Spansion Selector Guide

Spansion Selector Guide
Spansion ® Product Selector Guide
January 2014
Parallel NOR
Flash
Serial NOR
Flash
SLC NAND
Flash
Spansion ® Products Portfolio
Spansion offers a wide range of NOR Flash memory solutions in multiple voltages,
densities and packages expressly designed and optimized for embedded and
mobile applications, including:
>
>
>
>
Automotive
Consumer electronics
Gaming
Industrial equipment
>
>
>
Machine-to-Machine
Networking
PC and peripherals
>
>
>
Set-top box
Telecom
Wireless
BROAD FLASH PORTFOLIO: 1Mb TO 8Gb; 3V AND 1.8V SOLUTIONS
1 – 2Mb
4Mb
8Mb
16Mb
32Mb
64Mb
128Mb
256Mb
512Mb
1Gb
2Gb
4Gb
8Gb
gl family
Leading price-performance, page-mode
fl family
High performance single and multi I/O serial peripheral interface (SPI)
3.0V
al family
Performance – standard interface
jl/pl family
High performance simultaneous read/write
cd/cl family
Burst mode for automotive
ml family
ONFI 1.0, x8/x16
as family
Standard interface
vs /xs /ns families
Multiplexed burst mode simultaneous read/write
1.8V
ws family
Burst mode simultaneous read/write
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
fs family
ms family
High Performance multi I/O
serial peripheral interface (SPI)
ONFI 1.0, x8/x16
2
Spansion Flash Memory Guide
process node
110nm
110nm
90nm
90nm
65nm
65nm
architecture
Floating
Gate
MirrorBit®
Floating
Gate
MirrorBit
MirrorBit
MirrorBit
Eclipse™
features
WS-P
WS-R
1.8V, burst mode, SRW,
multiplex ADM interface
NS-P
VS-R
1.8V, burst mode, SRW,
AADM interface
32nm
Floating Gate Floating Gate Floating Gate
NAND
NAND
NAND
XS-R
1.8V, standard NOR,
de-multiplex ADP interface
AS-J
2.5V, burst mode,
de-multiplex ADP interface
CD-J
3.0V, burst mode,
de-multiplex ADP interface
CL-J
3.0V, SRW,
de-multiplex ADP interface
JL-J
3.0V, page mode, SRW,
de-multiplex ADP interface
PL-J
3.0V, page mode,
de-multiplex ADP interface
3.0V, Serial Pheripheral
Interface (SPI)
41nm
product nomenclature
1.8V, burst mode, SRW1,
de-multiplex ADP interface
3.0V, standard NOR,
de-multiplex ADP interface
48nm
GL-N
GL-P
GL-S
FL-P
FL-S
AL-J
FL1-K
FL2-K
1.8V Serial Peripheral
Interface (SPI)
FS-S
1.8V, ONFI 1.0, x8/x16
MS-1
MS-1
MS-2
3.0V, ONFI 1.0, x8/x16
ML-1
ML-1
ML-2
Bus Types – ADP: Address Data Parallel, ADM: Address Data Multiplexed, AADM: Address high, Address low, Data Multiplexed, SPI: Serial Peripheral Interface
1) SRW: Simultaneous Read/Write
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
3
Spansion GL Family
Spansion FL Family
32Mb – 2Gb, 3V NOR FLASH MEMORY
4Mb – 1Gb, 3V SERIAL FLASH MEMORY
Spansion GL family is optimized for the voltage, density, cost-per-bit, reliability,
performance and scalability needs of a wide variety of embedded applications.
With densities from 32Mb to 2Gb, each device requires only a single 3.0V power
supply for read and write functions and is entirely command set compatible with
the JEDEC Flash standards. The Spansion GL family supports Spansion’s Universal
Footprint, which provides one footprint across all densities, product families and
process technologies allowing manufacturers to design a single platform and
simply scale Flash memory capacity up or down, depending on the features and
functionality of the target end system.
Spansion FL Serial Flash family offers the highest density SPI flash and supports
lower pin counts, enables lower overall system cost and offers fast read/write
performance. These benefits coupled with a flexible sector architecture makes the
Spansion FL family an ideal solution for a variety of industrial, consumer electronics
and automotive applications, with performance that matches or in some cases,
exceeds conventional parallel I/O NOR flash memory. The Spansion FL-S SPI family
offers increased levels of read/write performance and functionality with an enhanced
feature set, delivering an effective data throughput of up to 80MBytes/sec while
maintaining backward compatibility with legacy solutions, enabling easy migrations.
key applications
key applications
>
Automotive navigation
>
Communications infrastructure
equipment
>
Gaming
>
Industrial control
>
Handsets
>
Set-top box
>
Consumer
packages
universal footprint
>
RoHS-compliant lead-free available
>
56-pin TSOP package
>
56-ball FBGA*
>
64-ball fortified BGA package
>
Wafer and die form
key device features
VOLTAGE
3.0V
DENSITIES
32Mb – 2Gb
INTERFACE
Page mode
BUS
x8 or x16, x16 only*
SECTOR TYPE
Uniform
ACCESS TIME
70** – 130ns
PAGE MODE
ACCESS MODE
15-30ns,
8 word/16 word*
0°C to +70°C
-40°C to +85°C
-40°C to +105°C*
Advanced sector
protection
TEMPERATURE
RANGE
SECURITY
* For GL-S
**For GL064S
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
>
Digital TV
>
DVD players/recorders
>
Set-top box
>
High-end printers
>
DSL modems
>
Optical disk drives
>
Wireless LANs
>
Automotive Infotainment/Clusters
key device features
VOLTAGE
2.7-3.6V Vcc (All)
1.65-3.6V VIO (FL-S)
DENSITIES
4Mb – 1Gb
INTERFACE
x1, x2, x4
SECTOR TYPE
PERFORMANCE
packages
>
Industry standard, SOIC,
USON/WSON and BGA
>
Wafer and die form
TEMPERATURE
RANGE
SECURITY
Uniform 4KB, Uniform
64KB, Uniform 256KB
(128Mb – 1Gb FL-S)
Up to 133MHz (Single
I/O)
Up to 104MHz (Dual/
Quad I/O)
Up to 80MHz (DDR)
-40°C to +85°C
-40°C to +105°C
Advanced sector
protection, OTP region,
Security registers
with OTP lock down,
software/hardware
protection modes,
Unique ID
4
Spansion FS Family
Spansion CD/CL Families
128Mb – 256Mb, 1.8V SERIAL FLASH MEMORY
32Mb – 64Mb, 2.5/3.0V BURST MODE NOR FLASH MEMORY
Spansion FS Serial Flash memory offers a reduced pin count for lower system cost
while providing optimal read/write performance for a variety of networking, mobile,
consumer electronics and industrial applications. With read speeds up to 133 MHz
clock speed in Single/Dual/Quad I/O mode and 80 MHz for double data rate
(DDR) modes, the FS family delivers up to 80 MBytes/sec of read throughput. In
addition, industry leading Programming performance of up to 1.08 MBytes/s speeds
manufacturing throughput and lowers programming costs dramatically.
Spansion’s burst NOR CD and CL families are optimized to withstand harsh
under-the-hood automotive environments while maintaining high reliability and
high performance. In addition to burst frequency support of up to 75 MHz, the
Spansion CD and CL families offer a wide x32 data bus and extended temperature
support. These features and a high-reliability technology node can help enable the
next generation of infotainment and navigation/telematic devices.
key applications
key applications
key device features
>
Network Storage
>
FPGAs
VOLTAGE
1.70 – 2.0V
>
Smart Meters
DENSITIES
128Mb – 256Mb
>
Automotive
>
Printers
>
INTERFACE
Medical
>
Digital Cameras
>
Feature phones
>
Bluetooth
SECTOR TYPE
TEMPERATURE
RANGE
packages
>
Industry standard SOIC,
WSON and BGA
> Wafer
and die form
SECURITY
x1, x2, x4
8x4kB and 1x32kB
at top/bottom with
all remaining sectors
64kB; option of uniform
256KB or uniform 64kB
-40°C to +85°C
-40°C to +105°C*
Advance sector
protection, OTP region,
Security registers
with OTP lock down,
software/hardware
protection modes,
Unique ID
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
>
Automotive under-the-hood
>
Automotive in-cabin
key device features
VOLTAGE
2.5V (CD) and
3.0V (CL)
DENSITIES
16Mb – 32Mb
BUS
x32
packages
>
80-pin PQFP
>
80-ball Fortified BGA
SECTOR TYPE
Top/Bottom boot
>
Wafer and die form
BURST
FREQUENCY
Up to 75 MHz
TEMPERATURE
RANGE
SECURITY
-40°C to +125°C,
-40°C to +145°C
(on die/wafer
products)
OTP region, advanced
sector protection
5
Spansion AL/JL/PL Families
Spansion AS Family
8Mb – 128Mb, 3.0V NOR FLASH MEMORY
8Mb – 16Mb, 1.8V NOR FLASH MEMORY
Spansion offers a broad line of 3V parallel NOR devices on a high-reliability
technology node with an array of features to meet the needs of a wide variety of
embedded applications. The 3.0V Spansion AL family devices are standard mode
Flash with low density offerings and extended temperature support. The 3.0V
Spansion JL family devices offer two and four bank memory configurations to allow
performance gains via simultaneous read-write operations. The 3.0V Spansion PL
family devices not only provide the benefits of a four-bank configuration, but also
support page mode operations which further increases data throughput to improve
system performance.
The 1.8V Spansion AS family is optimized for performance and reliability. In addition
to a fast initial access time of 70ns, the AS family offers low power consumption
and a fast program speed which is ideal for a wide variety of embedded applications.
Based on a proven 110nm Floating Gate process technology, the reliability of the AS
family also makes it suitable for use in automotive-grade applications.
key applications
Handheld navigation
>
Bluetooth
VOLTAGE
1.8V
>
Personal media players
DENSITIES
8Mb – 16Mb
INTERFACE
Standard NOR
key device features
AL
JL
PL
VOLTAGE
3.0V
3.0V
3.0V
DENSITIES
8Mb – 16Mb
32Mb – 64Mb
32Mb – 128Mb
BUS
x8/x16
x8/x16
x16
SECTOR TYPE
Top/Bottom/
Uniform boot
Top/Bottom boot
Dual boot
ACCESS TIME
55 – 90ns
55 – 70ns
55 – 70ns
PAGE MODE
ACCESS TIME
N/A
N/A
25 – 30ns, (8 word)
BANKS
1
2–4
4
TEMPERATURE
RANGE
-40°C to +85°C,
-40°C to +125°C
-40°C to +85°C
-25°C to +85°C,
-40°C to +85°C
SECURITY
OTP region
OTP region
OTP region
PACKAGES
48-ball
64-ball BGA
48-pin TSOP
Wafer and die form
48-pin TSOP
48-ball BGA
Wafer and die form
48-ball
56-ball
64-ball
80-ball BGA
56-pin TSOP
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
key device features
>
packages
>
48-pin TSOP
BUS
x8/x16
>
48-ball BGA (0.8mm pitch and
0.5mm pitch)
SECTOR TYPE
Top/Bottom boot
>
Wafer and die form
ACCESS TIME
70ns
TEMPERATURE
RANGE
-40°C to +85°C
SECURITY
Secured Silicon
Region, 256-byte OTP
sector for permanent,
secure identification
6
Spansion WS/NS/VS/XS Families
Spansion ML/MS Family
64Mb – 512Mb, 1.8V, BURST MODE, SIMULTANEOUS
1 – 8Gb NAND 3V/1.8V NAND FLASH MEMORY
READ/WRITE, NOR FLASH MEMORY
Spansion NAND products complement the parallel and serial NOR offerings from
Spansion for embedded applications. Spansion applies its stringent process for
qualification, testing, extended temperature support and packaging to its line of SLC
NAND products. Spansion’s high performance and high reliability SLC NAND product
portfolio will be available in 1 Gb, 2 Gb, 4 Gb and 8Gb (DDP) densities. These products
will work with systems that support 1-bit ECC and 4-bit ECC. All of Spansion’s NAND
products will be backed by Spansion’s world-class customer support and commitment for
longevity of supply. 4Xnm (1-bit ECC) 1/2/4Gb 3V x8 TSOP/BGA and 32nm (4-bit ECC)
1/4/Gb 3V x8 TSOP/BGA are in production currently. Also, a few 1.8V configurations
are available in X16 and X8 BGA package. 4Xnm 1Gb/2Gb/4Gb are also available with
AEC-Q100 and GT-Grade @ 85°C as well as high temperature of 105°C (1Gb @105°C
requires 2-bit ECC correction instead of 1-bit ECC). Other configurations are coming soon.
