Infineon ESD1P0RFW ESD Protection Data Sheet

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Infineon ESD1P0RFW ESD Protection Data Sheet | Manualzz

ESD1P0RF...

RF ESD Protection Diodes

• ESD / transient protection of RF antenna /

interfaces or ultra high speed data lines acc. to:

IEC61000-4-2 (ESD): ± 20 kV (contact)

IEC61000-4-4 (EFT): 40 A (5/50 ns)

IEC61000-4-5 (surge): 10 A (8/20 µs)

• Ultra low capacitance of 1 pF typ.

(0.5 pF per diode)

• Low clamping voltage

• Pb-free (ROHS compliant) package

Applications in anti-parallel configuration

• For low RF signal levels without superimposed

DC voltage: e.g. GPS, WLAN, Bluetooth

Applications in rail-to-rail configuration

• For high RF signal levels or low RF signal levels

with superimposed DC voltage: e.g. HDMI, S-ATA,

Gbit Ethernet

ESD1P0RFW ESD1P0RFS

D 1

D 2

D 1 D 2

D 3

D 4

Type

ESD1P0RFS

ESD1P0RFW

Package

SOT363

SOT323

Configuration

2 channels

1 channel

Marking

E6s

E6s

1 2010-12-20

ESD1P0RF...

Maximum Ratings at T

A

= 25°C, unless otherwise specified

Parameter Symbol

ESD contact discharge 1)

Peak pulse current (t p

= 8 / 20 µs) 2)

Operating temperature range

Storage temperature

I

V

T

ESD pp op

T stg

Value

20

10

-55...150

-65...150

Unit kV

A

°C

Electrical Characteristics at T

A

= 25°C, unless otherwise specified

Parameter Symbol Values min.

typ.

max.

Characteristics

Reverse working voltage 3)

Reverse current

V

R

= 70 V

Forward clamping voltage 2)

I

PP

= 3 A, t p

= 8/20 µs

I

PP

= 10 A, t p

= 8/20 µs

Line capacitance 4)

V

R

= 0 V, f = 1 MHz

V

R

= 0 V, f = 1 MHz, for Application example 4

Series inductance (per diode)

SOT323

SOT363

I

V

V

L

R

C

RWM

FC

T

S

-

-

-

-

-

-

-

-

-

-

4

12

1

0.5

1.4

1.6

70

100

7

15

1.5

0.75

-

-

Unit

V nA

V pF nH

1 VESD according to IEC61000-4-2, only valid in anti-parallel or rail-to-rail connection.

Please refer to the application examples.

2 Ipp according to IEC61000-4-5, only valid in anti-parallel or rail-to-rail connection.

Please refer to the application examples.

3 Only valid in rail-to-rail configuration V

CC

≥ V

RWM

4 Total capacitance line to ground (2 diodes in parallel)

2

ESD1P0RF...

t

Forward clamping voltage V p

= 8 / 20 µs

FC

= ƒ (I

PP

)

12

V

5

4

3

2

1

0

1

10

9

8

7

6

2 3 4 5 6 7 8 A

I pp

10

Forward current I

F

= ƒ (V

F

)

T

A

= Parameter in anti-parallel configuration

100

µA

60

40

20

-40°C

0

-20

25°C

-40

85°C

-60

-80

125°C

125°C

-400 -200 0

85°C

25°C

-40°C

200 mV

V

F

600

Reverse current I

R

= ƒ (V

R

)

T

A

= Parameter in rail-to-rail configuration

10

-5

A

125°C

10

-6

85°C

10

-7

10 -8

10

-9

10

-10

25°C

10

-11

-40°C

10 -12

0 10 20 30 40 50 V

V

R

70

Line capacitance C

T

= ƒ (f)

V

R

= 0 V pF

3

2

1.5

1

0.5

500 1000 MHz f

2000

3

Insertion loss |S

21

| 2 = ƒ (f)

V

R

= 0 V, line to ground, Z = 50 Ω dB

0

-0.25

-0.375

-0.5

-0.625

-0.75

0 250 500 750 1000 1250 1500 MHz 2000 f

ESD1P0RF...

4

1. Application example ESD1P0RFW

1 channel, anti-parallel configuration

1 protected signal line, superimposed DC voltage up to

±V

F

(diode forward voltage)

3

Line capacitance to ground = 1 pF

I/O

ESD sensitive circuit

1 2

The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible.

Pins 1 and 2 should be connected in parallel directly to a ground plane on the board.

2. Application example ESD1P0RFW

1 channel, rail-to-rail configuration

1 protected signal line, superimposed DC voltage up to

+Vcc (voltage supply)

+Vcc

I/O

ESD sensitive circuit

Line capacitance to ground = 1 pF

Pin 2 should be connected to the positive supply voltage and pin 1 should be connected directly to a ground plane on the board.

Clamped input voltage at I/O port is limited to Vcc + VF at positive transients and 0V -

VF at negative transients

(VF ... diode forward voltage drop).

ESD1P0RF...

5

6

P a c k a g e O u t l i n e

Package SOT323

2 ±0.2

0.3

+0.1

-0.05

3

3x

0.1

M

1

0.65

0.65

2

0.1 MAX.

0.1

0.9

±0.1

A

0.2

M A

0.15

+0.1

-0.05

ESD1P0RF...

F o o t P r i n t

0.6

0.65

0.65

M a r k i n g L a y o u t ( E x a m p l e )

Manufacturer

2005, June

Date code (YM)

BCR108W

Type code

Pin 1

S t a n d a r d P a c k i n g

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

4

Pin 1 2.15

0.2

1.1

7

P ackage SOT363

P a c k a g e O u t l i n e

2 ±0.2

0.2

+0.1

-0.05

6 5 4

6x

0.1

M

Pin 1 marking

1

0.65

2

0.65

3

0.1 MAX.

0.1

0.9

±0.1

A

0.2

M

A

0.15

+0.1

-0.05

F o o t P r i n t

0.3

ESD1P0RF...

0.65

0.65

M a r k i n g L a y o u t ( E x a m p l e )

Small variations in positioning of

Date code, Type code and Manufacture are possible.

Pin 1 marking

Laser marking

S t a n d a r d P a c k i n g

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

For symmetric types no defined Pin 1 orientation in reel.

4

Manufacturer

2005, June

Date code (Year/Month)

BCR108S

Type code

0.2

Pin 1 marking

2.15

8

1.1

ESD1P0RF...

Edition 2006-02-01

Published by

Infineon Technologies AG

81726 München, Germany

© Infineon Technologies AG 2007.

All Rights Reserved.

Attention please!

The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com

).

Warnings

Due to technical requirements components may contain dangerous substances.

For information on the types in question please contact your nearest

Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system.

Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

9

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