TVS Diode Array SPA SP720 Lead Free/Green Datasheet

TVS Diode Array SPA SP720 Lead Free/Green Datasheet
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP720 Series
SP720 Series 3pF 4kV Diode Array
RoHS
Pb GREEN
Description
The SP720 is an array of SCR/Diode bipolar structures for
ESD and over-voltage protection to sensitive input circuits.
The SP720 has 2 protection SCR/Diode device structures
per input. A total of 14 available inputs can be used to
protect up to 14 external signal or bus lines. Over-voltage
protection is from the IN (pins 1-7 and 9-15) to V+ or V-.
The SCR structures are designed for fast triggering at a
threshold of one +VBE diode threshold above V+ (Pin 16) or
a -VBE diode threshold below V- (Pin 8). From an IN input,
a clamp to V+ is activated if a transient pulse causes the
input to be increased to a voltage level greater than one
VBE above V+. A similar clamp to V- is activated if a negative
pulse, one VBE less than V-, is applied to an IN input.
Standard ESD Human Body Model (HBM) Capability is:
Pinout
SP720 (PDIP, SOIC)
TOP VIEW
IN 1
16 V+
IN 2
15 IN
IN 3
14 IN
IN 4
13 IN
• ESD Interface Capability for HBM Standards
IN 5
12 IN
- MIL STD 3015.7.................................................. 15kV
IN 6
11 IN
- IEC 61000-4-2, Direct Discharge,
IN 7
10 IN
- Single Input........................................... 4kV (Level 2)
9 IN
- Two Inputs in Parallel............................. 8kV (Level 4)
- IEC 61000-4-2, Air Discharge................15kV (Level 4)
V-
8
Features
• High Peak Current Capability
Functional Block Diagram
V+ 16
- IEC 61000-4-5 (8/20µs)........................................ ±3A
- Single Pulse, 100µs Pulse Width......................... ±2A
- Single Pulse, 4µs Pulse Width............................. ±5A
• Designed to Provide Over-Voltage Protection
3-7
9 - 15
IN
IN 1
2
- Single-Ended Voltage Range to......................... +30V
- Differential Voltage Range to............................. ±15V
• Fast Switching...............................................2ns Risetime
IN
• Low Input Leakages..................................1nA at 25º (Typ)
• Low Input Capacitance........................................ 3pF (Typ)
• An Array of 14 SCR/Diode Pairs
• Operating Temperature Range....................-40ºC to 105ºC
V-
8
Applications
Additional Information
Datasheet
Resources
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
• Microprocessor/Logic
Input Protection
• Analog Device Input
Protection
• Data Bus Protection
• Voltage Clamp
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP720 Series
Thermal Information
Absolute Maximum Ratings
Parameter
Rating
Units
+35
V
±2, 100µs
A
Continuous Supply Voltage, (V+) - (V-)
Forward Peak Current, IIN to VCC, IIN to GND
(Refer to Figure 5)
Parameter
Thermal Resistance (Typical, Note 1)
Rating
θJA
PDIP Package
90
o
SOIC Package
130
o
Maximum Storage Temperature Range
Maximum Junction Temperature (Plastic
Package)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Maximum Lead Temperature
(Soldering 20-40s) (SOIC Lead Tips Only)
Note:
ESD Ratings and Capability - See Figure 1, Table 1
Load Dump and Reverse Battery (Note 2)
Units
oC/W
C/W
C/W
-65 to 150
o
150
o
260
o
C
C
C
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Characteristics
TA = -40oC to 105oC, VIN = 0.5VCC , Unless Otherwise Specified
Parameter
Symbol
Test Conditions
VSUPPLY
Operating Voltage Range,
VSUPPLY = [(V+) - (V-)]
Forward Voltage Drop:
Min
Typ
Max
Units
-
2 to 30
-
V
IIN = 1A (Peak Pulse)
IN to V-
VFWDL
-
2
-
V
IN to V+
VFWDH
-
2
-
V
IIN
-20
5
20
nA
IQUIESCENT
-
50
200
nA
Note 3
-
1.1
-
V
VFWD/IFWD; Note 3
-
1
-
Ω
Input Leakage Current
Quiescent Supply Current
Equivalent SCR ON Threshold
Equivalent SCR ON Resistance
Input Capacitance
CIN
-
3
-
pF
Input Switching Speed
tON
-
2
-
ns
Notes:
2.In automotive and battery operated systems, the power supply lines should be externally protected for load dump and everse battery V+ and V- pins are connected to the same supply
voltage source as the device or control line under protection, a current limiting resistor should be connected in series between the external supply and the SP720 supply pins to limit
reverse battery current to within the rated maximum limits. Bypass capacitors of typically 0.01µF or larger from the V+ and V- pins to ground are recommended.
