Data Sheet | Dialog Semiconductor SC14WAMDECT SF Wireless Audio Module Datasheet
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The SC14WAMDECT SF is a wireless audio module that can be used in both Public Address and Tour Guide applications. It is pre-approved for use in all countries that use the DECT frequency band and is well suited for users who wish to make a wireless audio system but have little or no DECT experience. The module supports an internal antenna and can handle up to 128 receivers for Tour Guide applications.
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SC14WAMDECT SF
Wireless Audio Module
FINAL
General description
The SC14WAMDECT SF is a Cordless Audio Module with an integrated baseband, radio transceiver, power amplifier and crystal to be used in cordless microphone applications in the DECT frequency band. This module is intended for users with little or no DECT experience, who wish to make a wireless audio system.
The module can be configured for various audio applications. A Public Address System has two portable parts (PP) with two microphones and one fixed part
(FP) configured as a receiver and integrated into a loudspeaker. Another application is a Tour Guide Sys-
tem where one a microphone (FP) broadcasts to up to
128 receivers (PP) with an integrated loudspeaker or a headset connected. The SC14WAMDECT SF module is suitable for both FP and PP usage: a hardware pin selects the function of the module.
Features
Pre-programmed and ready-to-use module
Antenna embedded, support for external antennas
High quality audio sampled at 25.6 kHz
Latency: 14.2 ms (PA mode), 18.3 ms (TG mode)
UART data transfer (up to 1 kbit/s) in TG mode
Access code for secure registration in TG mode
ETSI (DECT) and FCC (DECT 6.0) certified
Japan DECT (J-DECT) pre-certified
Supports 1.9 GHz and 1.7 GHz DECT bands
Receiver sensitivity < -93 dBm
Transmit power EU: 23 dBm, USA: 20 dBm,
JPN: 20 dBm
Power supply voltage: 2.1 V to 3.45 V
Supports NiMH and Alkaline batteries
Small form factor (19.6 mm x 18.0 mm x 2.7 mm)
Operating temperature range: -40 °C to +85 °C
The SC14WAMDECT SF module is pre-approved for use in all countries that use the DECT frequency band, as well as the DECT 6.0 frequency band used in North
America.
Applications
Public Address System with one or two microphones
(transmitter) and one loudspeaker (receiver)
Tour Guide System with one microphone (transmitter) and up to 128 headsets (receiver)
________________________________________________________________________________________________
System diagram
PP
1 or 2 transmitters
PP
Receiver
FP
Public Address System
Transmitter
FP
PP
1 to 128 receivers
Tour Guide System
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
1 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
Table of Contents
1.0 Connection diagram. . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 PIN DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . 4
5.6.2 Internal and external antenna with FAD. 15
2.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 REFERENCES . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 GLOSSARY AND DEFINITIONS . . . . . . . . . . . 7
3.0 Wireless Audio Module functions. . . . . . . . . . . . . 8
3.1 DECT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 MICROPHONE CONFIGURATION . . . . . . . . . 8
3.3 LOUDSPEAKER CONFIGURATION . . . . . . . . 9
3.4 FUNCTIONAL OVERVIEW . . . . . . . . . . . . . . . 10
6.0 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.1 GENERAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . 16
6.3 OPERATING CONDITIONS . . . . . . . . . . . . . . 17
6.4 SUPPLY CURRENTS . . . . . . . . . . . . . . . . . . . 17
6.5 DIGITAL INPUT/OUTPUT PINS . . . . . . . . . . . 18
6.6 ANALOG FRONT END . . . . . . . . . . . . . . . . . . 19
6.7 AUDIO PERFORMANCE . . . . . . . . . . . . . . . . 21
6.8 BASEBAND PART . . . . . . . . . . . . . . . . . . . . . 22
6.9 RADIO (RF) PART . . . . . . . . . . . . . . . . . . . . . 23
6.10 RF POWER SUPPLY . . . . . . . . . . . . . . . . . . 23
6.11 RF CHANNEL FREQUENCIES. . . . . . . . . . . 24
4.0 Functional description. . . . . . . . . . . . . . . . . . . . . 11
4.1 AUDIO CONFIGURATION . . . . . . . . . . . . . . . .11
4.1.1 Microphone connection . . . . . . . . . . . . . .11
4.1.2 Audio equalisation . . . . . . . . . . . . . . . . . .11
4.2 POWER MANAGEMENT . . . . . . . . . . . . . . . . .11
4.3 OUT-OF-RANGE HANDLING . . . . . . . . . . . . . .11
4.4 PREAMBLE ANTENNA DIVERSITY. . . . . . . . .11
4.5 REGISTRATION . . . . . . . . . . . . . . . . . . . . . . . 12
4.5.1 Handling product identities . . . . . . . . . . 12
4.5.2 Access code . . . . . . . . . . . . . . . . . . . . . 12
4.6 DEREGISTRATION . . . . . . . . . . . . . . . . . . . . 12
4.7 DATA TRANSFER. . . . . . . . . . . . . . . . . . . . . . 12
7.0 Design guidelines. . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1 PCB DESIGN GUIDELINES . . . . . . . . . . . . . . 25
