Silicon Laboratories | SI5324 | Si5324 Data Sheet

Si5324 Data Sheet
Si5324
A NY - F R E QUE N C Y P RECISION C LOCK M ULTIPLIER /
J I T T E R A TTENUATOR
Features
See page 64.
Description
CKOUT1–
CKOUT1+
NC
GND
NC
36 35 34 33 32 31 30 29 28
RST
1
27 SDI
NC
2
26 A2_SS
INT_C1B
3
C2B
4
VDD
5
XA
6
XB
7
GND
8
20 GND
NC
9
19 GND
25 A1
24 A0
GND
Pad
23 SDA_SDO
22 SCL
21 CS_CA
Copyright © 2014 by Silicon Laboratories
LOL
CKIN1–
RATE1
CKIN1+
NC
10 11 12 13 14 15 16 17 18
The Si5324 is a low-bandwidth, jitter-attenuating, precision clock multiplier
for applications requiring sub 1 ps jitter performance with loop bandwidths
between 4 Hz and 525 Hz. The Si5324 accepts two input clocks ranging
from 2 kHz to 710 MHz and generates two output clocks ranging from 2 kHz
to 945 MHz and select frequencies to 1.4 GHz. The two outputs are divided
down separately from a common source. The Si5324 can also use its
external reference as a clock source for frequency synthesis. The device
provides virtually any frequency translation combination across this
operating range. The Si5324 input clock frequency and clock multiplication
ratio are programmable via an I2C or SPI interface. The Si5324 is based on
Silicon Laboratories' 3rd-generation DSPLL® technology, which provides
any-frequency synthesis and jitter attenuation in a highly integrated PLL
solution that eliminates the need for external VCXO and filter components.
The DSPLL loop bandwidth is digitally programmable, providing jitter
performance optimization at the application level. The Si5324 is ideal for
providing clock multiplication and jitter attenuation in high performance
timing applications.
Rev. 1.1 1/14
VDD
1/2/4/8/10G Fibre Channel line
cards
GbE/10/40/100G Synchronous
Ethernet (LAN/WAN)
Data converter clocking
Wireless base stations
Test and measurement
CMODE
Broadcast video –3G/HD/SD-SDI, 
Genlock
 Packet Optical Transport Systems 
(P-OTS), MSPP
 OTN/OTU-1/2/3/4 Asynchronous 
Demapping (Gapped Clock)

 SONET OC-48/192/768,

SDH/STM-16/64/256 line cards

CKOUT2–
Pin Assignments
Applications
CKIN2–

Ordering Information:
CKOUT2+

CKIN2+

Freerun, Digital Hold operation
Configurable signal format per
output (LVPECL, LVDS, CML,
CMOS)
Support for ITU G.709 and custom
FEC ratios (255/238, 255/237,
255/236, 239/237, 66/64, 239/238,
15/14, 253/221, 255/238)
LOL, LOS, FOS alarm outputs
I2C or SPI programmable
On-chip voltage regulator with high
PSNR
Single supply 1.8 ±5%, 2.5 ±10%,
or 3.3 V ±10%
Small size: 6 x 6 mm 36-lead QFN
 Pb-free, ROHS-compliant
VDD

Generates any frequency from

2 kHz to 945 MHz and select

frequencies to 1.4 GHz from an
input frequency of 2 kHz to
710 MHz

Ultra-low jitter clock outputs as low
as 290 fs rms (12 kHz–20 MHz),
320 fs rms (50 kHz–80 MHz)
Integrated loop filter with

selectable loop bandwidth

(4– 525 Hz)

Meets ITU-T G.8251 and Telcordia
GR-253-CORE jitter specification 
Hitless input clock switching with
phase build-out

RATE0

Si5324
Si5324
Functional Block Diagram
Xtal or Refclock
CKIN1
÷ N31
CKIN2
÷ N32
®
DSPLL
Xtal/Refclock
Loss of Signal/
Frequency Offset
Loss of Lock
2
÷ NC1_LS
CKOUT1
÷ NC2_LS
CKOUT2
÷N1_HS
÷ N2
VDD (1.8, 2.5, or 3.3 V)
Control
Signal Detect
GND
I2C/SPI Port
Clock Select
Device Interrupt
Rate Select
Skew Adjust
Rev. 1.1
Si5324
TABLE O F C ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1. External Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2. Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3. Typical Phase Noise Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
4. Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
5.1. ICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
6. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
8. Package Outline: 36-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
9. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
10. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
10.1. Si5324 Top Marking (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
10.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Rev. 1.1
3
Si5324
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Symbol
Ambient Temperature
TA
Supply Voltage during
Normal Operation
VDD
Test Condition
Min
Typ
Max
Unit
–40
25
85
°C
3.3 V Nominal
2.97
3.3
3.63
V
2.5 V Nominal
2.25
2.5
2.75
V
1.8 V Nominal
1.71
1.8
1.89
V
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated.
SIGNAL +
Differential I/Os VICM , VOCM
V
VISE , VOSE
SIGNAL –
(SIGNAL +) – (SIGNAL –)
Differential Peak-to-Peak Voltage
VID,VOD
VICM, VOCM
Single-Ended
Peak-to-Peak Voltage
t
SIGNAL +
VID = (SIGNAL+) – (SIGNAL–)
SIGNAL –
Figure 1. Differential Voltage Characteristics
80%
CKIN, CKOUT
20%
tF
tR
Figure 2. Rise/Fall Time Characteristics
4
Rev. 1.1
Si5324
Table 2. DC Characteristics
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
IDD
LVPECL Format
622.08 MHz Out
Both CKOUTs Enabled
—
251
279
mA
LVPECL Format
622.08 MHz Out
1 CKOUT Enabled
—
217
243
mA
CMOS Format
19.44 MHz Out
Both CKOUTs Enabled
—
204
234
mA
CMOS Format
19.44 MHz Out
1 CKOUT Enabled
—
194
220
mA
Disable Mode
—
165
—
mA
1.8 V ± 5%
0.9
—
1.4
V
2.5 V ± 10%
1
—
1.7
V
3.3 V ± 10%
1.1
—
1.95
V
CKNRIN
Single-ended
20
40
60
kΩ
Single-Ended Input
Voltage Swing
(See Absolute Specs)
VISE
fCKIN < 212.5 MHz
See Figure 1.
0.2
—
—
VPP
fCKIN > 212.5 MHz
See Figure 1.
0.25
—
—
VPP
Differential Input
Voltage Swing
(See Absolute Specs)
VID
fCKIN < 212.5 MHz
See Figure 1.
0.2
—
—
VPP
fCKIN > 212.5 MHz
See Figure 1.
0.25
—
—
VPP
Supply Current1
CKINn Input Pins2
Input Common Mode
Voltage (Input Threshold Voltage)
Input Resistance
VICM
Notes:
1. Current draw is independent of supply voltage
2. No under- or overshoot is allowed.
3. LVPECL outputs require nominal VDD ≥ 2.5 V.
4. This is the amount of leakage that the 3-Level inputs can tolerate from an external driver. See Si53xx Family Reference
Manual for more details.
5. LVPECL, CML, LVDS and low-swing LVDS measured with Fo = 622.08 MHz.
Rev. 1.1
5
Si5324
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
CKOVCM
LVPECL 100  load lineto-line
VDD –
1.42
—
VDD –1.25
V
Differential Output
Swing
CKOVD
LVPECL 100  load lineto-line
1.1
—
1.9
VPP
Single Ended Output
Swing
CKOVSE
LVPECL 100  load lineto-line
0.5
—
0.93
VPP
Differential Output
Voltage
CKOVD
CML 100  load line-toline
350
425
500
mVPP
CKOVCM
CML 100  load line-toline
—
VDD-0.36
—
V
CKOVD
LVDS
100  load line-to-line
500
700
900
mVPP
Low Swing LVDS
100  load line-to-line
350
425
500
mVPP
CKOVCM
LVDS 100 load line-toline
1.125
1.2
1.275
V
CKORD
CML, LVPECL, LVDS
—
200
—

