Intel D34010WYB Update Manual

Intel® NUC Board D54250WYB and
Intel® NUC Board D34010WYB
Technical Product Specification
November 2013
Order Number: H18263-003
Intel® NUC Board D54250WYB and Intel® NUC Board D34010WYB may contain design defects or errors known as errata that may cause the product to deviate
from published specifications. Current characterized errata are documented in Intel NUC Board D54250WYB and Intel NUC Board D34010WYB Specification
Update.
Revision History
Revision
Revision History
Date
001
First release of the Intel NUC Board D54250WYB and Intel NUC Board
D34010WYB Technical Product Specification
September 2013
002
Specification Clarification
October 2013
003
Specification Clarification
November 2013
Disclaimer
This product specification applies to only the standard Intel NUC Board with BIOS identifier
WYLPT10H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within
each processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright  2013, Intel Corporation. All rights reserved.
Board Identification Information
Basic Intel® NUC Board D54250WYB Identification Information
AA Revision
BIOS Revision
Notes
G99254-301
WYLPT10H.86A.0021
1,2
Notes:
1.
The AA number is found on a small label on the component side of the board.
2.
The Intel® Core™ i5-4250U processor is used on this AA revision
consisting of the following component:
Device
Stepping
S-Spec Numbers
Intel Core i5-4250U
C0
SR16M
Basic Intel® NUC Board D34010WYB Identification Information
AA Revision
BIOS Revision
Notes
G99257-301
WYLPT10H.86A.0021
1,2
Notes:
1.
The AA number is found on a small label on the component side of the board.
2.
The Intel® Core™ i3-4010U processor is used on this AA revision
consisting of the following component:
Device
Stepping
S-Spec Numbers
Intel Core i3-4010U
C0
SR16Q
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that
apply to the Intel NUC Board D54250WYB and Intel NUC Board D34010WYB.
Specification Changes or Clarifications
Date
Type of Change
Description of Changes or Clarifications
October 2013
Spec Clarification
• Added Figure 9 to show the front panel connectors.
• Added Figure 15 to show the location of the front panel
Consumer Infrared (CIR) sensor
• Updated the link for BIOS update utilities in Section 3.5.
• Updated the link for BIOS recovery in Section 3.6.
• Added information about length and character restrictions for
HDD passwords in Section 3.8.
• Added Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out.
November 2013
Spec Clarification
• Updated Section 1.5.1.3 Mini High Definition Multimedia
Interface* (Mini HDMI*)
• Updated Section 1.5.1.4 Mini DisplayPort*
• Updated Section 1.5.1.5 Multiple DisplayPort and HDMI
Configurations
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://www.intel.com/content/www/us/en/motherboards/desktopmotherboards/motherboards.html?wapkw=desktop+boards for the latest
documentation.
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel® NUC
Board D54250WYB and Intel® NUC Board D34010WYB.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel NUC Board
D54250WYB and Intel NUC Board D34010WYB and their components to the vendors,
system integrators, and other engineers and technicians who need this level of
information. It is specifically not intended for general audiences.
What This Document Contains
Chapter
Description
1
A description of the hardware used on Intel NUC Board D54250WYB and Intel
NUC Board D34010WYB
2
A map of the resources of the Intel NUC Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Other Common Notation
vi
#
Used after a signal name to identify an active-low signal (such as USBP0#)
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
KB
Kilobyte (1024 bytes)
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/s
Megabytes per second
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
Contents
Revision History
Disclaimer ................................................................................................ ii
Board Identification Information .................................................................. iii
Errata ......................................................................................................iv
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout (Top) ............................................................... 13
1.1.3 Board Layout (Bottom) .......................................................... 15
1.1.4 Block Diagram ...................................................................... 17
1.2 Online Support ................................................................................. 18
1.3 Processor ........................................................................................ 18
1.4 System Memory ............................................................................... 19
1.4.1 Memory Configurations .......................................................... 20
1.5 Processor Graphics Subsystem ........................................................... 21
1.5.1 Integrated Graphics ............................................................... 21
1.5.2 USB ..................................................................................... 24
1.6 SATA Interface ................................................................................. 25
1.6.1 AHCI Mode ........................................................................... 25
1.6.2 Intel® Rapid Storage Technology / SATA RAID .......................... 25
1.6.3 Intel® Smart Response Technology .......................................... 25
1.7 Real-Time Clock Subsystem ............................................................... 26
1.8 Audio Subsystem .............................................................................. 26
1.8.1 Audio Subsystem Software ..................................................... 27
1.9 LAN Subsystem ................................................................................ 27
1.9.1 Intel® I218V Gigabit Ethernet Controller ................................... 27
1.9.2 LAN Subsystem Software ....................................................... 27
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.10 Hardware Management Subsystem ..................................................... 29
1.10.1 Hardware Monitoring ............................................................. 29
1.10.2 Fan Monitoring ...................................................................... 29
1.10.3 Thermal Solution ................................................................... 30
1.11 Power Management .......................................................................... 31
1.11.1 ACPI .................................................................................... 31
1.11.2 Hardware Support ................................................................. 33
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
2 Technical Reference
2.1 Memory Resources ........................................................................... 37
2.1.1 Addressable Memory ............................................................. 37
2.2 Connectors and Headers .................................................................... 37
2.2.1 Front Panel Connectors .......................................................... 38
2.2.2 Back Panel Connectors ........................................................... 38
2.2.3 Header (Top) ........................................................................ 39
2.2.4 Connectors and Headers (Bottom) ........................................... 40
2.3 BIOS Security Jumper ....................................................................... 49
2.4 Mechanical Considerations ................................................................. 51
2.4.1 Form Factor .......................................................................... 51
2.5 Electrical Considerations .................................................................... 52
2.5.1 Power Supply Considerations .................................................. 52
2.5.2 Fan Header Current Capability ................................................ 53
2.6 Thermal Considerations ..................................................................... 53
2.7 Reliability......................................................................................... 56
2.8 Environmental .................................................................................. 56
3 Overview of BIOS Features
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Introduction ..................................................................................... 57
BIOS Flash Memory Organization ........................................................ 58
System Management BIOS (SMBIOS) ................................................. 58
Legacy USB Support ......................................................................... 58
BIOS Updates .................................................................................. 59
3.5.1 Language Support ................................................................. 59
3.5.2 Custom Splash Screen ........................................................... 60
BIOS Recovery ................................................................................. 60
Boot Options .................................................................................... 61
3.7.1 Network Boot........................................................................ 61
3.7.2 Booting Without Attached Devices ........................................... 61
3.7.3 Changing the Default Boot Device During POST ......................... 61
3.7.4 Power Button Menu ............................................................... 62
Hard Disk Drive Password Security Feature .......................................... 63
BIOS Security Features ..................................................................... 64
4 Error Messages and Blink Codes
4.1 Front-panel Power LED Blink Codes ..................................................... 65
4.2 BIOS Error Messages ........................................................................ 65
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Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 67
5.1.1 Safety Standards................................................................... 67
5.1.2 European Union Declaration of Conformity Statement ................ 68
5.1.3 EMC Regulations ................................................................... 69
5.1.4 e-Standby and ErP Compliance ............................................... 72
5.1.5 Regulatory Compliance Marks (Board Level) ............................. 73
5.2 Battery Disposal Information .............................................................. 74
Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
Major Board Components (Top) .......................................................... 13
Major Board Components (Bottom) ..................................................... 15
Block Diagram .................................................................................. 17
Memory Channel and SO-DIMM Configuration ...................................... 20
4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ......................................... 26
LAN Connector LED Locations ............................................................. 28
Thermal Solution and Fan Header ....................................................... 30
Location of the Standby Power LED ..................................................... 35
Front Panel Connectors ..................................................................... 38
Back Panel Connectors ...................................................................... 38
Header (Top) ................................................................................... 39
Connectors and Headers (Bottom) ...................................................... 40
Connection Diagram for Front Panel Header (2.0 mm Pitch) ................... 46
Connection Diagram for Internal USB 2.0 Dual-Port
Header (2.0 mm Pitch) ...................................................................... 48
Location of the CIR Sensor ................................................................ 48
Location of the BIOS Security Jumper ................................................. 49
Board Dimensions ............................................................................. 51
Localized High Temperature Zones ..................................................... 54
Tables
1.
