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COMPUTING
Data Sheet
The MVME7100 adds performance and features while protecting the fundamental investment in VMEbus and related technologies
Up to 1.3GHz system-on-chip
Freescale MPC864xD with dual
PowerPC ® e600 processor cores, dual integrated memory controllers,
DMA engine, PCI Express interface,
Ethernet, and local I/O
Extended temperature (-40 °C to
+71 °C) and rugged board variants available
Four Gigabit Ethernet ports
Up to 2GB of DDR2 ECC memory,
128MB NOR flash and 2GB, 4GB or
8GB NAND flash
USB 2.0 controller for integrating cost-effective peripherals
(commercial temperature only)
2eSST VMEbus protocol with
320MB/s transfer rate across the VMEbus
Board support packages for VxWorks,
LynxOS, and Linux
Dual 33/66/100 MHz PMC-X sites for expansion via industry standard modules with support for processor
PMCs
8x PCI Express expansion connector for PMC-X and XMC expansion using
Artesyn XMCspan
MVME7216E direct-connect rear transition module (RTM) for I/O routing through rear of a VMEbus chassis
MVME7100
Freescale MPC864xD VME SBC
The Artesyn Embedded Technologies MVME7100, featuring the system-on-chip MPC864xD processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC74xx processors. The system-on-chip implementation offers power/thermal, reliability, and lifecycle advantages not typically found in alternative architectures.
The Artesyn MVME7100 single-board computer (SBC) helps OEMs of industrial, medical, and defense/aerospace equipment add performance and features for competitive advantage while still protecting the fundamental investment in VMEbus and related technologies. Customers can keep their VMEbus infrastructure (chassis, backplanes, and other VMEbus and PMC boards) while improving performance and extending the lifecycle. Also, the extended lifecycle of
Artesyn computing products helps reduce churns in development and support efforts resulting from frequent product changes.
The faster processor and 2eSST VMEbus interface combine to offer significant performance improvement. New cost-effective peripherals can be integrated easily using USB interfaces.
Extended temperature (-40 °C to +71 °C) variants support a wide range of operating and storage temperatures in addition to increased tolerances for shock. This enables the boards to operate in harsh environments while maintaining structural and operational integrity.
MVME7100 Data Sheet
MVME7100 Block Diagram
USB* GbE
RJ-45
PHY
5482
PHY
5482
GbE
RJ-45
ABT/RST
COM
PMC1 Front I/O PMC2 Front I/O
Front Panel
XCVR
RS-232
Up to 2GB
DDR2 Memory
Serial Port 0
GbE 1
GbE 2
GbE 3
GbE 4
DUART
TSEC1
DDR2 MC
TSEC2
TSEC3
TSEC4
PCI Express
MPC864xD
Processor
I
2
C Bus
LBC
PCI Express
Device
Bus
I
2
C Bus
User
128 KB
CPLD
Decode
Timers/Regs
RTC
DS1375
Temp
VPD
8 KB
MAX6649
Serial Ports 1-4
QUART
16C554
Flash
128MB
Flash
2, 4
MRAM
512KB
XMCspan
PCI
Express
Switch
E2P
PEX8112
USB*
µPD720101
E2P
TSi384
PMC 1
E2P
TSi384
PMC 2
E2P
TSi384
VME
TSi148
XCVR
22501
VME Bus
XCVR
RS-232
GbE 3 GbE 4 COM2 – COM5
P2
* Commercial temperature only
PMC 1 Jn4 IO I 2 C Bus
P1
Overview
VMEBUS 2ESST PERFORMANCE
The 2eSST protocol offers an available VME bus bandwidth of up to 320MB/s, an increase of up to 8x over VME64, while maintaining backward compatibility with VME64 and VME32. The combination of the latest Texas Instruments VMEbus transceivers and the Tundra
Tsi148 VMEbus bridge’s legacy protocol support allows customers to integrate the MVME7100 series into their existing infrastructure providing backward compatibility and thereby preserving their investment in existing VMEbus boards, backplanes, chassis and software.