3.Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance.” These characteristics are given here for thumb-rule nformation to determine peak
current and dissipation under EOS conditions.
Typical Application of the SP720
(Application as an Input Clamp for Over-voltage, greater than 1VBE
Above V+ or less than -1VBE below V-)
+VCC
+VCC
INPUT
DRIVERS
OR
SIGNAL
SOURCES
LINEAR OR
DIGITAL IC
INTERFACE
IN 1-7
IN 9-15
TO +VCC
V+
SP720
V-
SP720 INPUT
PROTECTION CIRCUIT
(1 OF 14 ON CHIP)
FIGURE 4. TYPICAL APPLICATION OF THE SP720 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATER THAN 1VBE ABOVE V+ OR
LESS THAN -1V BE BELOW V-
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP720 Series
ESD Capability
ESD capability is dependent on the application and defined
test standard. The evaluation results for various test
standards and methods based on Figure 1 are shown in
Table 1.
Figure 1: Electrostatic Discharge Test
For the “Modified” MIL-STD-3015.7 condition that is
defined as an “in-circuit” method of ESD testing, the V+
and V- pins have a return path to ground and the SP720
ESD capability is typically greater than 15kV from 100pF
through 1.5kΩ. By strict definition of MIL-STD-3015.7 using
“pin-to-pin” device testing, the ESD voltage capability
is greater than 6kV. The MIL-STD-3015.7 results were
determined from AT&T ESD Test Lab measurements.
The HBM capability to the IEC 61000-4-2 standard is
greater than 15kV for air discharge (Level 4) and greater
than 4kV for direct discharge (Level 2). Dual pin capability (2
adjacent pins in parallel) is well in excess of 8kV (Level 4).
For ESD testing of the SP720 to EIAJ IC121 Machine
Model (MM) standard, the results are typically better than
1kV from 200pF with no series resistance.
CHARGE
SWITCH
Table 1: ESD Test Conditions
Standard
Type/Mode
MIL STD 3015.7
FORWARD SCR CURRENT (A)
FORWARD SCR CURRENT (mA)
40
20
0
RD
CD
±VD
Modified HBM
1.5kΩ
100pF
15kV
Standard HBM
1.5kΩ
100pF
6kV
HBM, Air Discharge
330Ω
150pF
15kV
HBM, Direct Discharge
330Ω
150pF
4kV
HBM, Direct Discharge,
Two Parallel Input Pins
330Ω
150pF
8kV
0kΩ
200pF
1kV
Machine Model
Figure 3: High Current SCR Forward Voltage Drop Curve
2.5
60
IN
DUT
FIGURE 1. ELECTR OSTATIC DISCHARGE TEST
TA = 25°C
SINGLE PULSE
80
CD
IEC 1000-4-2: R 1 50 to 100M
MIL STD 3015.7: R 1 1 to 10M
EIAJ IC121
100
DISCHARGE
SWITCH
H.V.
SUPPLY
VD
IEC 61000-4-2
Figure 2: Low Current SCR Forward Voltage Drop Curve
RD
R1
TA = 25°C
SINGLE PULSE
2
1.5
1
I FWD
EQUIV. SAT. ON
THRESHOLD ~ 1.1V
V FWD
0.5
0
600
800
1000
FORWARD SCR VOLTAGE DROP (mV)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
1200
0
1
2
FORWARD SCR VOLTAGE DROP (V)
3
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP720 Series
Peak Transient Current Capability for Long Duration Surges
The peak transient current capability rises sharply as the
width of the current pulse narrows. Destructive testing
was done to fully evaluate the SP720’s ability to withstand
a wide range of transient current pulses. The circuit used to
generate current pulses is shown in Figure 4.
Figure 4: T
ypical SP720 Peak Current Test Circuit
with a Variable Pulse Width Input
+
VG
-
The test circuit of Figure 4 is shown with a positive pulse
input. For a negative pulse input, the (-) current pulse input
goes to an SP720 ‘IN’ input pin and the (+) current pulse
input goes to the SP720 V- pin. The V+ to V- supply of the
SP720 must be allowed to float. (i.e., It is not tied to the
ground reference of the current pulse generator.) Figure
5 shows the point of overstress as defined by increased
leakage in excess of the data sheet published limits.
When adjacent input pins are paralleled, the sustained
peak current capability is increased to nearly twice that
of a single pin. For comparison, tests were run using dual
pin combinations 1+2, 3+4, 5+6, 7+9, 10+11, 12+13 and
14+15.
The overstress curve is shown in Figure 5 for a 15V supply
condition. The dual pins are capable of 10A peak current
for a 10µs pulse and 4A peak current for a 1ms pulse. The
complete for single pulse peak current vs. pulse width time
ranging up to 1 second are shown in Figure 5.
CURRENT
SENSE
(-)
(+)
VOLTAGE
PROBE
R 1 ~ 10 TYPICAL
VG ADJ. 10V/ATYPICAL
C1 ~ 100 µF
1 IN
V+ 16
2 IN
IN 15
3 IN
IN 14
4 IN
IN 13
5 IN
SP720
+
C1
-
IN 12
6 IN
IN 11
7 IN
IN 10
8 V-
IN 9
FIGURE 5. TYPICAL SP720 PEAK CURRENT TEST CIRCUIT
WITH A VARIABLE PULSE WIDTH INPUT
Figure 5: S
P720 Typical Nonrepetitive Peak Current
Pulse Capability
howing the Measured Point of Overstress in Amperes vs
S
pulse width time in milliseconds (TA = 25oC)
10
CAUTION: SAFE OPERATING CONDITIONS LIMIT
THE MAXIMUM PEAK CURRENT FOR A GIVEN
PULSE WIDTH TO BE NO GREATER THAN 75%
OF THE VALUES SHOWN ON EACH CURVE.
SINGLE PIN STRESS CURVES
DUAL PIN STRESS CURVE
9
8
PEAK CURRENT (A)
The maximum peak input current capability is dependent
on the V+ to V- voltage supply level, improving as the
supply voltage is reduced. Values of 0, 5, 15 and 30
voltages are shown. The safe operating range of the
transient peak current should be limited to no more than
75% of the measured overstress level for any given pulse
width as shown in Figure 5.
VARIABLE TIME DURATION
CURRENT PULSE GENERA TOR
R1
7
6
5
4
3
15V
0V
5V
30V
2
1
15V
V+ TOV-SUPPLY
0
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH TIME (ms)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP720 Series
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
5°C/second max
TS(max) to TL - Ramp-up Rate
5°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
Peak Temperature (TP)
tP
TP
Temperature
Reflow Condition
tS
time to peak temperature
Time
Package Dimensions Dual-In-Line Plastic Packages (PDIP)
N
E1
INDEX
AREA
1 2 3
N/2
Package
PDIP
Pins
16 Lead Dual-in-Line
JEDEC
MS-001
-B-
Millimeters
-AD
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
Max
A
-
A1
0.39
E
BASE
PLANE
D1
B
CL
eA
A1
eC
0.010 (0.25) M C A B S
C
eB
NOTES:
Notes:
1. ControllingDimensions:INCH. In case of conflictbetweenEnglishand
1. Controlling Dimensions: INCH. in case of conflict between English and Metric
Metricthe
dimensions,
the inch
dimensionscontrol.
dimensions,
inch dimensions
control.
2. Dimensioning
and tolerancing
ANSI Y14.5M-1982.
2. Dimensioning
and tolerancing
per ANSI per
Y14.5M-1982.
3. Symbols
are defined
in the
“MO
SeriesList”
Symbol
List”in2.2
Section
2.2 of No.
3. Symbols
are defined
in the “MO
Series
Symbol
in Section
of Publication
95. PublicationNo. 95.
4. Dimensions
A, A1
and
L are measured
withtheseated
package
seatedseating
in JE4. Dimensions
A, A1 and
L are
measured
with the package
in JE-DEC
plane gauge
GS-3. plane gauge GS-3.
DEC seating
5. D, D1,
and
E1and
dimensions
do not include
flashmold
or protrusions.
Mold flash or
5. D,
D1,
E1 dimensions
do notmold
include
flash or protrusions.
protrusions
0.010shall
inch (0.25mm).
Moldshall
flashnot
or exceed
protrusions
not exceed 0.010 inch (0.25mm).
are measured
with the leads
to be perpendicular
to datum -C- .
6. E and
eA are measured
6. EeAand
withconstrained
the leads constrained
to be perpendic7.eB andular
eC are
at the
to measured
datum -C. lead tips with the leads unconstrained. eC must be zero
or greater.
7. eB and eC are measuredat the lead tips withthe leads unconstrained.
8. B1 maximum
dimensions
not include dambar protrusions. Dambar protrusions shall
eC must
be zero ordogreater.
not exceed 0.010 inch (0.25mm).
8. B1 maximumdimensionsdo not includedambarprotrusions.Dambar
9. N is the
maximum number
ofexceed
terminal0.010
positions.
protrusions
shall not
inch (0.25mm).
10.Corner
N, N/2 andnumber
N/2 + 1)offor
E8.3, E16.3,
E18.3, E28.3, E42.6 will have a B1
9. Nleads
is the(1,maximum
terminal
positions.
dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 willhave a B1 dimensionof 0.030 - 0.045 inch (0.76 - 1.14mm).
