MAX11166

MAX11166
MAX11166
RELIABILITY REPORT
FOR
MAX11166ETC+T
PLASTIC ENCAPSULATED DEVICES
February 06, 2014
MAXIM INTEGRATED
160 RIO ROBLES
SAN JOSE, CA 95134
Approved by
Sokhom Chum
Quality Assurance
Reliability Engineer
Maxim Integrated. All rights reserved.
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MAX11166
Conclusion
The MAX11166ETC+T successfully meets the quality and reliability standards required of all Maxim Integrated products. In addition,
Maxim Integrated's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim Integrated's quality
and reliability standards.
Table of Contents
I. ........Device Description
IV. .......Die Information
II. ........Manufacturing Information
V. ........Quality Assurance Information
III. .......Packaging Information
VI. .......Reliability Evaluation
.....Attachments
I. Device Description
A. General
The MAX11166/MAX11167 16-bit, 500ksps/250ksps, SAR ADCs offer excellent AC and DC performance with true bipolar input range, small size, and
internal reference. The MAX11166/MAX11167 measure a ±5V (10VP-P) input range while operating from a single 5V supply. A patented charge-pump
architecture allows direct sampling of high-impedance sources. The MAX11166/MAX11167 integrate an optional 6ppm/°C reference with internal
buffer, saving the cost and space of an external reference. These ADCs achieve 92.6dB SNR and -105dB THD. The MAX11166/MAX11167
guarantee 16-bit no-missing codes and ±0.5 LSB INL (typ). The MAX11166/MAX11167 communicate using an SPI-compatible serial interface at
2.5V, 3V, 3.3V, or 5V logic. The serial interface can be used to daisy-chain multiple ADCs in parallel for multichannel applications and provides a busy
indicator option for simplified system synchronization and timing. The MAX11166/MAX11167 are offered in 12-pin, 3mm x 3mm, TDFN packages and
are specified over the -40°C to +85°C temperature range.
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MAX11166
II. Manufacturing Information
A. Description/Function:
16-Bit, 500ksps/250ksps, ±5V SAR ADCs with Internal Reference in TDFN
B. Process:
S45
C. Number of Device Transistors:
35573
D. Fabrication Location:
California, Texas or Japan
E. Assembly Location:
Texas, Taiwan
F. Date of Initial Production:
December 12, 2012
III. Packaging Information
A. Package Type:
12L TDFN
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-4679
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
1
J. Single Layer Theta Ja:
N/A
K. Single Layer Theta Jc:
N/A
L. Multi Layer Theta Ja:
41°C/W
M. Multi Layer Theta Jc:
8.5°C/W
IV. Die Information
A. Dimensions:
62X87 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX11166
V. Quality Assurance Information
A. Quality Assurance Contacts:
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% for all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
= ___1___
MTTF
=
_______1.83_______ (Chi square value for MTTF upper limit)
192 x 4340 x 79 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 13.9 x 10-9
= 13.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim Integrated's reliability monitor program. Maxim Integrated
performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at
http://www.maximintegrated.com/qa/reliability/monitor. Cumulative monitor data for the S45 Process results in a FIT Rate of 0.04 @
25C and 0.69 @ 55C (0.8 eV, 60% UCL).
B. E.S.D. and Latch-Up Testing (lot T2UZBQ002B, D/C 1220)
The AC91 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per JEDEC JESD22A114. Latch-Up testing has shown that this device withstands a current of +/-250mA and overvoltage per JEDEC JESD78.
Maxim Integrated. All rights reserved.
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MAX11166
Table 1
Reliability Evaluation Test Results
MAX11166ETC+T
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
79
0
T2UZBQ002B, D/C 1220
Note 1: Life Test Data may represent plastic DIP qualification lots.
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