TTI43351307

TTI43351307
CC2591
www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
2.4-GHz RF Front End
FEATURES
APPLICATIONS
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Seamless Interface to 2.4-GHz Low Power RF
Devices from Texas Instruments
Up to 22-dBm Output Power
6-dB Typical Improved Sensitivity on CC24xx
and CC2500, CC2510, and CC2511
Few External Components
– Integrated Switches
– Integrated Matching Network
– Integrated Balun
– Integrated Inductors
– Integrated PA
– Integrated LNA
Digital Control of LNA Gain by HGM Pin
100-nA in Power Down (EN = PAEN = 0)
Low Transmit Current Consumption
(100-mA at 3-V for 20-dBm Out, PAE = 33%)
Low Receive Current Consumption
– 3.4-mA for High Gain Mode
– 1.7-mA for Low Gain Mode
4.8-dB LNA Noise Figure, including T/R Switch
and external antenna match
RoHS Compliant 4×4-mm QFN-16 Package
2-V to 3.6-V Operation
All 2.4-GHz ISM Band Systems
Wireless Sensor Networks
Wireless Industrial Systems
IEEE 802.15.4 and ZigBee Systems
Wireless Consumer Systems
Wireless Audio Systems
DESCRIPTION
CC2591 is a cost-effective and high performance RF
Front End for low-power and low-voltage 2.4-GHz
wireless applications.
CC2591 is a range extender for all existing and future
2.4-GHz low-power RF transceivers, transmitters and
System-on-Chip products from Texas Instruments.
CC2591 increases the link budget by providing a
power amplifier for increased output power, and an
LNA with low noise figure for improved receiver
sensitivity.
CC2591 provides a small size, high output power RF
design with its 4x4-mm QFN-16 package.
CC2591 contains PA, LNA, switches, RF-matching,
and balun for simple design of high performance
wireless applications.
CC2591 BLOCK DIAGRAM
PA
BALUN
4
RF_P
3
RXTX
2
RF_N
5
PAEN
6
EN
11
ANT
LNA
Logic
Bias
15
7
BIAS
HGM
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values
may cause permanent damage to the device.
PARAMETER
Supply voltage
VALUE
All supply pins must have the same voltage
Voltage on any digital pin
UNIT
–0.3 to 3.6
V
–0.3 to VDD + 0.3, max 3.6
Input RF level
Storage temperature range
10
dBm
–50 to 150
°C
RECOMMENDED OPERATING CONDITIONS
The operating conditions for CC2591 are listed below.
PARAMETER
MIN
Ambient temperature range
–40
85
2
3.6
2400
2483.5
Operating supply voltage
Operating frequency range
MAX
UNIT
°C
V
MHz
ELECTRICAL CHARACTERISTICS
TC = 25°C, VDD = 3 V , fRF= 2440MHz (unless otherwise noted). Measured on CC2591EM reference design including external
matching components.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Receive current, High Gain Mode
HGM = 1
3.4
4
Receive current, Low Gain Mode
Transmit current
HGM = 0
1.7
2
PIN = 0.5 dBm
112
Transmit current
No input signal
40
50
Power down current
EN = PAEN = 0
0.1
0.3
High input level (control pins)
EN, PAEN, HGM, RXTX
Low input level (control pins)
EN, PAEN, HGM, RXTX
1.3
VDD
0.3
UNIT
mA
µA
V
Power down - Receive mode switching
time
12
µs
Power down - Transmit mode switching
time
1
µs
RF Receive
Gain, High Gain Mode
HGM = 1
11
dB
Gain, Low Gain Mode
HGM = 0
1
dB
Gain variation, 2400 – 2483.5 MHz, High
Gain Mode
HGM = 1
1.3
dB
Gain variation, 2.0V – 3.6V, High Gain
Mode
HGM = 1
1.5
dB
Gain variation, -40°C – 85°C, High Gain
Mode
HGM = 1
3
dB
Noise figure, High Gain Mode
HGM = 1, including internal T/R switch and external
antenna match
4.8
dB
Input 1 dB compression, High Gain Mode
HGM = 1
–17
dBm
Input IP3, High Gain Mode
HGM = 1
–2
dBm
Input reflection coefficient, S11
HGM = 1, measured at antenna port
–11
dB
2
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CC2591
www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
ELECTRICAL CHARACTERISTICS (continued)
TC = 25°C, VDD = 3 V , fRF= 2440MHz (unless otherwise noted). Measured on CC2591EM reference design including external
matching components.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RF Transmit
Gain
22
Output power, POUT
PIN = 0.5 dBm
Maximum output power
PIN = 5 dBm
Power Added Efficiency, PAE
PIN = 0.5 dBm
dB
20.6
dBm
22
dBm
34%
Output 1 dB compression
19
dBm
Output IP3
32
dBm
Output power variation over frequency
2400 – 2483.5 MHz, PIN = 0.5 dBm
0.5
dB
Output power variation over power supply
2V – 3.6V , PIN = 0.5 dBm
3.5
dB
Output power variation over temperature
-40°C – 85°C, PIN = 0.5 dBm
1.5
dB
2nd harmonic power
PIN = 0.5 dBm. The 2nd harmonic can be reduced to
below regulatory limits by using an external LC filter
and antenna.
