datasheet for ES/SMM5144XZ by Sumitomo Electric Device Innovations U.S.A.

datasheet for ES/SMM5144XZ by Sumitomo Electric Device Innovations U.S.A.
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
FEATURES
• Wafer Level Chip Scale Package with Solder Ball
• Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and
x2 multiplier
• Conversion Gain : 12dB
• Input Third Order Intercept Point (IIP3) :+2dBm
• Low Noise Figure : 3.6dB
• +2dBm LO Drive Level
DESCRIPTION
The ES/SMM5144XZ is a image-rejection down converter MMIC for
applications in the 24 to 30GHz frequency range. The device consists of a
image rejection resistive PHEMT mixer, Low Noise Amplifier, LO Buffer
amplifier and x2 multiplier in a flip chip form. The flip chip die can be used in
solder reflow process.
Sumitomo Electric Device Innovations’s stringent Quality Assurance Program
assures the highest reliability and consistent performance.
ABSOLUTE MAXIMUM RATING
Item
Symbol
Rating
6
Unit
-1
Drain Voltage
VDD
Gate Voltage (for Gain Control)
Input RF Power
Input LO Power
Storage Temperature
VGC
PinRF
PinLO
Tstg
V
0
10
-40 to +125
V
dBm
dBm
deg.C
Symbol
Conditions
Unit
VDD
5
V
VGC
PinLO
Tc
-0.5 to 0
V
dBm
deg.C
RECOMMENDED OPERATING CONDITIONS
Item
Drain Voltage
Gate Voltage (for Gain Control)
Input LO Power
Operating Case Temperature
+2
-40 to +85
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25deg.C)
Item
RF Frequency Range
IF Frequency Range
LO Frequency Range
LO Input Power
Conversion Gain
Gain Control Range
Noise Figure
Input 3rd.Order Intercept Point
Image rejection
RF Return Loss
LO-RF Isolation
LO-IF Isolation
RF-IF Isolation
Current Consumption @ LOA
VGC Voltage
Symbol
Test Conditions
fRF
fIF
fLO
PinLO
Gc
Gain
NF
IIP3
IR
RLRF
ISOLO-RF
ISOLO-IF
ISORF-IF
IDD_LOA
VGC
VDD_LOA=5V
VDD_LNA=5V
IDD_LNA=110mA *1
IF=1000MHz *2
-0.5
*1. Adjust V GC voltage between 0 to -0.5V to set to IDD_LNA=110mA
*2. Electrical characteristics are tested with IF freq.=1000MHz and external IF 90°hybrid.
Edition 0.3
Dec. 2012
Limits
Min.
24.0
DC
10
--9
-----------------
1
Unit
Typ.
2
12
10
3.6
2
20
8
30
50
50
100
---
Max.
30.0
4.0
17.0
--------------------145
0.0
GHz
GHz
GHz
dBm
dB
dB
dB
dBm
dB
dB
dB
dB
dB
mA
V
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Noise Figure vs. RF Frequecy
Conversion Gain vs. RF Frequency
@ VDD=5V, IDD_LNA=110mA, TC=+25deg.C
PinLO=+2dBm, fIF=1GHz (USB; fIF=fRF-fLO)
16
8
14
7
12
6
10
5
NF (dB)
GC (dB)
@ VDD=5V, IDD_LNA=110mA, TC=+25deg.C
PinLO=+2dBm, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
8
6
4
3
4
2
2
1
0
0
19 20 21 22 23 24 25 26 27 28 29 30 31 32
19 20 21 22 23 24 25 26 27 28 29 30 31 32
RF Frequency (GHz)
RF Frequency (GHz)
Input IP3 vs. RF Frequency
Image Rejection vs. RF Frequency
@ VDD=5V, IDD_LNA=110mA, TC=+25deg.C
PinLO=+2dBm, PinRF=-17dBm(2tone), fIF=1GHz (USB; fIF=fRF-fLO)