2.
3.
4.
5.
6.
7.
Feature Summary ............................................................................. 11
Components Shown in Figure 1 .......................................................... 14
Components Shown in Figure 2 .......................................................... 16
Supported Memory Configurations ...................................................... 19
DisplayPort Multi-Streaming Resolutions .............................................. 23
Multiple Display Configuration Maximum Resolutions ............................. 23
Audio Formats Supported by the Mini HDMI and
Mini DisplayPort Interfaces................................................................. 24
8. LAN Connector LED States ................................................................. 28
9. Effects of Pressing the Power Switch ................................................... 31
10. Power States and Targeted System Power ........................................... 32
11. Wake-up Devices and Events ............................................................. 33
12. Header Shown in Figure 10 ................................................................ 39
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
x
Connectors and Headers Shown in Figure 10 ........................................ 41
PCI Express Full-/Half-Mini Card Connector .......................................... 42
Dual-Port Front Panel USB 2.0 Header ................................................. 43
SATA Connector ............................................................................... 43
SATA Power Connector ...................................................................... 44
System ID / Custom Solutions Header (2.0 mm Pitch) .......................... 44
12-24 V Internal Power Supply Connector............................................ 45
Front Panel Header (2.0 mm Pitch) ..................................................... 45
States for a One-Color Power LED....................................................... 46
BIOS Security Jumper Settings ........................................................... 50
Fan Header Current Capability ............................................................ 53
Thermal Considerations for Components .............................................. 55
Tcontrol Values for Components ......................................................... 55
Environmental Specifications .............................................................. 56
Acceptable Drives/Media Types for BIOS Recovery................................ 60
Boot Device Menu Options ................................................................. 61
Master Key and User Hard Drive Password Functions ............................ 63
Supervisor and User Password Functions ............................................. 64
Front-panel Power LED Blink Codes ..................................................... 65
BIOS Error Messages ........................................................................ 65
Safety Standards .............................................................................. 67
EMC Regulations ............................................................................... 69
Regulatory Compliance Marks ............................................................ 73
1
Product Description
1.1
Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of Intel NUC Board D54250WYB and Intel NUC
Board D34010WYB.
Table 1. Feature Summary
Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
• Intel NUC Board D54250WYB has a soldered-down Intel® Core™ i5-4250U
processor with up to 15 W TDP
― Integrated graphics
― Integrated memory controller
― Integrated PCH
• Intel NUC Board D34010WYB has a soldered-down Intel® Core™ i3-4010U
processor with up to 15 W TDP
― Integrated graphics
― Integrated memory controller
― Integrated PCH
Memory
• Two 204-pin DDR3L SDRAM Small Outline Dual Inline Memory Module
(SO-DIMM) sockets
• Support for DDR3L 1600 MHz and DDR3L 1333 MHz SO-DIMMs
• Support for 2 Gb and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory only
Graphics
• Integrated graphics support for processors with Intel® Graphics Technology:
― One Mini High Definition Multimedia Interface* (Mini HDMI*) back panel
connector
Audio
• Intel® High Definition (Intel® HD) Audio via the Mini HDMI v1.4a and Mini
DisplayPort 1.2 interfaces through the processor
― One Mini DisplayPort* back panel connector
• Intel HD Audio via a stereo microphone/headphone jack on the front panel
• Front panel audio jack (3.5 mm jack)
Peripheral
Interfaces
• USB 3.0 ports:
― Two ports are implemented with external front panel connectors (blue)
― Two ports are implemented with external back panel connectors (blue)
• USB 2.0 ports:
― Two ports via one dual-port internal 2.0 mm pitch header (black)
― One port is reserved for the PCI Express* Half-Mini Card
― One port is reserved for the PCI Express Full-Mini Card
• SATA ports:
― One internal mSATA port (PCI Express Full-Mini Card) for SSD support
― One SATA 6.0 Gb/s port (blue)
continued
11
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Table 1. Feature Summary (continued)
Expansion
Capabilities
• One PCI Express Half-Mini Card connector
BIOS
• Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• One PCI Express Full-Mini Card connector
• Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)
Instantly Available
PC Technology
• Support for PCI Express*
• Suspend to RAM support
• Wake on PCI Express, LAN, front panel, Consumer Infrared (CIR), and
USB ports
LAN Support
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I218V Gigabit
Ethernet Controller
Hardware Monitor
Subsystem
Hardware monitoring subsystem, based on a Nuvoton NCT5577D embedded
controller, including:
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• One processor fan header
• Fan sense input used to monitor fan activity
• Fan speed control
12
Product Description
1.1.2
Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of Intel NUC
Board D54250WYB and Intel NUC Board D34010WYB.
Figure 1. Major Board Components (Top)
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
14
Item from Figure 1
Description
A
Battery
B
Custom Solutions header (2.0 mm pitch)
C
Processor fan header
D
Onboard power button
E
Power LED
F
Standby power LED
G
Hard Disk Drive LED
H
Thermal solution
Product Description
1.1.3
Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of Intel NUC
Board D54250WYB and Intel NUC Board D34010WYB.
