MAX4729

MAX4729ExT
Rev. A
RELIABILITY REPORT
FOR
MAX4729ExT
PLASTIC ENCAPSULATED DEVICES
May 25, 2006
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Jim Pedicord
Quality Assurance
Manager, Reliability Operations
Conclusion
The MAX4729 successfully meets the quality and reliability standards required of all Maxim products. In
addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet
Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
.....Attachments
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
I. Device Description
A. General
The MAX4729 single-pole/double-throw (SPDT) switches operate from a single supply ranging from +1.8V to
+5.5V. These switches provide low 3.5 on-resistance (RON), as well as 0.45 RON flatness with a +2.7V supply.
These devices typically consume only 1nA of supply current, making them ideal for use in lowpower, portable
applications. The MAX4729 features low-leakage currents over the extended temperature range, TTL/CMOScompatible digital logic, and excellent AC characteristics.
The MAX4729 is available in small 6-pin SC70 and 6-pin µDFN packages. The MAX4729 is offered in three
pinout configurations to ease design. The MAX4729 is specified over the extended -40°C to +85°C temperature
range.
B. Absolute Maximum Ratings
Item
(All voltages referenced to ground)
V+, IN
COM, NO, NC (Note 1)
Continuous Current (IN, V+, GND)
Continuous Current (COM, NO, NC)
Peak Current COM, NO, NC
(Pulsed at 1ms, 10% Duty Cycle)
Continuous Power Dissipation (TA = +70°C)
6-Pin μDFN (derate 2.1mW/°C above +70°C)
6-Pin SC70 (derate 3.1mW/°C above +70°C)
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
Rating
-0.3V to +6V
-0.3V to (V+ +0.3V)
±30mA
±80mA
±150mA
168mW
245mW
-40°C to +85°C
+150°C
-65°C to +150°C
+300°C
Note 1: Signals on NO, NC, or COM exceeding V+ or GND are clamped by internal diodes. Signals on IN
exceeding GND are clamped by an internal diode. Limit forward-diode current to maximum current rating.
II. Manufacturing Information
A. Description/Function:
Low-Voltage 3.5Ω, SPDT,CMOS Analog Switches
B. Process:
D35/E35
C. Number of Device Transistors:
190
D. Fabrication Location:
Texas, USA
E. Assembly Location:
Thailand or Mayalsia
F. Date of Initial Production:
April, 2004
III. Packaging Information
A. Package Type:
6-Pin uDFN (1.5x1)
6-Pin SOT23
B. Lead Frame:
Copper
Copper
C. Lead Finish:
Solder Plate or 100% Matte Tin Solder Plate or 100% Matte Tin
D. Die Attach:
Non-Conductive Epoxy
Non-Conductive Epoxy
E. Bondwire:
Gold (1.0 mil dia.)
Gold (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
Epoxy with silica filler
G. Assembly Diagram:
# 05-9000-1636
# 05-9000-0835
H. Flammability Rating:
Class UL94-V0
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-020-C:
Level 1
Level 1
IV. Die Information
A. Dimensions:
28 x 431 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.45 microns, Metal2 = 0.5 microns, Metal3 = 0.6 (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 microns, Metal2 = 0.5 microns, Metal3 = 0.6 (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
B. Outgoing Inspection Level:
Jim Pedicord (Manager, Reliability Operations)
Bryan Preeshl (Managing Director)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1 =
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 126 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 8.73 x 10-9
λ = 8/73 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and
subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each
lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80
piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached
Burn-In Schematic (Spec. # 06-6251) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour
life test monitors. This data is published in the Product Reliability Report (RR-1N). Current monitor data for the
D35/E35 Process results in a FIT Rate of 0.34 @ 25C and 5.69 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The AS19-4 die type has been found to have all pins able to withstand a transient pulse of ±1500V, per
Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
.
Table 1
Reliability Evaluation Test Results
MAX4729Ext
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
PACKAGE
DC Parameters
& functionality
SAMPLE
SIZE
NUMBER OF
FAILURES
126
0
77
77
0
0
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
uDFN
SOT
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output
pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
TERMINAL D
Mil Std 883D
Method 3015.7
Notice 8
R = 1.5kΩ
C = 100pf
CURRENT
PROBE
(NOTE 6)
ONCE PER SOCKET
ONCE PER BOARD
1K
VCC
+5V
0.1uF
1K
1
6
2
5
3
4
1K
1uF
DEVICES: MAX4729
PACKAGE: 6-SC70
MAX EXPECTED CURRENT: 1uA
DOCUMENT I.D.
06-6251
REVISION B
DRAWN BY: JIM CITTADINO
NOTES:
MAXIM TITLE: BI Circuit: MAX4729 (AS19Z)
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