Samsung | GH68-00422A | Specifications | Samsung GH68-00422A Specifications

Samsung GH68-00422A Specifications
PORTABLE CELLULAR
TELEPHONE
SCH-620
SERVICE
PORTABLE CELLULAR TELEPHONE
Manual
CONTENTS
1. General Introduction
2. Specification
3. Installation
4. NAM Programming
5. Product Support Tools
OK/
MENU
CLR
END/
2
3 DEF
SEND
1.
´
4 GHI
7 PQRS
ABC
5 JKL
6 MNO
8
9 WXYZ
TUV
6. Troubleshooting
7. Exploded view and its Part List
0 OPER
8. Electrical Parts List
9. Block diagram
10. PCB diagrams
11. Circuit diagrams
1. General Description
The SCH-620 cellular phone functions as both analog cellular phone working in AMPS (Advanced Mobile
Phone Service) mode and digital cellular phone working in CDMA (Code Division Multiple Access) mode.
CDMA type digital mode applies DSSS (Direct Sequential Spread spectrum) mode which first came to be used
in the military.
The DSSS reduces channel cross talk and allow to use one frequency channel by multiple users in the same
specific area, resulting in increase of channel capacity to about ten times compared to that of analog mode
currently used.
Soft/Softer Handoff, Hard Handoff, and Dynamic RF Power Control technologies are combined into this phone
to reduce the call drop while usage.
CDMA digital cellular network consists of MSO (Mobile Switching Office), BSC (Base Station Controller),
BTS(Base Station Transmission System), and MS (Mobile Station). MS meets the specifications of the below:
• IS-95A : Mobile Station-Base Station Compatibility Standard for Dual-Mode Wideband Spread Spectrum
Cellular System
• IS-96A : Speech Service Option 1 Standard for Dual-Mode Wideband Spread Spectrum Cellular Systems
• IS-98A : Standards for Dual-Mode Wideband Spread Spectrum Cellular Mobile Station
• IS-126 : Mobile Station Loopback Service Options Standard
SCH-620 is composed of main handset, rapid charger, three batteries (1600 mAh, 1000 mAh, 550mAh), handsfree kit, car adaptor, and travel charger. Hands-Free Kit is designed to be operated in full-duplex mode taking
turn-around delay between the phone and the system into account.
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1-1
2. Specification
2-1 General
Frequency Range
Transmitter
Receiver
Digital Mode
: 824 ~ 849 MHz
: 869 ~ 894 MHz
Analog Mode
824 ~ 849 MHz
869 ~ 894 MHz
Channel Spacing
: 1.23 MHz
30 kHz
Number of Channels
: 20 FA
832 CHs
Duplex Spacing
: 45 MHz
45 MHz
Frequency Stability
: ±2.5 ppm (-30˚C ~ +60˚C, -4˚F ~ +140˚F)
Operating Temperature
: -30˚C~+60˚C (-4˚F ~ +140˚F)
Operating Voltage
HHP : 3.6V DC (±10%)
Hands-free : 13.7V DC (±10%)
Item
Size
Weight (g)
including slim battery
105 x 45 x 18
89
including standard battery
105 x 45 x 21
117
including extended battery
105 x 45 x 24
138
Operating Time
Digital Mode
Item
Standby Time
Talk Time
slim battery
up to 75 hours
up to 90 min
standard battery
up to 155 hours
up to 200 min
extended battery
up to 250 hours
up to 330 min
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2-1
Specification
2-2 Digital Mode
Waveform Quality
0.944 or more
Time Reference
±1uS or less
Rx Sensitivity and Dynamic Range
Tx Output Power
-104 dBm, FER=0.5 % or less
-25 dBm, FER=0.5 % or less
280 mW (24.5 dBm)
Tx Frequency Deviation
±300 Hz or less
Occupied Band Width
1.32 MHz
Tx Conducted Spurious Emission
Minimum Tx Power Control
Open Loop Power Control
Standby Output Power
900 kHz : -42 dBc / 30 kHz below
1.98 MHz: -54 dBc / 30 kHz below
below -50 dBm
-25 dBm: -57.0 dBm ~ -38.5 dBm
-65 dBm: -17.5 dBm ~ + 1.5 dBm
-104 dBm: +18.0 dBm ~ +30.0 dBm
below -61 dBm
Colsed Loop Tx Power Control Range
Test1: ±24 dB or less
Test2: 0 mS ~ 2.5 mS
Test3: ±24 dB or more
Test4: ±24 dB or more
Test5: ±24 dB or more
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2-2
Specification
2-3 ANALOG MODE
TRANSMITTER
0.6W (+2/-4dB)
RF output power
Carrier ON/OFF conditions
“ON” Condition
“OFF” Condition
Compressor
Compression Rate
Attack Time
Recovery Time
Reference Input
within ±3dB of specification output (in 2mS)
below-60dBm (in 2mS)
2:1
3mS
13.5mS
Input level for producing a nominal ±2.9KHz
peak freqency deviation of transmitted carrier
6dB/OCT within 0.3 ~ 3KHz
Preamphasis
Maximum Freqency Deviation
F3 of G3
Supervisory Audio Tone
Signaling Tone
Wideband Data
Post Deviation Limiter Filter
3.0 ~ 5.9KHz
5.9 ~ 6.1KHz
6.1 ~ 15KHz
Over 15KHz
±12KHz
±2KHz (±10%)
±8KHz (±10%)
±8KHz (±10%)
above 40 LOG (F/3000) dB
above 35 dB
above 40 LOG (F/3000) dB
above 28 dB
Spectrum Noise Suppression
For all modulation
f0+20KHz ~ f0+45KHz
For modulation by voice and SAT
f0 +45KHz
For modulation by WBD(without SAT)
and ST (with SAT)
f0+45KHz ~ f0+60KHz
f0+60KHz ~ f0+90KHz
f0+90KHz ~ 2f0
Harmonic and conducted Spurious Emissions
above 26 dB
above 63 +10 LOG (PY) dB
above 45 dB
above 65 dB
above 63 +10 LOG (PY) dB
(where f0=carrier frequency
PY=mean output power in watts)
below 43 + 10 LOG (PY) dB
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2-3
Specification
RECEIVER
-6dB / OCT within 0.3 ~3KHz
De-Emphasis
Expander
Expander Rate
Attack Time
Recovery Time
Reference Input
1:2
within 3mS
within 13.5mS
output level to a 1000Hz tone from a carrier
within ±2.9KHz peak frequency deviation
12dB SINAD / -116dBm
Sensitivity
Intermodulation Spurious Response Attenuation
avove 65dB
RSSI Range
above 60dB
Protection Against Spurious Response
Interference
above 60dB
In Band Conducted Spurious Emission
Transmit Band
Receive Band
Other Band
below -60dBm
below -80dBm
below -47dBm
Radiated Spurious Emission
Frequency Range
25 ~ 70 MHz
70 ~ 130MHz
130 ~ 174 MHz
174 ~ 260 MHz
260 ~ 470 MHz
470 ~ 1GHz
Maximum Allowable EIRP
-45dBm
-41dBm
-41 ~ -32dBm
-32dBm
-32 ~ -26dBm
-21dBm
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2-4
Specification
2-4 CDMA Debug Display Information (menu 8)
IN IDLE MODE
1
2
3
Sxxxx
4
SIx
T-xx
x
Dxxx
Pxxx
-xx
6
CHxxx
8
7
5
IN CONVERSATION MODE
9
10
TEx
T-xx
Pxxx
REx
11
xx
Dxxx
x
-xx
3
CHxxxx
1 : Sxxxxx : SID (System ldentification) toggle
Nxxxxx : NID (Network Identification) toggle
2 : SIx : Slot cycle index (lowest between the system and the phone will be used)
3 : Handset Status : 0 - Acquisition
1 - Synchronization
2 - Paging (Idle)
3 - Traffic Initialization
4 - Traffic Mode
5 - Exit
4 : T-xx : Tx adjust, Value ranges from +63 ~ -63dB
5 : Dxxx : sector power in dBm
6 : -xx : Ec/Io
7 : Pxxx : PN offset
8 : CHxxxx : channel number
9 : TEx : Tx vocoder rate (8 is full rate, 1 is 1/8th rate)
E : EVRC
V : 13k or 8k
10 : REx : Rx vocoder rate (8 is full rate, 1 is 1/8th rate)
11 : xx : Walsh code used in traffic channel
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2-5
3. Installation
3-1 Installing a Battery Pack
1. To attach the battery pack after charging, align it with the phone about 1cm (1/2 inch away from its place so
that the two arrows on the phone are seen, the battery charge contacts pointing downward.
2. Slide the battery pack upwards until it clicks firmly into position. The phone is now ready to be turned on.
3. To remove the battery pack, release it by pressing the button on the rear of the phone.
4. Slide the battery pack downward about 1cm (1/2inch and lift it away from the phone.
Press this button to
release the battery pack
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3-1
Installation
3-2 For Desk Top Use
1. Choose a proper location to install the charger for Desk Top use.
2. Plug the power cord of the charger into an appropriate wall socket. When the power is connected correctly,
the lamps turn on briefly.
3. To charge the battery pack, insert the battery pack into the rear slot of the charger. The lamp marked BAT on
the front panel of the charger lights up red.
4. If you do not wish to use the phone while charging the battery, insert the phone with the battery pack
attached into the front slot of the charger. The lamp marked PHONE on the front panel of the charger lights
up red.
SLIM
BATTERY PACK
STANDARD
BATTERY PACK
EXTENDED
BATTERY PACK
Figure 3-1 Charging the Phone and Battery
Item
Model Name
Service Part#
Desk Top Rapid Charger
DTC61AB
GH44-00063A
Slim Battery Pack
BTI61AB
GH43-00157A
Standard Battery Pack
BTS61AB
GH43-00140C
Extended Battery Pack
BTE61AB
GH43-00132D
SPECIFICATIONS USING “DTC 61AB”
Product
Charging time (hours)
Stand by time (hours) Talking time(min)
Front
Rear
Digital
Digital
Slim Battery Pack (Li-ion: 500mAh)
2
2
75
90
Standard Battery Pack (Li-ion: 1000mAh)
2
2
155
200
Extended Battery Pack (Li-ion: 1600mAh)
2.5
6
250
330
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3-2
Installation
3-3 For Mobile Mount
3-3-1 Cradle
1. Choose a location where it is easy to reach and does not interfere with the driver’s safe operation of the car.
2. Separate the two halves of the clamshell by removing the two large slotted screws. See the figure 3-2.
3. Drill holes and mount the lower half of the clamshell by using the screws.
4. Place the cradle onto the remaining half of the clamshell and assemble them by using the screws.
5. Reassemble the two halves of the clamshell together. Adjust the mounting angle and tighten the two slotted
screws.
CRADLE
CLAM SHEEL
MOUNT UPPER
CELLULAR
PHONE
FIXED SCREW
HANDS
FREE BOX
CLAM SHEEL
MOUNT LOWER
CAR
32
32
Figure 3-2 Cradle Installation
3-3-2 Hands-Free Box
1. Drill holes in a proper location for the hands-free box, attach the mounting bracket by using the screws. See
the figure 3-3.
2. Install the hands-free box into the bracket.
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3-3
Installation
3-3-3 Hands-Free Microphone
1. It is recommended to install the microphone where it is 30-45 cm (12-18inch away from the driver. Choose
the location where is least susceptible to interference caused by external noise sources, ie, adjacent windows,
radio speakers, etc. Normal place is the sun visor.
2. Once the microphone has been correctly positioned, connect the microphone wire to the MIC jack on the
hands-free box.
MOUNTING BRACKET
Figure 3-3 Hands-Free Box 1 Installation
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3-4
Installation
3-3-4 Cables
1. Connect the cradle and the hands-free box with the data cable. See the figure 3-4.
2. Connect the antenna cable to the RF jack of the cradle.
3. Connect the power cable as follows:
Connect the red wire to the battery (+) terminal, black wire to the vehicle chassis. Then connect the battery (-)
terminal to the vehicle chassis. Connect the yellow wire to the switched side of the ignition switch, and then
connect the white to the stereo mute wire from your vehicle stereo.
4. Connect the other end of the power cable to the PWR jack of the hands-free box.
Notes:
It is recommended to connect the power cable directly to the battery to avoid power noise.
Make sure the connection, in the vehicle, between the battery (-) terminal and vehicle chassis is made correctly.
Make sure the fuse having a proper capacity is used on the power cable.
Make sure the cables do not pass over any sharp metal edge that may damage it.
Micro Phone
Yellow(Ignition)
White(Stereo Mute)
Red(Vehicle Battery)
Black(GND)
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3-5
4. NAM Programming
NAM features can be programmed as follows:
Notes:
- If you enter the NAM program mode, each item shows the currenly stored data. Go to the next item by
pressing OK.
- You can modify the data by entering a new data.
- If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits.
- To scroll items backwards or forwards, press the VOLUME button on the left side of the phone.
4-1 General Setup
LCD Display
Key in
Function
47*869#08#9
NAM program
1:General
2:Setup NAM1
3:Setup NAM2
47*869#08#9
1
-select NAM programming
-choose ‘GENERAL’
ESN
B0000000
Volume▼
-Electronic Serial Number of the phone
CAI version
2
Volume▼
by the mobile
-The version of Common Air Interface supported
VOC8/13/EVRC
Volume▼
evrc, voice08k, voice13k
SCM
00101010
Volume▼
-Station Class Mark displays the power class(bit0~1),
transmission(bit2), slotted class(bit5), dual mode(bit6).
Lock Code
0000
(0000)
4-digit code
OK
-Lock code, current status is displayed
to change, enter new code.
-stores it
SO_VOIC_EVRC
Slot Mode
Yes
Slot Index
2
Pref NAM1...
Digital pref
* or #
OK
-Slot mode. ‘Yes’ indicates the slot mode.
changes the status.
-stores it.
0-7
OK
-Slot mode index. The higher, the longer sleeping time
to change, enter new one.
-stores it.
OK
-Preferred system selection for NAM1
changes the system.
-stores it.
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4-1
NAM Programming
LCD Display
Key in
Pref NAM2...
Digital pref
OK
Function
-Preferred system selection for NAM2
changes the system.
-stores it.
4-2 Setting Up NAM1
LCD Display
Key in
Function
NAM Program
1:General
2:Setup NAM1
3:Setup NAM2
2
Choose ‘Setup NAM1.’
Setup NAM1
1:Phone #
2.FM
2:CDMA
1
Choose ‘Phone #’
phone number
Phone number currently used.
- to change, enter new one.
- store it.
Phone #
1234567890
OK
Mobile ID #
3003003000
Setup NAM1
1:Phone #
2.FM
2:CDMA
FM Home SID
4369
FM 1st Chn
333
FM Acq SID1
4
FM Acq SID2
0
mobile ID number
OK
Mobile ID number currently used.
- to change, enter new one.
- store it.
2
- Choose ‘FM’
ID number
OK
System ID for home, current status is displayed.
- to change, enter new one.
- store it.
Channel number
OK
Current 1st paging channel.
- to change, enter new one.
- store it.
ID number
OK
Acquisition system ID 1, Current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Acquisition system ID 2, Current status is displayed.
- to change, enter new one.
- store it.
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4-2
NAM Programming
LCD Display
FM Acq SID3
0
FM Acq SID4
0
FM Acq SID5
0
FM Acq SID6
0
FM LockSID 1
0
FM LockSID 2
0
FM LockSID 3
0
FM LockSID 4
0
FM LockSID 5
0
FM LockSID 6
0
Auto Reg
Yes
Key in
Function
ID number
OK
Acquisition system ID 3, Current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Acquisition system ID 4, Current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Acquisition system ID 5, Current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Acquisition system ID 6, Current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Lock system ID 1, current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Lock system ID 2, current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Lock system ID 3, current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Lock system ID 4, current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Lock system ID 5, current status is displayed.
- to change, enter new one.
- store it.
ID number
OK
Lock system ID 6, current status is displayed.
- to change, enter new one.
- store it.
OK
FM Registration, current status is displayed.
- changes the status
‘YES’ to enable, ‘NO’ to disable
- store it.
* or #
OK
Preferred system selection, current status is displayed.
- changes the status
- store it.
* or #
FM pref A only
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4-3
NAM Programming
LCD Display
FM ACCOLC
0
Setup NAM1
1:Phone #
2.FM
2:CDMA
Key in
* or #
OK
Current Access Overload Class.
- change the status.
- store it.
3
- Choose ‘CDMA’
number
OK
IMSI Moble Country Code, current code is displayed.
- to change, enter new one.
- stores it.
number
OK
IMSI Mobile Network Code, current code is displayed.
- to change, enter new one.
- stores it.
* or #
OK
Preferred system selection, current system is displayed.
- changes the system.
- stores it.
class number
OK
CDMA Access Overload Class, current status is displayed.
- to change, enter new one.
- stores it.
channel number
OK
Preferred channel currently used under system A
- to change, enter new one.
- stores it.
channel number
OK
Preferred channel currently used under system B
- to change, enter new one.
- stores it.
channel number
OK
Second channel currently used under system A
- to change, enter new one.
- stores it.
channel number
OK
Second channel currently used under system B
- to change, enter new one.
- stores it.
ID number
OK
1st Acquisition system ID, current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
2nd Acquisition system ID, current status is displayed.
- to change, enter new one.
- stores it.
IMSI_MCC
000
IMSI_MNC
00
CDMA pref..
A only
CDMA ACCOLC
0
Pchn Sys A
779
Pchn Sys B
779
Schn Sys A
738
Schn Sys B
738
CD Acq SID 1
0
CD Acq SID 2
0
Function
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4-4
NAM Programming
LCD Display
CD Acq SID 3
0
CD Acq SID 4
0
CD Acq SID 5
0
CD Acq SID 6
0
CD lockSID 1
0
CD lockSID 2
0
CD lockSID 3
0
CD lockSID 4
0
CD lockSID 5
0
CD lockSID 6
0
CDMA HomeSID
Yes
CDMA fSID
Yes
CDMA fNID
Yes
Key in
Function
ID number
OK
3rd Acquisition system ID, current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
4th Acquisition system ID, current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
5th Acquisition system ID, current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
6th Acquisition system ID, current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
1st lock system ID,current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
2nd lock system ID,current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
3rd lock system ID,current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
4th lock system ID,current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
5th lock system ID,current status is displayed.
- to change, enter new one.
- stores it.
ID number
OK
6th lock system ID,current status is displayed.
- to change, enter new one.
- stores it.
* or #
OK
CDMA Home system ID, current status is displayed
- changes the status.
- stores it.
* or #
OK
CDMA foreign SID, current status is displayed.
- changes the system.
- stores it.
* or #
OK
CDMA foreign NID, current status is displayed.
- changes the system.
- stores it.
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4-5
NAM Programming
LCD Display
SID #1
2222
NID #1
1
SID #2
2222
NID #2
2
SID #3
2222
NID #3
3
SID #4
2222
NID #4
3
Key in
Function
number
OK
first SID written in the list, current status is displayed.
- to change, enter new one.
- stores it.
number
OK
first NID written in the list, current status is displayed.
- to change, enter new one.
- stores it.
number
OK
2nd SID written in the list, current status is displayed.
- to change, enter new one.
- stores it.
number
OK
2nd NID written in the list, current status is displayed
- to change, enter new one.
- stores it.
number
OK
3rd SID written in the list, current status is displayed.
- to change, enter new one.
- stores it.
number
OK
3rd SID written in the list, current status is displayed.
- to change, enter new one.
- stores it.
number
OK
4th SID written in the list, current status is displayed.
- to change, enter new one.
- stores it.
number
OK
4th NID written in the list, current status is displayed.
- to change, enter new one.
- stores it.
Setup NAM1
1:Phone #
2.FM
2:CDMA
LCD return to the NAM1 setup mode.