Figure 2. Major Board Components (Bottom)
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Table 3. Components Shown in Figure 2
16
Item from
Figure 2
Description
A
Back panel connectors
B
PCI Express Full-Mini Card connector
C
PCI Express Half-Mini Card connector
D
SATA 6.0 Gb/s connector
E
Front panel dual-port USB 2.0 header (2.0 mm pitch)
F
Front panel USB 3.0 connector
G
Front panel USB 3.0 connector
H
Front panel header (2.0 mm pitch)
I
SATA power connector
J
Front panel stereo microphone/headphone jack
K
BIOS setup configuration jumper
L
Consumer Infrared (CIR) sensor
M
DDR3L SO-DIMM 2 socket
N
DDR3L SO-DIMM 1 socket
O
Internal DC power connector
Product Description
1.1.4
Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Figure 3. Block Diagram
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.2
Online Support
To find information about…
Visit this World Wide Web site:
Intel NUC Board D54250WYB and Intel
NUC Board D34010WYB
http://www.intel.com/NUC
Intel NUC Board Support
http://www.intel.com/NUCSupport
Available configurations for Intel NUC
Board D54250WYB and Intel NUC
Board D34010WYB
http://ark.intel.com
BIOS and driver updates
http://downloadcenter.intel.com
Tested memory
http://www.intel.com/NUCSupport
Integration information
http://www.intel.com/NUCSupport
Processor datasheet
http://ark.intel.com
1.3
•
Processor
Intel NUC Board D54250WYB has a soldered-down Intel® Core™ i5-4250U
processor with up to 15 W TDP
 Integrated graphics
 Integrated memory controller
•
 Integrated PCH
Intel NUC Board D34010WYB has a soldered-down Intel® Core™ i3-4010U
processor with up to 15 W TDP
 Integrated graphics
 Integrated memory controller
 Integrated PCH
NOTE
There are specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 52 for information on power supply requirements.
18
Product Description
1.4
System Memory
The board has two 204-pin SO-DIMM sockets and support the following memory
features:
•
•
•
•
•
•
•
•
1.35 V DDR3L SDRAM SO-DIMMs with gold plated contacts
Two independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided SO-DIMMs
16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 37 for information on the total amount of addressable
memory.
Minimum recommended total system memory: 1024 MB
Non-ECC SO-DIMMs
Serial Presence Detect
DDR3L 1600 MHz and DDR3L 1333 MHz SDRAM SO-DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.
Table 4 lists the supported SO-DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
4096 MB
4096 MB
8192 MB
Note:
Configuration (Note)
DS
SS
DS
SDRAM
Density
2 Gbit
4 Gbit
4 Gbit
SDRAM Organization
Front-side/Back-side
256 M x8/256 M x8
512 M x8/empty
512 M x8/512 M x8
Number of SDRAM
Devices
16
8
16
“DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about…
Refer to:
Tested Memory
http://www.intel.com/NUCSupport
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.4.1
Memory Configurations
The processor supports the following types of memory organization:
•
•
Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.
For information about…
Refer to:
Memory Configuration Examples
http://www.intel.com/NUCSupport
Figure 4 illustrates the memory channel and SO-DIMM configuration.
Figure 4. Memory Channel and SO-DIMM Configuration
20
Product Description
1.5
Processor Graphics Subsystem
The board supports graphics through Intel HD Graphics.
1.5.1
Integrated Graphics
The board supports integrated graphics via the processor.
Intel® High Definition (Intel® HD) Graphics
1.5.1.1
The Intel HD graphics controller features the following:
•
3D Features
 DirectX* 11 support
•
•
•
•
•
•
•
•
•
 OpenGL* 4.0 support
Video
Next Generation Intel® Clear Video Technology HD support is a collection of video
playback and enhancement features that improve the end user’s viewing
experience
Encode/transcode HD content
Playback of high definition content including Blu-ray* disc
Superior image quality with sharper, more colorful images
Playback of Blu-ray disc S3D content using Mini HDMI (v1.4a spec compliant
with 3D)
DirectX* Video Acceleration (DXVA) support for accelerating video processing
Full AVC/VC1/MPEG2 HW Decode
Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync
Video)
NOTE
Intel Quick Sync Video is enabled by an appropriate software application.
1.5.1.2
Video Memory Allocation
®
Intel Dynamic Video Memory Technology (DVMT) is a method for dynamically
allocating system memory for use as graphics memory to balance 2D/3D graphics and
system performance. If your computer is configured to use DVMT, graphics memory is
allocated based on system requirements and application demands (up to the
configured maximum amount). When memory is no longer needed by an application,
the dynamically allocated portion of memory is returned to the operating system for
other uses.
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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.5.1.3
Mini High Definition Multimedia Interface* (Mini HDMI*)
The Mini High-Definition Multimedia Interface (Mini HDMI) is provided for transmitting
uncompressed digital audio and video signals to television sets, projectors and other
video displays. It can carry high quality multi-channel audio data and all standard and
high-definition consumer electronics video formats. The Mini HDMI display interface
connecting the processor and display devices utilizes transition minimized differential
signaling (TMDS) to carry audiovisual information through the same Mini HDMI cable.
The processor HDMI interface is designed according to the High-Definition Multimedia
Interface Specification with 3D, Deep Color, and x.v.Color. The maximum supported
resolution is 1920 x 1200 @ 60 Hz, 24bpp. The Mini HDMI port is compliant with the
HDMI 1.4a specification.
1.5.1.4
Mini DisplayPort*
DisplayPort is a digital communication interface that utilizes differential signaling to
achieve a high bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPort is suitable for display
connections between consumer electronics devices such as high definition optical disc
players, set top boxes, and TV displays. The maximum supported resolution is 3840 x
2160 @ 60 Hz, 24bpp. The Mini DisplayPort interface supports the 1.2 specification.
The DisplayPort output supports Multi-Stream Transport (MST) which allows for
multiple independent video streams (daisy-chain connection with multiple monitors)
over a single DisplayPort. This will require the use of displays that support
DisplayPort 1.2 and allow for this feature.
22
For information about
Refer to
DisplayPort technology
http://www.displayport.org
Product Description
1.5.1.4.1
DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining
Table 5 lists the maximum resolutions available when using DisplayPort 1.2
Multi-Stream Transport.
Table 5. DisplayPort Multi-Streaming Resolutions
DisplayPort Usage
Models
Monitor 1
Monitor 2
Monitor 3
3 Monitors
1920 x 1200 @ 60 Hz
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
2 Monitors
2560 x 1600 @ 60 Hz
2560 x 1600 @ 60 Hz
3 Monitors
(with DisplayPort 1.2
hub)
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
1.5.1.5
1920 x 1080 @ 60 Hz
Multiple DisplayPort and HDMI Configurations
Multiple DisplayPort and HDMI configurations feature the following:
•
•
•
•
Two independent displays
Single HDMI 1.4a with 1080P support
Single DisplayPort 1.2 with 4K support
Collage Display
Table 6. Multiple Display Configuration Maximum Resolutions
Single Display
HDMI
Dual Display
DisplayPort and HDMI
Single Display
DisplayPort
1920 x 1200 @ 60 Hz
3840 x 2160 @ 60 Hz (DisplayPort)
1920 x 1200 @ 60 Hz (HDMI)
3840 x 2160 @ 60 Hz
Note: Higher resolutions may be achievable but have not been tested on Intel NUC.
For information about
Refer to
Multiple display maximum
resolutions
https://wwwssl.intel.com/content/www/us/en/processors/core/CoreTechnicalResou
rces.html (Generic link)
https://www-ssl.intel.com/content/www/us/en/processors/core/4thgen-core-family-desktop-vol-1-datasheet (Specific Link)
1.5.1.6
High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized
copy or interception between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4a for content protection
over wired displays (Mini HDMI and Mini DisplayPort).
