MAX6577

MAX6577
MAX6577ZUT+
RELIABILITY REPORT
FOR
MAX6576ZUT+
(MAX6577)
PLASTIC ENCAPSULATED DEVICES
October 30, 2008
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
Page 1/5
MAX6577ZUT+
Conclusion
The MAX6577ZUT+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6576/MAX6577 are low-cost, low-current temperature sensors with a single-wire output. The MAX6576 converts the ambient temperature
into a square wave with a period proportional to absolute temperature (°K). The MAX6577 converts the ambient temperature into a square wave with a
frequency proportional to absolute temperature. The MAX6576 offers accuracy of ±3°C at +25°C, ±4.5°C at +85°C, and ±5°C at +125°C. The
MAX6577 offers accuracy of ±3°C at +25°C, ±3.5°C at +85°C, and ±4.5°C at +125°C. Both devices feature a single-wire output that minimizes the
number of pins necessary to interface with a microprocessor. The period/frequency range of the output square wave can be selected by hard-wiring
the two time-select pins (TS0, TS1) to either VDD or GND. The MAX6576/MAX6577 are available in space-saving 6-pin SOT23 packages.
Maxim Integrated Products. All rights reserved.
Page 2/5
MAX6577ZUT+
II. Manufacturing Information
A. Description/Function:
SOT Temperature Sensors with Period/Frequency Output
B. Process:
S12
C. Number of Device Transistors:
D. Fabrication Location:
California
E. Assembly Location:
Carsem Malaysia, ISPL Philippines, Hana Thailand; UTL Thailand; Unisem
Malaysia
F. Date of Initial Production:
April
24, 1999
III. Packaging Information
A. Package Type:
6-pin SOT23
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-1601-0067
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Jb:
115*°C/W
K. Single Layer Theta Jc:
80°C/W
IV. Die Information
A. Dimensions:
57 X 35 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
1.2 microns (as drawn)
F. Minimum Metal Spacing:
1.2 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
Page 3/5
MAX6577ZUT+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
192 x 4340 x 80 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 13.4 x 10
= 13.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maximic.com/. Current monitor data for the S12 Process results in a FIT Rate of 12.5 @ 25C and 192.25 @ 55C, data limited (0.8 eV,
60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The MS14-2 die type has been found to have all pins able to withstand a HBM transient pulse of +/- 2500 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of 250 mA.
Maxim Integrated Products. All rights reserved.
Page 4/5
MAX6577ZUT+
Table 1
Reliability Evaluation Test Results
MAX6577ZUT+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
80
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Maxim Integrated Products. All rights reserved.
Page 5/5
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement