MAX4008

MAX4008
MAX4008EUT+
RELIABILITY REPORT
FOR
MAX4008EUT+
(MAX4007)
PLASTIC ENCAPSULATED DEVICES
November 3, 2008
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX4008EUT+
Conclusion
The MAX4008EUT+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX4007/MAX4008 precision, high-side, high-voltage current monitors are specifically designed for monitoring photodiode current in fiber
applications. They offer a connection point for the reference current and a monitor output that produces a signal proportional to the reference current.
The monitor output of the MAX4007 is a current proportional to the reference current. The monitor output of the MAX4008 is a voltage proportional to
the reference current. The current monitors have six decades of dynamic range and monitor reference currents of 250nA to 2.5mA with better than 5%
accuracy. The photodiode current can be monitored from 10nA to 10mA with reduced accuracy. The MAX4007/MAX4008 accept a supply voltage of
+2.7V to +76V, suitable for APD or PIN photodiode applications. Internal current limiting (20mA, typ) protects the devices against short circuit to
ground. A clamp diode protects the monitor output from overvoltage. Additionally, these devices feature thermal shutdown if the die temperature
reaches +150°C. The MAX4007/MAX4008 are available in tiny, spacesaving 6-pin SOT23 packages, and operate over the extended temperature
range of -40°C to +85°C.
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MAX4008EUT+
II. Manufacturing Information
A. Description/Function:
High-Accuracy, 76V, High-Side Current Monitors in SOT23
B. Process:
BCD8
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
UTL Thailand
F. Date of Initial Production:
January 25, 2003
III. Packaging Information
A. Package Type:
6-pin SOT23
B. Lead Frame:
Cu Alloy
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Au (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Jb:
115*°C/W
K. Single Layer Theta Jc:
80°C/W
L. Multi Layer Theta Ja:
74.6°C/W
M. Multi Layer Theta Jc:
6.1°C/W
IV. Die Information
A. Dimensions:
60 X 41 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
3.0 microns (as drawn)
F. Minimum Metal Spacing:
3.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX4008EUT+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the BCD8 Process results in a FIT Rate of 2.3 @ 25C and 39.6 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The OY13 die type has been found to have all pins able to withstand a HBM transient pulse of 2000 per Mil-Std 883 Method
3015.7. Latch-Up testing has shown that this device withstands a current of 250 mA.
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MAX4008EUT+
Table 1
Reliability Evaluation Test Results
MAX4008EUT+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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