–15
dBm
3rd harmonic power
PIN = 0.5 dBm. The 3rd harmonic can be reduced to
below regulatory limits by using an external LC filter
and antenna.
–30
dBm
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CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com
DEVICE INFORMATION
The CC2591 pinout and description are shown in Figure 1 and Table 1, respectively.
15
14
AVDD_LNA
BIAS
16
GND
AVDD_BIAS
PIN AND I/O CONFIGURATION
(TOP VIEW)
13
AVDD_PA1
1
12
GND
RF_N
2
11
ANT
RXTX
3
10
AVDD_PA2
RF_P
4
9
6
7
8
HGM
GND
PAEN
5
EN
QFN-16 4x4mm
GND
Figure 1.
NOTE:
The exposed die attach pad must be connected to a solid ground plane as this is the
primary ground connection for the chip. Inductance in vias to the pad should be
minimized. It is highly recommended to follow the reference layout. Changes will alter
the performance. Also see the PCB landpattern information in this data sheet.
For best performance, minimize the length of the ground vias, by using a 4-layer PCB
with ground plane as layer 2 when CC2591 is mounted onto layer 1.
4
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CC2591
www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
Table 1. TERMINAL FUNCTIONS
TERMINAL
TYPE
DESCRIPTION
NO.
NAME
—
GND
Ground
The exposed die attach pad must be connected to a solid ground plane. See
CC2591EM reference design for recommended layout.
AVDD_PA1
Power
2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA . See
CC2591EM reference design for recommended layout.
2
RF_N
RF
3
RXTX
Analog/Control
1
RF interface towards CC24xx or CC25xx device.
RXTX switching voltage when connected to CC24xx devices. See Table 3 and Table 4
for details.
4
RF_P
RF
5
PAEN
Digital Input
RF interface towards CC24xx or CC25xx device
Digital control pin. See Table 3 and Table 4 for details.
6
EN
Digital Input
Digital control pin. See Table 3 and Table 4 for details.
7
HGM
Digital Input
Digital control pin.
HGM=1 → Device in High Gain Mode
HGM=0 → Device in Low Gain Mode (RX only)
8, 9, 12, 14
GND
Ground
Secondary ground connections. Should be shorted to the die attach pad on the top
PCB layer.
10
AVDD_PA2
Power
2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA. See
CC2591EM reference design for recommended layout.
11
ANT
RF
13
AVDD_LNA
Power
2 V – 3.6 V Power. PCB trace to this pin serves as inductive load to LNA. See
CC2591EM reference design for recommended layout.
15
BIAS
Analog
Biasing input. Resistor between this node and ground sets bias current to PAs.
16
AVDD_BIAS
Power
2 V – 3.6 V Power.
Antenna interface.
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CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com
CC2591EM Evaluation Module
VDD VDD
C11/C12
C101/C102
= TLINE inductor
VDD
VDD
C131/C132
TL131
AVDD_LNA
TL101
AVDD_PA2
AVDD_BIAS
AVDD_PA1
TL11
C161
LDB182G4520C-110
RF_P
RXTX
RXTX
Balun
RXTX
SMA
L111
L112
CC2591
ANT
C111
SMA
RF_P
RF_P
C2
RF_N
RF_N
RF_N
PAEN
PAEN
EN
EN
HGM
BIAS
HGM
RXTX
R151
Figure 2. CC2591EM Evaluation Module
Table 2. List of Materials (See CC2591EM Reference Design)
DEVICE
FUNCTION
VALUE
L112
Part of antenna match.