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
Inches
Min
Notes
Min
Max
5.33
-
0.210
4
-
0.015
-
4
A2
2.93
4.95
0.115
0.195
-
B
0.356
0.558
0.014
0.022
-
B1
1.15
1.77
0.045
0.070
8, 10
C
0.204
0.355
0.008
0.014
5
D
18.66
19.68
0.735
0.775
D1
0.13
-
0.005
-
5
E
7.62
8.25
0.300
0.325
6
E1
6.10
7.11
0.240
0.280
5
2.54 BSC
e
7.62 BSC
eA
eB
-
L
2.93
N
16
0.100 BSC
-
0.300 BSC
6
10.92
-
0.430
7
3.81
0.115
0.150
4
16
9
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP720 Series
Package Dimensions — Small Outline Plastic Packages (SOIC)
N
Package
INDEX
AREA
H
0.25(0.010) M
B M
Pins
16
JEDEC
MS-012
E
-B-
SOIC
Millimeters
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
µ
e
A1
B
C
0.10(0.004)
0.25(0.010) M C A M B S
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication
Number 95.
NOTES:
2. Dimensioning
and tolerancing per ANSI Y14.5M-1982.
1. Symbols
are defined
in the
“MO
Series
Symbolor
List”
in burrs.
Section
2.2 flash,
of
3. Dimension
“D” does
not include
mold
flash,
protrusions
gate
Mold
Publication
95.not exceed 0.15mm (0.006 inch) per side.
protrusion
and gateNumber
burrs shall
Inches
Notes
Min
Max
Min
Max
A
A1
B
C
D
E
1.35
0.10
0.33
0.19
9.80
3.80
1.75
0.25
0.51
0.25
10.00
4.00
0.0532
0.0040
0.013
0.0075
0.3859
0.1497
0.0688
0.0098
0.020
0.0098
0.3937
0.1574
9
3
4
e
H
h
L
N
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.27
16
0.050 BSC
0.2284
0.2440
0.0099
0.0196
0.016
0.050
16
5
6
7
0º
µ
8º
0º
8º
-
2. Dimensioning
andinclude
tolerancing
perflash
ANSI
4. Dimension
“E” does not
interlead
orY14.5M-1982.
protrusions. Interlead flash and
protrusions
shall not
exceed
0.25mm
(0.010
inch)
perprotrusions
side.
3. Dimension
“D”
does not
include
mold
flash,
or gate burrs.
Moldflash,
and gate
not exceed
0.15mm
(0.006
5. The chamfer
on theprotrusion
body is optional.
If itburrs
is notshall
present,
a visual index
feature
must be
locatedinch)
within
the
crosshatched area.
per
side.
6. “L” 4.
is the
length of
terminal
forinclude
soldering
to a substrate.
Dimension
“E”
does not
interlead
flashor protrusions.Interlead
and protrusions
not exceed 0.25mm (0.010 inch) per side.
7. “N” is flash
the number
of terminalshall
positions.
5. The
chamfer
onshown
the body
is optional.
If it is not present, a visualindex
8. Terminal
numbers
are
for reference
only.
feature must be located withinthe crosshatchedarea.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating
6. “L
” isnot
theexceed
lengthaofmaximum
terminalfor
soldering
to a(0.024
substrate.
plane,
shall
value
of 0.61mm
inch).
7. “N”isdimension:MILLIMETER.
the numberof terminalConverted
positions.inch dimensions are not necessarily
10.Controlling
exact.
8. Terminal numbersare shownfor reference only.
9. The lead width“B”,as measured0.36mm(0.014 inch) or greaterabove
the seating plane, shall not exceed a maximumvalue of 0.61mm
(0.024 inch).
Part Numbering
System
Product Characteristics
10. Controllingdimension:MILLIMETER. Convertedinch dimensionsare
not necessarilyexact.
SP720 ** **
P=Lead Free
G=Green
TG= Tape and Reel / Green
TVS Diode Arrays
(SPA® Diodes)
Package
Series
AB = 16 Ld SOIC
AP = 16 Ld PDIP
See Ordering Information section for specific options available
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Ordering Information
Part Number
Temp. Range (ºC)
Package
Environmental
Informaton
Marking
Min. Order
SP720APP
-40 to 105
16 Ld PDIP
Lead-free
SP720AP(P) 1
1500
SP720ABG
-40 to 105
16 Ld SOIC
Green
SP720A(B)G 2
1920
SP720ABTG
-40 to 105
16 Ld SOIC
Tape and Reel
Green
SP720A(B)G 2
2500
Notes:
1. SP720AP(P) means device marking either SP720AP or SP720APP.
2. SP720A(B)G means device marking either SP720AG or SP720ABG which are good for types SP720ABG and SP720ABTG.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement