Dell | PowerEdge T610 | Specifications | Dell PowerEdge T610 Specifications

Dell PowerEdge T610 Specifications
PowerEdge T610
Technical Guide
The PowerEdge
T610 server
delivers balanced
high performance,
energy efficiency
and room for
growth.
Dell
This document is for informational purposes only. Dell reserves the right to make changes without
further notice to any products herein. The content provided is as is and without express or implied
warranties of any kind.
Dell, PowerEdge, Dell OpenManage, and ReadyRails are trademarks of Dell, Inc. Citrix is a registered
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and strictly forbidden.
Revision 1
June 2011
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Table of Contents
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4
5
6
Product Comparison ........................................................................................... 7
1.1
Overview .................................................................................................. 7
1.1.1
Customer-Inspired Design ......................................................................... 7
1.1.2
Energy Efficient .................................................................................... 7
1.1.3
Enhanced Virtualization ........................................................................... 7
1.1.4
Easy to Manage ..................................................................................... 7
1.1.5
Dell Services ........................................................................................ 8
1.2
Comparison ............................................................................................... 8
Key Technologies............................................................................................. 10
2.1
Overview ................................................................................................ 10
2.2
Detailed Information .................................................................................. 10
System Overview ............................................................................................. 11
Mechanical .................................................................................................... 14
4.1
Chassis Description..................................................................................... 14
4.2
Dimensions and Weight ................................................................................ 14
4.3
Front Panel View and Features ...................................................................... 15
4.4
Back Panel View and Features ....................................................................... 16
4.5
Power Supply Indicators ............................................................................... 16
4.6
NIC Indicators ........................................................................................... 17
4.7
Internal Chassis Views ................................................................................. 17
4.8
Rails and Cable Management ......................................................................... 18
4.9
Fans ...................................................................................................... 18
4.10 LCD Control Panel ...................................................................................... 19
4.11 Security .................................................................................................. 19
4.11.1
Cover Latch ....................................................................................... 19
4.11.2
Bezel ............................................................................................... 19
4.11.3
Hard Drive ......................................................................................... 20
4.11.4
TPM ................................................................................................. 20
4.11.5
Power Off Security ............................................................................... 20
4.11.6
Intrusion Alert .................................................................................... 20
4.11.7
Secure Mode ...................................................................................... 20
4.12 USB Peripherals......................................................................................... 20
4.13 Battery ................................................................................................... 20
4.14 Field Replaceable Units (FRU)........................................................................ 20
4.15 User Accessible Jumpers, Sockets, and Connectors ............................................... 20
Power, Thermal, Acoustic .................................................................................. 21
5.1
Power Efficiencies ..................................................................................... 21
5.2
Main Power Supply ..................................................................................... 21
5.3
Power Supply Specifications .......................................................................... 22
5.4
Heat Dissipation ........................................................................................ 22
5.5
Environmental Specifications......................................................................... 23
5.6
Power Consumption Testing .......................................................................... 24
5.7
Maximum Input Amps .................................................................................. 24
5.8
Energy Smart Enablement ............................................................................ 25
5.9
ENERGY STAR Compliance ............................................................................ 25
5.10 Acoustics ................................................................................................ 25
Processors ..................................................................................................... 27
6.1
Overview ................................................................................................ 27
6.2
Features ................................................................................................. 28
6.3
Supported Processors .................................................................................. 28
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6.4
Processor Configurations ..............................................................................
6.4.1
Single Processor Configuration .................................................................
6.4.2
Processor Power Voltage Regulation Modules (EVRD 11.1) .................................
6.5
Processor Installation ..................................................................................
7
Memory ........................................................................................................
7.1
Overview ................................................................................................
7.2
DIMMs Supported .......................................................................................
7.2.1
Memory Modes ....................................................................................
7.2.2
DIMM Population Rules ..........................................................................
7.3
Speed ....................................................................................................
7.4
DIMM Slots ...............................................................................................
7.5
Low Voltage DIMMs .....................................................................................
7.6
Mirroring .................................................................................................
7.7
Sparing ...................................................................................................
7.8
Memory Scrubbing......................................................................................
7.9
Advanced ECC (Lockstep) Mode ......................................................................
7.10 Optimizer (Independent Channel) Mode ............................................................
7.11 Supported Configurations .............................................................................
8
Chipset ........................................................................................................
8.1
Overview ................................................................................................
8.2
Intel I/O Hub (IOH) ....................................................................................
8.3
IOH QuickPath Interconnect (QPI) ...................................................................
8.4
Intel Direct Media Interface (DMI) ...................................................................
8.5
PCI Express ..............................................................................................
8.6
Intel I/O Controller Hub 9 (ICH9) ....................................................................
9
BIOS ............................................................................................................
9.1
Overview ................................................................................................
9.2
Supported ACPI States .................................................................................
9.3
I2C (Inter-Integrated Circuit) .........................................................................
10 Embedded NICs/LAN on Motherboard (LOM) .............................................................
11 PCI Slots .......................................................................................................
11.1 Overview ................................................................................................
11.2 Quantities and Priorities ..............................................................................
11.3 PCI Card Dimensions ...................................................................................
12 Storage ........................................................................................................
12.1 Overview ................................................................................................
12.2 Internal Hard Disk Drives ..............................................................................
12.2.1
Hard Disk Drive Carriers .........................................................................
12.2.2
Empty Drive Bays .................................................................................
12.2.3
Hard Drive LED Indicators .......................................................................
12.3 RAID Configurations ....................................................................................
12.4 Storage Controllers ....................................................................................
12.4.1
SAS 6/iR ...........................................................................................
12.4.2
PERC 6/i ...........................................................................................
12.4.3
PERC H200 .........................................................................................
12.4.4
PERC H700 .........................................................................................
12.5 Optical Drives ...........................................................................................
12.6 Tape Drives .............................................................................................
12.7 External Storage Support .............................................................................
13 Video ...........................................................................................................
14 Rack Information .............................................................................................
14.1 Overview ................................................................................................
14.2 Rails ......................................................................................................
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14.3 Cable Management Arm (CMA) .......................................................................
14.4 Rack View ...............................................................................................
15 Operating Systems ...........................................................................................
16 Systems Management ........................................................................................
16.1 Overview ................................................................................................
16.2 Server Management ....................................................................................
16.3 Embedded Server Management ......................................................................
16.4 Dell Lifecycle Controller and Unified Server Configurator .......................................
16.5 Integrated Dell Remote Access Controller..........................................................
16.6 iDRAC Express...........................................................................................
16.7 iDRAC6 Enterprise ......................................................................................
16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media .............................................
17 Peripherals ....................................................................................................
Appendix A. Statement of Volatility ..........................................................................
Appendix B. Certifications .....................................................................................
A.1
Regulatory Certifications .............................................................................
A.2
Product Safety Certifications .........................................................................
A.3
Electromagnetic Compatibility .......................................................................
A.4
Ergonomics, Acoustics and Hygienics ...............................................................
Appendix C. Additional Information and Options ...........................................................
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Tables
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23.
PowerEdge T610 Product Comparison to T410 and T710 ........................................ 8
Product Features Summary ........................................................................ 11
Chassis Dimensions .................................................................................. 14
Power Supply Status ................................................................................ 17
Power Supply Specifications ....................................................................... 22
Environmental Specifications ...................................................................... 23
Acoustical Performance (2.5‖ HDD System) ..................................................... 25
Acoustical Performance (3.5‖ HDD System) ..................................................... 25
Intel Xeon Processor 5500 and 5600 Series Features ........................................... 27
Supported Processors ............................................................................... 28
Supported Hard Drives.............................................................................. 39
Factory RAID Configurations ....................................................................... 40
Storage Card Support Matrix....................................................................... 43
Graphics Video Modes .............................................................................. 45
Supported Racks ..................................................................................... 47
Rail Adjustability Ranges and Depth ............................................................. 47
Unified Server Configurator Features and Description......................................... 52
Features List for Base Management Functionality, iDRAC, and vFlash ...................... 54
T610 Volatility Table ............................................................................... 57
Product Safety Certifications ...................................................................... 61
Electromagnetic Compatibility Certifications ................................................... 62
Ergonomics, Acoustics and Hygienics............................................................. 63
Industry Standards .................................................................................. 64
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Figures
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7.
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12.
13.
Front View (Tower Configuration) ................................................................
Front View (Rack Configuration) ..................................................................
Back View ............................................................................................
Internal Chassis View ...............................................................................
Fans and Cooling Shroud ...........................................................................
LCD Control Panel ...................................................................................
Power Supplies ......................................................................................
Memory Channel Layout ............................................................................
Dell 2.5‖ Hard Drive Carrier .......................................................................
T610 ReadyRails Sliding Rails with Optional CMA ...............................................
2U Threaded Rack Adapter Brackets Kit .........................................................
T610 Mounted in C1 Sliding Rails .................................................................
T610 CMA Mounted on the Side Opposite the Power Supplies (Recommended) ...........
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1 Product Comparison
1.1 Overview
The Dell™ PowerEdge™ T610 is a tower form-factor server designed to deliver the highest levels of
performance, availability and expandability in a two-socket server. Featuring up to two powerful
Intel® processors, the T610 offers large memory capacity, high I/O bandwidth and extensive storage
capacity, satisfying today’s compute requirements and also allowing it to grow as your business
grows. The T610 features straightforward systems management to ease IT administration and energy
efficiency to help manage power consumption and budget.
1.1.1
Customer-Inspired Design
Inspired by our customers, the T610 is built to simplify daily operations and maximize uptime.
Logical component layout and power supply placement provide a straightforward installation and
deployment experience. Dell PowerEdge servers provide a graphical and interactive LCD panel in the
front of the server, used for monitoring system health, assessing alerts and performing configuration.
The T610 has an AC power meter and ambient temperature thermometer built into the server which
can be monitored on the display without any software tools. Moreover, the T610 takes advantage of
Dell’s system commonality. Once your IT managers learn one system, they understand how to
manage all of Dell’s 11th generation (11G) servers.
1.1.2
Energy Efficient
The T610 helps reduce power consumption while delivering higher performance than previous
generations of Dell tower servers. Enhancements include the latest highly efficient, standards-based
Energy Smart components, updated energy-efficient power supply units (PSUs) and power and
thermal management that can be automated at the convenience of the system administrator. The
T610 can help to reduce power consumption and budget and ease the day of the systems
administrator as well.
1.1.3
Enhanced Virtualization
Featuring the Intel® Xeon® processor 5500 and 5600 series, up to 100% more memory capacity than
the previous server generations, integrated I/O and embedded hypervisors, the Dell PowerEdge T610
delivers better overall system performance and greater virtual machine-per-server capacity than
ever before.
With optional factory-integrated virtualization capabilities, tailored solutions can be created,
allowing you to streamline deployment and reduce the time taken to deliver new solutions to your
user base. For example, choose your hypervisor from market leaders such as VMware, Citrix and
Microsoft, and enable virtualization with a few mouse clicks.
1.1.4
Easy to Manage
The Dell OpenManage™ portfolio of systems management offerings streamline and simplify
operational tasks throughout the complete server lifecycle, from initial provisioning and deployment
to ongoing monitoring, troubleshooting and problem resolution, to applying BIOS and driver updates
and pulling administrative reports. Based on open standards, Dell OpenManage™ systems
management capabilities can be applied locally and to remote systems, remaining available out-ofband, independent of the operating system (OS) state, and functional even in virtualized (hypervisor)
environments. Designed to deliver comprehensive lifecycle management, the OpenManage portfolio
of systems management solutions help you to save time, save money and reduce the complexity of
managing your IT infrastructure.
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1.1.5
Dell Services
Dell Services can help reduce IT complexity, lower costs and eliminate inefficiencies by making IT
and business solutions work harder for you. The Dell Services team takes a holistic view of your needs
and designs solutions for your environment and business objectives, leveraging proven delivery
methods, local talent, and in-depth domain knowledge.
1.2 Comparison
Table 1.
Feature
PowerEdge T610 Product Comparison to T410 and T710
T410
®
T610
®
T710
Processor
Intel Xeon processor
5500 and 5600 series
Intel Xeon processor
5500 and 5600 series
Intel® Xeon® processor
5500 and 5600 series
Front Side Bus
6.4 GT/s QuickPath
Interconnect (QPI) links
6.4 GT/s QuickPath
Interconnect (QPI) links
6.4 GT/s QuickPath
Interconnect (QPI) links
# Sockets
2
2
2
# Cores
2, 4, or 6
2, 4, or 6
2, 4, or 6
L2/L3 Cache
4MB, 8MB, and 12MB
4MB, 8MB, and 12MB
4MB, 8MB, and 12MB
®
Chipset
Intel 5500
Intel 5520
Intel® 5520
DIMMs
8 x DDR3
12 x DDR3
18 x DDR3
Min/Max RAM
1GB/128GB
1GB/192GB
1GB/192GB
Drive Bays
Optional hot-plug
6 x 2.5‖ or
6 x 3.5‖
Hot-plug
8 x 2.5‖ or
8 x 3.5‖
Hot-plug
16 x 2.5‖ or
8 x 3.5‖
Hard Drive Types
SATA SSD, SAS, nearline
SAS, SATA
SAS SSD, SATA SSD, SAS,
nearline SAS, SATA
SAS SSD, SATA SSD, SAS,
nearline SAS, SATA
2 x 5.25‖
2 x 5.25‖
2 x 5.25‖
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i,
PERC S100, PERC S300
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i, PERC
S100, PERC S300
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i, PERC
S100, PERC S300
Non-RAID:
SAS 5/E
LSI 2032 (for tape
backup unit only)
6Gbps SAS HBA
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup
unit only)
6Gbps SAS HBA
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup
unit only)
6Gbps SAS HBA
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
External Drive
Bays
Embedded Hard
Drive Controller
Optional Storage
Controller
®
®
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Feature
T410
T610
T710
Optional hot-plug hard
drives
Optional hot-plug
redundant power
ECC memory
Memory mirroring
Quad-pack LED or LCD
diagnostic
Hot-plug hard drives
Optional hot-plug
redundant power
Hot-plug redundant
cooling
ECC memory
Memory mirroring
LCD diagnostic
One dual-port embedded
NIC with TOE
Hot-plug hard drives
Optional hot-plug
redundant power
Hot-plug redundant
cooling
ECC memory
Memory mirroring
LCD diagnostic
Two dual-port embedded
NICs with TOE
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash media
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™,
iDRAC6 Express
Optional: iDRAC6
Enterprise, vFlash media
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™,
iDRAC6 Express
Optional: iDRAC6
Enterprise, vFlash media
4 PCIe x8 (x4 routing)
1 PCIe x16 (x8 routing)
2 PCIe x8
3 PCIe x4 Gen 2
1 PCIe x16
4 PCIe x8
1 PCIe x4
NIC/LOM
Broadcom® BCM5716
2 x GbE
Optional: various NICs
available
Broadcom® BCM5709c
2 x GbE with TOE
Optional: various NICs
available
Broadcom® BCM5709c
4 x GbE with TOE
Optional: various NICs
available
USB
2 front, 4 back,
1 internal
2 front, 6 back,
1 internal
2 front, 6 back,
1 internal
Power Supplies
Non-redundant 525W or
Optional hot-plug
redundant
2 x 580W
Hot-plug redundant
2 x 570W (Energy Smart)
or
2 x 870W (High-output)
Hot-plug redundant
2 x 1100W
Fans
Non hot-plug, nonredundant
Optional hot-plug
redundant
Hot-plug redundant
Availability
Server
Management
I/O Slots
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2 Key Technologies
2.1 Overview
Key features of the PowerEdge T610 include dual Intel® Xeon® 5500 and 5600 series quad-core and
six-core processors, DDR3 memory, Intel® 5520 I/O Hub (IOH) with QuickPath architecture, dual-port
Gigabit Ethernet controller with TOE, PCI Express Generation 2, iDRAC6 with integrated video
controller, internal SD Module, iDRAC6 Express, and optional iDRAC6 Enterprise.
2.2 Detailed Information
The Intel® Xeon® processor 5500 and 5600 series is designed specifically for servers and workstation
applications. The processor features quad-core and six-core processing to maximize performance and
performance/watt. Refer to section 6 for more details.
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3 System Overview
Table 2 summarizes the features for the PowerEdge T610. For the latest information on supported
features for the PowerEdge T610, visit Dell.com.
Table 2.
Product Features Summary
Feature
Technical Specification
Form Factor
Tower or 5U rack-mountable
Processors
Latest quad-core or six-core Intel® Xeon® processors 5500 and 5600 series
Processor Sockets
2
Front Side Bus or
HyperTransport
Intel® QuickPath Interconnect (QPI)
Cache
Up to 12MB
Chipset
Intel® 5520
Memory1
Up to 192GB (12 DIMM slots/6 per-processor): 1GB/2GB/4GB/8GB/16GB DDR3
800MHz, 1066MHz or 1333MHz
I/O Slots
Two PCIe x8
Three PCIe x4 Gen2
One x4 storage slot
RAID Controller
Internal Controllers:
PERC H200 (6Gb/s)
PERC H700 (6Gb/s) (non-volatile
battery-backed cache: 512MB, 1GB)
SAS 6/iR
PERC 6/i (battery-backed cache: 256MB)
PERC S100 (software based)
PERC S300 (software based)
Drive Bays
8 x 2.5‖ hard drives or
8 x 3.5‖ hard drives
Optional support for half-height tape backup unit
Maximum Internal
Storage
Up to 24TB
Hard Drives
1
External Controllers:
PERC H800 (6Gb/s) (non-volatile
battery-backed cache: 512MB, 1GB)
PERC 6/E (battery-backed cache:
256MB, 512MB)
External HBAs (non-RAID):
6Gbps SAS HBA
SAS 5/E HBA
LSI2032 PCIe SCSI HBA
Hot-plug Hard Drive Options:
2.5" SAS SSD, SATA SSD, SAS (15K, 10K), nearline SAS (7.2K), SATA (7.2K)
3.5" SAS (15K, 10K), nearline SAS (7.2K), SATA (7.2K)
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Feature
Technical Specification
Communications
One dual-port embedded Broadcom® NetXtreme II™ 5709c Gigabit Ethernet NIC with
failover and load balancing.
Optional 1GBe and 10GBe Add-in NICs:
Broadcom NetXtreme II 57711 Dual Port Direct Attach 10Gb Ethernet PCI-Express
Network Interface Card with TOE and iSCSI Offload
Intel® Gigabit ET Dual Port Server Adapter and Intel Gigabit ET Quad Port Server
Adapter
Dual Port 10GB Enhanced Intel Ethernet Server Adapter X520-DA2 (FCoE ready for
future enablement)
Brocade® CNA dual-port adapter
Emulex® CNA iSCSI HBA stand up adapter OCE10102-IX-D
Emulex CNA iSCSI HBA stand up adapter OCE10102-FX-D
Brocade FC4 and 8 GB HBAs
Power Supply
Two hot-plug redundant 570W (Energy Smart) or
Two hot-plug redundant 870W
Availability
DDR3 memory; ECC; hot-plug hard drives; optional hot-plug redundant power
supplies; dual embedded NICs with failover and load balancing support; optional
PERC6/i or PERC H700 integrated daughtercard controller with battery-backed
cache; hot-plug redundant cooling; toolless chassis; fibre and SAS cluster support;
validated for Dell/EMC SAN
Video
Integrated Matrox® G200 with 8MB shared video memory
Remote Management
iDRAC6
Systems Management
Dell™ OpenManage™
Rack Support
ReadyRails™ sliding rails with optional cable management arm for 4-post racks
(optional adapter brackets required for threaded hole racks)
Operating Systems
Microsoft® Windows® Small Business Server 2011
Microsoft® Windows® Small Business Server 2008
Microsoft Windows Server® 2008 SP2, x86/x64 (x64 includes Hyper-V™)
Microsoft Windows Server® 2008 R2 SP1, x64 (includes Hyper-V™ v2)
Microsoft® Windows® HPC Server 2008
Novell® SUSE® Linux® Enterprise Server
Red Hat® Enterprise Linux®
Oracle® Solaris™
Optional Embedded Hypervisors:
Citrix® XenServer®
VMware® vSphere™ 4.1 (including VMware ESX® 4.1 or VMware ESXi™ 4.1)
For more information on the specific versions and additions, visit
www.dell.com/OSsupport.
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Feature
Technical Specification
Featured Database
Applications
Microsoft® SQL Server® solutions (see Dell.com/SQL)
Oracle® database solutions (see Dell.com/Oracle)
1
GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.
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4 Mechanical
4.1 Chassis Description
The PowerEdge T610 is a tower or rack-mount (5U) chassis design that supports the following
features:





LCD control panel, bezel, and hard-drive carriers
Toolless rack latches
LOM0 and iDRAC MAC address labels
Support for internal persistent storage:
o Internal USB and SD card slots
o One external vFlash media slot (on optional iDRAC6 Enterprise card)
Updated efficient power supplies
4.2 Dimensions and Weight
Table 3 details the dimensions and weight for the PowerEdge T610 rack and tower configurations.
Table 3.
Chassis Dimensions
Configuration
Height
Width
Depth
Weight
(max config)
Weight
(empty)
Rack
217.7mm
(8.57in)
482.5mm
(19in)
621mm
(24.4in)
35kg
(77lb)
20.2kg
(44.53lb)
Tower
441mm
(17.4in)
274mm
(10.8in)
621mm
(24.4in)
35kg
(77lb)
20.2kg
(44.30lb)
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4.3 Front Panel View and Features
Figure 1 and Figure 2 show the front views of the PowerEdge T610.
Figure 1.
Figure 2.
PowerEdge T610 Technical Guide
Front View (Tower Configuration)
Front View (Rack Configuration)
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See the Front-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T610 Hardware Owner’s Manual on Support.Dell.com for more information.
4.4 Back Panel View and Features
Figure 3 shows the back view of the PowerEdge T610.
Figure 3.
Back View
See the Back-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T610 Hardware Owner’s Manual on Support.Dell.com for more information.
4.5 Power Supply Indicators
The PowerEdge T610 redundant power supplies have one status bi-color LED: green for AC power
present and amber for a fault as detailed in Table 4.
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Table 4.
LED
Power Supply Status
Power Supply Status
AC Power is not present
AC Power is present
Fault of any kind is detected
DC Power is applied to the system
↔
Redundant power supply mismatch
(when hot-plugged/swapped)
See the Power Indicator Codes section in the About Your System chapter of the PowerEdge T610
Hardware Owner’s Manual on Support.Dell.com for more information.
4.6 NIC Indicators
See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge T610
Hardware Owner’s Manual on Support.Dell.com for more information.
4.7 Internal Chassis Views
Figure 4 shows the internal view of the PowerEdge T610 server.
Figure 4.
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Internal Chassis View
17
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4.8 Rails and Cable Management
ReadyRailsTM Sliding Rails for 4-post racks support the following:




Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks
including all generations of Dell racks
Tooled installation in 19‖ EIA-310-E compliant threaded hole 4-post racks (requires the 2U
Threaded Rack Adapter Brackets Kit)
Full extension of the system out of the rack to allow serviceability of key internal components
Optional cable management arm (CMA)
See section 14 for more details.
4.9 Fans
Two or four 92 mm single-rotor fans are mounted in the back of the cooling shroud. Each fan has a
single-wire harness that plugs into the planar fan connectors (FAN1 through FAN4). In a nonredundant configuration, two fans must be installed towards the back of the chassis.
The iDRAC6 controls and monitors the speed of the fans. A fan speed fault or over-temperature
condition results in a notification by iDRAC6.
The T610 power supply units have integrated fans. They are cooled by fans in the front section. The
system requires a blank module in place of the empty power supply slot.
All system fans are pulse-width modulated (PWM) fans. Redundant cooling (optional) is supported.
Figure 5.
PowerEdge T610 Technical Guide
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4.10 LCD Control Panel
The LCD control panel is located on the front of the system chassis to provide user access to buttons,
display, and I/O interfaces. See Figure 6. The control panel includes the following features:




ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6)
128x20 pixel LCD with controls:
o Two navigation buttons
o Select button
o System ID button
Non-maskable Interrupt (NMI) button (recessed)
Ambient temperature sensor
Figure 6.
LCD Control Panel
The LCD panel is a graphics display controlled by the iDRAC6. Both iDRAC6 and BIOS can send error
codes and messages to the display.
The system's LCD panel provides system information and status messages to signify when the system
is operating correctly or when the system needs attention.
BIOS has the ability to enter a secure mode through Setup, which locks the Power and NMI buttons.
When in this mode, the power button can still be used to turn on the server even when the power
button is disabled in System Setup.
For more information on the LCD panel, see the LCD Panel Features section in the About Your System
chapter in the PowerEdge T610 Hardware Owner’s Manual on Support.Dell.com.
4.11 Security
For additional information regarding the following security features, see the PowerEdge T610
Hardware Owner’s Manual on Support.Dell.com.
4.11.1 Cover Latch
The PowerEdge T610 comes with a tooled latch on the side cover of the system that secures it to the
chassis. A locked bezel secures the cover latch.
4.11.2 Bezel
A metal bezel is mounted to the chassis. A lock on the bezel is used to protect un-authorized access
to system hard drives and the control panel. System status on the LCD is viewable even when the
bezel is installed.
The bezel is standard for both the T610 tower and rack systems.
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4.11.3 Hard Drive
The front bezel of the system contains a lock which secures the system hard drives.
4.11.4 TPM
The Trusted Platform Module (TPM) is used to generate and store keys, protect and authenticate
passwords, and create and store digital certificates. The TPM can also be used to store Microsoft®
BitLocker™ keys for hard drive encryption features in Microsoft® Windows Server® 2008. TPM is
enabled through a BIOS option and uses HMAC-SHA1-160 for binding.
4.11.5 Power Off Security
The control panel is designed so the power switch cannot be accidentally activated. The lock on the
bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup that
disables the power button function.
4.11.6 Intrusion Alert
A switch mounted on the cooling shroud is used to detect chassis intrusion. When the cover is
opened, the switch circuit closes to indicate intrusion to the iDRAC6. When enabled, the software
can provide notification to the customer that the cover has been opened.
4.11.7 Secure Mode
BIOS has the ability to enter a secure boot mode through Setup. This mode includes the option to
lock out the power and NMI switches on the control panel or set up a system password.
4.12 USB Peripherals
The port on the control panel is for an optional USB key and is located inside the chassis. Some
possible applications of the USB key are listed as follows:



User custom boot and pre-boot OS for ease of deployment or diskless environments
USB license keys for software applications like eToken™ or Sentinel Hardware Keys
Storage of custom logs or scratch pads for portable user defined information (not hotswappable)
4.13 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH chip.
4.14 Field Replaceable Units (FRU)
The planar contains a serial EEPROM to store FRU information including Dell part number, part
revision level, and serial number. The backplane storage enclosure processor (SEP) and the power
supply microcontroller are also used to store FRU data.
4.15 User Accessible Jumpers, Sockets, and Connectors
See the Jumpers and Connectors chapter in the PowerEdge T610 Hardware Owner’s Manual on
Support.Dell.com.
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5 Power, Thermal, Acoustic
5.1 Power Efficiencies
One of the main features of the 11G family of servers is enhanced power efficiency. The T610
achieves higher power efficiency by implementing the following features:





















User-selectable power cap (subsystems throttle to maintain the specified power cap)
Improved power budgeting
Larger heat-sinks for processors and IOH
Accurate inlet temperature
Power-supply and voltage-regulator (VR) efficiency improvements
Use of switching regulators instead of linear regulators
Closed-loop thermal throttling
Increased rear venting and 3D venting
Pulse-width modulated (PWM) fans with an increased number of fan zones and configurationdependent fan speeds
Use of DDR3 memory (lower voltage compared to DDR2, UDIMM)
Processor VR dynamic phase shedding
Memory VR static phase shedding
Random time interval for system start
Ability for an entire rack to power on without exceeding the available power
BIOS Power/Performance options page
BIOS-based CPU P-state manager (power management in a virtualized environment)
Active Power Controller (BIOS-based CPU P-state manager)
Ability to power down or throttle memory
Option to disable a processor core
Ability to turn off embedded NICs or PCIe lanes when not being used
Option to run PCIe at Gen1 speeds instead of Gen2
5.2 Main Power Supply
The base redundant system consists of two hot-plug 570W Energy Smart (energy efficient) power
supplies in a 1+1 configuration. A redundant 870W high-output power supply is also available.
The power supplies connect indirectly to the planar through the power distribution board (PDB).
There is a power cable that connects the PDB to the backplane. Another cable also connects the PDB
to the optical and tape drives.
Field replaceable unit (FRU) data is stored in the memory of the power supply microcontroller.
Additionally, the power supply firmware can be updated by the iDRAC over the PMBus.
Power is soft-switched, allowing power cycling with a switch on the front of the system enclosure, or
through software control (through server management functions).
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Figure 7.
Power Supplies
5.3 Power Supply Specifications
Table 5.
Feature
Wattage
Power Supply Specifications
Specification
870 Watt (high output)
570 Watt (Energy Smart)
Voltage
90-264 VAC, autoranging, 47-63Hz
Maximum inrush current
Under typical line conditions and over the
entire system ambient operating range, the
inrush current may reach 55A per power
supply for 10ms or less.
5.4 Heat Dissipation
High output (870W) power supply: 2968.6 BTU/hr maximum
Energy Smart (570W) power supply: 1944.9 BTU/hr maximum
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5.5 Environmental Specifications
Table 6.
Environmental Specifications
Temperature
Operating
10° to 35°C (50° to 95°F) with a maximum
temperature gradation of 10°C per hour
Note: For altitudes above 2950 feet, the
maximum operating temperature is de-rated
1°F/550 ft.
Storage
-40° to 65°C (-40° to 149°F) with a maximum
temperature gradation of 20°C per hour
Relative Humidity
Operating
20% to 80% (non-condensing) with a maximum
humidity gradation of 10% per hour
Storage
5% to 95% (non-condensing) with a maximum
humidity gradation of 10% per hour
Maximum Vibration
Operating
0.26Grms at 10–350Hz for 5 minutes in
operational orientations
Storage
1.54Grms at 10–250Hz for 10 minutes in all
orientations
Maximum Shock
Operating
Half sine shock in all operational orientations of
31G +/-5% with a pulse duration of 2.6ms
+/-10%
Temperature
Operating
10° to 35°C (50° to 95°F) with a maximum
temperature gradation of 10°C per hour
Note: For altitudes above 2950 feet, the
maximum operating temperature is de-rated
1°F/550 ft.
Storage
-40° to 65°C (-40° to 149°F) with a maximum
temperature gradation of 20°C per hour
Relative Humidity
Operating
20% to 80% (non-condensing) with a maximum
humidity gradation of 10% per hour
Storage
5% to 95% (non-condensing) with a maximum
humidity gradation of 10% per hour
Maximum Vibration
Operating
0.26Grms at 5–350Hz for 5 minutes in
operational orientations
Storage
1.54Grms at 10–250Hz for 10 minutes in all
orientations
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Maximum Shock
Operating
Half sine shock in all operational orientations of
31 G 5% with a pulse duration of 2.6ms 10%
Storage
Half sine shock on all six sides of 71G 5% with a
pulse duration of 2ms 10% Square wave shock on
all six sides of 27G with velocity change @ 235
in/sec or greater
Altitude
Operating
-16 to 3048m (-50 to 10,000ft) Note: For
altitudes above 2950 feet, the maximum
operating temperature is de-rated 1°F/550ft
Storage
-16 to 10,600m (-50 to 35,000ft)
For additional information about environmental measurements for specific system configurations, see
www.dell.com/environmental_datasheets.
5.6 Power Consumption Testing
Feature
Energy Smart Power
Supply
High Output Power Supply
Dimensions
L-206.4mm1 x W-67.5mm x H-76.5mm
Status Indicators
1 x bi-color Light Emitting Diode
Integrated Fans
1 x 60mm
IEC-C14
Fixed Input Plug
1
AC Cord Rating
15 Amps @ 120 VAC, 10 Amps @ 240 VAC
Input Voltage
90 – 264VAC
Auto-ranging
Yes
Line Frequency
47 – 63Hz
Maximum Inrush Current
55 Amps per supply for 10ms or less
Hot-Swap Capability
Yes
Output Power
570 Watts
870 Watts
Maximum Heat Dissipation
1944.9 BTU per hour
2968.6 BTU per hour
Efficiency (20% - 100%
Load)
86.9 – 90.5% @ 115 VAC
88 – 92% @ 230 VAC
85 – 88% @ 115 VAC
87 – 90% @ 230 VAC
Does not include the power supply handle or ejection tab
5.7 Maximum Input Amps
Maximum input current (high-output power supply):


12A @ 90 VAC
6A @ 180 VAC
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Maximum input current (Energy Smart power supply):


7.8A @ 90 VAC
3.9A @ 180 VAC
5.8 Energy Smart Enablement
The 11G family of PowerEdge servers implements aspects of the Dell Energy Smart strategy. This
strategy offers the following:



Energy Smart components on a portfolio level, such as high-capacity and Energy Smart power
supplies
Systems with either a lowest power footprint configuration or a best performance per watt
configuration
Energy Smart components (such as DIMMs or hard drives) selected without cherry picking or
screening individual manufacturer’s components based on energy consumption
5.9 ENERGY STAR Compliance
ENERGY STAR® qualified configurations can be accessed from the ENERGY STAR Compliance results
landing page on Dell.com.
5.10 Acoustics
The acoustical design of the PowerEdge T610 reflects adherence to Dell’s high sound quality
standards. Sound quality is different from sound power level and sound pressure level in that it
describes how humans respond to annoyances in sound, like whistles, hums, etc. One of the sound
quality metrics in the Dell specification is prominence ratio of a tone as shown in Table 7 and
Table 8.
Table 7.
Acoustical Performance (2.5” HDD System)
Typical Configuration @ 23 ± 2 °C
CPUs
HDDs
Power
Supplies
2
4
2
Table 8.
Optical
Drive
1
Operating Mode
LWA-UL
(Bels)
LpA
(dBA)
Prominent
Tones
Idle
5.2
36
None
HDD Active
5.3
37
None
Acoustical Performance (3.5” HDD System)
Typical Configuration @ 23 ± 2 °C
CPUs
HDDs
Power
Supplies
2
4
2
Optical
Drive
1
Operating Mode
LWA-UL
(Bels)
LpA
(dBA)
Prominent
Tones
Idle
5.6
38
None
HDD Active
5.7
40
None
The acoustical specification for the T610 is Category III-C.
Definitions
Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific
activity.
Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6. The software
SPECPower_ssj2008 is utilized to stress the processors. SPECPower is set to 50% loading.
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LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and
measured in accordance to ISO 7779 (1999).
LpA: Average bystander A-Weighted sound pressure level. The system is placed in a rack with its
bottom at 25 cm from the floor. The acoustic transducers are at the four bystander positions, ref
ISO7779 (1999) Section 8.6.2.
Prominent tone: Criteria of D.5 and D.8 of ECMA-74 9th ed. (2005) are followed to determine if
discrete tones are prominent. The system is placed in a rack with its bottom at 75 cm from the floor.
The acoustic transducer is at front bystander position, ref ISO7779 (1999) Section 8.6.2.
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6 Processors
6.1 Overview
The Intel® Xeon® processor 5500 and 5600 series 2S is the microprocessor designed specifically for
servers and workstation applications. The Intel Xeon processor 5500 series features quad-core
processing to maximize performance and performance/watt for data center infrastructures and
highly dense deployments. The Intel 5600 series features six-core processing, offering enhanced
system-level performance, virtualization, and energy efficiency. The Intel Xeon processor also
feature Intel’s Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit
applications and operating systems.
The Intel Xeon processor uses a 1366-contact Flip-Chip Land Grid Array (FC-LGA) package that plugs
into a surface mount socket. The PowerEdge T610 provides support for up to two processors.
Table 9.
Intel Xeon Processor 5500 and 5600 Series Features
Feature
5500 Series
5600 Series
# Cores
4
6
Last Level Cache
8MB shared
12MB shared
Multi-processor support
1–2 processors
1-2 processors
Front Side Bus (FSB) (MHz)/
Link Frequency (GT/s)
Up to 6.4 GT/s
Up to 6.4 GT/s
Max Thermal Design Power
(TDP)
130W (workstation)
95W (server)
130W (workstation)
95W (server)
Max Frequency
>3GHz
>3GHz
Memory Controller
Integrated 3-channel DDR3
Integrated 3-channel DDR3
Process Technology
45nm
32nm
Intel® Trusted Execution
Technology
No
Yes
Intel® Advanced Encryption
Security- New Instructions
No
Yes
Intel® Virtualization
Technology
Yes
Yes
Intel® 64
Yes
Yes
Intel® Hyper-Threading
Technology
Yes
Yes
Socket
LGA1366
LGA1366
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6.2 Features
Key features of the Intel Xeon processor 5500 and 5600 series include:


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

Two, four, or six cores per processor
Two point-to-point QuickPath Interconnect links at 6.4 GT/s
1366-pin FC-LGA package
32 nm and 45 nm process technology
No termination required for non-populated processors (must populate CPU socket 1 first)
Integrated QuickPath DDR3 memory controller 64-byte cache line size RISC/CISC hybrid
architecture
Compatible with existing x86 code base
Intel MMX™ support—Execute Disable Bit Intel Wide Dynamic Execution
Ability to executes up to four instructions per clock cycle
Simultaneous Multi-Threading (SMT) capability
Support for CPU Turbo Mode (on certain processors)—increases processor frequency if
operating below thermal, power, and current limits for streaming SIMD (Single Instruction,
Multiple Data) Extensions 2, 3, and 4
Intel 64 Technology Intel VT-x and VT-d Technology for virtualization support Enhanced Intel
SpeedStep® Technology
Demand-based switching for active processor power management as well as support for ACPI
P-States, C-States and T-States
Support for DDR3L, 1.35V DIMMs for even lower system power (5600 series)
Support for memory sparing (5600 series)
AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL (5600 series)
Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks (5600 series)
6.3 Supported Processors
For the latest information on supported processors for the PowerEdge T610, visit Dell.com.
Table 10.
Model
Speed
Supported Processors
Power
Cache
Cores
QPI Speed
X5680
3.33GHz
130W
12M
6
6.4GT/s
X5670
2.93GHz
95W
12M
6
6.4GT/s
X5660
2.80GHz
95W
12M
6
6.4GT/s
X5650
2.66GHz
95W
12M
6
6.4GT/s
L5640
2.26GHz
60W
12M
6
5.86GT/s
X5677
3.46GHz
130W
12M
4
6.4GT/s
X5667
3.06GHz
95W
12M
4
6.4GT/s
E5640
2.66GHz
80W
12M
4
5.86GT/s
E5630
2.53GHz
80W
12M
4
5.86GT/s
L5630
2.13GHz
40W
12M
4
5.86GT/s
E5620
2.40GHz
80W
12M
4
5.86GT/s
L5609
1.86GHz
40W
12M
4
4.8GT/s
X5560
2.80GHz
95W
8M
4
6.4GT/s
PowerEdge T610 Technical Guide
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Model
Speed
Power
Cache
Cores
QPI Speed
E5530
2.40GHz
80W
8M
4
5.86GT/s
L5520
2.26GHz
60W
8M
4
5.86GT/s
E5507
2.26GHz
80W
4M
4
4.8GT/s
E5506
2.13GHz
80W
4M
4
4.8GT/s
E5503
2.00GHz
80W
4M
2
4.8GT/s
6.4 Processor Configurations
6.4.1
Single Processor Configuration
The PowerEdge T610 is designed so that a single processor placed in the CPU1 socket functions
normally. The system will halt during power-on self-test (POST) if a single processor is placed in the
CPU2 socket. If using a single processor, the T610 requires a heatsink blank in the CPU2 socket for
thermal reasons.
6.4.2
Processor Power Voltage Regulation Modules (EVRD 11.1)
Voltage regulation to the Intel Xeon processor 5500 and 5600 series 2S is provided by EVRD
(Enterprise Voltage Regulator-Down). EVRDs are embedded on the planar. Processor core voltage is
not shared between processors. EVRDs support static phase shedding and power management via the
PMBus.
6.5 Processor Installation
Refer to the Processors section in the Installing System Components chapter of the Dell PowerEdge
T610 Systems Hardware Owner’s Manual on Support.dell.com for processor installation and removal
instructions.
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7 Memory
7.1 Overview
The PowerEdge T610 utilizes DDR3 memory, providing a high performance, high-speed memory
interface capable of low latency response and high throughput. The T610 supports Registered ECC
DDR3 DIMMs (RDIMM) or Unbuffered ECC DDR3 DIMMs (UDIMM).
Key features of the T610 memory system include:




















Registered (RDIMM) and Unbuffered (UDIMM) DDR3 technology
Each channel carries 64 data and eight ECC bits
Support for up to 192 GB of RDIMM memory (twelve 16 GB RDIMMs)
Support for up to 24 GB of UDIMM memory (twelve 2 GB UDIMMs)
Support for 1066/1333 MHz single and dual rank DIMMs
Support for 1066 MHz quad rank DIMMs
Support for 1.35V low voltage (LV) DIMMs with 5600 series processors
Single DIMM configuration with DIMM at socket DIMM A1
Support ODT (On Die Termination)
Clock gating (CKE) to conserve power when DIMMs are not accessed
DIMMs will enter a low power self-refresh mode
I2C access to SPD EEPROM and thermal sensors
Single Bit Error Correction
SDDC (Single Device Data Correction, x4 or x8 devices)
Multi Bit Error Detection
Support for Closed Loop Thermal Management on RDIMMs and UDIMMs
Support for Advanced ECC mode
Support for Memory Optimized mode
Support for Memory Mirroring
Support for Memory Sparing with 5600 series processors
7.2 DIMMs Supported
The DDR3 memory interface consists of three channels with up to two RDIMMs or UDIMMs per channel
for single or dual rank and up to two RDIMMs per channel for quad rank. The interface uses 2 GB, 4
GB, 8 GB, or 16 GB RDIMMs. Also supported are 1 GB or 2 GB UDIMMs.
7.2.1
Memory Modes
The memory mode is dependent on how the memory is populated in the system, according to the
following configurations:


Three channels per processor populated identically
o Typically, the system will be set to run in Memory Optimized (Independent Channel)
mode in this configuration.
o This mode offers the most DIMM population flexibility and system memory capacity,
but offers the least number of RAS (reliability, availability, service) features.
o All three channels must be populated identically.
The first two channels per processor populated identically with the third channel unused
o Typically, two channels operate in Advanced ECC (Lockstep) mode with each other by
having the cache line split across both channels.
o This mode provides improved RAS features (SDDC support for x8-based memory).
o For memory mirroring, two channels operate as mirrors of each other (writes go to
both channels and reads alternate between the two channels).
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For Memory Mirroring, two channels operate as mirrors of each other—writes go to
both channels and reads alternate between the two channels.
One channel per processor populated
o This is a simple Memory Optimized mode.
o Mirroring is not supported.
o

7.2.2
DIMM Population Rules
The following DIMM population rules apply:





If DIMMs of different speeds are mixed, all channels will operate at the fastest common
frequency. RDIMMs and UDIMMs cannot be mixed.
If memory mirroring is enabled, identical DIMMs must be installed in the same slots across
both channels.
The third channel of each processor is unavailable for memory mirroring.
The T610 supports up to 12 DIMMs. DIMMs must be installed in each channel starting with the
DIMM slot farthest from the processor. Population order is identified by the silkscreen
designator and the System Information Label (SIL) located on the chassis cover.
DIMM slot population for each memory mode is listed as follows:
o Memory Optimized: [1, 2, 3], [4, 5, 6]
o Advanced ECC or Mirrored: [2, 3], [5, 6]
o Quad Rank or UDIMM: [1, 2, 3], [4, 5, 6]
Figure 8.
Memory Channel Layout
7.3 Speed
The memory frequency is determined by a variety of inputs:



Speed of the DIMMs
Speed supported by the processor
Configuration of the DIMMs
The memory speed of each channel depends on the memory configuration:


For single- or dual-rank memory modules:
o One memory module per channel supports up to 1333 MHz
o Two memory modules per channel supports up to 1066 MHz
For quad-rank memory modules:
o One memory module per channel supports up to 1066 MHz
o Two memory modules per channel are limited to 800 MHz, regardless of memory
module speed
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If memory modules with different speeds are installed, they will operate at the speed of the slowest
installed memory module(s).
For quad-rank DIMMs mixed with single- or dual-rank DIMMs, the quad-rank DIMM must be installed in
the slot with the white ejection tabs (the first DIMM slot in each channel). There is no requirement
for the order of single- and dual-rank DIMMs.
7.4 DIMM Slots
The PowerEdge T610 has 12 DIMM slots for memory. It does not have any riser cards for DIMM
population.
The first DIMM slot in each channel is color-coded with white ejection tabs for ease of installation.
The DIMM sockets are placed 450 mils (11.43 mm) apart, center-to-center to provide enough space
for sufficient airflow to cool stacked DIMMs.
7.5 Low Voltage DIMMs
With the introduction of the Intel® Xeon® processor 5600 series, low voltage (LV) DIMMs have been
added for selected memory configurations for the PowerEdge T610. Only this processor series
supports operating DIMMs at the lower voltage (1.35V, also referred to as DDR3L). The Intel Xeon
5500 processor series does not support low voltage operation. However, they can be operated at
1.5V. Therefore, DDR3L DIMMs can be used in systems with either processor series, and the platform
will automatically choose the appropriate operating voltage based on the processor populated.
DDR3L DIMMs will be qualified and available for use with Intel Xeon 5500 processor series mid-year
2011. Contact your Dell Sales Representative or visit Dell.com for more information.
LV DIMMs operate at 1.35V, creating power savings vs. standard memory which operates at 1.5V. In
order to achieve power savings, all DIMMs in the system must be of the LV type. If the system detects
a mixture of standard and LV DIMMs, the BIOS will operate all memory at 1.5V. When operating at
the lower voltage, additional frequency and population restrictions can take effect. For example, 3
DIMMs per channel operation is not supported at low voltage.
The DDR3L standard is completely backward compatible at standard voltage. DDR3L DIMMs can
operate at 1.5V without any limitations beyond standard voltage DDR3 DIMMs. As part of the addition
of LV DIMMs, the platform has certain default behaviors. Whenever possible, if there is no
performance degradation, the platform will default to 1.35V operation when using DDR3L DIMMs. In
certain cases, where a configuration is populated that cannot support 1.35V or a performance
degradation would result, the platform defaults to 1.5V operation. There are also options to override
default voltage within allowed limits.
7.6 Mirroring
The T610 system supports memory mirroring if identical memory modules are installed in the two
channels closest to the processor (memory not installed in the farthest channel). Mirroring must be
enabled in the System Setup program. In a mirrored configuration, the total available system
memory is one-half of the total installed physical memory.
7.7 Sparing
Systems with the Intel Xeon processor 5600 series support memory sparing. Sparing requires identical
memory installed in all three channels. One of the three channels is considered the Spare Channel,
and two-thirds of the total installed memory is usable and is the amount reported during POST and in
BIOS setup.
7.8 Memory Scrubbing
The T610 memory interface supports memory demand and patrol scrubbing, single-bit correction and
multi-bit error detection. Correction of a x4 or x8 device failure is also possible with (SDDC) in the
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Advanced ECC mode. Additionally, correction of a x4 device failure is possible in the Memory
Optimized mode.
7.9 Advanced ECC (Lockstep) Mode
In this configuration, the two channels closest to the processor are combined to form one 128-bit
channel. This mode supports SDDC for both x4- and x8-based memory modules. Memory modules
must be identical in size, speed and technology in corresponding slots.
7.10 Optimizer (Independent Channel) Mode
In Optimizer (Independent Channel) mode, all three channels are populated with identical memory
modules. This mode permits a larger total memory capacity but does not support SDDC with x8-based
memory modules.
A minimal single-channel configuration of 1 GB memory modules per processor is also supported in
this mode.
7.11 Supported Configurations
See the System Memory section in the Installing System Components chapter in the Dell PowerEdge
T610 Systems Hardware Owner's Manual on Support.dell.com.
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8 Chipset
8.1 Overview
The PowerEdge T610 planar incorporates the Intel® Xeon® 5520 processor series chipset for I/O and
processor interfacing. This chipset is designed to support the Intel Xeon 5500 and 5600 processor
series family, QuickPath Interconnect, DDR3 memory technology, and PCI Express Generation 2. The
chipset consists of the Intel 5520 chipset I/O Hub (IOH) and ICH9.
8.2 Intel I/O Hub (IOH)
The planar uses the Intel 5520 chipset IOH to provide a link between the Intel Xeon processor series
5500 and 5600 processor(s) and the I/O components. The main components of the IOH consist of two
full-width QuickPath Interconnect links (one to each processor), 36 lanes of PCI Express Gen2, a x4
Direct Media Interface (DMI), and an integrated IOxAPIC.
8.3 IOH QuickPath Interconnect (QPI)
The QuickPath Architecture consists of serial point-to-point interconnects for the processors and the
IOH. The T610 has a total of three QuickPath Interconnect (QPI) links—one link connecting the
processors, and multiple links connecting both processors with the IOH. Each link consists of 20 lanes
(full-width) in each direction with a link speed of 6.4 GT/s. An additional lane is reserved for a
forwarded clock. Data is sent over the QPI links as packets.
The QuickPath Architecture implemented in the IOH and processors features four layers:




Physical layer—Consists of the actual connection between components. Supports Polarity
Inversion and Lane Reversal for optimizing component placement and routing.
Link layer—Responsible for flow control and the reliable transmission of data.
Routing layer—Responsible for the routing of QPI data packets.
Protocol layer—Responsible for high-level protocol communications, including the
implementation of a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache coherence
protocol.
8.4 Intel Direct Media Interface (DMI)
The DMI connects the Intel 5520 chipset IOH with the Intel I/O Controller Hub (ICH). The DMI is
equivalent to a x4 PCIe Gen1 link with a transfer rate of 1 GB/s in each direction.
8.5 PCI Express
PCI Express is a serial point-to-point interconnect for I/O devices. PCIe Generation 2 doubles the
signaling bit rate of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwardscompatible with Gen1 transfer rates.
The IOH has two x2 PCIe Gen2 ports (1 GB/s) and eight x4 PCIe Gen2 ports (2 GB/s). The x2 ports can
be combined as a x4 link; however, this x4 link cannot be combined with any of the other x4 ports.
Two neighboring x4 ports can be combined as a x8 link, and both resulting x8 links can combine to
form a x16 link.
8.6 Intel I/O Controller Hub 9 (ICH9)
ICH9 is a highly integrated I/O controller, supporting the following functions:


Six x1 PCIe Gen1 ports, with the capability of combining ports 1-4 as a x4 link (ports are
unused on T610)
PCI Bus 32-bit Interface Rev 2.3 running at 33 MHz
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









Up to six Serial ATA (SATA) ports with transfer rates up to 300 MB/s (T610 features two SATA
port for optional internal optical drive or tape backup)
Six UHCI and two EHCI (high-speed 2.0) USB host controllers, with up to twelve USB ports
Eight external USB ports and two internal ports dedicated for Unmanaged Internal Persistent
Storage (UIPS)
Power management interface (ACPI 3.0b compliant)
Platform Environmental Control Interface (PECI)
Intel Dynamic Power Mode Manager
I/O interrupt controller
SMBus 2.0 controller
Low Pin Count (LPC) interface to Super I/O, Trusted Platform Module (TPM), and SuperVU
Serial Peripheral Interface (SPI) support for up to two devices (T610 BIOS is connected to the
ICH9 using SPI)
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9 BIOS
9.1 Overview
The PowerEdge T610 BIOS is based on the Dell BIOS core and supports the following features:


















Simultaneous Multi-Threading (SMT) support
Processor Turbo Mode support
PCI 2.3 compliant
Plug and Play 1.0a compliant
MP (Multiprocessor) 1.4 compliant
Ability to boot from hard drive, optical drive, iSCSI drive, USB key, and SD card
ACPI support
Direct Media Interface (DMI) support
PXE and WOL support for on-board NICs
Memory mirroring support
SETUP access through <F2> key at end of POST
USB 2.0 (USB boot code is 1.1 compliant)
F1/F2 error logging in CMOS
Virtual KVM, CD, and floppy support
Unified Extensible Firmware Interface (UEFI) 2.1 support
Power management support including DBS, Power Inventory and multiple power profiles
Intel TXT (5600 processor series)
Intel AESNI (5600 processor series)
The T610 BIOS does not support the following:


BIOS language localization
BIOS recovery after bad flash (can be recovered from iDRAC6 Express)
9.2 Supported ACPI States
Advanced Configuration and Power Interface (ACPI) is a standard interface for enabling the operating
system to direct configuration and power management.
The Intel Xeon processor 5500 and 5600 series supports the following C-States: C0, C1, C1E, C3, and
C6. The T610 supports all of the available C-States.
9.3 I2C (Inter-Integrated Circuit)
I2C is a simple bi-directional two-wire bus for efficient inter-integrated circuit control. All I2C-bus
compatible devices incorporate an on-chip interface which allows them to communicate directly with
each other via the I2C bus. This design concept solves the many interfacing problems encountered
when designing digital control circuits. These I2C devices perform communication functions between
intelligent control devices (e.g., microcontrollers), general-purpose circuits (e.g., LCD drivers,
remote I/O ports, memories) and application-oriented circuits.
The PowerEdge T610 BIOS accesses the I2C through the ICH9 (Intel I/O Controller Hub 9). There are
two multiplexers (MUX) on the ICH9 I2C bus.


One MUX (U_ICH_SPD) controls the DIMM SPDs through four split segments
The other MUX (U_ICH_MAIN) controls the clock buffers, TOE, and USB Hub through four split
segments.
BIOS controls both the MUXes through the two select lines using GPIO pins.
The clock chip, USB hub, and the front panel EEPROM device addresses are located on the IOH I 2C
bus.
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10 Embedded NICs/LAN on Motherboard (LOM)
The PowerEdge T610 has an embedded dual-port Gigabit Ethernet controller with TCP Offload Engine
(TOE) support. The embedded Broadcom® 5709C dual-port LAN controller is on the T610 planar as an
independent Gigabit Ethernet interface device. The following information details the features of the
LAN device:













x4 PCI Express Gen2 capable interface (controller operated at Gen1 speed)
Integrated MAC and PHY
3072x18 Byte context memory
64 KB receive buffer
TOE (TCP Offload Engine)
iSCSI controller (enabled through optional hardware key)
RDMA controller (RNIC) (enabled through an optional hardware key)
NC-SI (Network Controller-Sideband Interface) connection
Wake-On-LAN (WOL)
PXE 2.0 remote boot
iSCSI boot
IPv4 and IPv6 support
Bare metal deployment support
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11 PCI Slots
11.1 Overview
The PowerEdge T610 has five PCI Express expansion slots and one dedicated storage slot, which are
detailed as follows:



Two x8 PCIe Gen2 slots for full-height full-length cards connected to the IOH
Three x4 PCIe Gen2 slots for full-height half-length cards connected to the IOH
One x4 PCIe Gen1 slot for a dedicated storage controller card connected to the IOH
The system supports 25W maximum power for the first two PCIe cards and 15W for the third, fourth,
and fifth PCIe cards. The lower-power support on the third, fourth, and fifth cards is due to system
thermal limitations and not due to system power requirements.
The system does not support hot-plugging or hot-removal of PCI Express cards.
For more information on installing expansion cards and expansion-card priority, see the Expansion
Cards and Expansion-Card Risers section in the Installing System Components chapter of the Dell
PowerEdge T610 Systems Hardware Owner’s Manual on Support.dell.com.
11.2 Quantities and Priorities
Refer to the Expansion Cards and Expansion-Card Risers section in the Installing System Components
chapter of the Dell PowerEdge T610 Systems Hardware Owner’s Manual on Support.dell.com.
11.3 PCI Card Dimensions
For information about PCIe slots and card dimensions, see the Expansion Cards and Expansion-Card
Risers section in the Installing System Components chapter in the Dell PowerEdge T610 Systems
Hardware Owner’s Manual on Support.Dell.com.
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12 Storage
12.1 Overview
The PowerEdge T610 is available in two different hard-drive configurations:


8 x 2.5‖ hard drives
8 x 3.5‖ hard drives
Each configuration has a unique chassis and hard-drive backplane. Both chassis have eight hot-swapcapable Serial Attached SCSI (SAS) or Serial ATA (SATA) slots with two LED indicators per slot, two
mini-SAS cable connectors for connecting the backplane to the integrated SAS 6/iR (PERC H200) or
PERC 6/i (PERC H700), a 10-pin planar signal connector, and an 8-pin PDB power connector.
For SATA and SAS mixing, two SAS drives (in bay 0 and 1) are supported with the 2.5‖ or 3.5‖
backplane. In this configuration, one pair of drives will be SAS and the remaining six drives will be
SATA.
12.2 Internal Hard Disk Drives
The T610 system supports up to eight 2.5‖ or 3.5‖ hard disk drives. See Table 11 for information on
supported hard drives. For the most up-to-date information on supported hard drives, visit Dell.com.
Table 11.
Supported Hard Drives
Form Factor
Capacity
Speed
Type
2.5‖
160GB, 250GB, 500GB, 1TB
7.2K
SATA
2.5‖
500GB, 1TB
7.2K
NL SAS
2.5‖
146GB, 300GB, 600GB, 900GB
10K
SAS
2.5‖
73GB, 146GB
15K
SAS
2.5‖
50GB, 100GB
N/A
SATA SSD
2.5‖
149GB
N/A
SAS SSD
3.5‖
250GB, 500GB, 1TB, 2TB
7.2K
SATA
3.5‖
500GB, 1TB, 2TB, 3TB
7.2K
NL SAS
3.5‖
146GB
10K
SAS
3.5‖
146GB, 300GB, 450GB, 600GB
15K
SAS
The following additional guidelines apply for hard-drive configurations:
 Up to eight SAS or up to eight SATA drives are supported
 For SAS and SATA mixing, two SAS and up to six SATA drives are possible (two SAS drives must
be installed in slots 0 and 1)
 One mixed 2.5‖ and 3.5‖ hard drive configuration is allowed:
o A pair of 2.5‖ 10,000 rpm SAS drives must be installed with an adapter in a 3.5‖ hard
drive carrier in drive slots 0 and 1
o The remaining hard drives must be 3.5‖ hard drives and must be either all SAS or all
SATA
 Solid state drives (SSDs) require the PERC 6/i (PERC H700) integrated storage controller and
cannot be mixed with any other type of hard drive
12.2.1 Hard Disk Drive Carriers
The T610 supports the Dell 2.5‖ and 3.5‖ hard drive carriers. See Figure 9.
PowerEdge T610 Technical Guide
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Dell
Figure 9.
Dell 2.5” Hard Drive Carrier
12.2.2 Empty Drive Bays
For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling,
maintain a uniform appearance to the unit, and provide EMI shielding.
The T610 does not support diskless configuration.
12.2.3 Hard Drive LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED
is driven by the disk drive during normal operation. The bicolor LED is controlled by the storage
enclosure processor (SEP) device on the backplane. Both LEDs are used to indicate certain conditions
under direction of a storage controller.
For more information, see the Hard-Drive Indicator Patterns section in the About Your System
chapter in the Dell PowerEdge T610 Systems Hardware Owner’s Manual on Support.Dell.com.
12.3 RAID Configurations
See Table 12 for information on factory RAID configurations. For information on additional
configurations, visit Dell.com.
Table 12.
Factory RAID Configurations
Non-Mixed Drives
All SATA, all SAS, or
all SSD
Configuration
Type
Configuration
Description
Min HDD
Max HDD
0
Integrated SAS/SATA No
RAID (SAS 6/iR, PERC H200)
2.5‖ = 1
3.5‖ = 1
2.5‖ = 8
3.5‖ = 8
MSS
SAS/SATA— No
RAID
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Non-Mixed Drives
All SATA, all SAS, or
all SSD
Configuration
Type
Configuration
Description
Min HDD
Max HDD
1
MSSR0
Integrated SAS/SATA RAID 0
(SAS 6/iR, PERC H200,
PERC6/i, PERC H700)
2.5‖ = 1
3.5‖ = 1
2.5‖ = 8
3.5‖ = 8
2
MSSR1
Integrated SAS/SATA RAID 1
(SAS 6/iR, PERC H200,
PERC6/i, PERC H700)
2.5‖ = 2
3.5‖ = 2
2.5‖ = 2
3.5‖ = 2
3
MSSR5
Integrated SAS/SATA RAID 5
(PERC 6/i, PERC H700)
2.5‖ = 3
3.5‖ = 3
2.5‖ = 8
3.5‖ = 8
4
MSSR6
Integrated SAS/SATA RAID 6
(PERC 6/i, PERC H700)
2.5‖ = 4
3.5‖ = 4
2.5‖ = 8
3.5‖ = 8
5
MSSR10
Integrated SAS/SATA RAID
10 (PERC 6/i, PERC H700)
2.5‖ = 4
3.5‖ = 4
2.5‖ = 8
3.5‖ = 8
6
MSSR1R1
Integrated SAS/SATA RAID
1/RAID 1 (SAS 6/iR, PERC
H200, PERC 6/i, PERC H700)
2.5‖ =
2+2
3.5‖ =
2+2
2.5‖ = 2+2
3.5‖ = 2+2
7
MSSR1R5
Integrated SAS/SATA RAID
1/RAID 5 (PERC 6/i, PERC
H700)
2.5‖ =
2+3
3.5‖ =
2+3
2.5‖ = 2+6
3.5‖ = 2+6
12
MSSR1
Integrated SSD RAID 1
(PERC 6/i, PERC H700)
2.5‖ = 2
3.5‖ =
N/A
2.5‖ = 2
3.5‖ =
N/A
SAS/SATA—
RAID
SSD—RAID
PowerEdge T610 Technical Guide
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Non-Mixed Drives
All SATA, all SAS, or
all SSD
Configuration
Type
SSD—RAID
Configuration
Description
Min HDD
Max HDD
13
MSSR5
Integrated SSD RAID 5 (PERC
6/i, PERC H700)
2.5‖ = 3
3.5‖ =
N/A
2.5‖ = 8
3.5‖ =
N/A
14
MSSR10
Integrated SSD RAID 10
(PERC 6/i, PERC H700)
2.5‖ = 4
3.5‖ =
N/A
2.5‖ = 8
3.5‖ =
N/A
Mixed SATA + SAS
Min 2xSAS + 1xSATA
2.5” = Max 2xSAS +
6xSATA
3.5” = Max 2xSAS +
6xSATA
Configuration
Type
Configuration
Description
Min HDD
Max HDD
SAS + SATA—
No RAID
8
MSS-X
Integrated SAS/SATA No
RAID (SAS 6/iR, PERC H200)
2.5‖ = 3
3.5‖ = 3
2.5‖=6
3.5‖=6
9
MSSR1R1X
Integrated SAS/SATA RAID
1/RAID 1 (SAS 6/iR, PERC
6/i, PERC H200, PERC H700)
2.5‖ =
2+2
3.5‖ =
2+2
2.5‖ = 2+2
3.5‖ = 2+2
11
MSSR1R5X
Integrated SAS/SATA RAID
1/RAID 5 (PERC 6/i, PERC
H700)
2.5‖ =
2+3
3.5‖ =
2+3
2.5‖ = 2+6
3.5‖ = 2+6
SAS + SATA—
RAID
Mixed SSD + SAS
Min 2xSSD + 1xSAS
2.5” = Max 2xSSD +
6xSAS
Configuration
Type
Configuration
Description
Min HDD
Max HDD
15
Integrated SSD/SAS RAID
1/RAID 5 (PERC 6/i, PERC
H700)
2.5‖ =
2+3
3.5‖ =
N/A
2.5‖ =
2+6
3.5‖ =
N/A
MSSR1R5-X
SSD + SAS—
RAID
PowerEdge T610 Technical Guide
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12.4 Storage Controllers
12.4.1
SAS 6/iR
The T610 internal SAS 6/iR HBA is an expansion card that installs into the dedicated internal storage
slot. It incorporates two four-channel SAS IOCs for connection to SAS or SATA hard disk drives. It is
designed in a form factor that allows the same card to be used in the PowerEdge T610 and
PowerEdge T610.
12.4.2
PERC 6/i
If you want an internal RAID solution, select the PERC 6/i or PERC H700. The PERC 6/i uses the LSI
1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2 memory, and it
installs into the dedicated internal storage slot. A battery is also available for backup.
12.4.3
PERC H200
The H200 SAS HBA is an expansion card that installs into the dedicated internal storage slot. It
incorporates two four-channel 6 Gb/s SAS IOCs for connection to SAS hard disk drives. It is designed
in a form factor that allows the same card to be used in other 11G 2U rack-form factor platforms.
12.4.4
PERC H700
If you want an internal RAID solution, select the PERC H700 or PERC 6/i. The PERC H700 card has its
own processor with a PCI Express Gen2 host interface and DDR2 memory and installs into the
dedicated internal storage slot. A battery is also available for backup. It supports the internal 6 Gb/s
backplane interface for internal storage options (SAS, SATA, or SSD HDD). The PowerEdge T610
supports both 256MB and 512MB cache options on the internal H700.
Table 13.
Product
PERC
SAS/
SATA
SAS
HBA
SAS/
SATA
Usage
Storage Card Support Matrix
T610 Support
Slot
PCIe PCI
Con Bracket
I/O
Con
x8
No
x4
int
x4
int
0, 1, 5,
6, 10,
50, 60
Yes
Yes
x4
ext
x4
ext
0, 1, 5,
6, 10,
50, 60
Yes
Yes
x4
ext
x4
ext
0, 1, 5,
10, 50
Yes
0, 1
No
N/A
No
PERC 6/i
Integrated
(PERC
H700)
Internal Backplane
Storage (HDD, SSD)
Yes—Max 1
Storage
slot
PERC 6/E
Adapter
(PERC
H800)
External SAS / SATA
Storage
Yes—Max 2
(MD1000 and
MD1020)
PCIe
slot
PERC 5/E
Adapter
External Legacy
Storage
Yes—Max 2
(MD1000 only)
PCIe
slot
SAS 6/iR
Integrated
(PERC
H200)
Internal Backplane
Storage
(No tape or SSD
support)
Yes—Max 1
Storage
slot
x8
No
x4
int
x4
int
SAS 5/iR
Adapter
Internal SAS tape
Yes—Max 2
PCIe
slot
x8
Yes
x4
int
PowerEdge T610 Technical Guide
x8
x8
RAID
Battery
Backup
43
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Product
Usage
SAS 5/E
Adapter
(SAS 6G
HBA)
ICH
SATA
LSI
SCSI
PCIe PCI
Con Bracket
I/O
Con
Yes—Max 2
PCIe
slot
x8
Yes—2 ports for
Optical and/or
Tape
N/A
N/A
Yes—Max 2
PCIe
slot
T610 Support
Slot
External SAS (DAS,
tape)
On Planar
via
chipset
Internal SATA
optical/tape (No
HDD)
LSI 2032
Adapter
Internal/External
SCSI tape or
external legacy SCSI
storage
x4
RAID
Battery
Backup
Yes
x4
ext
x4
ext
None
No
N/A
x1
int
N/A
N/A
Yes
x1
int
x1
ext
N/A
N/A
A maximum of 2 external storage controllers (Dell PERC and SAS cards) are allowed in the system in
addition to the integrated storage controller.
12.5 Optical Drives
Optical drives are optional in all PowerEdge T610 systems and connect to the planar through the
SATA interface. The following internal optical drives are available on the PowerEdge T610:


DVD-ROM
DVD+RW
If an optical drive is not ordered with the system, a blank is installed in its place. In the absence of a
tape drive, an optional second SATA optical drive can be installed in the bay adjacent to the first
optical drive. IDE (PATA) optical drives are not supported.
12.6 Tape Drives
The PowerEdge T610 supports a maximum of one half-height tape backup unit (TBU), which is
optional in all T610 systems and connects to the planar SATA, SCSI controller card, or SAS controller
card. IDE tape drives are not supported.
Internal and external tape drives and tape libraries are supported. For more information on
supported tape drives and tape libraries, see http://www.dell.com/storage.
12.7 External Storage Support
External storage devices are supported. For more information, see http://www.dell.com/storage.
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13 Video
The PowerEdge T610 Integrated Dell Remote Access Controller (iDRAC6) incorporates an integrated
video subsystem, connected to the 32-bit PCI interface of the ICH9. This logic is based on the
Matrox® G200. The device only supports 2D graphics. The integrated video core shares its video
memory with the iDRAC6 128 MB DDR2 application space memory. This memory is also used for the
KVM buffer. The resolutions supported are listed in Table 14.
Table 14.
Resolution
Graphics Video Modes
Refresh Rate (Hz)
Color Depth
(bit)
640 x 480
60, 72, 75, 85
8, 16, 32
800 x 600
56, 60, 72, 75, 85
8, 16, 32
1024 x 768
60, 72, 75, 85
8, 16, 32
1152 x 864
75
8, 16, 32
1280 x 1024
60, 75, 85
8, 16
1280 x 1024
60
32
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14 Rack Information
14.1 Overview
The ReadyRails™ sliding rail system for the PowerEdge T610 provides toolless support for racks with
square or unthreaded round mounting holes including all generations of Dell racks. They also support
tooled mounting in 4-post threaded racks using an optional adapter brackets kit. The optional cable
management arm (CMA) can be mounted on either the left or right side of the sliding rails without
the use of tools for fast and easy deployment.
The T610 is not compatible with any other Dell rails including previous generation rails, but it does
use the same rails as the T710. The T610 supports sliding rails only. Static rails are not supported.
Mounting in 2-post racks is not supported.
14.2 Rails
The ReadyRails sliding rails for the T610 support toolless mounting in 19‖-wide, EIA-310-E compliant
square hole and unthreaded round hole racks and are available with or without the optional cable
management arm (CMA).
Figure 10. T610 ReadyRails Sliding Rails with Optional CMA
The rails can be used in a threaded-hole rack only if threaded rack adapter brackets are installed.
The threaded rack adapter brackets are first mounted to the EIA flanges in the rack, and then the
rails are mounted into the brackets. The design of the brackets has been optimized to limit the
forward shift of the system in the rack to only 17.3 mm.
The adapter bracket kit includes 6 brackets to accommodate different rail lengths, plus 4 sets of
custom screws in common thread sizes. A detailed Getting Started Guide is included in the kit along
with directions for installing the brackets and mounting the rails into the brackets.
Depending on the depth of the rack used, it may be necessary to remove the server’s bezel in order
to close the door of the rack. A minimum of 58 mm will be needed between the back surface of the
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door panel and the front face of the EIA flange for the front door to close with the 11G server bezel
installed.
Figure 11. 2U Threaded Rack Adapter Brackets Kit
Below is a summary of the rack types supported by the T610 rails. Note that mounting in 2-post racks
is not supported.
Table 15.
Supported Racks
Rack Types Supported
Product
T610
Rail
ID
C1
Mounting Interface
ReadyRails
Rail
Type
4-Post
2-Post
Square
Round
Thread
Flush
Center
√
√
√*
X
X
Sliding
*Requires the 2U Threaded Rack Adapter Brackets Kit (Dell part number PKCR1)
Other factors to consider when deploying the T610 include the spacing between the front and rear
mounting flanges of the rack, the type and location of any equipment mounted in the back of the
rack such as power distribution units (PDUs), and the overall depth of the rack.
Table 16.
Rail Adjustability Ranges and Depth
Rail Adjustability Range (mm)
Product
T610
Rail
ID
C1
Mounting
Interface
ReadyRails
Rail
Type
Sliding
Rail Depth (mm)
Square
Round
Threaded
Min
Max
Min
Max
Min
Max
Without
CMA
With
CMA
692
756
678
749
657
770
760
840
The adjustment range of the rails is a function of the type of rack in which they are being mounted.
The min-max values listed above represent the allowable distance between the front and back
mounting flanges in the rack. Rail depth represents the minimum depth of the rail as measured from
the rack front mounting flanges when the back rail bracket is positioned all the way forward.
14.3 Cable Management Arm (CMA)
The optional cable management arm (CMA) for the T610 organizes and secures the cords and cables
exiting the back of the server and unfolds to allow the server to extend out of the rack without
having to detach the cables.
Some key features of the T610 CMA include:


Large U-shaped baskets to support dense cable loads
Open vent pattern for optimal airflow
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



Fully reversible (can be mounted on either side) with no conversion required
Hook-and-loop straps are used rather than plastic tie wraps to eliminate the risk of cable
damage during cycling
A low profile fixed tray to both support and retain the CMA in its fully closed position
Both the CMA and the tray mount without the use of tools using simple and intuitive snap-in
designs
14.4 Rack View
The T610 ReadyRails sliding rails are a drop-in design, meaning that the system is installed vertically
into the rails by inserting the shoulder nuts on the sides of the system into the J-slots in the inner
rail members with the rails in the fully extended position.
Figure 12. T610 Mounted in C1 Sliding Rails
The T610 CMA can be mounted to either side of the rails without the use of tools or the need for
conversion, but it is recommended that it be mounted on the side opposite the power supplies to
allow easier access to the power supplies for service or replacement. Figure 13 shows a T610 system
with a CMA installed.
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Figure 13. T610 CMA Mounted on the Side Opposite the Power Supplies (Recommended)
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15 Operating Systems
For detailed information, see the following:


Operating System Support Matrix for Dell PowerEdge Systems on www.Dell.com
Dell PowerEdge T610 Systems Getting Started With Your System guide on Support.Dell.com
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16 Systems Management
16.1 Overview
Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of
managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell
developed systems management solutions gives you choice and flexibility, so you can simplify and
save in IT environments of any size. To help you meet your server management demands, Dell offers
Dell OpenManage™ systems management solutions for:
•
•
•
Deployment of one or many servers from a single console
Monitoring of server and storage health and maintenance
Update of system, operating system, and application software
Dell offers IT management solutions for organizations of all sizes—priced and sized appropriately, and
supported comprehensively.
16.2 Server Management
A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are
included with the product. ISO images are also available. A brief description of available content:
•
Dell Systems Build and Update Utility (SBUU): Dell Systems Build and Update Utility assists in
OS install and pre-OS hardware configuration and updates.
•
Server Update Utility (SUU): This DVD has an inventory tool for managing updates to
firmware, BIOS, and drivers for either Linux or Windows varieties.
•
OpenManage Server Administrator (OMSA): The OpenManage Server Administrator tool
provides a comprehensive, one-to-one (one console to one server) systems management
solution, designed for system administrators to manage systems locally and remotely over a
network. OMSA allows system administrators to focus on managing their entire network by
providing comprehensive one-to-one systems management.
•
Management Console: Dell IT Assistant (ITA) is also included, as well as tools to allow access
to our remote management products. These tools are Remote Access Service for iDRAC and
the Baseboard Management Controller (BMC) Utility.
•
Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension
snap-in to the Microsoft Active Directory. This allows you to manage Dell specific Active
Directory objects. The Dell-specific schema class definitions and their installation are also
included on the DVD.
•
Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the
latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can
use to update your system.
•
eDocs: The section includes PDF files for PowerEdge systems, storage peripherals, and Dell
OpenManage™ software.
•
Dell Management Console (DMC): The Dell Management Console is a systems management
console that enables systems administrators to discover and inventory devices on your
network. It provides functions such as health and performance monitoring of networked
devices, and patch management capabilities for Dell systems. DMC differs from the IT
Assistant management console (described above) in that with DMC, value-add plug-ins that
enable advanced functionality can be purchased and added to the base DMC product.
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16.3 Embedded Server Management
The PowerEdge T610 implements circuitry for the next generation of Embedded Server Management.
It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC (Integrated Dell
Remote Access Controller) is responsible for acting as an interface between the host system and its
management software and the periphery devices.
iDRAC6 provides features for managing the server remotely or in data center lights-out
environments.
Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.
16.4 Dell Lifecycle Controller and Unified Server Configurator
Embedded management is comprised of interdependent pieces:
•
•
•
Dell Lifecycle Controller
Unified Server Configurator
iDRAC6
Dell Lifecycle Controller powers the embedded management features. It includes integrated and
tamper-proof storage for system-management tools and enablement utilities (firmware, drivers,
etc.). Lifecycle Controller enables pre-OS server deployment, OS installation, platform updates,
platform configuration, and diagnostics capabilities.
Dell Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server
provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key
within 10 seconds of the Dell logo appearance during the system boot process. Table 17 details the
current functionality enabled by the USC.
Table 17.
Unified Server Configurator Features and Description
Feature
Description
Faster O/S Installation
Drivers and the installation utility are embedded on system, so no
need to scour Dell.com.
Faster System Updates
Integration with Dell support automatically directed to latest
versions of the Unified Server Configurator, iDRAC, RAID, BIOS, NIC,
and power supply.
Update Rollback
Ability to recover to previous ―known good state‖ for all updatable
components.
More Comprehensive Diagnostics
Diagnostic utilities are embedded on system.
Simplified Hardware Configuration
Detects RAID controller and allows user to configure virtual disk and
choose virtual disk as boot device, eliminating the need to launch a
separate utility. Also provides configuration for iDRAC, BIOS, and
NIC/LOM.
16.5 Integrated Dell Remote Access Controller
The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet
straightforward management of remote servers, by delivering ―as if you are there‖ presence and
control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s),
whether that server is located in a different room, a different building, a different city, or in a
different country. iDRAC6 is a purchasable option and is available as three offerings: iDRAC6 Express,
iDRAC6 Enterprise, and Virtual Flash (vFlash) media:
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


iDRAC6 Express is most appropriate for small-to-medium customers with limited remote
management needs.
iDRAC6 Enterprise is appropriate for large data center customers with distributed servers.
iDRAC6 with vFlash Media is provided for large enterprise customers with requirements for
system management automation.
16.6 iDRAC Express
The iDRAC Express is standard on the PowerEdge T610. In addition to providing a Lifecycle
Controller, the iDRAC6 Express offers the following key features:
•
•
•
•
Graphical web interface
•
Power control and management with the ability to limit server power consumption and
remotely control server power states
Standard-based interfaces
Server Sensor monitoring and fault alerting
Secure operation of remote access functions including authentication, authorization, and
encryption
•
Advanced troubleshooting capabilities
For more information on iDRAC6 Express features, see Table 18.
16.7 iDRAC6 Enterprise
The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6
Enterprise connects directly to the T610 planar and is mounted parallel to the planar with stand-offs.
Key features for the iDRAC6 Enterprise include:
•
•
•
•
Scripting capability with Dell’s Racadm command-line
Remote video, keyboard, and mouse control with Virtual Console
Remote media access with Virtual Media
Dedicated network interface
16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media
The iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is an 8 GB Dell branded
SD card that enables a persistent 256 MB virtual flash partition. The vFlash Media delivers the
following key features:



Support for 8 GB SD storage media
Can be used as a repository for a pre-OS image, eliminating the need to maintain a network
infrastructure for OS deployment
Can also be used for permanent diagnostics image for use after system failures, or permanent
failsafe image for periodic configuration changes
A more detailed feature list for iDRAC6 Express, iDRAC6 Enterprise, and vFlash Media is shown in
Table 18.
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Table 18.
Feature
Features List for Base Management Functionality, iDRAC, and vFlash Media
Base Management
Functionality
iDRAC 6 Express
iDRAC6 Enterprise
vFlash Media
Interface and Standards Support



Web-based GUI



SNMP



WSMAN



SMASH-CLP





IPMI 2.0

Racadm commandline
Conductivity
Shared/Failover
Network Modes




IPv4




VLAN Tagging




IPv6



Dynamic DNS





Dedicated NIC
Security and Authentication
Role-based
Authority




Local Users




Active Directory



SSL Encryption



Remote Management and Remediation
Remote Firmware
Update




Server power
control




Serial-over-LAN
(with proxy)




Serial-over-LAN (no
proxy)



Power capping



Last crash screen
capture



Boot capture



Serial-over-LAN





Virtual media
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Feature
Base Management
Functionality
iDRAC 6 Express
iDRAC6 Enterprise
vFlash Media
Virtual console


Virtual console
sharing



Virtual flash
Monitoring



Real-time Power
Monitoring



Real-time Power
Graphing



Historical Power
Counters











Sensor Monitoring
and Alerting

Logging Features
System Event Log

RAC Log
Trace Log
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17 Peripherals
The T610 supports the following USB devices:




DVD (bootable; requires two USB ports)
USB key (bootable)
Keyboard (only one USB keyboard is supported)
Mouse (only one USB mouse is supported)
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Appendix A.
Statement of Volatility
The Dell PowerEdge T610 contains both volatile and non-volatile (NV) components. Volatile
components lose their data immediately upon removal of power from the component. Non-volatile
components continue to retain their data even after the power has been removed from the
component. Components chosen as user-definable configuration options (those not soldered to the
motherboard) are not included in the Statement of Volatility. Configuration option information
(pertinent to options such as microprocessors, system memory, remote access controllers, and
storage controllers) is available by component separately. The NV components detailed in Table 19
are present in the PowerEdge T610 server.
Table 19.
T610 Volatility Table
Server BIOS Memory
Details
Size:
32Mbit
Type [Flash PROM, EEPROM]:
Flash EEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [boot code]
Boot Code and Configuration Information
How is data input to this memory?
Loading flash memory requires a vendorprovided firmware file and loader program
which is executed by booting up the system
from a floppy or OS-based executable
containing the firmware file and the loader. A
system loaded with arbitrary data in firmware
memory would not operate.
How is this memory write protected?
Software write protected
Server CMOS (Complementary Metal-Oxide
Semiconductor) Memory
Details
Size:
512 bytes
Type: [Flash PROM, EEPROM]:
Battery-backed NVRAM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [boot code]
RTC and Configuration settings
How is data input to this memory?
F2 Setup Menu during POST
How is this memory write protected?
N/A
Remarks
Jumper on motherboard can be used to clear to
factory default settings
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LOM (LAN [Network Interface] on
Motherboard) Memory
Details
Size:
4Mb (1MB)
Type: [Flash PROM, EEPROM]:
Flash
Can user programs or operating system write
data to it during normal operation?
Yes, under software control.
Purpose? [boot code]
Contains LOM boot code and configuration data
How is data input to this memory?
Requires vendor provided firmware file and
loader program used during factory assembly or
possible field update. A system loaded with
arbitrary data in firmware memory would not
operate.
How is this memory write protected?
Software control
Server System FRU
Details
Size:
4KB
Type: [Flash PROM, EEPROM]:
SEEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [boot code]
Store System FRU
How is data input to this memory?
BMC controller write
How is this memory write protected?
Not write protected
Power Supply FRU
Details
Size:
256 bytes
Type: [Flash PROM, EEPROM]:
SEEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [boot code]
Store power supply information
How is data input to this memory?
Programmed by the power supply manufacturer
How is this memory write protected?
Not write protected
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TPM (Trusted Platform Module; for boards
shipped outside of China. Boards sold to
destinations in China have S-TPM.)
Details
Size:
Unspecified size of user ROM, RAM, EEPROM;
128 bytes of OTP memory included
Type: [Flash PROM, EEPROM]:
ROM, RAM, EEPROM
Can user programs or operating system write
data to it during normal operation?
Yes, operating systems and applications that
conform to the TCG standard can write data to
the TPM during normal operation. Access to the
NV Storage is controlled by the TPM owner.
Purpose? [boot code]
Trusted Platform Module NV storage. May be
used to securely storage of encryption keys.
How is data input to this memory?
TCG TPM Specification defined command
interface or Using TPM Enabled operating
systems
How is this memory write protected?
As defined by the TCG TPM Specification,
protection of this NV memory area is
configurable by the TPM owner.
Backplane Firmware and FRU
Details
Size:
32KB
Type: [Flash PROM, EEPROM]:
Flash
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [boot code]
Backplane Firmware and FRU data storage
How is data input to this memory?
Loading flash memory requires a vendor
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS based executable
containing the firmware file and the loader.
System loaded with arbitrary data in firmware
memory would not operate.
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Embedded Bootable Memory Device
Details
Size:
1GB
Type: [Flash PROM, EEPROM]:
MMC
Can user programs or operating system write
data to it during normal operation?
Yes
Purpose? [boot code]
Optional embedded boot device
How is data input to this memory?
Factory installed or via USB bus
How is this memory write protected?
Not write protected
Server BMC (Baseboard Management
Controller) Firmware Flash Memory
Details
Size:
16MB Flash
Type: [Flash PROM, EEPROM]:
SPI Flash
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [boot code]
Stores the BMC Firmware
How is data input to this memory?
Loading flash memory requires a vendor
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS based executable
containing the firmware file and the loader. A
system loaded with arbitrary data in firmware
memory would not operate.
How is this memory write protected?
Software write protected
To obtain optional component information, please refer to the Dell Statement of Volatility for the
individual components. Please direct any questions to your Dell Marketing contact.
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Appendix B.
Certifications
A.1 Regulatory Certifications
Regulatory compliance certificates can be located at the following sites:


http://ausreactorprd01/reactor/xCertSearch.asp
http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance
/dec_conform?c=us&l=en&s=corp
A.2 Product Safety Certifications
The product has been certified and bears the Mark, as applicable, of the Product Safety authorities
as indicated in Table 20.
Table 20.
Product Safety Certifications
Country/Region
Authority or Mark
Argentina
IRAM
Belarus
BELLIS
Canada
SCC
China
CNCA or CCC
Croatia
KONCAR
European Union
CE
Germany
TUV
IECEE
IECEE CB
Israel
SII
Kazakhstan
OTAN – CKT
Kenya
KEBS
Kuwait
KUCAS
Mexico
NYCE or NOM
Moldova
INSM
Nigeria
SONCAP
Norway
NEMKO
Russia
GOST
Saudi Arabia
KSA ICCP
South Africa
NRCS
Taiwan
BSMI
Ukraine
UKRTEST or
UKRSERTCOMPUTER
United States
NRTL
Uzbekistan
STZ
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A.3 Electromagnetic Compatibility
The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated
in Table 21.
Table 21.
Electromagnetic Compatibility Certifications
Country/Region
Authority or Mark
Australia/New
Zealand
ACMA or C-Tick
Belarus
BELLIS
Bosnia &
Herzegovina,
Montenegro, Serbia
KVALITET
Canada
ICES
Class A
China
CNCA or CCC
Class A
Croatia
KONCAR
Class A
European Union
CE
Class A
Israel
SII
Class A
Japan
VCCI
Class A
Kazakhstan
OTAN – CKT
Class A
Moldova
INSM
Class A
Norway
NEMKO
Class A
Russia
GOST
Class A
South Africa
SABS
Class A
South Korea
KCC
Class A
Taiwan
BSMI
Class A
Ukraine
UKRTEST or UKRSERTCOMPUTER
Class A
United States
FCC
Class A
Uzbekistan
STZ
Class A
Vietnam
ICT
Class A
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Class A
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A.4 Ergonomics, Acoustics and Hygienics
The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and
Hygienics authorities as indicated in Table 22.
Table 22.
Ergonomics, Acoustics and Hygienics
Country/Region
Authority or Mark
Belarus
BELLIS
Germany
GS
Russia
GOST
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Appendix C.
Additional Information and Options
The PowerEdge T610 system conforms to the industry standards detailed in Table 23.
Table 23.
Industry Standards
Standard
URL for Information and Specifications
ACPI
Advance Configuration and
Power Interface Specification,
v2.0c
http://www.acpi.info/
Energy Star
EPA Version 1.0 of the
Computer Server specification
http://www.energystar.gov/index.cfm?c=archives.enterprise
_servers
Ethernet
IEEE 802.3-2005
http://standards.ieee.org/getieee802/802.3.html
IPMI
Intelligent Platform
Management Interface, v2.0
http://www.intel.com/design/servers/ipmi/
DDR3 Memory
DDR3 SDRAM Specification,
Rev. 3A
http://www.jedec.org/download/search/JESD79-3A.pdf
LPC
Low Pin Count Interface
Specification, Rev. 1.1
http://developer.AMD.com/design/chipsets/industry/lpc.ht
m
PCI Express
PCI Express Base Specification
Rev. 2.0
http://www.pcisig.com/specifications/pciexpress/
PMBus
Power System Management
Protocol Specification, v1.1
http://pmbus.info/specs.html
SAS
Serial Attached SCSI, v1.1
http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf
SATA
Serial ATA Rev. 2.6;
SATA II, Extensions to SATA
1.0a, Rev. 1.2
http://sata-io.org/
SMBIOS
System Management BIOS
Reference Specification, v2.6
http://www.dmtf.org/standards/smbios/
TPM
Trusted Platform Module
Specification, v1.2
http://www.trustedcomputinggroup.org/resources/tpm_mai
n_specification
UEFI
Unified Extensible Firmware
Interface Specification, v2.1
http://www.uefi.org/specs/
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Standard
URL for Information and Specifications
USB
Universal Serial Bus
Specification, Rev. 2.0
http://www.usb.org/developers/docs/
Windows Logo
Windows Logo Program System
and Device Requirements,
v3.10
http://www.microsoft.com/whdc/winlogo/hwrequirements.
mspx
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