4-3 Setting Up NAM2
LCD Display
NAM Program
1:General
2:Setup NAM1
3:Setup NAM2
Key in
3
Function
-Choose ‘Setup NAM2’
The NAM2 setup program is the same as ‘NAM1’.
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4-6
NAM Programming
Austria Only
1. Setting Up NAM1
LCD Display
NAM Program
1:Setup NAM1
2:Setup NAM2
NAM1
Phone #
1234567890
NAM1
Directory #
1234567890
NAM1
Activate PRL
Yes
NAM1
Anlg HomeSID
****
NAM1
Dgti HomeSID
****
NAM1
More Prog ?
Yes
Key in
Function
MEMU40654321
-select NAM programming
1
-choose ‘Setup NAM1’
Phone number
OK
-Phone number.
-to change, enter new one.
-store it.
Directory number
OK
-Directory number.
-to change, enter new one.
-store it.
* or #
OK
-Activate the Prefered Roaming List. ‘Yes’ enables PRL.
-changes the status.
-store it.
ID number
OK
System ID for home, current ststus is displayed.
-to change, enter new one.
-store it.
ID number
OK
System ID for home, current status is displayed.
-to change, enter new one.
-store it.
* or #
OK
-Setup Long NAM ‘Yes’enables Long NAM.
-changes the status.
-store it.
2. Setting Up NAM2
LCD Display
NAM Program
1:Setup NAM1
2:Setup NAM2
Key in
2
Function
-Choose ‘Setup NAM2’
The Quick NAM2 setup is the same as ‘1. Setting up Quick NAM1’
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4-7
NAM Programming
3. Setting up General
LCD Display
NAM Program
1:General
2:Setup NAM1
3:Setup NAM2
General
ESN
F1000000
General
CAI version
Key in
Function
1
-Choose ‘GENERAL’.
Volume
-Electronic Serial Number of the phone is displayed.
Volume
-Common Air interface version is displayed.
* or #
OK
-Vocoder data rate.
Volume
-Station Class Mark displays the power class, transmission,
slotted class, dual mode.
3
General
VOC Select
SO_VOIC_EVRC
General
SCM
01101010
General
Service Code
654321
6-digit code
OK
-NAM service Lock code, current ststus is displayed
-to change, enter new code.
-store it.
4-digit code
OK
Lock code, current ststus is displayed
-to change, enter new code.
-store it.
Yes
* or #
OK
Slot mode ‘Yes’indicates the slot mode.
-changes the status.
-store it.
2
0-7
OK
Slot mode index. The higher, the Ionger sleeping time
-to change, enter new one.
-store it.
General
Lock Code
****
General
Slot Mode
General
Slot Index
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4-8
NAM Programming
4. Setting up NAM1
LCD Display
NAM Program
1:General
2:Setup NAM1
3:Setup NAM2
Key in
Function
2
-Choose ‘Setup NAM1’.
***
3-digit number
OK
IMSI Moble Country Code, current code is displayed.
-to change, enter new one.
-stores it.
**
2-digit number
OK
IMSI Mobile Network Code, current code is displayed.
-to change, enter new one.
-stores it.
Phone number
OK
-Phone number.
-to change, enter new one.
-stores it.
Directory number
OK
-Directory number.
-to change, enter new one.
-stores it.
SID number
OK
Digital Home System ID, current status is displayed
-to change, enter new one.
-stores it.
NID number
OK
Lockout System ID (1~6), current status is displayed
-to change, enter new one.
-stores it.
ID number
OK
Lockout System ID (1~6), current status is displayed.
-to change, enter new one.
-stores it.
* or #
OK
CDMA Home System ID, current status is displayed
-change the status.
-store it.
* or #
OK
CDMA foreign SID, current status is displyed
-change the system
-store it.
NAM1 Digital
IMSI_MNC
NAM1 Digital
IMSI_MNC
NAM1 Digital
Phone #
1234567890
NAM1 Digital
Directory #
1234567890
NAM1 Digital
Home SID (01~20)
****
NAM1 Digital
Home NID ()1~20)
*
NAM1 Digital
LockoutSID(01~10)
NAM1 Digital
CDMA Home SID
Yes
NAM1 Digital
CDMA fSID
Yes
SAMSUNG Proprietary-Contents may change without notice
4-9
NAM Programming
LCD Display
Key in
NAM1 Digital
CDMA fNID
Yes
* or #
OK
CDMA foreign NID, current status is displayed
-change the system.
-store it.
class number
OK
CDMA Access Overload Class, current status is diplayed.
-to change, enter new one.
-store it.
Phone number
OK
-Phone number.
-to change, enter new one.
-store it.
SID number
OK
Analog Home System ID, current status displayed
-to change, enter new one.
-store it.
* or #
OK
Analog Registration, current status is displayed.
-change the status ‘YES’ to enable, ‘NO’ to disable.
-store it.
* or #
OK
Current Access Overload Class.
-change the system.
-store it.
NAM1 Digital
ACCOLC
9
NAM1 Analog
Phone #
1234567890
NAM1 Analog
Home SID
****
NAM1 Analolg
Auto Reg
Yes
NAM1 Analog
Accolc
9
Function
5. Setting Up NAM2
LCD Display
NAM Program
1:Setup NAM1
2:Setup NAM2
Key in
3
Function
-Choose ‘Setup NAM2’
The Quick NAM2 setup is the same as ‘4. Setting up Quick NAM1’
SAMSUNG Proprietary-Contents may change without notice
4-10
5. Product Support Tools
5-1 General
IMPORTANT INFORMATION
Purpose
The Product Support Tool (PST) offers you the ability to interface with the SAMSUNG CDMA telephone using
a PC. With this tool you can program the phones network system requirements and functionality, swap phone
data, and download software upgrades. This document supports UniPST version 1.xx.
NOTE: This software must be executed in the Windows95/98 mode.
EQUIPMENT REQUIRED
Make sure you have the following equipment setup:
1. Minimum PC configuration: 586 CPU, 16MB RAM, Windows95/98, 5MB of disk space free for software
upgrade.
2. PST Software with appropriate cable (DM Cable for SAMSUNG CDMA phone).
3. Serial Port (16550 Serial Interface Card).
4. Power Supply (3.8 V) or Battery
INSTALLATION
Software
1.Insert the PST floppy disk into drive (A:\).
2.Create an appropriate directory on the C:\ drive for PST software, Execute Setup.exe file,
The installation program creates folder and task bar on the windows95/98 start bar.
SAMSUNG CDMA Phone
The serial port should be configured to COM1 or COM2.
Use the following procedure to connect the phone, cable, and PC .
Plug the female end of the DM Cable into the 16550 card.
Pull the black rubber connector away from the socket at the base of the phone.
Plug the special connector on the cable into the socket at the base of the phone.
SAMSUNG Proprietary-Contents may change without notice
5-1
Product Support Tools
5-2. PST (Product Support Tool)
5-2-1 Getting Started
MAIN MENU SCREEN
1. At the Windows95/98, Double Click “UniPst.exe”.
2. The Main Menu Screen will be displayed.
The Main Menu Screen shows the basic tasks that are available.
CAUTION: DO NOT attempt to program phone with a low battery.
PST SETUP
UniPst supports SAMSUNG CDMA portable telephone. You can select serial port COM1 or COM2.
5-2-2 Operation Procedure
Service Programming
The Service Programming screens enable you to set and change the service activation parameters of the
phones. These items can be changed individually or as a group via the “Edit Items” Property Sheet of the PST.
There are several pages on the Service Programming Property Sheet (See below Figure).
Read Data from File
Click “open” icon to select the name of a file whose extension is “mmc”. The values will be read from the
named file, and will initialize the parameter values seen on the Service programming screen
Read Data from Phone
Click Read from the Phone icon to upload the current programmable parameters of the phone. The values are
read from the phone, so the phone must have the power ON and be properly connected to the PST.
NOTE: To actually view the data you need to go to the Edit Items screens.
Edit Items
Click this icon to edit Number Assignment Module (NAM) items or UI items.
There are two types of screens:
1. Parameters associated with a particular Number Assignment Module (NAM)
2. UI items settings
Phone Book
Click this icon to edit Phone Book.
While you edit cell, you can use <Enter> and < UP , DOWN,LEFT,LIGHT Arrow> and <SPACE> key. If you
want to edit phone number or name , you must move rectangle box to cell where you want to edit , Write it
down . if <UP and DOWN Arrow> key is pressed, the cursor moves to next cell or previous cell.
SAMSUNG Proprietary-Contents may change without notice
5-2
Product Support Tools
Save Data to File
Click this icon to save the current parameters to a file. Once you enter a filename, Click <OK> button to write
all current parameters to that file. This way the same information can be downloaded into multiple phones.
Write to Phone
Click this icon to write the selected parameter values to the phone. Writing the selected values to the phone
may take up to a minute.
If there are dependencies in a field you can make all the changes in the proper fields and download the
information all together.
If you intend to use this “Write to Phone” feature, it is recommended that you do a “Read Data from Phone”
first, and then make the changes, so that nothing gets inadvertently overwritten.
NOTE: DO NOT TOUCH THE PHONE WHILE WRITING IS IN PROGRESS.
Software Download and Upgrade Screen
To begin a software upgrade or download, perform the following steps:
1. From the main menu screen choose DOWNLOAD MODE?
Click open icon to choose a BIN file of the new software to be loaded. Choose the appropriate BIN file, then
Click <Open> (see below figure).
2. Click Download? to begin downloading the file. You will notice various messages and a progress bar that
informs the user what percentage of the downloading has already occurred.
3.Click Mode Select box, then Select SERVICE MODE?to return to the Service Mode Screen.
NOTE: DO NOT POWER OFF WHILE THE PHONE IS BEING DOWNLOADED!
SAMSUNG Proprietary-Contents may change without notice
5-3
Product Support Tools
5-3 TEST PROCEDURE
5-3-1 Configuration of Test
Spectrum Analyzer
RF In
HP8924C
RF
In/Out
Audio Audio
Out
In
Directional
Coupler
To A-Out
Test Jig
To A-In
DC Power Supply
(+3.93V)
❈ CAUTION : Because there is the loss (0.33V at Max Power) of the test jig and Data cable, you’d better input
3.93V to the DC Power Supply to use 3.6V (Battery normal voltage) at Cellular phone
Items needed to purchase from SAMSUNG
ITEMS
PARTS #
RF test Cable
Test cable
DM Cable
Test JIG
(RF Interface Pack Ass’y)
GH39-00002A
GH39-30516A
GH39-30525A
GH80-10502A
REMARK
Including
1. Power Cable(Black,Red)
2. 9-pin RS232 data Cable
SAMSUNG Proprietary-Contents may change without notice
5-4
Product Support Tools
5-3-2 List of Equipment
- DC Power Supply
- Test Jig
- Test Cable
- CDMA Mobile Station Test Set
- Spectrum Analyzer(include CDMA Test Mode)
HP8924C, HP83236A, CMD-80, etc
HP8596E
TEST JIG
DC POWER INPUT PORT
CHANGE VOLTAGE LEVEL
BY MODEL (3.8VDC)
RED: +
BLACK: GND
AUDIO SELECT
LEFT: AUDIO IN
RIGHT: AUDIONOFF
UP: AUTO POWER ON
DOWN: NOT USE
AUTO
DB25 CONNECTOR
CPMMECT TO
DB25 CONNECTOR
OF TEST CABLE
A-IN
- DC3.8v +
D89 CONNECTOR
CONNECT TO IBM
PC SERIAL PORT
TO_PC
T
E
S
T
HHP I/F TEST JIG
P
A
C
K
BJ11 CONNECTOR
CONNECT TO HP
SERIAL PORT
TO_HP
TO
A-OUT
TO
A-IN
PROBE
NOT USED
CONNECT TO
AUDIO OUT PORT OF
TEST EQUIPMENT
(USE BNC CABLE)
CONNECT TO
AUDIO IN PORT OF
TEST EQUIPMENT
(USE BNC CABLE)
TEST CABLE
2
3
1
4
5
6
SAMSUNG Proprietary-Contents may change without notice
5-5
Product Support Tools
TEST CABLE CONNECTIONS
1
MHC 172
2
RF CABLE (1.4 dB Loss)
3
BNC CONNECTOR (RF)
4
PLUG CONNECT TO SCH-611
5
DATA CABLE
6
Dsub 25PIN CONNECTOR (DATA)
Dsub 25 PIN CONNECTOR PIN DESCRIPTION (TEST CABLE 1, BACK SIDE)
DATA DESCRIPTION
Dsub CONN.
PIN NO.
DATA DESCRIPTION
Dsub CONN.
PIN NO.
V_F
12,21
DP_RX_DATA
8
DGND
2,4,6,13,19
HP_PWR
9
BATT
15,16,22
RI
10
C_F
3,20
CD
11
TX_AUDIO
5
RTS
14
DP_TX_DATA
7
CTS
17
RX_AUDIO
1
DTR
18
15
14
1
17
16
2
3
19
18
4
5
21
20
6
7
23
22
8
9
25
24
10
11
SAMSUNG Proprietary-Contents may change without notice
5-6
12
13
Product Support Tools
5-4. CONVERSION TABLE OF FREQUENCY vs CHANNEL
TYPE
CHANNEL
CONVERSION EQUATION
REMARK
TX
1 ≤ N≤ 799
F=0.03 ✕ N + 825.00
FREQUENCY
990 ≤N≤1023
F=0.03 ✕ (N-1023) + 825.00
N ; CH NUMBER
RX
1 ≤N≤ 799
F=0.03 ✕ N + 870.00
F ; FREQUENCY
FREQUENCY
990 ≤N≤1023
F=0.03 ✕ (N-1023) + 870.00
Change to Test Mode
A. To change the phone’s state from Normal Mode to Test Mode, You should enter the following keys.
“*759#813580“
B. The command “0 1” is Suspend.
C. To finish the Test Mode, You should enter the command “0 2”.
* Note: Make sure to change to “Digital only” or “Analog only” mode in NAM1,
EST MODE. (Refer to 4. NAM Programming)
Channel Selection and Tx Power Output Level Control
1. Digital Mode (CDMA)
A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ).
B. “0 1” : Suspend.
C. “0 9 0 3 6 3 #” : Set to ‘0363’ channel.
D. “0 7” : Carrier On.
E. “3 4” : Spread spectrum to 1.23MHz band width.
F. “7 1 2 7 5 #” : Output RF power level setting.
“275” means AGC level and AGC level range is from 0 to 511.
2. Analog Mode ( FM )
A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ).
B. “0 1” : Suspend.
C. “4 6” : Vocoder initial to Analog mode.
D. “0 9 0 3 8 3 #” : Set to ‘0383’ channel.
E. “0 7” : Carrier On.
F. “7 2 2 7 5 #” : Output RF power level setting.
“275” means AGC level and AGC level range is from 0 to 511.
G. “1 0 2” : RF Power level control, 2(0~7) means power level .
SAMSUNG Proprietary-Contents may change without notice
5-7
Product Support Tools
5-5 TEST COMMAND TABLE
Command No.
Signal. Name
Description
1
SUSPEND
enter to test menu
2
RESTART
escape from test menu
3
SAVE_VAL
Save values in e2prom only in auto test
4
GET_MODE
Get mode CDMAFM AUTO TEST
5
SET_MODE
Set mode CDMAFM AUTO TEST
6
WRITE_NV
Write the EEPROM item
7
CARRIERON
turn on the carrier
8
CARRIEROFF
turn off the carrier
9
LOADSYN
load the synthesizer for locking
10
PWRLEVEL
change RF power level
11
RXMUTE
mute rx audio
13
RXMUTE
mute tx audio
16
STON
turn on ST
17
STOFF
turn off ST
18
LCD_CONTRAST
index up key JOJ_98.11.23(contrast)
19
INDEX_DECR
index dn key JOJ_98.07.07
20
LNA_GAIN_WR
22
SNDNAM
Send NAM Information
23
SNDVERSION
Send Software Version
24
SNDESN
Send ESN
25
BACKLIGHT_ON
Backlight on
26
BACKLIGHT_OFF
Backlight off
27
LAMP_ON
LAMP on
28
LAMP_OFF
LAMP off
29
REBUILD
Rebuilding EEPROM
30
PLINE
Product lile information
32
SATON
turn on SAT
33
SATOFF
turn off SAT
34
CDATA
continuously sen TX Control data
35
VOLUME_UP
Electric Volume Up
36
VOLUME_DOWN
Electric Volume Down
40
VOC_CDMA_UNITY_GAIN
Vocoder CDMA unity gain
41
VOC_FM_HFRX_UPGAIN
Vocoder fm hfrx upgain
42
DTMFON
turn on DTMF
43
DTMFOFF
turn off DTMF
44
COMPANDORON
turn on compandor
SAMSUNG Proprietary-Contents may change without notice
5-8
Product Support Tools
Command No.
Signal. Name
Description
45
COMPANDOROFF
turn off compandor
47
FM_AUD_GAIN
FM audio gain
48
VIBRATOR_ON
activate a vibrator
49
VIBRATOR_OFF
inactivate a vibrator
50
BATT_TYPE
Battery Type
51
BBA
BBASIC supplier
52
HW_VERSION
HW version hmk_96.12.09
53
CARRIER
Target Carrier option
54
VOC13K
Target Service option
55
EXT_AUDIO
External Audio Path OnOff
57
MIC_ON
mute MIC Path
58
MIC_OFF
unmute MIC Path
59
ALLPATH
tune on the all audio path
60
FM_TX_GAIN
61
FM_RX_GAIN
62
DTMF_VOL_TX
63
TX_LIMITER
64
FM_SAT_LEVEL
65
FM_FREQ_SGAIN
66
FM_ST_GAIN
67
READ_BATT
Saved Low battery value read
68
VBATT1
set the low battery position in the standby
69
VBATT2
set the low battery position in the talking
70
WRITE_BATT
write a BATT
71
CDMA_TXADJ
sets tx_agc_adj for cdma mode
72
FM_TXADJ
sets tx_agc_adj for fm mode
73
SET_PA_RO
set TX power AMP ctrl RO JOJ_98.06.29
74
OFF_PA_RO
off TX power AMP ctrl RO JOJ_98.06.29
75
READ_RSSI
read a RSSI
77
READ_TEMP
read a TEMP
78
RXRAS_AUTO
adj RXRAS from 8924C JOJ_98.06.20
79
BUZZER_ON
Buzzer on
80
BUZZER_OFF
Buzzer off
81
VOC_PCMLPON
turn on to play a PCM LOOP BACK
82
VOC_PCMLPOFF
turn off to play a PCM LOOP BACK
SAMSUNG Proprietary-Contents may change without notice
5-9
Product Support Tools
Command No.
Signal. Name
Description
85
SPEAKER_ON
turn on the speaker path
86
SPEAKER_OFF
turn off the speaker path
87
FM_LOOP_TEST
FM loop back
88
TRK_ADJ
TRK LOCAL ADJUST
89
CDTRK_ADJ
CDMA TRK LOCAL ADJUST
92
TXRAS_ADJ
TX RAS adj = TXRAS offset arry
93
RXRAS_ADJ
RX RAS adj = RXRAS offset arry
94
HW_CHANFLAT
95
SW_CHANFLAT
96
CH_FLATNESS
97
FM_TX_PWR
99
TEMP
100
MAX
setting the volume for power Level 2-7
SAMSUNG Proprietary-Contents may change without notice
5-10
6. Troubleshooting
6-1 Logic Section
6-1-1 No Power
Press END/
button
U208 pin 1=3.6V?
No
Check the signal from the battery
terminal to Q203 pin 4.
No
Check U210 and its neighboring
circuits.
No
Check U210 and its neighboring
circuits.
No
Check U206 and its neighboring
circuits.
Yes
U210 pin 1 input
=3.6V?
Yes
U210 pin 5 output
=3.0V?
Yes
U206 pin 5 output
=3.0V?
Yes
END
SAMSUNG Proprietary-Contents may change without notice
6-1
Troubleshooting
6-1-2 Abnormal Initial Operation (Normal +3.0V voltage source)
Press END/
button
TCXO CLK
applied to U406 pin 35?
No
Check TCXO output,
R460 and C467.
Replace if required.
No
Check U304 and its neighboring
circuit. Replace if required.
No
Check U202, pin 2 Replace if required.
No
Check ‘H’ level input U304 pin 38.
No
Check the LED and its neighboring
circuit. Replace if required.
No
Check the LCD pins and its
neighboring circuit.
Replace if required.
Yes
TCXO CLK signal output
from U304 pin 37?
Yes
LCD-CS signal output
from U104 pin 10A?
Yes
CHIPX8 CLK signal output
from U304 pin 38?
Yes
LED ON?
Yes
Normal initial
display on LCD?
Yes
END
SAMSUNG Proprietary-Contents may change without notice
6-2
Troubleshooting
6-1-3 Abnormal Backlight Operation
Press and button on the phone
‘H’ level output from
U104 pin 7L?
No
Check U104 pin7L.
Replace if required.
No
Check U209 and its
neighboring circuits.
Replace if required
No
Check Q206, L202
and its neighboring circuits.
Yes
‘H’ level input from
U104 pin7L drive U209?
Yes
The voltage applied to
LCD(U207) pins31?
Yes
Backlight
LED on
SAMSUNG Proprietary-Contents may change without notice
6-3
Troubleshooting
6-1-4 Abnormal Key Data input
Check initial status
Scanning signals
output from U104, pins 5C, 48,
5D, 4A, 6C, 5A, 6D?
No
Check U104 pins
5C, 48, 5D, 4A, 6C, 5A, 6D
No
Replace the keypad assembly
Yes
Check U104 pins 2A, 4C, and 3B
Yes
Check CON102-24.
Yes
Normal key data input?
Yes
END
SAMSUNG Proprietary-Contents may change without notice
6-4
Troubleshooting
6-1-5 Abnormal Key tone
Abnormal Keytone
CLK Waveform output
from U204 pin 17?
No
Check U204 pin 17.
Replace if required.
No
Check U204, pin 15.
Replace if required.
No
Check Q201,Q202,R227,R220,
and D206.Replace if required.
No
Connect the buzzer correcty
Yes
CHIP_CELECT U104 pin 7M
Yes
CLK waveform applied
to CON102-24 pin 24?
Yes
Is the buzzer
connection correct?
Yes
Check the buzzer and
replace if required
SAMSUNG Proprietary-Contents may change without notice
6-5
Troubleshooting
6-2 Transmitter Section
Power Level : +10dBm
DC Power Supply : 3.95V
CH:363
Abormal
transmitter
section
No
Check Tx PLL
OK?
No
Check U406
Tx IF level
OK?
SPAN 5MHz
Tx VCO:270.76MHz
IF:130.38MHz
Yes
CDMA: -15dBm
Check U406
local Input level
CDMA: -8dBm
Yes
Yes
Check Tx
Power level.
OK?
No
Check U404
Out level.
OK?
CDMA: -12dBm
Yes
Check U306
Out level
CDMA: +8.63dBm
No
SAMSUNG Proprietary-Contents may change without notice
6-6
969.27MHz
CH:363
Troubleshooting
6-3 FM Receiver Section
Power Level : -50dBm
DC Power Supply : 3.95V
CH:363
RX part
No
Check FM 12dB
SINAD OK?
Check LNA
in/output OK?
No
Check Duplexer
& LNA power
Gain: +20dB
Yes
Yes
Yes
Check 1st
local & mixer power
OK?
Check mixer
in/output OK?
Gain(FM): -8dB
No
Check PLL (U504)
& VCO output
local: -2.3dBm
VCO_OUTPUT: -4dBm
Yes
Check IF AMP
in/output OK?
No
Check IF AMP
power OK?
Gain(FM): +20dB
Yes
Check IF filter
in/output OK?
No
Check IF filter
solderling
CDMA : -16dBm
FM : -6dB
Yes
Check 2nd
local & AGC control
voltage OK?
No
170.76MHz170.76MHz
Yes
RF Rx FM OK
IFR INPUT CDMA :-40dBm
FM : -26dBm
SAMSUNG Proprietary-Contents may change without notice
6-7
Check IFR(U304)
Soldering
Troubleshooting
6-4 CDMA Receiver Section
Start CDMA mode
Normal CDMA
SVC & ROAM OK?
No
Check CDMA RX path
Setup CDMA
call. OK?
No
Check Transmitter
No
Yes
Measure
CDMA FER
Yes
Normal CDMA RF?
SAMSUNG Proprietary-Contents may change without notice
6-8
Troubleshooting
6-5 Desk-Top Rapid Charger
Plug_in
Check LED state
(RED>GRN>YEL)
Check
BAT-Contact.
Check Voltage of
C3, C2.
(about 330V)
Check
F1, BD1, U1
Check Battery.
Check component the secondary
D30, D20, U22, U23, U24, U25, U26.
Blank of Front.
Check
BAT-Contact.
Check
Battery.
Check C30
Blank of Rear
Check
BAT-Contact.
Check
Battery.
Check C40.
Check
Voltage of
C41.(5V)
Check U25.
LED blink?
(Yellow)
Check Voltage of
C22.
(about 4.5V)
Check
U26.
Check Voltage of
C22.
(about 4.5V)
LED blink?
(RED>GRN>YEL)
Check
LD1, LD2
Check component the secondary
D30, D20, U22, U23, U24, U25, U26.
SAMSUNG Proprietary-Contents may change without notice
6-9
Troubleshooting
6-6 Hands-Free Kit 1
Start
Ignition Check
Phone Power
ON/OFF Check
Charger Circuit
Auto Power ON
Handset Hook
ON/OFF Check
Handset Mode
Battery Check
Hands Free Mode
Charging current
and voltage check
according to
battery type
Full Charging check
Charging LED Check
In conversation mode, volume
adijustment, mute on/off,
calibration check
Auto power off
according to lgnition status
Handsfree off with the phone
powered off or removed
SAMSUNG Proprietary-Contents may change without notice
6-10
7. Exploded View and its Parts List
7-1 Cellular phone Exploded View
2-5
1-1
2-3
1
2
3
10
2-4
2-1
2-2
4
10-1
6
14
5
7
10-2
13
12
16
8
9
10-3
15-1
15
10-4
11
15-2
12
SAMSUNG Proprietary-Contents may change without notice
7-1
Exploded view and its Part List
7-2 Cellular phone Exploded List
Location No.
1
Description
SEC Code
Remark
FLIP COVER ASS’Y
GH75-00428A
LOGO BADGE
GH68-20008A
FRONT ASS’Y
GH75-00426A
2-1
LCD WINDOW
GH72-00180A
SNA
2-2
LCD BOHO SPONGE
GH74-00492A
SNA
2-3
EAR JACK HOLDER
GH72-00148A
SNA
2-4
HINGE ASS’Y
GH75-00046A
SNA
2-5
ANTENNA CAP
GH73-00094A
3
SIDE KEY ASS’Y
GH75-00088A
4
KEY PAD
GH72-00588A
5
KEY SHIELD CAN
GH72-00554A
6
MIC. HOLDER
GH73-00046A
7
SPONGE REAR CONNECTOR
GH74-00094A
8
REAR SHIELD CAN
GH72-00555A
9
SHIELD RF SPONGE
GH74-00272A
10
KEY PCB ASS’Y
GH59-00039A
10-1
MOTOR
GH31-00003A
10-2
BUZZER MAGNETIC
3002-001064
10-3
READ SWITCH
3409-001084
10-4
MICROPHONE
GH96-00772A
11
BATTERY
GH43-00140C
12
SCREW(MAIN)
6001-001148
13
LCD MODULE
GH07-00015A
14
SPEAKER
3001-001138
15
REAR ASS’Y
GH75-00451A
15-1
ANTENNA BRACKET
GH71-00013A
SNA
15-2
BATTERY LOCKER
GH72-00147A
SNA
16
ANTENNA
GH42-00036A
1-1
2
SAMSUNG Proprietary-Contents may change without notice
7-2
SNA
SNA
Exploded view and its Part List
7-3 Desk-Top Rapid charger Exploded View
1
A
TYPE
2
4
B
SEC. CODE
Remark
A
GH44-00063A
Israel
B
GH44-00063B
Hong Kong
6
3
5
7
8
No
Description
Q’TY
1
Case. upper
1
2
Hook-plate
2
9
3
SCREW
4
4
Battery housing
1
10
5
SCREW
1
6
Power cord
1
7
PCB
1
8
Case. Lower
1
9
SCREW
4
10
BUM PON
4
11
Label
1
11
SAMSUNG Proprietary-Contents may change without notice
7-3
Exploded view and its Part List
7-4 Hands-free Kit 1 Exploded View
1
2
3
4
5
6
No
7
Description
Q’TY
1
Case. upper
1
2
SCREW 3✕5Y
1
3
PCB
1
4
Case. Lower
1
5
SCREW 3✕12Y
4
6
Sponge
2
7
Label
1
SAMSUNG Proprietary-Contents may change without notice
7-4
Exploded view and its Part List
7-5 Speaker Exploded View
6
7
4
9
3
8
5
2
1
No
Description
Q’TY
1
Case. Front
1
2
Speaker
1
3
Case. Rear
1
4
Bolt
2
5
HEX. NUT
2
6
Hamdle
1
7
Speaker wire
1
8
Screw
4
9
Label
1
SAMSUNG Proprietary-Contents may change without notice
7-5
Exploded view and its Part List
7-6 Cradle Exploded View
No
Description
Q’TY
1
Cover Top
1
2
Holder Socket
1
3
Spring Lock
2
4
Locker
1
5
Locker
1
6
Eject-A
1
7
Eject Spring
2
8
Frame
1
9
Eject-B
1
10
Screw
6
11
PCB
1
12
SCREW
4
13
Cover Bottom
1
14
Screw
2
15
Label
1
16
I/F coil cord
1
17
Data coil cord
1
1
2
4
3
6
5
7
9
8
7
10
11
12
16
13
14
15
17
SAMSUNG Proprietary-Contents may change without notice
7-6
8. Electrical Parts List
8-1 Main parts List
Level Design LOC
ITEMS
DESCRIPTIONS
0
SEC CODE
SCH-620B/TRJ
1
SCREW-MACHINE
“BH,*,M2,L5,ZPC(BLK),SM20C,FDP”
6001-001148
1
SCREW-MACHINE
“PH,+,M1.7,L5,ZPC(BLK),SWRCH18A,FP”
6001-001204
1
ANTENNA-SCH620
“SCH-620,824~895MHz,-,50ohm”
GH42-00036A
1
“BATTERY-1000M,BLK,POT
“3.6V,1000mAh,-,2CmA,4.1V”
GH43-00140C
1
“CHARGER-SCH620,TC010A”
“SCH-620,AC/DC,12W,220VAC”
GH44-00113A
1
LABEL(P)-COLOR
“SCH-611,ART,PI9,100G,BLK”
GH68-00157F
1
MAN(CARD)-SERVICES(BRAZ) “SCH-811,TELEFONICA,BRAZ”
GH68-00556A
1
LABEL(R)-B/C RIBBON
“SCH-2500,POLYESTER,60X450,-,BLK”
GH68-00639B
1
LABEL(P)-BAR CODE
“SCH-611,WHITE POLYESTER,61X50,100G
GH68-00662A
1
LABEL(R)-MAIN
“SCH-620,MAT,39.7X29.8,T0.05,SIL”
GH68-00787A
1
LABEL(P)-SHIP(BRAZ-3)
“SCH-620,CRP,250X180,100G,YEL”
GH68-00791A
1
MAN(BOOK)-USER’S
“SCH-620,SAMSUNG,BRAZ”
GH68-00893A
1
LABEL(P)-MS BAR CODE
“SCH-1900,ART,100X155,T0.1,WHT”
GH68-11057A
1
LABEL(R)-BAR CODE
“SP-D300,PR,34X6.5,T0.1,WHT”
GH68-30963A
1
BAG-VINYL
“POLYPROPYLEN,T0.06,105X230,SGH-A100”
GH69-00393A
1
PMO-KEY PAD
“SCH-620,FE TYPE,BLK,-,-”
GH72-00588A
1
RMO-RUBBER REAR
“SCH-900,RUBBER,12X12X1.3,BLK,60”
GH73-00050A
1
RMO-EAR JACK RUBBER
“SCH-900,RUBBER,9X7X0.8,BLK,70”
GH73-00064A
1
RMO-ANT.CAP(BLK)
“SCH-900,SILICON,6X6X9,BLK,50”
GH73-00094A
1
RMO-COVER CONNECT
“SPH-6000,SI,17X4.2X5,BLK,80HB”
GH73-40673A
1
MPR-WINDOW VINYL
“SCH-900,PE4187,34.6X24XT0.2,TRP,-”
GH74-00078A
1
MEC-SIDE KEY
“SCH-900,SEC,IVR”
GH75-00088A
PMO-SIDE KEY
“SCH-900,ABS,IVR,-,-”
GH72-00181A
2
RMO-SIDE KEY RUBBER
“SCH-900,RUBBER,28.65X3.2X2.1,BLK,50”
GH73-00044A
1
2
MEC-HANGER ROPE
“SGH-2300,-,BLK”
GH75-00223E
1
PBA MAIN-SCH620
“SCH-620,TELSEL,BRAZ,-,-,-,-”
GH92-00780A
2
D302
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D303
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D402
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D403
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
ZD206
DIODE-TVS
“SM05,6V/1mA,300,SOT-23”
0406-001005
2
ZD101
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
ZD102
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
ZD103
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D206
DIODE-ARRAY
“DAN202U,80V,100mA,CA2-3,SC-70,”
0407-000115
2
D204
DIODE-ARRAY
“DA221,20V,100mA,C2-3,EM3,TR”
0407-001006
2
D205
DIODE-ARRAY
“DA221,20V,100mA,C2-3,EM3,TR”
0407-001006
2
D401
DIODE-ARRAY
“DA221,20V,100mA,C2-3,EM3,TR”
0407-001006
SAMSUNG Proprietary-Contents may change without notice
8-1
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
ZD104
DIODE-ARRAY
“DA221,20V,100mA,C2-3,EM3,TR”
0407-001006
2
ZD202
DIODE-ARRAY
“DA221,20V,100mA,C2-3,EM3,TR”
0407-001006
2
ZD203
DIODE-ARRAY
“DA221,20V,100mA,C2-3,EM3,TR”
0407-001006
2
D301
DIODE-PIN
“BAR63-02W,50V,100mA,SCD-80,TP”
0409-001016
2
Q301
TR-SMALL SIGNAL
“2SC4081,NPN,200mW,UMT,TP,180-3”
0501-000218
2
Q205
TR-SMALL SIGNAL
“2SC4617,NPN,200mW,EM3,TP,120-5”
0501-000225
2
Q207
TR-SMALL SIGNAL
“2SC4617,NPN,200mW,EM3,TP,120-5”
0501-000225
2
Q504
TR-SMALL SIGNAL
“2SC4617,NPN,200mW,EM3,TP,120-5”
0501-000225
2
Q303
TR-SMALL SIGNAL
“AT32033,NPN,200mW,SOT-23,TP,70”
0501-002110
2
Q505
TR-SMALL SIGNAL
“AT32033,NPN,200mW,SOT-23,TP,70”
0501-002110
2
Q202
TR-SMALL SIGNAL
“MMBT2222AWT1,NPN,150mW,SOT-323”
0501-002202
2
Q204
TR-SMALL SIGNAL
“MMBT2222AWT1,NPN,150mW,SOT-323”
0501-002202
2
Q206
TR-SMALL SIGNAL
“2SA1579,PNP,200MW,SC-70,TP,180-390”
0501-002250
2
Q402
TR-DIGITAL
“RN1102,NPN,100MW,10K/10K,SSM,TP”
0504-000167
2
Q101
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q208
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q304
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q502
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q201
TR-DIGITAL
“RN2104,PNP,100MW,47K/47K,SSM,TP”
0504-000172
2
Q404
TR-DIGITAL
“RN2104,PNP,100MW,47K/47K,SSM,TP”
0504-000172
2
Q501
TR-DIGITAL
“RN2104,PNP,100MW,47K/47K,SSM,TP”
0504-000172
2
Q203
FET-SILICON
“SI3443DV,P,-20V,+-3.5mA,65mohm”
0505-001165
2
Q401
FET-SILICON
“SI3443DV,P,-20V,+-3.5mA,65mohm”
0505-001165
2
Q503
FET-SILICON
“SI3443DV,P,-20V,+-3.5mA,65mohm”
0505-001165
2
Q302
FET-GAAS
“NE34018,5V,-3V,80mA,125mW,SOT-343,TP”
0505-001183
2
LED101
LED
“CHIP,RED,1.2x0.8mm,660nm”
0601-001226
2
U202
IC-CMOS LOGIC
“7S04FU,INVERTER,SOP,5P,-,-,TP,”
0801-002345
2
U303
IC-ANALOG SWITCH
“SW395TR,SPDP,SOT-26,6P,-,DUAL,”
1001-001048
2
U209
IC-POWER DRIVER
“D361A,SOP,8P,120MIL,SINGLE,90MA,TP,
1003-001226
2
U105
IC-EEPROM
“24256,256KBIT,SOP,8P,150MIL,-,3V,10%,
1103-001147
2
U110
IC-SRAM
“68U4100,512KX8BIT,BGA,48P,-,100NS,3.3V,
1106-001287
2
U111
IC-FLASH MEMORY
“29LV800,512Kx16BIT,BGA,48P,354”
1107-001111
2
U112
IC-FLASH MEMORY
“29LV160,2MX8BIT,FBGA,48P,-,90NS,3V,10%
1107-001164
2
U503
IC-CASCODE AMP
“0916,SOT-143,4P,-,-,2.7V,-,6Vd”
1201-001248
2
U401
IC-POWER AMP
“23124,LCC,8P,-,SINGLE,-,PLASTI”
1201-001259
2
U403
IC-OP AMP
“821,SOT23-5,5P,63MIL,SINGLE,-,”
1201-001348
2
U302
IC-MMIC AMP
“MD57-0001,SOT-26,6P,114MIL,SIN”
1201-001384
2
U201
IC-VOLTAGE COMP.
“75W56,SSOP,8P,110MIL,DUAL,7V,C”
1202-001022
2
U208
IC-SWITCH VOL. REG.
“5205,SOT-23,5P,150MIL,PLASTIC,”
1203-001285
2
U305
IC-SWITCH VOL. REG.
“5205,SOT-23,5P,150MIL,PLASTIC,”
1203-001285
2
U306
IC-SWITCH VOL. REG.
“5205,SOT-23,5P,150MIL,PLASTIC,”
1203-001285
SAMSUNG Proprietary-Contents may change without notice
8-2
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
U407
IC-SWITCH VOL. REG.
“5205,SOT-23,5P,150MIL,PLASTIC,”
1203-001285
2
U210
IC-VOLTAGE REGULATOR
“5219,SOT-23,5P,63MIL,PLASTIC,2.91/3.09V
1203-001720
2
U206
IC-RESET
“3470,SOT23,5P,-,PLASTIC,0.99/1.01V,300mW
1203-001835
2
U204
IC-ENCODER/DECODER
“ST5092TQFPTR,QFP,44P,-,PLASTIC”
1204-001375
2
U304
IC-IF CIRCUIT
“IFR3000,TQFP,48P,-,PLASTIC,3.5V,-,-
1204-001504
2
U406
IC-IF CIRCUIT
“IFT3000,TQFP,48P,-,PLASTIC,3.5V,-,-
1204-001505
2
U104
IC-TRANSCEIVER
“MSM3000,PBGA,196P,-,PLASTIC,3.5V,-,-
1205-001670
2
U404
IC-MIXER
“MRFIC0954,TSSOP,20P,173MIL,PLASTIC,
1205-001747
2
U504
IC-PLL
“LMX2332LSLB,CSP,20P,-,PLASTIC,”
1209-001197
2
R411
THERMISTOR-NTC
“10KOHM,3%,4100K,30MW/C,TP”
1404-001165
2
R412
THERMISTOR-NTC
“10KOHM,3%,4100K,30MW/C,TP”
1404-001165
2
R451
THERMISTOR-NTC
“10KOHM,3%,4100K,30MW/C,TP”
1404-001165
2
L502
R-CHIP
“0ohm,5%,1/16W,DA,TP,1608”
2007-000070
2
R556
R-CHIP
“0ohm,5%,1/16W,DA,TP,1608”
2007-000070
2
R218
R-CHIP
“2Kohm,5%,1/16W,DA,TP,1005”
2007-000137
2
L430
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R103
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R105
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R107
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R109
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R113
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R144
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R424
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R565
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R314
R-CHIP
“220ohm,5%,1/16W,DA,TP,1005”
2007-000139
2
R112
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R121
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R128
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R129
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R137
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R160
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R227
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R232
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R248
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R253
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R255
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R301
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R503
R-CHIP
“2.2Kohm,5%,1/16W,DA,TP,1005”
2007-000141
2
R450
R-CHIP
“2.7Kohm,5%,1/16W,DA,TP,1005”
2007-000142
2
R101
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R131
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
SAMSUNG Proprietary-Contents may change without notice
8-3
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
R568
R-CHIP
“5.1Kohm,5%,1/16W,DA,TP,1005”
2007-000144
2
R452
R-CHIP
“6.2Kohm,5%,1/16W,DA,TP,1005”
2007-000145
2
R143
R-CHIP
“6.8Kohm,5%,1/16W,DA,TP,1005”
2007-000146
2
R239
R-CHIP
“6.8Kohm,5%,1/16W,DA,TP,1005”
2007-000146
2
R454
R-CHIP
“8.2Kohm,5%,1/16W,DA,TP,1005”
2007-000147
2
R110
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R119
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R123
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R127
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R139
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R171
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R175
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R224
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R453
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R136
R-CHIP
“15Kohm,5%,1/16W,DA,TP,1005”
2007-000151
2
R130
R-CHIP
“20Kohm,5%,1/16W,DA,TP,1005”
2007-000152
2
R102
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R142
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R225
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R234
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R252
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R552
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R215
R-CHIP
“24Kohm,5%,1/16W,DA,TP,1005”
2007-000154
2
R311
R-CHIP
“24Kohm,5%,1/16W,DA,TP,1005”
2007-000154
2
R104
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R330
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R331
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R402
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R462
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R550
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R553
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R554
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R220
R-CHIP
“56Kohm,5%,1/16W,DA,TP,1005”
2007-000159
2
R210
R-CHIP
“68Kohm,5%,1/16W,DA,TP,1005”
2007-000160
2
R145
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R146
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R147
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R148
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R149
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R150
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R151
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
SAMSUNG Proprietary-Contents may change without notice
8-4
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
R152
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R170
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R173
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R208
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R235
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R245
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R247
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R249
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R250
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R251
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R315
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R320
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R455
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R563
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R209
R-CHIP
“120Kohm,5%,1/16W,DA,TP,1005”
2007-000163
2
R341
R-CHIP
“150Kohm,5%,1/16W,DA,TP,1005”
2007-000164
2
R205
R-CHIP
“200Kohm,5%,1/16W,DA,TP,1005”
2007-000165
2
R133
R-CHIP
“1Mohm,5%,1/16W,DA,TP,1005”
2007-000170
2
R310
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R313
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R460
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R502
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R505
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R569
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R570
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R571
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R572
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R212
R-CHIP
“1.5Kohm,5%,1/16W,DA,TP,1005”
2007-000242
2
R430
R-CHIP
“1.5Kohm,5%,1/16W,DA,TP,1005”
2007-000242
2
R431
R-CHIP
“1.5Kohm,5%,1/16W,DA,TP,1005”
2007-000242
2
R226
R-CHIP
“3.3Mohm,5%,1/16W,DA,TP,1005”
2007-000690
2
R305
R-CHIP
“3.3Mohm,5%,1/16W,DA,TP,1005”
2007-000690
2
R106
R-CHIP
“470ohm,5%,1/16W,DA,TP,1005”
2007-000932
2
R551
R-CHIP
“5.6Kohm,5%,1/16W,DA,TP,1005”
2007-000982
2
R135
R-CHIP
“680ohm,5%,1/16W,DA,TP,1005”
2007-001119
2
R304
R-CHIP
“82ohm,5%,1/16W,DA,TP,1005”
2007-001217
2
R242
R-CHIP
“36ohm,5%,1/16W,DA,TP,1005”
2007-001294
2
R243
R-CHIP
“36ohm,5%,1/16W,DA,TP,1005”
2007-001294
2
R244
R-CHIP
“36ohm,5%,1/16W,DA,TP,1005”
2007-001294
2
R116
R-CHIP
“150ohm,5%,1/16W,DA,TP,1005”
2007-001306
2
R176
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
SAMSUNG Proprietary-Contents may change without notice
8-5
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
R180
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R181
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R182
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R183
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R184
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R185
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R186
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R187
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R188
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R189
R-CHIP
“330ohm,5%,1/16W,DA,TP,1005”
2007-001313
2
R501
R-CHIP
“910ohm,5%,1/16W,DA,TP,1005”
2007-001317
2
R124
R-CHIP
“1.2Kohm,5%,1/16W,DA,TP,1005”
2007-001319
2
R457
R-CHIP
“1.2Kohm,5%,1/16W,DA,TP,1005”
2007-001319
2
R441
R-CHIP
“1.8Kohm,5%,1/16W,DA,TP,1005”
2007-001320
2
R211
R-CHIP
“3.3Kohm,5%,1/16W,DA,TP,1005”
2007-001325
2
R240
R-CHIP
“3.3Kohm,5%,1/16W,DA,TP,1005”
2007-001325
2
R312
R-CHIP
“510ohm,5%,1/16W,DA,TP,1005”
2007-002796
2
R566
R-CHIP
“16OHM,5%,1/16W,DA,TP,1005”
2007-003006
2
R567
R-CHIP
“16OHM,5%,1/16W,DA,TP,1005”
2007-003006
2
R217
R-CHIP
“20OHM,5%,1/16W,DA,TP,1005”
2007-003010
2
R459
R-CHIP
“62KOHM,5%,1/16W,DA,TP,1005”
2007-003023
2
R228
R-CHIP
“620KOHM,5%,1/16W,DA,TP,1005”
2007-003024
2
R461
R-CHIP
“100Kohm,1%,1/16W,DA,TP,1005”
2007-007107
2
R456
R-CHIP
“13Kohm,1%,1/16W,DA,TP,1005”
2007-007131
2
R426
R-CHIP
“15Kohm,1%,1/16W,DA,TP,1005”
2007-007132
2
R458
R-CHIP
“15Kohm,1%,1/16W,DA,TP,1005”
2007-007132
2
R435
R-CHIP
“18Kohm,1%,1/16W,DA,TP,1005”
2007-007135
2
R404
R-CHIP
“27Kohm,1%,1/16W,DA,TP,1005”
2007-007138
2
R221
R-CHIP
“47Kohm,1%,1/16W,DA,TP,1005”
2007-007139
2
R309
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R322
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R323
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R405
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R440
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R403
R-CHIP
“100ohm,1%,1/16W,DA,TP,1005”
2007-007306
2
R407
R-CHIP
“20Kohm,1%,1/16W,DA,TP,1005”
2007-007312
2
R427
R-CHIP
“20Kohm,1%,1/16W,DA,TP,1005”
2007-007312
2
R436
R-CHIP
“3.9Kohm,1%,1/16W,DA,TP,1005”
2007-007315
2
R408
R-CHIP
“3.3Kohm,1%,1/16W,DA,TP,1005”
2007-007316
2
R306
R-CHIP
“1Kohm,1%,1/16W,DA,TP,1005”
2007-007318
2
R437
R-CHIP
“390ohm,1%,1/16W,DA,TP,1005”
2007-007319
SAMSUNG Proprietary-Contents may change without notice
8-6
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
R564
R-CHIP
“68Kohm,1%,1/16W,DA,TP,1005”
2007-007589
2
R438
R-CHIP
“2KOHM,1%,1/16W,DA,TP,1005”
2007-007766
2
L350
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R174
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R203
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R207
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R223
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R321
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R557
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R558
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
R560
R-CHIP
“0OHM,5%,1/16W,DA,TP,1005”
2007-007771
2
C105
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C106
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C107
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C108
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C128
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C130
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C262
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C270
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C305
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C308
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C311
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C324
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C341
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C351
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C354
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C356
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C357
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C361
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C364
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C370
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C408
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C409
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C419
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C421
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C422
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C427
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C428
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C429
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C441
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C469
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
SAMSUNG Proprietary-Contents may change without notice
8-7
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
C472
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C474
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C477
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C479
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C483
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C485
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C487
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C503
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C509
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C510
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C511
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C512
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C515
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C522
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C525
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C541
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C554
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C555
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C556
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C557
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C558
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C559
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
L314
“C-CERAMIC,CHIP”
“0.1nF,5%,50V,NP0,TP,1005”
2203-000233
2
C101
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C111
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C117
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C121
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C122
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C126
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C133
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C254
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C255
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C263
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C277
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C375
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C378
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C380
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C381
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C384
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C403
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C412
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
SAMSUNG Proprietary-Contents may change without notice
8-8
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
C414
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C420
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C423
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C425
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C460
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C461
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C463
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C464
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C466
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C467
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C478
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C482
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C486
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C506
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C513
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C516
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C564
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C501
“C-CERAMIC,CHIP”
“0.01nF,0.5pF,50V,NP0,TP,1005”
2203-000278
2
C362
“C-CERAMIC,CHIP”
“11pF,5%,50V,NPO,TP,1005,-”
2203-000300
2
C210
“C-CERAMIC,CHIP”
“0.12nF,5%,50V,NP0,TP,1005”
2203-000311
2
C452
“C-CERAMIC,CHIP”
“0.012nF,5%,50V,NP0,TP,1005”
2203-000330
2
C306
“C-CERAMIC,CHIP”
“0.018nF,5%,50V,NP0,TP,1005”
2203-000425
2
C110
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C115
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C170
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C249
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C307
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C312
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C313
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C314
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C315
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C326
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C327
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C331
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C332
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C345
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C347
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C349
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C359
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C360
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C410
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
SAMSUNG Proprietary-Contents may change without notice
8-9
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
C432
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C434
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C442
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C443
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C451
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C457
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C453
“C-CERAMIC,CHIP”
“2.2nF,10%,50V,X7R,TP,1005,-”
2203-000489
2
C140
“C-CERAMIC,CHIP”
“220pF,10%,50V,X7R,TP,1005,-”
2203-000585
2
C265
“C-CERAMIC,CHIP”
“220pF,10%,50V,X7R,TP,1005,-”
2203-000585
2
C514
“C-CERAMIC,CHIP”
“220pF,10%,50V,X7R,TP,1005,-”
2203-000585
2
C328
“C-CERAMIC,CHIP”
“0.022nF,5%,50V,NP0,TP,1005”
2203-000628
2
C160
“C-CERAMIC,CHIP”
“0.027nF,5%,50V,NP0,TP,1005”
2203-000679
2
C161
“C-CERAMIC,CHIP”
“0.027nF,5%,50V,NP0,TP,1005”
2203-000679
2
C340
“C-CERAMIC,CHIP”
“0.027nF,5%,50V,NP0,TP,1005”
2203-000679
2
C342
“C-CERAMIC,CHIP”
“0.027nF,5%,50V,NP0,TP,1005”
2203-000679
2
C543
“C-CERAMIC,CHIP”
“0.027nF,5%,50V,NP0,TP,1005”
2203-000679
2
C132
“C-CERAMIC,CHIP”
“3.3nF,10%,50V,X7R,TP,1005,-”
2203-000714
2
C322
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C323
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C329
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C363
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C376
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C382
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C484
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C507
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C102
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C104
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C120
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C320
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C114
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C116
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C124
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C203
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C204
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C219
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C220
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C226
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C405
“C-CERAMIC,CHIP”
“0.047nF,5%,50V,NP0,TP,1005”
2203-000995
2
C563
“C-CERAMIC,CHIP”
“0.056nF,5%,50V,NP0,TP,1005”
2203-001072
2
C228
“C-CERAMIC,CHIP”
“6.8nF,10%,25V,X7R,TP,1005,-”
2203-001101
2
C229
“C-CERAMIC,CHIP”
“6.8nF,10%,25V,X7R,TP,1005,-”
2203-001101
SAMSUNG Proprietary-Contents may change without notice
8-10
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
C231
“C-CERAMIC,CHIP”
“6.8nF,10%,25V,X7R,TP,1005,-”
2203-001101
2
C232
“C-CERAMIC,CHIP”
“6.8nF,10%,25V,X7R,TP,1005,-”
2203-001101
2
C248
“C-CERAMIC,CHIP”
“6.8nF,10%,25V,X7R,TP,1005,-”
2203-001101
2
C551
“C-CERAMIC,CHIP”
“6.8nF,10%,25V,X7R,TP,1005,-”
2203-001101
2
C119
“C-CERAMIC,CHIP”
“8.2nF,10%,16V,X7R,TP,1005,-”
2203-001210
2
C413
“C-CERAMIC,CHIP”
“8.2nF,10%,16V,X7R,TP,1005,-”
2203-001210
2
C450
“C-CERAMIC,CHIP”
“0.082nF,5%,50V,NP0,TP,1005”
2203-001239
2
C455
“C-CERAMIC,CHIP”
“0.082nF,5%,50V,NP0,TP,1005”
2203-001239
2
C526
“C-CERAMIC,CHIP”
“0.008nF,0.5pF,50V,NP0,TP,1005”
2203-001259
2
C505
“C-CERAMIC,CHIP”
“33nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001416
2
C309
“C-CERAMIC,CHIP”
“0.0005nF,0.1pF,50V,NP0,TP,1005”
2203-002668
2
C523
“C-CERAMIC,CHIP”
“0.0005nF,0.1pF,50V,NP0,TP,1005”
2203-002668
2
C544
“C-CERAMIC,CHIP”
“0.0005nF,0.1pF,50V,NP0,TP,1005”
2203-002668
2
C348
“C-CERAMIC,CHIP”
“0.009nF,0.25pF,50V,NP0,TP,1005”
2203-003054
2
C125
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C127
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C131
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C171
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C173
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C207
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C212
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C214
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C217
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C222
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C223
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C224
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C225
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C227
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C230
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C238
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C242
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C246
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C247
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C250
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C251
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C253
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C261
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C280
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C281
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C302
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C304
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
SAMSUNG Proprietary-Contents may change without notice
8-11
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
C321
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C333
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C334
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C352
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C353
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C355
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C358
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C372
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C374
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C383
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C407
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C424
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C440
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C456
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C462
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C470
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C471
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C473
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C488
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C490
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C491
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C504
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C521
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C530
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C542
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C552
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C553
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C561
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
R201
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
R202
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005”
2203-005061
2
C141
“C-CERAMIC,CHIP”
“1000nF,+80-20%,10V,Y5V,TP,1608”
2203-005065
2
C211
“C-CERAMIC,CHIP”
“1000nF,+80-20%,10V,Y5V,TP,1608”
2203-005065
2
C234
“C-CERAMIC,CHIP”
“1000nF,+80-20%,10V,Y5V,TP,1608”
2203-005065
2
C237
“C-CERAMIC,CHIP”
“1000nF,+80-20%,10V,Y5V,TP,1608”
2203-005065
2
C546
“C-CERAMIC,CHIP”
“1000nF,+80-20%,10V,Y5V,TP,1608”
2203-005065
2
C565
“C-CERAMIC,CHIP”
“1000nF,+80-20%,10V,Y5V,TP,1608”
2203-005065
2
C476
“C-CERAMIC,CHIP”
“0.0015nF,0.1pF,50V,NP0,TP,1005”
2203-005281
2
C489
“C-CERAMIC,CHIP”
“0.0015nF,0.1pF,50V,NP0,TP,1005”
2203-005281
2
C562
“C-CERAMIC,CHIP”
“0.001nF,0.1pF,50V,NP0,TP,1005”
2203-005288
2
C430
“C-CERAMIC,CHIP”
“7pF,0.1pF,50V,NPO,TP,1005,-”
2203-005383
2
C431
“C-CERAMIC,CHIP”
“7pF,0.1pF,50V,NPO,TP,1005,-”
2203-005383
SAMSUNG Proprietary-Contents may change without notice
8-12
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
L307
“C-CERAMIC,CHIP”
“0.005nF,0.1pF,50V,NP0,TP,1005”
2203-005393
2
C426
“C-CERAMIC,CHIP”
“0.0047nF,0.1pF,50V,NP0,TP,1005”
2203-005395
2
C325
“C-CERAMIC,CHIP”
“0.003nF,0.1pF,50V,NP0,TP,1005”
2203-005444
2
C344
“C-CERAMIC,CHIP”
“0.003nF,0.1pF,50V,NP0,TP,1005”
2203-005444
2
C343
“C-CERAMIC,CHIP”
“0.0056nF,0.1pF,50V,NP0,TP,1005”
2203-005450
2
C218
“C-CERAMIC,CHIP”
“33nF,10%,10V,X7R,TP,1005,-”
2203-005480
2
C301
“C-CERAMIC,CHIP”
“47nF,10%,10V,X7R,TP,1005,-”
2203-005481
2
C475
“C-CERAMIC,CHIP”
“0.0022nF,0.1pF,50V,NP0,TP,1005”
2203-005552
2
C310
“C-CERAMIC,CHIP”
“10000NF,+80-20%,6.3V,Y5V,TP,2012”
2203-005571
2
C549
“C-CERAMIC,CHIP”
“10000NF,+80-20%,6.3V,Y5V,TP,2012”
2203-005571
2
C550
“C-CERAMIC,CHIP”
“10000NF,+80-20%,6.3V,Y5V,TP,2012”
2203-005571
2
C239
“C-CERAMIC,CHIP”
“1000NF,10%,16V,X5R,TP,3216(0.95T)”
2203-005634
2
C240
“C-CERAMIC,CHIP”
“1000NF,10%,16V,X5R,TP,3216(0.95T)”
2203-005634
2
C129
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C233
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C458
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C492
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C241
“C-TA,CHIP”
“220uF,20%,6.3V,LZ,TP,7132”
2404-001083
2
C508
“C-TA,CHIP”
“4.7uF,20%,6.3V,GP,TP,2012,-”
2404-001086
2
C560
“C-TA,CHIP”
“220nF,20%,20V,GP,TP,2012,-”
2404-001092
2
C213
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3719,-”
2404-001100
2
C274
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3719,-”
2404-001100
2
C215
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C216
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C221
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C235
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C252
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C260
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C276
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C303
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C350
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C371
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C373
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C377
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C379
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C402
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C404
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C406
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C468
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C480
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
C481
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
SAMSUNG Proprietary-Contents may change without notice
8-13
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
C502
“C-TA,CHIP”
“10UF,20%,6.3V,GP,TP,2012”
2404-001105
2
L411
INDUCTOR-SMD
“180nH,10%,0.8x1.6x0.8mm”
2703-000143
2
L412
INDUCTOR-SMD
“180nH,10%,0.8x1.6x0.8mm”
2703-000143
2
L312
INDUCTOR-SMD
“470nH,10%,0.8x1.6x0.8mm”
2703-000213
2
L323
INDUCTOR-SMD
“470nH,10%,0.8x1.6x0.8mm”
2703-000213
2
R140
INDUCTOR-SMD
“220nH,10%,1.25x2x0.85mm”
2703-000266
2
L414
INDUCTOR-SMD
“220nH,5%,2.29x1.73x1.52mm”
2703-001079
2
L324
INDUCTOR-SMD
“560nH,10%,1.6x0.8x0.8mm”
2703-001221
2
L321
INDUCTOR-SMD
“100nH,5%,1.8x1.12x1.02mm”
2703-001513
2
L302
INDUCTOR-SMD
“10nH,5%,1.8x1.12x1.02mm”
2703-001547
2
L413
INDUCTOR-SMD
“120nH,5%,1.8x1.12x1.02mm”
2703-001673
2
L401
INDUCTOR-SMD
“27nH,5%,1x0.5x0.5mm”
2703-001726
2
L304
INDUCTOR-SMD
“15nH,5%,1x0.5x0.5mm”
2703-001730
2
L420
INDUCTOR-SMD
“22nH,5%,1.8x1.12x1.02mm”
2703-001731
2
L332
INDUCTOR-SMD
“56nH,5%,1.8x1.12x1.02mm”
2703-001732
2
L320
INDUCTOR-SMD
“120nH,2%,2.29x1.73x1.52mm”
2703-001744
2
L202
INDUCTOR-SMD
“4.7mH,20%,4.45x6.6x2.92mm”
2703-001775
2
L305
INDUCTOR-SMD
“82NH,5%,1005”
2703-001868
2
L435
INDUCTOR-SMD
“4.7nH,10%,1.0x0.5x0.5mm”
2703-001949
2
L434
INDUCTOR-SMD
“12nH,10%,1.0x0.5x0.5mm”
2703-001950
2
C524
INDUCTOR-SMD
“8.2nH,5%,1.0x0.5x0.5mm”
2703-001952
2
L311
INDUCTOR-SMD
“8.2nH,5%,1.0x0.5x0.5mm”
2703-001952
2
L313
INDUCTOR-SMD
“8.2nH,5%,1.0x0.5x0.5mm”
2703-001952
2
L516
INDUCTOR-SMD
“8.2nH,5%,1.0x0.5x0.5mm”
2703-001952
2
L522
INDUCTOR-SMD
“8.2nH,5%,1.0x0.5x0.5mm”
2703-001952
2
L431
INDUCTOR-SMD
“6.8nH,5%,1.0x0.5x0.5mm”
2703-001953
2
L432
INDUCTOR-SMD
“6.8nH,5%,1.0x0.5x0.5mm”
2703-001953
2
L433
INDUCTOR-SMD
“6.8nH,5%,1.0x0.5x0.5mm”
2703-001953
2
L511
INDUCTOR-SMD
“6.8nH,5%,1.0x0.5x0.5mm”
2703-001953
2
L501
INDUCTOR-SMD
“18nH,5%,1.0x0.5x0.5mm”
2703-001970
2
X102
CRYSTAL-SMD
“.032768MHZ,30PPM,28-ACM,9PF,50OHM,TP”
2801-003747
2
X101
RESONATOR-CERAMIC
“27MHZ,0.5%,TP,2.5X2X1.2”
2802-001104
2
OSC1
OSCILLATOR-VCO
“967MHZ,-,50,TP,3V,8.5MA”
2806-001200
2
U502
OSCILLATOR-VCTCXO
“19.68MHZ,2PPM,10KOHM//10PF,TP,3V,1.5MA”
2809-001230
2
F304
FILTER-SAW
“85.380MHz,13KHz,+-13KHz/1.5dB,”
2904-001074
2
F303
FILTER-SAW
“85.38MHz,0.6MHz,+-0.3MHz/0.8dB,TP,+-
2904-001128
2
F402
FILTER-SAW
“836.5MHz,25MHz,+-12.5MHz/1.6dB,TP,+-
2904-001135
2
F301
FILTER-SAW
“881.5MHz,25MHz,+-12.5MHz/1.6dB,TP,+-
2904-001136
2
F401
FILTER-SAW
“836.5MHz,25MHz,+-12.5MHz/2dB,TP,+-
2904-001138
2
F403
FILTER-SAW
“130.38MHz,1.26MHz,+-0.63MHz/1dB,TP,+-
2904-001174
2
F501
FILTER-DUPLEXER
“881.5MHZ,836.5MHZ,3.3/2.4DB,TP,824-
2909-001094
SAMSUNG Proprietary-Contents may change without notice
8-14
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
2
SPK
SPEAKER
“0.075W,32ohm,104dB,-”
3001-001138
2
L403
CORE-FERRITE BEAD
“AB,120OHM,1X0.5X0.5MM,150MA,TP,M
3301-001341
2
L405
CORE-FERRITE BEAD
“AB,120OHM,1X0.5X0.5MM,150MA,TP,M
3301-001341
2
L409
CORE-FERRITE BEAD
“AB,120OHM,1X0.5X0.5MM,150MA,TP,M
3301-001341
2
L440
CORE-FERRITE BEAD
“AB,120OHM,1X0.5X0.5MM,150MA,TP,M
3301-001341
2
L443
CORE-FERRITE BEAD
“AB,120OHM,1X0.5X0.5MM,150MA,TP,M
3301-001341
2
F502
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L203
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L210
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L301
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L310
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L331
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L341
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L422
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L509
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L510
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
L521
CORE-FERRITE BEAD
“AB,1.5KOHM,1X0.5X0.5MM,100MA,TP,M
3301-001342
2
CN501
CONNECTOR-COAXIAL
“SMC,JACK,100mohm,50ohm,0.5dB”
3705-001163
2
CN102
CONNECTOR-SOCKET
“24P,2R,0.5mm,SMD-S,AUF”
3710-001428
2
CN101
CONNECTOR-SOCKET
“18P,1R,0.5mm,SMD-A,AUF”
3710-001429
2
J201
JACK-AC POWER
“2P,2.6PI,AU,BLK,NO”
3722-001172
2
T1
RF POWER SPLITTER
“2WAY,955-979MHz,12dB,-,TP”
4709-001080
2
U207
DISPLAY LCD-SCH611
“SCH-611,UG-12T09-FGHTX-A,BLACK/LIGHT
GH07-00015A
2
PCB
PCB-SCH620 MAIN
“SCH-620,FR-4,6LAYER,0.8T,118X138mm”
GH41-00063A
1
ELA ETC-EARPHONE
“SCH-2000,SPRINT,USA,20mW,32ohm”
GH96-01124A
1
MEA ETC-ANT.LUG
“SCH-900,SEC,KORA,BLK,-,-,-”
GH97-00961A
2
NPR-ANT.CONTACT
“SCH-5100.KOR,C1720S-1/2H,T0.1,”
GH71-10728A
2
RMO-LCD BOHO RUBBER
“SPH-3400,CR,5X3XT1.4,BLK,60HB”
GH73-40727A
MEA FRONT-BLK
“SCH-620,TELEFONICA,BRAZ,BLK,-,-,-”
GH97-01557A
MEC-SUA. FRONT
“SCH-620,TELEFONICA,BLK”
GH75-00426A
3
PMO-EAR JACK HOLDER
“SCH-900,PUR,BLK,-,-”
GH72-00148A
3
PMO-LCD WINDOW
“SCH-900,ACRYL,TRP,-,-”
GH72-00180A
3
PMO-LED CAP
“SCH-900,ACRYL,M/WHT,-,-”
GH72-00182A
3
PMO-FRONT COVER
“SCH-620,PC,BLK,-,K2261”
GH72-00901A
3
MPR-WINDOW VINYL
“SCH-900,PE4187,34.6X24XT0.2,TRP,-”
GH74-00078A
3
MPR-LCD WINDOW FOAM TAPE“SCH-900,TESA,26.45X36XT0.4,BLK,-”
GH74-00109A
3
MPR-REED S/W SPONGE
“SCH-900,EVA SPONGE,12X3,BLK,-”
GH74-00123A
3
MPR-LCD BOHO SPONGE
“SCH-620,SRS PORON,36X27.95XT0.5,-,-”
GH74-00492A
3
MCT-WINDOW BOHO
“SH800,3M336,-,-,-”
GH74-40107A
3
MEC-HINGE
“SPH-8000,SEC,BLK”
GH75-00046A
NPR-HINGE SPRING
“SPH-8000,PW1,PI0.6,BLK”
GH71-00011A
1
2
4
SAMSUNG Proprietary-Contents may change without notice
8-15
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
4
PMO-HOUSING CAP
“SPH-8000,POM,BLK,-,-”
GH72-00059A
4
PMO-HINGE CAM
“SPH-8000,POM,BLK,-,-”
GH72-00060A
4
PMO-HINGE SHAFT
“SPH-8000,POM,BLK,-,-”
GH72-00061A
4
PMO-HINGE HOUSING
“SPH-8000,POM,BLK,-,-”
GH72-00064A
MEC-SUA. FLIP
“SCH-620,TELEFONICA,BLK”
GH75-00428A
4
LABEL(R)-FLIP(BLK)
“SCH-900,PC EMBO,30X4,T0.125,BLK”
GH68-00278A
4
LABEL(M)-LOGO BADGE
“SCH-500,NI,20.0X4.4,T0.3,BLK”
GH68-20008A
4
PMO-FLIP COVER
“SCH-620(TELEFONICA),PC,BLK,-,K2261”
GH72-00903A
3
1
MEA ETC-FRONT SHIELD
“SCH-620,-,BRAZ,TRP,-,-,-”
GH97-01559A
2
PMO-FRONT SHIELD CAN
“SCH-620,ABS,IVR,-,-”
GH72-00553A
2
RMO-LCD UNDER
“SCH-900,RUBBER,32X1.7X0.8,BLK,60”
GH73-00052A
2
RMO-SHIELD FRONT CUSHION “SCH-620,RUBBER,9.2X5.5XT0.5,BLK,50”
GH73-00322A
MEA ETC-REAR SHIELD
“SCH-620,-,BRAZ,TRP,-,-,-”
GH97-01560A
SCREW-TAPTITE
“CH,+,B,M1.7,L3.5,ZPC(BLK),SWRCH18A”
6003-001085
key pad
UNIT-SCH611 KEY PAD
“SCH-611,KBSCH611,KEY PAD,-,-,-,-”
GH59-00039A
3
BUZZER
BUZZER-MAGNETIC
“99dB,3.6V,80mA,2630Hz,BK”
3002-001064
3
S/W
SWITCH-REED
“200V,0.5A,500US,200US”
3409-001084
3
CON
CONNECTOR-HEADER
“NOWALL,24P,2R,0.5MM,SMD-S,AUF”
3711-004234
3
MOT
MOTOR-SCH990
“SCH-990,3.0V,-,10-55HZ,-,-”
GH31-00003A
3
MIC
ELA UNIT-SPH8000 MIC ASS’Y “SPH-8000,-,-,MIC ASS’Y,OB-22L44,-,-”
GH96-00772A
2
NPR-MOTOR BRACKET
“SCH-990,STS301,T0.3,-”
GH71-00068A
2
PMO-MOTOR SHEET
“SCH-900,PC SHEET,-,-,-”
GH72-00376A
2
PMO-KEY SHIELD CAN
“SCH-620,ABS,IVR,-,-”
GH72-00554A
2
PMO-REAR SHIELD CAN
“SCH-620,ABS,IVR,-,-”
GH72-00555A
2
RMO-MIC HOLDER
“SCH-900,RUBBER,7.2X6.8X4.5,BLK,50”
GH73-00046A
2
RMO-BUZZER HOLDER
“SCH-900,RUBBER,11.2X4.6X4.2,BLK,50”
GH73-00047A
2
RMO-MIC DUMMY
“SCH-900,RUBBER,6X2.5X0.5,BLK,50”
GH73-00048A
2
RMO-RUBBER CONNECTOR
“SCH-900,RUBBER,7X5.5XT1.0,BLK,60”
GH73-00051A
2
RMO-KEY SHIELD RUBBER
“SCH-900,RUBBER,12X2XT0.4,BLK,-”
GH73-00073A
2
RMO-MOTOR RUBBER
“SCH-990,RUBBER,PI12XT0.3,BLK,-”
GH73-00187A
2
RMO-DUPLEXER RUBBER
“SCH-620,RUBBER,19.4X7.5XT0.3,BLK,-”
GH73-00339A
2
MPR-SPONGE CONNECTOR
“SCH-900,SPONGE,12X10,BLK,60”
GH74-00094A
2
MPR-SHIELD RF SPONE
“SCH-620,SPONGE(SSP010),23.8X16.2X0.5
GH74-00272A
2
MPR-SHIELD MOTOR SPONGE “SCH-620,SPONGE(SSP-010),15X9XT0.5,-,-”
GH74-00421A
2
MPR-MIC SPONGE NEW
GH74-00422A
1
2
2
1
“SCH-620,SRS PORON TAPE,5X5XT0.7,-,-”
MEA REAR-GLOBAL TELECOM “SCH-620,GLOBAL TELECOM,BRAZ,BLK,-,-,-”
GH97-01576A
MEC-SUA. REAR
“SCH-620,GLOBAL TELECOM,BLK”
GH75-00451A
3
LABEL(R)-QUALCOMM
“SCH-100F,VINYL,12X6,0.12,TRP”
GH68-30846A
3
IPR-SPRING LOCKER MA
“SH-700,STS304,T0.3,-”
GH70-10516A
3
NPR-ANT BRACKET
“SCH-2500,ZN GOLD PLT,-,AU”
GH71-00013A
3
PMO-BATTERY LOCKER
“SCH-900,PC,BLK,-,-”
GH72-00147A
2
SAMSUNG Proprietary-Contents may change without notice
8-16
Electrical Parts List
Level Design LOC
ITEMS
DESCRIPTIONS
SEC CODE
3
PMO-REAR COVER
“SCH-620,PC,BLK,-,K2261”
GH72-00902A
3
MPR-REAR GASKET LEFT
“SCH-611,BUJICPO,17X4.7,BLK,-”
GH74-00360A
3
MPR-REAR GASKET RIGHT
“SCH-611,BUJICPO,18.4X7.3,BLK,-”
GH74-00361A
1
PAA MAIN-SCH620(BRAZ)
“SCH-620,GLOBAL-TELECOM,BRAZ,-,-,-,-”
GH99-02226A
2
LABEL(P)-SEAL
“SP-R912,CRP,65.0x95.0,-,ORG”
GG68-10705A
2
BOX(P)-CARTON MAIN
“-,SGH-A100,SW-3 A(KOL),330X278X210,-”
GH69-00381A
2
CUSHION-MAIN CASE
“SCH-620,HIPS(T0.8),195X130X58”
GH69-00414A
2
BOX(P)-UNIT MAIN
“-,SCH-620,IVORY,135X63X200,-”
GH69-00437A
2
BAG-STD BATT.
“PE,T0.06,70X170,SCH-1011”
GH69-30503A
8-2 Desk-top charger parts List
No.
Design LOC
DESCRIPTIONS
SEC CODE
1
2
3
4
5
6
7
8
9
10
11
12
13
C7, C8
C1
C2, C3
C21, C332
C23, C33
C36
C6, C41
Y-CAP
X-CAP
CAP-FELECTRONIC
CAP-FELECTRONIC
CAP-FELECTRONIC
CAP-FELECTRONIC
CAP-FELECTRONIC
2, 2nF, 20%, 250V
100nF, 20%, 250V
10uF, 400V, 85°C 10x16
680uF, 16V, 105°C 10x13
220uF, 16V, 85°C 6x11
47uF, 16V, 85°C 5x7
10uF, 50V, 105°C 5x11
2201-001004
2301-001092
2401-00
2401-003090
2401-000804
2401-00
2401-00
F1
LD1, LD2
BD1
D2, D3
D21, D31, D32
FUSE
LED
DIODE-BRIDGE
DIODE-FR
DIODE-SCHOTKY
250VAC, 2A 5x15 BLACKTUBING
RED/GRN-DUAL 3 (ROUND)
600V, 1A
1000V, 1A
40V, 1A
14
15
16
D30
D20
TH1
DIODE-FR
DIODE-SCHOTKY
THERMISTER
17
18
19
20
21
D1
U1
U26
U21
PC1
TRANSIENT VOLTAGE
SUPPESSOR
IC-pemto
IC-SWITCHING
IC-VOLTAGE
REGULATER
22
23
24
R21
R15, R16
R51
25
26
VR1, VR2
TNR1
27
28
29
30
31
J01-15
R26, R27, R45, R16
R35, R52
R33, R47
CHT009
3601-001125
0601-00
0402-000003
0402-000012
0402-000358
0402-000124
0402-000205
0402-000467
1404-000128
1404-001083
0403-001028
0505-00
1203-000391
1203-000542
0604-001098
0604-000191
2003-000327
2009-001039
1404-000215
1404-001014
2103-000210
1405-000001
1405-000193
3811-000545
200V, 1.5A/2A
60V, 5A
5Ω, 10Ø
PHOTO-OOUPLER
R-METAL OXIDE
R-SURGE
160V, 600W
TO-220, 700V, 1A
35V, 1.5A, DIP-8P
5V, 100mA, TO-92
120-180%, 200mW
DIP-4P, ST
51Ω, 2W, 5%
1/2W, 4.7MΩ, 5%
10KΩ, 25°C
R-NTC
R-SEMIFIX
1KΩ, 1/10W, 30% TOP, TP
470V, 2500A, 300V, 3000A
VARISTOR
WIRE-NO SHEATH
R-METAL FILM
R-CARBON FILM
0.6*52mm, SDACW
1Ω, 1/4W, 1%, TP
47KΩ, 1/8W, 5%, TP
4.7KΩ, 1/8W, 1%, TP
ML26-00274A
SAMSUNG Proprietary-Contents may change without notice
8-17
REMARKS
Electrical Parts List
No.
32
33
34
35
35
36
37
38
39
40
41
Design LOC
LF1
L22
L21
C25
C4, C23, C24
C44
C34
C5, C7
C28, C30, C33,
C42, C43, C45
C26
DESCRIPTIONS
R-METAL FILM
S/W TRANS
LINE-FILTER
COILCHOKE(TROIDAL)
COIL-CHOKE (DRUM)
CAP-CHIP
CAP-CHIP
CAP-CHIP
CAP-CHIP
CAP-CHIP
CHT09, 0.8mA, EE1916
UU1014-V, 22mH(MIN)
120uH, 10X5, 0, 40
7uH 5X7,5
2012, 104K, X7R, 50V
2012, 474Z, Y5V, 50V
2012, 474K, X7R, 50V
2012, 101J, NPO, 50V
2012, 103K, X7R, 50V
2012, 104Z, Y52, 50V
2012, 224K, X7R, 25V
42
43
U25
U22
44
U23, U24
45
Q23
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
Q21, Q22, Q24
D33
CAP-CHIP
u-com
IC-OP AMP
IC-COMPERATER
71
72
73
74
75
76
77
78
79
R24, R44
R25
R28, R31, R32, R48,
R63
R36, R53
R34, R51
R40, R49
R61
R23, R43, R60
R64, R65, R66, R7
R41
R37, R54
R38, R55, R69, R70
R1, R2
R29, R47
R30, R42, R68
R4
R22
R3
B1, B2
CN21
CON1
(BOTTBM)
(U1)
FET-DUAL
P-CHANNEL
TR-PNP
DIODE-ULTRA HIGH
SPEED
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
CHIP-BEAD
BAIT-CONNENTORFRONT, REAR
CONNECTOR-C/B
CASE ASS’Y-COVER
CASE ASS’Y-BOTTOM
LABEL, DTC81
SCREW-TAP
PCB-MAIN DTC81
u-com, 8bit, SOP-32P
28V, 150pA, DUAL
SOP-8P
36V, 1mA, DUAL
SOP-8P
12V, 5A, 0.05
SO-8P
SOT-23, 60V, 600mA
SOT-23, 80V, 100mW
2012, 620Ω, 1%
2012, 680Ω, 1%
2012, 10KΩ, 1%
2012, 470KΩ, 1%
2012, 150KΩ, 1%
2012, 12KΩ, 1%
2012, 27KΩ, 1%
2012, 91Ω, 1%
2012, 470Ω, 1%
2012, 4.7KΩ, 1%
2012, 2.4KΩ, 1%
2012, 47KΩ, 5%
2012, 10Ω, 5%
2012, 2.2KΩ, 5%
2012, 1KΩ, 5%
2012, 750Ω, 5%
2012, 180Ω, 5%
2012, 5.6Ω, 5%
3x4, CHIP-BEAD
4P, 3.0mm
30x9x10
3.9mm, 3(2)P
COVER (1)
GATE LABEL (1)
BATT HOUSING (1)
BATT LOCKER (1)
TH+M3x8, BLK (1)
BOTTOM (1), BOMPON (4)
30x50x0.15
PH+, 2.6x12, BLK
FR-1, loz, 125x64x1.2
15x13x5x1.0
SEC CODE
ML29-00023K
ML27-00
ML27-00252A
2203-000206
2203-000204
2203-000922
2203-000985
2203-000979
2203-002278
2203-001458
2203-000192
2203-001604
2203-000575
0903-001148
1201-000166
1201-000167
1202-000188
1202-000104
1202-000187
0505-001180
0501-000462
0407-000114
2007-000
2007-000
2007-000297
2007-000922
2007-000
2007-000352
2007-00
2007-001677
2007-00
2007-000868
2007-00508
2007-000
2007-000
2007-000493
2007-000
2007-000
2007-000
2007-000
3301-000329
ML74-001411
3711-000203
ML72-00
ML72-00
ML68-0
ML60-00001A
ML41-00
ML39-00
ML62-00133A
6001-000563
SAMSUNG Proprietary-Contents may change without notice
8-18
REMARKS
Electrical Parts List
No.
80
Design LOC
(U1)
DESCRIPTIONS
81
82
PWR-CORD
HEAT-SINK(U1)
SCREW-TAP)U1)
ADHESIVE-SEALANT
83
84
VINIL SACK
SOLDER-WIRE
85
ALCOHL
FLUX-SOLDER
SEC CODE
PH+, M3x6
DC739, 40RTV
0201-001029
0201-000303
170x350x0.05, WHITE
KR-19, S60A, D1.0
0202-000178
0202-000193
0204-000429
MF02-00020A
0202-000226
ML74-00113A
(CH3)2CHOM
920-CFX
REMARKS
D3, 0, Sn60%
SOLDER-WIRE
8-3 Hands-Free Kit Part List
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
Design LOC
UPPER C/D
LOWER C/D
FRAME
HOLDER SOCKET
LOCKER
EJECTOR
SPRING LOCK
SPRING EJECT
HOLDER C/D
COVER GATE
SCREW
SCREW
SCREW
CASE CONN UPPER
CASE CONN LOWER
BUTTON PUSH
CURL CORD ASS'Y
CONNECTOR
SPRING PLATE
CABLE DATA ASS'Y
SCREW
CASE UPPER
CASE LOWER
BRACKET INSTALL
RIVET
HEAT SINK
SCREW
SCREW
CASE UPPER
CASE LOWER
SPRING FIXING
SCREW
CABLE MIC
CUSHION MIC.
MIC CONDENSOR
CABLE POWER
LABEL
LABEL
LABEL
DESCRIPTIONS
SEC CODE
FOR CRADLE
FOR CRADLE
FOR CRADLE
FOR CRADLE
FOR CRADLE
FOR CRADLE
FOR CRADLE
FOR CRADLE
FOR CRADLE
FOR CRADLE
#2 BT 2.6x6B
BM 3x6B
#2 BT 2x8Y
FOR CONNECTOR
JACK
FOR CONNECTOR
JACK
FOR CONNECTOR
JACK
FOR CONNECTOR
JACK
FOR CONNECTOR
JACK
FOR CONNECTOR
JACK
HIROCE 15P
#2 FT2x6B
CONTROL BOX CASE
CONTROL BOX CASE
CONTROL BOX CASE
CONTROL BOX CASE
CONTROL BOX CASE
#2 PS 3x6 Y
#2 PS 3x12 B
MICROPHONE
MICROPHONE
MICROPHONE
#1 FT 2x8 B
1P+1SCHIELD
SAMSUNG Proprietary-Contents may change without notice
8-19
REMARKS
Electrical Parts List
No.
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
Design LOC
LABEL BAR CODE
LABEL BAR CODE
MANUAL
POLYBAG
POLYBAG
CABLE TIE
POWER LOG
SCREW
SCREW
BOX ACCESSORY
UNIT BOX
PACKING PAD
OUTER BOX
CASE FRONT
CASE REAR
HANDLE SPEAKER
BOLT
HEX. NUT
SPEAKER
SPEAKER WIRE
SCREW
LABEL
LABEL 3 SORTS
DESCRIPTIONS
Design LOC
1
2
3
4
5
6
7
8
9
10
11
12
13
ZD201, ZD202
ZD1
D5, D7, D101, D102
D1, D2, D3
D100
R278
R9
R8
R3, R13, R131
R51, R52, R139, R272
R279
R137, R138
R31, R32, R225, R251,
R257, R270
R132
R213, R217, R228, R229,
R230, R231
R271
R1, R7, R112
R18
R12
R38, R110, R113, R117,
16
17
18
19
20
REMARKS
WIRE+PLUG
MICROPHONE
CMP-68(NP)
4P, RED-BLK-YLWWHITE
FOR CRADLE
FOR CONTROL BOX
FOR SPEAKER
FOR SERIAL NO.
FOR PRODUCT
4-COLOR PRINT
15x27, PE
6x9, PE
80mm
ø6
#1 BT4x16B
PM 4x6B
FOR ACCESSORY
ASS'Y
FOR PACKING
FOR PACKING
FOR PACKING
FOR EXTERNAL
SPEAKER
FOR EXTERNAL
SPEAKER
FOR EXTERNAL
SPEAKER
FOR FIXING HANDLE
WITH WASHER
LEEWON 9050F
2P
#1 PT 3x12B
No.
14
15
SEC CODE
DESCRIPTIONS
ZENER DIODE
TVS DIODE
DIODE
DIODE
DIODE
RESISTOR
RESISTOR
RESISTOR
RESISTOR
RESISTOR
RESISTOR
RESISTOR
RESISTOR
5.1V 0.5W - DIP
P6KE33 - DIP
1N4148 - DIP
1N5818 - DIP
SDS7000 - CHIP
CH2012 1ohm-J 5%
CH2012 91oohm-F 1%
CH2012 8.2K-F 1%
CH2012 100ohm-J 5%
CH2012 220ohm-J 5%
CH2012 270ohm-J 5%
CH2012 330ohm-J 5%
CH2012 1K-J 5%
RESISTOR
RESISTOR
CH2012 1.8K-J 5%
CH2012 2.2K-J 5%
RESISTOR
RESISTOR
RESISTOR
RESISTOR
RESISTOR
CH2012 2.4K-J 5%
CH2012 2.7K-J 5%
CH2012 3K-J 5%
CH2012 3.9K-J 5%
CH2012 4.7K-J 5%
SEC CODE
SAMSUNG Proprietary-Contents may change without notice
8-20
REMARKS
Electrical Parts List
No.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
Design LOC
DESCRIPTIONS
R119, R268
R275
R57, R233, R248
R5, R10, R17, R20,
R23,R27 R30, R33, R41,
R44 R45, R46, R55, R56,
R100. R104, R108, R109,
R111, R115, R116, R120,
R122, R123, R124, R135,
R201, R202, R203, R204,
R205, R207, R208, R210,
R211, R212, R215, R252,
R253, R254, R255, R258,
R260, R266, R270, R274,
R276, R114
R269
R102
R43
R54, R267
R19, R128, R266
R24
R106, R107, R121, R127,
R277
R16, R126
R40, R222, R223, R224
R4, R21, R37, R101, R105
R136, R140, R259, R273
R133, R134
R227
R216, R226
R36, R42, R53, R103,
R125, R129
R141, R214, R261
R26
R39
R29
R14
R50
L6
VR1
C255, C256
C257
C15, C204, C205, C206,
C259
C104
C106
C258
C207
C1
C7, C18, C23, C29, C40,
C43, C45, C260
C4
C221
C32, C101, C105, C107
C108, C109, C110, C111,
C112, C111133,, C114,
C115, C1116, C117, C118,
C119, C201, C202, C215.
C216, C217
C17
C5, C25, C209, C218,
RESISTER
RESISTER
CH2012 5.1K-J 5%
CH 2012 10K-J 5%
RESISTER
RESISTER
RESISTER
RESISTER
RESISTER
RESISTER
RESISTER
RESISTER
RESISTER
RESISTER
CH 2012 560 ohm-J 5%
CH 3216 10K-J 5%
CH 3216 12K-J 5%
CH 3216 10K-J 5%
CH 2012 12K-J 5%
CH 2012 15K-J 5%
CH 2012 18K-J 5%
CH 2012 22K-J 5%
CH 2012 27K-J 5%
CH 2012 33K-J 5%
RESISTER
RESISTER
RESISTER
RESISTER
CH 2012 47K-J 5%
CH 2012 56K-J 5%
CH 2012 68K-J 5%
CH 2012 82K-J 5%
RESISTER
RESISTOR
RESISTOR
RESISTOR
RESISTOR
RESISTOR
VAR. RESISTOR
ELEC. CAPACITOR
ELEC. CAPACITOR
ELEC. CAPACITOR
ELEC. CAPACITOR
ELEC. CAPACITOR
ELEC. CAPACITOR
ELEC. CAPACITOR
ELEC. CAPACITOR
ELEC. CAPACITOR
CH 2012 100K-J 5%
CH 2012 220K-J 5%
CH 2012 1M-J 5%
CH 2012 5.6K-J 5%
0.1 ohm/1W-F-DIP
22 ohm/1W-J-DIP
0.2 ohm/1W-J-DIP
MVR32 5K
0.47UF/50V (5*11)85˚C
2.2UF/16V (5*11)85˚C
10UF/16V (5*11)85˚C
10UF/25V (5*11)85˚C
22UF/35V (5*11)85˚C
47UF/16V (5*11)85˚C
100UF/35V (6.3*11)85˚C
470UF/16V (8*11.5)85˚C
ELEC. CAPACITOR
TAN. CAPACITOR
CERAMIC CAPACITOR
470UF/35V (10*18)85˚C
4.7UF/16V (5*11)85˚C
CH 2012 B330P-J (330)
CERAMIC CAPACITOR
CERAMIC CAPACITOR
CH 2012 B470P-K (471)
CH2012 B102-K (102)
CERAMIC CAPACITOR
CERAMIC CAPACITOR
CH 2012 B152-K (152)
CH 2012 B103-K (103)
SEC CODE
SAMSUNG Proprietary-Contents may change without notice
8-21
REMARKS
Electrical Parts List
No.
Design LOC
60
61
C222, C223, C261
C250
C100
C219, C220
C2, C3, C6, C13, C14, C16,
C22, C24, C26, C30, C31,
C41, C42, C44,C46, C103,
C120, C121, C2224, C226,
C228, C237, C238, C239,
C241, C242, C243, C244,
C245, C246, C247, C248,
C249, C251, C252, C253,
C254, R209
C208, C213
C263
C262
L2
L4
L1
L3
J100
J201
J203 FOR SPEAKER
J1
CERAMIC CAPACITOR
CERAMIC CAPACITOR
CH 2012 B472-K (472)
CH 2012 B104-Z (104)
CERAMIC CAPACITOR
CERAMIC CAPACITOR
CERAMIC CAPACITOR
INDUCTOR (COIL)
INDUCTOR (COIL)
INDUCTOR (COIL)
INDUCTOR (COIL)
CONNECTOR-DATA
MIC JACK
CONNECTOR-SPEAKER
CONNECTOR-POWERR
CH 2012 B105-Z (105)
CH 3216 B104-Z (104)
CH 2012 B224-Z (224)
220UH (18ø )
220UH (13ø )
10UH
20UH
20P (RP13A-12RC-20PB)
TC38-001-01
LAD-1140-02 (2 PIN)
LAD-1140-04 (4 PIN)
TRANSISTOR
TRANSISTOR
B772-DIP
KST2222A - CHIP
Q20, Q21
Q1, Q2, Q6, Q11, Q12, Q13,
Q14, Q15, Q16, Q100, Q101,
Q102, Q103, Q104, Q105,
Q107, Q108, Q109, Q110,
Q208
Q3, Q8, Q106, Q202
Q4, Q5
BT201
BT100
U201, U207
U202
U204
U205
U206
U208
U100
U1
U4
U2
U3
U5
U101
S201
U209
P.C.B
TRANSISTOR
FET
X-TAL
RESONATOR
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
SWITCH
IC
KST2907A - CHIP
IRF9540 OR 2SJ176 - DIP
I2.288Mhz - DIP
3.58Mhz - DIP
LM358 - CHIP
AD1845 - CHIP
ADSP-2176 - CHIP
74111C14D - CHIP
93C66 - CHIP
HEF4051B - CHIP
PIC6C73 - CHIP
NJM2360 OR KA34063 CHIP
LM2576 - DIP
LM7805 - CHIP
LP2951CM
LM3403 - CHIP
LM2904 - CHIP
TACT SWITCH
TDA1905 - DIP
MAIN PCB SCH 811
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
DESCRIPTIONS
SEC CODE
SAMSUNG Proprietary-Contents may change without notice
8-22
REMARKS
Electrical Parts List
Design LOC
No.
1
2
3
DESCRIPTIONS
REMARKS
SEC CODE
REMARKS
SEC CODE
REMARKS
CMP-68
4 ohm 5W
4 PIN POWER CABLE ASS'Y
MIC ASS'Y
SPEAKER ASS'Y
POWER CABLE
Design LOC
No.
SEC CODE
DESCRIPTIONS
1
2
3
RESISTOR
RESISTOR
RESISTOR
CH 2012 330 ohm-J 5%
CH 2012 2.2K-J 5%
CH 2012 1K-J 5%
4
5
6
7
8
9
10
11
CONNECTOR WAFER
CONNECTOR WAFER
PHOTO INT.
THERMOSTOR
LED (LED TACK)
COILD CORD CABLE
DATA CABLE
P.C.B
13 PIN 2mm PITCH ANGLE
15 PIN 2mm PITCH ANGLE
SG215 - DIP
C103JF4C (10K 1%)
KARG138 (5 , 3 COLOR)
13 PIN 2mm PITCH ANGLE
15 PIN 2mm PITCH ANGLE
SUB PCB SCH-811
8-4 Travel charger
Design LOC
No.
DESCRIPTIONS
1
U2
IC OPTP
2
3
U1
U4
IC PWM P/S
IC V.REF TO -92
4
5
D1, 2, 3, 4
D21
DIODE REC
DIODE SCHOTKY
6
7
D7, 20
D5
DIODE SW
T.V.S DIODE
8
D6
DIODE UF
9
10
11
12
D24
LED
LED
MOV1
DIODE ZENER
LED CONNECTOR
13
14
15
16
17
18
19
20
21
VR1
L1, 2
PTF1
L20
R4, 5
C1, 2
C22
C21
C4, 20, 24
VARISTOR
M.O.V
SEMI-FIXEED RES
INDUCCTOR
SGH500 TRANS
CHOKE ASS'Y
SURGE RESISTOR
CAP EL
CAP EL
CAP EL
CAP EL
LTV817V
TLP621GRH
TOP222P
KA431AZ
TL431ACLP
KIA431
1N4007
SR560
SR560
RLS4148
P6KE160A
P6KE1600A
UF40007
UF4007
RLZJ4.3
352111-0310
ALL-153GW
D62Z0V300RA65
TNR12G471K
RG06P102
SCH500
PPSR0.5W
SHL400V10UF
KMF16V330UF
AG10V1000UF
1SK1C476M05007
SAMSUNG Proprietary-Contents may change without notice
8-23
Electrical Parts List
Design LOC
No.
DESCRIPTIONS
22
C8
CE. CAP
23
24
25
26
27
28
29
30
31
C3
C6
TH
F1
SK2
Q7
R2
R14, 15, 16
JP1, 2, 3
CE. CAP
MY. CAP
THERMISTOR
MICRO FUSE
CONN. HEADER
S.S. TR
CHIP RESI
CHIP RESI
CHIP RESI
32
R66, 67
CHIP RESI
33
34
JP4, 5
R57
CHIP RESI
CHIP RESI
35
R58
CHIP RESI
36
R17
CHIP RESI
37
R1
CHIP RESI
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
R59
C23
C5
C25, 26, 27, 28, 29, 30
U3
MICOM IC
P.C.B
AC PLUG ASS'Y
PLUG TERMINAL
CONTACT TERMINAL
CONTACT TERMINAL
CASE BOTTOM
CASE TOP
SCREW
SCREW
OUTPUT CABLE ASS'Y
LABEL
CARTON BOX
MAIN BOARD
CARD BOARD(A)
CARD BOARD(B)
PAD
VINYL SACK
CHIP RESI
CHIP CAPACITOR
CHIP CAPACITOR
CHIP CAPACITOR
IC HYBRID
SEC CODE
440DL472
SDE472M
ECSL3A220K06BS5
S/M2A152J
FTG-310H37
MST
5267-04A
KTA1273
MCR18EZHJ6R2
MCR18EZHF1R0
MCR18EZHJ0R0
CR180R0JM
MCR18EZHJ511
CR18511JM
MCR10EZHJORO
MCR10EZHF1501
CR10150FM
MCR10EZHF2201
CR102201FM
MCR10EZHJ470
CR10470JM
MCR18EZHJ103
CR18103JM
MCR10EZHJ102
CM21COG331J50AT
CM316Y5V224Z50AT
CM21Y5V104Z50AT
AH1504F
PIC16C711
TC30
AXR324100201
SAMSUNG Proprietary-Contents may change without notice
8-24
REMARKS
Electrical Parts List
8-5 CLA Parts List
No.
Design LOC
DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CERAMIC CAPACITOR
CERAMIC CAPACITOR
CERAMIC CAPACITOR
CHIP DIODE
CHIP DIODE
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
CHIP RESISTOR
20
21
22
C6, C9
C3
C5, C10
D7
D5, D6
R21
R111, R12, R22, R34
R31
R33
R15
R29
R35
R13
R14
R5
R16, R17
R27
R6, R24
R7, R18, R19, R20, R26,
R28, R30, R32
Q3, Q5, Q7, Q9, Q10, Q11
Q4, Q8
Q1, Q6
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
J1
L1
D2, D4
D1
U4
C7
C2, C4
C1
F1
U1
U2
U3
LED 1, 2
R4
R2
R1
R3
VR1
41
42
43
44
45
46
47
48
49
50
51
52
53
CURL CORD ASS'Y
CLA PCB
OUTER GND
WIREJUMPER
UPPER COVER
LOWER COVER
FUSE COVER
OUTER SPRING
POWER CONTACT
SPRING
FUSE HOLDER
FUSE PLATE
UPPER+LOWER
7 PIN CONNECTOR
CHOKE COIL
SCHOTTKY DIODE
TRANSIENT DIODE
DIODE
ELECT CAPACITOR
ELECT CAPACITOR
ELECT CAPACITOR
FUSE
ADJUST REGULATOR
I.C.
