PAD2_0
VDD_PAD2_1
VDD_PAD2_2
M2
K2
B5
B11
T25
B14
B24
G25
D25
AE16
AE8
F2
VDD_PAD1_0
VDD_PAD1_1
VDD_PAD1_2
VDD_PAD1_3
VDD_PAD1_4
E
C1
H1
W1
AC1
AF8
AF16
T26
G26
D26
A24
A14
A11
A5
AC23
AA21
F
AA6
AC4
AE1
AE2
AE25
AE26
AF1
AF2
AF25
AF26
W19
W8
T16
T11
R15
R14
R13
P15
R12
P14
C26
G
If you are not Qfuse (security),
for VSS_THERMAL
Place near
MSM pin AD26
H
I2C_SDA
I2C_SCL
H
P13
A1
PA_POWER_CTL
GSM_PA_DAC_REF
P25
MDDIC_DATP
A23
MDDIC_DATN
B22
MDDIC_STBP
B23
MDDIC_STBN
P12
AF24
N14
AF23
N15
AD25
N13
AC26
N12
AC16
M15
AB26
NA
M14
R19
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
M12
H21
M13
E26
E25
W26
NC
VSS39
VSS41
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
w18 (Analog VSS guard ring for CODEC)
M11
F23
R213
W18
L16
G23
VGA_CAM_RESET_N
V26
W16
L11
B8
K10
P26
U19
GSM_PA_BAND
GSM_PA_EN
A8
F6
D19
H8
D9
D13
VSSA1
VSSA2
VSSA3
VSSA4
VSSA5
VSSA6
VSSA7
VSSA8
VSSA9
VSSA10
VSSA11
VSSA12
VSSA13
VSSA14
VSSA15
VSSA16
F21
F10
A21
H19
H10
ANT_SEL2
ANT_SEL1
ANT_SEL0
CAM_MODE1_N
FM_INTX
FM_BUSEN
D23
D11
A18
U200-2
MSM6280_B
D4
T19
MMP_HPCM_FSYNC
TX_ON
B26
T23
VSS_PAD3_0
VSS_PAD3_1
A15
VSS_PAD3_2
A9
VSS_PAD3_3
B2
B4
VSS_DIG_0
VSS_DIG_1
VSS_DIG_2
VSS_DIG_3
VSS_DIG_4
VSS_DIG_5
VSS_DIG_6
VSS_DIG_7
VSS_DIG_8
VSS_DIG_9
VSS_DIG_10
VSS_DIG_11
VSS_DIG_12
VSS_DIG
B17
B25
H12
RESERVED
R26
B1
J8
MMP_HPCM_CLK
MMP_HPCM_DI
MMP_HPCM_DO
C231
0.01u
10%
(PLLOUT_TEST)
VSS_PAD2_0
VSS_PAD2_1
VSS_PAD2_2
A26
G4
(VDD_DAC_REF)
M1
D16
N21
AC2
VSS_PAD1_0
VSS_PAD1_1
VSS_PAD1_2
VSS_PAD1_3
U1
VSS_PAD1_4
K1
H15
K19
W2
C2
F1
VDD_DIG_0
VDD_DIG_1
VDD_DIG_2
VDD_DIG_3
VDD_DIG_4
VDD_DIG_5
VDD_DIG_6
VDD_DIG_7
VDD_DIG_8
VDD_DIG_9
VDD_DIG_10
VDD_DIG_11
VDD_DIG_12
PA_R1
LIN_PWM_MAG
H2
RX_QM
RX_QP
RX_IM
RX_IP
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
AC25
A2
Y25
AB25
A25
AA25
this pin can be grounded as in MSM6275
C232
0.1u
10%
C230
0.1u
W25
A22
AD26
L19
H23
K26
J26
G21
J25
K23
B3
J19
L15
D21
C25
D22
D20
USB_DAT_VP
N23
USB_SE0_VM
N25
USB_OE_TP_N
N26
BT_CLK_GPIO25
BT_SBST_GPIO24
BT_SBCK_GPIO23
BT_SBDT_GPIO22
BT_TX_RX_N_GPIO21
BT_DATA_GPIO20
GSM_PA_RAMP
GSM_PA_PWR_CTL_REF
KEY_ROW[2]
KEY_ROW[1]
KEY_ROW[0]
U21
G
USB_DAT
USB_SE0
USB_OE_N
AE9
UART3_CTS_N_GPIO86
UART3_DP_RX_DATA_GPIO85
M19
UART3_DP_TX_DATA_GPIO84
D6
GPIO40
D7
GPIO42
AF9
L23
W11
M21
AC10
VGA_CAM_PWR_EN
TOUCH_I2C_SCL
TOUCH_I2C_SDA
PM_INT_N
PS_HOLD
AA11
UART2_RFR_N_GPIO91
UART2_CTS_N_GPIO90
UART2_DP_TX_DATA_GPIO88
AC11
F4
T12
E4
W12
TP200 G6
AA12
GRFC8_GPIO11
GRFC7_GPIO10
GRFX6_GPIO9
GRFC5_AUX_SBST_GPIO8
GRFC4_AUX_SBCK_GPIO7
GRFC3_GPIO6
GRFC2_GPIO5
GRFC1_AUX_SBDT_GPIO4
GRFC0_GPIO3
USIM_CLK
USIM_RST_N
USIM_DATA
AE12
AC12
F7
AF12
F14
W13
AA13
TOUCH_PENIRQ_N
CAM_MODE2_N
AE14
AC13
EBI2_ADDR[14]
EBI2_ADDR[13]
EBI2_ADDR[12]
EBI2_ADDR[11]
D8
AC14
F
L26
T13
A2_20_GPIO34
A2_19
A2_18
A2_17
A2_16
A2_15
A2_14
A2_13
A2_12
A2_11
A2_10
A2_9
A2_8
A2_7
A2_6
A2_5
A2_4
A2_3
A2_2
A2_1
UART_RXD
UART_TXD
AA14
M23
MMP_PWR_EN
UART1_RFR_N_PA_POWER_CTL_M_GPIO98
UART1_CTS_N_GPIO97
UART1_DP_RX_DATA_GPIO96
UART1_DP_TX_DATA_GPIO95
GPIO44
GPIO39
GPIO64
AF13
P16
AC5
P21
AF3
F9
AE4
AUX_PCM_CLK_GRFC14_GPIO80
AUX_PCM_DIN_GRFC13_GPIO14
AUX_PCM_DOUT_GRFC12_GPIO103
AUX_PCM_SYNC_GRFC11_GPIO102
TX_ON_GRFC10
B7
AC6
A7
AE5
D10
AF5
AA7
GPIO45
GPIO53
GPIO52
GPIO51
GPIO50
GPIO49
AC7
L12
AA8
VREG_MSMP_2.7V
H25
D17
TRST_N
TCK
TMS
TDI
TDO
RTCK
MMP_RESET_IN_N
KEY_COL[0]
KEY_COL[1]
WHEEL_SW_L
WHEEL_SW_R
WM_EN
W9
0
GP_PDM2_PA_RAN_GE1
H17
GP_PDM1_PA_RAN_GE0
A4
AC8
D2_15
D2_14
D2_13
D2_12
D2_11
D2_10
D2_9
D2_8
D2_7
D2_6
D2_5
D2_4
D2_3
D2_2
D2_1
D2_0
KEYSENSE4_N_GPIO48
KEYSENSE3_N_GPIO47
KEYSENSE2_N_GPIO46
KEYSENSE1_N_GPIO63
R21
KEYSENSE0_N_GPIO62
AE7
P19
AA9
VREG_MSME_1.8V
(CAD : 10uF=>Input MSMA_2.6V)
MSM_MICROSD_DATA[1]
MSM_MICROSD_DATA[2]
MSM_MICROSD_DATA[3]
LCD_MAKER_ID
LCD_VSYNC_OUT
VREG_MSMA_2.6V
Q_IM_CH1
Q_IP_CH1
I_IM_CH1
I_IP_CH1
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
U200-1
MSM6280_A
UB2_N
XMEM2_CS_N0
OE2_N
AF4
WE2_N
AE10
LB2_N_A2_0
T14
NAND2_FLASH_READY_GPIO33
AC9
RESIN_N
F11
RESOUT_N
AA4
RESOUT_N_EBI1
AE17 R209
WDOG_EN
D18
W6
V2
TCXO
A10
USB_XTAL48_IN
B10
USB_XTAL48_OUT
A16
SLEEP_XTAL_IN
B16
SLEEP_XTAL_OUT
M6
L2
U4
V8
U8
AA2
G1
K8
N4
Y4
AB1 R207
51
P11
SDRAM_ADDR[14]
P8SDRAM_ADDR[13]
P6SDRAM_ADDR[12]
P2SDRAM_ADDR[11]
P1SDRAM_ADDR[10]
N1 SDRAM_ADDR[9]
N2 SDRAM_ADDR[8]
N6 SDRAM_ADDR[7]
N8 SDRAM_ADDR[6]
N11 SDRAM_ADDR[5]
M4 SDRAM_ADDR[4]
M8 SDRAM_ADDR[3]
XMEM2_CS_N1
LCD_CS_N_GPIO38
AF7
W10
PMIC_AUXIN[1]
PMIC_AUXIN[2] - PA_THERM
Normal boot
Trusted boot
VREG_MSMC_1.2V
F25
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
DAC_REF
W14
AA10
A
Place near
MSM pin W18
(CODEC VSS)
H13
AF10
EBI2_DATA[15]
EBI2_DATA[14]
EBI2_DATA[13]
EBI2_DATA[12]
EBI2_DATA[11]
EBI2_DATA[10]
EBI2_DATA[9]
EBI2_DATA[8]
EBI2_DATA[7]
EBI2_DATA[6]
EBI2_DATA[5]
EBI2_DATA[4]
EBI2_DATA[3]
EBI2_DATA[2]
EBI2_DATA[1]
EBI2_DATA[0]
NOR boot
8-bit, NAND boot
16-bit, NAND boot
B
SDCC_DAT1_GPIO99
M25
SDCC_DAT2_GPIO100
M26
SDCC_DAT3_GPIO101
AE3
MDP_VSYNC_SECONDA_GPIO104
AD2 R210
MDP_VSYNC_PRIMARY_GPIO105
CAMIF_DATA9_GPIO61
CAMIF_DATA8_GPIO60
CAMIF_DATA7_GPIO59
CAMIF_DATA6_AUX_TDO_GPIO58
CAMIF_DATA5_AUX_TDI_GPIO57
CAMIF_DATA4_AUX_TMS_GPIO56
CAMIF_DATA3_AUX_TCK_GPIO55
CAMIF_DATA2_AUX_TRST_N_GPIO54
CAMIF_VSYNC_GPIO16
CAMIF_HSYNC_GPIO15
CAMIF_PCLK_GPIO82
CAMIF_DATA0_GPIO83
CAMIF_DATA1_GPIO81
GPIO19
GPIO17
SYNTH1_GPIO41
RINGER_GPIO18
E2
0
1
1
0.1u
TX_AGC_ADJ
L13
TRK_LO_ADJ
F19
TCXO_EN_GPIO94
F17
PA_ON0
F20
D2
HKADC[0] - AMUX_OUT
HKADC[1] - VBATT_SENSE
HKADC[2] - HDET1
HKADC[3] - REMOTE_ADC
HKADC[4] - PCB_Rev_ADC
HKADC[5] - VBATT_TEMP
BOOT_MODE
0
1
C238
MMP_CAM_DATA[7]
MMP_CAM_DATA[6]
MMP_CAM_DATA[5]
MMP_CAM_DATA[4]
MMP_CAM_DATA[3]
MMP_CAM_DATA[2]
MMP_CAM_DATA[1]
MMP_CAM_DATA[0]
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_PCLK
MMC_SELECT_N
CODEC_I2C_SDA
LCD_BL_CTRL
CODEC_I2C_SCL
EAR_SENSE_N
LIN_PWM_FREQ
J6
D1
AB2
I2C_SDA_GPIO26
I2C_SCL_GPIO27
G2
AB4
N16
H4
SBST
SBDT
SBCK
P4
J23
J4
L21
J2
K21
J1
K6
Native, ARM JTAG
Native, MSM JTAG
BOOT_MODE3
10%
SSBDT_PM
L8
K4
SSBDT_RTR
L6
MMC_CMD_GPIO30
MMC_DATA_SDCC_DAT0_GPIO32
MMC_CLK_SDCC_CLK_GPIO31
V4
U6
L14
E1
R11
H26
Y1
H14
Y2
M16
V6
150K 1%
WDOG_STB_SBCK1_GPIO0
SBDT1_GPIO1
PA_ON1_GPIO2
GRFC9_GPIO12
CAMCLK_PO_GP_MN_GPIO13
GPIO28
USB_RX_DATA_GPIO29
XMEM2_CS_N2_GPIO35
XMEM2_CS_N3_GPIO36
LCD_EN_GPIO37
GPIO43
SYNTH2_GPIO65
GPIO66
XMEM1_CS_N1_GPIO76
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
UART3_RFR_N_GPIO87
UART2_DP_RX_DATA_GPIO89
SYNTH0_GP_PDM0_GPIO92
SBST1_GPIO93
MSM_MICROSD_CMD
MSM_MICROSD_DATA[0]
MSM_MICROSD_CLK
R4
W4
ROM1_CLK_SDRAM1_CLK
XMEM1_CS_N2_SDRAM1_CS_N0
SDRAM1_CLK_EN
ROM1_ADV_N_SDRAM1_RAS_N
XMEM1_LWAIT_N_SDRAM1_CAS_N
XMEM1_HWAIT_N
WE1_N_SDRAM1_WE_N
A1_25_SDRAM1_DQM3_GPIO75
A1_23_SDRAM1_DQM2_GPIO78
UB1_N_SDRAM1_DQM1
LB1_N_SDRAM1_DQM0
OE1_N
XMEM1_CS_N0
T1
AF14
NAND_CLE
NAND_CS_N
EBI2_OE_N
EBI2_WE_N
NAND_ALE
NAND_READY
E
T2
R6
AC15
MMP_CS_N
MMP_LCD_BYPASS_CS_N
EBI2_DATA[0:15]
T4
D14
D
T6
R8
A1_22
A1_21
A1_20
A1_19
A1_18
A1_17
A1_16
A1_15
GPIO_74
GPIO_73
GPIO_72
GPIO_71
GPIO_70
GPIO_69
GPIO_68
GPIO_67
SDRAM1_D15
SDRAM1_D14
SDRAM1_D13
SDRAM1_D12
SDRAM1_D11
SDRAM1_D10
SDRAM1_D9
SDRAM1_D8
SDRAM1_D7
SDRAM1_D6
SDRAM1_D5
SDRAM1_D4
SDRAM1_D3
SDRAM1_D2
SDRAM1_D1
SDRAM1_D0
R23
C
T8
L4 SDRAM_ADDR[2]
V1 SDRAM_ADDR[0]
SDRAM_DATA[31]
SDRAM_DATA[30]
SDRAM_DATA[29]
SDRAM_DATA[28]
SDRAM_DATA[27]
SDRAM_DATA[26]
SDRAM_DATA[25]
SDRAM_DATA[24]
SDRAM_DATA[23]
SDRAM_DATA[22]
SDRAM_DATA[21]
SDRAM_DATA[20]
SDRAM_DATA[19]
SDRAM_DATA[18]
SDRAM_DATA[17]
SDRAM_DATA[16]
SDRAM_DATA[15]
SDRAM_DATA[14]
SDRAM_DATA[13]
SDRAM_DATA[12]
SDRAM_DATA[11]
SDRAM_DATA[10]
SDRAM_DATA[9]
SDRAM_DATA[8]
SDRAM_DATA[7]
SDRAM_DATA[6]
SDRAM_DATA[5]
SDRAM_DATA[4]
SDRAM_DATA[3]
SDRAM_DATA[2]
SDRAM_DATA[1]
SDRAM_DATA[0]
A1_24_GPIO79
A1_1
A1_2
A1_3
A1_4
A1_5
A1_6
A1_7
A1_8
A1_9
A1_10
A1_11
A1_12
A1_13
A1_14
SDRAM_DATA[0:31]
L1 SDRAM_ADDR[1]
SDRAM_ADDR[0:14]
B
100nH
R202
470K1%
C200
R203
R204
R205
VREG_MSMP_2.7V
L200
R201
10p
RESET_IN_N
RESOUT_N
BUFF_TCXO
USB_XTAL_IN