Output Voltage Low
CKOVOLLH
CMOS
—
—
0.4
V
Output Voltage High
CKOVOHLH
VDD = 1.71 V
CMOS
0.8 x
VDD
—
—
V
Output Clocks (CKOUTn)3,5
Common Mode
Common Mode Output
Voltage
Differential Output
Voltage
Common Mode Output
Voltage
Differential Output
Resistance
Notes:
1. Current draw is independent of supply voltage
2. No under- or overshoot is allowed.
3. LVPECL outputs require nominal VDD ≥ 2.5 V.
4. This is the amount of leakage that the 3-Level inputs can tolerate from an external driver. See Si53xx Family Reference
Manual for more details.
5. LVPECL, CML, LVDS and low-swing LVDS measured with Fo = 622.08 MHz.
6
Rev. 1.1
Si5324
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Output Drive Current
(CMOS driving into
CKOVOL for output low
or CKOVOH for output
high. CKOUT+ and
CKOUT– shorted
externally)
CKOIO
ICMOS[1:0] = 11
VDD = 1.8 V
—
7.5
—
mA
ICMOS[1:0] = 10
VDD = 1.8 V
—
5.5
—
mA
ICMOS[1:0] = 01
VDD = 1.8 V
—
3.5
—
mA
ICMOS[1:0] = 00
VDD = 1.8 V
—
1.75
—
mA
ICMOS[1:0] = 11
VDD = 3.3 V
—
32
—
mA
ICMOS[1:0] = 10
VDD = 3.3 V
—
24
—
mA
ICMOS[1:0] = 01
VDD = 3.3 V
—
16
—
mA
ICMOS[1:0] = 00
VDD = 3.3 V
—
8
—
mA
VDD = 1.71 V
—
—
0.5
V
VDD = 2.25 V
—
—
0.7
V
VDD = 2.97 V
—
—
0.8
V
VDD = 1.89 V
1.4
—
—
V
VDD = 2.25 V
1.8
—
—
V
VDD = 3.63 V
2.5
—
—
V
2-Level LVCMOS Input Pins
Input Voltage Low
Input Voltage High
VIL
VIH
Notes:
1. Current draw is independent of supply voltage
2. No under- or overshoot is allowed.
3. LVPECL outputs require nominal VDD ≥ 2.5 V.
4. This is the amount of leakage that the 3-Level inputs can tolerate from an external driver. See Si53xx Family Reference
Manual for more details.
5. LVPECL, CML, LVDS and low-swing LVDS measured with Fo = 622.08 MHz.
Rev. 1.1
7
Si5324
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
3-Level Input Pins4
Input Voltage Low
VILL
—
—
0.15 x VDD
V
Input Voltage Mid
VIMM
0.45 x
VDD
—
0.55 x VDD
V
Input Voltage High
VIHH
0.85 x
VDD
—
—
V
Input Low Current
IILL
See Note 4
–20
—
—
µA
Input Mid Current
IIMM
See Note 4
–2
—
+2
µA
Input High Current
IIHH
See Note 4
—
—
20
µA
VOL
IO = 2 mA
VDD = 1.71 V
—
—
0.4
V
IO = 2 mA
VDD = 2.97 V
—
—
0.4
V
IO = –2 mA
VDD = 1.71 V
VDD –
0.4
—
—
V
IO = –2 mA
VDD = 2.97 V
VDD –
0.4
—
—
V
LVCMOS Output Pins
Output Voltage Low
Output Voltage Low
Output Voltage High
Output Voltage High
VOH
Notes:
1. Current draw is independent of supply voltage
2. No under- or overshoot is allowed.
3. LVPECL outputs require nominal VDD ≥ 2.5 V.
4. This is the amount of leakage that the 3-Level inputs can tolerate from an external driver. See Si53xx Family Reference
Manual for more details.
5. LVPECL, CML, LVDS and low-swing LVDS measured with Fo = 622.08 MHz.
8
Rev. 1.1
Si5324
Table 3. AC Characteristics
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Single-Ended Reference Clock Input Pin XA (XB with cap to GND)
Input Resistance
XARIN
RATE[1:0] = LM, ML, MH,
or HM, ac coupled
—
12
—
k
Input Voltage Swing
XAVPP
RATE[1:0] = LM, ML, MH,
or HM, ac coupled
0.5
—
1.2
VPP
0.5
—
2.4
VPP
0.002
—
710
MHz
40
—
60
%
2
—
—
ns
—
—
3
pF
—
—
11
ns
N1  6
0.002
—
945
MHz
N1 = 5
970
—
1134
MHz
N1 = 4
1.213
—
1.4
GHz
—
—
212.5
MHz
Differential Reference Clock Input Pins (XA/XB)
Input Voltage Swing
XA/XBVPP
RATE[1:0] = LM, ML, MH,
or HM
CKINn Input Pins
Input Frequency
Input Duty Cycle
(Minimum Pulse Width)
CKNF
CKNDC
Input Capacitance
CKNCIN
Input Rise/Fall Time
CKNTRF
Whichever is smaller
(i.e., the 40% / 60%
limitation applies only
to high frequency
clocks)
20–80%
See Figure 2
CKOUTn Output Pins
(See ordering section for speed grade vs frequency limits)
Output Frequency
(Output not configured
for CMOS or
Disabled)
Maximum Output
Frequency in CMOS
Format
CKOF
CKOF
Notes:
1. Input to output phase skew after an ICAL is not controlled and can assume any value.
2. Lock and settle time performance is dependent on the frequency plan, the XAXB reference frequency, and LOCKT
setting (see application note, “AN803: Lock and Settling Time Considerations for Si5324/27/69/74 Any-Frequency
Jitter Attenuating Clock ICs”. Visit the Silicon Labs Technical Support web page at:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx to submit a technical support request regarding
the lock time of your frequency plan.
3. LOCKT = 3.3 ms
Rev. 1.1
9
Si5324
Table 3. AC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Output Rise/Fall
(20–80 %) @
622.08 MHz output
CKOTRF
Output not configured for
CMOS or Disabled
See Figure 2
—
230
350
ps
Output Rise/Fall
(20–80%) @
212.5 MHz output
CKOTRF
CMOS Output
VDD = 1.71
CLOAD = 5 pF
—
—
8
ns
Output Rise/Fall
(20–80%) @
212.5 MHz output
CKOTRF
CMOS Output
VDD = 2.97
CLOAD = 5 pF
—
—
2
ns
Output Duty Cycle
Uncertainty @
622.08 MHz
CKODC
100  Load
Line-to-Line
Measured at 50% Point
(Not for CMOS)
—
—
+/-40
ps
LVCMOS Input Pins
Minimum Reset Pulse
Width
tRSTMN
Reset to Microprocessor Access Ready
tREADY
1
µs
10
ms
LVCMOS Output Pins
tRF
CLOAD = 20pf
See Figure 2
—
25
—
ns
LOSn Trigger Window
LOSTRIG
From last CKINn to 
Internal detection of LOSn
N3 ≠ 1
—
—
4.5 x N3
TCKIN
Time to Clear LOL after
LOS Cleared
tCLRLOL
LOS to LOL
Fold = Fnew
Stable Xa/XB reference
—
10
—
ms
Rise/Fall Times
Notes:
1. Input to output phase skew after an ICAL is not controlled and can assume any value.
2. Lock and settle time performance is dependent on the frequency plan, the XAXB reference frequency, and LOCKT
setting (see application note, “AN803: Lock and Settling Time Considerations for Si5324/27/69/74 Any-Frequency
Jitter Attenuating Clock ICs”. Visit the Silicon Labs Technical Support web page at:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx to submit a technical support request regarding
the lock time of your frequency plan.
3. LOCKT = 3.3 ms
10
Rev. 1.1
Si5324
Table 3. AC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Output Clock Skew
tSKEW
 of CKOUTn to  of
CKOUT_m, CKOUTn
and CKOUT_m at same
frequency and signal
format
PHASEOFFSET = 0
CKOUT_ALWAYS_ON = 1
SQ_ICAL = 1
—
—
100
ps
Phase Change due to
Temperature Variation1
tTEMP
Max phase changes from
–40 to +85 °C
—
300
500
ps
—
1
1.5
s
—
0.8
1.0
—
1.2
1.5
—
4.2
5.0
—
200
—
ps
—
0.05
0.1
dB
5000/BW
—
—
ns pk-pk
Device Skew
PLL Performance
(fin = fout = 622.08 MHz; BW = 7 Hz; LVPECL, XAXB = 114.285 MHz)
Lock Time2
Si5324E-C-GM3
tLOCKMP
Start of ICAL to of LOL
Si5324A/B/C/D-C-GM
Settle Time2
Si5324E-C-GM
tSETTLE
Start of ICAL to Fout within
5 ppm of final value
Si5324A/B/C/D-C-GM
Output Clock Phase
Change
tP_STEP
Closed Loop Jitter
Peaking
JPK
Jitter Tolerance
JTOL
After clock switch
f3  128 kHz
Jitter Frequency Loop
Bandwidth
s
Notes:
1. Input to output phase skew after an ICAL is not controlled and can assume any value.
2. Lock and settle time performance is dependent on the frequency plan, the XAXB reference frequency, and LOCKT
setting (see application note, “AN803: Lock and Settling Time Considerations for Si5324/27/69/74 Any-Frequency
Jitter Attenuating Clock ICs”. Visit the Silicon Labs Technical Support web page at:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx to submit a technical support request regarding
the lock time of your frequency plan.
3. LOCKT = 3.3 ms
Rev. 1.1
11
Si5324
Table 3. AC Characteristics (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Phase Noise
fout = 622.08 MHz
Symbol
Test Condition
Min
Typ
Max
Unit
CKOPN
100 Hz Offset
—
–90
—
dBc/Hz
1 kHz Offset
—
–106
—
dBc/Hz
10 kHz Offset
—
–121
—
dBc/Hz
100 kHz Offset
—
–132
—
dBc/Hz
1 MHz Offset
—
–132
—
dBc/Hz
Subharmonic Noise
SPSUBH
Phase Noise @ 100 kHz
Offset
—
–88
–76
dBc
Spurious Noise
SPSPUR
Max spur @ n x F3
(n  1, n x F3 < 100 MHz)
—
–93
–70
dBc
Notes:
1. Input to output phase skew after an ICAL is not controlled and can assume any value.
2. Lock and settle time performance is dependent on the frequency plan, the XAXB reference frequency, and LOCKT
setting (see application note, “AN803: Lock and Settling Time Considerations for Si5324/27/69/74 Any-Frequency
Jitter Attenuating Clock ICs”. Visit the Silicon Labs Technical Support web page at:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx to submit a technical support request regarding
the lock time of your frequency plan.
3. LOCKT = 3.3 ms
12
Rev. 1.1
Si5324
Table 4. Microprocessor Control
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
I2C Bus Lines (SDA, SCL)
Input Voltage Low
VILI2C
—
—
0.25 x VDD
V
Input Voltage High
VIHI2C
0.7 x VDD
—
VDD
V
VDD = 1.8V
0.1 x VDD
—
—
V
VDD = 2.5 or 3.3 V
0.05 x VDD
—
—
V
VDD = 1.8 V
IO = 3 mA
—
—
0.2 x VDD
V
VDD = 2.5 or 3.3 V
IO = 3 mA
—
—
0.4
V
Hysteresis of Schmitt
trigger inputs
Output Voltage Low
VHYSI2C
VOLI2C
Rev. 1.1
13
Si5324
Table 4. Microprocessor Control (Continued)
(VDD = 1.8 ± 5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Duty Cycle, SCLK
tDC
SCLK = 10 MHz
40
—
60
%
Cycle Time, SCLK
tc
100
—
—
ns
Rise Time, SCLK
tr
20–80%
—
—
25
ns
Fall Time, SCLK
tf
20–80%
—
—
25
ns
Low Time, SCLK
tlsc
20–20%
30
—
—
ns
High Time, SCLK
thsc
80–80%
30
—
—
ns
Delay Time, SCLK Fall
to SDO Active
td1
—
—
25
ns
Delay Time, SCLK Fall
to SDO Transition
td2
—
—
25
ns
Delay Time, SS Rise
to SDO Tri-state
td3
—
—
25
ns
Setup Time, SS to
SCLK Fall
tsu1
25
—
—
ns
Hold Time, SS to
SCLK Rise
th1
20
—
—
ns
Setup Time, SDI to
SCLK Rise
tsu2
25
—
—
ns
Hold Time, SDI to
SCLK Rise
th2
20
—
—
ns
Delay Time between
Slave Selects
tcs
25
—
—
ns
SPI Specifications
14
Rev. 1.1
Si5324
Table 5. Jitter Generation
Parameter
Jitter Gen
OC-192
Symbol
JGEN
Test Condition*
Measurement
Filter
DSPLL
BW2
0.02–80 MHz
120 Hz
4–80 MHz
0.05–80 MHz
Jitter Gen
OC-48
JGEN
0.12–20 MHz
Min
Typ
Max
GR-253Specification
Unit
—
4.2
6.2
30
psPP
—
.27
.42
N/A
psrms
—
3.7
6.4
10
psPP
—
.14
0.31
N/A
psrms
—
4.4
6.9
10
psPP
—
.26
0.41
1.0
ps rms
—
3.5
5.4
40.2
psPP
—
.27
0.41
4.02
ps rms
120 Hz
120 Hz
120 Hz
*Note: Test conditions:
1. fIN = fOUT = 622.08 MHz
2.
Clock input: LVPECL
3.
Clock output: LVPECL
4.
PLL bandwidth: 120 Hz
5.
114.285 MHz 3rd OT crystal used as XA/XB input
6.
VDD = 2.5 V
7.
TA = 85 °C
Table 6. Thermal Characteristics