O.P AMP
O.P AMP(14P)
DUALL COLOR LED
LAMP
CARBON FILM
RESISTOR
CARBON FILM
RESISTOR
CARBON FILM
RESISTOR
CARBON FILM
RESISTOR
V. RESISTOR
CHIP TRANSISTOR
CHIP TRANSISTOR
CHIP TRANSISTOR
SEC CODE
MAIN SMD ASS'Y
CL21B04JBNCS/0.1U
CL21B103JBNCS/0.01U
CL21B224JBNCS/0.22U
KDS181
KDS184
RC1608J102CS/1K OHM
RC1608J104CS/100K OHM
RC1608J134CS/130K OHM
RC1608J182CS/1.8K OHM
RC1608J222CS/2.2K OHM
RC1608J272CS/2.7K OHM
RC1608J304CS/300K OHM
RC1608J333CS/33K OHM
RC1608J335CS/3.3M OHM
RC1608J392CS/3.9K OHM
RC1608J431CS/430 OHM
RC1608J432CS/4.3K OHM
RC1608J562CS/5.6K OHM
RC1608J912CS/9.1K OHM
KSR1104/NPN
KSR2104
KTA1504
INSERT ASS'Y
GILS-7P-S2T2-EF
RF-300/300UH
1N5819
P6KE36A
KA431
CESSL1C100MAAT/10U16V
105˚C
CESSL1C331MAAT/330U16V
105˚C
CESSX1V101MAAT/100U35
V 105˚C
250V/2A
LM2576T-ADJ
KA358D
KA324D
SAM3270
0.5 OHM 11/2W
11K OHM 1/4W
470 OHM 1/4W
680 OHM 1/4W
1K OHM/VOLUME/GF06P
ELECTRIC ASS’Y
7 PIN/MQ179
FR-4 (T=1.6)
1.68PIE/25MM
PC/BLACK
PC/BLACK
PC/BLACK
CLA OUTER SPRING
CLA POWER CONTACT
CLA
FUSE HOLDER/CLA
FUSE PLATE/CLA
SAMSUNG Proprietary-Contents may change without notice
8-25
REMARKS
Electrical Parts List
No.
54
55
56
57
Design LOC
HANISHELLL
OUT BOX
CURRUGATED PAD
CLA SPONGE
DESCRIPTIONS
SEC CODE
+PH (2.6x14-2S) BLACK
CLA010A
PACKING ASS’Y
TAPPING SCREW
NAME LABEL
CARTON BOX
CLA CORRUGATED PAD
SAMSUNG Proprietary-Contents may change without notice
8-26
REMARKS
9. Block Diagrams
9-1 Main Diagram
SAMSUNG Proprietary-Contents may change without notice
9-1
Block Dirgrams
9-2 CLC BLOCK DIRGRAM
SAMSUNG Proprietary-Contents may change without notice
9-2
MEMO
SAMSUNG Proprietary-Contents may change without notice
9-3
10. PCB Diagrams
10-1 Main PCB Top Diagram
SAMSUNG Proprietary-Contents may change without notice
10-1
PCB diagrams
10-2 Main PCB Bottom Diagram
Samsung Electronics
10-2
PCB diagrams
10-3 CLC PCB Top Diagram
10-4 CLC PCB Bottom Diagram
Samsung Electronics
10-3
PCB diagrams
10-5 Hands-free Kit PCB Top Diagram
Samsung Electronics
10-4
11. Circuit Diagrams
11-1 Logic & Audio & Power Circuit Diagram
2
1
4
3
6
5
7
9
8
11
10
12
+3.0V
+3.0V
+3.0V
6D
C102
4 7 0 PF
+3.0V
R140
220nH
R563
1 00K
E
3
V I BRA T OR
TX_ I QDAT A0
TX_ I QDAT A1
TX_ I QDAT A2
TX_ I QDAT A3
TX_ I QDAT A4
TX_ I QDAT A5
TX_ I QDAT A6
TX_ I QDAT A7
C_ RX _ I DA TA0
C_ RX _ I DA TA1
C_ RX _ I DA TA2
C_ RX _ I DA TA3
C_ RX _ QDA TA0
C_ RX _ QDA TA1
C_ RX _ QDA TA2
C_ RX _ QDA TA3
NC0
NC1
GPI O2 9
GPI O3 0
GPI O_ I NT 1
GPI O_ I NT 2
_ GP_ CS
_ CTS
_ RFR
PDM1
PDM2
DP_ T X_ DA TA
DP_ R X_ DA TA
YAMN 1
SL EE P_ XT AL _ I N
L CD_ E
SL EE P_ XT AL _ OUT
NC2
NC3
FM_ R X_ CL K
FM_ R X_ ST B
FM_ R X_ QD ATA
FM_ R X_ I D ATA
KEYS ENSE 3
GPI O_ I NT 3
MODE 0
MODE 1
TMOD E
I _ OF FSET
Q_ OF FSET
_ TX_ CL K
TX_ C L K
TCX0
2
+3.0V
1
C129
1 UF
1 0V
R145
1 00K
C126
1 0 NF
C125
1 0 0 NF
F
Z D1 0 2
R180
R181
R182
R183
R184
R185
R186
R187
R188
R189
3
3
3
3
3
3
3
3
3
3
DQ4
A4
DQ3
A3
DQ2
A2
DQ1
A1
DQ0
30
30
30
30
30
30
30
30
30
30
3A
6F
4A
_ L WR
1G
_ RD
4B
RY / _ BY
NC2
_BYT E
NC3
_ WE
NC4
_ CE
VS S 2
_ RE S ET
VS S 1
_ RD
_ L WR
_ HWR
_ RAM_ CS1
_ ROM_ CS1
_ ROM_ CS2
_ RAM_ CS2
C1 2 7
100NF
4D
1H
6H
R TS
V BAT
V BAT
C TS
D TR
V I BRA T OR
L ED_ ON
S CAN_ 6
S CAN_ 5
S CAN_ 4
K EY_ 2
K EY_ 1
K EY_ 0
ON_ SW
S CAN_ 3
S CAN_ 2
S CAN_ 1
S CAN_ 0
V BAT
T X_ AU DI O
R119
1 0K
H
B UZ +
B UZ -
( K E Y- CON)
C_F
+3.0V
D P_ RX _ DAT A
D P_ T X _ DAT A
H P_ PWR
RI
L EADS W
CD
V_F
C116
4 7 PF
R2 1 1
3. 3K
R2 0 2
R2 0 1
100NF 100NF
C2 1 5
1 0 UF
6. 3V
C2 1 4
100NF
R2 0 7
0
C565
1 UF
R253
1K
VCC2
VCC1
Z D2 0 3
+3.0AV
R2 2 5
22K
SRT
GND _ RE S ET
C2 7 4
3 3 UF
6. 3V
4
5
R2 4 8
1K
2
3
C2 2 0
4 7 PF Z D2 0 6
C2 1 9
4 7 PF
C253
1 0 0 NF
4
5
6
T X_ A UDI O
C2 2 5
100NF
D2 0 4
DA2 2 1 T L
D2 0 5
R2 1 7
20
RX_ A UDI O
R5 5 3
47K
1
C546
1 UF
2
+3.0V
I N
3
3
OUT
5
C2 5 2
1 0 UF
6. 3V
4
EN
10
1
GND
7
8
9
C2 4 6
100NF
+3.0V
+3.0V
2
1
2
11
2
3
41
40
39
38
37
35
36
NC1 3
C2 5 0
100NF
C2 7 6
1 0 UF
6. 3V
C2 5 5
1 0 NF
C2 5 1
100NF
F
C2 2 4
100NF
U2 0 4
NC1 2
29
VL R+
NC1 1
28
NC3
NC1 0
27
LO
26
VL R-
GNDP
NC4
MCL K
DR
NC5
13
14
C2 2 3
100NF
R2 1 5
24K
R2 1 8
2K
25
FS
24
NC9
23
PCM_ CL K
PCM_ SYNC
G
15
16
17
18
19
20
21
+3.0AV
22
VBAT
C2 8 2
NC
U2 0 8
R 55 4
4 7K
C2 6 5
220PF
ON_ SW_ SEN SE
I N
OUT
5
GND
4
C2 6 2
100PF
CO_ D OUT
CT L _ I N
_ CHI P_ SE L ECT
CT L _ CL K
R2 1 9
NC
21
( BUZ Z ER)
3 EN
1
BUZ 3
3
R2 2 7
1K
1
2
C 2 35
1 0 UF
6 . 3V
C2 6 3
1 0 NF
C2 6 1
100NF
C2 3 8
100NF
C2 2 1
6. 3V
1 0 UF
3
B M5 / T R
1
C2 2 7
100NF
+3.0V
BUZ +
+3.0AV
6
32
MI C2 - 3 0
NC2
2
3
R2 2 0
56K
C2 6 0
1 0 UF
6. 3V
H
En g i n e e r :
Dr a wn
Q2 0 2
COMPANY
R& D CHK :
DOC CT RL
7
SAMSUNG Proprietary-Contents may change without notice
11-1
8
9
b y :l j c Da t e
Ch a n g e d1
: 9
9 9 . 0 9 .Ti1me
6
10
Ch a n g e dQA
:
NAME
Ad d r e s s
Ci t y
by:
12 1 8 A
Si z e :
A2
TI T L E:
CHK :
MF G ENGR CHK :
5
C2 2 2
100NF
MI C1 - 3 3
MI C2 + 3 1
VF R+
C132
3 . 3 NF
4
34
VF R-
C2 2 6
4 7 PF
CO_ D I N
Ch a n g e d
1
42
H P_ PWR
C277
1 0 NF
2
43
NC1
Q2 0 1
Q2 0 8
1 0 UF
_ RES ET
C 21 8
3 3NF
2
1
C2 1 6
6. 3V
44
+3.0V
R251
1 00K
100PF
100NF
U2 0 6
C281
1 0 0 NF
R252
2 2K
C2 7 0
C2 1 2
C2 1 3
3 3 UF
6. 3V
1
3
V_I N
R249
1 00K
E
L203
C2 1 1
1 UF
Q2 0 7
1
J ACK _ S
7
+3.0AV
L210
C2 1 0
NC
Z D2 0 2
U2 0 1 - 2
5
R2 1 0
68K
C2 0 7
100NF
R2 1 2
1. 5K
+3.0V
3
2
SEND _ END
6
MI C
SPK
NC
1
2
+3.0AV
C2 1 7
100NF
R1 4 2
22K
R562 C280
1 0 0 NF
NC
R250
1 00K
1 0 0 PF
C130
C173
1 0 0 NF
C131 C133
1 0 0 NF 1 0 NF
R247
1 00K
C_F
V_F
V BAT
R124
1 . 2K
8
R2 0 8
100K
C2 0 6
NC
V_I N
R255
1K
D
U2 0 1 - 1
R2 0 5
200K
C2 0 4 C2 0 3
4 7 PF 4 7 PF
3
R245
1 00K
6E
1D
VSS1
VSS2
_ OE
4
D2 0 6
R X_ AU DI O
V BAT
MI C
R246
NC
C249
1 NF
_ WE
2G
C
12
CN1 0 1 - 1
CS2
3B
4C
5
4
2
V_I N
ON_ SW
CN1 0 2 - 2 4
3A
100K
_ L WR
_ RES ET
3D
P S_ HOL D
Z D1 0 4
R1 7 0
+3.0V
1H
6H
VSS2
VSS1
_ CS
R1 7 5
10K
3B
1
3
ADC_ DAT A _ SBD T
ADC_ CL K_ SBCK
ADC_ ENA_ SBST
CHI P X8
EL _ E N
R144
1 00
R270
NC
3C
NC
3G
_ RAM_ CS1
J2 0 1
+3.0V
C242
1 0 0 NF
R239
6 . 8K
2E
3B
3D
4C
NC1
NC2
NC3
RY/ _ BY
_ BYT E
_ WE
_ OE
_ CE
_ RES ET
3
U2 1 0
+3.0V
_ L WR
_ RD
_ ROM_ CS1
R2 0 3
0
C2 3 6
NC
G
2H
3A
6F
4A
1G
1F
4B
B
R2 0 9
120K
2
C141
1 UF
R1 7 1
10K
3E
6B
6C
6F
6G
1B
1C
1F
1G
+3.0AV
C254
1 0 NF
R235
1 00K
3H
I / O1
I / O2
I / O3
I / O4
I / O5
I / O6
I / O7
I / O8
_ OE
1F
_ ROM_ CS2
VBAT
D TR
C TS
R TS
CD
+3.0V
4H
NC1
R1 3 9
10K
1
C241
2 2 0 UF
6 . 3V
4E
A0
C124
R147 1 00K
R 1 5 01 0 0 K
R 1 4 81 0 0 K
R151 1 00K
R 1 4 91 0 0 K
R 1 5 21 0 0 K
R 1 4 61 0 0 K
Q2 0 3
5H
4 7 PF
L CD_ C S
_ I DL E
_ SL EE P
V _ F _ C ON
Z D1 0 1
DQ5
A5
RT S
K EY_ 2
K EY_ 1
K EY_ 0
S CAN_ 0
Z D1 0 3
A6
5E
_ RD
C1 2 8
100PF
R I NGE R_ EN _
K EY_ 0
K EY_ 1
K EY_ 2
S CAN_ 0
S CAN_ 1
S CAN_ 2
S CAN_ 3
S CAN_ 4
S CAN_ 5
S CAN_ 6
DQ6
+3.0V
RI
D P_ RX _ DAT A
D P_ T X _ DAT A
A7
2F
NC1 4
R137
1K
DQ7
MI C1 +
S DA 5
A8
2G
AD( 0 : 7 )
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A1 0
A1 1
A1 2
A1 3
A1 4
A1 5
A1 6
A1 7
A1 8
NC8
4 V SS
R136
1 5K
DQ8
GNDA
S CL 6
1E
A9
3F
GND
_ WC 7
3 N C3
1D
DQ9
MI C3 -
2 N C2
A( 0 : 1 9 )
A1 0
3G
1A
2A
2B
4A
4B
4C
5A
5B
6A
1H
2H
3H
4H
5H
6H
5G
4G
4F
3F
DX
V CC 8
3L
4L
1K
2K
3K
4K
1J
2J
3J
4J
1H
2H
3H
4H
3G
1G
4G
3F
4F
2G
1F
4E
3E
2F
4D
1E
3D
2E
4C
0E
3C
2D
4B
3B
2C
1D
1M
2N
3N
2L
4M
4N
1L
2M
B
C
C
H
L
DQ1 0
1E
6 D VCC1
VCC2
AD( 0 : 1 5 )
6G
5F
5G
4F
3G
3F
2G
2F
5E
5H
4E
4H
3H
3E
2H
2E
DQ1 5 / A- 1
DQ1 4
DQ1 3
DQ1 2
DQ1 1
DQ1 0
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
U1 1 0
C1 7 1
100NF
A( 0 : 1 8 )
CO
1 N C1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
7
1C
DQ1 1
A1 1
4F
4G
VCC
NC1 5
+3.0V
U1 0 5
1B
A1 2
5G
A1 9
A1 8
A1 7
A1 6
A1 5
A1 4
A1 3
A1 2
A1 1
A1 0
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
MI C3 +
D
2D
AD( 0 : 1 5 )
A( 0 : 1 9 )
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
_ RD
_ L WR
_ HWR
_ RAM_ CS1
_ ROM_ CS1
_ ROM_ CS2
_ RAM_ CS2
P A_ ON 2
A DC_ D AT A_ SBDT
A DC_ C L K_ S BCK
A DC_ E NA_ S BST
C HI PX 8
GPI O2 2
U1 0 4
2C
DQ1 2
4D
3C
2B
6E
6D
6C
6A
6B
5D
5C
5A
5B
2A
2C
2D
1B
1A
1C
1D
1E
VCC
C TL _ C L K
A( 20)
R I NGE R
S YNT H _ L OC K
P A_ ON
P A_ R0
P A_ R1
T RK_ L O_ AD J
T X_ AGC_ AD J
R X_ AGC_ AD J
L NA_ R ANGE
GPI O2 5
GPI O2 3
GPI O2 6
GPI O2 7
P CM_ C L K
P CM_ S YNC
P CM_ D I N
P CM_ D OUT
WDOGS T B_ P CMSC S
A UX_ P CM_ C L K
A UX_ P CM_ S YNC
A UX_ P CM_ D I N
A UX_ P CM_ D OUT
GPI O2 4
GPI O_ I NT 4
R I NGE R
X T AL _ I N
X T AL _ OUT
WDOG_ EN
L NA_ GAI N
T MS
T CK
T DO
T DI
_ T EST
GPI O1 4
GPI O1 5
GPI O1 6
GPI O8
GPI O9
GPI O1 0
GPI O1 3
GPI O1 9
GPI O2 0
GPI O2 1
GPI O1 2
_ RESI N
R ESOU T
K EYSE NSE4
GPI O7
GPI O_ I NT 0
2A
DQ1 3
A1 3
U1 1 2
A( 1 : 2 0 )
NC1 6
C121
1 0 NF
4K
4L
3L
1N
R1302 0K
3N
1K
R 1 6 01 K
R1314 . 7K
3K
1M
2N
7P
C TL _ I N
7M
_ CHI P _ SEL ECT
8N
A
L
ERT
_
L
ED
C122
C140
C119
8L
MODE
1 0 NF
2 2 0 PF
8 . 2 NF
1 1B
P CM_ C L K
1 1C
P CM_ S YNC
1 2A
C O_ DOUT
1 3A
C O_ DI N
1 2B
1 0B
1 0C
1 0D
1 1A
7N
1 0N
4N
1 0M
R133
1 2P
1M
1 0L
R135
1 3M
R134
1
6 80
2
5B
T
P_
T
MS
NC
4
6
7C
T P_ T C K
7A
T P_ T D O
R174
X1 0 1 5
8A
T P_ T D I
0
8C
T P_ T E ST 9 B
9C
S CL
9D
S DA
6B
P L L _ D AT A
7D
P LL_CLK
7B
PLL_EN
9A
6M
S EL _ P A_ ON
6N
_ WP
6P
C ON_ S L EEP
8D
9M
_ RESE T
1 1P
Q5 0 4
3A
ON_ SW_ SEN SE
6A
R143
J ACK_ S
9P
6 . 8K
P S_ HOL D
5B
1A
AD( 0 : 1 5 )
SCAN _ 0
SCAN _ 1
SCAN _ 2
SCAN _ 3
SCAN _ 4
SCAN _ 5
SCAN _ 6
C120
4 7 0 PF
R173
1 00K
5F
5J
6E
6K
9E
9K
10F
10J
2A
4C
3B
5C
4B
5D
4A
6C
5A
6D
5P
6L
5G
5H
6F
6G
6H
6J
7E
7F
7G
7H
7J
7K
8E
8F
8G
8H
8J
8K
9F
9G
9H
9J
10G
10H
8B
1D
2M
10A
8P
C
5A
T P_ MODE
VDD0
VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
KEYS ENSE 0
KEYS ENSE 1
KEYS ENSE 2
GPI O0
GPI O1
GPI O2
GPI O3
GPI O4
GPI O5
GPI O6
GPI O1 7
GPI O1 8
GND0
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND1 0
GND1 1
GND1 2
GND1 3
GND1 4
GND1 5
GND1 6
GND1 7
GND1 8
GND1 9
GND2 0
GND2 1
GND2 2
GND2 3
GPI O1 1
_ SL E EP
_ I DL E
L CD_ CS
GPI O2 8
R129
T RK_ L O_ AD J
T X_ AGC_ AD J
R X_ AGC_ AD J
C1 1 0
1 NF
KEYS ENSE _ 3
F M_ C L K
F M_ S T B
C_ RX _ I D( 0 )
C_ RX _ I D( 1 )
A( 2 1 )
T X_ C L K
_ T X_ CL K
T CXO_ N
