User manual | View detail for AVR32102: Using the 32

AVR32102: Using the AVR32 SDRAM controller
Features
• Several types of SDRAMs supported
- 2K, 4K or 8K row address memory parts
- SDRAM with two or four internal banks
- SDRAM 16 or 32 bit data path
- CAS latency of 1,2 or 3 cycles supported
• Ease of use
- Automatic refresh operation, programmable
- Seamless access when configured
• Software configurable
- Timing parameters
- Initialization
32-bit
Microcontrollers
Application Note
1 Introduction
The AVR®32 has a dedicated SDRAM (Synchronous DRAM) controller. This
controller is highly flexible and capable of supporting a series of external SDRAMs.
Timing values and parameters are calculated from the SDRAMs datasheet and
programmed into the SDRAM controller. This is also true for various types of
access with respect to read and write operations. When the controller is correctly
instantiated, the external SDRAM can then be accessed as a normal memory
mapped device. The controller provides a seamless and transparent interface to a
memory mapped SDRAM device.
Rev. 32013A-AVR-05/06
2 SDRAM Controller features
Several features are available in the SDRAM controller. These features can either be
setup before normal operation begins, while other features can be enabled or
disabled on the fly. The SDRAM controller is capable of either 16-bit or 32-bit data
path, and supports byte, half-word and word access. Bursts can be used for both
write and read access.
2.1 Device characteristics
A specific SDRAM device has device characteristics with respect to timing and
command sequence. These device characteristics are stored into the SDRAM
controller to control the data flow between the AVR32 and SDRAM. Once the SDRAM
device is configured, the access to the SDRAM device is seamless to the user.
2.2 Access
The SDRAM Controller is part of EBI (External Bus Interface), which is accessed
through the System Bus from the CPU core. In turn the SDRAM Controller may
connect to an external SDRAM through the PIO. A conceptual schematic of the path
is illustrated in Figure 1.
Figure 1: Conceptual schematics
AVR32
CPU
System Bus
SDRAM
Controller
PIO
EBI
SDRAM
In order to get access to the SDRAM all the parts along the path must be configured
correctly to support the specific SDRAM.
3 Theory of operation and connectivity
Several terms and expressions are used when describing and working with SDRAM.
This chapter will highlight the parts needed to configure your SDRAMC. This is by no
means an extensive description on how SDRAMs work, but a brief introduction and
description on the factors the SDRAM Controller has to take into account. For more
information about SDRAM operation, consult the datasheet for AVR32 device or
SDRAM datasheet.
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3.1 Response times
Whenever issuing a command (i.e. read/write, a bank/row/column change) a certain
delay is associated with that command. These values are dependent on the SDRAM
device chosen and can be found in the datasheet of the chosen device. The timing of
control signals is also found in the datasheet.
3.2 Physical layout & Access
A SDRAM consists of DRAM memory blocks, which are called banks. Some devices
have 2 banks, but the greater majority has 4. Each of these banks consists of a
certain number of columns and rows to uniquely identify a memory cell. This is shown
in Figure 3.1.
Figure 3.1: Generic SDRAM device
BANK 3
BANK 2
CONTROL LOGIC
BANK 1
BANK 0
Memory cell
rows
columns
The number of columns and rows available multiplied by the number of banks (4) give
the total memory size of the SDRAM. The address will consist of different parts for
accessing a specific row and column within a bank. This configuration is similar for
different sizes of SDRAM. An example is found in Table 1.
Table 1: SDRAM Configuration Mapping: 2048 rows, 4 banks
CPU Address Line
25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
BA[1:0] Row[10:0]
BA[1:0] Row[10:0]
BA[1:0] Row[10:0]
BA[1:0] Row[10:0]
8
7
6
Column[7:0]
Column[8:0]
Column[9:0]
Column[10:0]
5
4
3
2
1
0
NBS[1:0]
NBS[1:0]
NBS[1:0]
NBS[1:0]
Table 1 shows how the address lines (relative from the offset) are connected and how
they are used in the SDRAM. The mapping shows how signals are used in a 8MB
SDRAM.
A SDRAM may then be connected straightly to EBI interface as shown in Figure 3.2.
Keep in mind that the Parallel I/O controller must be configured to gain access to the
pins through the SDRAM Controller.
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Figure 3.2: SDRAM connection
AVR32
SDRAM
SDRAMC
SDRAMC
User interface
SDCK
CLK
SDCKE
CKE
SDCS
CS
BA[1:0]
BA[1:0]
RAS
RAS
CAS
CAS
SDWE
WE
NBS[1:0]
NBS[1:0]
SDRAMC_A[12:0]
A[12:0]
D[31:0]
D[31:0]
PIO
PB
Figure 3.3: SDRAM connectivity
Instead of using a single SDRAM, multiple SDRAMs can be connected together to the
SDRAMC to increase the amount of SDRAM available to the system. One possible
solution is shown in Figure 3.4.
