TVS Diode Arrays General Purpose ESD Protection - SP1001 Series (SPA Diodes)

TVS Diode Arrays General Purpose ESD Protection - SP1001 Series (SPA Diodes)
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
SP1001 Series - 8pF 15kV Unidirectional TVS Array
RoHS
Pb GREEN
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes above
the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting highspeed signal pins.
Pinout
Features
*SP1001-02
(SC70-3)
*SP1001-04
(SC70-5)
1
1
5
2
3
3
2
4
SP1001-04
(SOT 553)
1
2
3
1
6
NC
2
5
2
3
4
NC
SP1001-05
(SOT 563)
5
SP1001-05
(SOT 963)
1
6
1
2
5
2
5
4
3
4
3
4
SP1001-02
(SOT 553)
*SP1001-05
(SC70-6)
6
*Note: AEC-Q101 qualified
Functional Block Diagram
SP1001-02
2
1
5
4
• Low capacitance of 8pF
(TYP) per I/O
• Low leakage current of
0.5μA (MAX) at 5V
• ESD protection of ±15kV
contact discharge, ±30kV
air discharge, (Level 4,
IEC61000-4-2)
• Small package saves
board space
• EFT protection,
IEC61000-4-4, 40A
(5/50ns)
• AEC-Q101 qualified
(SC70-x packages)
• Lightning protection,
IEC61000-4-5, 2A (8/20µs)
Applications
• Computer Peripherals
• LCD/PDP TVs
• Mobile Phones
• Set Top Boxes
• Digital Cameras
• DVD Players
•Desktops/Notebooks
•MP3/PMP
SP1001-02
4
5
Application Example
LCD module
Controller
Input
3
1
SP1001-05
4
2
3
6
1
5
2
4
Outside World
SP1001-04
5
D1
D2
D3
D4
2
SP 1001-04JTG (SC70-5)
SP 1001-04XTG (SOT553)
Shield
Ground
3
Signal
Ground
Additional Information
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/26/16
Datasheet
Resources
Samples
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Absolute Maximum Ratings
Symbol
Thermal Information
Parameter
Value
Units
2
A
Storage Temperature Range
Operating Temperature
–40 to 125
°C
Storage Temperature
–55 to 150
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
Parameter
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Rating
Units
–55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering
20s-40s)
260
°C
Thermal Resistance Junction to Ambient
124.21
°C/W
Thermal Resistance Junction to Case
190.54
°C/W
1
W
Power Dissipation
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Forward Voltage Drop
VF
Reverse Voltage Drop
VR
Reverse Standoff Voltage
VRWM
IR≤1µA
5.5
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
µA
V
Clamp Voltage1
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1,2
VESD
Diode Capacitance1
CD
Min
Typ
IF=10mA
0.7
0.9
IR=1mA
6.0
Max
1.2
V
8.5
V
IPP=1A, tp=8/20µs, Fwd
8.0
11.0
IPP=2A, tp=8/20µs, Fwd
9.7
13.0
(VC2 - VC1) / (IPP2 - IPP1)
1.7
IEC61000-4-2 (Contact)
±15
IEC61000-4-2 (Air)
±30
Units
V
Ω
kV
kV
Reverse Bias=0V
12
pF
Reverse Bias=2.5V
8
pF
Reverse Bias=5V
7
pF
Notes:
1
Parameter is guaranteed by device characterization
2
A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should be
placed on the circuit board as close to the source of the ESD
transient as possible. Install the ESD suppressors directly
behind the connector so that they are the first board-level
circuit component encountered by the ESD transient. They
are connected from signal/data line to ground.
14
12
Capacitance (pF)
10
8
6
4
2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
DC Bias (V)
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/26/16
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes max.
Do not exceed
260°C
Part Numbering System
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
time to peak temperature
Time
Product Characteristics
SP1001-0* * T G
TVS Diode Arrays
(SPA® Diodes)
G= Green
T= Tape & Reel
Package
Series
Number of Channels
J = SC70-3, SC70-5 or SC70-6
X = SOT553 or SOT563
V = SOT963
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
Part Marking System
Lead Plating
Matte Tin (SC70-x) Pre-Plated Frame
(SOT5x3, SOT963)
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute
Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
A* *
A**
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
25
Peak Temperature (TP)
tP
TP
Temperature
Reflow Condition
Product Series
2. Dimensions include solder plating.
Number of Channels
A = SP1001 series
(varies)
Assembly Site
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP1001-02JTG
SC70-3
A*2
3000
SP1001-02XTG
SOT553
A*2
3000
SP1001-04JTG
SC70-5
A*4
3000
SP1001-04XTG
SOT553
A*4
3000
SP1001-05JTG
SC70-6
A*5
3000
SP1001-05VTG
SOT963
A*5
8000
SP1001-05XTG
SOT563
A*5
3000
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/26/16
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SC70
SC70-3
B
Solder Pad Layout
3
Package
SC70-3
Pins
3
JEDEC
MO-203
Millimeters
E HE
2
1
e
e
D
A2 A
A1
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
0.66 BSC
e
C
L
6
SC70-5
e
e
5
not used
Solder Pad Layout
4
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package
SC70-5
Pins
5
JEDEC
MO-203
Millimeters
3
2
1
B
D
A2 A
A1
C
L
6
SC70-6
B
5
4
Solder Pad Layout
E
1
2
HE
Min
Max
Min
Max
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
0.65 BSC
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package
SC70-6
Pins
6
JEDEC
MO-203
Millimeters
3
D
A2 A
A1
C
Max
Inches
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
L
0.026 BSC
HE
Min
B
Inches
A
e
B
0.026 BSC
HE
HE
E
Inches
Min
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/26/16
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SOT553 and SOT563
A
6
Package
L
D
SOT 553
5
(not used)
4
E
HE
5
Millimeters
Solder Pad Layout
e
Max
Min
Max
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
c
B
0.50 BSC
e
A
D
6
5
2
4
E
3
e
L
SOT 563
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Package
SOT 563
Pins
6
Millimeters
Inches
Min
Max
Min
Max
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
HE
A
B
0.020 BSC
L
Solder Pad Layout
c
Inches
Min
A
3
2
SOT 553
Pins
0.50 BSC
e
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Package Dimensions — SOT963
Package
SOT 963
Pins
6
Millimeters
Nom
Max
Min
Nom
Max
0.44
0.48
0.50
0.0173
0.0189
0.0197
B
0.10
0.15
0.20
0.004
0.006
0.008
c
0.05
0.10
0.15
0.002
0.004
0.006
A
D
0.95
1.00
1.05
0.037
0.039
0.041
E
0.75
0.80
0.85
0.029
0.031
0.033
E1
0.95
1.00
1.05
0.037
0.039
0.041
0.35 BSC
e
Recommanded Solder Pad Layout
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/26/16
Inches
Min
0.014 BSC
L
0.05
0.10
0.15
0.002
0.004
0.006
L1
0.125
0.15
0.175
0.005
0.006
0.007
ø
3º
5º
7º
3º
5º
7º
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Embossed Carrier Tape & Reel Specification — SC70-3
Dimensions
Millimetres
Min
Inches
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0 ± 0.20
1.574 ± 0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.30
2.50
0.090
0.098
1.00 Ref
A1
B0
2.30
2.50
0.090
1.90 Ref
B1
K0
0.039 Ref
0.098
0.074
1.10
1.30
0.043
0.051
K1
0.60 Ref
0.023 Ref
t
0.27 max
0.010
Millimetres
Inches
Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6
Dimensions
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0 ± 0.20
W
7.70
1.574 ± 0.008
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.096
K0
1.12
1.32
0.044
0.052
t
0.27 max
0.010 max
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/26/16
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Embossed Carrier Tape & Reel Specification — SOT553 and SOT563
Dimensions
Millimetres
Min
Inches
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.1
0.154
0.161
10P0
40.0 ± 0.20
1.574 ± 0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
1.73
1.83
0.068
0.072
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
0.22 max
t
.009 max
Embossed Carrier Tape & Reel Specification – SOT963
t
W
KO
AO
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/26/16
BO
Inches
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.136
0.140
D1
0.45
0.55
0.018
0.022
P0
P
Millimetres
Min
1.50 min
D
F
oD1
/
Dimensions
Symbol
E
P2
o/ D
PO
10P0
3.90
0.059 min
4.10
40.0 ± 0.20
0.154
0.161
1.575 ± 0.008
P
1.95
2.05
0.077
0.081
P2
1.95
2.05
0.077
0.081
W
7.90
8.20
0.311
0.323
A0
1.11
1.21
0.044
0.048
B0
1.11
1.21
0.044
0.048
K0
0.58
0.68
0.023
0.027
t
0.22 max
0.009 max
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