PREPARED BY: DATE SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION U SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC MODEL No. QM2A1UB029 □ CUSTOMER’S APPROVAL DATE U PRESENTED BY U BY U Development Department Ⅰ System Device Division Electronic Components and Devices Group SHARP CORPORATION PAGE 2/22 MODEL No. SPEC No. QM2A1UB029 DOC. FIRST ISSUE RECORD OF REVISION Dec. 4, 2012 IDENT. DATA No. REF. PAGE DATE PARAGRAPH REVISED CHECK No. SUMMARY DRAWING No. Dec. 4, 2012 & APPROVAL FIRST ISSUE PAGE 3/22 Product name : 5GHz Wireless LAN Front-End IC Model No. QM2A1UB029 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) Please do verify the validity of this part after assembling it in customer’s products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2) This product is designed for use in the following application areas ; • OA equipment • Audio visual equipment • Home appliances • Telecommunication equipment (Terminal) • Measuring equipment • Tooling machines • Computers If the use of the product in the above application areas is for equipment listed in paragraphs (3) or (4), please be sure to observe the precautions given in those respective paragraphs. (3) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; • Transportation control and safety equipment (aircraft, train, automobile etc.) • Traffic signals • Gas leakage sensor breakers • Rescue and security equipment • Other safety equipment (4) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; • Space equipment • Telecommunication equipment (for trunk lines) • Nuclear power control equipment • Medical equipment (5) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. PAGE 4/22 CONTENTS Page 1. Description 5 2. Pin Out and Assignment 6 3. Absolute Maximum Ratings 7 4. Electrical Characteristics 8 5. Application Information 9 6. Package and packing specification 11 MODEL No. QM2A1UB029 PAGE 5/22 SPEC No. 1. Description 1-1 Functions The QM2A1UB029 is an integrated Front-end IC in a small and low profile 2.5mmx2.5mmx0.4mm package for 5GHz Band WLAN systems. The QM2A1UB029 integrates three-stage Power Amplifier with a power detector, LNA and SPDT switch with all 50ΩRF ports. The IC requires minimal external components and provides minimizing PCB foot-print. Bypass RX LNA SW SW (SPDT) TX ANT PA 1-2 Features ▪ Integrates matching network, All RF ports are 50Ω ▪ Integrates the high efficiency and high linearity PA Pout=18dBm (MCS7, BW=40MHz , 64QAM) at EVM 2%, 5.15-5.9GHz, VDD=3.6V ▪ Wide dynamic range and load insensitive built-in power detector ▪ The LNA with bypass mode function which allows wide dynamic range Rx operation ▪ Lead Free / RoHS Compliant / Halogen Free 1-3 Applications ▪ W-LAN(IEEE 802.11a/n/ac) ====== Not designed or rated as radiation hardened ====== 1-4 Handle with care ▪ ESD (Electro-Static Discharge) sensitive. ▪ Gallium (Ga) and Arsenic (As) specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or powder. When the product is disposed, please follow the related regulation and do not mix this with general industrial waste or household waste. MODEL No. QM2A1UB029 SPEC No. PAGE 6/22 N.C. VDD_PA2 VDD_PA1 N.C. 2. Pin Out and Assignment 2-1 Pin Out 12 11 10 9 TOP VIEW 14 VC_RX 15 LAN_ON 16 029 YMX SB 1 2 3 8 TX 7 N.C. 6 PA_ON 5 VDET 4 VDD_LNA N.C. N.C. 13 RX ANT N.C. (contact pins facing down) 2-2 Pin Description Pin Symbol 1 2 3 4 5 6 7 8 N.C. RX N.C. VDD_LNA VDET PA_ON N.C. TX Description Non Connection Rx Port Output Non Connection LNA Supply Voltage Detector Voltage Output PA ON/OFF Control Voltage Non Connection Tx Port Input Pin 9 10 11 12 13 14 15 16 Symbol N.C. VDD_PA1 VDD_PA2 N.C. ANT N.C. VC_RX LNA_ON Description Non Connection PA 1st&2nd Stage Supply Voltage PA 3rd Stage Supply Voltage Non Connection Antenna Port Non Connection Rx Switch Control Voltage LNA ON/OFF Control Voltage MODEL No. QM2A1UB029 PAGE 7/22 SPEC No. 3. Absolute Maximum Ratings and Recommended Operating Conditions 3-1 Absolute Maximum Ratings Applied conditions greater than those listed may cause permanent damage to the IC. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. Parameter Symbol Unit Min. Max. Note DC Supply Voltage (VDD) VDD DC Supply Current (IDD) IDD_PA V - 5 No RF Applied, Ta=25℃ mA - 300 While Tx mode, Ta=25℃ Total DC Power Dissipation PD W - 1 Ta=25℃ TX RF Input Level TX_IN dBm - 0 Ta=25℃ RX RF Input Level RX_IN dBm - 5 At ANT Port,Ta=25℃ Storage Temperature Tstg ℃ -55 +125 Operating Temperature Ta_opr ℃ -30 +85 Maximum Junction Temperature Tj_max ℃ +150 3-2 Recommended Operating Conditions Parameter Frequency DC Supply Voltage Control Voltage (High State) Control Voltage (Low State) Unit Min. Typ. Max. MHz V V V V 4900 3.2 2.95 2.8 - 3.6 3.3 3.3 0 5900 4.6 3.65 VDD 0.4 Note VDD_PA,VDD_LNA PA_ON (*1) VC_RX, LNA_ON PA_ON, VC_RX, LNA_ON (*1) with virtual resistor R2 in our evaluation board. (refer to page.9) 3-3 FEIC Control Logic Table Mode WLAN RX (Normal-mode) WLAN RX (Bypass-mode) WLAN TX VC_RX LNA_ON PA_ON High High Low High Low Low Low Low High MODEL No. QM2A1UB029 PAGE 8/22 SPEC No. 4. Electrical Characteristics These specifications are obtained with the evaluation board shown in Page 10 Test conditions are Ta = 25 °C, Source impedance: ZS = 50, load impedance: ZL = 50 , unless otherwise noted. Common Parameters Ta=25℃,VDD_PA=VDD_LNA=3.6V, PA_ON=LNA_ON=VC_RX=0V, no RF input Parameter Stand-by Leakage Current Symbol ILEAK Condition Measured on VDD leakage current Min. Typ. Max Unit - - 20 μA Tx Parameters Ta=25℃,Freq=5.15-5.9GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=3.3V, LNA_ON=VC_RX=0V, unless otherwise noted. Parameter Power Gain Symbol GAIN_TX PA Supply Current IDD_PA PA Control Current IPA_ON Error Vector Magnitude Power Detector Voltage Output Condition Min. Pout=18dBm , 802.11ac, MCS7, 64QAM, BW=40MHz EVM VDET_DC VDET Typ. Max Unit 28 dB 180 mA 4 mA 2 % No RF 0.2 V Pout=18dBm, CW 0.75 V Pout=20dBm, 6Mbps, OFDM -35 dBm/MHz nd 2fo rd 3fo -50 dBm/MHz RL_TX 12 dB RL_ANT 12 dB 2 Harmonic 3 Harmonic Return Loss TX Input port ANT port Ta=25℃,Freq=4.9-5.15GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=3.3V, LNA_ON=VC_RX=0V, unless otherwise noted. Parameter Power Gain Error Vector Magnitude(*1) Symbol Condition Min. GAIN_TX EVM Pout=15dBm , 802.11ac, MCS7, 64QAM, BW=40MHz Typ. Max Unit 28 dB 2.0 % RX Parameters Ta=25℃,Freq=4.9-5.9GHz, VDD_LNA=3.6V, LNA_ON=3.3V,VC_RX=3.3V, PA_ON=0V, unless otherwise noted. Parameter Symbol Normal-mode Gain GAIN_Rx Bypass-mode Gain GAIN_BP Noise Figure NF Input IP3 Normal-mode Typ. Max Unit 13 dB LNA_ON=0V -7 dB (Includes the SW loss before LNA) 2.5 dB 7 dBm LNA_ON=0V 18 dBm Measured on VDD_LNA 8.5 mA IIP3_NORM Bypass-mode IIP3_BP IDD_LNA LNA Control Current Min. The tone separation= 100kHz, Pin=-20dBm LNA Supply Current Rx Control Current Condition IC_RX Measured on VC_RX - 6 μA ILNA_ON Measured on LNA_EN - 6 μA Return Loss RX output port RL_RX 7 dB ANT port RL_ANT 8 dB MODEL No. QM2A1UB029 PAGE 9/22 SPEC No. 5. Application Information 5-1 Typical Evaluation Circuit VDD_LNA RX C3 （ 4 2 1 5 R1 3 LNA_ON 16 VDET ） 15 （ 6 ） PA_ON LNA VC_RX 14 7 R2 SPDT 13 TX 8 PA 9 10 11 ANT 12 NC VDD_PA C2 C1 Figure 1. Schematic of Evaluation Circuit Table 1. Parts List of Evaluation Circuit