1L
3J
2K
1K
4J
3H
1J
2J
1G
2G
3G
4G
1F
2F
3F
4F
1A
1P
9N
5K
8M
9L
3M
5M
5N
2P
3P
4P
5L
4M
10K
13P
11N
14A
14P
2E
1E
3E
4E
5E
10P
2B
3C
4D
3D
2D
4H
1H
2L
R127
1 0K
R128
1K
5C
C 11 1
1 0 NF
C115
1 NF
R176
3 30
+3.0V
L OCK
P A_ ON
P A_ R0
C117
1 0 NF
5D
A1 4
5F
BZ
S END_ END
L EADS W
C _ RX_ QD( 0 : 3 )
C _ RX_ I D( 0 : 3 )
T X_ I Q_ D( 0 : 7 )
6B
Q_ OF F SET
C161
2 7 PF
Q1 0 1
6A
I _ OF F SET
R123
1 0K
R121
1K
X1 0 2
A L E RT _ L ED
2
B
R1 1 0
10K
C160
2 7 PF
AD( 0 : 1 5 )
6G
VCCA
C108
1 0 0 PF
C104
4 7 0 PF
DQ1 4
CI
1
C107
1 0 0 PF
DQ1 5 / A - 1
A1 5
VCCP
3
C114
4 7 PF
6C
R112
1K
L E D1 0 1
A1 6
CS-
C101
1 0 NF
C1 7 0
1 NF
NC1 7
1 00
C106
1 0 0 PF
A1 7
CCL K
C105
1 0 0 PF
A
A1 8
2B
6E
1 00
R109
RI
+3.0V
4G
VCC
3C
DP_ R X_ DA T A
4 70
R107
CD
R116
1 50
A( 1 : 1 9 )
I MD_ CT L
R113
1 00
R106
C TS
NC1 8
D TR
DP_ T X_ DA T A
R101
4 . 7K
NC7
+3.0V
A
R102
2 2K
U1 1 1
NC6
R103
1 00
+3.0V
R105
1 00
R104
4 7K
SCH- 6 2 0 EX P
L OGIC/ AUDI O/ POWE R
RE V : Dr a wi n g
8. 0
CHK :
11
Pa g e : 1
Nu mb e r :
12
Circuit diagrams
11-2 TX & RX & LOCAL Circuit Diagram
3
2
1
5
4
6
8
7
9
10
12
11
+3.0V
C3 8 4
1 0 NF
R5 5 8
F3 0 3
C3 5 1 C3 5 2
100P F 100NF
R306
1K
C324
1 0 0 PF
R300
NC
C306
1 8 PF
C312
1 NF
B
Q3 0 2
L 304
1 5nH
C307
1 NF
L 307
5 PF
L 350
0
I N
C308
1 0 0 PF
2
L 313
8 . 2nH
5 GND
L 308
NC
+3.0RL
L 305
8 2nH
L 303
NC
R305
3 . 3M
R314
2 20
R304
82
1
CN5 0 1
3
1
L 516
8 . 2nH
C522
1 0 0 PF
3
T X_ 1 S T _ L O
C525
1 0 0 PF
4
3
6
L 511
6 . 8nH
R571
10
C556
1 0 0 PF
C503
1 0 0 PF
3
I F_ I N
EN
DATA
D OI F
15
12
V BAT
4
C501
1 0 PF
3 G
8
R402
4 7K
C490
1 0 0 NF
C505
3 3 NF
C507
4 . 7 NF
C403
1 0 NF
C404
21
22
25
3
5
8
13
16
18
19
23
34
43
R3 2 1
0
C3 6 0
1 NF
C408
1 0 0 PF
R3 2 3
10K
C3 8 0
1 0 NF
G1
C3 7 9
1 0 UF
6. 3V
C
RX_ I F _ DO
C3 6 2
1 1 PF
C3 7 8
1 0 NF
C3 7 7
1 0 UF
6. 3V
+3.0V
+3.0B
D4 0 1
1
R4 5 0
2. 7K
C506
1 0 NF
2
2
1
V_ F _ CON
R5 5 0
47K
2
C4 6 2
100NF
46
C373
1 0 UF
6 . 3V
C4 5 0
8 2 PF
R4 3 6
3 . 9 K R4 3 7
( 1 %)
390
( 1 %)
OUT
I N
GND
4
EN
1
C4 8 8
C4 5 7
100NF
1 NF
V_ I N
R4 4 0
10K
( 1 %)
T X_ I F _
T X_ I F
C4 5 5
8 2 PF
D4 0 3
R 33 0
4 7K
C3 7 2
C3 7 1
1 0 0 N F 1 0 UF
6. 3V
C375
1 0 NF
+3.0B
41
C 37 6
4 . 7NF
F M_ MOD
C4 5 6
100NF
L422
+3.0T
+3.0T
L 440
L 409
OUT
21
9
47
45
40
23
6
0
C414
1 0 NF
C424
1 0 0 NF
L434
12nH
U4 0 4
T XEN V CC
11 12 13
14
15
16
3
17
2
L OI N
FM/ C DMA
NC
4
18
EN
1
V_ I N
2
C5 4 2
100NF
C4 7 1 C4 7 2
100NF 100P F
C4 8 1
1 0 UF
6. 3V
1
I F I N+
10 7
G6 G5
C430
7 PF
C431
7 PF
V CC3
I F I N19 20
L 413
1 20nH
( c oi l )
6
G4
5
G3
2
G2
1
G1
9
3
OUT C444
NC
I N+
8
4
OUT +
I N-
C443
1 NF
R2 2 3
0
C2 2 8
6. 8NF
C2 3 1
6. 8NF
R4 3 1
1. 5K
T X_ I F
C2 3 2
6. 8NF
C485
1 0 0 PF
H
L 443
C475
2 . 2 PF
4. 7n H
L435
L 405
8
C479
1 0 0 PF
C477
1 0 0 PF
C478
1 0 NF
OUT
I N
5
10
R405
1 0K
( 1 %)
C487
1 0 0 PF
R408
3 . 3 K ( 1 %)
T X_ AGC1
C2 3 7
R2 2 8
620K
C412
1 0 NF
C486
1 0 NF
9
R404
2 7 K ( 1 %)
L 433
6 . 8nH
C476
1 . 5 PF
R2 2 1
47K
1
11
12
R4 0 7
2 0 K ( 1 %)
C2 3 9
+3.0V
2
13
14
C2 4 0
8. 2NF
15
2
R560
0
RS
V1
E_ RD
28
27
C4 5 8
1 UF
10V
F
VR
2
1
1
C2 C2 +
C1 -
2
3
4
VDD1
C3 +
VSS
Q2 0 4
R2 4 2
36
R2 4 0
3. 3K
R2 4 4
36
R2 4 3
36
_ RES ET
_ L WR
+3.0V
R2 2 4
10K
A( 1 )
Q2 0 6
26
1
3
2
2
25
24
23
22
21
20
19
18
1
3
4
L+
5
6
7
Samsung Electronics
11-2
8
L-
BASE
CHF
VOUT
GND
V+
E
8
R5 5 6
0
7
EL 1
6
EL 2
5
EL _ E N
U2 0 9
C2 4 7
100NF
+3.0V
C2 4 8
6. 8NF
17
VOUT
VDD
H
16
31
31
32
32
EL 1
EL 2
En g i n e e r :
COMP ANY NAME
Dr a wn b y :
Ad d r e s s
Ci t y
9
by : l
j Da
ct
e Ch a n g e d :1 9
me6 Ch a n g e d :QA
9 9 . 0 9 Ti
. 1
10
Si z e :
TI T L E:
R& D CHK :
DOC CT RL CHK :
MF G ENGR CHK :
4
G
L202
4 . 7 mH
C2 3 0
100NF
C1 +
C3 -
EL _ E N
Q2 0 5
1
L CD_ CS
AD( 0 : 1 5 )
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
R2 3 4
22K
3
3
V0
Ch a n g e d
3
R4 4 1
1. 8K
_ T X_ CL K
T X_ C L K
T X_ I Q_ D( 0 : 7 )
11
12
13
14
15
16
17
18
R2 2 2
NC
T X_ AGC2
R424
1 00
PD_ OUT
T CXO
C4 6 7
1 0 NF
L ED_ ON
RESE T B 2 9
RW_ WR
1 UF
3
R561
NC
E
L OCK
C4 5 4
NC
R4 6 0
10
1 UF
T X_ A GC_ A DJ
C4 1 3
4
24
36
37
38
35
CS2 3 0
V2
1 UF
U4 0 3
5
G G G G
6 4 3 1
5
V3
1 UF
+3.0T
F4 0 2
V4
3
7
+3.0T
R403
100 ( 1 %)
I NT R S
2
6
R2 2 6
3. 3M
C2 3 3
1 UF
C442
1 NF
1
4
C5 5 1
6. 8NF
C489
1 . 5 PF
T X_ I F _
C432
1 NF
R4 5 9
62K
25
+3.0V
2
C2 2 9
6. 8NF
L 414
2 20nH
( c oi l )
26
U2 0 2
L412
180n H
R 4 30
1 . 5K
C4 6 6
1 0 NF
+3.0V
C440 L411
1 0 0 NF 1 8 0 n H
C441
1 0 0 PF
V_ F
R4 5 8
15K
( 1 %)
C4 7 0
100NF
5
F4 0 3
C4 6 4
1 0 NF
R2 3 2
1K
C2 3 4
_ I DL E
C4 6 9
100PF
C4 6 3
1 0 NF
R4 6 1
100K
C4 8 2
1 0 NF
C484
4 . 7 NF
+3.0T
+3.0T
C4 7 3 C4 7 4
100NF 100P F
C5 4 1
100PF
_ I DL E
C434
1 NF
T XD0
T XD1
T XD2
T XD3
T XD4
T XD5
T XD6
T XD7
VDDM2
VDDM1
VDD5
VDD4
VDD3
VDD2
VDD1
R462
4 7K
3
C427
1 0 0 PF
ENAB L E
5
6
RFOU T+
GND4
( T HER MAL )
1 0k
7
RFOU T-
R426
1 5K
( 1 %)
8
I N
C4 6 8
1 0 UF
6. 3V
U2 0 7
C429
1 0 0 PF
GND3
R427
2 0K
( 1 %) 2 1
R411
T X_ AGC2
9
VCC1
R438
2 K ( 1 %)
EXC- OUT
10
C483
1 0 0 PF
MODE
T X_ 1 S T _ L O
P A_ ON
C428
1 0 0 PF
GND1
C544
0 . 5 PF
GNDE XC
I N
VCC2
2
L 431
6 . 8nH
L 432
6 . 8nH
EXC- I N
C426
4 . 7 PF
RFVC NTRL
F4 0 1
C420
1 0 NF
C423
1 0 NF
C422
1 0 0 PF
GND2
C425 C421
1 0 NF 1 0 0 PF
2
U4 0 6
R5 5 7
R4 5 7
1. 2K
10
48
44
39
22
7
5
3
T X_ C L K/ 2 0
T X_ C L K 1 9
RBI A S
8
C5 5 0
1 0 UF
GND
4
ADC_ DAT A
F M_ MOD
+3.0V1
+3.0V
_ SL E EP
U4 0 7
C480
1 0 UF
6 . 3V
GNDD
GND7
GND6
GND5
GND4
GND3
GND2
GND1
ADC_ ENAB L E
L OCK _ DET
PD_ I SET
1
PD_ OUT
T XI F _ OUT /
2
T CXO
T XI F _ OUT
2
3
D
R4 5 6
13K
( 1 %)
29
ADC_ CL K
42
T XVC O_ T 2
43
T XVC O_ T 1
4
VCON T ROL
C4 5 1
1 NF
L420
22nH
C4 5 2 ( c o i l )
1 2 PF
C4 5 3
2. 2NF
DNC
28
31
SBI _ EN
32
SBDT _ F M/
33
SBSK _ I DL E/
34
SBCK _ SEL 2
D4 0 2
R4 3 5
18K
( 1 %)
27
30
+3.0T
C419
1 0 0 PF
6 4 3 1
R3 0 9
10K
C374
1 0 0 NF
+3.0T
G G G G
1
VP1
C370
1 0 0 PF
C511
1 0 0 PF
5
OUT
R4 5 5
100K
100
U3 0 5
5
Q4 0 4
3
V_ I N
SEL _ PA_ ON
ADC_ DAT A _ SBD T
ADC_ ENA_ SBST
ADC_ CL K_ SBCK
C516
1 0 NF
+3.0R
C4 6 1
1 0 NF
R4 5 2
6. 2K
R4 5 3
10K
PD_ OUT
L 403
5
C4 6 0
1 0 NF
5. 6K
R5 5 1
T CXO
C510
1 0 0 PF
C512
1 0 0 PF
+3.0V1
( 1 %)
11
C3 8 3
100NF
R4 5 1
GAT E
T X_ A GC1
C515
1 0 0 PF
C3 6 3
4. 7NF
( 1 %)
D3 0 3
C3 6 4
100PF
C3 8 2
4. 7NF
R4 5 4
8. 2K
L 509
C410
1 NF
1 0 UF
6 . 3V
C405
4 7 PF
C492
1 UF
1 0V
V CC
RXI F _ I N
R3 2 2
10K
( 1 %)
C3 6 1
100PF
R3 3 1
47K
EN 3
Q5 0 1
_ I DL E
Q4 0 2
VC
OUT
F
1
DNC
C3 5 9
1 NF
V_ I N
2
GND
C509
1 0 0 PF
1
C407
1 0 0 NF
T RK_ L O_ A DJ
C513
1 0 NF
GND
R502
10
C564
1 0 NF
C508
4 . 7 UF
6 . 3V
2
C545
NC
1
I N
L430
R501
9 10
Q4 0 1
1
2
C555
1 0 0 PF
GND1 1
GND2 4
GND3 7
9
GND4
GND5 1 0
GND6 1 3
GND7 1 6
GND8 1 9
GND9 2 1
R503
2 . 2K
P LL_CLK
PLL_EN
P L L _ D AT A
3
G
SBCK _ SL E EP/
SBST _ I DL E/
SBDT _ F M/
SBI _ EN
F M_ S L OT
L332
56nH
( c oi l )
ADC_ I N3
18
_ I F_ I N
14
GND4
C514
2 2 0 PF
8
R XI F _ I N
R X_ I F _ DO
6
5
2
1
C402
1 0 UF
6 . 3V
VP
D O_ RF
17
C560
2 2 0 NF
2 0V
2 3 4 6 8
22
6
_ RX_ I N
3
9
GND3
GND2
GND1
RFOU T
7
4
C409
1 0 0 PF
OUT
3
G1
G2
G3
G4
G5
R568 C563 C558
5 . 1 K 5 6 PF 1 0 0 PF
20
C491
1 0 0 NF
C406
1 0 UF
6 . 3V
33
C3 5 8
100NF
U3 0 6
4
4
R569
10
C561
1 0 0 NF
5
VT
2
T CXO_ I N
R X_ I N
FOL D
7
V CC
OUT
OSC1
R F I N V REF V CC2 V CC1
3
L324
560n H
C3 8 1
1 0 NF
U5 0 2
U5 0 4
3
5
R572
10
24
VCC
C559
1 0 0 PF
R567
16
C530
1 0 0 NF
U4 0 1
2
B
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND1 0
MODE
Q5 0 2
C562
1 PF
R566
16
23
C502
1 0 UF
6 . 3V
1
5
G1
1
G2
2
C504
1 0 0 NF
CL K
TXOU TPUT
C540
NC
1
G3
3
F M_ C L K
F M_ S T B
D3 0 2
R5 5 2
22K
2
VCC1
F5 0 2
C310
1 0 UF
C543
2 7 PF
6
G4
5
+3.0B
4
5
6
7
8
9
10
11
12
13
14
G1
G2
G3
G4
G5
G6
G7
G8
G9
G1 0
G1 1
3
RX
E
G5
6
1
2
3
C557
1 0 0 PF
TX
L 401
2 7 NH
G6
7
C3 3 4
100NF
4
C523
0 . 5 PF
2
C401
NC
32
30
31
26
29
ADC_ CL K_ SBCK
ADC_ ENA_ SBST
ADC_ DAT A _ SBD T
R3 2 0
100K
C_ RX _ I D( 0 : 3 )
45
46
47
C3 4 9
1 NF
1
Q3 0 4
C3 3 3
100NF
+3.0R
R565
1 00
R F_ I N 2
GND2
C3 4 7
1 NF
R3 4 1
150K
L 510
U5 0 3
A NT
D
G7
8
2
T1
S T H- 0 1 R
1
G8
10
C3 4 8
9 PF
+3.0R
Q5 0 5
1
+3.0R
F5 0 1
C3 4 6
NC
4
OUT
5
R F _ OU T GND1
7 VCON T ROL
_ SL E EP
R313
10
C385
NC
C526
8 PF
L 503
NC
I N
39
40
41
42
2
C524
8 . 2nH
C521
1 0 0 NF
2
9
CHI P X8
C_ RX _ QD( 0 : 3 )
48
RM_ R X_ CL K
F M_ R X_ ST B
F3 0 4
L323
470n H
38
U3 0 4
10
F M_ I F
9
F M_ I F /
ADC_ I N1
OUT
R564
6 8K
R505
10
L341
RX_ A GC_ A DJ
R3 1 5
100K
C332
1 NF
RXQD 3
RXQD 2
RXQD 1
RXQD 0
1 1 CDMA _ I F
1 2 CDMA _ I F /
1 NF
L 522
8 . 2nH
C553
1 0 0 NF
CHI P X8
RXI D 3
RXI D 2
T CXO
100PF
SEL 1 _ PA_ ON
3
G1
4
G2
5
G3
6
G4
C
+3.0R
L 521
L 314
1 0 0 PF
C554
1 0 0 PF
36
C3 5 7
T CXO
A
28
AD( 0 : 1 5 )
I N
R570
10
C314
1 NF
C315
1 NF
3
2
GND RF2
6
VA
4
VB
1
5
COM RF1
C3 4 5
1 NF
C329
4 . 7 NF
C331
C3 4 0
2 7 PF
C3 4 3
5. 6p F
C3 4 4
3 PF
2
L 501
1 8nH
Q3 0 3
L320
120n H
( c oi l )
5
LO
3
C309
0 . 5 PF
L 502
0
L321
100n H
( c oi l )
U3 0 3
C3 2 8
2 2 PF
2
C327
1 NF
L OSRC 2
OUT . R
C3 4 2
2 7 PF
C3 2 3
4. 7NF
3
1
5
G G G G
1 3 4 6
L 306
NC
R312
5 10
C3 2 6
1 NF
I F6
1 RF
I N. R
SW- 3 9 5
4
V DD
C313
1 NF
OUT
6
OUT
1
R311
2 4K
( 1 %)
C325
3 PF
U3 0 2
F3 0 1
3 4 7 8 9
I N
CON_ SL EE P
A N5 0 1
C552
1 0 0 NF
L 311
8 . 2nH
10
1
D3 0 1
C3 4 1
100PF
L 312
4 70nH
( c oi l )
+3. 0 B
C301
4 7 NF
C305
1 0 0 PF
G2
G3
G4
G5
G6
2
L 302
1 0nH
C302
1 0 0 NF
C3 5 3 C3 5 4 C3 5 5 C3 5 6
100NF 100P F 100NF 100P F
C3 5 0
1 0 UF
6. 3V
27
VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDDM
I _ OF FSET
Q3 0 1
2
4
6
14
15
17
20
24
35
44
RXVC O_ OU T
1
37
C5 4 9
1 0 UF
ADC_ I N2
I MD_ C T L
C321
1 0 0 NF
TCXO/ N
0
C322
4 . 7 NF
C320
4 7 0 PF
3
+3.0B
L331
R310
10
A
R301
1K
T CXO_ N
Q_ OF F SET
I _ OF F SET
L 310
Q_ OF FSET
C304
1 0 0 NF
+3.0R
+3.0RL
C303
C311
1 0 UF
1 0 0 PF 6 . 3 V
RXVC O_ T2
L 301
RXVC O_ T1
+3.0R
SCH- 6 2 0 EX P A2
T X & RX & L OCA L
RE V : Dr a wi n g
8. 0
CHK :
11
Pa g e :
Nu mb e r :
12
2
Circuit diagrams
11-3 CLC Circuit Diagram
Samsung Electronics
11-3
ELECTRONICS
©Samsung Electronics Co.,Ltd. APRIL. 2000
Printed in Korea.
Code No.: GH68-00669A
BASIC.
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