1.5 nH: LQW15AN1N5B00 from Murata
L111
DC block.
1 nF: GRM1555C1H102JA01 from Murata
C111
Part of antenna match.
1 pF: GRM1555C1H1R0BZ01 from Murata
C161
Decoupling capacitor.
1 nF: GRM1555C1H102JA01 from Murata
C11/C12
Decoupling. Will affect PA resonance.
10 pF || 1 nF. The smallest cap closest. See CC2591EM
reference design for placement.
10 pF: GRM1555C1H100JZ01 from Murata
1 nF: GRM1555C1H102JA01 from Murata
C101/C102
Decoupling. Will affect PA resonance.
18 pF || 1 nF. The smallest cap closest. See for
CC2591EM reference design placement.
18 pF: GRM1555C1H180JZ01 from Murata
1 nF: GRM1555C1H102JA01 from Murata
C131/C132
Decoupling. Will affect PA resonance.
10 pF || 1 nF. The smallest cap closest. See CC2591EM
reference design for placement.
10 pF: GRM1555C1H100JZ01 from Murata
1 nF: GRM1555C1H102JA01 from Murata
C2
Decoupling of external balun
1 nF: GRM1555C1H102JA01 from Murata
TL11
Transmission line. Will affect PA resonance.
See CC2591EM reference design.
TL101
Transmission line. Will affect PA resonance.
See CC2591EM reference design.
TL131
Transmission line. Will affect LNA resonance.
See CC2591EM reference design.
R151
Bias resistor
4.3 kΩ: RK73H1ETTP4301F from Koa
6
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CC2591
www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
TYPICAL CHARACTERISTICS
LNA GAIN AND NOISE FIGURE
vs
FREQUENCY
12
5.4
13
11
5.3
12
HGM
5.1
8
5
4.9
NF HGM
6
4.8
5
4.7
4
4.6
3
4.5
2
9
8
7
6
5
4
3
1
0
1
4.3
-1
0
4.2
-2
-40
2400 2410
2420
2430 2440 2450
2460
2470
LGM
2
4.4
LGM
HGM
10
Gain − dB
9
7
11
5.2
Noise Figure − dB
10
Gain − dB
LNA GAIN
vs
TEMPERATURE
2480
-20
0
20
40
60
80
o
T − Temperature − C
f − Frequency − MHz
Figure 3.
Figure 4.
LNA GAIN
vs
POWER SUPPLY
12
11
10
HGM
9
Gain − dB
8
7
6
5
4
3
2
LGM
1
0
-1
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Power Supply − V
Figure 5.
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CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS (continued)
I_VDD
POUT
0
2
4
6
135
130
36
PAE
34
125
32
120
30
28
110
26
105
24
100
22
20
90
85
18
2400 2410
2420 2430
2440 2450 2460
2470 2480
f − Frequency − MHz
Figure 6.
Figure 7.
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
TEMPERATURE
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
POWER SUPPLY
38
145
38
140
36
34
135
34
125
32
130
32
120
36
125
I_VDD
28
120
26
115
24
110
22
105
POUT
20
18
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80
Output Power (dBm) and PAE − %
30
Current Consumption − mA
PAE
Output Power (dBm) and PAE − %
95
POUT
Input Power − dBM
135
130
PAE
115
30
I_VDD
28
110
26
105
24
100
22
95
POUT
20
90
100
18
85
95
16
80
2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9
T − Temperature − oC
3 3.1 3.2 3.3 3.4 3.5 3.6
Power Supply − V
Figure 8.
8
115
I_VDD
Current Consumption − mA
-6 -4 -2
38
Current Consumption − mA
PAE
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
Output Power (dBm) and PAE − %
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
-20 -18 -16 -14 -12 -10 -8
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
FREQUENCY
Current Consumption − mA
Output Power (dBm) and PAE − %
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
INPUT POWER
Figure 9.
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CC2591
www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
Controlling the Output Power from CC2591
The output power of CC2591 is controlled by controlling the input power. The CC2591 PA is designed to work in
compression (class AB), and the best efficiency is reached when a strong input signal is applied.
Input Levels on Control Pins
The four digital control pins (PAEN, EN, HGM, RXTX) have built-in level-shifting functionality, meaning that if the
CC2591 is operating from a 3.6-V supply voltage, the control pins will still sense 1.6-V - 1.8-V signals as logical
‘1’.
An example of the above would be that RXTX is connected directly to the RXTX pin on CC24xx, but the global
supply voltage is 3.6 V. The RXTX pin on CC24xx will switch between 0 V (RX) and 1.8 V(TX), which is still a
high enough voltage to control the mode of CC2591.
The input voltages should however not have logical ‘1’ level that is higher than the supply.
Connecting CC2591 to a CC24xx Device
Table 3. Control Logic for Connecting CC2591 to a CC24xx Device
PAEN = EN
RXTX
HGM
MODE OF OPERATION
0
X
X
Power Down
1
0
0
RX Low Gain Mode
1
0
1
RX High Gain Mode
1
1
X
TX
VDD VDD
C11/C12
C101/C102
= TLINE inductor
VDD
VDD
C131/C132
TL131
AVDD_LNA
TL101
AVDD_PA2
AVDD_BIAS
AVDD_PA1
TL11
C161
CC243x
RF_P
RF_P
RF_P
RF_P
RXTX
RXTX
RXTX
L111
ANT
L112
C113
TXRX_SWITCH
C112
CC2591
RF_N
RF_N
RF_N
RF_N
PAEN
C111
RREG_OUT (CC243x)
BIAS
EN
HGM
R151
Connected to
VDD/GND/MCU/RXTX
Alternativiely
from MCU
Figure 10. CC2591 + CC24xx Application Circuit
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CC2591
SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com
Connecting CC2591 to the CC2500, CC2510, or CC2511 Device
Table 4. Control Logic for Connecting CC2591 to a CC2500/10/11 Devices
PAEN
EN
RXTX
HGM
MODE OF OPERATION
0
0
NC
X
Power Down
0
1
NC
0
RX LGM
0
1
NC
1
RX HGM
1
0
NC
X
TX
1
1
NC
X
Not allowed
VDD VDD
C11/C12
C101/C102
= TLINE inductor
VDD
VDD
C131/C132
TL131
AVDD_LNA
TL101
AVDD_PA2
AVDD_BIAS
AVDD_PA1
TL11
C161
CC2500
CC2510
CC2511
RF_P
RF_P
RF_P
RXTX
RXTX
RXTX
L111
CC2591
C111
BIAS
C113
NC
C112
ANT
L112
RF_P
RF_N
RF_N
RF_N
RF_N
PAEN
GDO0
EN
GDO2
HGM
R151
Connected to
VDD/GND/MCU
Alternatively
from MCU
Figure 11. CC2591 + CC2500/10/11 Device Application Circuit
10
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www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008
Connecting CC2591 to a CC2520 Device
Control Logic for Connecting CC2591 to a CC2520 Device
PAEN
EN
RXTX
HGM
MODE OF OPERATION
0
0
NC
X
Power Down
0
1
NC
0
RX LGM
0
1
NC
1
RX HGM
1
0
NC
X
TX
1
1
NC
X
Not allowed
VDD VDD
C11/C12
C101/C102
= TLINE inductor
VDD
VDD
C131/C132
TL131
TL101
CC2520
AVDD_LNA
AVDD_PA2
AVDD_BIAS
AVDD_PA1
TL11
C161
C41
RF_P
RXTX
RXTX
L111
RXTX
C112
CC2591
ANT
L112
C113
C111
L41
RF_P
RF_P
RF_P
NC
C1
L21
RF_N
RF_N
RF_N
RF_N
PAEN
PA_EN
LNA_EN
BIAS
EN
HGM
R151
Connected to
VDD/GND/MCU
C21
Alternatively
from MCU
Figure 12. CC2591 + CC2520 Application Circuit
Revision History
Changes from Original (March 2008) to Revision A ....................................................................................................... Page
•
Changed the data sheet From: Product Preview To: Production Data. Multiple changes throughout. ................................. 1
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CC2591RGVR
ACTIVE
VQFN
RGV
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CC2591
CC2591RGVRG4
ACTIVE
VQFN
RGV
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CC2591
CC2591RGVT
ACTIVE
VQFN
RGV
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CC2591
CC2591RGVTG4
ACTIVE
VQFN
RGV
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CC2591
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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11-Apr-2013
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CC2591RGVR
VQFN
RGV
16
2500
330.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
CC2591RGVT
VQFN
RGV
16
250
180.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC2591RGVR
VQFN
RGV
16
2500
338.1
338.1
20.6
CC2591RGVT
VQFN
RGV
16
250
210.0
185.0
35.0
Pack Materials-Page 2
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