Symbol Value Vendor Part Number C1 1 uF Murata C2 None - C3 1 uF Murata GRM155F11C105Z R1(*2) 27k ohm ROHM MCR01 MRTJ273 R2 (*2) 24 ohm ROHM MCR01 MRTJ240 GRM155F11C105Z - (*2)These resistors do not need in the real circuit because they are put to simulate the output series resistor and input impedance of the chip set. MODEL No. QM2A1UB029 Evaluation Board 029 C3 R1 1pin index R2 ● 5-2 PAGE 10/22 SPEC No. C1 C2 Figure 2. Pattern Layout of Evaluation Circuit Material: FR4 (ε=4.7） SR Cu PP Unit: um 20 18 200 Cu 35 Core 400 Cu PP 35 200 Cu SR 18 20 MODEL No. QM2A1UB029 PAGE 11/22 SPEC No. 6. Package and packing specification 6-1 Storage Conditions 6-1-1 Storage conditions required before opening the dry packing • Normal temperature : 5 ~ 40 °C • Normal humidity : 80 % ( Relative humidity ) or less • Storage period : One year or less * " Humidity " means " Relative humidity " 6-1-2 Storage conditions required after opening the dry packing In order to prevent moisture absorption after opening, ensure the following storage conditions apply: (1) Storage conditions for one-time soldering ( Convection reflow**, IR / Convection reflow** ) • Temperature : 5 ~ 25 °C • Humidity : 60 % or less • Period : 96 hours or less after opening (2) Storage conditions for two-time soldering ( Convection reflow**, IR / Convection reflow** ) a. Storage conditions following opening and prior to performing the 1st reflow • Temperature : 5 ~ 25 °C • Humidity : 60 % or less • Period : 96 hours or less after opening b. Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow • Temperature : 5 ~ 25 °C • Humidity : 60 % or less • Period : 96 hours or less after completion of the 1st reflow ** : Air or nitrogen environment 6-1-3 Temporary storage after opening To re-store the devices before soldering, do so only once and use a dry box or place desiccant ( with a blue humidity indicator ) with the devices and perform dry packing again using heat-sealing. The storage period, temperature and humidity must be as follows : (1) Storage temperature and humidity First opening X1 Re-sealing Ｙ Re-opening X2 Mounting Temperature : 5 ~ 40 °C Temperature : 5 ~ 25 °C Temperature : 5 ~ 40 °C Temperature : 5 ~ 25 °C Humidity : 80 % or less *** Humidity : 60 % or less Humidity : 80 % or less *** Humidity : 60 % or less ***：External atmosphere temperature and humidity of the dry packing (2) Storage period • X1＋X2 ׃ •Y ׃ Refer to Section 6-1-2 (1) and (2) a , depending on the mounting method. Two weeks or less MODEL No. QM2A1UB029 SPEC No. 6-2 Baking Condition (1) Situations requiring baking before mounting • Storage conditions exceed the limits specified in Section 6-1-2 or 6-1-3. • Humidity indicator in the desiccant was already red ( pink ) when opened. ( Also for re-opening.) (2) Recommended baking conditions • Baking temperature and period : 120 + 10 / -0 °C for 2 ~ 3 hours • The above baking conditions do not apply since the embossed carrier tape is not heat-resistant. Replace the devices on heat-resistant carrier. (3) Storage after baking • After baking, store the devices in the environment specified in Section 6-1-2 and mount immediately. 6-3 Surface Mount Conditions The following soldering conditions are recommended to ensure device quality. 6-3-1 Soldering (1) Convection reflow or IR/Convection reflow ( one-time soldering or two-time soldering in air or nitrogen environment ) • Temperature and period : A) Peak temperature 260℃ max B) Heating temperature 40 to 60 seconds as 230℃ C) Preheat temperature It is 150 to 200℃, and is 120±30 seconds D) Temperature increase rate It is 1 to 3℃/seconds • Measuring point : IC package surface • Temperature profile : A IC package surface temperature B C D Time PAGE 12/22 MODEL No. QM2A1UB029 SPEC No. PAGE 13/22 6-4 Condition for removal of residual flux (1) Ultrasonic washing power : 25 watts / liter or less (2) Washing time : Total 1 minute or less (3) Solvent temperature : 15 ~ 40 °C 6-5 Package outline specification 6-5-1 Package outline Refer to the attached drawing. 6-5-2 LEAD FINISH or BALL TYPE LEAD FREE TYPE ( Ni / Pd / Au ) 6-6. Markings 6-6-1 Marking details ( The information on the package should be given as follows. ) (1) Product name : 029 (2) Date code : YMX Y → Denotes the production year. (Last one digit of the year.) M → Denotes the production month.（1・2・～・8・9・0・N・D） X → Denotes the production ref. code (1 digit). (3) Company name : S (4) Factory Code : (1 digit, Example “B”) 6-6-2 Marking layout The layout is shown in the attached drawing. (The layout does not specify the size of the marking character and marking position.) 029 YMX SB MODEL No. QM2A1UB029 SPEC No. PAGE 14/22 Package specifications TOP VIEW 2.5 2.5 029 YMX SB S … Brand name “S” B … Factory code Pin 1 indicator 0.4 1.7 1.7 UNIT : mm Pin 1 indicator NOTE : LEAD FREE product. LEAD FINISH : Ni/Pd/Au PLATING LEAD MATERIAL : Cu Alloy 0.2 0.25 0.5 BOTTOM VIEW MODEL No. QM2A1UB029 SPEC No. PAGE 15/22 6-7 Packing specifications ( Embossed carrier tape specifications ) This standard applies to the embossed carrier tape specifications for ICs supplied by SHARP CORPORATION. SHARP’s embossed carrier tape specifications are generally based on those described in JIS C 0806 ( Japanese Industrial Standard ) and EIA481A. 6-7-1 Tape structure The embossed carrier tape is made of conductive plastic. The embossed portions of the carrier tape are filled with IC packages and a top covering tape is used to enclose them. 6-7-2 Taping reel and embossed carrier tape size For the taping reel and embossed carrier tape sizes, refer to the attached drawing. 6-7-3 IC package enclosure direction in embossed carrier tape The IC package enclosure direction in the embossed portion relative to the direction in which the tape is pulled is indicated by an index mark on the package ( indicating the No. 1 pin ) shown in the attached drawing. 6-7-4 Missing IC packages in embossed carrier tape The number of missing IC packages in the embossed carrier tape per reel should not exceed either 1 or 0.1 % of the total contained on the tape per reel, whichever is larger. There should never be more than two consecutive missing IC packages. 6-7-5 Tape joints There is no joint in an embossed carrier tape. 6-7-6 Peeling strength of the top covering tape Peeling strength must meet the following conditions. (1) Peeling angle : 165 ~ 180 ° (2) Peeling speed : 300 mm / min (3) Peeling strength : 0.2 ~ 0.7 Ｎ ( 20 ~ 70 gf ) Top covering tape 165 ~ 180° Peeling direction Pull-out direction Embossed carrier tape MODEL No. QM2A1UB029 PAGE 16/22 SPEC No. 6-7-7 Packing (1) The top covering tape ( leader side ) at the leading edge of the embossed carrier tape, and the trailing edge of the embossed carrier tape, should both be held in place with paper adhesive tape at least 30 mm in length. (2) The leading and trailing edges of the embossed carrier tape should be left empty ( with embossed portions not filled with IC packages ) in the attached drawing. (3) The number of IC packages enclosed in the embossed carrier tape per reel should generally comply with the list given below. Number of IC Packages / Reel Number of IC Packages / Inner carton Number of IC Packages / Outer carton 5,000 devices / Reel 5,000devices / Inner carton 25,000 devices / Outer carton 6-7-8 Indications The following should be indicated on the taping reel and the packing carton. • Part Number ( Product Name ) • Storage Quantity • Packed Date • Manufacture’s Name ( SHARP ) Note : The IC taping direction is indicated by " EL " suffixed to the part number. EL : Equivalent to " L " of the JIS C 0806 standard. 6-7-9 Protection during transportation The IC packages should have no deformation and deterioration of their electrical characteristics resulting from transportation. 6-8 Precautions for use (1) Opening must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment. (2) The devices should be mounted within one year of the date of delivery. 6-9 Chemical substance information in the product Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by Electronic Information Products. Names and Contents of the Toxic and Hazardous Substances or Elements in the Product Lead ( Pb ) Mercury ( Hg ) Cadmium ( Cd ) ○ ○ ○ Hexavalent Chromium ( Cr (VI) ) ○ Polybrominated Biphenyl ( PBB ) ○ Polybrominated Diphenyl Ethers ( PBDE ) ○ ○ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ / T 11363 - 2006. x : indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part exceeds the concentration limit requirement as described in SJ / T 11363 - 2006 standard. MODEL No. QM2A1UB029 SPEC No. PAGE 17/22 Product Orientation Emboss taping type (EL) The drawing direction of tape Index mark Trailer side of tape Adhesive tape (paper) 30 MIN. Carrier tape (empty enboss） 500 MIN. Leader side of tape Filled emboss with products Filled emboss with products Index mark Carrier tape (empty enboss） 500 MIN. Adhesive tape (paper) 30 MIN. Top cover tape 200 MIN. The drawing direction of tape MODEL No. QM2A1UB029 SPEC No. PAGE 18/22 Tape structure and dimensions Pocket hole for IC Hole for Taping Machine （ ） （ ） （ （ ） ） Unit: mm Symbol Size Symbol Size Symbol （ ） （ Size ◎ R1,R2,R3, and θ are reference value ） （ ） （ ） MODEL No. QM2A1UB029 SPEC No. PAGE 19/22 9.5 Reel structure and dimensions · UNIT: mm · ( ): Reference value UNIT : mm MODEL No. QM2A1UB029 SPEC No. PAGE 20/22 Inner packing appearance Reel & tape Inner label Pull-out direction Desiccant with humidity indicator Inner label Laminated aluminum bag Cushion pad Inner label Laminated aluminum bag Cushion pad Inner label Inner box MODEL No. QM2A1UB029 PAGE 21/22 SPEC No. Outer packing appearance (345) 45 ) (55) (3 Inner label Inner box 5 rows adhesivetape tape(“Ｈ”taping) Adshive ( “H” taping ) ) 65 3 ( (385) Outer label Outer box (315) UNIT: mm ( ) : Reference value MODEL No. QM2A1UB029 PAGE 22/22 SPEC No. Inner label and Outer label Inner carton label (a) LEAD FREE QM2A1UB029 (3N)1 QM2A1UB029 <QUANTITY> (b) (c) < LOT > xxxxxxxxxx xxxx QM2A1UB029/EL/ (d) YYYY.MM.DD MADE IN xxxx (f) (e) 5000 (3N)2 5000 XXXXXXXXXXXX 103120 (j) TYPE : A EIAJ C-3 <RMK> XXXXXXXXXXXXXXXXX (g) (h) (i) Outer carton label (c) (4S)PKG ID : QM2A1UB029/EL/ (e) (Q)QUANTITY : 25000 (g) MADE IN xxxx LEAD FREE XXXXXXXXXXXXXXXXXXXX (a) (k) XXXXXXXXXXXXXXXXXXXX YYYY.MM.DD XXXXXXXXXXXXXXXXXXXX (d) (P)CUST PROD ID : QM2A1UB029 XXXXXXXXXXX (f) NOTE : The « LEAD FREE » indicates this product is lead free articles. "R.C." is SHARP’s corporate logo which indicates RoHS compliant ( a ) Model No. ( b ) Quantity / PD lot / Company code ( c ) SHARP internal Model No. ( d ) Packed date ( e ) Quantity ( f ) “ SHARP ” Logo ( g ) The country of origin ( h ) Type name / Former ( i ) Assemble management No. ( j ) Assemble lot No. / Date code / Quantity ( k ) Shipment lot No.
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