USB_XTAL_OUT
SLEEP_CLK
SDRAM_WE_N
SDRAM_DQM[3]
SDRAM_DQM[2]
SDRAM_DQM[1]
SDRAM_DQM[0]
SDRAM_CLK
SDRAM_CS_N
SDRAM_CLK_EN
SDRAM_RAS_N
SDRAM_CAS_N
USB_XTAL_OUT
( Default Pull-Down)
0
0
X
0
1
C203
1M
0.1u
VREG_MSME_1.8V
48MHz
MODE0
0
1
BOOT_MODE2
R200
AD1
X200
F16
3
2
ICRT20S48M0X514CR
1
USB_XTAL_IN
E23
A
0
0
MIC2P
( +/- 2500ppm for USB Peripheral )
1
LGE Internal Use Only
2
3
4
5
6
7
- 172 -
8
9
10
11
12
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
4
4
C302
0.1u
C303
0.1u
C304
0.1u
C306
0.1u
C305
0.1u
9
8
7
10
12
11
MMP_VDD_USB_3.3V
A
VREG_USB_3.3V
MMP_VDD_CORE_1.0V
6
C300
10u
C307
10p
LCD INTERFACE
MICROSD_DETECT
R333
NA
TP303
C331
G14
F13
2.2uH
C334
330p
C335
330p
390
TV_OUT
75
L300
R339
R338
22p
392ohm 1%
TVDATA
TVREF
2
3
INOUT_A2
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
CN300
LCD_DATA[4]
LCD_DATA[5]
LCD_DATA[6]
LCD_DATA[7]
8
10
5
9
7
6
1
MMP_LCD_DATA[8]
MMP_LCD_DATA[9]
MMP_LCD_DATA[10]
MMP_LCD_DATA[11]
2
3
INOUT_A1
INOUT_B1
INOUT_A2
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
5
P8
N8
P9
M10
N10
N9
N11
P11
N12
N7
L8
P13
L9
N13
M11
M9
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
8
7
6
10
G1
4
9
FL303 ICVE10184E150R500FR
2
3
4
INOUT_A1
INOUT_B1
INOUT_A2
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
5
G1
MMP_CAM_DATA[0]
MMP_CAM_DATA[1]
MMP_CAM_DATA[2]
MMP_CAM_DATA[3]
MMP_CAM_DATA[4]
MMP_CAM_DATA[5]
MMP_CAM_DATA[6]
MMP_CAM_DATA[7]
B5
A5
B6
B4
A4
C3
A3
A2
A1
B2
B1
B3
C1
C2
C5
C6
D3
D1
1
MMP_LCD_DATA[12]
MMP_LCD_DATA[13]
MMP_LCD_DATA[14]
MMP_LCD_DATA[15]
9
7
6
A6
D2
D5
C4
D4
E1
E4
E3
E2
MMP_LCD_VSYNC_IN
MMP_LCD_VSYNC_OUT
R324
0
R325
0
R326
R327
H
0
OTP Program Pin
LCD_VSYNC_OUT
C326
22p
LCD_VDD_2.8V
150mA
MMP_HPCM_CLK
MMP_HPCM_FSYNC
0
NA
+VPWR
BH28PB1WHFV
1
5
STBY SEL
2
6
GND BGND
3
4
VIN
VOUT
LCD_LDO_EN
R329
MMP_A_MCLK
MMP_A_BCLK
MMP_A_LRCLK
MMP_ADO_DACDAT
MMP_ADI_ADCDAT
33
C327
U300
MMP_HPCM_DO
MMP_HPCM_DI
+VPWR
C329
1u
1u
5
3
MMP_USB_D+
MMP_USB_DVREG_5V
0
U301
4
9
C330
1u
LCD_BL_CTRL
P3
UDP
P4
UDN
J4 R335
UVBUS
P6
UID
M7
URSET
C1+
C1-
C332
1u
AAT3169IFO-T1 C328
7
C2+
1u
8
C26
OUTCP
IN
EN_SET
10
GND
15
PGND
+VPWR
3.4K
1%
+VPWR
D1
D2
D3
D4
D5
D6
11
12
13
14
1
2
F
WLED_PWR
WLED_1
WLED_2
WLED_3
WLED_4
WLED_5
C333
1u
MMP_VDD_1.9V
1
C336
0.01u
R345
9
8
MSM_USB_DMMP_USB_D-
C340
8p
U303 R1114D191D-TR-F
3
VDD VOUT
4
NC
6
CE
7
6
VCC HSD2+
_OE
D+
HSD1- GND
HSD2-
D-
G
2
GND1
5
GND2
C338
1u
C337
1u
FSUSB30UMX U304
1
10
SEL HSD1+
USB_SELECT_N
27MHz
C339
8p
R318
VA301
LCD BACKLIGHT CHARGE PUMP
LCD LDO
MMP_LCD_RD_N
MMP_LCD_WE_N
MMP_LCD_ADS
100K
2
MMP_LCD_ADS
MMP_LCD_CS_N
LCD_RESET_N
MMP_LCD_RD_N
MMP_LCD_WE_N
MMP_LCD_VSYNC_OUT
51
51
51
51
TP300
TP301
MMP_XTAL_OUT
MMP_XTAL_IN
3
1
R314
R315
R316
R317
E
MMP_LCD_CS_N
27Mhz XTAL
4
LCD_IF_MODE
LCD connector change : 35pin ZIF -> 40pin BTB
MMP_PWR_EN
MMP_XTAL_IN
C
D
G
MMP_XTAL_OUT
MMP_LCD_VSYNC_IN
LCD_MAKER_ID
WLED_PWR
WLED_1
WLED_2
WLED_3
WLED_4
WLED_5
ENBY0036001
1.0T, Socket
GB042-40S-H10-E3000
MMP_LCD_DATA[0]
MMP_LCD_DATA[1]
MMP_LCD_DATA[2]
MMP_LCD_DATA[3]
MMP_LCD_DATA[4]
MMP_LCD_DATA[5]
MMP_LCD_DATA[6]
MMP_LCD_DATA[7]
MMP_LCD_DATA[8]
MMP_LCD_DATA[9]
MMP_LCD_DATA[10]
MMP_LCD_DATA[11]
MMP_LCD_DATA[12]
MMP_LCD_DATA[13]
MMP_LCD_DATA[14]
MMP_LCD_DATA[15]
N4
AMCLK
M2
ABCLK
K2
AFS
K1
ADO
L3
ADI
FA-238_27MHz_9PF
X300
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
LCD_DATA[4]
LCD_DATA[5]
LCD_DATA[6]
LCD_DATA[7]
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
8
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
10
G13
10
INOUT_B1
INOUT_A1
G1
4
22p
TEST
MMP_CAM_MCLK
MMP_CAM_PCLK
MMP_CAM_HSYNC
MMP_CAM_VSYNC
J2
HPCMDO
J1
HPCMDI
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
C321
0.1u
100K
TP302
100K
R331
MMP_CAM_INT
33
1
MMP_LCD_DATA[4]
MMP_LCD_DATA[5]
MMP_LCD_DATA[6]
MMP_LCD_DATA[7]
MMP_MICROSD_DATA[0]
MMP_MICROSD_DATA[1]
MMP_MICROSD_DATA[2]
MMP_MICROSD_DATA[3]
MMP_MICROSD_CMD
MMP_MICROSD_CLK
FL302 ICVE10184E150R500FR
H3
HPCMCLK
H1
HPCMFS
SCL
SDA
C320
NA
VA300
ICVN0505X150FR
R336
MMP_CAM_PWR_EN
F14
5
F
P2
M3
P7
N1
P1
M5
N6
M6
P5
N5
MMP_CAM_RESET_N
MMP_STROBE_CHARGE
UARTTX
UARTRX
UARTRTS
UARTCTS
6
3.3K
MMP_I2C_SCL
MMP_I2C_SDA
R312
R340
N14
P14
K5
AGND_USBT
L5
AGND_USBC
MMP_STROBE_READY
LCS0N
LCS1N
LRDN
LWRN
LA0
LCK
LHS
LVS
LACT
SPICLK
SPICS
SPIDO
SPIDI
AGND_VDAC
M4
N3
M1
L1
ND0
ND1
ND2
ND3
ND4
ND5
ND6
ND7
ND15
F12
N2
K3
L2
J3
LD0
LD1
LD2
LD3
LD4
LD5
LD6
LD7
LD8
LD9
LD10
LD11
LD12
LD13
LD14
LD15
LD16
LD17
U302
ZR3453
AVSS_PLL
CAM_VDD_IO_2.7V
R321 1K
L14
L10
J12
H12
K14
G12
J13
H13
K11
R322 1K
R320
R319 10K
100K
E
CAM_VDD_IO_2.7V
CAM_VDD_IO_2.7V
EBI2_DATA[0:15]
NCSN
NALE
NCLE
NREN
NWEN
NRBN
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
L13
M13
L12
L11
K13
M14
HD0
HD1
HD2
HD3
HD4
HD5
HD6
HD7
HD8
HD9
HD10
HD11
HD12
HD13
HD14
HD15
F6
F7
F8
F9
G6
G7
G8
G9
H6
H7
H8
H9
J6
J7
J8
J9
D
VIDA
VIDB
VIDC
VIDD
VIDE
VIDF
VIDG
VIDH
VIDI
VIDJ
VIDK
VIDL
VIDM
VIDN
VIDO
VIDP
F11
D12
C10
C12
C13
C14
B14
C11
B13
A14
A13
B12
A12
B11
A11
C9
B10
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
EBI2_DATA[9]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
HA11
HA12
HA13
HA14
XTALOUT
A10
A9
C8
C7
EBI2_ADDR[11]
EBI2_ADDR[12]
EBI2_ADDR[13]
EBI2_ADDR[14]
F1
F2
E5
F3
H2
G1
G3
P12
VMCLK
P10
VPCLK
M12
VHREF
K12
VVS
J14
MMP_INT_N
HCS0N
HCS1N
HRDN
HWRN
HGINTN
XTALIN
B8
A8
B7
B9
A7
H14
0
NA
E13
VENBYPIN
E11
VENBYPOUT
R311
R313
MMP_CS_N
NAND_ALE
EBI2_OE_N
EBI2_WE_N
10K
7
FL301 ICVE10184E150R500FR
SDAT0
SDAT1
SDAT2
SDAT3
SCMD
SCLK
SWP
C
R310
RESETN
D11
TCK
D13
TDO
E12
TDI
E14
TMS
D14
TRSTN
K4
AVDD_USBT
L4
AVDD_USBC
H11
AVDD_VDACI
G11
AVDD_VDACP
D10
D9
G4
H4
K10
M8
D6
G2
D7
VDDQ2
L6
VDDQ1
VDD_PMU
VDD_HOST
VDD_SERIAL
VDD_GENERAL
VDD_NAND
VDD_CIS
VDD_LCD
VDD_MMC
NA
D8
VDDCORE1
F4
VDDCORE2
J11
VDDCORE3
L7
VDDCORE4
AVDD_PLL
E10
R309
MMP_LCD_BYPASS_CS_N
VREG_MSMP_2.7V
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
8
22p
INOUT_B4
C325
INOUT_B3
INOUT_A4
22p
INOUT_B2
INOUT_A3
22p
INOUT_B1
INOUT_A2
C323
INOUT_A1
G1
4
C322
3
C324
2
G2
MMP_LCD_DATA[0]
MMP_LCD_DATA[1]
MMP_LCD_DATA[2]
MMP_LCD_DATA[3]
9
G2
C318
B
LCD_VDD_2.8V
FL300 ICVE10184E150R500FR
1
G2
C309
10u
0
C315
10p
R308
C314
0.1u
C313
0.1u
C316
C317
C312
0.1u
1u
C308
10u
0.1u
C311
10p
C319
C310
0.1u
0.1u
1u
FB300
B
G2
VREG_MSMP_2.7V
MMP_RESET_IN_N
LCD_VDD_2.8V
FB301
MMP_VDD_1.9V
R301
R300
0
0
C301
0.1u
VREG_USB_3.3V CAM_VDD_IO_2.7V
MMP_VDD_1.9V
VREG_MMC_3.0V
MMP_VDD_CORE_1.0V
A
5
CAM_VDD_IO_2.7V
LCD_VDD_2.8V
VREG_MMC_3.0V
3
2
VREG_MSMP_2.7V
1
MSM_USB_D+
2
MMP_USB_D+
3
USB_D+
4
5
USB_D-
H
SWITCH FOR USB2.0
1
2
3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4
4
5
6
7
- 173 -
8
9
10
11
12
LGE Internal Use Only
7. CIRCUIT DIAGRAM
2
1
4
3
6
5
9
8
7
10
12
11
A
A
B
B
MEMORY (2Gbit 70n NAND FLASH + 1Gbit SDRAM)
VREG_USIM_3.0V
J400
N3
N4
N5
N6
N9
N10
N11
N12
N13
P7
P8
R2
R7
R9
T2
T3
T7
T13
U1
U3
U14
V1
V2
V13
V14
W1
W2
W3
W4
W11
W12
W13
W14
Y1
Y2
Y3
Y4
Y11
Y12
Y13
Y14
EBI2_DATA[0:15]
E
EBI2_DATA[0]
EBI2_DATA[1]
EBI2_DATA[2]
EBI2_DATA[3]
EBI2_DATA[4]
EBI2_DATA[5]
EBI2_DATA[6]
EBI2_DATA[7]
EBI2_DATA[8]
EBI2_DATA[9]
EBI2_DATA[10]
EBI2_DATA[11]
EBI2_DATA[12]
EBI2_DATA[13]
EBI2_DATA[14]
EBI2_DATA[15]
A1
A2
A3
A4
A11
A12
A13
A14
B1
B2
B3
B4
B11
B12
B13
B14
C1
C2
C5
C13
C14
VCCD1
VCCD2
VCCD3
VCCD4
VCCD5
VCCD6
U402
TYA000BC00HOGG
SDRAM_ADDR[0]
SDRAM_ADDR[1]
SDRAM_ADDR[2]
SDRAM_ADDR[3]
SDRAM_ADDR[4]
SDRAM_ADDR[5]
SDRAM_ADDR[6]
SDRAM_ADDR[7]
SDRAM_ADDR[8]
SDRAM_ADDR[9]
SDRAM_ADDR[10]
SDRAM_ADDR[11]
SDRAM_ADDR[12]
R400
15K
USIM_P_DATA
C
VREG_USIM_3.0V
D400
C400
33p
C401
33p
C402
1u
USIM_P_DATA
6
1
5
2
4
3
VREG_MSMP_2.7V
USIM_P_CLK
USIM_P_RST_N
PLR0504F
L6
K6
D5
D6
E6
C8
E5
D7
M3
M4
M9
M10
M2
D8
C4
D4
C7
D2
D13
V3
V8
V12
RESOUT_N
EBI2_WE_N
SDRAM_RAS_N
SDRAM_WE_N
SDRAM_CAS_N
SDRAM_CLK
SDRAM_CS_N
R404
0
USIM
R401
100K
NAND_ALE
NAND_CLE
R402
R403
100K
10K
D
NAND_CS_N
EBI2_OE_N
NAND_READY
SDRAM_CLK_EN
SDRAM_ADDR[13]
SDRAM_ADDR[14]
VREG_MSME_1.8V
VREG_MSMP_2.7V
+VPWR
+VPWR
V4
VCCQD1
V9
VCCQD2
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
IO14
IO15
IO16
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
C3
D3
E3
E2
D12
C12
D11
C11
D10
C10
E4
D9
C9
VCCN2
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
NC63
NC64
NC65
NC66
NC67
NC68
NC69
NC70
NC71
NC72
NC73
NC74
NC75
NC76
NC77
NC78
NC79
NC80
NC81
NC82
K12
C6
F7
G2
G13
L13
P2
P13
R8
U2
U6
U10
U13
C410
0.01u
C411
C412
0.01u
0.1u
MMP_MICROSD_DATA[0]
MMC_SELECT_N
U400
SLAS4717EPMTR2G
1
10
VCC
NO2
NO1
COM2
9
2
MSM_MICROSD_CMD
3
MICROSD_CMD
8
COM1
IN2
4
J12
J13
K1
K2
K3
K4
K5
K10
K11
K13
K14
L1
L2
L3
L4
L5
L14
M5
M6
N2
7
IN1
NC2
NC1
GND
5
MMP_MICROSD_CMD
MSM_MICROSD_DATA[1]
MSM_MICROSD_CLK
MICROSD_DATA[1]
MICROSD_CLK
MMP_MICROSD_DATA[1]
MMC_SELECT_N
3
4
5
6
MMP_MICROSD_CLK
MSM_MICROSD_DATA[2]
6
1
2
MICROSD_DATA[2]
7
8
17
E
U401 MAX4701ETE+T
16
NC1
COM1
IN1_IN2
NO2
COM2
NO1
V+
NC4
NC2
COM4
GND
NO4
NO3
IN3_IN4
COM3
NC3
MICROSD_DATA[0]
15
MSM_MICROSD_DATA[0]
14
13
MMP_MICROSD_DATA[3]
12
MICROSD_DATA[3]
11
MSM_MICROSD_DATA[3]
10
9
MMP_MICROSD_DATA[2]
PGND
C413
0.01u
F
MICRO SD SELECT MSM AND MMP
D1
D14
E1
E7
E8
E9
E10
E11
E12
E13
F2
F3
F4
F5
F6
F8
F9
F10
F11
F12
F13
G3
G4
G5
G6
G7
G8
G9
G10
H2
H3
H4
H5
H6
J2
J3
J4
J5
J6
J10
J11
F
_WP
_WEN
_RAS
_WED
_CAS
CLK
_CS1
_CS2
ALE
CLE
_CE
_RE
RY__BY
CKE
BA0
BA1
U8
DQM0
T8
DQM1
V7
DQM2
U9
DQM3
M11
M13
L10
L12
J9
H12
H10
G12
M12
L9
L11
K9
H13
H11
H9
G11
SDRAM_ADDR[0:12]
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
4
C1
C5
5
C2
C6
6
C3
C7
10
GND1 GND4
9
GND2 GND3
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
SDRAM_DQM[0]
SDRAM_DQM[1]
SDRAM_DQM[2]
SDRAM_DQM[3]
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
C403
C404
C405
C406
C407
C408
C409
D
U4
T4
T5
V5
U5
T6
V6
U7
T9
T10
V10
T11
U11
V11
T12
U12
P3
R3
P4
R4
P5
R5
P6
R6
P9
P10
R10
P11
R11
P12
R12
R13
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC30
NC31
NC32
NC33
NC34
NC35
NC36
NC37
NC38
NC39
NC40
NC41
NC42
NC43
NC44
NC45
NC46
NC47
NC48
NC49
NC50
NC51
NC52
NC53
NC54
NC55
NC56
NC57
NC58
NC59
NC60
NC61
NC62
SDRAM_DATA[0]
SDRAM_DATA[1]
SDRAM_DATA[2]
SDRAM_DATA[3]
SDRAM_DATA[4]
SDRAM_DATA[5]
SDRAM_DATA[6]
SDRAM_DATA[7]
SDRAM_DATA[8]
SDRAM_DATA[9]
SDRAM_DATA[10]
SDRAM_DATA[11]
SDRAM_DATA[12]
SDRAM_DATA[13]
SDRAM_DATA[14]
SDRAM_DATA[15]
SDRAM_DATA[16]
SDRAM_DATA[17]
SDRAM_DATA[18]
SDRAM_DATA[19]
SDRAM_DATA[20]
SDRAM_DATA[21]
SDRAM_DATA[22]
SDRAM_DATA[23]
SDRAM_DATA[24]
SDRAM_DATA[25]
SDRAM_DATA[26]
SDRAM_DATA[27]
SDRAM_DATA[28]
SDRAM_DATA[29]
SDRAM_DATA[30]
SDRAM_DATA[31]
NC83
NC84
NC85
NC86
NC87
NC88
NC89
NC90
NC91
NC92
NC93
NC94
NC95
NC96
NC97
NC98
NC99
NC100
NC101
NC102
NC103
NC104
NC105
NC106
NC107
NC108
NC109
NC110
NC111
NC112
NC113
NC114
NC115
NC116
NC117
NC118
NC119
NC120
NC121
NC122
NC123
SDRAM_DATA[0:31]
C
1
2
3
7
8
USIM_P_RST_N
USIM_P_CLK
G
G
H
H
1
LGE Internal Use Only
2
3
4
5
6
7
6
- 174 -
8
9
10
11
12
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
VREG_BT_2.85V
10
VBATT
1
+5V_PWR
2
USB_VBUS
ICHARGE
C511
0.1
1608
C512
1u
C510
11
10
9
12
NUS3116MTR2G
P_DRAIN P_COLLECTOR
EMITTER1
BASE1
EMITTER2
BASE2
COLLECTOR
GATE
SOURCE
DRAIN
9
8
CHG_CNT_N
7
A
USB_CNT_N
6
BATT_FET_N
5
VBATT
VREG_5V
R533
2.2u
C590
GSM_PA_PWR_CTL_REF
4
8
ICHARGEOUT
VREG_WM_2.7V
C514 C513
0.1u 10u
CHARGING
+VPWR
C515
2.2u
VDD_MSM : 0.1uF
VDD_ANA : 0.1uF
VDD_RUIM : 0.1uF
VDD_WLAN : 0.1uF
VDD_MAIN : 0.1uF
3
R504
2012
C508
4.7u
U500
+VPWR
2.2u
1608
C507
0.1u
VREG_WM_2.7V
C506
4.7u
VDD_MSMC : 4.7uF
VDD_MSME : 4.7uF
VDD_PA : 4.7uF
VSW_5V : 4.7uF
7
6
+VPWR
C500
33u
1u
C504
C505
4.7u
0.1u
C502
C503
0.1u
C501
0.1u
0.1u
+VPWR
C509
4.7u
VREG_SYNTH_2.6V
PMIC VPWR BYPASS
A
5
4
3
VGA_VDD_1.8V
2
VREG_TCXO_2.85V
1
0
C516 C517
4.7u 0.1u
RMT_PWR_ON_N
Rev. 1.1
MIDI_3.3V
AMUX_OUT
C518 C519
4.7u 0.1u
64
SBDT
RB521S-30
1u
57
VREG_MSMA_2.6V
56
55
0
TCXO_EN
54
51
R509
53
C530
12n
VREG_MSMP_2.7V
BUFF_TCXO
52
C532
R512
51
R513
1K
C535
0
47
SSBDT_PM
45
SLEEP_CLK
44
43
USIM_P_RST_N
C545
22p
+VPWR
C536
C538
C537
1608
R515
R511
4.7n
18K
1u
6
1u
FM_AUDIO_L
1608
4.7u
4.7u
C541
51K
1u
C542
R516
1K
C546
22p
18K
4.7n
C547
12n
20
VREG_MMC_3.0V
C548
1u
C549
1u
CODEC_I2C_SCL
CODEC_I2C_SDA
C550
NA
24
C524
0.1u
C525
10u
C531
NA
27
32
MIC_PWR
29
30
HP_EAR_R
HP_EAR_L
R2_GPIO3
ROUT2
L2_GPIO2
LOUT2
FB500
23
SPK_OUT+
25
SPK_OUTFB501
OUT3
OUT4
AUXL
AUXR
MODE
PGND
22
21
C543 C544
NA NA
MIC2P
18
33
VREG_MSME_1.8V
C551
NA
C553
C552
1608
1608
2.2u
2.2u
4.7uH
VREG_RF_SMPS
R520
C555
10u
ROUT1
LOUT1
28
HP_R
VBATT
L502
MICBIAS
12
HP_L
D
L501
4.7uH
VMID
15
CSB_GPIO1
16
SCLK
17
SDIN
42
KYPD_LED_EN
PM_ON_SW_N
C554
22u
19
Rev. 1.0
VREG_USIM_3.0V
AGND2
1
LIP
2
LIN
SPK_L
USIM_RST_N
USIM_P_CLK
USIM_CLK
USIM_DATA
ind_2x1_6h1_r
3
MID_MICP
R517
DGND
AGND1
4
RIP
5
RIN
FM_AUDIO_R
48
46
C533
SPK_R
51K
50
49
10K
USIM_P_DATA
R510
1u
WM8983
7
LRC
8
BCLK
9
ADCDAT
10
DACDAT
11
MCLK
MMP_A_LRCLK
MMP_A_BCLK
MMP_ADI_ADCDAT
MMP_ADO_DACDAT
MMP_A_MCLK
R508
C534
1u
V_BACK_UP
PM_INT_N
TCXO_PM
58
VREG_RUIM
RUIM_RST(MPP6)
VDD_RUIM
RUIM_M_RST(MPP5)
RUIM_CLK(MPP10)
VREG_MMC
XTAL_IN
41
40
39
VREG_MSME
VSW_MSME
38
37
VDD_MSME
35
36
RUIM_M_CLK(MPP9)
VREG_MSMC
VSW_MSMC
VSW_PA
VIB_DRV_N
KPDPWR_N
VDD_MSMC
34
33
32
31
30
29
R518
28
22
+VPWR
KPD_DRV_N
GP1_DRV_N(MPP7)
27
21
RUIM_M_IO(MPP11)
SLEEP_CLK
VDD_PA
XTAL_OUT
USB_SE0
USB_D_M
VREG_PA
USB_D_P
RUIM_IO(MPP12)
20
TP500
59
C523
100K
VBACKUP
USB_DAT
19
U502
13
DCVDD
14
DBVDD
26
AVDD2
31
AVDD1
PS_HOLD
121K
(1%)
R519
USB_VBUS
18
R506
C539
1u
16
17
SBCK
0.1u
62
X500
VDD_MSM
VREG_MSMP
PMIC
USB_CTL_N
C522
63
61
60
1
2
32.768KHz
65
VDD_WLAN
VREG_WLAN
66
68
67
VREG_RFRX2
VREG_RFRX1
CBL1PWR_N(MPP4)
69
70
VDD_RF
AMUX_IN1(MPP1)
73
74
75
71
76
72
AMUX_IN2(MPP2)
SPKR_BYP
VDD_SPKR
SPKR_IN_P
VREG_RFTX
SPKR_OUT_P
77
79
78
SPKR_IN_M
SPKR_OUT_M
81
82
80
REF_OUT(MPP8)
CBL0PWR_N(MPP3)
VDD_ANA
TCXO_OUT
SBST
VSW_5V
LCD_DRV_N
R514
VREG_5V
TCXO_EN
USB_OE_N
15
26
47K
4.7u
C540
83
USB_ID
14
USB_DAT
MSM_USB_D+
USB_SE0
MSM_USB_D-
84
VREG_USB
13
VREG_MSMA
U501
PM6650-2M
PON_RESET_N
12
USB_VBUS
VDD_MAIN
85
9
25
C
PS_HOLD
FLSH_DRV_N
10
USB_OE_N
AMUX_OUT
GND_SLUG
8
USB_CNT_N
TCXO_IN
BAT_FET_N
11
smd_2520h1_6_r
MSM_INT_N
VBAT
7
C528
4.7u
JTAG_PS_HOLD
D500
REF_BYP
REF_GND
VCOIN
24
C527
1u
470K
REF_ISET
ISNS_M
6
C520 C521
4.7u 0.1u
R505
CHG_CTL_N
5
23
0.1u
10K
1u
4.7uH
L500
R507
C526
D501
RB521S-30
+VPWR
C529
VCHG
ISNS_P
4
BATT_FET_N
FLSH_DRV_N
RESET_IN_N
VREG_SYNT
ADC_BYP
2
3
ICHARGE
CHG_CNT_N
ICHARGEOUT
VBATT
VREG_TCXO
1
VREG_5V
VREG_MSME_1.8V
VREG_USB_3.3V
+5V_PWR
B
0
C557
1000p
C556
0.1u
C559
C558
VREG_MSMC_1.2V
1608
0.1u
L503
4.7u
4.7uH
AUDIO DAC/ADC, AMP etc. (WM8983)
E
MIDI_3.3V
MMP_VDD_USB_3.3V
NA
MICBIAS
2
4
13
14
INL_
FB502
600
FB503
600
R524
12
C1N
SVDD2
10u
MIDI_EAR_R
68
9
100K
C563
P
4
G2
3
G1
2
O
1
MIC500
R525
10
PQ
4
SPM0204HE5-PB-3
MIDI_EAR_L
68
11
MIC
C567
22n
C568
22n
MIC1N
C569
NA
MIC1P
C575
33p
F
C576
10p
C578
0.22u
15K
R529
PQ
FM_ANT
EAR_MIC_P
HP_EAR_R
MIC_PWR
TV_OUT
MIDI_EAR_L
MIDI_EAR_R
RMT_PWR_ON_N
7
8
USB_VBUS
EVLC14S02050
EVLC14S02050
VA505
VA506
47p
C587
C586
47p
EVLC14S02050
D502
1u
C585
VA504
SD12T1G
ULCE0505C015FR
EVLC14S02050
EVLC14S02050
VA501
VA502
VA503
33p
VA507
VA508
C589
PRSB6.8C
PRSB6.8C
C588
10p
ULCE0505C015FR
UART_TXD
UART_RXD
9
CNTRL
OUT
GND
VCC
IN
C579
10u
HEADPHONE AMP
4
+VPWR
3
2
C581
0.01u
1
EAR_MIC_P
DRAIN_THERMAL
NUS3065MUTAG
OVP
U506 NC7SB3157L6X
1
6
B1
S
2
5
GND VCC
3
4
A
B0
CAM_MIC+
U505
+5V_PWR
FSUSB30UMX U507
10
1
SEL HSD1+
EAR_SENSE_N
9
8
7
RMT_ADC
6
USB_D-
VCC HSD2+
_OE
D+
HSD1- GND
HSD2-
D-
RMT_INT
2
C580
47p
2.2K
GATE
DRAIN
R530
6
SRC
10p
EAR_SENSE_N
VBATT
5
C583
RMT_INT-USB_D+
RMT_ADC-USB_D-
20
22
H
INL+
OUTR
C577
1u
FB504
VA500
G
OUTL
SVSS
PGND
R528
CN500
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
SVDD1
U504
MAX9722BETE
C1P
INR_
C570
1u
R1180D331B
3
PVDD
15
17
1
P_G
WM_EN
5
5
C572
1u
NC
6
INR+
C571
1u
VREG_MSMP_2.7V
L504
2.2uH
VOUT
GND2
SGND
F
CE_OR_NC
GND1
C564
47p
8
3
VDD
7
2
_SHDN
U503
1
C566
1u
PVSS
C565
4.7u
16
MIDI_3.3V
6
--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
R521
Draw the Artwork_line thickly !!!!!
15K
R522
HP_EAR_L
Power Line --> Route carefully!!!!!
VREG_5V
E
HP_AMP_EN
PRSB6.8C
1608
C573
4.7u
PRSB6.8C
C574
C560
0.1u
C562
0.22u
C561
VREG_MSMP_2.7V
G
EAR_SENSE_N
MID_MICP
C584
0.1u
USB_D+
3
RMT_INT-USB_D+
4
5
RMT_ADC-USB_D-
CAM/HP MIC SEL
H
USB/REMOCON_SEL
MMI 18Pin CONNECTOR
1
2
3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4
7
- 175 -
8
9
10
11
12
LGE Internal Use Only
7. CIRCUIT DIAGRAM
1
4
3
2
VGA CAM LDO
5
6
8
7
9
10
11
12
5M CAMERA INTERFACE
VGA_VDD_2.7V
A
CAM_VDD_AF_2.7V
U600 BH28PB1WHFV
1
5
STBY SEL
2
6
GND BGND
3
4
VIN
VOUT
VGA_CAM_PWR_EN
+VPWR
CAM_VDD_SA_2.7V
CAM_VDD_SD_1.8V
CAM_VDD_IO_2.7V
CAM_VDD_CORE_1.2V
C601
0.1u
C602
1u
C600
10u
9
INOUT_B3 INOUT_A3
INOUT_B2 INOUT_A2
INOUT_B1 INOUT_A1
ICVE10184E070R100FR
3
2
1
R601 10
MMP_I2C_SCL
R602 10
MMP_I2C_SDA
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_RESET_N
STROBE_TRIGGER
5M_CAM_DATA[6]
5M_CAM_DATA[4]
5M_CAM_DATA[2]
5M_CAM_DATA[0]
FL600
CAM_VDD_SA_2.7V
150mA
150mA
+VPWR
+VPWR
R603
R604
10
10
R607
VOUT
NC
2
3
4
C617
1u
C616
1u
VDD
GND2
VOUT
NC
6
MMP_CAM_PWR_EN
5
MMP_CAM_DATA[3]
MMP_CAM_DATA[2]
MMP_CAM_DATA[1]
MMP_CAM_DATA[0]
4
6
7
8
9
C618
1u
33
5
R1114D271D
CE_OR_NC
GND1
10
1
MMP_CAM_PWR_EN
G1
6
5
INOUT_B4 INOUT_A4
INOUT_B3 INOUT_A3
INOUT_B2 INOUT_A2
INOUT_B1 INOUT_A1
5M_CAM_DATA[3]
5M_CAM_DATA[2]
5M_CAM_DATA[1]
5M_CAM_DATA[0]
4
3
2
1
ICVE10184E070R100FR FL601
C
C608
0.1u
C606
0.1u
C607
0.1u
MMP_CAM_INT
5M_CAM_DATA[7]
5M_CAM_DATA[5]
5M_CAM_DATA[3]
5M_CAM_DATA[1]
R608
10
VA602
GND2
G2
CE_OR_NC
GND1
C610 C611 C612 C613
10p 10p 10p 10p
EVLC18S02015
3
C615
1u
U602
R1114D271D
VDD
ICVL0518100Y500FR
2
VA600
5M_CAM_MCLK
U601
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
C609
CN600
5M_CAM_DATA[7]
5M_CAM_DATA[6]
5M_CAM_DATA[5]
5M_CAM_DATA[4]
4
MMP_CAM_PCLK
VA601
8
GB042-30S-H10-E3000
INOUT_B4 INOUT_A4
ICVL0518100Y500FR
CAM_VDD_IO_2.7V
7
5
10
5MP CAM LDO
B
6
G1
G2
MMP_CAM_DATA[7]
MMP_CAM_DATA[6]
MMP_CAM_DATA[5]
MMP_CAM_DATA[4]
C605
0.1u
1u
C603
1u
C604
1u
C614
0.1u
C
VREG_MMC_3.0V
SWITCH FOR 5M VT CALL
MODE SWITCH
C619
D
Strobe(Xenon Lamp) Flash Interface
D
VREG_MMC_3.0V
2200p
U606
TPA6205A1DRBR
6
VDD
VO+
5M_CAM_MCLK
100K
2200p
P1 P2 P3
P4
+VPWR
VREG_MMC_3.0V
VREG_MSMP_2.7V
VREG_BT_2.85V
G
RTS
DSR
BT_CLK
UTXD
NC3
URXD
NC2
PWR
VBAT
VBAT
ON_SW ON_SW
NC1
VCHAR
TX
TX
RX
RX
GND
GND
NC4
2.5G
BT_SBCK
BT_SBDT
BT_DATA
V_BACK_UP
HOOK_SENSE_N
CAM_VDD_AF_2.7V
CAM_VDD_SD_1.8V
3G
SPK_OUTSPK_OUT+
PCB ARRAY TP
12
4
11
5
10
6
9
7
8
STROBE_TRIGGER
C622
0.1u
MMP_STROBE_CHARGE
FLSH_DRV_N
E
F
VBATT
R621
470K
EAR_MIC_P
BT_SBST
BT_TX_RX_N
TCXO_BT
CTS
13
SSP-132MHT
MODE1 MODE2 MODE3
CN603
G1
12
11
10
9
8
7
6
5
4
3
2
1
14
3
ESSY0004701
F
MSM_USB_D+
MSM_USB_DUSB_VBUS
VBATT
PM_ON_SW_N
+5V_PWR
UART_TXD
UART_RXD
CN601
2
SW600
LINEAR MOTOR DRIVER ( AUDIO AMP )
CN602
+VPWR
MMP_CAM_MCLK
1
MMP_STROBE_READY
C621
0.1u
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
VBAT_SENSE
C626
R623
0.1u
680K
PSD05-LF
C624
CAM_MODE2_N
CAM_MODE1_N
AXK714247G
CAM_SELECT_N
+VPWR
CAM_MCLK
U607 NC7SB3157L6X
1
6
B1
S
5
2
GND VCC
4
3
A
B0
INSTPAR
IN-
VGA_CAM_MCLK
CAM_MODE3_N
MOTOR+
G2 G1
C623
0.1u
5
7
GND
9
PGND
R619
E
MOTOR-
VA605
IN+
8
EVLC14S02050
4
VO-
VA603
3
BYPASS
VA604
R615 100K
U604 NC7SB3157L6X
1
6
B1
S
2
5
GND VCC
3
4
A
B0
5M_CAM_MCLK
_SHUTDOWN
EVLC14S02050
2
VREG_MSMP_2.7V
C625
10u
D600
1
G4 G3
R611 100K
51K
4
51K
OUT_Y
51K
TC7SZ86FU
5
VCC
R612
IN_B
IN_A
GND
U605
EVLC14S02050
1
2
3
LIN_INVERTER
LIN_PWM_FREQ
U603
TC7SZ86FU
5
VCC
IN_B
IN_A
4
OUT_Y
GND
+VPWR VREG_5V
VREG_MSMP_2.7V
R614
1
2
3
LIN_PWM_MAG
VREG_MSMP_2.7V
100K
R613
R610
1u
C620
LIN_MOTOR_EN
R622
80.6K
OUT608
OUT611
VBAT_TEMP
MICROSD_CLK
MICROSD_DETECT
MICROSD_CMD
MICROSD_DATA[0]
MICROSD_DATA[1]
MICROSD_DATA[2]
MICROSD_DATA[3]
C627
OUT614
0.1u
G
CAM_MIC+
WHEEL_SW_R
WHEEL_SW_L
(BATTERY PAD 1.5 X 3.4)
MMP_CAM_PWR_EN
G2
JTAG CONNECTOR
OJ600
H
OJ601 OJ602
AXK740327G
OJ603 OJ604
UART_TXD
UART_RXD
PM_ON_SW_N
VBATT
H
TP600
TP601
TP602
TP603
TP604
R626
0
1608
MAIN - SUB B to B Conn.
FOR NEST JIG
1
LGE Internal Use Only
2
3
4
5
7
6
- 176 -
8
9
10
11
12
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
1
3
2
5
4
7
6
9
8
10
12
11
LCD_VDD_2.8V
0
R700
A
VREG_MSMP_2.7V
+VPWR
EVLC14S02050
EVLC14S02050
VA711
VA703
VA702
VA701
LD703
SSC-FR104-II1
R714
KYPD_LED_EN
Rev. 1.1
ON_SW KEY
200
LD701
SSC-FR104-II1
R712
200
LD700
SSC-TWH104-HL
47
R711
LD704
47
SSC-TWH104-HL
47
R713
R715
47
EVLC14S02050
EVLC14S02050
EVLC14S02050
VA700
KEY_COL[1]
R716
KEY_COL[0]
LD702
END
LEGG-S14G
51K
LD705
PM_ON_SW_N
701
CLR
LEGG-S14G
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
EVL14K02200
51K
51K
470
470
470
470
700
SEND
KEY_ROW[2]
VA708
EVL14K02200
(GREEN) (WHITE)
SIDE KEY
(RED)
PQ
KEY
KEY PCB BACKLIGHT LEDs
VA712
EVLC14S02050
VA710
EVLC14S02050
VA704
X+
Y+
XY-
VA709
R706
R705
B
C
R707
R708
R709
R710
EVLC14S02050
TOUCH_I2C_SCL
EVLC14S02050
TOUCH_I2C_SDA
EVLC14S02050
2.7K
C1
C2
C3
D1
D2
D3
END
VA707
SDA
A1
XSCL
GND
Y-
EVLC14S02050
AUX
VDD_REF
X+
PENIRQA0
Y+
CN700
1
2
3
4
5
VA706
A1
A2
A3
B1
B2
B3
TOUCH_PENIRQ_N
TSC2007IYZGR
VA705
U700
R704
2.7K
0.1u
R703
1u
R702
C701
NA
C700
R701
VREG_MSMP_2.7V
C
TOUCH SCREEN DRIVER IC
Touch Driver IC change : TSC2003 -> TSC2007
VGA_VDD_2.7V
D
D
VGA_VDD_1.8V
CN701
+VPWR
LX2
EN2
FB2
C714 C715
10p 10p
L701
8
39K
4.7uH
C704
5
E
100p
R728
100p
56K
2.2u
EN1
C702
R726
2
C708
FB1
4.7u
AAT2510IWP-AA-T1
11
LX1
2.2u
4
VIN2
C707
C712 C713 C709
10p 10p
0.1u
1
MMP_PWR_EN
MMP_CAM_PWR_EN
VIN1
4.7u
R729
NA
C711
0.1u
9
CAM_VDD_CORE_1.2V
4.7uH
C705
U701
12
C703
4.7u
x+
Y+
xY-
C710
0.1u
MMP_VDD_CORE_1.0V
L700
MMP_CAM_HSYNC
MMP_CAM_VSYNC
VGA_CAM_DATA[7]
VGA_CAM_DATA[6]
C706
VGA_CAM_RESET_N
I2C_SCL
I2C_SDA
56K
10
10
56K
R719 10
R720 10
R724
R725
resistor
EVLC18S02015
ICVL0518100Y500FR
VA713
VA714
RCV+
RCV-
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
R730
E
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
R731
MMP_CAM_PCLK
VGA_CAM_DATA[0]
VGA_CAM_DATA[1]
VGA_CAM_DATA[2]
VGA_CAM_DATA[3]
VGA_CAM_DATA[4]
VGA_CAM_DATA[5]
MOTOR+
MOTOR-
10
GND1
GND2
PGND1
PGND2
BGND
R718
3
6
7
10
13
10
VA715
R717
EVLC18S02015
VGA_CAM_PWDN
VGA_CAM_MCLK
F
F
ICVE10184E070R100FR
INOUT_B1
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
8
7
6
VGA_CAM_DATA[0]
VGA_CAM_DATA[1]
VGA_CAM_DATA[2]
VGA_CAM_DATA[3]
MMP_CAM_DATA[4]
MMP_CAM_DATA[5]
MMP_CAM_DATA[6]
MMP_CAM_DATA[7]
1
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
5
10
5
9
G1
INOUT_A2
G1
4
INOUT_A1
FL700
10
3
G2
2
9
8
7
6
VGA_CAM_DATA[4]
VGA_CAM_DATA[5]
VGA_CAM_DATA[6]
VGA_CAM_DATA[7]
G2
ICVE10184E070R100FR
1
MMP_CAM_DATA[0]
MMP_CAM_DATA[1]
MMP_CAM_DATA[2]
MMP_CAM_DATA[3]
FL701
G
G
H
H
1
2
3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4
5
5
6
7
- 177 -
8
9
10
11
12
LGE Internal Use Only
7. CIRCUIT DIAGRAM
1
2
4
3
6
5
9
8
7
10
11
12
A
VREG_MMC_3.0V
NA
BT_ANT
BT_GND
0
C800
L800
NA
R800
VREG_MSMP_2.7V
A
B
2
VDD
CLK_SCLK
MICROSD_CLK
10
VSS
DAT0_DO
MICROSD_DATA[0]
MICROSD_DATA[1]
MICROSD_DETECT
C803
1u
DAT1_RSV
C804
1u
14
C810
C809
R811
R810
C807
C808
C806
C805
COMMON
DUMMY1
DUMMY2
VDD_INT
16
SYNC_DET_TX_EN
VDD_MSM
RX_BB_TX_BB
VDD_BAT
XTAL_IN
TP800
TP801
TP802
BT_SBST
BT_SBCK
BT_SBDT
5
BT_TX_RX_N
R807
13
7
C802
0
1000p
BT_DATA
TCXO_BT
C
33p
33p
33p
33p
1u
33p
33p
33p
C
4
SBST
11
SBCK
12
SBDT
VCC_OUT
PGND4
20
PGND3
19
PGND2
18
PGND1
17
DETECT
M800
10K
CMD_DI
CLK_REF
10K
9
3
R808
1000p
CD_DAT3_CS
GND4
15
GND3
8
GND2
6
GND1
1
C801
BT_CLK
DAT2_RSV
ANT
LBRQ-2B43A
S800 SCHA1B0102
MICROSD_DATA[2]
MICROSD_DATA[3]
MICROSD_CMD
LG INNOTEK
R809
100K
100K
BLUETOOTH
R806
R803
R805
100K
100K
100K
R802
R801
100K
R804
B
VREG_MSMP_2.7V
VREG_BT_2.85V
C811
100p
C812
0.1u
C813 C814
100p 2.2u
Micro SD
D
+VPWR
VREG_MMC_3.0V
VREG_BT_2.85V
VREG_MSMP_2.7V
D
VREG_MSMP_2.7V
CN801
G1
E
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
EAR_MIC_P
BT_SBST
BT_TX_RX_N
TCXO_BT
BT_CLK
BT_SBCK
BT_SBDT
BT_DATA
V_BACK_UP
HOOK_SENSE_N
CAM_VDD_AF_2.7V
CAM_VDD_SD_1.8V
F
SPK_OUTSPK_OUT+
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
CN800
1
7
2
6
3
5
4
MICROSD_CLK
MICROSD_DETECT
MICROSD_CMD
MICROSD_DATA[0]
MICROSD_DATA[1]
MICROSD_DATA[2]
MICROSD_DATA[3]
CAM_MIC+
WHEEL_SW_R
WHEEL_SW_L
E
WHEEL_SW_R
WHEEL_SW_L
WHEEL CONNECTOR
MMP_CAM_PWR_EN
F
G2
AXK840225WG
Header
MAIN - SUB B to B Conn.
OUT800
SPK_OUT+
SPEAKER PAD
SPK_OUT-
G
OUT801
SPEAKER +/-
H
5
LGE Internal Use Only
7
6
- 178 -
8
9
10
11
12
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
1
2
3
4
5
7
6
8
11
10
9
12
A
A
5MP CAMERA POWER
B
B
(VDD_SD)
+VPWR
CAM_VDD_SD_1.8V
150mA
CAM_VDD_AF_2.7V
+VPWR
150mA
U901
C
1
MMP_CAM_PWR_EN
1
U900 R1114D181D
3
VDD VOUT
4
NC
6
CE
2
2
GND1
5
GND2
3
C902
1u
C901
1u
C903
1u
VDD
GND1
VOUT
R1114D271D
CE_OR_NC
GND2
NC
6
MMP_CAM_PWR_EN
C
BAT900
5
V_BACK_UP
4
C900
1u
C904
1u
BACK_UP BATTERY
D
D
MIC900
1
2
CAM_MIC+
PLW0501H-LF
INSTPAR
SPOB-413S42-RC3310BC
ZD900
E
E
CAM MIC
F
R904
F
100K
NCS2200SQ2T2G
U902
2
VIN+
3
VIN-
4
R905
GND
OUT
1M
5
R906
10K
HOOK_SENSE_N
1
VCC
EAR_MIC_P
5.1K
VREG_MSMP_2.7V
R907
C905
0.1u
Headset Hook Switch
G
G
H
H
1
2
3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4
5
7
6
- 179 -
8
9
10
11
12
LGE Internal Use Only
7. CIRCUIT DIAGRAM
1
2
3
4
5
4
6
7
6
8
10
9
11
12
A
A
B
B
CAM_VDD_SA_2.7V CAM_VDD_AF_2.7V
CAM_VDD_IO_2.7V
CAM_VDD_SD_1.8V
CAM_VDD_CORE_1.2V
CAM_VDD_AF_2.7V
CAM_VDD_SA_2.7V
CAM_VDD_IO_2.7V
CAM_VDD_SD_1.8V
AXT628124-Header
32
C
CN1001
CAM_VDD_CORE_1.2V
31
28
1
27
2
26
3
25
4
24
5
23
6
C
MMP_I2C_SCL
MMP_I2C_SDA
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_INT
MMP_CAM_RESET_N
22
7
21
8
20
9
19
10
18
11
MMP_CAM_INT
STROBE_TRIGGER
5M_CAM_DATA[7]
5M_CAM_DATA[5]
D
5M_CAM_DATA[4]
5M_CAM_DATA[7]
5M_CAM_DATA[5]
5M_CAM_DATA[3]
5M_CAM_DATA[1]
5M_CAM_DATA[2]
MMP_CAM_PCLK
5M_CAM_DATA[6]
5M_CAM_DATA[3]
5M_CAM_DATA[1]
5M_CAM_DATA[0]
17
12
16
13
15
14
30
29
MMP_CAM_PCLK
GB042-30P-H1--E3000
CN1000
1
30
29
2
28
3
4
27
5
26
6
25
7
24
23
8
9
22
21
10
20
11
12
19
13
18
17
14
16
15
MMP_I2C_SCL
MMP_I2C_SDA
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_RESET_N
STROBE_TRIGGER
5M_CAM_DATA[6]
5M_CAM_DATA[4]
5M_CAM_DATA[2]
5M_CAM_DATA[0]
D
MMP_CAM_MCLK
MMP_CAM_MCLK
ENBY0041601
CONNECT TO MAIN PCB
E
E
CONNECT TO CAMERA MODULE
CAMERA FPCB CONNECTOR
TP1000
TP1001
TP1002
TP1003
F
F
G
G
H
H
1
2
2
3
4
5
5
6
7
7
8
9
10
12
11
LGMC
LGE Internal Use Only
- 180 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
1
2
4
3
5
6
7
8
9
9
10
A
B
B
C
C
VGA_VDD_2.7V
VGA_VDD_1.8V
VGA_VDD_2.7V
VGA_VDD_1.8V
GB042-30P-H10-E3000
AXK720147G
CN1201
CN1200
1
2
3
4
5
6
7
8
9
10
VGA_CAM_PWDN
VGA_CAM_MCLK
D
CAM_PCLK
VGA_CAM_DATA[0]
VGA_CAM_DATA[1]
VGA_CAM_DATA[2]
VGA_CAM_DATA[3]
VGA_CAM_DATA[4]
VGA_CAM_DATA[5]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VGA_CAM_PWDN
VGA_CAM_MCLK
20
19
18
17
16
15
14
13
12
11
VGA_CAM_RESET_N
I2C_SCL
I2C_SDA
CAM_PCLK
VGA_CAM_DATA[0]
VGA_CAM_DATA[1]
VGA_CAM_DATA[2]
VGA_CAM_DATA[3]
VGA_CAM_DATA[4]
VGA_CAM_DATA[5]
MOTOR+
MOTOR-
CAM_HSYNC
CAM_VSYNC
VGA_CAM_DATA[7]
VGA_CAM_DATA[6]
RCV+
RCV-
RCV-
VGA_CAM_RESET_N
I2C_SCL
I2C_SDA
D
CAM_HSYNC
CAM_VSYNC
VGA_CAM_DATA[7]
VGA_CAM_DATA[6]
x+
Y+
xY-
OUT1200
RCV+
E
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
RECEIVER PAD
OUT1201
E
RECEIVER +/CN1202
G1
G2
MOTOR+
OUT1202
MOTOR-
OUT1203
1
2
3
4
5
Y+
x+
MOTOR +/-
10
9
8
7
6
G3
xY-
G4
F
F
G
G
H
H
1
2
2
3
4
5
6
7
8
9
10
12
11
LGMC
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 181 -
LGE Internal Use Only
7. CIRCUIT DIAGRAM
1
2
3
4
5
6
4
5
7
6
8
9
10
A
B
B
C
C
1100
D
D
SW1100
CN1100
1
2
3
4
5
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
KEY_ROW[0]
LOCK KEY
CAMERA
FOCUS
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
E
E
F
F
G
G
H
H
1
2
2 3
3 4
4 5
5 6
7
6
8
8 9
9
1
10
0
11
12
LGMC
LGE Internal Use Only
- 182 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP
8. BGA IC PIN MAP
1. MSM6280
(Top View)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 183 -
LGE Internal Use Only
8. BGA IC PIN MAP
1. MSM6280
(Top View)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
W
W
Y
Y
AA
AA
AB
AB
AC
AC
AD
AD
AE
AE
AF
AF
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Used
Not used
LGE Internal Use Only
- 184 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP
2. MCP (Top View)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 185 -
LGE Internal Use Only
8. BGA IC PIN MAP
2. MCP (Top View)
1 2 3 4 5 6
7 8 9 10 11 12 13 14
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
W
W
Y
Y
1 2 3 4 5 6
LGE Internal Use Only
Used
Not used
7 8 9 10 11 12 13 14
- 186 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP
3. PM6650-2 (PMIC)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 187 -
LGE Internal Use Only
8. BGA IC PIN MAP
4. WM8983 (Audio codec)
LGE Internal Use Only
- 188 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP
5. FM RADIO
1
2
3
4
5
6
A
B
C
D
E
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 189 -
LGE Internal Use Only
8. BGA IC PIN MAP
6. ZORAN(ZR3453)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
LGE Internal Use Only
- 190 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
<Audio Codec>
- Headset, speaker operation
<LDO IC>
- 1.0V, 1.2V power supply
<PM IC>- Power management
<Baseband and RF IC>
- Check the battery voltage and
Outputs of LDOs-Rx operation
<Charging IC>
- Check the TA and bettery
<Memory IC>- Check S/W
download
<Xtal>
- Check the frequency (27MHz)
<Xtal>- Check the frequency
(19.2MHz)
<Multi media IC>
- Camcorder, Camera operation
<GSM900 TX SAW filter>
- GSM900 TX operation
<RF IC>
- GSM, WCDMA TX/RX operation
<UMTS Duplexer>
- WCDMA RX,TX separation
<UMTS RX SAW filter>
- WCDMA RX operation
<GSM PAM>- GSM TX
amplifier operation
<RF SW>
<FEM>- RX, TX
switching selection
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 191 -
LGE Internal Use Only
9. PCB LAYOUT
<FM radio IC>
- FM radio operation
<Headphone AMP>
- Headset operation
<Charge Pump>
- LCD backlight charge pump
<OVP IC>
- Over voltage protection
LGE Internal Use Only
- 192 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 193 -
LGE Internal Use Only
9. PCB LAYOUT
LGE Internal Use Only
- 194 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 195 -
LGE Internal Use Only
9. PCB LAYOUT
LGE Internal Use Only
- 196 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 197 -
LGE Internal Use Only
LGE Internal Use Only
- 198 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration
10. Calibration
10.1 Usage of Hot-Kimchi
10.1.1 Calibration
Calibration only
Model Name
• Procedure
1. Click SETTING in menu, and logic operation in sub-menu.
Choose “1” in LOGIC MODE (means calibration alone)
2.Select the model name which you want in list box
3.Click Start button to calibrate a phone
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 199 -
LGE Internal Use Only
10. Calibration
10.1.2 Basic Setting
• Contents
√ Click SETTING in menu, and logic operation in sub-menu.
√ You can select how to control AT comm, Testset, and Power supply in DLL Operating Mode.
√ You can set UART Port and logic mode. (mode 1 : Calibration alone)
√ You can set Result File’s name type. If you choose “TIME”, the saved files’ name is saved in a run time.
√ You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.)
√ You can set the path of HOTKIMCHI program.
LGE Internal Use Only
- 200 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration
10.1.3 Log of Calibration and Test
• Contents
√ On Running, Log window is created in center area. It displays logs of command, and measurements
of Calibration or Autotest.
√ The result files are saved in the directory “~janghee\debug\Cal”, “~janghee\debug\Auto”, or
“~janghee\debug\CalAuto”.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 201 -
LGE Internal Use Only
LGE Internal Use Only
- 202 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
17
2
1
4
87
90 4
7
6
8
9
14 15 20
18
19
21
29 30 31
23 24 25
16
32
33 36
38
37
39
40
41
42
28
10
3
44
45
11
86
48
46
50 51
52
12
56
53 54
13
34
27
35
88
61 62
58
57
26
22
63 64
75
76 77 78 79 80
81
84
49
89
68 69 70
55 59 60 65 66 67
82
85
83
47
71
72
73
74
43
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 203 -
LGE Internal Use Only
ASS'Y EXPLODED VIEW
B
D
A
C
LGE Internal Use Only
- 204 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.2 Replacement Parts
<Mechanic component>
Level
Location
No.
1
Description
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Part Number
Spec
Color
IMT,BAR/FLIP
TIMT0000711
Black
Without Color
2
AAAY00
ADDITION
AAAY0260102
3
WSAY00
SOFTWARE,APPLICATION
WSAY0113601
; , , ,WORLD WIDE , ,
3
MCCL00
CAP,BOX
MCCL0001103
BOX, TW, , , , ,
Without Color
3
MCJZ00
COVER
MCJZ0049101
BOX, TW, , , , ,
Without Color
3
MLAC00
LABEL,BARCODE
MLAC0004501
Export(105*40)
Without Color
3
MLAJ00
LABEL,MASTER BOX
MLAJ0004401
LABEL,MASTER BOX(for C1300i NEW_CGR)
Without Color
3
MLAP00
LABEL,UNIT
MLAP0001115
Reliance Seal Label
Without Color
3
MPAA00
PACKING,BLISTER(LOWE
R)
MPAA0002003
PRESS, PB, , , , ,
Without Color
3
MPAB00
PACKING,BLISTER(UPPER
)
MPAB0001603
PRESS, PB, , , , ,
Without Color
3
MPCY00
PALLET
MPCY0011201
PALLET(for G5400 O2U 1200x1000_Wooden)
2
APEY00
PHONE
APEY0415111
Black
3
ACGK00
COVER ASSY,FRONT
ACGK0093401
Without Color
4
ACGZ00
COVER ASSY
ACGZ0013901
UPPER
5
MCJZ00
COVER
MCJZ0046501
MOLD, PC LUPOY SC-1004A, , , , ,
6
MICA01
INSERT,FRONT
MICA0013901
5
MFBB00
FILTER,RECEIVER
5
MPBM00
5
Remark
Silver
Without Color
Black
5
2.2X4.0
Without Color
9
MFBB0023201
COMPLEX, (empty), , , , ,
Without Color
4
PAD,RECEIVER
MPBM0019201
COMPLEX, (empty), , , , ,
Without Color
7
MTAF
TAPE,MOTOR
MTAF0006001
Without Color
6
5
MTAK00
TAPE,CAMERA
MTAK0002501
Without Color
8
4
ACHA00
COVER SUB ASSY,FRONT
ACHA0001801
5
MBJL00
BUTTON,SIDE
MBJL0042701
MOLD, ABS MP-211, , , , ,
Silver
27
5
MCCC00
CAP,EARPHONE JACK
MCCC0045901
COMPLEX, (empty), , , , ,
Black
`4
5
MCJK00
COVER,FRONT
MCJK0073001
MOLD, PC LUPOY SC-1004A, , , , ,
Black
22
6
MICA00
INSERT,FRONT
MICA0019901
M1.4 D2.2 L1.5
Gold
34
5
MDAG00
DECO,FRONT
MDAG0028401
MOLD, PC LUPOY SC-1004A, , , , ,
Black
17
5
MKBZ00
KNOB
MKBZ0002101
MOLD, PC LUPOY SC-1004A, , , , ,
Black
25
5
MLEA00
LOCKER,BATTERY
MLEA0039301
MOLD, PC LUPOY SC-1004A, , , , ,
Black
18
5
MPBT00
PAD,CAMERA
MPBT0044701
COMPLEX, (empty), , , , ,
Without Color
33
5
MSDC00
SPRING,LOCKER
MSDC0010601
Without Color
19
5
MSIY00
SHAFT
MSIY0001201
CUTTING, STS, , , , ,
Silver
29
5
MTAA00
TAPE,DECO
MTAA0142501
COMPLEX, (empty), , , , ,
Without Color
23
5
MTAA01
TAPE,DECO
MTAA0142601
COMPLEX, (empty), , , , ,
Without Color
21
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
COMPLEX, (empty), , , , ,
Without Color
- 205 -
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
5
MTAA02
TAPE,DECO
MTAA0142701
5
MTAA03
TAPE,DECO
5
MTAA04
5
Description
Color
Remark
COMPLEX, (empty), , , , ,
Without Color
20
MTAA0142801
COMPLEX, (empty), , , , ,
Without Color
16
TAPE,DECO
MTAA0146601
COMPLEX, (empty), , , , ,
Without Color
26
MTAB00
TAPE,PROTECTION
MTAB0185401
COMPLEX, (empty), , , , ,
Without Color
28
5
MTAC00
TAPE,SHIELD
MTAC0057901
COMPLEX, (empty), , , , ,
Without Color
32
5
MTAC01
TAPE,SHIELD
MTAC0058101
COMPLEX, (empty), , , , ,
Without Color
31
5
MTAZ00
TAPE
MTAZ0193901
COMPLEX, (empty), , , , ,
Black
11
5
MTAZ01
TAPE
MTAZ0195701
COMPLEX, (empty), , , , ,
Without Color
12
5
MTAZ02
TAPE
MTAZ0195801
COMPLEX, (empty), , , , ,
Without Color
15
5
MTAZ03
TAPE
MTAZ0195901
COMPLEX, (empty), , , , ,
Without Color
24
4
MKAG00
KEYPAD,MAIN
MKAG0000901
MOLD, PC LUPOY SC-1004A, , , , ,
Black
35
4
MLAZ00
LABEL
MLAZ0038303
PRINTING, (empty), , , , ,
White
4
MPBG00
PAD,LCD
MPBG0065101
COMPLEX, (empty), , , , ,
Black
4
MPBG01
PAD,LCD
MPBG0068901
COMPLEX, (empty), , , , ,
Without Color
4
MPBT00
PAD,CAMERA
MPBT0044901
COMPLEX, (empty), , , , ,
Without Color
4
MPBZ00
PAD
MPBZ0193801
COMPLEX, (empty), , , , ,
Without Color
4
MTAB00
TAPE,PROTECTION
MTAB0182801
COMPLEX, (empty), , , , ,
Without Color
1
4
MTAB01
TAPE,PROTECTION
MTAB0182901
COMPLEX, (empty), , , , ,
Without Color
3
4
MTAC00
TAPE,SHIELD
MTAC0058201
COMPLEX, (empty), , , , ,
Without Color
4
MTAD00
TAPE,WINDOW
MTAD0072001
COMPLEX, (empty), , , , ,
Without Color
4
MWAC00 WINDOW,LCD
MWAC0083101
COMPLEX, (empty), , , , ,
Without Color
4
SACY00
PCB ASSY,FLEXIBLE
SACY0063001
5
SACE00
PCB ASSY,FLEXIBLE,SMT
SACE0057301
6
SACC00
PCB ASSY,FLEXIBLE,SMT
BOTTOM
SACC0036101
7
ENBY00
CONNECTOR,BOARD TO
BOARD
ENBY0018601
6
SACD00
PCB ASSY,FLEXIBLE,SMT
TOP
SACD0047101
7
ENBY00
CONNECTOR,BOARD TO
BOARD
ENBY0019501
20 PIN,.4 mm,ETC , ,H=1.5, Socket
7
ENBY01
CONNECTOR,BOARD TO
BOARD
ENBY0040601
30 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT
,MALE ,SMD ,R/TP , ,
6
SPCY00
PCB,FLEXIBLE
SPCY0106101
POLYI ,0.4 mm,Mutil-5,VGA-CAM ,; , , , , , , , , ,
4
SJMY00
VIBRATOR,MOTOR
SJMY0008502
3 V,1.0 A,10*3.6T ,2.0Vrms 175HZ linear motor 1.5G ,;
,3V , , ,1.5G , , , ,
4
SURY00
RECEIVER
SURY0012801
4
SVCY00
CAMERA
SVCY0014601
CMOS ,MEGA ,5M AF, Sony 1/2.8", HPCB
4
SVCY01
CAMERA
SVCY0014001
CMOS ,VGA ,5.5x11.4x3.2t, Magna 1/7.4"
LGE Internal Use Only
Part Number
Spec
38
10 PIN,.4 mm,STRAIGHT , ,H=0.9, SOCKET
36
37
- 206 -
39
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
4
SVLM00
LCD MODULE
SVLM0025501
3
ACGM00
COVER ASSY,REAR
ACGM0094701
4
ENZY00
CONNECTOR,ETC
ENZY0019901
3 PIN,3 mm,STRAIGHT , ,
70
4
ESQY00
SWITCH,ROTARY
ESQY0001201
6 V,0.005 A,HORIZONTAL ,0.04 G,KU990 Wheel Switch
,; ,2C2P ,6VDC ,0.5MA ,HORIZONTAL ,
81
4
MCJN00
COVER,REAR
MCJN0069201
MOLD, PC LUPOY SC-1004A, , , , ,
Black
75
4
MDAD00
DECO,CAMERA
MDAD0032801
PRESS, Al, 0.3, , , ,
Black
80
4
MFBC00
FILTER,SPEAKER
MFBC0033001
COMPLEX, (empty), , , , ,
Without Color
64
4
MFBD00
FILTER,MIKE
MFBD0025301
COMPLEX, (empty), , , , ,
Without Color
74
4
MFBD01
FILTER,MIKE
MFBD0025401
COMPLEX, (empty), , , , ,
Black
62
4
MLAB00
LABEL,A/S
MLAB0001102
C2000 USASV DIA 4.0
White
4
MPBH00
PAD,MIKE
MPBH0032201
COMPLEX, (empty), , , , ,
Without Color
4
MPBH01
PAD,MIKE
MPBH0032301
COMPLEX, (empty), , , , ,
Without Color
4
MPBH02
PAD,MIKE
MPBH0032401
COMPLEX, (empty), , , , ,
Without Color
72
4
MPBM00
PAD,RECEIVER
MPBM0019401
COMPLEX, (empty), , , , ,
Without Color
59
4
MPBT00
PAD,CAMERA
MPBT0044801
COMPLEX, (empty), , , , ,
Without Color
4
MPBU00
PAD,CONNECTOR
MPBU0007601
COMPLEX, (empty), , , , ,
Without Color
56
4
MPBU01
PAD,CONNECTOR
MPBU0007701
COMPLEX, (empty), , , , ,
Without Color
68
4
MPBZ00
PAD
MPBZ0187301
COMPLEX, (empty), , , , ,
Without Color
76
4
MPFZ01
PLATE
MPFZ0029901
COMPLEX, (empty), , , , ,
Without Color
82
4
MSDD00
SPRING,PLATE
MSDD0006701
PRESS, Bs, 0.15, , , ,
Gold
66
4
MSDD01
SPRING,PLATE
MSDD0006901
PRESS, Bs, , , , ,
Gold
63
4
MTAA00
TAPE,DECO
MTAA0142901
COMPLEX, (empty), , , , ,
Without Color
79
4
MTAC00
TAPE,SHIELD
MTAC0058301
COMPLEX, (empty), , , , ,
Without Color
69
4
MTAD00
TAPE,WINDOW
MTAD0072101
COMPLEX, (empty), , , , ,
Without Color
77
4
MTAJ00
TAPE,FLEXIBLE PCB
MTAJ0001701
COMPLEX, (empty), , , , ,
Without Color
60
4
MTAZ00
TAPE
MTAZ0194001
COMPLEX, (empty), , , , ,
Without Color
47
4
MTAZ01
TAPE
MTAZ0197401
COMPLEX, (empty), 0.1, , , ,
Without Color
65
4
MWAE00 WINDOW,CAMERA
MWAE0028001
CUTTING, Quartz Glass, , , , ,
Without Color
78
4
MWAE01 WINDOW,CAMERA
MWAE0026401
MOLD, Polyarylamide IXEF 1032, , , , ,
Without Color
67
3
MLAK00
LABEL,MODEL
MLAK0006901
5
MLAZ00
LABEL
MLAZ0038301
PID Label 4 Array
Without Color
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
Color
MAIN ,240*400 ,45.08*75*2.2 ,262k ,TFT ,TM ,DAC
IC(Sharp) ,
Remark
10
Without Color
- 207 -
57,71
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.2 Replacement Parts
<Main component>
Level
Location
No.
4
SNGF00
4
Description
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Part Number
Spec
ANTENNA,GSM,FIXED
SNGF0027102
3.0 ,-2.0 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL
,; ,QUAD ,-2.0 ,50 ,3.0
SNGF01
ANTENNA,GSM,FIXED
SNGF0027201
3.0 ,-2.0 dBd, ,BLUETOOTH, INTERNAL ,; ,SINGLE ,-2.0
,50 ,3.0
3
GMEY00
SCREW MACHINE,BIND
GMEY0010601
1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK
3
SACY00
PCB ASSY,FLEXIBLE
SACY0063003
4
SACE00
PCB ASSY,FLEXIBLE,SMT
SACE0057302
5
SACD00
PCB ASSY,FLEXIBLE,SMT
TOP
SACD0047102
6
CN601
CONNECTOR,BOARD TO
BOARD
ENBY0041601
28 PIN,0.4 mm,ETC , ,B to B ,; , ,0.40MM ,[empty] ,MALE
,SMD ,BK , ,
6
ENBY01
CONNECTOR,BOARD TO
BOARD
ENBY0040601
30 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT
,MALE ,SMD ,R/TP , ,
5
SPCY00
PCB,FLEXIBLE
SPCY0103601
POLYI ,0.2 mm,DOUBLE ,5M-F-CAM ,; , , , , , , , , ,
3
SAFY00
PCB ASSY,MAIN
SAFY0203411
4
SAFB00
PCB ASSY,MAIN,INSERT
SAFB0075601
5
ADCA00
DOME ASSY,METAL
ADCA0069301
5
SPKY00
PCB,SIDEKEY
SPKY0049301
4
SAFF00
PCB ASSY,MAIN,SMT
SAFF0124311
5
SAFC00
PCB ASSY,MAIN,SMT
BOTTOM
SAFC0091501
6
C100
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C101
CAP,CERAMIC,CHIP
ECCH0000129
120 pF,50V,J,NP0,TC,1005,R/TP
6
C102
INDUCTOR,CHIP
ELCH0001401
15 nH,J ,1005 ,R/TP ,Pb Free
6
C103
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C104
CAP,CERAMIC,CHIP
ECCH0000196
0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C105
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C106
CAP,CERAMIC,CHIP
ECCH0000107
6 pF,50V,D,NP0,TC,1005,R/TP
6
C107
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C108
CAP,CHIP,MAKER
ECZH0000806
5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C110
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C111
CAP,CERAMIC,CHIP
ECCH0000149
3.3 nF,50V,K,X7R,HD,1005,R/TP
6
C112
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C116
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C117
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C118
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
LGE Internal Use Only
Color
Remark
58,73
Black
84
44
Without Color
43
POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,
- 208 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C119
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C120
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C121
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C122
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C123
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C124
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C125
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C126
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C127
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C128
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C129
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C130
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6
C131
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C132
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C133
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C134
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C135
CAP,TANTAL,CHIP
ECTH0005501
33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,
,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6
C136
CAP,CERAMIC,CHIP
ECCH0000109
8 pF,50V,D,NP0,TC,1005,R/TP
6
C137
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C139
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C140
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C141
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C142
CAP,CERAMIC,CHIP
ECCH0000196
0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C143
CAP,CHIP,MAKER
ECZH0000844
68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C144
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C145
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C146
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C147
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C148
CAP,CHIP,MAKER
ECZH0001105
8200 pF,16V ,K ,X7R ,HD ,1005 ,R/TP
6
C149
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C152
CAP,CERAMIC,CHIP
ECCH0000195
3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C153
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C154
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C155
CAP,CERAMIC,CHIP
ECCH0000101
.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C156
CAP,CERAMIC,CHIP
ECCH0000901
2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C159
CAP,CHIP,MAKER
ECZH0000846
8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 209 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C160
CAP,TANTAL,CHIP
ECTH0004101
22 uF,6.3V ,M ,STD ,1608 ,R/TP
6
C161
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C162
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C163
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C164
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C167
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C168
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C169
CAP,CERAMIC,CHIP
ECCH0000185
5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C170
CAP,CERAMIC,CHIP
ECCH0000178
1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP
6
C173
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C200
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C214
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C218
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C219
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C222
CAP,CERAMIC,CHIP
ECCH0000147
2.2 nF,50V,K,X7R,HD,1005,R/TP
6
C223
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
6
C231
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C232
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C233
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C235
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C236
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C238
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C239
CAP,TANTAL,CHIP,MAKER
ECTZ0004701
4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6
C300
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C301
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C303
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C308
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C309
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C310
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C311
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C321
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C322
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C323
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C324
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C325
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C326
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C339
CAP,CERAMIC,CHIP
ECCH0000109
8 pF,50V,D,NP0,TC,1005,R/TP
Description
LGE Internal Use Only
Part Number
Spec
- 210 -
Color
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C340
CAP,CERAMIC,CHIP
ECCH0000109
8 pF,50V,D,NP0,TC,1005,R/TP
6
C403
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C404
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C405
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C406
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C407
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C408
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C409
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C410
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C411
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C500
CAP,TANTAL,CHIP
ECTH0005501
33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,
,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6
C501
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C502
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C503
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C504
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C505
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C506
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C507
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C508
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C509
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C510
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C511
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C512
CAP,CHIP,MAKER
ECZH0003501
1 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C513
CAP,TANTAL,CHIP
ECTH0004807
10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6
C514
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C515
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6
C518
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C519
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C522
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C523
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C524
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C525
CAP,TANTAL,CHIP
ECTH0004807
10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6
C526
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C527
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C528
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 211 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C529
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C530
CAP,CERAMIC,CHIP
ECCH0000199
12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP
6
C532
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C533
CAP,CERAMIC,CHIP
ECCH0000151
4.7 nF,25V,K,X7R,HD,1005,R/TP
6
C534
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C535
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C536
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C537
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C538
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C539
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C540
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C541
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C542
CAP,CERAMIC,CHIP
ECCH0000151
4.7 nF,25V,K,X7R,HD,1005,R/TP
6
C545
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C546
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C547
CAP,CERAMIC,CHIP
ECCH0000199
12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP
6
C548
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C549
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C552
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C553
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C554
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6
C555
CAP,CERAMIC,CHIP
ECCH0005604
10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6
C556
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C557
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C558
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C559
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C560
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C561
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C586
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C587
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C589
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C590
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6
C600
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C601
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C602
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C613
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C619
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Description
LGE Internal Use Only
Part Number
Spec
- 212 -
Color
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C620
CAP,CERAMIC,CHIP
ECCH0000147
2.2 nF,50V,K,X7R,HD,1005,R/TP
6
C623
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C624
CAP,CERAMIC,CHIP
ECCH0000147
2.2 nF,50V,K,X7R,HD,1005,R/TP
6
C625
CAP,CERAMIC,CHIP
ECCH0005604
10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6
C626
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C627
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C702
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C703
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C704
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C705
CAP,TANTAL,CHIP,MAKER
ECTZ0004701
4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6
C706
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C707
CAP,TANTAL,CHIP,MAKER
ECTZ0004701
4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6
C708
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
CN300
CONNECTOR,BOARD TO
BOARD
ENBY0036001
40 PIN,0.4 mm,ETC , ,H=1.0, Socket
6
CN500
CONNECTOR,I/O
ENRY0006401
18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
6
CN600
CONNECTOR,BOARD TO
BOARD
ENBY0040701
30 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE
,SMD ,R/TP ,1.0 ,
6
CN601
CONNECTOR,BOARD TO
BOARD
ENBY0035201
14 PIN,0.4 mm,ETC , ,H=2.0, Socket
6
CN603
CONNECTOR,BOARD TO
BOARD
ENBY0029501
40 PIN,0.4 mm,ETC , ,H=3.0, Socket
6
CN701
CONNECTOR,BOARD TO
BOARD
ENBY0040701
30 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE
,SMD ,R/TP ,1.0 ,
6
D400
DIODE,TVS
EDTY0008607
SC70-6L ,6 V,200 W,R/TP ,PB-FREE
6
D501
DIODE,SWITCHING
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
6
D502
DIODE,TVS
EDTY0007401
SMD ,12 V,350 W,R/TP ,
6
D600
DIODE,TVS
EDTY0008601
SOD-323 ,6 V,400 W,R/TP ,PB-FREE
6
FB500
FILTER,BEAD,CHIP
SFBH0001501
120 ohm,1608 ,
6
FB501
FILTER,BEAD,CHIP
SFBH0001501
120 ohm,1608 ,
6
FB504
FILTER,BEAD,CHIP
SFBH0008103
1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , ,
,SMD ,R/TP
6
FL100
FILTER,SEPERATOR
SFAY0010002
900,1800 ,1900.2100 , dB, dB, dB, dB,ETC ,GSM
TRIPLE, WCDMA2100 FEM, 5X4X1.3
6
FL101
FILTER,SAW
SFSY0030201
897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx
6
FL102
FILTER,SAW
SFSY0031201
2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,
5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140
,1.4*1.1*0.62 ,SMD ,R/TP
6
FL103
DUPLEXER,IMT
SDMY0001202
1950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45
dB,3.0*2.5*1.1 ,SMD ,SAW DUPLEXER ,; ,2140 ,45
,1950 ,43 ,2.4 ,1.8 ,3.0*2.5*1.1 ,DUAL ,SMD ,R/TP
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 213 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
FL104
FILTER,SAW
SFSY0031101
1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA
2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR
6
FL300
FILTER,EMI/POWER
SFEY0011601
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6
FL301
FILTER,EMI/POWER
SFEY0011601
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6
FL302
FILTER,EMI/POWER
SFEY0011601
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6
FL303
FILTER,EMI/POWER
SFEY0011601
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6
J400
CONN,SOCKET
ENSY0018701
6 PIN,ETC , ,2.54 mm,H=1.8
6
L100
CAP,CERAMIC,CHIP
ECCH0000185
5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
L101
INDUCTOR,CHIP
ELCH0001035
4.7 nH,S ,1005 ,R/TP ,PBFREE
6
L103
INDUCTOR,CHIP
ELCH0001036
5.6 nH,S ,1005 ,R/TP ,PBFREE
6
L104
INDUCTOR,CHIP
ELCH0001031
15 nH,J ,1005 ,R/TP ,PBFREE
6
L105
INDUCTOR,CHIP
ELCH0001036
5.6 nH,S ,1005 ,R/TP ,PBFREE
6
L106
INDUCTOR,CHIP
ELCH0005014
5.6 nH,S ,1005 ,R/TP ,
6
L107
INDUCTOR,CHIP
ELCH0001031
15 nH,J ,1005 ,R/TP ,PBFREE
6
L108
INDUCTOR,CHIP
ELCH0005014
5.6 nH,S ,1005 ,R/TP ,
6
L109
INDUCTOR,CHIP
ELCH0005004
22 nH,J ,1005 ,R/TP ,
6
L110
INDUCTOR,CHIP
ELCH0004711
22 nH,J ,1005 ,R/TP ,
6
L111
INDUCTOR,CHIP
ELCH0005004
22 nH,J ,1005 ,R/TP ,
6
L112
INDUCTOR,CHIP
ELCH0004710
15 nH,J ,1005 ,R/TP ,
6
L113
INDUCTOR,CHIP
ELCH0004704
4.7 nH,S ,1005 ,R/TP ,
6
L114
INDUCTOR,CHIP
ELCH0004707
1.5 nH,S ,1005 ,R/TP ,
6
L115
INDUCTOR,CHIP
ELCH0004703
1 nH,S ,1005 ,R/TP ,
6
L116
INDUCTOR,CHIP
ELCH0004703
1 nH,S ,1005 ,R/TP ,
6
L117
INDUCTOR,CHIP
ELCH0004708
2.7 nH,S ,1005 ,R/TP ,
6
L118
INDUCTOR,CHIP
ELCH0004703
1 nH,S ,1005 ,R/TP ,
6
L119
INDUCTOR,CHIP
ELCH0004703
1 nH,S ,1005 ,R/TP ,
6
L121
INDUCTOR,CHIP
ELCH0004721
2.2 nH,S ,1005 ,R/TP ,
6
L123
INDUCTOR,CHIP
ELCH0004710
15 nH,J ,1005 ,R/TP ,
6
L124
INDUCTOR,CHIP
ELCH0004709
3.3 nH,S ,1005 ,R/TP ,
6
L125
INDUCTOR,CHIP
ELCH0004703
1 nH,S ,1005 ,R/TP ,
6
L126
INDUCTOR,CHIP
ELCH0004705
8.2 nH,J ,1005 ,R/TP ,
6
L128
INDUCTOR,CHIP
ELCH0004704
4.7 nH,S ,1005 ,R/TP ,
6
L200
INDUCTOR,CHIP
ELCH0005009
100 nH,J ,1005 ,R/TP ,
6
L500
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6
L501
INDUCTOR,SMD,POWER
ELCP0008004
4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD
,2.5X2X1MM ,11MM ,R/TP
6
L502
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6
L503
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
Description
LGE Internal Use Only
Part Number
Spec
- 214 -
Color
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
L700
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6
L701
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6
MIC500
MICROPHONE
SUMY0010603
PIN ,42 dB,4.72*3.76*1.25 ,MEMS MIC , , , ,OMNI
,1.5TO5V , ,SMD
6
Q100
TR,BJT,ARRAY
EQBA0000602
TESV ,200 mW,R/TP ,EPITAXIAL PLANAR NPN/PNP
TRANSISTOR
6
R100
RES,CHIP,MAKER
ERHZ0000212
12 Kohm,1/16W ,F ,1005 ,R/TP
6
R101
RES,CHIP,MAKER
ERHZ0000310
680 ohm,1/16W ,F ,1005 ,R/TP
6
R104
RES,CHIP,MAKER
ERHZ0003801
5.1 ohm,1/16W ,J ,1005 ,R/TP
6
R107
RES,CHIP
ERHY0013101
2.7 ohm,1/16W ,J ,1005 ,R/TP
6
R109
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R111
RES,CHIP,MAKER
ERHZ0000504
68 ohm,1/16W ,J ,1005 ,R/TP
6
R112
RES,CHIP,MAKER
ERHZ0000517
91 ohm,1/16W ,J ,1005 ,R/TP
6
R113
RES,CHIP,MAKER
ERHZ0000517
91 ohm,1/16W ,J ,1005 ,R/TP
6
R114
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R115
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R117
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R118
RES,CHIP,MAKER
ERHZ0000411
120 ohm,1/16W ,J ,1005 ,R/TP
6
R119
RES,CHIP,MAKER
ERHZ0000411
120 ohm,1/16W ,J ,1005 ,R/TP
6
R120
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R123
RES,CHIP,MAKER
ERHZ0000504
68 ohm,1/16W ,J ,1005 ,R/TP
6
R124
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R125
RES,CHIP,MAKER
ERHZ0000201
100 ohm,1/16W ,F ,1005 ,R/TP
6
R126
RES,CHIP,MAKER
ERHZ0000201
100 ohm,1/16W ,F ,1005 ,R/TP
6
R200
RES,CHIP,MAKER
ERHZ0000407
1000 Kohm,1/16W ,J ,1005 ,R/TP
6
R201
RES,CHIP,MAKER
ERHZ0000537
680000 ohm,1/16W ,F ,1005 ,R/TP
6
R202
RES,CHIP,MAKER
ERHZ0000222
150 Kohm,1/16W ,F ,1005 ,R/TP
6
R204
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R205
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R206
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R207
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R211
RES,CHIP,MAKER
ERHZ0000437
2 Kohm,1/16W ,J ,1005 ,R/TP
6
R312
RES,CHIP,MAKER
ERHZ0000463
33 ohm,1/16W ,J ,1005 ,R/TP
6
R314
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R315
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R316
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R317
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R319
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 215 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R320
6
Description
Part Number
Spec
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
R321
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R322
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R329
RES,CHIP,MAKER
ERHZ0000463
33 ohm,1/16W ,J ,1005 ,R/TP
6
R340
RES,CHIP,MAKER
ERHZ0000267
3300 ohm,1/16W ,F ,1005 ,R/TP
6
R401
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R402
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R403
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R504
RES,CHIP,MAKER
ERHZ0003901
0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012
,R/TP
6
R506
RES,CHIP,MAKER
ERHZ0004201
121000 ohm,1/16W ,F ,1005 ,R/TP
6
R507
RES,CHIP,MAKER
ERHZ0000203
10 Kohm,1/16W ,F ,1005 ,R/TP
6
R509
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R510
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R511
RES,CHIP,MAKER
ERHZ0000431
18 Kohm,1/16W ,J ,1005 ,R/TP
6
R512
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R514
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
6
R515
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R516
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R517
RES,CHIP,MAKER
ERHZ0000431
18 Kohm,1/16W ,J ,1005 ,R/TP
6
R518
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R519
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R524
RES,CHIP,MAKER
ERHZ0000504
68 ohm,1/16W ,J ,1005 ,R/TP
6
R525
RES,CHIP,MAKER
ERHZ0000504
68 ohm,1/16W ,J ,1005 ,R/TP
6
R603
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R608
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R610
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R611
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R612
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R613
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R614
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R615
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R619
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R621
RES,CHIP,MAKER
ERHZ0000288
470 Kohm,1/16W ,F ,1005 ,R/TP
6
R622
RES,CHIP,MAKER
ERHZ0000318
80.6 Kohm,1/16W ,F ,1005 ,R/TP
6
R623
RES,CHIP,MAKER
ERHZ0000537
680000 ohm,1/16W ,F ,1005 ,R/TP
6
R626
RES,CHIP,MAKER
ERHZ0000701
0 ohm,1/10W ,J ,1608 ,R/TP
LGE Internal Use Only
- 216 -
Color
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R726
RES,CHIP,MAKER
ERHZ0000476
39 Kohm,1/16W ,J ,1005 ,R/TP
6
R728
RES,CHIP
ERHY0000147
56K ohm,1/16W,F,1005,R/TP
6
R730
RES,CHIP
ERHY0000147
56K ohm,1/16W,F,1005,R/TP
6
R731
RES,CHIP
ERHY0000147
56K ohm,1/16W,F,1005,R/TP
6
SW100
CONN,RF SWITCH
ENWY0005301
,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER
,SMD ,R/TP ,AU , ,
6
SW600
SWITCH,SLIDE
ESSY0004701
4 V,300 mA,HORIZONTAL , G,Slide Switch ,; ,1C3P
,[empty] ,[empty] ,[empty] ,1.5N , ,TP
6
U100
IC
EUSY0300502
QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF
Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx
6
U101
PAM
SMPY0013501
35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge
6
U102
IC
EUSY0278501
SON5-P-0.50 ,5 PIN,R/TP ,INVERTER GATE, Pb Free
6
U104
COUPLER,RF
DIRECTIONAL
SCDY0003403
-18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~
1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP
6
U105
PAM
SMPY0013301
dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz,
HSDPA
6
U200
IC
EUSY0295601
CSP ,409 PIN,R/TP ,WCDMA/GSM/GPRS/EDGE/HSDPA
Base Band
6
U302
IC
EUSY0330701
FPBGA ,180 PIN,R/TP ,5M Camera,VGA30,Multi audio
codec
6
U402
IC
EUSY0333402
FBGA ,225 PIN,ETC ,2G(LB/128Mx16/2.7V)
NAND+1G(8Mx4x32) SDRAM ,; ,IC,MCP
6
U500
IC
EUSY0332901
WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET &
DUAL Transistor
6
U501
IC
EUSY0306302
BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree
6
U502
IC
EUSY0342001
QFN ,32 PIN,R/TP ,CODEC,3D, 5band equalizer,Stereo
HP AMP, Stereo SPKAMP ,; ,IC,Audio Codec
6
U603
IC
EUSY0140901
SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
6
U605
IC
EUSY0140901
SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
6
U606
IC
EUSY0335701
QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP
6
U701
IC
EUSY0251501
DFN33-12 ,12 PIN,R/TP
,DUALDCDC_DMBpower,400mA,600mA,1Mhz
6
VA300
VARISTOR
SEVY0004101
5.6 V, ,SMD ,360pF, 1005
6
VA301
DIODE,TVS
EDTY0009401
VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW
,[empty] ,[empty] ,2P ,1
6
VA500
VARISTOR
SEVY0007301
5 V,<0.5pF ,SMD ,
6
VA501
VARISTOR
SEVY0007301
5 V,<0.5pF ,SMD ,
6
VA502
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA503
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA504
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA505
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA506
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA507
DIODE,TVS
EDTY0008606
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 217 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
VA508
DIODE,TVS
EDTY0008606
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6
VA601
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
6
VA603
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA604
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA605
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
X100
VCTCXO
EXSK0007802
19.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM
,2.8V , , , , ,SMD ,P/TP
6
X200
RESONATOR
EXRY0002401
48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing
Tolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap
6
X300
X-TAL
EXXY0023301
27 MHz,50 PPM,9 pF,50 ohm,SMD ,3.2*2.5*0.7 ,30ppm
at -20'C ~ +70'C, Pb Free
6
X500
X-TAL
EXXY0018701
32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9
,
5
SAFD00
PCB ASSY,MAIN,SMT TOP
SAFD0091001
6
C109
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C113
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C114
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C115
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C150
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C151
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C157
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C158
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C166
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C171
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C172
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C210
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C211
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C212
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C213
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C215
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C216
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C217
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C220
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C221
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C224
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C225
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C226
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C227
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C228
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Description
LGE Internal Use Only
Part Number
Spec
- 218 -
Color
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C229
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C230
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C234
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C302
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C304
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C305
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C306
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C307