7.2 MODULE PLACEMENT ON THE MAIN BOARD
7.3 PATTERN FOR PIN 79 ON THE MAIN BOARD.
7.4 PRECAUTIONS REGARDING UNINTENDED
COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.0 Example application diagrams . . . . . . . . . . . . . . 27
5.0 Usage guidelines . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1 PUBLIC ADDRESS MODE . . . . . . . . . . . . . . . 14
5.1.1 Microphone (PP) . . . . . . . . . . . . . . . . . . 14
5.1.2 Loudspeaker (FP) . . . . . . . . . . . . . . . . . 14
5.1.3 LED indication . . . . . . . . . . . . . . . . . . . . 14
5.1.4 Volume control . . . . . . . . . . . . . . . . . . . . 14
5.1.5 Accessory input/output . . . . . . . . . . . . . 14
5.2 TOUR GUIDE MODE . . . . . . . . . . . . . . . . . . . 14
5.2.1 Microphone (FP) . . . . . . . . . . . . . . . . . . 14
5.2.2 Headphone (PP) . . . . . . . . . . . . . . . . . . 14
5.2.3 LED indication . . . . . . . . . . . . . . . . . . . . 14
5.2.4 Volume control . . . . . . . . . . . . . . . . . . . . 14
5.2.5 Accessory input/output . . . . . . . . . . . . . 15
5.2.6 API (Tour Guide mode only) . . . . . . . . . 15
5.3 REGISTRATION . . . . . . . . . . . . . . . . . . . . . . . 15
5.4 DEREGISTRATION . . . . . . . . . . . . . . . . . . . . 15
5.5 BATTERY LOW DETECTION . . . . . . . . . . . . . 15
5.6 ANTENNA OPERATION . . . . . . . . . . . . . . . . . 15
5.6.1 Internal antenna only . . . . . . . . . . . . . . . 15
9.0 Notices to OEM. . . . . . . . . . . . . . . . . . . . . . . . . . . 29
9.1 FCC REQUIREMENTS REGARDING THE END
PRODUCT AND THE END USER . . . . . . . . . 29
9.2 INDUSTRY CANADA REQUIREMENTS RE-
GARDING THE END PRODUCT AND THE END
USER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
9.3 END APPLICATION APPROVAL . . . . . . . . . . 30
9.4 SAFETY REQUIREMENTS. . . . . . . . . . . . . . . 30
10.0 Package information . . . . . . . . . . . . . . . . . . . . . 31
10.1 SOLDERING PROFILE. . . . . . . . . . . . . . . . . 31
10.2 MOISTURE SENSITIVITY LEVEL (MSL) . . . 31
10.3 COPPER PAD, SOLDER OPENING AND
STENCIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
10.4 MECHANICAL DIMENSIONS . . . . . . . . . . . . 34
11.0 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 35
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
2 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
1.0 Connection diagram
FINAL
NC
VREFm
LSRp
LSRn
GND
ACCESS_1
ACC_IN
SOCp
SOCn
GND
GND
NC
CHARGE_CTRL
CHG_DET/PON
NC
NC
CP_VOUT1
NC
GND
P0
RFP0
P0n
RFP0n
GND
VREFp
MICp
NC
22
23
24
25
26
19
20
21
27
4
5
6
7
8
9
10
1
2
3
11
12
13
14
15
16
17
18
79
TP1
82
81
SC14WAMDECT SF
80
GND
GND
GND
GND
RF0
GND
RF1
GND
GND
GND
ACCESS_2
ACCESS_3
ACCESS_4
ACCESS_5
ACCESS_0
VBATIN
VBATIN
VBATSW
VDDOUT
GND
LED_GRN
LED_RED1
NC
NC
NC
NC
JTAG
RSTn
75
74
73
72
71
70
69
78
77
76
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
Figure 1: Connection diagram (top view, leads face down)
Table 1: Ordering information
Part number
SC14WAMDECT SF01T
Package
MOD88
Note 1: MOQ = 600 pcs.
Datasheet
CFR0011-120-00-FM Rev 5
Size (mm)
18 x 19.6
Revision 3.0
3 of 36
Shipment form
Tray
Pack quantity
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
1.1 PIN DESCRIPTION
7
8
9
10
3
4
1
2
5
6
11
12
13
14
15
Table 2: Pin description
Pin
Module
Pin name
GND
P0
RFP0
P0n
RFP0n
GND
VREFp
MICp
NC
NC
VREFm
LSRp
LSRn
GND
ACCESS_1
In/
Out
O
I
-
-
-
O
O
O
O
-
O
-
I
-
O
16
24
25
26
27
28
29
21
22
23
17
18
19
20
30
31
ACC_IN
SOCp
SOCn
GND
GND
NC
CHARGE_CTRL
CHG_DET/
PON
NC
NC
CP_VOUT1
NC
GND
PON
GND
GND
-
-
-
O
-
I
I
I
-
-
-
O
I
-
-
I
-
1
-
-
-
-
-
-
-
-
-
-
-
Iout
Drive
(mA)
-
-
-
-
8
8
-
8
8
-
-
-
-
-
-
-
-
-
Reset
State
Description
I
I
-
-
Ground
Hi-Z Control port for FAD. See
Hi-Z Control port for FAD. See
Hi-Z Control port for FAD. See
Hi-Z Control port for FAD. See
Ground
Positive microphone supply voltage.
Positive microphone input.
Must be unconnected.
Must be unconnected.
-
O
O
-
Negative microphone reference (star point), connect to GND.
Positive loudspeaker output.
Negative loudspeaker output.
Ground
I TG mode: Access code bit 1.
PA mode: Must be unconnected.
I-PU Transmitter (PA PP or TG FP): Accessory input
Receiver (PA FP or TG PP): Must be unconnected.
-
-
-
I
-
I-PD
(270k fixed pulldown)
I
I
-
-
Battery state of charge positive input. Not used, connect to GND.
Battery state of charge negative input. Not used, connect to GND.
Ground
Ground
Must be unconnected.
O-0 Charge control output. Not used, leave unconnected.
I-PD
(270k fixed pulldown)
PP: Charge Detect input.
FP: Power On pushbutton input:
When OFF and short press: switch ON.
When ON and 2 s press: registration.
When ON and 5 s press: power OFF.
When ON and 10 s press: deregistration.
-
-
Must be unconnected.
Must be unconnected.
Must be unconnected.
Must be unconnected.
Ground
PP: Power On & Toggle Mute pushbutton input.
When OFF and short press: switch ON.
When OFF and 2 s press: switch ON and registration.
When ON and short press: toggle mute.
When ON and 2 s press: power OFF.
FP: Must be unconnected.
Ground
Ground
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
4 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
Table 2: Pin description (Continued)
Pin
32
Module
Pin name
(Note 2)
ACC_OUT
In/
Out
O
33
34
35
36
37
38
39
40
41
42
43
48
49
50
51
52
44
45
46
47
53
54
55
56
57
58
MAS_SLV
FP_PP
VOL_DN
VOL_UP/
MUTE
NC
GND
NC
REGION1
REGION2
LED_RED2
RF_POWER
NC
GND
NC
UART_RX
UART_TX
GND
GND
GND
RSTn
JTAG
NC
NC
NC
NC
LED_RED1
O
-
-
I
-
-
-
-
-
-
O
-
-
-
-
-
I
-
-
I
I
-
I
I
I
O
-
-
-
-
-
-
-
-
8
-
-
-
-
-
8
-
-
-
1
Iout
Drive
(mA)
8
-
-
-
-
-
-
8
Reset
State
(Note 3)
Description
-
-
I
-
-
-
-
-
-
I-PU
(200k pull-up)
-
Receiver (PA FP or TG PP): Accessory output
Transmitter (PA PP or TG FP): Must be unconnected.