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Figure 3.4: 2MB x 4 schematics
32
2M x 8
SDRAM
D[7..0]
D[31..0]
2M x 8
SDRAM
D[7..0]
RAS
CLK
CAS
WE
D[7..0]
D[15..8]
CS
CS
CLK
WE
SDCK
RAS
A[11]..A[9..0]
RAS
SDCKE
CAS
A10
CAS
A10
DOM
BA[1..0]
DOM
BA[1..0]
SDWE
NBS[3..0]
9
NBS0
NBS1
A[11]..A[9..0]
9
SDRAM
Controller
A[12..0]
2M x 8
SDRAM
BA[1..0]
2M x 8
SDRAM
D[7..0]
D[23..16]
D[7..0]
D[31..24]
CS
CS
CLK
SDCS
CLK
WE
NBS2
9
WE
RAS
A[11]..A[9..0]
RAS
CAS
A10
CAS
A10
DOM
BA[1..0]
DOM
BA[1..0]
NBS3
A[11]..A[9..0]
9
12
Figure 3.4 shows how 4 identical SDRAMs are connected in series. The 4 2MB
SDRAMs provide a seamless 8MB memory segment. When creating such a series, it
is of the uttermost importance that the timing parameters are compatible for all the
SDRAMs.
Most SDRAM has burst support as well. It is very common for a sequential read to be
referred to as burst read with length one. Variants of bursts like sequential and
interleaved bursts may also be available. These access types are usually written to
the SDRAM Mode Register. Consult the SDRAM documentation for a list of features
that your device supports. Chapter 4.3.1 describes how to issue these commands
from the AVR32 to the SDRAM.
3.3 Data maintenance
As SDRAM consists of blocks of DRAM, the data must be refreshed at intervals to
maintain the data integrity. This interval is specified in the datasheet for the selected
SDRAM device. If the data is not refreshed at a regular interval, the data may become
of an unknown state.
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4 SDRAM controller
The SDRAM controller must be configured to match the timing characteristics of the
specified device before usage. This chapter covers this configuration.
4.1 Initialization
After a reset, the AVR32 is not configured to access an external SDRAM device. The
sequence for initializing the SDRAM controller after a successful reset will be as
follows:
• Setup the HMATRIX to enable SDRAMC.
• Initialize the SDRAMC and timing characteristics for your specific device
• Configure your parallel input/output Controller (PIO Controller)
4.2 HMATRIX
The SDRAM is connected to the EBI. The HMATRIX is the AHB Bus Matrix that
connects every controller on the bus to the AVR32 CPU. The SDRAMC is not
selected by default, but it will have to be enabled. This is done by setting one of the
special function registers for your device. The registers are named sfrX and are found
in the HMATRIX module.
4.3 SDRAM registers and user interface
To specify the access type and timings for the SDRAM, the SDRAMC registers are
used. The registers listed here must be configured to make sure your SDRAM will
work correctly. There are other registers as well; for more information about these
register and more in depth description concerning the registers described in this
section, consult your AVR32 datasheet.
4.3.1 SDRAMC_MR: Mode Register
The value SDRAMC_MR defines the command issued when the SDRAM is
accessed. This is written directly to the mode register. This is a 3 bit value with the
following commands available:
Table 2: SDRAM commands
Mode
Description
6
0
0
0
Normal access
0
1
1
Issues a NOP-command regardless of cycle
0
1
0
All Banks Precharge regardless of cycle
0
0
1
Load Mode Register. Whenever this mode is selected, the access to "SDRAMBase +offset" address will write the value "offset" to the SDRAM device Mode
register.
1
0
0
An Auto-Refresh command. An "All Banks Precharge" must be issued previous to
this command.
1
0
1
Extended Load Mode Register. This is equivalent to "Load Mode Register".
1
1
0
Deep power-down mode
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4.3.2 SDRAMC_TR: Refresh Timer Register
The Refresh Timer Register (SDRAMC_TR) contains the number of clock cycles
(period) of the refresh pulse. This value is dependent on Master Clock Frequency, the
refresh rate of the SDRAM device and the refresh burst length. 15,6 μs per row is a
typical value for a burst length of one. This is 12-bit value that reflects which has
denomination in clock cycles.