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Value
Unit
Thermal Resistance Junction to Ambient
JA
Still Air
32
C°/W
Thermal Resistance Junction to Case
JC
Still Air
14
C°/W
Rev. 1.1
15
Si5324
Table 7. Absolute Maximum Ratings*
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
—
3.8
V
VDD+0.3
V
DC Supply Voltage
VDD
–0.5
LVCMOS Input Voltage
VDIG
–0.3
CKINn Voltage Level Limits
CKNVIN
0
—
VDD
V
XA/XB Voltage Level Limits
XAVIN
0
—
1.2
V
Operating Junction Temperature
TJCT
–55
—
150
ºC
Storage Temperature Range
TSTG
–55
—
150
ºC
2
—
—
kV
ESD MM Tolerance; All pins
except CKIN+/CKIN–
150
—
—
V
ESD HBM Tolerance
(100 pF, 1.5 k); CKIN+/CKIN–
750
—
—
V
ESD MM Tolerance;
CKIN+/CKIN–
100
—
—
V
ESD HBM Tolerance
(100 pF, 1.5 k); All pins except
CKIN+/CKIN–
Latch-up Tolerance
JESD78 Compliant
*Note: Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions specified in the operation sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods of time may affect device reliability.
16
Rev. 1.1
Si5324
2. Typical Application Circuits
C4 1 µF
System
Power
Supply
C1 0.1 µF
Ferrite
Bead
C2 0.1 µF
VDD = 3.3 V
C3 0.1 µF
130 
CKIN1–
82 
Input
Clock
Sources*
GND PAD
GND
CKIN1+
VDD
130 
+
100 
–
CKOUT1–
82 
0.1 µF
0.1 µF
Clock Outputs
CKOUT2+
VDD = 3.3 V
130 
0.1 µF
CKOUT1+
+
100 
–
CKOUT2–
130 
0.1 µF
CKIN2+
CKIN2–
82 
82 
Option 1:
Si5324
INT_C1B
Interrupt/CKIN_1 Invalid Indicator
C2B
CKIN_2 Invalid Indicator
LOL
PLL Loss of Lock Indicator
XA
114.285 MHz Crystal
XB
VDD
15 k
Crystal/Ref Clk Rate
A[2:0]
RATE[1:0]2
15 k
Option 2:
0.1 µF
Refclk+
Refclk–
Control Mode (L)
Reset
XA
0.1 µF
Serial Port Address
SDA
Serial Data
SCL
Serial Clock
I2C Interface
XB
CS_CA
CMODE
Clock Select/Clock Active
RST
Notes: 1. Assumes differential LVPECL termination (3.3 V) on clock inputs.
2. Denotes tri-level input pins with states designated as L (ground), M (VDD/2), and H (VDD).
Figure 3. Si5324 Typical Application Circuit (I2C Control Mode)
Rev. 1.1
17
Si5324
C4 1 µF
System
Power
Supply
C1 0.1 µF
Ferrite
Bead
C2 0.1 µF
VDD = 3.3 V
C3 0.1 µF
130 
82 
Input
Clock
Sources*
82 
GND PAD
CKIN1+
GND
VDD
130 
0.1 µF
CKOUT1+
+
100 
–
CKOUT1–
CKIN1–
0.1 µF
0.1 µF
Clock Outputs
CKOUT2+
VDD = 3.3 V
130 
+
100 
–
CKOUT2–
130 
0.1 µF
CKIN2+
82 
82 
Option 1:
CKIN2–
Si5324
XA
INT_C1B
Interrupt/CLKIN_1 Invalid Indicator
C2B
CLKIN_2 Invalid Indicator
LOL
PLL Loss of Lock Indicator
SS
Slave Select
114.285 MHz Crystal
XB
VDD
15 k
RATE[1:0]2
Crystal/Ref Clk Rate
15 k
Option 2:
SDO
0.1 µF
Refclk+
Refclk–
Control Mode (H)
Reset
SDI
XA
0.1 µF
SCLK
XB
CMODE
CS_CA
Serial Data Out
Serial Clock
Clock Select/Clock Active
RST
Notes: 1. Assumes differential LVPECL termination (3.3 V) on clock inputs.
2. Denotes tri-level input pins with states designated as L (ground), M (VDD/2), and H (VDD).
Figure 4. Si5324 Typical Application Circuit (SPI Control Mode)
18
Rev. 1.1
SPI Interface
Serial Data In
Si5324
3. Functional Description
Xtal or Refclock
CKIN1
÷ N31
CKIN2
÷ N32
®
DSPLL
Xtal/Refclock
Loss of Signal/
Frequency Offset
Loss of Lock
÷ NC1_LS
CKOUT1
÷ NC2_LS
CKOUT2
÷N1_HS
÷ N2
VDD (1.8, 2.5, or 3.3 V)
Control
Signal Detect
GND
I2C/SPI Port
Clock Select
Device Interrupt
Rate Select
Skew Adjust
Figure 5. Si5324 Functional Block Diagram
The Si5324 is a low loop bandwidth, jitter-attenuating
clock multiplier for high performance applications. The
Si5324 accepts two input clocks ranging from 2 kHz to
710 MHz and generates two output clocks ranging from
2 kHz to 945 MHz and select frequencies to 1.4 GHz.
The Si5324 can also use its external reference as a
clock source for frequency synthesis. The device
provides virtually any frequency translation combination
across this operating range. Independent dividers are
available for each input clock and output clock, so the
Si5324 can accept input clocks at different frequencies
and it can generate output clocks at different
frequencies. The Si5324 input clock frequency and
clock multiplication ratio are programmable through an
I2C or SPI interface. Silicon Laboratories offers a PCbased software utility, DSPLLsim, that can be used to
determine the optimum PLL divider settings for a given
input frequency/clock multiplication ratio combination
that minimizes phase noise and power consumption.
This
utility
can
be
downloaded
from
http://www.silabs.com/timing.
The Si5324 is based on Silicon Laboratories' 3rdgeneration DSPLL® technology, which provides anyfrequency synthesis and jitter attenuation in a highly
integrated PLL solution that eliminates the need for
external VCXO and loop filter components. The Si5324
PLL loop bandwidth is digitally programmable and
supports a range from 4 Hz to 525 Hz. A fast lock
feature is available to reduce lock times inherent with
low loop bandwidth PLLs. The DSPLLsim software
utility can be used to calculate valid loop bandwidth
settings for a given input clock frequency/clock
multiplication ratio.
The Si5324 supports hitless switching between the two
synchronous input clocks in compliance with Telcordia
GR-253-CORE that greatly minimizes the propagation
of phase transients to the clock outputs during an input
clock transition (maximum 200 ps phase change).
Manual and automatic revertive and non-revertive input
clock switching options are available. The Si5324
monitors both input clocks for loss-of-signal (LOS) and
provides a LOS alarm when it detects missing pulses on
either input clock. The device monitors the lock status of
the PLL. The lock detect algorithm works by
continuously monitoring the phase of the input clock in
relation to the phase of the feedback clock. Due to the
low loop bandwidth of the part, the LOL indicator clears
before the loop fully settles (see “AN803: Lock and Settling
Time Considerations for Si5324/27/69/74 Any-Frequency
Jitter Attenuating Clock ICs” for additional details).
The Si5324 also monitors frequency offset alarms
(FOS), which indicate if an input clock is within a
specified frequency ppm accuracy relative to the
frequency of an XA/XB reference clock. Both Stratum
3/3E and SONET Minimum Clock (SMC) FOS
thresholds are supported.
The Si5324 provides a digital hold capability that allows
the device to continue generation of a stable output
clock when the selected input reference is lost. During
digital hold, the DSPLL generates an output frequency
based on a historical average frequency that existed a
fixed amount of time before the error event occurred,
eliminating the effects of phase and frequency
transients that may occur immediately preceding digital
hold.
Rev. 1.1
19
Si5324
The Si5324 has two differential clock outputs. The
signal format of each clock output is independently
programmable to support LVPECL, LVDS, CML, or
CMOS loads. When configured for CMOS, four clock
outputs are available. If not required, the second clock
output can be powered down to minimize power
consumption. In addition, the phase of one output clock
may be adjusted in relation to the phase of the other
output clock. The resolution varies from 800 ps to 2.2 ns
depending on the PLL divider settings. The DSPLLsim
software utility determines the phase offset resolution
for a given combination of input clock and multiplication
ratio. For system-level debugging, a bypass mode is
available which drives the output clock directly from the
input clock, bypassing the internal DSPLL. The device is
powered by a single 1.8, 2.5, or 3.3 V supply with bestin-class PSNR.
3.2. Additional Documentation
Consult the Silicon Laboratories Any-Frequency
Precision Clock Family Reference Manual (FRM) for
detailed information about the Si5324. Additional design
support is available from Silicon Laboratories through
your distributor.
Silicon Laboratories offers a PC-based software utility
called DSPLLsim to simplify device configuration,
including frequency planning and loop bandwidth
selection. The FRM and this utility can be downloaded
from http://www.silabs.com/timing (see “AN803: Lock and
Settling Time Considerations for Si5324/27/69/74 AnyFrequency Jitter Attenuating Clock ICs” for additional details).
3.1. External Reference
An external, high quality 38.88 MHz clock or a low-cost
114.285 MHz 3rd overtone crystal or external reference
is used as part of a fixed-frequency oscillator within the
DSPLL. This external reference is required for the
device to perform jitter attenuation. Specific
recommendations can be found in the Family Reference
Manual.
In digital hold, the DSPLL remains locked and tracks the
external reference. Note that crystals can have
temperature sensitivities.
Due to the low bandwidth capabilities of this part, any
low-frequency wander or instability on the external
reference will transfer to the output clocks. To address
this issue, a stable external reference, TXCO, OCXO, or
thermally-isolated crystal is recommended.
For example, with a 20 ppm oscillator as the reference
on the XA/XB pins, temperature changes cause the
oscillator to change frequency slightly. Although the
Si5324 is locked to its input on CLKIN, it also uses the
XA/XB as a reference.
If there is a need to use a reference oscillator instead of
a crystal, Silicon Labs does not recommend using
MEMS based oscillators. Instead, Silicon Labs
recommends the Si530EB121M109DG, which is a very
low-jitter/wander, LVPECL, 2.5 V crystal oscillator. The
very low loop BW of the Si5324 means that it can be
susceptible to XAXB reference sources that have high
wander. Experience has shown that in spite of having
low jitter, some MEMs oscillators have high wander, and
these devices should be avoided. Contact Silicon Labs
for details.
20
Rev. 1.1
Si5324
3.3. Typical Phase Noise Performance
Figure 6. Broadcast Video
Table 8. Broadcast Video Jitter1
Jitter Bandwidth2
Jitter (Peak-Peak)
Jitter (RMS)
10 Hz to 20 MHz
5.24 ps
484 fs
Notes:
1. Number of samples: 8.91E9.
2. Jitter integration bands include low-pass (–20 dB/Dec) and hi-pass (–60 dB/Dec) rolloffs per Telecordia GR-253-CORE.
Rev. 1.1
21
Si5324