I-PD Configuration of PA and TG mode.
I-PD
MAS_SLV FP_PP
H L
Mode
PA receiver
H
L
L
H
L
H
PA transmitter
TG transmitter
TG receiver
I-PD PP: Volume Down input. Connect to Volume Down pushbutton.
FP: Must be unconnected.
I-PU PP: Volume Up input. Connect to Volume Up pushbutton.
FP: Mute input. When this pin is pulled LOW the FP will mute all audio to/from the PP.
Must be unconnected.
-
Ground
Must be unconnected.
I-PU Selection of DECT RF frequency (FP and PP).
I-PD
REGION1 REGION2 RF BAND
L
L
L
H
DECT 6.0 (USA)
Reserved
H
H
L
H
Japan DECT
European DECT
I PA FP: Red LED 2 output (see
). Connect to VDDOUT via a series resistor (typ. 39
.
Other modes: Must be unconnected.
I-PU RF Power mode selection input.
High Power Mode (HPM): leave unconnected.
Low Power Mode (LPM): connect to GND.
-
-
-
I-PD
(10k)
Must be unconnected.
Ground
Must be unconnected.
UART RX input, debug purposes.
UART TX output, debug purposes.
Ground
Ground
Ground
Active low Reset input with Schmitt-trigger input, open-drain output and pull-up resistor to internal VDD. Input may not exceed 2.0 V. An internal capacitor of 47 nF is mounted on this pin.
Debug purposes. Internally connected to VDDOUT (pin 61) via a
1 k
resistor
Must be unconnected.
Must be unconnected.
Must be unconnected.
Must be unconnected.
Red LED output 1. See
.
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
5 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
62
63
64
65
Table 2: Pin description (Continued)
Pin
59
60
61
Module
Pin name
(Note 2)
LED_GRN
GND
VDDOUT
In/
Out
O
-
-
66
67
68
69
73
74
75
76
70
71
72
VBATSW
VBATIN
VBATIN
ACCESS_0
ACCESS_5
ACCESS_4
ACCESS_3
ACCESS_2
GND
GND
GND
RF1
GND
RF0
GND
77
78
GND
GND
79
80
TP1
GND
81:88 TP2 to TP9
O
-
-
-
-
-
-
-
-
-
-
-
I
I
I
I
I
I
I
NC
8
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Iout
Drive
(mA)
8
-
-
-
-
-
-
Reset
State
(Note 3)
Description
-
-
-
-
-
-
-
-
-
-
-
I
-
-
Supply voltage output for LED_RED2 (typ. 1.8 V). Internally connected to JTAG (pin 53) via a 1 k
pull-up resistor.
I-PU Supply voltage output for LED_RED1, LED_GRN (< 3.45 V).
Main supply voltage < 3.45 V.
Main supply voltage < 3.45 V.
TG mode: Access code bit 0 (LSB).
PA mode: Must be unconnected.
I
-
I
Green LED output. See section 5.0
Ground
I
I
I
TG mode: Access code bit 5 (MSB).
PA mode: Must be unconnected.
TG mode: Access code bit 4.
PA mode: Must be unconnected.
TG mode: Access code bit 3.
PA mode: Must be unconnected.
TG mode: Access code bit 2.
PA mode: Must be unconnected.
Ground
Ground
Ground
RF signal for external antenna. See section 5.6
Ground
RF signal for external antenna. See section 5.6
Ground
Ground
Ground
Tuning point for internal antenna. Follow instructions of section 7.3
.
Ground
Must be unconnected. See
Note 2: GND: internally connected to the module ground plane. Every GND pin should be connected to the main PCB.ground plane.
NC: not connected.
TP: test point.
Note 3: All digital inputs have Schmitt trigger inputs. After reset all I/Os are set to input and all pull-up or pull-down resistors are enabled unless otherwise specified.
PU = Pull-up resistor enabled, PD = Pull-down resistor enabled, I = input,
O = output, Hi-Z = high impedance, 1 = logic HIGH level, 0 = logic LOW level
Refer also to Px_DIR_REGs for INPUT/OUTPUT and Pull-up/Pull-down configurations
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
6 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
2.0 Introduction
2.1 SCOPE
The SC14WAMDECT SF module can be configured for various audio applications. A Public Address System has two portable parts (PP) each with a microphone and one fixed part (FP) configured as a receiver and integrated into a loudspeaker. Another application is a
Tour Guide System, where one microphone is the FP which broadcasts to up to 128 (PP) receivers with an integrated loudspeaker or with a headset connected.
2.2 REFERENCES
1. AN-D-218, SC14WAMDECT External antenna design guidelines, Application note, Dialog Semiconductor.
2. AN-D-223, SC14WAMDECT production pairing,
Application Note, Dialog Semiconductor.
3. FpApiProject.pdf, Specification for interface between FpApiProject and Host in WAM project,
Dialog Semiconductor.
4. PpApiProject.pdf, Specification for interface between PpApiProject and Host in WAM project,
Dialog Semiconductor.
2.3 GLOSSARY AND DEFINITIONS
DECT Digital Enhanced Cordless Telephone
VES
WAM
FAD
FP
Fast Antenna Diversity
Fixed Part; the microphone for the TG system or the speaker for the PA system.
GFSK Gaussian Frequency Shift Keying
HW Hardware
IPEI
MMI
International Portable Equipment Identity (refer to ETSI EN 300 175-6)
Man Machine Interface
NC
PA
PCB
PP
Not Connected
Public Address (System)
Printed Circuit Board (without components)
Portable Part; the microphone for the
PA system or the speaker for the TG system.
RFPI
RSSI
Radio Fixed Part Identity (refer to
ETSI EN 300 175-6)
Radio Signal Strength Indication
(please refer to ETSI EN 300 175-1)
State Of Charge SOC
SW Software
TG Tour Guide (System)
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
7 of 36
Virtual EEPROM Storage
Wireless Audio Module
FINAL
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
3.0 Wireless Audio Module functions
This section describes the key functions and features supported by the SC14WAMDECT SF module.
3.1 DECT
The SC14WAMDECT SF is based on the ETSI DECT specifications for digital cordless telephone systems.
shows that this module has two configurations: microphone (MIC) and loudspeaker (SPEAKER).