Spansion WS/NS/VS/XS Flash memory families offer high density, high
reliability and performance-enhancing features making them the ideal solution for
multimedia rich mobile applications. The product lines feature 1.8V, multi-bank,
fast access with burst mode, and simultaneous read/write operation with product
density scaling from 64Mb to 512Mb. The Spansion WS/NS/VS/XS product
families support burst speeds up to 108MHz as well as page mode interface which
can improve read transfer rates by up to 50%, compared to standard asynchronous
Flash products.
key applications
>
>
Entry level,
mainstream and
high-end handsets
High-performance
mobile applications
key device features
VOLTAGE
DENSITIES
INTERFACE
44-ball
64Mb – 512Mb
WS: (ADP), NS/VS: (ADM), XS: (AADM)
BUS
x16
SECTOR TYPE
Top/Bottom/Dual boot
packages
>
1.8V
>
64-ball
INITIAL
ACCESS TIME
>
84-ball BGA
>
Wafer and die form
PAGE MODE
ACCESS TIME
15ns (WS only)
BURST
FREQUENCY
Up to 108MHz
TEMPERATURE
RANGE
SECURITY
80ns
-25°C to +85°C, -40°C to +85°C
on select products
Secured Silicon Region, 256-word OTP
sector for permanent, secure identification
key applications
key device features
>
Digital TVs
>
Set-top Boxes
VOLTAGE
3V/1.8V
>
Network memory modules
TECHNOLOGY
4x/3x nm SLC FG NAND
>
Industrial meters
>
Industrial sensors
DENSITIES
1 – 8Gb
>
Game Consoles
INTERFACE
ONFI 1.0
>
Printers
BUS
x8/x16
>
Digital Camera
>
Automotive infotainment
CYCLING
100K (typ.)
>
GPS Navigation
>
Toys
PERFORMANCE 1
packages
> Industry
Standard 48-Pin TSOP,
63-Ball BGA
TEMPERATURE
RANGE
PACKAGES
SOFTWARE
SUPPORT
Cache Programming,
Multi-plane commands
support, OTP, and
25uS Random access,
25 ns Seq. access,
200-300uS tprog,
2-3.5ms tbers
-40°C to +85°C,
-40°C to +105°C
48-Pin TSOP
63-Ball BGA
67-Ball BGA
Complimentary Drivers
and Spansion FFS
1
Different parts have varied performance, please refer to
page 12 for exact details on a particular part.
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
7
Spansion’s Universal Footprint
CONSISTENT PACKAGES AND PINOUTS SPEEDS TIME-TO-MARKET AND REDUCES DESIGN
leveraging the spansion
universal footprint
Spansion’s Universal Footprint with consistent packaging and pinouts across product families, process
technologies, and densities allows design engineers to swap devices at any point in the design or product life
cycle without affecting board design.
design simplicity
Designers can manage differentiated end product models based on a single platform design thanks to
Spansion’s Universal Footprint. The platform design concept, used by makers of DVD players, industrial
equipment, and network routers, saves design time and minimizes cost. Coupled with our cost-effective system
software and drivers, you have a complete Flash solution to manage the changing design needs of your products.
>
One footprint across densities, product families,
and process technologies
>
Scaleable, seamless
time-to-market
>
Minimize board rework and re-spin Price
>
Interoperable between high performance and
price-performance products to optimize BOM
PARALLEL NOR
48-pin and 56-pin TSOP
For extreme design flexibility
8Mb – 1Gb
64-BALL FORTIFIED BGA
For highest flexibility
11x13mm, 9x9mm
16Mb – 2Gb
11mm
9mm
supply chain
9mm
11mm
9mm
11mm
9mm
9mm
9mm
9mm
13mm
13mm
13mm
9mm
11mm
48-pin TSOP48-pin
48-pin
56-pin
TSOP
48-pin
TSOP
TSOP
TSOP56-pin
56-pin
TSOP
56-pin
TSOP
TSOP
13mm
56-BALL BGA
For small form factor
for high densities
128Mb – 512Mb
>
Service multiple platforms with one footprint
>
Minimize reliance on one product by qualifying
multiple products in the same footprint
48-BALL
FINE PITCH BGA
For small form factor
for low densities
8Mb – 64Mb
SPI NOR
NAND
8-pin soic
150 mil
4Mb – 32Mb
8-pin soic
208 mil
4Mb – 128Mb
8-pAD wson
6x5 mm
16Mb – 128Mb
8-pAD wson
6x8 mm
32Mb – 256Mb
150 mil soic and 6x5 wson
208 mil soic and 6x8 wson
Single footprint,
widest density range
63-Ball BGA
1Gb – 8Gb
48-pin TSOP
1Gb – 8Gb
16-pin soic
300 mil
32Mb – 1Gb
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
24-BALL BGA
6x4 ball
array
16Mb – 512Mb
24-BALL BGA
5x5 ball
array
16Mb – 512Mb
67-Ball BGA
1Gb
8
(S) Spansion Ordering Part Number Construction
single-die products
Generic OPN
Ordering Options
Speed Option
Asynchronous (no CLK input) “Speed Option” represents random access time (ns). If greater than
100ns, use the two leftmost digits.
Synchronous (CLK input) “Speed Option” represents clock frequency (MHz). First character
represents the data rate, combined with the speed in 100s of MHz:
0 SDR, <100 MHz
A SDR, >=100 MHz
D DDR, <100 MHz
Second character represents the speed between 0 and 99 MHz:
D 15-19
E 20-24
F 25-29
A 0-4
B 5-9
C 10-14
Bus Width (NAND)
00 = x8 NAND, single die
G 30-34
H 35-39
J 40-44
S
Prefix
S = Spansion
Series
2
G
Flash Interface and
Simultaneous Read-write
srw no srw
A
J
Standard
G
P
Page
W
Burst (ADP)
Burst (ADM) N/V
Burst (AADM) X
F
Serial (SPI)
C
Automotive
Burst (Demux)
M
NAND
ADP = Address data parallel
ADM = Address data mux
AADM = Address –
address data mux
U 90-94
W 95-99
X 100-108
R 75-79
S 80-84
T 85-89
Temperature Grade
C = Commercial (0° to +70°C)
S = Extended Commercial (0° to +85°C)
W = Wireless (-25° to +85°C)
I = Industrial (-40° to +85°C)
V = Automotive in-cabin (-40° to +105°C)
N = Extended (-40° to +125°C)
Density
001 - 512 = 1 Mb-512 Mb
204 - 216 = 4 Mb-16 Mb*
116 - 164 = 16 Mb-64 Mb **
Family
9
N 60-64
P 65-69
Q 70-74
04 = x16 NAND, single die
Product Series
25 = Serial Peripheral Interface (SPI) Flash memory
29 = Sector Erase NOR Flash memory
34 = Floating Gate NAND
70 = Dual Die Flash Package
Prefix
K 45-49
L 50-54
M 55-59
G Density
L
0
Core Voltage
L = 3-volt VCC
D = 2.5-volt VCC
S = 1.8-volt VCC
1
Tech
G
S
Process Technology
J = 110nm, Floating Gate Technology
K = 90nm, Floating Gate Technology
N = 110nm, MirrorBit Technology
P = 90nm, MirrorBit Technology
R = 65nm, MirrorBit Technology
S = 65nm, MirrorBit Technology (Eclipse)
1 = NAND Revision 1 (4X nm)
2 = NAND Revision 2 (3X nm)
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
Speed
1
Package
0
D
Package Type (Family)
A = BGA - 0.5mm pitch
B = BGA - 0.8mm pitch
C = CSOP
D = Fortified BGA, 9mm x 9mm
E = Super CSP
F = Fortified BGA, 11mm x 13mm
M = SOIC/SOP
N = SON
P = PLCC
Q = PQFP
S = SSOP
T = TSOP
G = BGA - 0.8mm pitch
Temp
H
I
Packaging Type
0 = Tray
1 = Tube
2 = 7" Tape & Reel
3 = 13" Tape & Reel
Model Number
0
1
Pack
type
3
Additional Ordering Options
Varies for each generic OPN (characters
1-9). Meaning is defined in each datasheet.
Package Material Set
(Varies by Package Type)
A = Leaded
F = Lead (Pb)-Free
H = Low Halogen Lead (Pb)-Free
* For FL2-K
** For FL1-K
9
3.0V Parallel Flash Memory
density
page
mode
2 Gb
part
number
access times (ns)/
clock frequency
packages
temp
vcc(v)
vio(v)
org
sector
•
S70GL02GS
110 (20), 120 (30)
64-Ball FBGA
-40° to +85°C
2.7-3.6
2.7-3.6,
1.65-Vcc
x16
H, L
2 Gb
•
S70GL02GP
110 (25)
64-Ball FBGA
0° to +85°C,
-40° to +85°C
3.0-3.6
3.0-3.6
x8/x16
H, L
1 Gb
•
S29GL01GS
100 (15), 110 (20)
56-Pin TSOP, 64-Ball FBGA,
KGW
-40° to +85°C,
-40° to +105°C
2.7-3.6
2.7-3.6,
1.65-Vcc
x16
H, L
1 Gb
•
S29GL01GP
110 (25), 120 (25),
130 (25)
56-Pin TSOP, 64-Ball FBGA,
KGD, KTW
0° to +85°C,
-40° to +85°C
3.0-3.6,
2.7-3.6
3.0-3.6,
2.7-3.6,
1.65-Vcc
x8/x16
H, L
512 Mb
•
S29GL512S
100 (15), 110 (20)
56-Pin TSOP, 56-Ball FBGA,
64-Ball FBGA, KGW
-40° to +85°C
-40° to +105°C
2.7-3.6
2.7-3.6,
1.65-Vcc
x16
H, L
512 Mb
•
S29GL512P
100 (25), 110 (25),
120 (25)
56-Pin TSOP, 64-Ball FBGA,
KTD, KTW
0° to +85°C,
-40° to +85°C
3.0-3.6,
2.7-3.6
3.0-3.6,
2.7-3.6,
1.65-Vcc
x8/x16
H, L
256 Mb
•
S29GL256S
90 (15), 100 (20)
56-Pin TSOP, 56-Ball FBGA,
64-Ball FBGA, KGW
-40° to +85°C,
-40° to +105°C
2.7-3.6
2.7-3.6,
1.65-Vcc
x16
H, L
256 Mb
•
S29GL256P
90 (25), 100 (25),
110 (25)
56-Pin TSOP, 64-Ball FBGA,
KGD, KGW
0° to +85°C,
-40° to +85°C
3.0-3.6,
2.7-3.6
3.0-3.6,
2.7-3.6,
1.65-Vcc
x8/x16
H, L
128 Mb
•
S29GL128S
90 (15), 100 (20)
56-Pin TSOP, 56-Ball FBGA,
64-Ball FBGA, KGW
-40° to +85°C,
-40° to +105°C
2.7-3.6
2.7-3.6,
1.65-Vcc
x16
H, L
128 Mb
•
S29GL128P
90 (25), 100 (25),
110 (25)
56-Pin TSOP, 64-Ball FBGA,
KGD, KGW
0° to +85°C,
-40° to +85°C
3.0-3.6,
2.7-3.6
x8/x16
H, L
128 Mb
•
S29PL127J
60 (25), 65 (25),
70 (30)
56-Pin TSOP, 80-Ball FBGA
-40° to +85°C,
-25° to +85°C
2.7-3.6
3.0-3.6,
2.7-3.6,
1.65-Vcc
2.7-3.6,
1.65-1.95
x16
D
64 Mb
•
S29GL064S
70 (15), 80 (25)
48-Pin TSOP, 56-Pin TSOP,
48-Ball FBGA, 64-Ball FBGA
0 to +85C,
-40 to +85C
2.7-3.6
2.7-3.6,
1.65-3.6
x16,
x8/x16
T, B, U
64 Mb
•
S29GL064N
90 (25), 110 (30)
48-Pin TSOP, 56-Pin TSOP,
48-Ball FBGA, 64-Ball FBGA,
KGD, KGW
-40° to +85°C
2.7-3.6
2.7-3.6,
1.65-3.6
x16,
x8/x16
T, B, U
64 Mb
•
S29PL064J
55 (20), 60 (25),
65 (25), 70 (30)
48-Ball FBGA, 56-Ball FBGA
-40° to +85°C,
-25° to +85°C
2.7-3.6
2.7-3.6
x16
D
Sectors: 2048x128KB; 32-byte Page Mode Read; WP#
Pin; Secured Silicon Region; Advanced Sector Protection,
VersatileI/O, 512-byte write buffer
Sectors: 2048x128KB; WP#/ACC Pin; Secured Silicon Region;
Advanced Sector Protection, VersatileI/O, 32-word write buffer
Sectors: 1024x128KB; 32-byte Page Mode Read; WP#
Pin; Secured Silicon Region; Advanced Sector Protection,
VersatileI/O, 512-byte write buffer
Sectors: 1024x128KB; WP#/ACC Pin; Secured Silicon Region;
Advanced Sector Protection, VersatileI/O, 32-word write
buffer
Sectors: 512x128KB; 32-byte Page Mode Read; WP# Pin;
Secured Silicon Region; Advanced Sector Protection,
VersatileI/O, 512-byte write buffer
Sectors: 512x128KB; WP#/ACC Pin; Secured Silicon Region;
Advanced Sector Protection, VersatileI/O, 32-word write
buffer
Sectors: 256x128KB; 32-byte Page Mode Read; WP#
Pin; Secured Silicon Region; Advanced Sector Protection,
VersatileI/O, 512-byte write buffer
Sectors: 256x128KB; WP#/ACC pin; Secured Silicon Region;
Advanced Sector Protection, VersatileI/O; 32-word write
buffer
Sectors: 128x128KB; 32-byte Page Mode Read; WP#
Pin; Secured Silicon Region; Advanced Sector Protection,
VersatileI/O, 512-byte write buffer
Sectors: 128x128KB; WP#/ACC pin; Secured Silicon Region;
Advanced Sector Protection, VersatileI/O, 32-word write
buffer
Banks: 16/48/48/16Mb; WP#/ACC pin; Secured Silicon
Region; Advanced Sector Protection
Sectors: 8x8KB, 127x64KB or 128x64KB; WP#/ACC Pin
or separate WP# and ACC pins; Secured Silicon Region;
VersatileI/O; 256-word write buffer
Sectors: 8x8KB, 127x64KB or 128x64KB; WP#/ACC Pin
or separate WP# and ACC pins; Secured Silicon Region;
VersatileI/O; 16-word write buffer