23
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.5.1.7
Integrated Audio Provided by the Mini HDMI and
Mini DisplayPort Interfaces
The Mini HDMI and Mini DisplayPort interfaces from the PCH support audio. The
processor supports two High Definition audio streams on two digital ports
simultaneously.
Table 7 shows the specific audio technologies supported by the PCH.
Table 7. Audio Formats Supported by the Mini HDMI and
Mini DisplayPort Interfaces
Audio Formats
Mini HDMI
Mini DisplayPort
AC-3 – Dolby* Digital
Yes
Yes
Dolby Digital Plus
Yes
Yes
DTS-HD*
Yes
Yes
LPCM , 192 kHz/24 bit, 8 channel
Yes
Yes
Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc
Audio Format)
Yes
Yes
1.5.2
USB
The board supports eight USB ports. All eight ports are high-speed, full-speed, and
low-speed capable. The port arrangement is as follows:
•
USB 3.0 ports:
 Two front panel USB 3.0 ports are implemented through an external connector
(blue)
•
 Two ports are implemented with vertical back panel connectors (blue)
USB 2.0 ports:
 Two ports via one dual-port internal 2.0 mm pitch header (black)
 One port is reserved for the PCI Express Half-Mini Card
 One port is reserved for the PCI Express Full-Mini Card
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.
24
For information about
Refer to
The location of the USB connectors on the back panel
Figure 9, page 38
The location of the front panel USB headers
Figure 2, page 15
Product Description
1.6
SATA Interface
The board provides the following SATA interfaces:
•
•
One internal mSATA port (PCI Express Full-Mini Card) for SSD support
One SATA 6.0 Gb/s port (blue)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6 Gb/s. A point-to-point interface is used for host to device connections.
1.6.1
AHCI Mode
The board supports AHCI storage mode.
NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows* 7
and Windows 8 includes the necessary AHCI drivers without the need to install
separate AHCI drivers during the operating system installation process, however, it is
always good practice to update the AHCI drivers to the latest available by Intel.
1.6.2
Intel® Rapid Storage Technology / SATA RAID
The PCH supports Intel® Rapid Storage Technology, providing both AHCI and
integrated RAID functionality. The RAID capability provides high-performance RAID 0
and 1 functionality on all SATA ports. Other RAID features include hot spare support,
SMART alerting, and RAID 0 auto replace. Software components include an Option
ROM for pre-boot configuration and boot functionality, a Microsoft Windows compatible
driver, and a user interface for configuration and management of the RAID capability
of the PCH.
1.6.3
Intel® Smart Response Technology
Intel® Smart Response Technology is a disk caching solution that can provide improved
computer system performance with improved power savings. It allows configuration of a
computer system with the advantage of having HDDs for maximum storage capacity
with system performance at or near SSD performance levels.
For more information on Intel Smart Response Technology, go to
http://www.intel.com/support/chipsets/sb/CS-032826.htm
NOTE
In order to use supported RAID and Intel Smart Response Technology features, you
must first enable RAID in the BIOS.
25
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.7
Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied via the power supply 5 V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.8
Audio Subsystem
The audio subsystem supports the following features:
•
•
•
•
•
Analog line-out/Analog Headphone/Analog Microphone (front panel jack)
DMIC interface (custom solutions header), with support for mono and stereo digital
microphones
Support for 44.1 kHz/48 kHz/96 kHz/192 kHz sample rates on all analog outputs
Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog inputs
Front Panel Audio Jack Support (see Figure 5 for 3.5 mm audio jack pin out):
 Speakers only
 Headphones only
 Microphone only
 Combo Headphone/Microphone
Pin Number
Pin Name
Description
1
Tip
Left Audio Out
2
Ring
Right Audio Out
3
Ring
Common/Ground
4
Sleeve
Audio In
Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out
NOTE
The analog circuit of the front panel audio connector is designed to power headphones
or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers
are connected to this output.
26
Product Description
1.8.1
Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining Audio software and drivers
http://downloadcenter.intel.com
1.9
LAN Subsystem
The LAN subsystem consists of the following:
•
•
Intel I218V Gigabit Ethernet Controller (10/100/1000 Mb/s)
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the Processor and the LAN controller
• Power management capabilities
 ACPI technology support
•
 LAN wake capabilities
LAN subsystem software
For information about
Refer to
LAN software and drivers
http://downloadcenter.intel.com
1.9.1
Intel® I218V Gigabit Ethernet Controller
The Intel I218V Gigabit Ethernet Controller supports the following features:
•
•
•
•
•
•
1.9.2
Compliant with the 1 Gb/s Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications
Multi-speed operation: 10/100/1000 Mb/s
Full-duplex operation at 10/100/1000 Mb/s; Half-duplex operation at 10/100 Mb/s
Flow control support compliant with the 802.3X specification as well as the specific
operation of asymmetrical flow control defined by 802.3z
VLAN support compliant with the 802.3q specification
MAC address filters: perfect match unicast filters, multicast hash filtering,
broadcast filter, and promiscuous mode
LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining LAN software and drivers
http://downloadcenter.intel.com
27
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.9.3
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item
Description
A
Link LED (Green)
B
Data Rate LED (Green/Yellow)
Figure 6. LAN Connector LED Locations
Table 8 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 8. LAN Connector LED States
LED
Link
Data Rate
28
LED Color
Green
Green/Yellow
LED State
Condition
Off
LAN link is not established.
On
LAN link is established.
Blinking
LAN activity is occurring.
Off
10 Mb/s data rate is selected.
Green
100 Mb/s data rate is selected.
Yellow
1000 Mb/s data rate is selected.
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including thermal and voltage monitoring.
For information about
Refer to
Wired for Management (WfM) Specification
www.intel.com/design/archives/wfm/
1.10.1
Hardware Monitoring
The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577D
embedded controller, which supports the following:
•
•
•
•
Processor and system ambient temperature monitoring
Chassis fan speed monitoring
Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp, PCH Vcc
SMBus interface
1.10.2
Fan Monitoring
Fan monitoring can be implemented using third-party software.
29
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.10.3
Thermal Solution
Figure 6 shows the location of the thermal solution and processor fan header.
Item
Description
A
Processor fan header
B
Thermal solution
Figure 7. Thermal Solution and Fan Header
30
Product Description
1.11 Power Management
Power management is implemented at several levels, including:
•
•
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
 Power Input
 Instantly Available PC technology
 LAN wake capabilities
 Wake from USB
 WAKE# signal wake-up support
 Wake from S5
 Wake from CIR
 +5 V Standby Power Indicator LED
1.11.1
ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
•
•
•
•
•
•
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 11 on page 33)
Support for a front panel power and sleep mode switch
Table 9 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 9. Effects of Pressing the Power Switch
If the system is in this
state…
…and the power switch is
pressed for
Off
(ACPI G2/G5 – Soft off)
Less than four seconds
Power-on
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Less than four seconds
Soft-off/Standby
(ACPI G1 – sleeping state)
On
(ACPI G0 – working state)
More than six seconds
Fail safe power-off
(ACPI G2/G5 – Soft off)
Sleep
(ACPI G1 – sleeping state)
Less than four seconds
Wake-up
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
More than six seconds
Power-off
(ACPI G2/G5 – Soft off)
…the system enters this state
Note
Note: Depending on power management settings in the operating system.