FINAL
One internal antenna is embedded and an external antenna is supported (see section
). An external microcontroller can be used for limited control purposes via the UART interface. See
.
3.2 MICROPHONE CONFIGURATION
For a microphone configuration the SC14WAMDECT
SF module requires the external parts listed in
.
Table 3: Microphone configuration overview
Item
Battery
Microphone
Keys
LEDs
Supported
Yes
Yes
Yes
Yes
Remark
2 NiMH or standard Alkaline cells.
Note: For LiIon batteries an external LDO is required.
Connect to pin MICp (single ended).
Connect to pins ACC_IN, PON, VOL_UP/MUTE and VOL_DN.
Connect to pins LED_RED1 and LED_GRN.
Figure 2 shows the usage of the module with an exter-
nal microphone. This MIC configuration can be used for the PP of a Public Address System and for the FP of a Tour Guide System.
Keys
LEDs
SC14WAMDECT SF
Microphone
Battery
Figure 2: MIC configuration
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
8 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
3.3 LOUDSPEAKER CONFIGURATION
For a loudspeaker configuration the SC14WAMDECT
SF module requires the external components listed in
Table 4: Loudspeaker configuration overview
Item
Battery
Loudspeaker
Keys
LEDs
Supported
Yes
Yes
Yes
Yes
Remark
2 NiMH or standard Alkaline cells.
Connect to pins LSRp and LSRn (differential).
Connect to pins CHG_DET/PON, VOL_UP/MUTE and VOL_DN.
PA mode: Connect to pins LED_RED1, LED_RED2 and LED_GRN.
TG mode: Connect to pins LED_RED1 and LED_GRN.
FINAL
Figure 3 shows the use of the module in a typical loud-
speaker configuration. This SPEAKER configuration can be used for the FP of a Public Address System and for the PP of a Tour Guide System.
Keys
LEDs
SC14WAMDECT SF Loudspeaker
Battery
Figure 3: SPEAKER configuration
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
9 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
3.4 FUNCTIONAL OVERVIEW
Table 5: Overview of supported functions
Functionality
Connection handling
PP to FP
FP to PP
Protocol
Registration
Remark
PA mode: 1 or 2 microphones (PP) transmit to one loudspeaker (FP).
TG mode: 1 microphone (FP) broadcasts to max. 128 loudspeakers (PP).
Number of PPs per FP
Link establishment time
Registration time-out
Manual.
TG mode: optionally protected by 6-bit access code.
PA mode: 1 or 2
TG mode: 1 to 128
2 s (typ.)
FP: 600 s (TG mode)
PP: 120 s (TG mode)
Wire registration is supported. See [
]. Factory registration
Audio and tone
Microphone mute
Latency
Mute of MIC in all audio connections is possible.
PA mode: 1 MIC: 14.2 ms, 2 MICs: 14.2 ms or 15.8 ms
.
General
Battery handling Charging is not supported, requires external components.
FINAL
Note 4: Latency for 2 microphones depends on the assigned slot.
Note 5: For Tour Guide System the 'normal delay' applies as defined in the DECT specification.
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SC14WAMDECT SF
Wireless Audio Module
4.0 Functional description
4.1 AUDIO CONFIGURATION
The SC14WAMDECT SF module supports a dedicated audio channel. The gains can be adjusted to meet the audio level requirements by using the
SC14WAMDECT SF application reference design. For other acoustic designs it is needed to adjust and tune the audio setup.
FINAL
4.1.1 Microphone connection
The SC14WAMDECT SF module only supports singleended connection of a microphone.
4.1.2 Audio equalisation
To enable adjustments of the frequency response the
SC14WAMDECT SF contains two programmable filters
in the TX direction (see Figure 4) .
CELT
Figure 4: MIC audio routing
4.2 POWER MANAGEMENT
To minimise the current consumption the
SC14WAMDECT SF module will shut down all codec amplifiers in Idle state. This means that all reference voltages in the front-end will be disabled.
4.3 OUT-OF-RANGE HANDLING
When the PP goes in-range or out-of-range a signal is sent from the PP to the MMI software indicating whether the PP is in-lock or is out-of-lock with the FP.
This is used to indicate the link status via pins
LED_RED1 and LED_RED2 on the FP.
4.4 PREAMBLE ANTENNA DIVERSITY
To optimise the audio quality during rapidly changing radio paths (fading), the SC14WAMDECT SF supports preamble antenna diversity. The preamble diversity algorithm uses RSSI measurements to judge the radio signal strength on both antennas and determine the best performing antenna. This antenna will be used for the receive slot and for the next transmit slot.
The software embedded in the SC14WAMDECT SF supports antenna diversity for both FP and PP with at least one external antenna. Refer to
for more detailed information.
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4.5 REGISTRATION
The PP and the FP must be paired using a procedure called Registration. Without registration the PP will be out-of-lock and unable to establish a link to a FP.
Therefore it will not be able to make a call.
The registration uses the unique product identities and secures the PP and FP to allow no cross-communication. To avoid cross-communication it is very important that all the PPs and the FP use a unique numbering scheme, which is standard in DECT based systems.
It is possible to pair a PP and FP during production using the production interface including wire registration. See [
].
FINAL
4.5.1 Handling product identities
To ensure that the FP and PPs do not make crosscommunications a unique ID must be entered into the
VES of the FP and PP. For DECT products, the FP identifier is called the RFPI and the PP identifier is called the IPEI. These numbers are factory settings.
After a successful registration, the IPEI is stored in the
FP and the RFPI is stored in the PP. In this way the two parts are known to each other and are allowed to make connections. See
.
FP
Subscription areas in
EEPROM
(Stores the IPEI of the registered PPs)
Subscription data PP #1
Subscription data PP #2
DECT
RF link
PP #1
Subscription areas in
EEPROM
(Stores the RFPI of the registered FPs)
Subscription data FP #1
4.5.2 Access code
Figure 5: Handling product identities
In TG mode a 6-bit access code (0x00 to 0x3F) can be defined via pins ACCESS_0 to ACCESS_5. The bit pattern on the ACCESS_x pins of the FP must be set before registration and needs to remain stable during registration. For successful registration of a PP the access codes of PP and FP must be the same.