BALANCED PERFORMANCE
The MVME7100 series provides more than just faster VMEbus transfer rates; it provides balanced performance from the processor, memory subsystem, local busses and I/O subsystems. This coupled with a wealth of I/O interfaces make the MVME7100 series ideal for use as an application-specific compute blade, or an intelligent I/O blade/carrier. The Freescale MPC864xD system-onchip (SoC) processor, running at speeds up to 1.3GHz, is well-suited for I/O and data-intensive applications. The integrated SoC design creates an I/O intensive state-of-the-art package that combines dual low power processing cores with on-chip L2 cache and dual integrated
DDR2 memory controllers, PCI Express, DMA , Ethernet and local device I/O. The on-chip PCI Express interface and dual DDR2 memory busses are well matched to the processor. To ensure optimal I/O performance, the 8x PCI Express port is connected to a five-port PCI Express switch. Three 4x PCI Express ports are connected to PCI Express-to-PCI-X bridges which provide independent PCI-X busses for the two PMC-X sites and VME bus interface. A 1x PCI Express port is connected to a PCI Express-to-
PCI bridge which is connected to the USB chip (commercial temperature only). The MVME7100 also offers quad Gigabit Ethernet interfaces, USB 2.0, and five (5) RS-232 serial connections. All of this adds up to a set of well-balanced, high-performance subsystems offering unparalleled performance.
MVME7100 Data Sheet
Backward Compatibility
The MVME7100 series continues the direction of providing a migration path from Artesyn’s embedded controllers such as the
MVME16x, MVME17x, MVME2300/MVME2400, and from Artesyn
SBCs such as the MVME2600/2700 to a single platform. The
MVME7100 series, like the MVME3100, MVME5100, MVME5500, and MVME6100 series, merged the best features of Artesyn’s embedded controllers and SBCs enabling OEMs to support varying I/O requirements with the same base platform, simplifying part number maintenance, technical expertise requirements, and sparing.
The MVME7100 series offers customers an alternate migration path from the MVME2100, MVME2300, MVME2400, MVME2600,
MVME2700, MVME3100, MVME5100, MVME5500 and
MVME6100 boards to allow them to take advantage of features such as the integrated MPC864xD SoC processor, DDR2 memory,
Gigabit Ethernet, PCI-X, PCI Express, USB, and 2eSST.
PCI EXPANSION
The MVME7100 has an 8x PCI Express connection to support PCI
Express expansion carriers such as the Artesyn XMCspan.
TRANSITION MODULES
The MVME7216E transition module provides industry standard connector access to two 10/100/1000BaseTX ports, and four asynchronous serial ports configured as RS-232 DTE. All of these are via RJ-45 connectors. The MVME7216E RTM is designed to directly connect to the VME backplane in chassis’ with an 80 mm deep rear-transition area.
Software Support
FIRMWARE MONITOR
The MVME7100 firmware (known as MOTLoad) is resident in the
MVME7100 flash and provides power-on self-test, initialization and operating system booting capabilities. In addition, it provides a debugger interface similar to the time proven “BUG” interface on previous VMEbus boards from Artesyn.
OPERATING SYSTEMS AND KERNELS
The MVME7100 series supports booting a variety of operating systems including a complete range of real-time operating systems and kernels. Artesyn Embedded Technologies Embedded
Computing Linux (2.6.25 kernel) is available now. VxWorks BSPs
(5.5.1 AMP, 6.8 SMP) are provided and supported by Wind River
Systems.
Specifications
PROCESSOR
•
Microprocessor: Freescale MPC864xD with dual PowerPC e600 cores
•
Clock Frequency: 1.06 or 1.3 GHz
•
On-chip L1 Cache (I/D): 32 K/32 K per core
•
On-chip L2 Cache: 1MB per core
SYSTEM CONTROLLER
Integrated within MPC864xD
MAIN MEMORY
Type: Double data rate (DDR2) SDRAM
Speed: DDR2-533
Capacity: 1GB or 2GB
Configuration: Dual memory controller
FLASH MEMORY
Type: NOR flash, on-board programmable
•
Capacity: 128MB
•
Write Protection: Hardware via switch, software via register or sector lock
Type: NAND flash, on-board programmable
•
Capacity: 2GB, 4GB or 8GB
•
Write Protection: Software via register
•
Supported by YAFFS (Linux) or Datalight FlashFX ® Pro
(VxWorks) under separate license
NON-VOLATILE MEMORY
Type: SEEPROM, on-board programmable
•
Capacity: 128 KB (available for users), 8 KB baseboard
Vital Product Data (VPD), and two (2) 256B Serial Presence
Detect (SPD)
Type: MRAM
•
Capacity: 512 KB
VMEBUS INTERFACE
Compliance: ANSI/VITA 1-1994 VME64 (IEEE STD 1014), ANSI/
VITA 1.1-1997 VME64 Extensions, VITA 1.5-199x 2eSST
Controller: Tundra Tsi148 PCI-X to VMEbus bridge with support for VME64 and 2eSST protocols
DTB Master: A16, A24, A32, A64; D08-D64, SCT, BLT, MBLT,
2eVME, 2eSST
DTB Slave: A16, A24, A32, A64; D08-D64, SCT, BLT, MBLT,
2eVME, 2eSST, UAT
Arbiter: RR/PRI
Interrupt Handler/Generator: IRQ 1-7/Any one of seven IRQs
System Controller: Yes, switchable or auto detect
Location Monitor: Two, LMA32
MVME7100 Data Sheet
ETHERNET INTERFACE
Controller: MPC864xD Triple Speed (TSEC) Ethernet Controllers
Interface Speed: Four @ 10/100/1000Mbps (TSEC)
Connector: Two Gigabit Ethernet ports routed to front panel
RJ-45, two Gigabit Ethernet ports to VMEbus P2 connector, pin out matching MVME7216E RTM
Indicators: Link status/speed/activity
ASYNCHRONOUS SERIAL PORTS
Port 1
•
Controller: MPC864xD Duart (second port N/C)
•
Number of Ports: One 16550 compatible
•
Configuration: RS-232 DTE (RxD, TxD, RTS, CTS)
•
Async Baud Rate, bps max.: 38.4 K RS-232, 115 Kbps raw
•
Connector: One front panel Mini DB-9
•
Mini DB-9 to DB-9 adapter cable: SERIAL-MINI-D2
Ports 2-5
•
Controller: Exar ST16C544D Quart
•
Number of Ports: Four 16550 compatible
•
Configuration: RS-232 (RxD, TxD, RTS, CTS)
•
Async Baud Rate, b/s max: 38.4 K RS-232, 115 Kbps raw
•
Connector: Via VMEbus P2 connector, pinout matching
MVME7216E RTM
USB Interface (commercial temperature only)
•
Controller: NEC μ720101
•
Configuration: USB 2.0
•
Number of ports: One
•
Connector: One powered port routed to front panel
DUAL IEEE P1386.1 PCI MEZZANINE CARD SLOTS
Address/Data: A32/D32/D64, PMC PN1, PN2, PN3, PN4 connectors (PN4 for PMC1 only)
PCI Bus Clock: 33 MHz, 66 MHz or 100 MHz PCI/ PCI-X
Signaling: 3.3 V
Power: +3.3 V, +5 V, ±12 V
Module Types: Two single-wide or one doublewide, front panel or P2 I/O, PMC and PrPMC support, PMC1 site Pn4 routed to
VMEbus P2 connector rows A and C
PCI EXPANSION CONNECTOR FOR INTERFACE TO
XMCSPAN BOARDS
8x PCI Express interface
One 76-pin connector located on MVME7100 planar
COUNTERS/TIMERS
TOD Clock Device: Maxim DS1375 I 2 C device with battery backup
Cell Storage Life: 10 years at 25 °C
Cell Capacity Life: One year at 100% duty cycle, 25 °C
Removable Battery: Yes
Real-Time Timers/Counters: Four, 32-bit programmable timers in PLD; four, 32-bit programmable/ cascadable timers in
MPC864xD
Watchdog Timer: In PLD
BOARD SIZE AND WEIGHT
Height: 233.4 mm (9.2 in.)
Depth: 160.0 mm (6.3 in.)
Front Panel Height: 261.8 mm (10.3 in.)
Width: 19.8 mm (0.8 in.)
Max. Component Height: 14.8 mm (0.58 in.)
Weight: .68 kg (1.5 lbs.)
POWER REQUIREMENTS
Board Variant
MVME7100-0161
MVME7100-0163
MVME7100-0171
MVME7100-0173
Power (+5 V ±5%)
Typical: 40 W
Maximum: 55 W
Typical: 40 W
Maximum: 55 W
Typical: 45 W
Maximum: 60 W
Typical: 45 W
Maximum: 60 W
ESTIMATED MTBF
Expected field MTBF estimate based on Telcordia SR-332, issue 1, ground fixed, controlled environment, unit ambient air temperature of 40 °C is 1,066,000 hours at 60% confidence level. Contact
Artesyn for alternative environments or temperatures.
MVME7100 Data Sheet
OTHER FEATURES
RoHS compliant
Jumper-less configuration
On-board temperature sensor (Maxim MAX6649)
JTAG header for connection of diagnostic tools
FRONT PANEL
IEEE or Scanbe handles
Connectors for serial, Gigabit Ethernet and USB ports
(commercial temperature only)
Openings for PMC sites
Transition Modules
I/O CONNECTORS
MVME7216E
•
Asynchronous Serial Ports: Four, RJ-45, labeled as COM2-5
•
Ethernet: Two 10/100/1000BaseTX, RJ-45
NON-VOLATILE STORAGE
8 KB VPD SEEPROM
BOARD SIZE
Height: 233.4 mm (9.2 in.)