Figure 7. OTN/SONET/SDH Phase Noise
Note: Phase noise plot uses brick wall integration.
Table 9. SONET Jitter
Jitter Bandwidth*
Jitter, RMS
SONET_OC48, 12 kHz to 20 MHz
266 fs
SONET_OC192_A, 20 kHz to 80 MHz
283 fs
SONET_OC192_B, 4 MHz to 80 MHz
155 fs
SONET_OC192_C, 50 kHz to 80 MHz
275 fs
Brick Wall_800 Hz to 80 MHz
287 fs
*Note: Jitter integration bands include low-pass (–20 dB/Dec) and hi-pass (–60 dB/Dec) roll-offs
per Telecordia GR-253-CORE.
22
Rev. 1.1
Si5324
Figure 8. Wireless Base Station Phase Noise
Table 10. Wireless Base Station Jitter*
Jitter Bandwidth
Jitter (peak-peak)
Jitter (RMS)
10 Hz to 20 MHz
7.28 ps
581 fs
Note: Number of samples: 8.91E9
Rev. 1.1
23
Si5324
4. Register Map
All register bits that are not defined in this map should always be written with the specified Reset Values. The
writing to these bits of values other than the specified Reset Values may result in undefined device behavior.
Registers not listed, e.g. Register 64, should never be written to.
Register
D7
0
D6
D5
D4
FREE_RUN
CKOUT_
ALWAYS_ON
D3
D2
D1
BYPASS_REG
1
CK_PRIOR2[1:0]
2
CK_PRIOR1[1:0]
BWSEL_REG[3:0]
3
CKSEL_REG[1:0]
4
AUTOSEL_REG[1:0]
5
ICMOS[1:0]
DHOLD
SQ_ICAL
HST_DEL[4:0]
6
SFOUT2_REG[2:0}
SFOUT1_REG[2:0]
7
8
FOSREFSEL[2:0]
HLOG_2[1:0]
HLOG_1[1:0]
9
HIST_AVG[4:0]
10
DSBL2_ REG
DSBL1_ REG
11
19
D0
PD_CK2
FOS_EN
FOS_THR[1:0]
20
VALTIME[1:0]
CK2_BAD_PIN
PD_CK1
LOCK[T2:0]
CK1_ BAD_ PIN
LOL_PIN
INT_PIN
CK1_ACTV_PIN
CKSEL_PIN
CK_BAD_ POL
LOL_POL
INT_POL
23
LOS2_MSK
LOS1_MSK
LOSX_MSK
24
FOS2_MSK
FOS1_MSK
LOL_MSK
21
22
25
CK_ACTV_ POL
N1_HS[2:0]
31
NC1_LS[19:16]
32
NC1_LS[15:8]
33
NC1_LS[7:0]
34
NC2_LS[19:16]
35
NC2_LS[15:8]
36
NC2_LS[7:0]
40
N2_HS[2:0]
N2_LS[19:16]
41
N2_LS[15:8]
42
N2_LS[7:0]
43
N31[18:16]
44
N31[15:8]
45
N31[7:0]
46
24
N32[18:16]
Rev. 1.1
Si5324
Register
D7
D6
D5
D4
D3
47
N32[15:8]
48
N32[7:0]
55
D2
D1
CLKIN2RATE[2:0]
CLKIN1RATE[2:0]
128
CK2_ACTV_REG CK1_ACTV_REG
129
130
DIGHOLDVALID
131
132
FOS2_FLG
134
LOS2_INT
LOS1_INT
LOSX_INT
FOS2_INT
FOS1_INT
LOL_INT
LOS2_FLG
LOS1_FLG
LOSX_FLG
FOS1_FLG
LOL_FLG
PARTNUM_RO[11:4]
135
136
D0
PARTNUM_RO[3:0]
RST_REG
REVID_RO[3:0]
ICAL
137
FASTLOCK
138
139
LOS2_EN[0:0] LOS1_EN[0:0]
142
INDEPENDENTSKEW1[7:0]
143
INDEPENDENTSKEW2[7:0]
LOS2_EN [1:1]
LOS1_EN [1:1]
FOS2_EN
FOS1_EN
Table 11. CKOUT_ALWAYS_ON and SQ_ICAL Truth Table
CKOUT_ALWAYS_ON
SQ_ICAL
Results
0
0
CKOUT OFF until after the first ICAL
0
1
CKOUT OFF until after the first successful
ICAL (i.e., when LOL is low)
1
0
CKOUT always ON, including during an ICAL
1
1
CKOUT always ON, including during an ICAL.
Use these settings to preserve output-to-output
skew
Rev. 1.1
25
Si5324
5. Register Descriptions
Register 0.
Bit
D7
Name
Type
D6
D5
FREE_RUN
CKOUT_
ALWAYS_ON
R/W
R/W
R
D4
D3
D2
D1
D0
BYPASS_
REG
R
R
R
R/W
R
Reset value = 0001 0100
Bit
Name
7
Reserved
6
FREE_RUN
5
Function
Reserved.
Free Run.
Internal to the device, route XA/XB to CKIN2. This allows the device to lock to its XA-XB
reference.
0: Disable
1: Enable
CKOUT_
CKOUT Always On.
ALWAYS_ON This will bypass the SQ_ICAL function. Output will be available even if SQ_ICAL is on
and ICAL is not complete or successful. See Table 11 on page 25.
0: Squelch output until part is calibrated (ICAL).
1: Provide an output.
Notes:
1. The frequency may be significantly off until the part is calibrated.
2. Must be 1 to control output to output skew.
26
4:2
Reserved
Reserved.
1
BYPASS_
REG
Bypass Register.
This bit enables or disables the PLL bypass mode. Use only when the device is in digital
hold or before the first ICAL. Bypass mode is not supported for CMOS output clocks.
0: Normal operation
1: Bypass mode. Selected input clock is connected to CKOUT buffers, bypassing PLL.
0
Reserved
Reserved.
Rev. 1.1
Si5324
Register 1.
Bit
D7
D6
D5
D4
Name
Type
R
R
R
D3
D2
D1
D0
CK_PRIOR2 [1:0]
CK_PRIOR1 [1:0]
R/W
R/W
R
Reset value = 1110 0100
Bit
Name
Function
7:4
Reserved
3:2
CK_PRIOR2
[1:0]
CK_PRIOR 2.
Selects which of the input clocks will be 2nd priority in the autoselection state machine.
00: CKIN1 is 2nd priority.
01: CKIN2 is 2nd priority.
10: Reserved
11: Reserved
1:0
CK_PRIOR1
[1:0]
CK_PRIOR 1.
Selects which of the input clocks will be 1st priority in the autoselection state machine.
00: CKIN1 is 1st priority.
01: CKIN2 is 1st priority.
10: Reserved
11: Reserved
Reserved.
Register 2.
Bit
D7
D6
D5
Name
BWSEL_REG [3:0]
Type
R/W
D4
D3
D2
D1
D0
R
R
R
R
Reset value = 0100 0010
Bit
7:4
3:0
Name
Function
BWSEL_REG BWSEL_REG.
[3:0]
Selects nominal f3dB bandwidth for PLL. See the DSPLLsim for settings. After
BWSEL_REG is written with a new value, an ICAL is required for the change to take
effect.
Reserved
Reserved.
Rev. 1.1
27
Si5324
Register 3.
Bit
D7
D6
D5
D4
Name
CKSEL_REG [1:0]
DHOLD
SQ_ICAL
Type
R/W
R/W
R/W
D3
D2
D1
D0
R
R
R
R
Reset value = 0000 0101
Bit
7:6
28
Name
Function
CKSEL_REG CKSEL_REG.
[1:0]
If the device is operating in register-based manual clock selection mode
(AUTOSEL_REG = 00), and CKSEL_PIN = 0, then these bits select which input clock
will be the active input clock. If CKSEL_PIN = 1 and AUTOSEL_REG = 00, the CS_CA
input pin continues to control clock selection and CKSEL_REG is of no consequence.
00: CKIN_1 selected.
01: CKIN_2 selected.
10: Reserved
11: Reserved
DHOLD.
Forces the part into digital hold. This bit overrides all other manual and automatic clock
selection controls.
0: Normal operation.
1: Force digital hold mode. Overrides all other settings and ignores the quality of all of the
input clocks.
5
DHOLD
4
SQ_ICAL
SQ_ICAL.
This bit determines if the output clocks will remain enabled or be squelched (disabled)
during an internal calibration. See Table 11 on page 25.
0: Output clocks enabled during ICAL.
1: Output clocks disabled during ICAL.
3:0
Reserved
Reserved.
Rev. 1.1
Si5324
Register 4.
Bit
D7
D6
Name
AUTOSEL_REG [1:0]
Type
R/W
D5
D4
D3
D2
D1
D0
HIST_DEL [4:0]
R
R/W
Reset value = 0001 0010
Bit
Name
7:6
AUTOSEL_
REG [1:0]
Function
AUTOSEL_REG [1:0].
Selects method of input clock selection to be used.
00: Manual (either register or pin controlled, see CKSEL_PIN)
01: Automatic Non-Revertive
10: Automatic Revertive
11: Reserved
5
Reserved
Reserved.
4:0
HIST_DEL
[4:0]
HIST_DEL [4:0].
Selects amount of delay to be used in generating the history information used for Digital
Hold.
Register 5.
Bit
D7
D6
Name
ICMOS [1:0]
Type
R/W
D5
D4
D3
D2
D1
D0
R
R
R
R
R
R
Reset value = 1110 1101
Bit
Name
Function
7:6
ICMOS [1:0]
ICMOS [1:0].
When the output buffer is set to CMOS mode, these bits determine the output buffer drive
strength. The first number below refers to 3.3 V operation; the second to 1.8 V operation.
These values assume CKOUT+ is tied to CKOUT-.
00: 8mA/2mA.
01: 16mA/4mA
10: 24mA/6mA
11: 32mA/8mA
5:0
Reserved
Reserved.
Rev. 1.1
29
Si5324
Register 6.
Bit
D7
D6
Name
Type
R
R
D5
D4
D3
D2
D1
SFOUT2_REG [2:0]
SFOUT1_REG [2:0]
R/W
R/W
D0
Reset value = 0010 1101
30
Bit
Name
Function
7:6
Reserved
Reserved.
5:3
SFOUT2_
REG [2:0]
SFOUT2_REG [2:0].
Controls output signal format and disable for CKOUT2 output buffer. Bypass mode is not
supported for CMOS output clocks.
000: Reserved
001: Disable
010: CMOS
011: Low swing LVDS
100: Reserved
101: LVPECL
110: CML
111: LVDS
2:0
SFOUT1_
REG [2:0]
SFOUT1_REG [2:0].
Controls output signal format and disable for CKOUT1 output buffer. Bypass mode is not
supported for CMOS output clocks.
000: Reserved
001: Disable
010: CMOS
011: Low swing LVDS
100: Reserved
101: LVPECL
110: CML
111: LVDS
Rev. 1.1
Si5324
Register 7.
Bit
D7
D6
D5
D4
D3
Name
Type
D2
D1
D0
FOSREFSEL [2:0]
R
R
R
R
R
R/W
Reset value = 0010 1010
Bit
Name
7:3
Reserved.
2:0
Function
Reserved.
FOSREFSEL FOSREFSEL [2:0].
[2:0]
Selects which input clock is used as the reference frequency for Frequency Off-Set
(FOS) alarms.
000: XA/XB (External reference)
001: CKIN1
010: CKIN2
011: Reserved
100: Reserved
101: Reserved
110: Reserved
111: Reserved
Rev. 1.1
31
Si5324
Register 8.
Bit
D7
D6
D5
D4
Name
HLOG_2[1:0]
HLOG_1[1:0]
Type
R/W
R/W
D3
D2
D1
D0
R
R
R
R
Reset value = 0000 0000
Bit
Name
Function
7:6
HLOG_2 [1:0] HLOG_2 [1:0].
00: Normal operation
01: Holds CKOUT2 output at static logic 0.
Entrance and exit from this state will occur without glitches or runt pulses.
10:Holds CKOUT2 output at static logic 1.
Entrance and exit from this state will occur without glitches or runt pulses.
11: Reserved
5:4
HLOG_1 [1:0] HLOG_1 [1:0].
00: Normal operation
01: Holds CKOUT1 output at static logic 0.
Entrance and exit from this state will occur without glitches or runt pulses.
10: Holds CKOUT1 output at static logic 1.
Entrance and exit from this state will occur without glitches or runt pulses.
11: Reserved
3:0
Reserved
Reserved.
Register 9.
Bit
D7
D6
D5
Name
HIST_AVG [4:0]
Type
R/W
D4
D3
D2
D1
D0
R
R
R
Reset value = 1100 0000
32
Bit
Name
Function
7:3
HIST_AVG
[4:0]
HIST_AVG [4:0].
Selects amount of averaging time to be used in generating the history information for
Digital Hold.
2:0
Reserved
Reserved.
Rev. 1.1
Si5324
Register 10.
Bit
D7
D6
D5
D4
Name
Type
R
R
R
D3
D2
DSBL2_REG
DSBL1_REG
R/W
R/W
R
D1
D0
R
R
Reset value = 0000 0000
Bit
Name
7:4
Reserved
Function
Reserved.
3
DSBL2_REG DSBL2_REG.
This bit controls the powerdown of the CKOUT2 output buffer. If disable mode is
selected, the NC2_LS output divider is also powered down.
0: CKOUT2 enabled.
1: CKOUT2 disabled.
2
DSBL1_REG DSBL1_REG.
This bit controls the powerdown of the CKOUT1 output buffer. If disable mode is
selected, the NC1_LS output divider is also powered down.
0: CKOUT1 enabled.
1: CKOUT1 disabled.
1:0
Reserved
Reserved.
Register 11.
Bit
D7
D6
D5
D4
D3
D2
Name
Type
R
R
R
R
R
R
D1
D0
PD_CK2
PD_CK1
R/W
R/W
Reset value = 0100 0000
Bit
Name
Function
7:2
Reserved
Reserved.
1
PD_CK2
PD_CK2.
This bit controls the powerdown of the CKIN2 input buffer.
0: CKIN2 enabled.
1: CKIN2 disabled.
0
PD_CK1
PD_CK1.
This bit controls the powerdown of the CKIN1 input buffer.
0: CKIN1 enabled.
1: CKIN1 disabled.
Rev. 1.1
33
Si5324
Register 19.
Bit
D7
D6
D5
D4
D3
D2
D1
Name
FOS_EN
FOS_THR [1:0]
VALTIME [1:0]
LOCKT [2:0]
Type
R/W
R/W
R/W
R/W
D0
Reset value = 0010 1100
Bit
Name
Function
7
FOS_EN
FOS_EN.
Frequency Offset Enable globally disables FOS. See the individual FOS enables (FOSx_EN, register 139).
0: FOS disable
1: FOS enabled by FOSx_EN
6:5
FOS_THR [1:0] FOS_THR [1:0].
Frequency Offset at which FOS is declared:
00: ± 11 to 12 ppm (Stratum 3/3E compliant, with a Stratum 3/3E used for REFCLK
01: ± 48 to 49 ppm (SMC)
10: ± 30 ppm (SONET Minimum Clock (SMC), with a Stratum 3/3E used for REFCLK.
11: ± 200 ppm
4:3
VALTIME [1:0] VALTIME [1:0].
Sets amount of time for input clock to be valid before the associated alarm is removed.
00: 2 ms
01: 100 ms
10: 200 ms
11: 13 seconds
2:0
LOCKT [2:0]
LOCKT [2:0].
Sets retrigger interval for one shot monitoring phase detector output. One shot is triggered by phase slip in DSPLL. Refer to the Family Reference Manual for more details.
To minimize lock time, the value 001 for LOCKT is recommended (see “AN803: Lock and
Settling Time Considerations for Si5324/27/69/74 Any-Frequency Jitter Attenuating Clock ICs” for
additional details).
000: 106 ms
001: 53 ms
010: 26.5 ms
011: 13.3 ms
100: 6.6 ms
101: 3.3 ms
110: 1.66 ms
111: .833 ms
34
Rev. 1.1
Si5324
Register 20.
Bit
D7
D6
D5
D4
Name
Type
R
R
R
R
D3
D2
D1
D0
CK2_BAD_PIN
CK1_BAD_PIN
LOL_PIN
INT_PIN
R/W
R/W
R/W
R/W
Reset value = 0011 1110
Bit
Name
7:4
Reserved
Function
Reserved.
3
CK2_BAD_PIN CK2_BAD_PIN.
The CK2_BAD status can be reflected on the C2B output pin.
0: C2B output pin tristated
1: C2B status reflected to output pin
2
CK1_BAD_PIN CK1_BAD_PIN.
The CK1_BAD status can be reflected on the C1B output pin.
0: C1B output pin tristated
1: C1B status reflected to output pin
1
LOL_PIN
LOL_PIN.
The LOL_INT status bit can be reflected on the LOL output pin.
0: LOL output pin tristated
1: LOL_INT status reflected to output pin
0
INT_PIN
INT_PIN.
Reflects the interrupt status on the INT_C1B output pin.
0: Interrupt status not displayed on INT_C1B output pin. If CK1_BAD_PIN = 0, INT_C1B
output pin is tristated.
1: Interrupt status reflected to output pin. Instead, the INT_C1B pin indicates when
CKIN1 is bad.
Rev. 1.1
35
Si5324
Register 21.
Bit
D7
D6
D5
D4
D3
D2
Name
Type
R
R
R
R
R
R
D1
D0
CK1_ACTV_PIN
CKSEL_ PIN
R/W
R/W
Reset value = 1111 1111
Bit
Name
7:2
Reserved
1
0
36
Function
Reserved.
CK1_ACTV_PIN CK1_ACTV_PIN.
The CK1_ACTV_REG status bit can be reflected to the CS_CA output pin using the
CK1_ACTV_PIN enable function. CK1_ACTV_PIN is of consequence only when pin
controlled clock selection is not being used.
0: CS_CA output pin tristated.
1: Clock Active status reflected to output pin.
CKSEL_PIN
CKSEL_PIN.
If manual clock selection is being used, clock selection can be controlled via the
CKSEL_REG[1:0] register bits or the CS_CA input pin. This bit is only active when
AUTOSEL_REG = Manual.
0: CS_CA pin is ignored. CKSEL_REG[1:0] register bits control clock selection.
1: CS_CA input pin controls clock selection.
Rev. 1.1
Si5324
Register 22.
Bit
D7
D6
D5
D4
Name
Type
R
R
R
R
D3
D2
D1
D0
CK_ACTV_POL
CK_BAD_ POL
LOL_POL
INT_POL
R/W
R/W
R/W
R/W
Reset value = 1101 1111
Bit
Name
Function
7:4
Reserved
3
CK_ACTV_ POL
2
CK_BAD_ POL
1
LOL_POL
LOL_POL.
Sets the active polarity for the LOL status when reflected on an output pin.
0: Active low
1: Active high
0
INT_POL
INT_POL.
Sets the active polarity for the interrupt status when reflected on the INT_C1B output pin.
0: Active low
1: Active high
Reserved.
CK_ACTV_POL.
Sets the active polarity for the CS_CA signals when reflected on an output pin.
0: Active low
1: Active high
CK_BAD_POL.
Sets the active polarity for the INT_C1B and C2B signals when reflected on output
pins.
0: Active low
1: Active high
Rev. 1.1
37
Si5324
Register 23.
Bit
D7
D6
D5
D4
D3
Name
Type
R
R
R
R
R
D2
D1
D0
LOS2_ MSK
LOS1_ MSK
LOSX_ MSK
R/W
R/W
R/W
Reset value = 0001 1111
38
Bit
Name
Function
7:3
Reserved
2
LOS2_MSK
LOS2_MSK.
Determines if a LOS on CKIN2 (LOS2_FLG) is used in the generation of an interrupt.
Writes to this register do not change the value held in the LOS2_FLG register.
0: LOS2 alarm triggers active interrupt on INT_C1B output (if INT_PIN=1).
1: LOS2_FLG ignored in generating interrupt output.
1
LOS1_MSK
LOS1_MSK.
Determines if a LOS on CKIN1 (LOS1_FLG) is used in the generation of an interrupt.
Writes to this register do not change the value held in the LOS1_FLG register.
0: LOS1 alarm triggers active interrupt on INT_C1B output (if INT_PIN=1).
1: LOS1_FLG ignored in generating interrupt output.
0
LOSX_MSK
LOSX_MSK.
Determines if a LOS on XA/XB(LOSX_FLG) is used in the generation of an interrupt.
Writes to this register do not change the value held in the LOSX_FLG register.
0: LOSX alarm triggers active interrupt on INT_C1B output (if INT_PIN=1).
1: LOSX_FLG ignored in generating interrupt output.
Reserved.
Rev. 1.1
Si5324
Register 24.
Bit
D7
D6
D5
D4
D3
Name
Type
R
R
R
R
R
D2
D1
D0
FOS2_MSK
FOS1_MSK
LOL_MSK
R/W
R/W
R/W
Reset value = 0011 1111
Bit
Name
Function
7:3
Reserved
2
FOS2_MSK
FOS2_MSK.
Determines if the FOS2_FLG is used to in the generation of an interrupt. Writes to this
register do not change the value held in the FOS2_FLG register.
0: FOS2 alarm triggers active interrupt on INT_C1B output (if INT_PIN=1).
1: FOS2_FLG ignored in generating interrupt output.
1
FOS1_MSK
FOS1_MSK.
Determines if the FOS1_FLG is used in the generation of an interrupt. Writes to this register do not change the value held in the FOS1_FLG register.
0: FOS1 alarm triggers active interrupt on INT_C1B output (if INT_PIN=1).
1: FOS1_FLG ignored in generating interrupt output.
0
LOL_MSK
LOL_MSK.
Determines if the LOL_FLG is used in the generation of an interrupt. Writes to this register do not change the value held in the LOL_FLG register.
0: LOL alarm triggers active interrupt on INT_C1B output (if INT_PIN=1).
1: LOL_FLG ignored in generating interrupt output.
Reserved.
Rev. 1.1
39
Si5324
Register 25.
Bit
D7
D6
Name
N1_HS [2:0]
Type
R/W
D5
D4
D3
D2
D1
D0
R
R
R
R
R
Reset value = 0010 0000
Bit
Name
Function
7:5
N1_HS [2:0]
N1_HS [2:0].
Sets value for N1 high speed divider which drives NCn_LS (n = 1 to 2) low-speed divider.
000: N1= 4
001: N1= 5
010: N1=6
011: N1= 7
100: N1= 8
101: N1= 9
110: N1= 10
111: N1= 11
4:0
Reserved
Reserved.
Register 31.
Bit
D7
D6
D5
D4
D3
Name
Type
D2
D1
D0
NC1_LS [19:16]
R
R
R
R
R/W
Reset value = 0000 0000
40
Bit
Name
Function
7:4
Reserved
Reserved.
3:0
NC1_LS
[19:16]
NC1_LS [19:16].
Sets value for NC1 low-speed divider, which drives CKOUT1 output. Must be 0 or odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111=2^20
Valid divider values=[1, 2, 4, 6, ..., 2^20]
Rev. 1.1
Si5324
Register 32.
Bit
D7
D6
D5
D4
D3
Name
NC1_LS [15:8]
Type
R/W
D2
D1
D0
Reset value = 0000 0000
Bit
7:0
Name
Function
NC1_LS [15:8] NC1_LS [15:8].
Sets value for NC1 low-speed divider, which drives CKOUT1 output. Must be 0 or odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111=2^20
Valid divider values=[1, 2, 4, 6, ..., 2^20]
Register 33.
Bit
D7
D6
D5
D4
D3
Name
NC1_LS [7:0]
Type
R/W
D2
D1
D0
Reset value = 0011 0001
Bit
Name
Function
7:0
NC1_LS [19:0]
NC1_LS [7:0].
Sets value for NC1 low-speed divider, which drives CKOUT1 output. Must be 0 or odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111=2^20
Valid divider values=[1, 2, 4, 6, ..., 2^20]
Rev. 1.1
41
Si5324
Register 34.
Bit
D7
D6
D5
D4
D3
Name
D2
D1
D0
NC2_LS [19:16]
Type
R
R
R
R
R/W
Reset value = 0000 0000
Bit
Name
Function
7:4
Reserved
Reserved.
3:0
NC2_LS
[19:16]
NC2_LS [19:16].
Sets value for NC2 low-speed divider, which drives CKOUT2 output. Must be 0 or odd.
00000000000000000000=1
00000000000000000001=2
00000000000000000011=4
00000000000000000101=6
...
11111111111111111111=2^20
Valid divider values=[1, 2, 4, 6, ..., 2^20]
Register 35.
Bit
D7
D6
D5
D4
D3
Name
NC2_LS [15:8]
Type
R/W
D2
D1
D0
Reset value = 0000 0000
Bit
7:0
42
Name
Function
NC2_LS [15:8] NC2_LS [15:8].
Sets value for NC2 low-speed divider, which drives CKOUT2 output. Must be 0 or odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111=2^20
Valid divider values=[1, 2, 4, 6, ..., 2^20]
Rev. 1.1
Si5324
Register 36.
Bit
D7
D6
D5
D4
D3
Name
NC2_LS [7:0]
Type
R/W
D2
D1
D0
Reset value = 0011 0001
Bit
7:0
Name
Function
NC2_LS [7:0] NC2_LS [7:0].
Sets value for NC2 low-speed divider, which drives CKOUT2 output. Must be 0 or odd.
00000000000000000000 = 1
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111 = 220
Valid divider values = [1, 2, 4, 6, ..., 220]
Rev. 1.1
43
Si5324
Register 40.
Bit
D7
D6
Name
N2_HS [2:0]
Type
R/W
D5
D4
D3
D2
D1
N2_LS [19:16]
R
R/W
Reset value = 1100 0000
44
Bit
Name
7:5
N2_HS [2:0]
4
Reserved
3:0
N2_LS [19:16]
Function
N2_HS [2:0].
Sets value for N2 high speed divider which drives N2LS low-speed divider.
000: 4
001: 5
010: 6
011: 7
100: 8
101: 9
110: 10
111: 11
Reserved.
N2_LS [19:16].
Sets value for N2 low-speed divider, which drives phase detector.
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111 = 220
Valid divider values = [2, 4, 6, ..., 220]
Rev. 1.1
D0
Si5324
Register 41.
Bit
D7
D6
D5
D4
D3
Name
N2_LS [15:8]
Type
R/W
D2
D1
D0
D1
D0
Reset value = 0000 0000
Bit
7:0
Name
Function
N2_LS [15:8] N2_LS [15:8].
Sets value for N2 low-speed divider, which drives phase detector.
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111 = 220
Valid divider values = [2, 4, 6, ..., 220]
Register 42.
Bit
D7
D6
D5
D4
D3
Name
N2_LS [7:0]
Type
R/W
D2
Reset value = 1111 1001
Bit
Name
7:0
N2_LS [7:0]
Function
N2_LS [7:0].
Sets value for N2 low-speed divider, which drives phase detector.
00000000000000000001 = 2
00000000000000000011 = 4
00000000000000000101 = 6
...
11111111111111111111 = 220
Valid divider values = [2, 4, 6, ..., 220]
Rev. 1.1
45
Si5324
Register 43.
Bit
D7
D6
D5
D4
D3
D2
Name
D1
D0
N31 [18:16]
Type
R
R
R
R
R
R/W
Reset value = 0000 0000
Bit
Name
7:3
Reserved
2:0
N31 [18:16]
Function
Reserved.
N31 [18:16].
Sets value for input divider for CKIN1.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
1111111111111111111 = 219
Valid divider values = [1, 2, 3, ..., 219]
Register 44.
Bit
D7
D6
D5
D4
D3
Name
N31_[15:8]
Type
R/W
Reset value = 0000 0000
46
Bit
Name
7:0
N31_[15:8]
Function
N31_[15:8].
Sets value for input divider for CKIN1.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
1111111111111111111 = 219
Valid divider values = [1, 2, 3, ..., 219]
Rev. 1.1
D2
D1
D0
Si5324
Register 45.
Bit
D7
D6
D5
D4
D3
Name
N31_[7:0]
Type
R/W
D2
D1
D0
D2
D1
D0
Reset value = 0000 1001
Bit
Name
7:0
N31_[7:0
Function
N31_[7:0].
Sets value for input divider for CKIN1.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
1111111111111111111 = 219
Valid divider values = [1, 2, 3, ..., 219]
Register 46.
Bit
D7
D6
D5
D4
D3
Name
Type
N32_[18:16]
R
R
R
R
R
R/W
Reset value = 0000 0000
Bit
Name
7:3
Reserved
2:0
N32_[18:16]
Function
Reserved.
N32_[18:16].
Sets value for input divider for CKIN2.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
1111111111111111111 = 219
Valid divider values = [1, 2, 3, ..., 219]
Rev. 1.1
47
Si5324
Register 47.
Bit
D7
D6
D5
D4
D3
Name
N32_[15:8]
Type
R/W
D2
D1
D0
D2
D1
D0
Reset value = 0000 0000
Bit
Name
7:0
N32_[15:8]
Function
N32_[15:8].
Sets value for input divider for CKIN2.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
1111111111111111111 = 219
Valid divider values = [1, 2, 3, ..., 219]
Register 48.
Bit
D7
D6
D5
D4
D3
Name
N32_[7:0]
Type
R/W
Reset value = 0000 1001
48
Bit
Name
7:0
N32_[7:0]
Function
N32_[7:0].
Sets value for input divider for CKIN2.
0000000000000000000 = 1
0000000000000000001 = 2
0000000000000000010 = 3
...
1111111111111111111 = 219
Valid divider values = [1, 2, 3, ..., 219]
Rev. 1.1
Si5324
Register 55.
Bit
D7
D6
Name
Type
R
R
D5
D4
D3
D2
D1
CLKIN2RATE_[2:0]
CLKIN1RATE[2:0]
R/W
R/W
D0
Reset value = 0000 0000
Bit
Name
Function
7:6
Reserved
5:3
CLKIN2RATE[2:0]
2:0
CLKIN1RATE [2:0] CLKIN1RATE[2:0].
CKINn frequency selection for FOS alarm monitoring.
000: 10–27 MHz
001: 25–54 MHz
002: 50–105 MHz
003: 95–215 MHz
004: 190–435 MHz
005: 375–710 MHz
006: Reserved
007: Reserved
Reserved.
CLKIN2RATE_[2:0].
CKINn frequency selection for FOS alarm monitoring.
000: 10–27 MHz
001: 25–54 MHz
002: 50–105 MHz
003: 95–215 MHz
004: 190–435 MHz
005: 375–710 MHz
006: Reserved
007: Reserved
Rev. 1.1
49
Si5324
Register 128.
Bit
D7
D6
D5
D4
D3
D2
Name
D1
D0
CK2_ACTV_REG CK1_ACTV_REG
Type
R
R
R
R
R
R
R
R
Reset value = 0010 0000
Bit
Name
Function
7:2
Reserved
1
CK2_ACTV_REG
CK2_ACTV_REG.
Indicates if CKIN2 is currently the active clock for the PLL input.
0: CKIN2 is not the active input clock. Either it is not selected or LOS2_INT is 1.
1: CKIN2 is the active input clock.
0
CK1_ACTV_REG
CK1_ACTV_REG.
Indicates if CKIN1 is currently the active clock for the PLL input.
0: CKIN1 is not the active input clock. Either it is not selected or LOS1_INT is 1.
1: CKIN1 is the active input clock.
Reserved.
Register 129.
Bit
D7
D6
D5
D4
D3
Name
Type
R
R
R
R
R
D2
D1
D0
LOS2_INT
LOS1_INT
LOSX_INT
R
R
R
Reset value = 0000 0110
50
Bit
Name
Function
7:3
Reserved
Reserved.
2
LOS2_INT
LOS2_INT.
Indicates the LOS status on CKIN2.
0: Normal operation.
1: Internal loss-of-signal alarm on CKIN2 input.
1
LOS1_INT
LOS1_INT.
Indicates the LOS status on CKIN1.
0: Normal operation.
1: Internal loss-of-signal alarm on CKIN1 input.
0
LOSX_INT
LOSX_INT.
Indicates the LOS status of the external reference on the XA/XB pins.
0: Normal operation.
1: Internal loss-of-signal alarm on XA/XB reference clock input.
Rev. 1.1
Si5324
Register 130.
Bit
D7
Name
Type
D6
D5
D4
D3
DIGHOLDVALID
R
R
R
R
D2
D1
D0
FOS2_INT
FOS1_INT
LOL_INT
R
R
R
R
Reset value = 0000 0001
Bit
Name
Function
7
Reserved
6
DIGHOLDVALID
5:3
Reserved
Reserved.
2
FOS2_INT
CKIN2 Frequency Offset Status.
0: Normal operation.
1: Internal frequency offset alarm on CKIN2 input.
1
FOS1_INT
CKIN1 Frequency Offset Status.
0: Normal operation.
1: Internal frequency offset alarm on CKIN1 input.
0
LOL_INT
Reserved.
Digital Hold Valid.
Indicates if the digital hold circuit has enough samples of a valid clock to meet digital hold specifications.
0: Indicates digital hold history registers have not been filled. The digital hold
output frequency may not meet specifications.
1: Indicates digital hold history registers have been filled. The digital hold output
frequency is valid.
PLL Loss of Lock Status.
0: PLL locked.
1: PLL unlocked.
Rev. 1.1
51
Si5324
Register 131.
Bit
D7
D6
D5
D4
D3
Name
Type
D2
D1
D0
LOS2_FLG LOS1_FLG LOSX_FLG
R
R
R
R
R
R/W
R/W
R/W
Reset value = 0001 1111
52
Bit
Name
Function
7:3
Reserved
2
LOS2_FLG
CKIN2 Loss-of-Signal Flag.
0: Normal operation.
1: Held version of LOS2_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by LOS2_MSK bit. Flag cleared by writing 0 to
this bit.
1
LOS1_FLG
CKIN1 Loss-of-Signal Flag.
0: Normal operation
1: Held version of LOS1_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by LOS1_MSK bit. Flag cleared by writing 0 to
this bit.
0
LOSX_FLG
External Reference (signal on pins XA/XB) Loss-of-Signal Flag.
0: Normal operation
1: Held version of LOSX_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by LOSX_MSK bit. Flag cleared by writing 0 to
this bit.
Reserved.
Rev. 1.1
Si5324
Register 132.
Bit
D7
D6
D5
D4
Name
Type
D3
D2
FOS2_FLG FOS1_FLG
R
R
R
R
R/W
R/W
D1
D0
LOL_FLG
R/W
R
Reset value = 0000 0010
Bit
Name
Function
7:4
Reserved
3
FOS2_FLG
CLKIN_2 Frequency Offset Flag.
0: Normal operation.
1: Held version of FOS2_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by FOS2_MSK bit. Flag cleared by writing 0 to
this bit.
2
FOS1_FLG
CLKIN_1 Frequency Offset Flag.
0: Normal operation
1: Held version of FOS1_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by FOS1_MSK bit. Flag cleared by writing 0 to
this bit.
1
LOL_FLG
PLL Loss of Lock Flag.
0: PLL locked
1: Held version of LOL_INT. Generates active output interrupt if output interrupt pin is
enabled (INT_PIN = 1) and if not masked by LOL_MSK bit. Flag cleared by writing 0 to
this bit.
0
Reserved
Reserved.
Reserved.
Rev. 1.1
53
Si5324
Register 134.
Bit
D7
D6
D5
D4
D3
Name
PARTNUM_RO [11:4]
Type
R
D2
D1
D0
D2
D1
D0
Reset value = 0000 0001
Bit
Name
Function
7:0
PARTNUM_RO [11:0]
Device ID (1 of 2).
0000 0001 1000: Si5324
Others Reserved
Register 135.
Bit
D7
D6
D5
D4
D3
Name
PARTNUM_RO [3:0]
REVID_RO [3:0]
Type
R
R
Reset value = 1000 0010
54
Bit
Name
7:4
PARTNUM_RO [11:0]
3:0
REVID_RO [3:0]
Function
Device ID (2 of 2).
0000 0001 1000: Si5324
Others Reserved
Indicates Revision Number of Device.
0010: Revision C
Others Reserved.
Rev. 1.1
Si5324
Register 136.
Bit
D7
D6
Name
RST_REG
ICAL
Type
R/W
R/W
D5
D4
D3
D2
D1
D0
R
R
R
R
R
R
Reset value = 0000 0000
Bit
Name
7
RST_REG
Function
Internal Reset (Same as Pin Reset).
Note: The I2C (or SPI) port may not be accessed until 10 ms after RST_REG is asserted.
0: Normal operation.
1: Reset of all internal logic. Outputs disabled or tristated during reset.
6
ICAL
5:0
Reserved
Start an Internal Calibration Sequence.
For proper operation, the device must go through an internal calibration sequence.
ICAL is a self-clearing bit. Writing a one to this location initiates an ICAL. The calibration is complete once the LOL alarm goes low. A valid stable clock (within 100 ppm)
must be present to begin ICAL.
Note: Any divider, CLKINn_RATE or BWSEL_REG changes require an ICAL to take
effect.
0: Normal operation.
1: Writing a "1" initiates internal self-calibration. Upon completion of internal self-calibration, LOL will go low.
Reserved.
Rev. 1.1
55
Si5324
Register 137.
Bit
D7
D6
D5
D4
D3
D2
D1
Name
D0
FASTLOCK
Type
R
R
R
R
R
R
R
R/W
Reset value = 0000 0000
Bit
Name
7:1
Reserved
0
FASTLOCK
Function
Do not modify.
This bit must be set to 1 to enable FASTLOCK. This improves initial lock time by
dynamically changing the loop bandwidth.
Register 138.
Bit
D7
D6
D5
D4
D3
D2
Name
Type
R
R
R
R
R
R
D1
D0
LOS2_EN [1:1]
LOS1_EN [1:1]
R/W
R/W
Reset value = 0000 1111
Bit
Name
7:2
Reserved
1
LOS2_EN [1:0]
Function
Reserved.
Enable CKIN2 LOS Monitoring on the Specified Input (2 of 2).
Note: LOS2_EN is split between two registers.
00: Disable LOS monitoring.
01: Reserved.
10: Enable LOSA monitoring.
11: Enable LOS monitoring.
LOSA is a slower and less sensitive version of LOS. See the Family Reference Manual
for details.
0
LOS1_EN [1:0]
Enable CKIN1 LOS Monitoring on the Specified Input (1 of 2).
Note: LOS1_EN is split between two registers.
00: Disable LOS monitoring.
01: Reserved.
10: Enable LOSA monitoring.
11: Enable LOS monitoring.
LOSA is a slower and less sensitive version of LOS. See the Family Reference Manual
for details.
56
Rev. 1.1
Si5324
Register 139.
Bit
D7
D6
Name
Type
R
D5
D4
LOS2_EN [0:0]
LOS1_EN [0:0]
R/W
R/W
R
D3
D2
D1
D0
FOS2_EN FOS1_EN
R
R
R/W
R/W
Reset value = 1111 1111
Bit
Name
7:6
Reserved
Function
Reserved.
5
LOS2_EN [1:0] Enable CKIN2 LOS Monitoring on the Specified Input (2 of 2).
Note: LOS2_EN is split between two registers.
00: Disable LOS monitoring.
01: Reserved.
10: Enable LOSA monitoring.
11: Enable LOS monitoring.
LOSA is a slower and less sensitive version of LOS. See the family reference manual
for details.
4
LOS_EN [1:0]
Enable CKIN1 LOS Monitoring on the Specified Input (1 of 2).
Note: LOS1_EN is split between two registers.
00: Disable LOS monitoring.
01: Reserved.
10: Enable LOSA monitoring.
11: Enable LOS monitoring.
LOSA is a slower and less sensitive version of LOS. See the family reference manual
for details.
3:2
Reserved
Reserved.
1
FOS2_EN
Enables FOS on a Per Channel Basis.
0: Disable FOS monitoring.
1: Enable FOS monitoring.
0
FOS1_EN
Enables FOS on a Per Channel Basis.
0: Disable FOS monitoring.
1: Enable FOS monitoring.
Rev. 1.1
57
Si5324
Register 142.
Bit
D7
D6
D5
D4
D3
D2
Name
INDEPENDENTSKEW1 [7:0]
Type
R/W
D1
D0
Reset value = 0000 0000
Bit
Name
7:0
INDEPENDENTSKEW1 [7:0]
Function
INDEPENDENTSKEW1.
8 bit field that represents a twos complement of the phase offset in
terms of clocks from the high speed output divider. Default = 0.
Register 143.
Bit
D7
D6
D5
D4
D3
D2
Name
INDEPENDENTSKEW2 [7:0]
Type
R/W
D1
D0
Reset value = 0000 0000
Bit
7:0
58
Name
Function
INDEPENDENTSKEW2 [7:0] INDEPENDENTSKEW2.
8 bit field that represents a twos complement of the phase offset in terms
of clocks from the high speed output divider. Default = 0.
Rev. 1.1
Si5324
5.1. ICAL
The device's registers must be configured for the intended applications. After the part is configured, the part must
perform a calibration procedure when there is a stable clock on the selected CLKINn input. The calibration process
is triggered by writing a "1" to bit D6 in register 136. See the Family Reference Manual for details. In addition, after
a successful calibration operation, changing any of the Registers indicated in Table 12 requires that a calibration be
performed again by the same procedure (writing a "1" to bit D6 in register 136).
Table 12. ICAL-Sensitive Registers
Address
Register
0
BYPASS_REG
0
CKOUT_ALWAYS_ON
1
CK_PRIOR1
1
CK_PRIOR2
2
BWSEL_REG
4
HIST_DEL
5
ICMOS
7
FOSREFSEL
9
HIST_AVG
10
DSBL1_REG
10
DSBL2_REG
11
PD_CK1
11
PD_CK2
19
FOS_EN
19
FOS_THR
19
LOCKT
19
VALTIME
25
N1HS
31
NC1_LS
34
NC2_LS
40
N2_HS
40
N2_LS
43
N31
46
N32
55
CLKIN1RATE
55
CLKIN2RATE
Rev. 1.1
59
Si5324
CKOUT1–
CKOUT1+
NC
GND
NC
VDD
CKOUT2–
CKOUT2+
CMODE
6. Pin Descriptions
36 35 34 33 32 31 30 29 28
RST
1
27 SDI
NC
2
26 A2_SS
INT_C1B
3
25 A1
C2B
4
VDD
5
24 A0
XA
6
XB
7
21 CS_CA
GND
8
20 GND
NC
9
GND
Pad
23 SDA_SDO
22 SCL
19 GND
LOL
CKIN1–
CKIN1+
RATE1
NC
CKIN2–
CKIN2+
RATE0
VDD
10 11 12 13 14 15 16 17 18
Pin #
Pin Name
I/O
Signal Level
Description
1
RST
I
LVCMOS
External Reset.
Active low input that performs external hardware reset of device.
Resets all internal logic to a known state and forces the device registers to their default value. Clock outputs are disabled during reset.
The part must be programmed after a reset or power-on to get a
clock output. See Family Reference Manual for details.
This pin has a weak pull-up.
2, 9, 14,
30, 33
NC
3
INT_C1B
No Connection.
Leave floating. Make no external connections to this pin for normal
operation.
O
LVCMOS
Interrupt/CKIN1 Invalid Indicator.
This pin functions as a device interrupt output or an alarm output for
CKIN1. If used as an interrupt output, INT_PIN must be set to 1. The
pin functions as a maskable interrupt output with active polarity controlled by the INT_POL register bit.
If used as an alarm output, the pin functions as a LOS (and optionally FOS) alarm indicator for CKIN1. Set CK1_BAD_PIN = 1 and
INT_PIN = 0.
0 = CKIN1 present.
1 = LOS (FOS) on CKIN1.
The active polarity is controlled by CK_BAD_POL. If no function is
selected, the pin tristates.
Note: Internal register names are indicated by underlined italics, e.g., INT_PIN. See Si5324 Register Map.
60
Rev. 1.1
Si5324
Pin #
Pin Name
I/O
Signal Level
Description
4
C2B
O
LVCMOS
CKIN2 Invalid Indicator.
This pin functions as a LOS (and optionally FOS) alarm indicator for
CKIN2 if CK2_BAD_PIN = 1.
0 = CKIN2 present.
1 = LOS (FOS) on CKIN2.
The active polarity can be changed by CK_BAD_POL. If
CK2_BAD_PIN = 0, the pin tristates.
5, 10, 32
VDD
VDD
Supply
Supply.
The device operates from a 1.8, 2.5, or 3.3 V supply. Bypass capacitors should be associated with the following Vdd pins:
5
0.1 µF
10
0.1 µF
32
0.1 µF
A 1.0 µF should also be placed as close to the device as is practical.
7
6
XB
XA
I
Analog
External Crystal or Reference Clock.
External crystal should be connected to these pins to use internal
oscillator based reference. Refer to Family Reference Manual for
interfacing to an external reference. External reference must be
from a high-quality clock source (TCXO, OCXO). Frequency of crystal or external clock is set by RATE[1:0] pins.
8, 31, 20,
19
GND
GND
Supply
Ground.
Must be connected to system ground. Minimize the ground path
impedance for optimal performance of this device. Grounding these
pins does not eliminate the requirement to ground the GND PAD on
the bottom of the package.
11
15
RATE0
RATE1
I
3-Level
External Crystal or Reference Clock Rate.
Three level inputs that select the type and rate of external crystal or
reference clock to be applied to the XA/XB port. Refer to the Family
Reference Manual for settings. These pins have both a weak pull-up
and a weak pull-down; they default to M.
L setting corresponds to ground.
M setting corresponds to VDD/2.
H setting corresponds to VDD.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state.
16
17
CKIN1+
CKIN1–
I
Multi
Clock Input 1.
Differential input clock. This input can also be driven with a singleended signal. Input frequency range is 2 kHz to 710 MHz.
12
13
CKIN2+
CKIN2–
I
Multi
Clock Input 2.
Differential input clock. This input can also be driven with a singleended signal. Input frequency range is 2 kHz to 710 MHz.
Note: Internal register names are indicated by underlined italics, e.g., INT_PIN. See Si5324 Register Map.
Rev. 1.1
61
Si5324
Pin #
Pin Name
I/O
Signal Level
Description
18
LOL
O
LVCMOS
PLL Loss of Lock Indicator.
This pin functions as the active high PLL loss of lock indicator if the
LOL_PIN register bit is set to 1.
0 = PLL locked.
1 = PLL unlocked.
If LOL_PIN = 0, this pin will tristate. Active polarity is controlled by
the LOL_POL bit. The PLL lock status will always be reflected in the
LOL_INT read only register bit (see “AN803: Lock and Settling Time
Considerations for Si5324/27/69/74 Any-Frequency Jitter Attenuating Clock
ICs” for additional details).
21
CS_CA
I/O
LVCMOS
Input Clock Select/Active Clock Indicator.
Input: In manual clock selection mode, this pin functions as the
manual input clock selector if the CKSEL_PIN is set to 1.
0 = Select CKIN1.
1 = Select CKIN2.
If CKSEL_PIN = 0, the CKSEL_REG register bit controls this function and this input tristates. If configured for input, must be tied high
or low.
Output: In automatic clock selection mode, this pin indicates which
of the two input clocks is currently the active clock. If alarms exist on
both clocks, CK_ACTV will indicate the last active clock that was
used before entering the digital hold state. The CK_ACTV_PIN register bit must be set to 1 to reflect the active clock status to the
CK_ACTV output pin.
0 = CKIN1 active input clock.
1 = CKIN2 active input clock.
If CK_ACTV_PIN = 0, this pin will tristate. The CK_ACTV status will
always be reflected in the CK_ACTV_REG read only register bit.
22
SCL
I
LVCMOS
Serial Clock.
This pin functions as the serial clock input for both SPI and I2C
modes.
This pin has a weak pull-down.
23
SDA_SDO
I/O
LVCMOS
Serial Data.
In I2C control mode (CMODE = 0), this pin functions as the bidirectional serial data port.
In SPI control mode (CMODE = 1), this pin functions as the serial
data output.
25
24
A1
A0
I
LVCMOS
Serial Port Address.
In I2C control mode (CMODE = 0), these pins function as hardware
controlled address bits. The I2C address is 1101 [A2] [A1] [A0].
In SPI control mode (CMODE = 1), these pins are ignored.
These pins have a weak pull-down.
Note: Internal register names are indicated by underlined italics, e.g., INT_PIN. See Si5324 Register Map.
62
Rev. 1.1
Si5324
Pin #
Pin Name
I/O
Signal Level
Description
26
A2_SS
I
LVCMOS
Serial Port Address/Slave Select.
In I2C control mode (CMODE = 0), this pin functions as a hardware
controlled address bit [A2].
In SPI control mode (CMODE = 1), this pin functions as the slave
select input.
This pin has a weak pull-down.
27
SDI
I
LVCMOS
Serial Data In.
In I2C control mode (CMODE = 0), this pin is ignored.
In SPI control mode (CMODE = 1), this pin functions as the serial
data input.
This pin has a weak pull-down.
29
28
CKOUT1–
CKOUT1+
O
Multi
Output Clock 1.
Differential output clock with a frequency range of 8 kHz to
1.4175 GHz. Output signal format is selected by SFOUT1_REG
register bits. Output is differential for LVPECL, LVDS, and CML
compatible modes. For CMOS format, both output pins drive identical single-ended clock outputs.
34
35
CKOUT2–
CKOUT2+
O
Multi
Output Clock 2.
Differential output clock with a frequency range of 8 kHz to
1.4175 GHz. Output signal format is selected by SFOUT2_REG
register bits. Output is differential for LVPECL, LVDS, and CML
compatible modes. For CMOS format, both output pins drive identical single-ended clock outputs.
36
CMODE
I
LVCMOS
GND PAD
GND
GND
Supply
Control Mode.
Selects I2C or SPI control mode for the Si5324.
0 = I2C Control Mode
1 = SPI Control Mode
This pin must not be NC. Tie either high or low.
Ground Pad.
The ground pad must provide a low thermal and electrical
impedance to a ground plane.
Note: Internal register names are indicated by underlined italics, e.g., INT_PIN. See Si5324 Register Map.
Rev. 1.1
63
Si5324
7. Ordering Guide
Ordering Part
Number1
Output Clock Frequency
Range
Package
ROHS6,
Pb-Free
Temperature Range
Si5324A-C-GM2
2 kHz–945 MHz
970–1134 MHz
1.213–1.417 GHz
36-Lead 6 x 6 mm QFN
Yes
–40 to 85 °C
Si5324B-C-GM2
2 kHz–808 MHz
36-Lead 6 x 6 mm QFN
Yes
–40 to 85 °C
Si5324C-C-GM2
2 kHz–346 MHz
36-Lead 6 x 6 mm QFN
Yes
–40 to 85 °C
Si5324D-C-GM2
2 kHz–150 MHz
36-Lead 6 x 6 mm QFN
Yes
–40 to 85 °C
Si5324E-C-GM3
2 kHz–945 MHz
970–1134 MHz
1.213–1.417 GHz
36-Lead 6 x 6 mm QFN
Yes
–40 to 85 °C
Notes:
1. Add an R at the end of the device to denote tape and reel options.
2. These OPNs are recommended for all new designs. Refer to AN803 for more information.
3. This OPN is intended for use in legacy designs in which the Si5324 device must retain the original lock time behavior
as described in AN803 and Product Bulletin (PB-1312191): “Si5324, Si5374, Si5374 Loss of Lock (LOL) Time
Behavior: New Applications Note and Ordering Options”.
64
Rev. 1.1
Si5324
Table 13. Product Selection Guide
Part
Number
Control Number of
Input
Output
RMS Phase Jitter
PLL
Hitless
Inputs and Frequency Frequency (12 kHz–20 MHz) Bandwidth Switching
Outputs
(MHz)*
(MHz)*
Free
Run
Mode
Package
0.008–644
0.45 ps
60 Hz to
8 kHz
19–710
19–710
0.3 ps
60 Hz to
8 kHz
6x6 mm
36-QFN
1–710
1–710
0.3 ps
60 Hz to
8 kHz
6x6 mm
36-QFN
1PLL, 1 | 1 0.002–710 0.002–1417
0.3 ps
60 Hz to
8 kHz
Pin
1PLL, 2 | 2 0.008–707 0.008–1050
0.3 ps
60 Hz to
8 kHz

Si5324
I2C/SPI
1PLL, 2 | 2 0.002–710 0.002–1417
0.3 ps
4 Hz to
525 Hz


6x6 mm
36-QFN
Si5326
I2C/SPI
1PLL, 2 | 2 0.002–710 0.002–1417
0.3 ps
60 Hz to
8 kHz


6x6 mm
36-QFN
Si5327
I2C/SPI
1PLL, 2 | 2 0.002–710
0.002–808
0.5 ps
60 Hz to
8 kHz


6x6 mm
36-QFN
Si5366
Pin
1PLL, 4 | 5 0.008–707 0.008–1050
0.3 ps
60 Hz to
8 kHz

Si5368
I2C/SPI
1PLL, 4 | 5 0.002–710 0.002–1417
0.3 ps
60 Hz to
8 kHz


14x14 mm
100-TQFP
Si5369
I2C/SPI
1PLL, 4 | 5 0.002–710 0.002–1417
0.3 ps
4 Hz to
525 Hz


14x14 mm
100-TQFP
Si5374
I 2C
4PLL, 8 | 8 0.002–710
0.002–808
0.4 ps
4 Hz to
525 Hz


10x10 mm
80-BGA
Si5375
I 2C
4PLL, 4 | 4 0.002–710
0.002–808
0.4 ps
60 Hz to
8 kHz


10x10 mm
80-BGA
Si5315
Pin
1PLL, 2 | 2 0.008–644
Si5316
Pin
1PLL, 2 | 1
Si5317
Pin
1PLL, 1 | 2
Si5319
I2C/SPI
Si5323
6x6 mm
36-QFN


6x6 mm
36-QFN
6x6 mm
36-QFN
14x14 mm
100-TQFP
*Note: Maximum input and output rates may be limited by speed rating of device. See each device’s data sheet for ordering
information.
Rev. 1.1
65
Si5324
1.8, 2.5 V Operation
1.8, 2.5, 3.3 V Operation
100 Lead 14 x 14 mm TQFP
36 Lead 6 mm x 6 mm QFN
FSYNC Realignment
LOL Alarm
FOS Alarm
Hitless Switching
LOS
Jitter Generation
(12 kHz – 20 MHz)
Max Output Frequency (MHz)
Max Input Freq (MHz)1
P Control
Clock Outputs
Clock Inputs
Device
Table 14. Product Selection Guide (Si5322/25/65/67)
Low Jitter Precision Clock Multipliers (Wideband)
Si5322
2
2
Si5325
2
2
Si5365
4
5
Si5367
4
5


707
1050
0.6 ps rms typ
710
1400
0.6 ps rms typ
707
1050
0.6 ps rms typ
710
1400
0.6 ps rms typ















Notes:
1. Maximum input and output rates may be limited by speed rating of device. See each device’s data sheet for ordering
information.
2. Requires external low-cost, fixed frequency 3rd overtone 114.285 MHz crystal or reference clock.
66
Rev. 1.1
Si5324
8. Package Outline: 36-Pin QFN
Figure 9 illustrates the package details for the Si5324. Table 15 lists the values for the dimensions shown in the
illustration.
Figure 9. 36-Pin Quad Flat No-lead (QFN)
Table 15. Package Dimensions
Symbol
Millimeters
Symbol
Millimeters
Min
Nom
Max
A
0.80
0.85
0.90
A1
0.00
0.02
0.05

—
—
12º
b
0.18
0.25
0.30
aaa
—
—
0.10
bbb
—
—
0.10
ccc
—
—
0.08
D
D2
L
6.00 BSC
3.95
4.10
4.25
Min
Nom
Max
0.50
0.60
0.70
e
0.50 BSC
ddd
—
—
0.10
E
6.00 BSC
eee
—
—
0.05
E2
3.95
4.10
4.25
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-220, variation VJJD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
Rev. 1.1
67
Si5324
9. PCB Land Pattern
Figure 10. PCB Land Pattern Diagram
Figure 11. Ground Pad Recommended Layout
68
Rev. 1.1
Si5324
Table 16. PCB Land Pattern Dimensions
Dimension
MIN
MAX
e
0.50 BSC.
E
5.42 REF.
D
5.42 REF.
E2
4.00
4.20
D2
4.00
4.20
GE
4.53
—
GD
4.53
—
X
—
0.28
Y
0.89 REF.
ZE
—
6.31
ZD
—
6.31
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
center ground pad.
Card Assembly
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
Small Body Components.
Rev. 1.1
69
Si5324
10. Top Marking
10.1. Si5324 Top Marking (QFN)
10.2. Top Marking Explanation
Mark Method:
Laser
Font Size:
0.80 mm
Right-Justified
Line 1 Marking:
Si5324Q
Customer Part Number
Q = Speed Code: A, B, C, D
See Ordering Guide for options.
Line 2 Marking:
C-GM
C = Product Revision
G = Temperature Range –40 to 85 °C (RoHS6)
M = QFN Package
Line 3 Marking:
YYWWRF
YY = Year
WW = Work Week
R = Die Revision
F = Internal code
Assigned by the Assembly House. Corresponds to the year
and work week of the mold date.
Line 4 Marking:
Pin 1 Identifier
Circle = 0.75 mm Diameter
Lower-Left Justified
XXXX
Internal Code
70
Rev. 1.1
Si5324
DOCUMENT CHANGE LIST
Revision 1.0 to Revision 1.1
Revision 0.1 to Revision 0.2



Added reference to AN803 on pages 11,19,20,34,62.
Added additional LOL and Settling Time Specs on
page 11.
 Added new part numbers on page 64.

Updated Rise/Fall Time values.
Updated minimum loop BW value.
Revision 0.2 to Revision 0.25













Updated features and applications.
Changed maximum loop bandwidth to 525 Hz
(global).
Updated PLL performance specifications in Table 1.
Added Typical Video Phase Noise Plot and data.
Removed references to Si5325.
Added note to register CKOUT_ALWAYS_ON on
how to control output to output skew.
Added Product Selection Guide to Section “7.
Ordering Guide”.
Corrected typographical errors in Table 1.
Updated typical phase noise performance page.
Updated functional description.
Added additional phase noise plots to Section “3.3.
Typical Phase Noise Performance”.
Updated Register Map.
Revised Device Top Mark.
Revision 0.25 to Revision 0.3
Changed Any-Rate to Any-Frequency
 Changed Table 2, “Absolute Maximum Ratings,” on
page 6.
 Added Table 11, “CKOUT_ALWAYS_ON and
SQ_ICAL Truth Table,” on page 25
 Added “no bypass with CMOS outputs”

Revision 0.3 to Revision 1.0
Expanded spec Tables 1 and 2 to include all
specifications in the Reference Manual.
 Reordered sections to conform to data sheet quality
convention.
 Added tSETTLE specification.








Corrected minor register map typos.
Minor changes to Table 2.
Added maximum lock and settle times to Table 3.
Added titles to Tables 8, 9, and 10.
Updated/added selection guide Tables 13 and 14.
Removed SLEEP from register map.
Added warning about MEMS reference oscillators to
"3.1. External Reference" on page 20.
Rev. 1.1
71
Si5324
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Please visit the Silicon Labs Technical Support web page:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
Patent Notice
Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analogintensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where
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Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
72
Rev. 1.1
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