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C312
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C313
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C314
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C315
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C316
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C317
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C318
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C319
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C327
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C328
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C329
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C330
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C331
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C332
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C333
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C334
CAP,CERAMIC,CHIP
ECCH0000137
330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6
C335
CAP,CERAMIC,CHIP
ECCH0000137
330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6
C336
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C337
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C338
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C400
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C401
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C402
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C412
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C413
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C516
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C517
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C520
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C521
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 219 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C562
CAP,CERAMIC,CHIP
ECCH0002004
0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP
6
C563
CAP,CERAMIC,CHIP
ECCH0005604
10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6
C564
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C565
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C566
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C567
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6
C568
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6
C570
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C571
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C572
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C573
DIODE,TVS
EDTY0008606
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6
C574
DIODE,TVS
EDTY0008606
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6
C575
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C576
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C577
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C578
CAP,CERAMIC,CHIP
ECCH0002004
0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP
6
C579
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C580
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C581
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C583
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C584
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C585
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C588
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C603
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C604
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C605
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C606
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C607
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C608
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C609
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C610
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C611
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C612
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C614
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C615
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C616
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C617
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Description
LGE Internal Use Only
Part Number
Spec
- 220 -
Color
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C618
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C621
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C622
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C700
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C701
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C709
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C710
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C711
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C712
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C713
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C714
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C715
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
D500
DIODE,SWITCHING
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
6
FB300
FILTER,BEAD,CHIP
SFBH0000903
600 ohm,1005 ,
6
FB301
FILTER,BEAD,CHIP
SFBH0000903
600 ohm,1005 ,
6
FB502
FILTER,BEAD,CHIP
SFBH0000903
600 ohm,1005 ,
6
FB503
FILTER,BEAD,CHIP
SFBH0000903
600 ohm,1005 ,
6
FL600
FILTER,EMI/POWER
SFEY0011701
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6
FL601
FILTER,EMI/POWER
SFEY0011701
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6
FL700
FILTER,EMI/POWER
SFEY0011701
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6
FL701
FILTER,EMI/POWER
SFEY0011701
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6
L120
INDUCTOR,CHIP
ELCH0004722
47 nH,J ,1005 ,R/TP ,
6
L127
INDUCTOR,CHIP
ELCH0009114
100 nH,J ,1005 ,R/TP ,coil
6
L300
INDUCTOR,CHIP
ELCH0010401
2.2 uH,M ,1005 ,R/TP ,
6
L504
INDUCTOR,CHIP
ELCH0010401
2.2 uH,M ,1005 ,R/TP ,
6
LD700
DIODE,LED,CHIP
EDLH0011901
WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
6
LD701
DIODE,LED,CHIP
EDLH0007901
RED ,1608 ,R/TP ,Indicator,0.4T Red LED
6
LD702
DIODE,LED,CHIP
EDLH0014501
GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty]
,[empty] ,2P
6
LD703
DIODE,LED,CHIP
EDLH0007901
RED ,1608 ,R/TP ,Indicator,0.4T Red LED
6
LD704
DIODE,LED,CHIP
EDLH0011901
WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
6
LD705
DIODE,LED,CHIP
EDLH0014501
GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty]
,[empty] ,2P
6
R121
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R122
RES,CHIP,MAKER
ERHZ0000204
100 Kohm,1/16W ,F ,1005 ,R/TP
6
R208
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R217
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 221 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R218
6
Description
Part Number
Spec
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R310
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R331
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R336
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R338
RES,CHIP,MAKER
ERHZ0000509
75 ohm,1/16W ,J ,1005 ,R/TP
6
R339
RES,CHIP
ERHY0000170
390 ohm,1/16W ,F ,1005 ,R/TP
6
R345
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R400
RES,CHIP,MAKER
ERHZ0000422
15 Kohm,1/16W ,J ,1005 ,R/TP
6
R505
RES,CHIP,MAKER
ERHZ0000487
470 Kohm,1/16W ,J ,1005 ,R/TP
6
R522
RES,CHIP,MAKER
ERHZ0000422
15 Kohm,1/16W ,J ,1005 ,R/TP
6
R528
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R529
RES,CHIP,MAKER
ERHZ0000422
15 Kohm,1/16W ,J ,1005 ,R/TP
6
R530
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R601
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R602
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R604
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R607
RES,CHIP,MAKER
ERHZ0000463
33 ohm,1/16W ,J ,1005 ,R/TP
6
R701
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R703
RES,CHIP
ERHY0003601
2700 ohm,1/16W ,J ,1005 ,R/TP
6
R704
RES,CHIP
ERHY0003601
2700 ohm,1/16W ,J ,1005 ,R/TP
6
R705
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R706
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R707
RES,CHIP,MAKER
ERHZ0000484
470 ohm,1/16W ,J ,1005 ,R/TP
6
R708
RES,CHIP,MAKER
ERHZ0000484
470 ohm,1/16W ,J ,1005 ,R/TP
6
R709
RES,CHIP,MAKER
ERHZ0000484
470 ohm,1/16W ,J ,1005 ,R/TP
6
R710
RES,CHIP,MAKER
ERHZ0000484
470 ohm,1/16W ,J ,1005 ,R/TP
6
R711
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R712
RES,CHIP,MAKER
ERHZ0000527
200 ohm,1/6W ,J ,1005 ,R/TP
6
R713
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R714
RES,CHIP,MAKER
ERHZ0000527
200 ohm,1/6W ,J ,1005 ,R/TP
6
R715
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R716
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R717
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R718
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R719
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R720
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R724
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use Only
- 222 -
Color
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R725
6
SPFY00
6
Description
Part Number
Spec
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
PCB,MAIN
SPFY0151801
FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , ,
U103
IC
EUSY0335301
WLCSP(Coated) ,25 PIN,R/TP ,FM Tuner(RDS),
3.35*3.3, Pb Free
6
U300
IC
EUSY0290701
HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power Save
LDO
6
U301
IC
EUSY0336502
, PIN,R/TP , ,; ,IC,Charge Pump
6
U303
IC
EUSY0346001
SON1612 ,6 PIN,R/TP ,1.9V 150mA Single LDO ,;
,IC,LDO Voltage Regulator
6
U304
IC
EUSY0338301
uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF
6.5ohm 1.4X1.8
6
U400
IC
EUSY0317101
WQFN ,10 PIN,R/TP ,1.8*1.4*0.75
6
U401
IC
EUSY0271201
TQFN ,16 PIN,R/TP ,Quad Analog switch, Pb Free
6
U503
IC
EUSY0333001
SON1612 ,6 PIN,R/TP ,3.3V, 150mA LDO Pb-Free,
Active High
6
U504
IC
EUSY0303901
QFN,130mW Capless Stereo Headphone Driver ,16
PIN,R/TP ,Capless hp amp
6
U505
IC
EUSY0333701
TLLGA ,8 PIN,R/TP ,OVP
6
U506
IC
EUSY0175301
MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1
MUX/DEMUX, Pb Free
6
U507
IC
EUSY0338301
uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF
6.5ohm 1.4X1.8
6
U600
IC
EUSY0290701
HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power Save
LDO
6
U601
IC
EUSY0338701
SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free
6
U602
IC
EUSY0338701
SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free
6
U604
IC
EUSY0175301
MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1
MUX/DEMUX, Pb Free
6
U607
IC
EUSY0175301
MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1
MUX/DEMUX, Pb Free
6
U700
IC
EUSY0337101
CSP ,12 PIN,R/TP ,Touchscreen Controller IC , ,IC,A/D
Converter
6
VA600
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
6
VA602
VARISTOR
SEVY0003801
18 V, ,SMD ,
6
VA700
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
6
VA701
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA702
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA703
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA704
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA705
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA706
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA707
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA708
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 223 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
VA709
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA710
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA711
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA712
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
6
VA713
VARISTOR
SEVY0003801
18 V, ,SMD ,
6
VA714
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
6
VA715
VARISTOR
SEVY0003801
18 V, ,SMD ,
5
WSYY00
SOFTWARE
WSYY0636510
3
SAJY00
PCB ASSY,SUB
SAJY0024902
4
SAJB00
PCB ASSY,SUB,INSERT
SAJB0012001
5
AFBA00
FRAME ASSY,SHIELD
AFBA0007701
6
MFEA00
FRAME,SHIELD
MFEA0015601
MOLD, ABS MP-211, , , , ,
Without Color
50
6
MPBJ00
PAD,MOTOR
MPBJ0045901
COMPLEX, (empty), , , , ,
Without Color
45
6
MPBU00
PAD,CONNECTOR
MPBU0007801
COMPLEX, (empty), , , , ,
Without Color
48
6
MPBU01
PAD,CONNECTOR
MPBU0007901
COMPLEX, (empty), , , , ,
Without Color
49
6
MPBZ00
PAD
MPBZ0190001
COMPLEX, (empty), , , , ,
Without Color
5
MPBU00
PAD,CONNECTOR
MPBU0008001
COMPLEX, (empty), , , , ,
Without Color
51
5
MPBZ00
PAD
MPBZ0187201
COMPLEX, (empty), , , , ,
Without Color
46
5
SMZY00
MODULE,ETC
SMZY0016801
5
SUSY00
SPEAKER
SUSY0026002
4
SAJE00
PCB ASSY,SUB,SMT
SAJE0019001
5
SAJC00
PCB ASSY,SUB,SMT
BOTTOM
SAJC0017301
6
C901
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C902
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C903
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C904
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C905
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
CN800
CONNECTOR,ETC
ENZY0015301
4 PIN,2.2 mm,ETC , ,H=2.3
6
MIC900
MICROPHONE
SUMY0010507
UNIT ,42 dB,4*1.35 ,SMD
6
R800
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R904
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R905
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R906
RES,CHIP,MAKER
ERHZ0000407
1000 Kohm,1/16W ,J ,1005 ,R/TP
6
R907
RES,CHIP,MAKER
ERHZ0000530
5.1 Kohm,1/16W ,J ,1005 ,R/TP
6
S800
CONN,SOCKET
ENSY0015801
8 PIN,ETC , ,1.1 mm,H=1.9, Detect Pin
6
U900
IC
EUSY0294701
SON1612-6 ,6 PIN,R/TP ,1.8V 150mA LDO Pb-Free
Description
LGE Internal Use Only
Part Number
Spec
Color
Remark
52
Without Color
55
UNIT ,8 ohm,83 dB,16 mm,19.85*18.75*6.1 Module SPK
,; , , , , , , ,[empty]
- 224 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
U901
IC
EUSY0338701
SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free
6
U902
IC
EUSY0250501
SC70 ,5 PIN,R/TP ,Comparator, pin compatible to
EUSY0077701
6
ZD900
DIODE,TVS
EDTY0008610
SOD-523 ,5 V,250 W,R/TP ,PB-FREE
5
SAJD00
PCB ASSY,SUB,SMT TOP
SAJD0019601
6
BAT900
BATTERY,CELL,LITHIUM
SBCL0001701
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,
phi 4.8, Pb-Free
6
C801
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C802
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C803
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C804
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C805
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C806
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C807
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C808
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C809
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C810
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C811
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C812
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C813
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C814
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C900
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
CN801
CONNECTOR,BOARD TO
BOARD
ENBY0029401
40 PIN,0.4 mm,ETC , ,H=3.0
6
M800
MODULE,ETC
SMZY0012601
4.5x3.2x1.2 Bluetooth RF Module
6
R801
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R802
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R803
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R804
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R805
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R806
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R808
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R809
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R810
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
R811
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
5
SPJY00
PCB,SUB
SPJY0042101
FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , ,
Description
Part Number
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Spec
- 225 -
Color
Remark
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.3 Accessory
Level
Location
No.
Description
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Part Number
Spec
Color
SILVER
SNOW
5
MCHZ00
COMPACT DISK
MCHZ0040301
COMPLEX, (empty), , , , ,
3
MCJA00
COVER,BATTERY
MCJA0047601
PRESS, Al, , , , ,
3
MHBY00
HANDSTRAP
MHBY0004310
COMPLEX, (empty), , , , ,
Without Color
3
MPHY00
PROTECTOR
MPHY0011301
COMPLEX, (empty), 0.1, , , ,
Without Color
3
SBPL00
BATTERY PACK,LI-ION
SBPL0091101
3.7 V,1000 mAh,1 CELL,PRISMATIC ,KU990(NYX)
BATT, Europe Label, Pb-Free ,; ,3.7 ,1000 ,0.2C
,PRISMATIC ,46x34x55 , ,BLACK ,Innerpack
,Europe(Reverse insert OK)
3
SGDY00
DATA CABLE
SGDY0010908
; ,[empty] ,[empty] ,[empty] ,18pin 6.2mm. NYX Box
Package ,BLACK , ,N
3
SGEY00
EAR PHONE/EAR MIKE
SET
SGEY0005546
; ,10mW ,16ohm ,111dB ,20HZ ,20HZ ,[empty] ,BLACK
,18P MMI CONNECTOR ,Plug Mold( Abnormal)
,Earphone,Stereo
3
SSAD00
ADAPTOR,AC-DC
SSAD0025003
100-240V ,5060 Hz,5.1 V,.7 A,CE ,England, 18pin plug,
Nyx packing ,; , , , , , ,WALL 2P ,I/O CONNECTOR ,
LGE Internal Use Only
- 226 -
Remark
Black
85
Black
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Note
Note
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