MAX6964

MAX6964
MAX6964AEG+
RELIABILITY REPORT
FOR
MAX6964AEG+
PLASTIC ENCAPSULATED DEVICES
October 31, 2008
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX6964AEG+
Conclusion
The MAX6964AEG+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6964 I²C-compatible serial interfaced peripheral provides microprocessors with 17 output ports. Each output is an open-drain current-sinking
output rated at 50mA and 7V. The outputs are capable of driving LEDs, or providing logic outputs with external resistive pullup up to 7V. Eight-bit
PWM current control is also integrated. Four of the bits are global control and apply to all LED outputs to provide coarse adjustment of current from
fully off to fully on with 14 intensity steps. Additionally, each output has an individual 4-bit control, which further divides the globally set current into 16
more steps. Alternatively, the current control can be configured as a single 8-bit control that sets all outputs at once. Each output has independent
blink timing with two blink phases. LEDs can be individually set to be either on or off during either blink phase, or to ignore the blink control. The blink
period is controlled by an external clock (up to 1kHz) on BLINK or by a register. The BLINK input can also be used as a logic control to turn the LEDs
on and off, or as a general-purpose input (GPI). The MAX6964 supports hot insertion. The SDA, SCL, RST-bar, BLINK, and the slave address input
ADO remain high impedance in power-down (V+ = 0V) with up to 6V asserted upon them. The output ports remain high impedance with up to 8V
asserted upon them. The MAX6964 is controlled through a 2-wire I²C serial interface, and can be configured to one of four I²C addresses.
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MAX6964AEG+
II. Manufacturing Information
A. Description/Function:
17-Output LED Driver/GPO with Intensity Control and Hot-Insertion Protection
B. Process:
S4
C. Number of Device Transistors:
0
D. Fabrication Location:
Texas
E. Assembly Location:
Carsem Malaysia, ATP Philippines, UTL Thailand
F. Date of Initial Production:
January 24, 2004
III. Packaging Information
A. Package Type:
24-pin QSOP
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-0795
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
105°C/W
K. Single Layer Theta Jc:
34°C/W
L. Multi Layer Theta Ja:
88°C/W
M. Multi Layer Theta Jc:
34°C/W
IV. Die Information
A. Dimensions:
72 X 69 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX6964AEG+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the S4 Process results in a FIT Rate of 4.6 @ 25C and 79.2 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The DW65 die type has been found to have all pins able to withstand a HBM transient pulse of 1500 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of 250 mA.
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MAX6964AEG+
Table 1
Reliability Evaluation Test Results
MAX6964AEG+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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