4.3.3 SDRAMC_CR: Control Register
The Configuration Register (SDRAM_CR) contains information about timing and
physical characteristics of the selected SDRAM-device:
Table 2: SDRAMC Control Register
Bit / bitfield
Description
NC
Number of columns
NR
Number of rows
NB
Number of banks
CAS
CAS latency
DBW
Data bus width
TWR
Write recovery delay. The write recovery delay in clock cycles
TRC
Row cycle delay. The delay between a Refresh and an Activate Command in
cycles.
TRCD
Row to column delay. The number of cycles between a Precharge Command
and a tailing Command.
TRAS
Active to Precharge delay. This field contains the delay (in clock cycles)
between an Activate Command and a Read/Write Command.
TXSR
Exit Self Refresh to Active Delay. The number of clock cycles between SCKE
high and Activate Command is defined as TXSR.
Please note that all these fields have a default reset value that may or may not
correspond to your SDRAM. These values can either be found, or calculated from,
the SDRAM manufacturer's datasheet.
4.3.4 SDRAMC_HSR: High Speed Register
The High Speed Register contains a single bit, DA, which enables or disables
decoding of cycles.
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4.3.5 SDRAMC_LPR: Low Power Register
The Low Power Register enables low power features to be applied to the SDRAM
device.
Table 3: Low Power Register
Bitfield
Size
Description
Only low-power SDRAM
LPCB
2
Low Power configuration bits
PASR
3
Partial Array Self-refresh. Used during
initialization to specify whether only
one quarter, one half quarter or all
banks is to be enabled. Disabled
banks are not refreshed
*
TCSR
2
Temperature Compensated Selfrefresh. Used during initialization to
set the refresh timer interval according
to temperature. Consult your SDRAM
datasheet for more information
*
DS
2
Drive Strength. Check your SDRAM
device specification.
*
TIMEOUT
2
Define when low-power mode is
enabled
The LPCB may be configured in one out of 4 ways:
• 00: Low Power Features inhibited.
• 01: Issues a Self Refresh Command to the SDRAM device. SDCLK is deactivated
and SDCKE is set low. The SDRAM device is always in Self-refresh mode while
not accessed.
• 10: Issues a Power-down Command to the SDRAM device. SDCKE is set low. The
SDRAM device is always in Power-down mode while not accessed.
• 11: Issues a Deep Power-down mode to the SDRAM device. Unique to low-power
SDRAMs.
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The TIMEOUT bitfield defines when low-power mode is enabled and may have one of
the following values:
•
•
•
•
00: Activate low-power mode immediately after the end of the last transfer.
01: Activate low-power mode 64 clock cycles after the last transfer.
10: Activate low-power mode 128 clock cycles after the last transfer.
11: Reserved.
4.3.6 Interrupt registers
All interrupt registers have one bit that enables the actual feature (high) or disables it
(low).
Table 4: SDRAMC interrupt registers
Register
Description
SDRAMC_IER
Interrupt Enable Register. Enables refresh error interrupt.
SDRAMC_IDR
Interrupt Disable Register. Disables the refresh error interrupt.
SDRAMC_IMR
Interrupt Mask Register. Mask the refresh error interrupt or not.
SDRAMC_ISR
Interrupt Status Register. Is read as true if a refresh error interrupt has
occurred since this register was last read.
4.3.7 SDRAMC_MDR: Memory Device Register
In the Memory Device Register it is specified the type of SDRAM used. It has a single
bitfield, MD, which specifies the type and is 2 bits long. The bitfield Memory Device
Type (MD) can have one of the following values:
•
•
•
•
00: SDRAM
01: Low-power SDRAM
10: Reserved
11: Reserved
4.4 EBI and PIO
The SDRAMC is part of the EBI interface. To get the EBI interface out on the I/O-pins,
the correct module must be set for the PIO controller. This is done by activating the
appropriate module for the PIO port.
4.5 Usage
When the SDRAM controller is correctly initialized, the physical lines are connected
and the correct module has control over the PIO lines, the SDRAM is ready to go.
The EBI interface have it's own dedicated memory space. All devices connected to
the AVR32 through the EBI can thus be memory-mapped. The appropriate base
address for the EBI can be found in the datasheet. All access to the memory area that
covers the SDRAM is then transparent.
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5 Package information
Included with the application note is a driver package. This package contains drivers,
example code and documentation.
5.1 Drivers
Drivers are available in the package. These drivers are written to be independent of a
specific compiler and are successfully tested on GCC (GNU Compiler Collection) and
IAR Embedded Workbench®. This example is for the SDRAM found on the STK1000.
5.2 Examples
Examples are available from the corresponding driver package. All functionality is
divided into libraries and an example that utilizes the library.
5.3 Documentation
Function specific documentation is available in the package. Refer to readme.html.
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