31
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.11.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 10 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 10. Power States and Targeted System Power
Global States
Sleeping States
Processor
States
G0 – working
state
S0 – working
C0 – working
D0 – working
state.
Full power > 30 W
G1 – sleeping
state
S3 – Suspend to
RAM. Context
saved to RAM.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G1 – sleeping
state
S4 – Suspend to
disk. Context
saved to disk.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G2/S5
S5 – Soft off.
Context not saved.
Cold boot is
required.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G3 –
mechanical off
No power to the
system.
No power
D3 – no power for
wake-up logic,
except when
provided by
battery or
external source.
No power to the system.
Service can be performed
safely.
AC power is
disconnected
from the
computer.
Device States
Targeted System
Power (Note 1)
Notes:
32
1.
Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2.
Dependent on the standby power consumption of wake-up devices used in the system.
Product Description
1.11.1.2
Wake-up Devices and Events
Table 11 lists the devices or specific events that can wake the computer from specific
states.
Table 11. Wake-up Devices and Events
Devices/events that wake up the system…
…from this sleep state
Power switch
S3, S4, S5
RTC alarm
S3, S4, S5
LAN
S3, S4, S5
USB
S3
WAKE#
S3, S4, S5
Consumer IR
S3, S4, S5
(Note
1)
(Note 1)
(Note 1)
(Note 2)
(Note 1)
(Note 3)
Notes:
1.
S4 implies operating system support only.
2.
USB ports must be turned off during S4/S5 states.
3.
When Deep S4/S5 is enabled only Wake from RTC and Power Switch is supported.
NOTE
The use of these wake-up events from an ACPI state requires an operating system that
provides full ACPI support. In addition, software, drivers, and peripherals must fully
support ACPI wake events.
1.11.2
Hardware Support
The board provides several power management hardware features, including:
•
•
•
•
•
•
•
•
Wake from Power Button signal
Instantly Available PC technology
LAN wake capabilities
Wake from USB
WAKE# signal wake-up support
Wake from S5
Wake from CIR
+5 V Standby Power Indicator LED
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
33
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
1.11.2.1
Power Input
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about
Refer to
The location of the internal power connector
Figure 2, page 15
The signal names of the internal power connector
Table 13, page 45
1.11.2.2
Instantly Available PC Technology
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 11 on page 33 lists the devices and events that can
wake the computer from the S3 state.
The use of Instantly Available PC technology requires operating system support and
drivers for any installed PCI Express add-in card.
1.11.2.3
LAN Wake Capabilities
LAN wake capabilities enable remote wake-up of the computer through a network. The
LAN subsystem monitors network traffic at the Media Independent Interface. Upon
detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that
powers up the computer.
1.11.2.4
Wake from USB
USB bus activity wakes the computer from an ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.11.2.5
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.
1.11.2.6
Wake from S5
When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from an ACPI S5 state.
34
Product Description
1.11.2.7
Wake from Consumer IR
CIR activity wakes the computer from an ACPI S3, S4, or S5 state.
1.11.2.8
+5 V Standby Power Indicator LED
The standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 8. Location of the Standby Power LED
35
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
36
2
Technical Reference
2.1
Memory Resources
2.1.1
Addressable Memory
The board utilizes 32 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 32 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
•
•
•
•
•
•
BIOS/SPI Flash device (96 Mb)
Local APIC (19 MB)
Direct Media Interface (40 MB)
PCI Express configuration space (256 MB)
PCH base address registers PCI Express ports (up to 256 MB)
Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards
(256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. All installed system memory can
be used when there is no overlap of system addresses.
2.2
Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
37
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
•
•
•
2.2.1
Front panel I/O connectors
Back panel I/O connectors
On-board I/O connectors and headers (see pages 39 and 40)
Front Panel Connectors
Figure 9 shows the location of the front panel connectors for the board.
Item
Description
A
Front panel stereo microphone/
headphone jack
USB 3.0 port
USB 3.0 port
B
C
Figure 9. Front Panel Connectors
2.2.2
Back Panel Connectors
Figure 10 shows the location of the back panel connectors for the board.
Item
Description
A
B
C
D
E
USB 3.0 ports
LAN
Mini HDMI connector
Mini DisplayPort connector
12-19 V DC input jack
Figure 10. Back Panel Connectors
38
Technical Reference
2.2.3
Header (Top)
Figure 11 shows the location of the header on the top-side of the board.
Figure 11. Header (Top)
Table 12 lists the header identified in Figure 11.
Table 12. Header Shown in Figure 11
Item from Figure 12
Description
A
Custom Solutions header (2.0 mm pitch)
39
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
2.2.4
Connectors and Headers (Bottom)
Figure 10 shows the locations of the connectors and headers on the bottom-side of the
board.
Figure 12. Connectors and Headers (Bottom)
40
Technical Reference
Table 13 lists the connectors and headers identified in Figure 10.
Table 13. Connectors and Headers Shown in Figure 10
Item from
Figure 10
Description
A
PCI Express Full-Mini Card connector
B
PCI Express Half-Mini Card connector
C
SATA 6.0 Gb/s connector through the PCH
D
Front panel dual-port USB 2.0 header (2.0 mm pitch)
E
Front panel header (2.0 mm pitch)
F
SATA power connector
G
BIOS setup configuration jumper
H
Internal DC power connector
41
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
2.2.4.1
Signal Tables for the Connectors and Headers
Table 14. PCI Express Full-/Half-Mini Card Connector
Pin
Signal Name
1
WAKE#
2
3.3 V
3
Reserved
4
GND
5
Reserved
6
1.5 V
7
CLKREQ#
8
Reserved
9
GND
10
Reserved
11
REFCLK-
12
Reserved
13
REFCLK+
14
Reserved
15
GND
16
Reserved
17
Reserved
18
GND
19
Reserved
20
Reserved
21
GND
22
PERST#
23
PERn0
24
+3.3 V aux
25
PERp0
26
GND
27
GND
28
+1.5 V
29
GND
30
SMB_CLK
31
PETn0
32
SMB_DATA
33
PETp0
34
GND
35
GND
36
USB_D-
37
GND
38
USB_D+
Additional Signal Name
(mSATA) Vendor
continued
42
Technical Reference
Table 14. PCI Express Full-/Half-Mini Card Connector (continued)
Pin
Signal Name
Additional Signal Name
39
+3.3 Vaux
(mSATA) Vendor
40
GND
41
+3.3 Vaux
42
LED_WWAN#
43
Reserved
44
LED_WLAN#
45
Reserved
46
LED_WPAN#
47
Reserved
48
+1.5V
49
Reserved
50
GND
51
Reserved
52
+3.3V
(mSATA) Vendor
(mSATA) Vendor
(mSATA) Vendor
(mSATA) DA/DSS
(mSATA) Presence Detection
NOTE
The mSATA signals are routed only to the PCI Express Full-Mini Card connector and
not to the Half-Mini Card connector. These signals are required to support mSATA
modules.
Table 15. Dual-Port Front Panel USB 2.0 Header
Pin
Signal Name
Pin
Signal Name
1
+5 V DC
2
+5 V DC
3
D−
4
D−
5
D+
6
D+
7
Ground
8
Ground
9
KEY (no pin)
10
No Connect
Table 16. SATA Connector
Pin
Signal Name
1
Ground
2
TXP
3
TXN
4
Ground
5
RXN
6
RXP
7
Ground
43
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Table 17. SATA Power Connector
Pin
Signal Name
1
3.3 V DC
2
3.3 V DC
3
3.3 V DC
4
Ground
5
Ground
6
Ground
7
5 V DC
8
5 V DC
9
5 V DC
10
Ground
11
Ground
12
Ground
13
N/A
14
N/A
15
N/A
Table 18. System ID / Custom Solutions Header (2.0 mm Pitch)
Pin
Signal Name
Pin
Signal Name
1
Prog_LED
2
GND
3
HDMI_CEC
4
DMIC_CLK
5
3.3 Vsby
6
DMIC_DATA
7
Key (no pin)
8
SCI/SMI GPIO
9
5 Vsby (2A)
10
WDTO#/GPIO
2.2.4.2
Add-in Card Connectors
The board has the following add-in card connectors:
•
•
44
One PCI Express Half-Mini Card
One PCI Express Full-Mini Card
Technical Reference
2.2.4.3
Power Supply Connectors
The board has the following power supply connectors:
•
External Power Supply – the board can be powered through a 12-19 V DC
connector on the back panel. The back panel DC connector is compatible with a
5.5 mm/OD (outer diameter) and 2.5 mm/ID (inner diameter) plug, where the
inner contact is +19 (±10%) V DC and the shell is GND. The maximum current
rating is 10 A.
NOTE
External power voltage, 12-19 V DC, is dependent on the type of
power brick used.
•
Internal Power Supply – the board can alternatively be powered via the
internal 12-24 V DC 1 x 2 power connector, where pin 1 is GND and pin 2 is
+19 (±10%) V DC.
Table 19. 12-24 V Internal Power Supply Connector
Pin
Signal Name
1
Ground
2
+19 V (±10%)
For information about
Refer to
Power supply considerations
Section 2.5.1, page 52
2.2.4.4
Front Panel Header (2.0 mm Pitch)
This section describes the functions of the front panel header. Table 20 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 20. Front Panel Header (2.0 mm Pitch)
Pin
Signal Name
Description
Pin
Signal Name
Description
1
HDD_POWER_LED
Pull-up resistor
(750 Ω) to +5V
2
POWER_LED_MAIN
[Out] Front panel LED
(main color)
3
HDD_LED#
[Out] Hard disk
activity LED
4
POWER_LED_ALT
[Out] Front panel LED
(alt color)
5
GROUND
Ground
6
POWER_SWITCH#
[In] Power switch
7
RESET_SWITCH#
[In] Reset switch
8
GROUND
Ground
9
+5V_DC
Power
10
Key
No pin
45
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch)
2.2.4.4.1
Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires a SATA hard
drive or optical drive connected to an onboard SATA connector.
2.2.4.4.2
Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.4.4.3
Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 21 shows the
possible LED states.
Table 21. States for a One-Color Power LED
LED State
Description
Off
Power off
Blinking
Standby
Steady
Normal operation
NOTE
The LED behavior shown in Table 21 is default – other patterns may be set via BIOS
setup.
46
Technical Reference
2.2.4.4.4
Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.4.5
System ID / Custom Solutions Header (2.0 mm Pitch)
The System ID / Customs Solution header is provided to aid customers in developing
custom applications.
•
•
•
•
•
•
•
Prog_LED#: general purpose signal output that indicates when an event was
triggered by the operating system. Signal is amplified by a transistor. Intel can
provide sample code for customers who may want to write their own applications
leveraging this signal.
SMB_CLK and SMB_DATA: SMBus interface, reserved for future support of All-InOne chassis detection. General SMBus information can be found on the platform
EDS and at http://smbus.org/specs/.
3.3 V Standby: can be used to monitor the presence of 3.3 V standby power.
PWRBT#: power button signal (functions in the same manner as the power button
pin on the front panel header).
HDMI Consumer Electronics Control (CEC): standard communication signal from
the Mini HDMI connector (http://www.hdmi.org/) - the signal is exposed through
this header for third party solutions to monitor/control CEC activity between
multiple HDMI devices.
5 V Standby: can be used to monitor the presence of 5 V Standby power or provide
power from the 5 V Standby rail (up to 2A current rating).
SCI/SMI GPI: input signal for direct connection to a front panel push-button to
trigger a Windows command. Intel will be adding BIOS support and accompanying
Windows utility to enable Direct Application Launch* feature. General information
about Direct Application Launch can be found at:
http://msdn.microsoft.com/en-us/windows/hardware/gg463078.aspx
47
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
2.2.4.6
Internal USB 2.0 Dual-Port Header (2.0 mm Pitch)
Figure 14 is a connection diagram for the internal USB header.
NOTE
•
•
The +5 V DC power on the USB header is fused.
Use only an internal USB connector that conforms to the USB 2.0 specification for
high-speed USB devices.
Figure 14. Connection Diagram for Internal
USB 2.0 Dual-Port Header (2.0 mm Pitch)
2.2.4.7
Consumer Infrared (CIR) Sensor
The Consumer Infrared (CIR) sensor on the front panel provides features that are
designed to comply with Microsoft Consumer Infrared usage models.
The CIR feature is made up of the receiving sensor. The receiving sensor consists of a
filtered translated infrared input compliant with Microsoft CIR specifications.
Customers are required to provide their own media center compatible remote or smart
phone application for use with the Intel NUC. Figure 15 shows the location of the CIR
sensor.
Item
Description
A
CIR Sensor
Figure 15. Location of the CIR Sensor
48
Technical Reference
2.3
BIOS Security Jumper
CAUTION
Do not move a jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the board
could be damaged.
Figure 13 shows the location of the BIOS Security Jumper. The 3-pin jumper
determines the BIOS Security program’s mode.
Table 22 describes the jumper settings for the three modes: normal, lockdown, and
configuration.
Figure 16. Location of the BIOS Security Jumper
49
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Table 22 lists the settings for the jumper.
Table 22. BIOS Security Jumper Settings
Function/Mode
Jumper Setting
Configuration
Normal
1-2
The BIOS uses current configuration information and passwords
for booting.
Lockdown
2-3
The BIOS uses current configuration information and passwords
for booting, except:
• All POST Hotkeys are suppressed (prompts are not displayed
and keys are not accepted. For example, F2 for Setup, F10
for the Boot Menu).
• Power Button Menu (see Section 3.7.4)
BIOS updates are not available except for automatic Recovery
due to flash corruption.
Configuration
Mode
None
BIOS Recovery Update process if a matching *.bio file is found.
Recovery Update can be cancelled by pressing the Esc key.
If the Recovery Update was cancelled or a matching *.bio file
was not found, a Config Menu will be displayed. The Config
Menu consists of the following (followed by the Power Button
Menu selections):
[1]
Suppress this menu until the BIOS Security Jumper is
replaced.
[2]
Clear BIOS User and Supervisor Passwords.
[3]
Reset Intel AMT to default factory settings.
[4]
Clear Trusted Platform Module.
For information on the Power Button Menu, see Section 3.7.4.
50
Technical Reference
2.4
2.4.1
Mechanical Considerations
Form Factor
The board is designed to fit into a custom chassis. Figure 17 illustrates the mechanical
form factor for the board. Dimensions are given in inches [millimeters]. The outer
dimensions are 4.0 inches by 4.0 inches [101.60 millimeters by 101.60 millimeters].
Figure 17. Board Dimensions
51
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
2.5
2.5.1
Electrical Considerations
Power Supply Considerations
CAUTION
The external 12-19 V DC jack is the primary power input connector of Intel NUC Board
D54250WYB and Intel NUC Board D34010WYB. However, the board also provides an
internal 1 x 2 power connector that can be used in custom-developed systems that
have an internal power supply. The internal 1 x 2 power connector is a Molex 5566-2
header which accepts a Molex 5557-02R connector from the power supply.
There is no isolation circuitry between the external 12-19 V DC jack and the internal
1 x 2 power connector. It is the system integrator’s responsibility to ensure no more
than one power supply unit is or can be attached to the board at any time and to
ensure the external 12-19 V DC jack is covered if the internal 1 x 2 power connector is
to be used. Simultaneous connection of both external and internal power supply units
could result in potential damage to the board, power supplies, or other hardware.
System power requirements will depend on actual system configurations chosen by the
integrator, as well as end user expansion preferences. It is the system integrator’s
responsibility to ensure an appropriate power budget for the system configuration is
properly assessed based on the system-level components chosen.
•
•
52
The back panel input range is 12-19 V DC
The internal power connector input range is 12-24 V DC
Technical Reference
2.5.2
Fan Header Current Capability
Table 23 lists the current capability of the fan headers.
Table 23. Fan Header Current Capability
2.6
Fan Header
Maximum Available Current
Processor fan
.25 A
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 50 oC at the processor fan
inlet is a requirement.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the system integrator. Intel makes no warranties or
representations that merely following the instructions presented in this document will
result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in shorter than expected product lifetime.
53
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
Figure 15 shows the locations of the localized high temperature zones.
Item
Description
A
B
Processor voltage regulator area
Thermal solution
Figure 18. Localized High Temperature Zones
54
Technical Reference
Table 24 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 24. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 25. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.
Table 25. Tcontrol Values for Components
Component
Tcontrol
Processor
For processor case temperature, see processor datasheets and
processor specification updates
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 18
55
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332
Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate
repair rates and spare parts requirements. The MTBF for Intel NUC Board D54250WYB
and Intel NUC Board D34010WYB is 66,640 hours.
2.8
Environmental
Table 26 lists the environmental specifications for the board.
Table 26. Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-40 °C to +60 °C
Operating
0 °C to +50 °C
The operating temperature of the board may be determined by measuring the
air temperature from the junction of the heatsink fins and fan, next to the
attachment screw, in a closed chassis, while the system is in operation.
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/s²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.
56
3
Overview of BIOS Features
3.1
Introduction
The board uses a Intel Visual BIOS that is stored in the Serial Peripheral Interface
Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI
Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration
utility, LAN EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as WYLPT10H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The Visual BIOS Setup program can be used to view and change the BIOS settings for
the computer. The BIOS Setup program is accessed by pressing the <F2> key after
the Power-On Self-Test (POST) memory test begins and before the operating system
boot begins.
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 49 shows how to put the board in configure mode.
57
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb (8192 KB)
flash memory device.
3.3
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The MIF
database defines the data and provides the method for accessing this information. The
BIOS enables applications such as third-party management software to use SMBIOS.
The BIOS stores and reports the following SMBIOS information:
•
•
•
•
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
3.4
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system’s
USB drivers are not yet available. Legacy USB support is used to access the BIOS
Setup program, and to install an operating system that supports USB. By default,
Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards
and mice are recognized and may be used to configure the operating system.
(Keyboards and mice are not recognized during this period if Legacy USB support
was set to Disabled in the BIOS Setup program.)
58
Overview of BIOS Features
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel® Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
3.5
BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
•
•
•
Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Intel® F7 switch during POST allows a user to select where the BIOS .bio file is
located and perform the update from that location/device. Similar to performing a
BIOS Recovery without removing the BIOS configuration jumper.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about
Refer to
BIOS update utilities
http://support.intel.com/support/motherboards/desktop/sb
/CS-034499.htm
3.5.1
Language Support
The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for support.
59
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
3.5.2
Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
Refer to
For information about
Intel Integrator Toolkit
http://developer.intel.com/design/motherbd/software/itk/
Additional Intel® software tools
http://developer.intel.com/design/motherbd/software.htm
3.6
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 27 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need to
be made bootable.
Table 27. Acceptable Drives/Media Types for BIOS Recovery
Media Type (Note)
Can be used for BIOS recovery?
Hard disk drive (connected to SATA or USB)
Yes
CD/DVD drive (connected to SATA or USB)
Yes
USB flash drive
Yes
USB diskette drive (with a 1.4 MB diskette)
No (BIOS update file is bigger than 1.4 MB size limit)
NOTE
Supported file systems for BIOS recovery:
•
•
•
•
•
60
NTFS (sparse, compressed, or encrypted files are not supported)
FAT32
FAT16
FAT12
ISO 9660
For information about
Refer to
BIOS recovery
http://www.intel.com/support/motherboards/desktop/sb/cs-034524.htm
Overview of BIOS Features
3.7
Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.7.1
Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.7.2
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
•
•
•
Video adapter
Keyboard
Mouse
3.7.3
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 28 lists the boot device menu
options.
Table 28. Boot Device Menu Options
Boot Device Menu Function Keys
Description
<↑> or <↓>
Selects a default boot device
<Enter>
Exits the menu, and boots from the selected device
<Esc>
Exits the menu and boots according to the boot priority
defined through BIOS setup
61
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
3.7.4
Power Button Menu
As an alternative to Back-to-BIOS Mode or normal POST Hotkeys, the user can use the
power button to access a menu. The Power Button Menu is accessible via the following
sequence:
1. System is in S4/S5 (Not G3)
2. User pushes the power button and holds it down
3. The system will emit three short beeps from the PC speaker, then stop to signal the
user to release the power button
4. User releases the power button before the 4-second shutdown override
If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD
where possible.
At the point where Setup Entry/Boot would be in the normal boot path, the BIOS will
display the following prompt and wait for a keystroke:
[ESC] Normal Boot
[F2]
Intel Visual BIOS
[F3]
Disable Fast Boot
[F4]
BIOS Recovery
[F7]
Update BIOS
[F9]
Remote Assistance
[F10] Enter Boot Menu
[F12] Network Boot
[F2] Enter Setup is displayed instead if Visual BIOS is not supported.
[F3] Disable Fast Boot is only displayed if at least one Fast Boot optimization is
enabled.
[F9] Remote Assistance is only displayed if Remote Assistance is supported.
If an unrecognized key is hit, then the BIOS will beep and wait for another keystroke.
If one of the listed hotkeys is hit, the BIOS will follow the indicated boot path.
Password requirements must still be honored.
If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and
reset the system.
62
Overview of BIOS Features
3.8
Hard Disk Drive Password Security Feature
The Hard Disk Drive Password Security feature blocks read and write accesses to the
hard disk drive until the correct password is given. Hard Disk Drive Passwords are set
in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3
resume, the system BIOS will automatically unlock drives on resume from S3. Valid
password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in
length.
The User hard disk drive password, when installed, will be required upon each powercycle until the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The
Master Key hard disk drive password exists as an unlock override in the event that the
User hard disk drive password is forgotten. Only the installation of the User hard disk
drive password will cause a hard disk to be locked upon a system power-cycle.
Table 29 shows the effects of setting the Hard Disk Drive Passwords.
Table 29. Master Key and User Hard Drive Password Functions
Password Set
Password During Boot
Neither
None
Master only
None
User only
User only
Master and User Set
Master or User
During every POST, if a User hard disk drive password is set, POST execution will
pause with the following prompt to force the user to enter the Master Key or User hard
disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system
will continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the
above prompt. The user will have three attempts to correctly enter the hard disk drive
password. After the third unsuccessful hard disk drive password attempt, the system
will halt with the message:
Hard Disk Drive Password Entry Error
A manual power cycle will be required to resume system operation.
NOTE
As implemented on Intel NUC Board D54250WYB and Intel NUC Board D34010WYB,
Hard Disk Drive Password Security is only supported on either SATA port 0 (mSATA) or
SATA Port 1 (onboard SATA connector). The passwords are stored on the hard disk
drive so if the drive is relocated to another computer that does not support Hard Disk
Drive Password Security feature, the drive will not be accessible.
63
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB
Technical Product Specification
3.9
BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
•
•
•
•
•
•
•
•
The supervisor password gives unrestricted access to view and change all the Setup
options in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user
passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
To clear a set password, enter a blank password after entering the existing
password.
Table 30 shows the effects of setting the supervisor password and user password. This
table is for reference only and is not displayed on the screen.
Table 30. Supervisor and User Password Functions
Password
During
Boot
None
None
None
Can change a
limited
number of
options
Supervisor Password
Supervisor
None
N/A
Can change all
options
Enter Password
Clear User Password
User
User
Can change all
options
Can change a
limited
number of
options
Supervisor Password
Enter Password
Supervisor or
user
Supervisor or
user
Supervisor
Mode
User Mode
Neither
Can change all
options (Note)
Can change all
options (Note)
Supervisor
only
Can change all
options
User only
Supervisor
and user set
Note:
64
Setup Options
Password
to Enter
Setup
Password
Set
If no password is set, any user can change all Setup options.
4
Error Messages and Blink Codes
4.1
Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 31).
Table 31. Front-panel Power LED Blink Codes
Type
Pattern
Note
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error
(Note)
On-off (1.0 second each) two times, then
2.5-second pause (off), entire pattern repeats
(blink and pause) until the system is powered
off.
Memory error
On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
Thermal trip warning
Each beep will be accompanied by the following
blink pattern: .25 seconds on, .25 seconds off,
.25 seconds on, .25 seconds off. This will result
in a total of 16 blinks.
When no VGA option ROM is
found.
Note: Disabled per default BIOS setup option.
4.2
BIOS Error Messages
Table 32 lists the error messages and provides a brief description of each.
Table 32. BIOS Error Messages
Error Message
Explanation
CMOS Battery Low
The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.
Memory Size Decreased
Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available
System did not find a device to boot.
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Technical Product Specification
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5
Regulatory Compliance and Battery
Disposal Information
5.1
Regulatory Compliance
This section contains the following regulatory compliance information for Intel NUC
Board D54250WYB and Intel NUC Board D34010WYB:
•
•
•
•
•
5.1.1
Safety standards
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) standards
Product certification markings
Safety Standards
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB comply with the safety
standards stated in Table 33 when correctly installed in a compatible host system.
Table 33. Safety Standards
Standard
Title
CSA/UL 60950-1
Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1
Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
IEC 60950-1
Information Technology Equipment – Safety - Part 1: General
Requirements (International)
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5.1.2
European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the products Intel®
NUC Board D54250WYB and Intel® NUC Board D34010WYB are in conformity with all
applicable essential requirements necessary for CE marking, following the provisions of
the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low
Voltage Directive), and 2011/65/EU (ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC,
2006/95/EC, and 2011/65/EU.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.
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Regulatory Compliance and Battery Disposal Information
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,
2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.
5.1.3
EMC Regulations
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB comply with the EMC
regulations stated in Table 34 when correctly installed in a compatible host system.
Table 34. EMC Regulations
Regulation
Title
FCC 47 CFR Part 15,
Subpart B
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
ICES-003
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022
Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024
Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22
Limits and methods of measurement of Radio Disturbance Characteristics
of Information Technology Equipment. (International)
CISPR 24
Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurement. (International)
VCCI V-3, V-4
Voluntary Control for Interference by Information Technology Equipment.
(Japan)
KN-22, KN-24
Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438
Bureau of Standards, Metrology, and Inspection (Taiwan)
FCC Declaration of Conformity
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686
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This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.
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Regulatory Compliance and Battery Disposal Information
Japan VCCI Statement
Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.
Korea Class B Statement
Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas.
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5.1.4
e-Standby and ErP Compliance
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB meet the following
program requirements in an adequate system configuration, including appropriate
selection of an efficient power supply:
•
•
•
72
EPEAT*
Korea e-Standby
European Union Energy-related Products Directive 2013 (ErP) Lot 6
For information about
Refer to
Electronic Product Environmental Assessment Tool (EPEAT)
http://www.epeat.net/
Korea e-Standby Program
http://www.kemco.or.kr/new_eng/pg02
/pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP)
http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm
Regulatory Compliance and Battery Disposal Information
5.1.5
Regulatory Compliance Marks (Board Level)
Intel NUC Board D54250WYB and Intel NUC Board D34010WYB have the regulatory
compliance marks shown in Table 35.
Table 35. Regulatory Compliance Marks
Description
Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel NUC: E210882.
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to the European Union (EU) EMC directive,
Low Voltage directive, and RoHS directive.
For CE Mark-Related Questions:
Intel Corporation
Attn: Corporate Quality
2200 Mission College Blvd.
Santa Clara, CA 95054-1549
USA
Australian Communications Authority (ACA) and New Zealand Radio
Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel
supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
Korea Certification mark. Includes an adjacent MSIP (Ministry of Science,
ICT & Future Planning) certification number:
MSIP-REM-CPU-D54250WYB and MSIP-REM-CPU -D34010WYB.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
V-0
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel NUC and associated collateral. The color of the
mark may vary depending upon the application. The Environmental Friendly
Usage Period (EFUP) for Intel NUC has been determined to be 10 years.
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5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør
om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse
med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des
Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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Regulatory Compliance and Battery Disposal Information
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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