Depth: 80.0 mm (3.1 in.)
Front Panel Height: 261.8 mm (10.3 in.)
Front Panel Width: 19.8 mm (0.8 in.)
All Modules
ENVIRONMENTAL
Cooling Method
Operating Temperature
Storage Temperature
Vibration Sine
Vibration Random
Commercial
Forced Air
0 °C to +55 °C
–40 °C to +85 °C
1G, 5 - 200 Hz
N/A
-ET
Forced Air
–40 °C to +71 °C
–50 °C to +100 °C
1G, 15 - 2000 Hz*
.0007g
2 /Hz
15 - 2000 Hz*
4 g/11 mS* to 100% RH
Optional
Shock
Humidity
N/A
5% to 90% RH
Conformal Coating Optional
*Final ET shock and vibration capabilities TBD. Values shown are minimums.
SAFETY
All printed wiring boards (PWBs) are manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
ELECTROMAGNETIC COMPATIBILITY (EMC)
Intended for use in systems meeting the following regulations:
•
U.S.: FCC Part 15, Subpart B, Class A (non-residential)
•
Canada: ICES-003, Class A (non-residential)
Artesyn board products are tested in a representative system to the following standards:
•
CE Mark per European EMC Directive 89/336/EEC with
Amendments; Emissions: EN55022 Class B; Immunity:
EN55024
MVME7100 Data Sheet
Ordering Information
Part Number
MVME7100-0161
Description
1.06 GHz MPC8640D, 1GB DDR2 memory, 4GB NAND flash, SCANBE (ENP1)
1.06 GHz MPC8640D, 1GB DDR2 memory, 4GB NAND flash, IEEE (ENP1)
Weight
0.57 kg
0.61 kg MVME7100-0163
MVME7100-0171
MVME7100-0171-2GF
MVME7100-0173*
1.3 GHz MPC8641D, 2GB DDR2 memory, 8GB NAND flash, SCANBE (ENP1)
1.3 GHz MPC8641D, 2GB DDR2 memory, 2GB NAND flash, SCANBE (ENP1)
0.57 kg
0.57 kg
MVME7100-0173-2GF
MVME7100ET-0161-2GF
Related Products
XMCSPAN-001
1.3 GHz MPC8641D, 2GB DDR2 memory, 8GB NAND flash, IEEE (ENP1)
1.3 GHz MPC8641D, 2GB DDR2 memory, 2GB NAND flash, IEEE (ENP1)
Extended temperature – 1.06 GHz MPC8640D, 1GB DDR2 memory, 2GB NAND flash, SCANBE (ENP2)
0.62 kg
0.62 kg
0.60 kg
MVME7216E-101
MVME721ET-101
XMC Expansion, IEEE handles
Rear transition module
Extended temp RTM, new NEW I/O on 5 row P2, two GbE, four serial, PIM, 6E (for use with MVME3100/4100/7100)
MVME721ET-102
SERIAL-MINI-D2
Extended temp RTM SCANBE, I/O on 5 row P2, two GbE, four serial, PIM, 6E (for use with MVME3100/4100/7100)
Serial cable - Micro D sub connector to standard DB-9
ACC/CABLE/SER/DTE/6E Serial cable, RD 009, 2M, 2 DTE MD/D, RJ-45 to DB-9
*Artesyn announced end of life (EOL) notification on September 25, 2015. Product availability is dependent on Artesyn’s component stock for this board.
Please contact your local Artesyn sales manager for further information.
SOLUTION SERVICES
Artesyn Embedded Technologies provides a portfolio of solution services optimized to meet your needs throughout the product lifecycle. Design services help speed time-to-market. Deployment services include global 24x7 technical support. Renewal services enable product longevity and technology refresh.
WORLDWIDE OFFICES
Tempe, AZ U.S.A. +1 888 412 7832 Shanghai, China +86 21 3395 0289
Munich, Germany +49 89 9608 2552 Tokyo, Japan
Hong Kong +852 2176 3540 Seoul, Korea
+81 3 5403 2730
+82 2 3483 1500
Artesyn Embedded Technologies, Artesyn and the Artesyn Embedded Technologies logo are trademarks and service marks of Artesyn Embedded Technologies, Inc. All other names and logos referred to are trade names, trademarks, or registered trademarks of their respective owners. © 2016 Artesyn Embedded Technologies, Inc. All rights reserved. For full legal terms and conditions, please visit www.artesyn.com/legal.
www.artesyn.com
MVME7100-DS 08Mar2016
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