@ VDD=5V, IDD_LNA=110mA, TC=+25deg.C
PinLO=+2dBm, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
8
6
40
IIP3 (dBm)
Image Rejection (dB)
50
30
20
4
2
0
10
-2
0
-4
19 20 21 22 23 24 25 26 27 28 29 30 31 32
19 20 21 22 23 24 25 26 27 28 29 30 31 32
RF Frequency (GHz)
RF Frequency (GHz)
Edition 0.3
Dec. 2012
2
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Conversion Gain vs. IDD_LNA
Noise Figure vs. IDD_LNA
@ VDD=5V, TC=+25deg.C
PinLO=+2dBm, fIF=1GHz (USB; fIF=fRF-fLO)
@ VDD=5V, TC=+25deg.C
PinLO=+2dBm, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
18
10
16
9
14
8
7
NF (dB)
GC (dB)
12
10
8
4
IDD_LNA=120mA
3
IDD_LNA=110mA
2
IDD_LNA=130mA
1
IDD_LNA=110mA
IDD_LNA=105mA
2
5
4
IDD_LNA=130mA
6
6
0
0
19
20
21
22
23
24
25
26
27
28
29
30
31
32
19
20
21
RF frequemcy (GHz)
22 23
24 25 26 27 28 29
RF frequemcy (GHz)
30
31
32
Input IP3 vs. RF Frequency
Image Rejection vs. RF Frequency
@ VDD=5V, TC=+25deg.C
PinLO=+2dBm, PinRF=-17dBm(2tone), fIF=1GHz (USB; fIF=fRF-fLO)
@ VDD=5V, TC=+25deg.C
PinLO=+2dBm, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
50
6
45
5
40
4
3
35
IIP3 (dBm)
IR (dB)
2
30
25
20
15
10
5
1
0
-1
IDD_LNA=130mA
-2
IDD_LNA=130mA
IDD_LNA=120mA
-3
IDD_LNA=120mA
IDD_LNA=110mA
-4
IDD_LNA=110mA
IDD_LNA=105mA
-5
IDD_LNA=105mA
-6
0
19
20
Edition 0.3
Dec. 2012
21
22 23
24 25 26 27 28 29
RF frequemcy (GHz)
30
31
19
32
20
21
22 23
24
25
26
27
RF frequemcy (GHz)
3
28 29
30
31
32
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Input IP3 vs. LO-in Power
Conversion Gain vs. LO-in Power
@ VDD=5V, IDD_LNA=110mA, TC=+25deg.C
fRF=26GHz, PinRF=-17dBm(2tone), fIF=1GHz (USB; fIF=fRF-fLO)
@ VDD=5V, IDD_LNA=110mA, TC=+25deg.C
fRF=26GHz, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
6
16
5
4
IIP3 (dBm)
GC (dB)
14
12
10
3
2
1
0
8
-1
-2
6
-3
-2
-1
0
1
2
3
4
5
6
-3
7
Image Rejection vs. LO-in Power
@ VDD=5V, IDD_LNA=110mA, TC=+25deg.C
fRF=26GHz, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
30
25
IR (dB)
20
15
10
5
0
-2
-1
0
1
2
3
4
5
6
7
LO in power (dBm)
Edition 0.3
Dec. 2012
-1
0
1
2
3
LO in power (dBm)
LO in power (dBm)
-3
-2
4
4
5
6
7
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Input IP3 vs. VGC
Conversion Gain vs. VGC
@ VDD=5V, TC=+25deg.C, PinLO=+2dBm, PinRF=-17dBm(2tone)
fRF=26GHz, fIF=1GHz (USB; fIF=fRF-fLO)
18
8
16
6
14
4
IIP3 (dBm)
GC (dB)
@ VDD=5V, TC=+25deg.C, PinLO=+2dBm, PinRF=-20dBm
fRF=26GHz, fIF=1GHz (USB; fIF=fRF-fLO)
12
10
2
0
8
-2
6
-4
4
-6
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
-0.6
-0.5
-0.4
-0.3
-0.1
0
0.1
Vgc (V)
Image Rejection vs. VGC
IDD vs. VGC
@ VDD=5V, TC=+25deg.C, PinLO=+2dBm, PinRF=-20dBm
fRF=26GHz, fIF=1GHz (USB; fIF=fRF-fLO)
@ VDD=5V, TC=+25deg.C, PinLO=+2dBm, PinRF=-20dBm
fRF=26GHz, fIF=1GHz (USB; fIF=fRF-fLO)
50
300
40
250
Total Current
200
30
Idd (mA)
Image Rejection (dB)
Vgc (V)
-0.2
20
Low Noise Amplifier
150
100
LO Amplifier