Banks: 8/24/24/8Mb; WP#/ACC pin; Secured Silicon
Region; Advanced Sector Protection
S29JL064J
55, 60, 70
48-Pin TSOP, 48-Ball FBGA, KGW
-40° to +85°C
2.7-3.6
NA
x8/x16
D
Banks: 8/24/24/8Mb; WP#/ACC pin; Secured Silicon Region
S29GL032N
90 (25), 110 (30)
48-Pin TSOP, 56-pin TSOP,
48-Ball FBGA, 64-Ball FBGA,
KGW
-40° to +85°C
2.7-3.6
2.7-3.6,
1.65-3.6
x8/x16
T, B, U
Sectors: 8x8KB, 63x64KB or 64x64KB; WP#/ACC Pin;
Secured Silicon Region; VersatileI/O; 16-word write buffer
•
S29PL032J
55 (20), 60(25),
65 (25), 70 (30)
48-Ball FBGA, 56-Ball FBGA
-40° to +85°C,
-25° to +85°C
2.7-3.6
2.7-3.6
x16
D
•
S29JL032J
60, 70
48-Pin TSOP, 48-Ball FBGA
-40° to +85°C
2.7-3.6
NA
x8/x16
T, B
Banks: 4/12/12/4Mb; WP#/ACC pin; Secured Silicon Region;
Advanced Sector Protection
Banks: 4/12/12/4Mb, 4/28, 8/24, 16/16; WP#/ACC pin;
Secured Silicon Region
3.0-3.6
1.65-3.6
x32
D
Banks: 8/24Mb or 24/8Mb; WP#, ACC pins, Secured Silicon
Region; Advanced Sector Protection, Versatile I/O
3.0-3.6,
2.7-3.6
NA
x8/x16
T, B
Sectors: 1x16KB,2x8KB,1x32KB,31x64KB
3.0-3.6
1.65-3.6
x32
D
Banks: 4/12Mb or 12/4Mb; WP#, ACC pins, Secured Silicon
Region; Advanced Sector Protection, Versatile I/O
3.0-3.6,
2.7-3.6
NA
x8/x16
T, B
Sectors: 1x16KB, 2x8KB, 1x32KB, 15x64KB
64 Mb
32 Mb
•
32 Mb
•
32 Mb
32 Mb
simulop
burst
mode
•
•
•
•
•
16 Mb
16 Mb
8 Mb
•
•
S29CL032J
75, 66, 56, 40MHz
80-Pin PQFP, 80-Ball BGA
-40° to +85°C,
-40° to +125°C,
-40° to +145°C
S29AL016J
55, 70
48-Pin TSOP, 48-Ball FBGA,
64-Ball FBGA, 56-Pin SSOP,
KGD, KGW
-40° to +85°C,
-40° to +125°C
S29CL016J
66, 56, 40MHz
80-Pin PQFP, 80-Ball BGA,
KGD
S29AL008J
55, 70
48-Pin TSOP, 48-Ball FBGA,
56-Pin SSOP, KGD, KGW
-40° to +85°C,
-40° to +125°C,
-40° to +145°C
-40° to +85°C,
-40° to +125°C
features
Sector: T: Top Boot, B: Bottom Boot, D: Dual Boot, U: Uniform Sectors, H: High-Protect, L: Low-Protect
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
10
3.0V SPI Flash Memory
density
page
mode
simulop
burst
mode
part
number
access times (ns)/
clock frequency
133MHz (Single I/O),
104MHz (Multi I/O),
80MHz (DDR)1
133MHz (Single I/O),
104MHz (Multi I/O),
80MHz (DDR)1
133MHz (Single I/O,
Multi I/O), 80MHz
(DDR)
133MHz (Single I/O),
104MHz (Multi I/O),
80MHz (DDR)1
104MHz (Single I/O),
80MHz (Multi I/O)
133MHz (Single I/O,
Multi I/O),
80MHz (DDR)
1 Gb
S70FL01GS
512 Mb
S25FL512S
256 Mb
S25FS256S
256 Mb
S25FL256S
256 Mb
S70FL256P
128 Mb
S25FS128S
128 Mb
S25FL127S
108MHz (Single I/O,
Multi I/O)
128 Mb
S25FL128S
133MHz (Single I/O),
104MHz (Multi I/O),
80MHz (DDR)1
128 Mb
S25FL129P
104MHz (Single I/O),
80MHz (Multi I/O)
128 Mb
S25FL128P
104MHz (Single I/O)
64 Mb
S25FL064P
104MHz (Single I/O),
80MHz (Multi I/O)
64 Mb
S25FL164K
108MHz (Multi I/O)
64 Mb
S25FL064K*
80MHz (Single I/O),
80MHz (Multi I/O)
32 Mb
S25FL032P
104MHz (Single I/O),
80MHz (Multi I/O)
32 Mb
S25FL132K
108MHz (Multi I/O)
16 Mb
S25FL116K
108MHz (Multi I/O)
16 Mb
S25FL216K
8 Mb
S25FL208K
4 Mb
S25FL204K
65MHz (Single I/O,
Dual Output)
76MHz (Single I/O,
Dual Output)
85MHz (Single I/O,
Dual Output)
packages
temp
vcc(v)
16-Pin SO
-40° to +85°C,
-40° to +105°C
2.7-3.6
16-Pin SO, 24-ball BGA
(6x8 mm)
-40° to +85°C,
-40° to +105°C
2.7-3.6
16-pin SO, 8-contact
WSON (6x8mm),
24-ball BGA (6x8mm)
16-Pin SO, 8-contact
WSON (6x8 mm), 24-ball
BGA (6x8 mm)
16-Pin SO, 24-ball BGA
(6x8 mm)
8-pin SO 208mil, 8-contact
WSON (6x5mm), 24-ball
BGA (6x8mm)
16-Pin SO
8-pin SO 208mil
8-contact WSON (6x5mm)
24-ball BGA (6x8mm)
16-Pin SO, 8-contact
WSON (6x8 mm),
24-ball BGA (6x8 mm)
16-Pin SO, 8-contact
WSON (6x8 mm),
24-ball BGA (6x8 mm)
16-Pin SO, 8-contact
WSON (6x8 mm)
16-Pin SO, 8-contact
WSON (6x8 mm), 24-ball
BGA (6x8 mm), KGW
8-Pin SO 208mil, 16-Pin SO,
8-contact WSON
(5x6 mm), 24-ball BGA
(6x8 mm), KGW
-40° to +85°C,
-40° to +105°C
1.7-2.0
-40° to +85°C,
-40° to +105°C
2.7-3.6
-40° to +85°C
8-Pin SO 208mil, 16-Pin SO
8-Pin SO 208mil, 16-Pin SO,
8-contact USON (5x6 mm),
8-contact WSON (6x8 mm),
24-ball BGA (6x8 mm), KGW
8-Pin SO 208mil, 8-Pin SO
150mil, 8-contact WSON
(5x6 mm), 24-ball BGA
(6x8 mm), KGW
8-Pin SO 208mil, 8-Pin SO
150mil, 8-contact WSON
(5x6 mm), 24-ball BGA
(6x8 mm), KGW
8-Pin SO 208mil,
8-Pin SO 150mil
8-Pin SO 208mil,
8-Pin SO 150mil
8-Pin SO 208mil,
8-Pin SO 150mil
vi/o(v)
org
sector
features
x1, x2,
x4
U
Dual Die stack; Sectors: uniform 256KB; H/W & S/W write
protect; OTP sector
x1, x2,
x4
U
Sectors: uniform 256KB; H/W & S/W write protect; OTP sector
x1, x2,
x4
U
Sectors: uniform 256KB or uniform 64KB with eight 4KB
sub-sectors and one 32KB sub-sector top/bottom, all remaining
sectors 64KB ; H/W & S/W write protect; OTP sector
x1, x2,
x4
U
Sectors: uniform 256KB or uniform 64KB with 32 top/bottom
4KB sub-sectors; H/W & S/W write protect; OTP sector
2.7-3.6
x1, x2,
x4
U
-40° to +85°C,
-40° to +105°C
1.7-2.0
x1, x2,
x4
U
-40° to +85°C,
-40° to +105°C
2.7-3.6
(for Vcc)
x1, x2,
x4
(for
ORG)
U
(for
sector)
Sectors: uniform 256KB or uniform 64KB with 16 top/bottom
4KB sub-sectors, all remaining sectors 64KB; H/W & S/W write
protect; OTP sectors
-40° to +85°C,
-40° to +105°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 256KB or uniform 64KB with 32 top/bottom
4KB sub-sectors; H/W & S/W write protect; OTP sector
-40° to +85°C,
-40° to +105°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 256KB or uniform 64KB with 32 top/bottom
4KB sub-sectors; H/W & S/W write protect; OTP sector; ACC pin
-40° to +85°C
2.7-3.6
x1
U
Sectors: uniform 256KB or uniform 64KB; H/W & S/W write
protect; x8 Parallel Program Mode; ACC pin
-40° to +85°C,
-40° to +105°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 64KB with 32 top/bottom 4KB sub-sectors,
H/W & S/W write protect; OTP sector; ACC pin
-40° to +85°C,
-40° to +105°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 4KB with 64KB block erase; H/W & S/W
write protect; OTP sector; Program/erase suspend/resume
-40° to +85°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 4KB with 64KB block erase; H/W & S/W
write protect; OTP sector; Program/erase suspend/resume.
-40° to +85°C,
-40° to +105°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 64KB with 32 top/bottom 4KB sub-sectors,
H/W & S/W write protect; OTP sector; ACC pin
-40° to +85°C,
-40° to +105°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 4KB with 64KB block erase; H/W & S/W
write protect; OTP sector; Program/erase suspend/resume
-40° to +85°C,
-40° to +105°C
2.7-3.6
x1, x2,
x4
U
Sectors: uniform 4KB with 64KB block erase; H/W & S/W
write protect; OTP sector; Program/erase suspend/resume
-40° to +85°C
2.7-3.6
x1, x2
U
-40° to +85°C
2.7-3.6
x1, x2
U
-40° to +85°C
2.7-3.6
x1, x2
U
1.65-3.6
1.65-3.6
1.65-3.6
Sectors: uniform 256KB or uniform 64KB with 32 top/bottom
4KB sub-sectors; H/W & S/W write protect; OTP sector; ACC pin
Sectors: uniform 256KB or uniform 64KB with eight 4KB
sub-sectors and one 32KB sub-sector top/bottom, all remaining
sectors 64KB ; H/W & S/W write protect; OTP sector
Sectors: uniform 4KB with 64KB block erase; H/W & S/W
write protect
Sectors: uniform 4KB with 64KB block erase; H/W & S/W
write protect
Sectors: uniform 4KB with 64KB block erase; H/W & S/W
write protect
Sector: T: Top Boot, B: Bottom Boot, D: Dual Boot, U: Uniform Sectors, H: High-Protect, L: Low-Protect
1) 3.0-3.6V. *Not recommended for new designs.
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
11
3.0V NAND Memory
part
number
density
(gbits)
i/o bus
width
number
of blocks
page
size
(bytes)
sequential
access
(ns)
random
access
(us)
page
program
time (us)
block
erase
time (ms)
ecc bits
required
packages
temp
vcc(v)
vi/o(v)
features
S34ML01G100
1
x8
1024
2048+64
25
25
200
2
1
TSOP 48,
BGA 63
-40° to +85°C
(Ind),
-40° to +105°C
(Auto)
2.7-3.6
-0.6-4.6
ONFI 1.0 compliant, HW protection for involuntary
pgm/erase during power transition, Block zero valid up
to 1K cycles, Supports Read Cache. Temp support up to
105C available with *2-bit ECC instead of 1-bit ECC.
-40° to +85°C
(Ind),
-40° to +105°C
(Auto)
2.7-3.6
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for involuntary
pgm/erase during power transition, Block zero valid
up to 1K cycles, Supports Read and Write Cache with
Multi-plane support. Now AEC-Q100, GT-Grade
available. Temp support up to 105C available now.
2.7-3.6
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for involuntary
pgm/erase during power transition, Block zero valid
up to 1K cycles, Supports Read and Write Cache with
Multi-plane support.
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for involuntary
pgm/erase during power transition, Block zero valid
up to 1K cycles, Supports Read and Write Cache with
Multi-plane support. Now AEC-Q100, GT-Grade
available. Temp support up to 105C available now.
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for involuntary
pgm/erase during power transition, Block zero valid
up to 1K cycles, Supports Read and Write Cache with
Multi-plane support. Now AEC-Q100, GT-Grade
available. Temp support up to 105C available now.
S34ML02G100
2
x8
2048
2048+64
25
25
200
3.5
1
TSOP 48,
BGA 63
S34ML02G104
2
x16
2048
2048+64
25
25
200
3.5
1
TSOP 48
-40° to +85°C
1
TSOP 48,
BGA 63
-40° to +85C
(Ind),
-40° to +105°C
(Auto)
1
TSOP 48,
BGA 63
-40° to +85°C
(Ind),
-40° to 105°C
(Auto)
-40° to +85°C
2.7-3.6
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for involuntary
pgm/erase during power transition, Block zero valid
up to 1K cycles, Supports Read and Write Cache with
Multi-plane support (TSOP-Two Chip Enables,
BGA-Single Chip Enable).
S34ML04G100
S34ML04G104
4
4
x8
x16
4096
4096
2048+64
2048+64
25
25
25
25
200
200
3.5
3.5
2.7-3.6
2.7-3.6
S34ML08G101
8
x8
8192
2048+64
25
25
200
3.5
1
TSOP 48,
BGA 63
S34ML01G200
1
x8
1024
2048+64
25
25
300
3
4
TSOP 48,
BGA 63,
BGA 67
-40° to +85°C
2.7-3.6
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for involuntary
pgm/erase during power transition, Block zero valid
up to 1K cycles, Supports Read and Write Cache with
Multi-plane support. Unique ID support.
S34ML01G204
1
x16
1024
2048+64
25
25
300
3
4
TSOP_48
-40° to +85°C
2.7-3.6
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for involuntary
pgm/erase during power transition, Block zero valid
up to 1K cycles, Supports Read and Write Cache with
Multi-plane support. Unique ID support.
S34ML04G200
4
x8
4096
2048+64
25
30
300
3.5
4
TSOP_48,
BGA_63
-40° to +85°C
2.7-3.6
-0.6-4.6
ONFI 1.0 compliant, OTP, HW protection for
involuntary pgm/erase during power transition, Block
zero valid up to 1K cycles, Supports Read and Write
Cache with Multi-plane support. Unique ID support.
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
12
1.8V NAND Memory
part
number
density
(gbits)
i/o bus
width
number
of blocks
page
size
(bytes)
sequential
access
(ns)
random
access
(us)
page
program
time (us)
block
erase
time (ms)
ecc bits
required
packages
temp
vcc(v)
vi/o(v)
features
S34MS01G100
1
x8
1024
2048+64
45
25
250
2
1
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read Cache
S34MS01G104
1
x16
1024
2048+64
45
25
250
3.5
1
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read Cache
S34MS02G100
2
x8
2048
2048+64
45
25
250
3.5
1
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, OTP, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read and Write Cache with Multi-plane support
S34MS02G104
2
x16
2048
2048+64
45
25
250
3.5
1
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, OTP, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read and Write Cache with Multi-plane support
S34MS04G100
4
x8
4096
2048+64
25
25
200
3.5
1
TSOP 48,
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, OTP, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read and Write Cache with Multi-plane support
S34MS01G200
1
x8
1024
2048+64
45
25
300
3
4
BGA 63,
BGA 67
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, OTP, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read Cache and Write Cache with Multiplane
support. Unique ID support
S34MS01G204
1
x16
1024
2048+64
45
25
300
3
4
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, OTP, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read Cache and Write Cache with Multiplane
support. Unique ID support
S34MS04G200
4
x8
4096
2048+64
45
30
300
3.5
4
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, OTP, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read Cache and Write Cache with Multiplane
support. Unique ID support
S34MS04G204
4
x16
4096
2048+64
45
30
300
3.5
4
TSOP 48,
BGA 63
-40° to
+85°C
1.7-1.95
-0.6-2.7
ONFI 1.0 compliant, OTP, HW protection for involuntary pgm/
erase during power transition, Block zero valid up to 1K cycles,
Supports Read Cache and Write Cache with Multiplane
support. Unique ID support
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
13
2.5V Parallel Flash Memory
density
page
mode
simulop
32Mb
•
16Mb
•
burst
mode
•
•
part
number
access times (ns)/
clock frequency
packages
temp
vcc(v)
vi/o(v)
org
sector
features
S29CD032J
75, 66, 56, 40MHz
80-Pin PQFP, 80-Ball BGA
-40° to +85°C,
-40° to +125°C,
-40° to +145°C
2.5-2.75
1.65-2.75
x32
D
Banks: 8/24Mb or 24/8Mb; WP#, ACC pins, Secured Silicon
Region; Advanced Sector Protection, Versatile I/O
S29CD016J
66, 56, 40MHz
80-Pin PQFP, 80-Ball BGA,
KGD
-40° to +85°C,
-40° to +125°C,
-40° to +145°C
2.5-2.75
1.65-2.75
x32
D
Banks: 4/12Mb or 12/4Mb; WP#, ACC pins, Secured Silicon
Region; Advanced Sector Protection, Versatile I/O
1.8V Parallel ADP Flash Memory
density
page
mode
simulop
burst
mode
part
number
access times (ns)/
clock frequency
packages
temp
vcc(v)
vi/o(v)
org
sector
features
512Mb
•
•
•
S29WS512P
54, 66, 80, 104MHz
84-Ball FBGA
-25° to +85°C
1.70-1.95
1.701.95
x16
D
Banks: 16x32Mb; WP#, ACC Pins; Secured Silicon Region;
Advanced Sector Protection; 32-word write buffer
256Mb
•
•
•
S29WS256P
54, 66, 80, 104MHz
84-Ball FBGA
-25° to +85°C
1.70-1.95
1.701.95
x16
D
Banks: 16x16Mb; WP#, ACC Pins; Secured Silicon Region;
Advanced Sector Protection; 32-word write buffer
128Mb
•
•
•
S29WS128P
54, 66, 80, 104MHz
84-Ball FBGA, KTD, KGW
-25° to +85°C
1.70-1.95
1.701.95
x16
D
Banks: 16x8Mb; WP#, ACC Pins; Secured Silicon Region;
Advanced Sector Protection; 32-word write buffer
64Mb
•
•
•
S29WS064R
66, 83, 108MHz
84-Ball FBGA
-40° to +85°C,
-25° to +25°C
1.70-1.95
1.701.95
x16
T, B
Banks: 4x16Mb; ACC Pin; Secured Silicon Region; Advanced
Sector Protection; 32-word write buffer
16Mb
S29AS016J
70
48-Pin TSOP, 48-Ball
FBGA, KGD, KGW
-40° to +85°C
1.65-1.95
NA
x8/x16
T, B
Sectors: 8x8KB, 31x64KB; WP# pin, RY/BY# pin
8Mb
S29AS008J
70
48-Pin TSOP, 48-Ball
FBGA, KGD, KGW
-40° to +85°C
1.65-1.95
NA
x8/x16
T, B
Sectors: 8x8KB, 15x64KB; WP# pin, RY/BY# pin
1.8V Parallel ADP MCP Solutions
product
technology (nm)
code flash (mb)
psram (mb)
S71WS256PC0
90
256
64
dram (mb)
flash/ram speed
(mhz)1
mcp/pop
package (mm)
package footprint
104/104
MCP
11.6 x 8.0
84-ball
Sector: T: Top Boot, B: Bottom Boot, D: Dual Boot, U: Uniform Sectors, H: High-Protect, L: Low-Protect
1) Maximum targeted frequency noted for each product – lower speed grades may also be offered.
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
14
1.8V Muxed AADM Flash Memory
simulop
burst
mode
part
number
access times (ns)/
clock frequency
packages
temp
vcc(v)
vi/o(v)
org
sector
features
256Mb
•
•
S29XS256R
83, 104, 108MHz
44-Ball FBGA
-40° to +85°C,
-25° to +85°C
1.70-1.95
1.701.95
x16
T, B
Banks: 8x32Mb; WP#, ACC Pins; Secured Silicon Region;
32-word write buffer
128Mb
•
•
S29XS128R
83, 104, 108MHz
44-Ball FBGA
-40° to +85°C,
-25° to +85°C
1.70-1.95
1.701.95
x16
T, B
Banks: 8x16Mb; WP#, ACC Pins; Secured Silicon Region;
32-word write buffer
64Mb
•
•
S29XS064R
66, 83, 108MHz
44-Ball FBGA
-40° to +85°C,
-25° to +85°C
1.70-1.95
1.701.95
x16
T, B
Banks: 8x16Mb; WP#, ACC Pins; Secured Silicon Region;
Advanced Sector Protection; 32-word write buffer
density
page
mode
1.8V Muxed AADM MCP Solutions
product
technology (nm)
code flash (mb)
S72XS256RE0
65
256
psram (mb)
dram (mb)
flash/ram speed
(mhz)1
mcp/pop
package (mm)
package footprint
256
108/166
MCP
8.0 x 8.0
133-ball
1.8V Muxed ADM Flash Memory
simulop
burst
mode
part
number
access times (ns)/
clock frequency
packages
temp
vcc(v)
vi/o(v)
org
sector
features
512Mb
•
•
S29NS512P
66, 83MHz
64-Ball BGA
-25° to +85°C
1.70-1.95
1.701.95
x16
T
Banks: 16x32Mb; WP#, ACC Pins; Secured Silicon Region;
Advanced Sector Protection; 32-word write buffer
256Mb
•
•
S29VS256R
83, 104, 108MHz
44-Ball FBGA
-40° to +85°C,
-25° to +85°C
1.70-1.95
1.701.95
x16
T, B
Banks: 8x32Mb; WP#, ACC Pins; Secured Silicon Region;
32-word write buffer
128Mb
•
•
S29VS128R
83, 104, 108MHz
44-Ball FBGA
-40° to +85°C,
-25° to +85°C
1.70-1.95
1.701.95
x16
T, B
Banks: 8x16Mb; WP#, ACC Pins; Secured Silicon Region;
32-word write buffer
64Mb
•
•
S29VS064R
66, 83, 108MHz
44-Ball FBGA
-40° to +85°C,
-25° to +85°C
1.70-1.95
1.701.95
x16
T, B
Banks: 4x16Mb; ACC Pin; Secured Silicon Region; Advanced
Sector Protection; 32-word write buffer
density
page
mode
1.8V Muxed ADM MCP Solutions
product
technology (nm)
code flash (mb)
psram (mb)
dram (mb)
flash/ram speed
(mhz)1
mcp/pop
package (mm)
package footprint
S71VS064RB0
65
64
32
108 / 108
MCP
7.5 x 5.0
52-ball
S71VS128RB0
65
128
32
108 / 108
MCP
7.7 x 6.2
56-ball
S71VS128RC0
65
128
64
108 / 108
MCP
7.7 x 6.2
56-ball
S71VS256RC0
65
256
64
108/108
MCP
7.7 x 6.2
56-ball
128
S71VS256RD0
65
256
S72VS256RE0
65
256
256
108/108
MCP
9.2 x 8.0
56-ball
108/166
MCP
8.0 x 8.0
133-ball
Sector: T: Top Boot, B: Bottom Boot, D: Dual Boot, U: Uniform Sectors, H: High-Protect, L: Low-Protect
1) Maximum targeted frequency noted for each product – lower speed grades may also be offered.
Spansion Product Selector Guide Embedded and Mobile Applications Portfolio
15
about spansion
Spansion’s (NYSE: CODE) technology is at the heart of electronics systems,
powering everything from the internet of today to the smart grid of tomorrow,
positively impacting people’s daily lives at work and play. Spansion’s broad
Flash memory product portfolio, smart innovation and industry leading service
and support are enabling customers to achieve greater efficiency and success
in their target markets. For more information, visit http://www.spansion.com.
spansion
915 Deguigne Drive / PO Box 3453
Sunnyvale, CA 94088-3453 USA
+1 (408) 962-2500
1 866 SPANSION
www.spansion.com
www.facebook.com/spansion
twitter: @spansion
www.youtube.com/spansioninc
43715C
January 2014
©2014 Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™ and combinations thereof, are trademarks and registered trademarks of Spansion
LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
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