10
50
0
0
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
-0.6
Vgc (V)
Edition 0.3
Dec. 2012
-0.5
-0.4
-0.3
-0.2
Vgc (V)
5
-0.1
0
0.1
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Input IP3 vs. Temperature
Conversion Gain vs. Temperature
@ VDD=5V, IDD_LNA=110mA
PinLO=+2dBm, PinRF=-17dBm(2tone), fIF=1GHz (USB; fIF=fRF-fLO)
@ VDD=5V, IDD_LNA=110mA
PinLO=+2dBm, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
20
10
18
8
16
6
14
IIP3 (dBm)
GC (dB)
12
10
8
6
4
2
0
-2
4
-4
2
-6
0
19
20
21
22
23
24
25
26
27
28
29
30
31
19 20 21 22 23 24 25 26 27 28 29 30 31 32
32
RF Frequency (GHz)
RF Frequency (GHz)
Tc=25deg.C
Tc=-40deg.C
Tc=25deg.C
Tc=85deg.C
Image Rejection vs. Temperature
@ VDD=5V, IDD_LNA=110mA
PinLO=+2dBm, PinRF=-20dBm, fIF=1GHz (USB; fIF=fRF-fLO)
50
45
40
35
IR (dB)
30
25
20
15
10
5
0
19
20
21
22
23
24
25
26
27
28
29
30
31
32
RF Frequency (GHz)
Tc=25deg.C
Edition 0.3
Dec. 2012
Tc=-40deg.C
Tc=85deg.C
6
Tc=-40deg.C
Tc=85deg.C
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Chip outline
BUMP SIDE DOWN
BUMP SIDE UP
Symbol
Dimensions
(typ.)
A
0.396
A1
0.121
A2
0.275
b
0.168
D
2.37
D1
2.00
E
2.57
E1
2.00
e
0.40
MD
6
ME
6
N
36
aaa
0.07
bbb
0.046
ccc
0.03
ddd
0.07
eee
0.03
SIDE VIEW
NOTES :
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3.
BALL DESIGNATION PER JEDEC STD MS-028 AND JEP95
4.
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED.
5. PRIMARY DATUM C IS SEATING PLANE
6. ALLOY OF SOLDER BALL : Sn-3.0Ag-0.5Cu
Edition 0.3
Dec. 2012
7
Note
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Pin Assignment
1
2
3
4
5
6
A
B
C
D
E
F
Bump Side Down ( Die Top View)
Pin Assignment
Edition 0.3
Dec. 2012
1
2
3
4
5
6
A
VDD_LNA
GND
GND
GND
GND
VDD_LOA
B
GND
GND
GND
GND
GND
GND
C
VGC
GND
GND
GND
GND
GND
D
GND
GND
GND
GND
GND
GND
E
RFIN
GND
GND
GND
GND
LOIN
F
GND
GND
IFOUT(I)
IFOUT(Q)
GND
GND
8
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Application Circuit Block Diagram
VDD for LNA
C1
C2
x2
2
C2
RF in
(RF freq. ; 24 to 30GHz)
C1
C2
VGC
C1
VDD for LOA
7
1
6
3
4
LO in
(LO freq. ; 10 to 17GHz)
5
External Coupler
MURATA ; LDC32900M03B-703
Or equivalent
R1
IF out
(IF freq. ; DC to 4GHz)
Pin Assignment
Component List
Pin
Name
Name
Description
Value
1
VDD_LNA
C1
Capacitor
0.1uF
2
VGC
C2
Capacitor
100pF
3
RF Input
R1
Resister
50ohm
4, 5
IF Output
6
LO Input
7
VDD_LOA
*All bumps except Pin 1 to 7 are GND
Edition 0.3
Dec. 2012
9
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Marking
INDEX
XXXX
Part Number
( ex. SMM5144XZ
5144)
Bump Side Down ( Die Top View)
Edition 0.3
Dec. 2012
10
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
PCB and Solder-resist Pattern
Resist window for solder ball
( 0.18mm)
Solid-Filled via
Via hole
LOIN
VDD_LOA
IFOUT (Q)
WLCSP Die
VDD_LNA
IFOUT (I)
External IF hybrid
VGC
RFIN
Resist
Solid-Filled via
Via hole
RO4003C
Heat Sink
NOTES.
1) Core Material ; Rogers CORP. 4003
Thickness 0.2mm typ. , Er=3.38 typ.
2) Copper Foil Thickness ; 18um typ.
3) Finish Copper Foil ; Ni 1um min. / Au 0.1um max.
4) Resist ; +/- 20um.
5) All Dimensions are in mm.
6) Solid-filled via is used to prevent depletion of the solder from ground pad through via holes
Edition 0.3
Dec. 2012
11
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
2-inch Tray Packing (Part No. : ES/SMM5144XZ)
Tray Material : ABS – TP10
Quantity : 100 pcs. / Tray
Edition 0.3
Dec. 2012
12
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Tape and Reel Packing (Part No. : ES/SMM5144XZT)
Tape Material : Conductive Polycarbonate
Reel Material : Conductive Polystyrene
Quantity : 500 pcs. / Reel
Edition 0.3
Dec. 2012
13
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Assembly Techniques for WLCSP MMICs
1. WLCSP Assembly Flow
WLCSP MMIC can be handled as a standard SMT component as in the following
assembly flow.
Solder
Screen
Printing
WLCSP
mounting
Reflow
Soldering
Fill in
under filler
One can also make use of C4 (Controlled Collapse Chip Connection) assembly
techniques or a flux dip assembly method. In this case lower residue flux is
recommended to save cleaning process steps, as liquid cleaning is not recommended.
Dip solder
balls to flux
or dip flux
on PCB
WLCSP
mounting
Reflow
Soldering
Fill in
under filler
2. PCB Layout
PCB land patterns are based on SEI’s experimental data. The land pattern has been
developed and tested for optimized assembly at SEI. Solid-filled via is required to
prevent depletion of the solder of solder paste and solder ball from ground pad through
via holes during the reflow soldering process. To prevent shorts between solder balls,
solder mask resist should be used. A recommended PCB layout is shown on page 11.
3. Stencil Mask
The use of solder mask is required to put WLCSP MMIC on PCB using standard SMT
assembly techniques. The stencil mask design is critical. A minimum solder mask
space of 0.16mm between solder balls must be used to prevent shorting. To realize
stable solder volume, stencil thickness and opening need to be optimized. A
recommended stencil mask pattern is shown in Fig. 1.
0.16mm
36- 0.24mm
Stencil mask : t=0.125mm
Figure 1
Edition 0.3
Dec. 2012
14
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Assembly Techniques for WLCSP MMICs
4. Die Mounting
For WLCSP MMIC with fine pitch of 0.4mm, it is recommended to use automated finepitch placement. Due to the variety of mounting machines and parameters and surface
mount processes vary from company to company, careful process development is
recommended.
5. Reflow Soldering
The solder reflow condition (infrared reflow/heat circulation reflow/hotplate reflow) shall be
optimized and verified by the customer within the condition shown in Fig.2 to realize
optimum solder ability. An excessive reflow condition can degrade the WLCSP MMICs that
may result in device failure. The solder reflow must be limited to three (3) cycles maximum.
The temperature profile during reflow soldering shall be controlled as shown in Fig.2.
Customers must optimize and verify the reflow condition to meet their own mounting
method using their own equipment and materials. For any special application, please
contact the Sumitomo sales office nearest you for information.
Certain types of PCB expand and contract causing peaks and valleys in the board material
during the reflow cycle. The recommended measure to prevent this from occurring is to
screw the PCB onto a stiffener board with a small heat capacity prior to the reflow process.
The solder balls of WLCSP MMIC use Pb-free alloy and the melting point of the Sn/Ag/Cu
used is 218deg.C. The actual profile used depends on the thermal mass of the entire
populated board and the solder compound used.
Figure 2
Edition 0.3
Dec. 2012
15
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Assembly Techniques for WLCSP MMICs
6. Cleaning
SEDI does not recommend a liquid cleaning system to clean WLCSP MMIC. If a liquid
cleaning system is required, please contact our nearest sales office from the list at
http://global-sei.com/Electro-optic/about/office.html.
7. Underfill Process
WLCSP MMIC is connected to PCB by solder balls. A major concern in using WLCSP
MMICs is the ability of the solder balls to withstand temperature cycling. It is thought the
stress to the solder balls due to the difference of the coefficients of thermal expansion
between GaAs and PCB is a potential cause of failure. To reduce this stress, it
recommended to use underfill in the gap between the WLCSP die and the PCB. In
reliability tests, underfill has beneficial results in temperature cycle, drop test and
mechanical stress test. The other side, underfill is undesirable due to the complexity of
the process and added assembly cost from the additional process. The end user must
decide to whether to use this process from their own test results.
8. ESD Protection
Semiconductor devices are sensitive to static electricity. User must pay careful attention to
the following precautions when handling semiconductor devices.
Customers should lay a conductive mat on the bench, and use wrist ground straps.
When handling products with an ESD rating of class 0, customers should lay a conductive
mat on the floor, and use foot ground straps. Ionizers are also recommended. All of this
equipment must be periodically tested in a recommended process.
Follow ESD precautions to protect against < HBM +/-250V ESD voltage strike.
ESD
Note: Based on JEDEC JESD22-A114-C
Class 0
Up to 250V
9. RoHS Compliance
RoHS Compliance
Edition 0.3
Dec. 2012
Yes
16
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
Assembly Techniques for WLCSP MMICs
10. Handling of WLCSP MMICs in Tape and Reel From
Peel the carrier tape and the top tape off slowly at a rate of 10 mm/s or less to prevent the
generation of electro-static discharge. When peeling the tape off, the angle between the
carrier tape and the top tape should be kept at 165 to 180 degrees as shown in Fig. 3.
Top tape
165 to 180degree
Carrier tape
Figure 3
11. Packing
WLCSP products are offered in either the tape and reel or tray shipping configuration. The
products are placed with solder bump facing down.
a) Tray Shipment
Each tray contains 100pcs. and minimum order is one tray, and must order in
100pcs. increment
b) Tape and Reel Shipment
Each reel contains 500pcs. and minimum order is one reel, and must order in
500pcs. increment
ORDERING INFORMATION
ES/SMM5144XZ : Tray Shipment : 100pcs. /Tray and, 100pcs. (per Tray) increment.
ES/SMM5144XZT : Tape and Reel Shipment : 500pcs. /Reel, and 500pcs. (per Reel) increment.
Part Number
ES/SMM5144XZ
ES/SMM5144XZT
Order Unit
100pcs.
500pcs.
Packing
100pcs./Tray=100pcs./Packing
500pcs./Reel=500pcs./Packing
- NOTE This information is described as reference information based on SEI experimental test like assembly
process, PCB and stencil design, Temperature cycle test result and so on.
SEI can not guarantee the quality of WLCSP after the customer’s assembly process because assembly
and PCB condition is generally different between customer and SEI.
Please check the quality of device ( or system ) after customer assembles with customer’s PCB and
assembly process.
Edition 0.3
Dec. 2012
17
ES/SMM5144XZ
Preliminary
24– 30GHz Down converter MMIC
For further information please contact:
http://global-sei.com/Electro-optic/about/office.html
CAUTION
This product contains gallium arsenide (GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
Do not put these products into the mouth.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Edition 0.3
Dec. 2012
18
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