4.6 DEREGISTRATION
There are two ways of deregistering a PP from an FP:
• PP registration:
After successful PP registration an existing FP pairing will be overwritten. This method can be used when the PP should be combined with another FP and the original registration should be removed.
• FP deregistration:
During FP deregistration all existing PP pairings are removed. This method can be used when the original PPs were lost.
4.7 DATA TRANSFER
In Tour Guide mode an API function is available for broadcasting data from FP to PP via the UART at a rate of 1 kbit/s. The data is transmitted in packets of maximum 20 bytes. No data interpretation is done.
For more information on this API function, see [
] and
[ 4 ]. A software example (“Sendmail”) of data transfer
via UART is available on request.
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Wireless Audio Module
5.0 Usage guidelines
This section outlines the usage guidelines for both applications: Public Address mode (PA system) and
Tour Guide mode (broadcasting).
Initially the Public Address mode is described. Many of the user functions and behaviours in the Tour Guide mode are the same and therefore are not repeated in the Tour Guide section.
Note: The end product user must not be able to switch between the two modes. Only when designing and manufacturing the end product shall the operating mode be assigned.
FINAL
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FINAL
5.1 PUBLIC ADDRESS MODE
In Public Address mode one or two battery operated wireless microphones (PP, transmitter) connect to a standalone loudspeaker (FP, receiver).
5.1.1 Microphone (PP)
The wireless microphone can be a standard handheld microphone or a belt pack with a lavalier microphone attached. The SC14WAMDECT SF module (transmitter, PP) can be integrated into the microphone.
The microphone or belt pack should have three LEDs
(two red and one green), a Power On button and two optional pushbuttons for volume up and down.
5.1.2 Loudspeaker (FP)
The SC14WAMDECT SF module (receiver, FP) can be integrated directly into a loudspeaker or an amplifier. In the use case described below it is assumed that the module is built into a simple loudspeaker with integrated amplifier.
The loudspeaker can be mains or battery operated.
The loudspeaker should have three status LEDs (two red and one green) and one pushbutton, which acts as both Power On and Registration button.
The Power On button will normally be connected to the power switch of the loudspeaker/amplifier. The Registration button is used for pairing of a wireless microphone with the loudspeaker.
5.1.3 LED indication
A green LED and two red LEDs indicate the status of the module. The indications apply for both FP and PP.
Pins LED_RED1 and LED_RED2 indicate the status of
microphones 1 and 2. See Table 6 .
Table 6: LED status indications
LED_GRN LED_REDx Description
OFF
ON
OFF
OFF
OFF flash 0.25 s flash 0.5 s
OFF
OFF
ON module OFF module ON, no link module ON, link good flash 0.5 s mute (MIC or SPEAKER) flash 1 s registration ongoing
OFF
OFF battery LOW, link good battery LOW, no link
5.1.4 Volume control
The microphone can have optional Volume Up and Volume Down keys. The volume control range is:
• Microphone volume: 0 dB to +30 dB, 2 dB/step, default value: +10 dB.
• Loudpeaker volume: fixed at 0 dB.
To mute the microphone press and release the Power
On button (toggle).
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To mute both microphones from the loudspeaker side
(FP), press and hold the Volume Up key. The audio will be muted as long as this key is pressed.
5.1.5 Accessory input/output
The accessory input (pin ACC_IN) for the microphone
(PP) and the accessory output (pin ACC_OUT) for the loudspeaker (FP) are supported as shown in
.
Table 7: Accessory I/O function table (PA mode)
ACC_IN (PP1) ACC_IN (PP2) ACC_OUT (FP)
L
L
H
H
L
H
L
H
H
L
L
L
Pin ACC_OUT could be used to control an external audio amplifier to drive large loudspeakers.
5.2 TOUR GUIDE MODE
In Tour Guide mode a microphone (FP, transmitter) broadcasts to up to 128 headphones (PP, receiver).
After pairing to the FP, all headphones will receive the same audio signal from the microphone.
5.2.1 Microphone (FP)
The microphone is the audio transmitter and should include two LEDs (red and green), a Power On button and two optional pushbuttons for volume up and down.
The SC14WAMDECT SF module (transmitter, FP) can be integrated into the microphone.
5.2.2 Headphone (PP)
The SC14WAMDECT SF module (receiver, PP) is normally built into the headphone and directly connected to the loudspeaker.
5.2.3 LED indication
A green and a red LED (pin LED_RED1) indicate the status of the module. The indications apply for both FP and PP. Pin LED_RED2 is not used. See
.
5.2.4 Volume control
The headphone can have optional Volume Up and
Down pushbuttons. The volume control range is:
• Microphone volume: fixed at +10 dB.
• Loudspeaker volume: -12 dB to +2 dB, 2 dB/step, default value: +2 dB.
To mute the loudspeaker (receiver) press and release the Power On button (toggle). To mute the microphone
(transmitter) press and hold the Volume Up key. The audio will be muted as long as this key is pressed.
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Wireless Audio Module
5.2.5 Accessory input/output
The accessory input (pin ACC_IN) for the microphone
(FP) and the accessory output (pin ACC_OUT) for the loudspeaker (PP) are supported as shown in
.
Table 8: Accessory I/O function table (TG mode)
ACC_IN (FP)
L
H
ACC_OUT (PP)
H
L
5.2.6 API (Tour Guide mode only)
The SC14WAMDECT SF software has a simple API to control the module from an external host processor.
The API supports the following basic functions for Tour
Guide mode operation:
• Registration on/off
• Set/get access code
• Mute/unmute audio
• Get status (Registration mode/Audio/Mute/Low battery)
• Data transfer up to 1 kbit/s from FP to PP
5.3 REGISTRATION
The procedure for FP-to-PP pairing is the same for
Public Address mode and Tour Guide mode:
1. Turn off PP and turn on FP.
2. Set 6-bit access code via pins ACCESS_0 to
ACCESS_5. Do not change during registration.
3. FP: Press and hold PON button (pin 23) for 2 s, until the red LED1 starts flashing.
4. PP: Press and hold PON button (pin 29) for 2 s, until red LED1 starts flashing.
5. When flashing stops and the red LEDs are continuously on, registration has succeeded.
5.4 DEREGISTRATION
The procedure for FP-to-PP unpairing is the same for
Public Address mode and Tour Guide mode:
1. Turn off FP.
2. FP: Press and hold PON button (pin 23) for 10 s.
3. The red LED1 will flash 3 times (0.5 s interval) and all registrations will be cleared.
5.5 BATTERY LOW DETECTION
The SC14WAMDECT SF includes a battery low detection circuit. A battery low condition is indicated by a flashing green LED.
• Battery low voltage: 2.3 V (default)
FINAL
5.6 ANTENNA OPERATION
Figure 6 shows the internal circuit of the
SC14WAMDECT SF.
Pin RF0 is used for two external antennas and can also be used for RF test purposes. Therefore it is recommended to add a reserve pattern for a 10 pF capacitor, even when the two external antennas are not used.
Re-certification of the SC14WAMDECT SF is required when at least one external antenna is added. On request, Dialog Semiconductor can provide a pre-certified PCB layout for an external antenna circuit.
Pin RF1 is recommended for connecting an RF cable to perform conducted tests for type approval.
RFP0n
TX
RX
RFP0
Figure 6: Internal circuit of the SC14WAMDECT SF
5.6.1 Internal antenna only
When only the internal antenna is used, the FAD function is disabled. In this case pins RFP0, RFP0n, P0 and P0n must be left unconnected.
5.6.2 Internal and external antenna with FAD
shows one external antenna connected to pin
RF1 of the SC14WAMDECT SF. This configuration supports the FAD function. In this case pins RFP0,
RFP0n, P0 and P0n must be left unconnected. See [
] for more detailed information.
RF1
P0n
P0
External
Antenna
RF1
RF0
TP1
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Figure 7: One external antenna
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FINAL
6.0 Specifications
added to the parameter description. Typical values are informative.
Note 6: This parameter will not be tested in production. The MIN/MAX values are guaranteed by design and verified by characterisation.
6.1 GENERAL
Table 9: SC14WAMDECT SF module
ITEM
Dimensions
Weight
Temperature range
Frequency range
Antenna range
CONDITIONS
l x w x h
Standards compliancy
Power supply
Maximum PCB warpage
According to DECT standard
- typical outdoor
- typical indoor
ETS 300 444 (DECT GAP), former TBR2214
FCC part 15
2 cells (NiMH / Alkaline)
For entire reflow range
VALUE
18.0 x 19.6 x 2.7
1.5
-40 to +85
1870 to 1930
350
75
2.10 to 3.45
0.1
m m
V mm
Note 7: The resulting range is very dependent on the mechanical design. Dialog Semiconductor is not responsible for this design and as such
Dialog Semiconductor is not responsible for the resulting performance range of the final product.
UNIT mm g
°C
MHz
6.2 ABSOLUTE MAXIMUM RATINGS
Table 10: Absolute Maximum Ratings (Note 8)
PARAMETER
Vbat_max
Vpon_max
Vled_max
Vdig_bp_max
Vdig_max
Vana_max
Vesd_hbm
Vesd_mm
DESCRIPTION
Max voltage on pin VBATIN
Max voltage on pin PON
Max voltage on pin Grn LED, Red LED1
Max voltage on digital pins with back drive protection; UART_RX
Max voltage on other digital pins
Max voltage on analog pins
ESD voltage according to human body model; all pins
ESD voltage according to machine model; all pins
CONDITIONS MIN MAX
3.45
5.5
3.6
3.6
2.0
2.2
2000
150
UNIT
V
V
V
V
V
V
V
V
Note 8: Absolute maximum ratings are those values that may be applied for maximum 50 h. Beyond these values, damage to the device may occur.
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6.3 OPERATING CONDITIONS
Table 11: Operating Conditions (Note 9)
PARAMETER
Vbat
Vpon
Vdig_bp
Vdig
Vana
Icharge
DESCRIPTION
Supply voltage on pin VBATIN
Voltage on pin PON
Voltage on digital pins with back drive protection; UART_RX
Voltage on other digital pins
Voltage on analog pins
Current through pin CHG_DET
CONDITIONS
VDD = 1.8 V
VDD = 1.8 V
Rseries >
(Vcharge-3 V)/
10 mA
Iout_vrefp
TA
Output current through pin VREFp
Ambient temperature
Note 9: Within the specified limits, a life time of 10 years is guaranteed.
Note 10: Within this temperature range full operation is guaranteed.
6.4 SUPPLY CURRENTS
The supply currents in Table 12 and
been measured using a DC voltmeter across a 0.22
series resistor between the positive battery terminal and pin VBATIN.
Table 12: Supply currents: Public Address mode
PARAMETER
Ibat_PA_stby
Ibat_PA_talk
DESCRIPTION
Standby supply current
(PA mode)
Talk mode supply current
(PA mode)
CONDITIONS
FP (RX); LPM; Vbat = 2.6 V
FP (RX); HPM; Vbat = 2.6 V
FP (RX); HPM/U; Vbat = 2.6 V
PP (TX); Vbat = 2.6 V
FP (RX); LPM; 1 PP (TX);
Vbat = 2.6 V
FP (RX); HPM; 1 PP (TX);
Vbat = 2.6 V
FP (RX); HPM/U; 1 PP (TX);
Vbat = 2.6 V
FP (RX); LPM; 2 PPs (TX);
Vbat = 2.6 V
FP (RX); HPM; 2 PPs (TX);
Vbat = 2.6 V
FP (RX); HPM/U; 2 PPs (TX);
Vbat = 2.6 V
PP (TX); LPM; Vbat = 2.6 V
PP (TX); HPM; Vbat = 2.6 V
PP (TX); HPM/U; Vbat = 2.6 V
MIN
2.1
-40
MIN
TYP
134
155
191
168
120
174
143
TYP
95
114
96
45
132
151
1
+85
MAX
MAX
3.45
5.5
3.45
1.98
2.1
10
FINAL mA
°C mA mA mA mA mA mA mA
UNIT mA mA mA mA mA mA
UNIT
V
V
V
V
V mA
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FINAL
Table 13: Supply currents: Tour Guide mode
PARAMETER
Ibat_TG_stby
Ibat_TG_talk
DESCRIPTION
Standby supply current
(TG mode)
Talk mode supply current
(TG mode)
CONDITIONS
FP (TX); LPM; Vbat = 2.6 V
FP (TX); HPM; Vbat = 2.6 V
FP (TX); HPM/U; Vbat = 2.6 V
PP (RX); Vbat = 2.6 V
FP (TX); LPM; Vbat = 2.6 V
FP (TX); HPM; Vbat = 2.6 V
FP (TX); HPM/U; Vbat = 2.6 V
PP (RX); LPM; Vbat = 2.6 V
PP (RX); HPM; Vbat = 2.6 V
PP (RX); HPM/U; Vbat = 2.6 V
6.5 DIGITAL INPUT/OUTPUT PINS
Table 14: Digital input levels
PARAMETER
Vil_dig
Vil_pon
Vil_charge
Vil_rst
Vih_dig
Vih_pon
Vih_charge
Vih_rst
DESCRIPTION CONDITIONS
Logic 0 input level; all digital input pins except PON,
CHG_DET and RSTn
Logic 0 input level; pin PON
Logic 0 input level; pin
CHG_DET
VDD = 1.8 V
Logic 0 input level; pin RSTn VDD = 1.8 V
Logic 1 input level; all digital input pins except PON,
CHG_DET and RSTn
VDD = 1.8 V
Logic 1 input level; pin PON
Logic 1 input level; pin
CHG_DET
Logic 1 input level; pin RSTn VDD = 1.8 V
MIN
1.5
1.5
MIN
0.7*VDD
0.8*VDD
TYP
TYP
137
200
159
85
102
125
106
45
94
90
MAX
MAX
0.3*VDD
0.9
0.9
0.2*VDD
UNIT mA mA mA mA mA mA mA mA mA mA
UNIT
V
V
V
V
V
V
V
V
Table 15: Digital output levels
PARAMETER
Vol_dig
Voh_dig
DESCRIPTION
Logic 0 output level
Logic 1 output level
CONDITIONS
VDD = 1.8 V; Iout =
2, 4, 8 mA
VDD = 1.8 V; Iout =
2, 4, 8 mA
Note 11: For output drive capability, see section
.
MIN
0.8*VDD
TYP MAX
0.2*VDD
UNIT
V
V
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FINAL
6.6 ANALOG FRONT END
Table 16: Microphone amplifier
PARAMETER
Vmic_0dB_unt
Rin_mic
Vmic_offset
DESCRIPTION
Untrimmed differential RMS input voltage between MICp and MICn (0 dBm0 reference level)
CONDITIONS
0 dBm0 on COUT
MIC_GAIN[3:0] = 0,
@ 1020 Hz;
Tolerance:
• 13% when untrimmed
(
BANDGAP_REG
=8)
• 6% when trimmed
Resistance of activated microphone amplifier inputs
(MICp, MICn and
MICh) to internal GND
Input referred DC-off-
MIC_GAIN[3..0] = 1111
3 sigma deviation limits
MIN
114
75
-2.6
TYP
131
150
MAX
149
+2.6
UNIT mV k
mV
Note 12: BANDGAP_REG will be tuned at the factory.
Note 13: 0 dBm0 on COUT = -3.14 dB of max PCM value. COUT is CODEC output in test mode
Note 14: Trimming possibility is foreseen. At system production the bandgap reference voltage can be controlled within 2% accuracy and data can be stored in Flash. Either AVD or VREF can be trimmed within 2% accuracy. If AVD is trimmed VREF will be within 2% accuracy related to either AVD. Or vice versa VREF can be trimmed. For Vref trimming measure
VREFp, VREFm) and update BANDGAP_REG[3:0].
Table 17: Microphone amplifier (Operating Condition)
PARAMETER
Vmic_cm_level
DESCRIPTION
MICp and MICn common mode voltage
CONDITIONS
MICp and MICn are set to
GND with internal resistors
(Rin_mic). If DC coupled the input voltage must be equal to this voltage.
MIN TYP
(0.9 V/
1.5)*
VREFp
MAX UNIT
V
Table 18: Microphone supply voltages
PARAMETER
Vref_unt
Rout_vrefp
Nvrefp_idle
PSRRvrefp
DESCRIPTION
VREFp-VREFm untrimmed
VREFp output resistance
Peak noise on
VREFp-VREFm
Power supply rejection Vref output
CONDITIONS
I
LOAD
= 0 mA
BANDGAP_REG = 8
CCITT weighted
VREFp/m, f = 100 Hz to 4 kHz
BANDGAP_REG[5:4] = 3
Note 15: Vrefm is a clean ground input and is the 0 V reference.
MIN
1.41
40
TYP
1.5
MAX
1.59
UNIT
V
1
-120
dBV dB
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Table 19: VREFp load circuit
PARAMETER
Cload_vrefp
Iout_vrefp
DESCRIPTION
VREFp (parasitic) load capacitance
VREFp output current
CONDITIONS
FINAL
MIN TYP MAX
20
1
UNIT pF mA
Rout_vrefp VREFp
VREFm
C load_vrefp
Iout_vrefp
Figure 8: VREFp load circuit
Table 20: LSRp/LSRn outputs
PARAMETER
Vlsr_0dB_unt
DESCRIPTION
Untrimmed differential RMS output voltage between LSRp and LSRn in audio mode (0 dBm0 reference level)
CONDITIONS
,
LSRATT[2:0] = 001,
@ 1020 Hz Load circuit A (see
) with RL1=
, Cp1 or load circuit B (see
) with RL2, Cp2 and
Cs2
Tolerance:
• 13% when untrimmed
(
BANDGAP_REG
=8)
• 6% when trimmed
Rout_lsr
Vlsr_dc
Resistance of activated loudspeaker amplifier outputs
LSRp and LSRn
DC offset between
LSRp and LSRn
Note 16: 0 dBm0 on CIN = -3.14 dB of max PCM value.
LSRATT[2:0] = 3
R
L1
= 28
3 sigma deviation limits
Table 21: LSRp/LSRn load circuits
PARAMETER
Cp1_Rl1_inf
Cp1_Rl1_1k
Rl1
DESCRIPTION
Load capacitance
Load capacitance
Load resistance
CONDITIONS
see
, R
L1
=
see
, R
L1
1 k
MIN
621
-20
MIN
28
TYP
714
1
TYP
MAX
807
20
MAX
30
100
UNIT mV
mV
UNIT pF pF
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Table 21: LSRp/LSRn load circuits
PARAMETER
Cp2
Cs2
Rl2
DESCRIPTION
Parallel load capacitance
Serial load capacitance
Load resistance
CONDITIONS
see
FINAL
MIN
600
TYP MAX
30
30
UNIT pF
F
LSRp
LSRp
R
L1
C p1
R
L2
C s2
C p2
LSRn
LSRn
Figure 9: Load circuit A: Dynamic loudspeaker
6.7 AUDIO PERFORMANCE
Figure 10: Load circuit B: Piezo loudspeaker
Table 22: Frequency response
PARAMETER
Fco_low
Fco_upr
DESCRIPTION
Lower cutoff frequency
(-3 dB)
Upper cutoff frequency
(-3 dB
CONDITIONS
Input voltage = -20 dBV rms
Output voltage: -3 dBV rms
MIN TYP
6
11.3
MAX UNIT
Hz kHz
Table 23: Distortion
PARAMETER
THD
DESCRIPTION
Total Harmonic Distortion
CONDITIONS
PA mode; PP: Vin = -30 dBV; measured on FP f = 200 Hz, volume step 1 f = 200 Hz, volume step 9 f = 2 kHz, volume step 1 f = 2 kHz, volume step 9
MIN TYP MAX
0.5
1.0
0.03
0.09
UNIT
%
%
%
%
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FINAL
Linearity Volume Step 1
-50
-60
-70
-80
-90
-100
-100
0
-10
-20
-30
-40
-90 -80 -70 -60 -50 -40
Input Level PP [dBV ]
-30 -20 -1 0 0
Figure 11: Linearity for a 1 kHz tone at volume step 1
6.8 BASEBAND PART
Table 24: Baseband specifications: UART
PARAMETER
Fbit_uart
Fbit_flash
DESCRIPTION CONDITIONS
Serial interface bit rate UART; Interface for external microprocessor or PC
Flash download bit rate Via UART
MIN TYP MAX
115.2
115.2
UNIT kbit/s kbit/s
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6.9 RADIO (RF) PART
Standards compliancy: ETS 301 406 (former TBR6).
Table 25: Radio specifications
PARAMETER DESCRIPTION
P_Rx
P_Rx_T
IPL
NTP
Receiver sensitivity
Receiver sensitivity, full temperature range
Intermodulation performance level (EN 301 406 section 4.5.7.6)
Normal Transmitted Power
(HPM: High Power Mode) dPrfpa_T
Fbit
BW_Tx
Low Power mode
RFPA power variation, full temperature range
Bit rate
Transmitter bandwidth
CONDITIONS
BER = 0.001; TA = 25 °C
BER = 0.001;
-40 °C
TA 85 °C
TA = 25 °C;
Pw = -80 dBm;
f = 2 channels
DECT
DECT6.0 and Japan DECT
-40 °C
TA +85 °C
GFSK modulation
DECT GFSK;
NTP = 20 dB
FINAL
MIN
-93
-35
TYP
-92
MAX
-89
-87
UNIT dBm dBm dBm
21 23
10
2.5
1.152
24.5
20
4
1.728
dBm dBm dBm dB
Mbit/s
MHz
Table 26: RFPA preferred settings for various power modes
Address
(VES)
0x39
0x3B
0x3D
0x05
0x23
0x24
Register / Parameter
HPM/U
(USA)
RF_PA_CTRL1_REG 0x09A0
RF_TEST_MODE2_REG 0x0056
RF_BBADC_CTRL_REG
RF_PLL_CTRL2_REG[MODINDEX]
0x0380
0x25
Upper RSSI threshold
Lower RSSI threshold
0x2C
0x22
Note 17: This power setting is only applicable for Full slot.
PARAMETER
VBAT IN
V
1
V
2
V
2
V
3
6.10 RF POWER SUPPLY
Table 27: Requirements for linear supply regulator
DESCRIPTION
Voltage at VBAT SW
Settling time
Receive period
Transmit period
Drop during transmit
CONDITIONS
Unloaded V
B
Loaded V
B
-V
1
-V
2
-V
3
I = 50 mA
I = 130 mA
I = 550 mA
HPM
(Europe)
0x0CF0
0x0062
0x03A0
0x25
N/A
N/A
HPM/J
(Japan)
0x2CE0
0x0068
0x0398
0x23
0x28
0x1E
MIN
2.1
TYP
3
MAX
3.45
UNIT
V
20
100
200
25 mV mV mV mV
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
23 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
B
FINAL
Figure 12: RF power supply
6.11 RF CHANNEL FREQUENCIES
Table 28: RF frequencies and channel numbers
European DECT
Channel number
Japan DECT
Frequency (MHz)
1787.616
1789.344
1791.072
1881.792
1883.520
1885.248
1886.976
1888.704
1890.432
1892.160
1893.888
1895.616
1897.344
1899.072
1900.800
1902.528
1921.536
1923.264
1924.992
1926.720
1928.448
9
8
7
6
5
4
3
2
1
0
4
-
-
-
0
USA DECT 6.0
4
3
2
1
0
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
24 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
7.0 Design guidelines
7.1 PCB DESIGN GUIDELINES
• Because of the presence of the digital radio frequency bursts with 100 Hz time division periods
(TDD noise), supply ripple and RF radiation, special attention is needed for the power supply and ground
PCB layout.
• Power supply considerations
Both high and low frequency bypassing of the supply line connections should be provided and placed as close as possible to the SC14WAMDECT SF. In order to get the best overall performance for both FP and PP applications, a number of considerations for the PCB has to be taken into account.
• Make angle breaks on long supply lines to avoid resonances at DECT frequencies. Maximum
80 mm before an angle break is recommended.
• Supply lines should be placed as far as possible away from sensitive audio circuits. If it is necessary to cross supply lines and audio lines, it should be done with right angles between supply and audio lines/circuits (microphone, ear-speaker, speakerphone, etc.)
• Ground plane considerations
In order to achieve the best audio performance and to avoid the influence of power supply noise,
RF radiation, TDD noise and other noise sources, it is important that the audio circuits on both FP and PP applications boards are connected to the
VREFm pin on the SC14WAMDECT SF with separate nets in the layout.
It is advised to provide the following audio circuits with separate ground nets connected to the
VREFm pin:
• Microphone(s)
• Headset microphone and speaker
• Speakerphone (signal grounds)
Depending on the layout it may also be necessary to bypass a number of the audio signals listed above to avoid humming, noise from RF radiation and TDD noise. It is also important to choose a microphone of appropriate quality with a high RF immunity (with builtin capacitor).
• ESD performance
Besides TDD noise, the ESD performance is important for the end application. In order to achieve a high ESD performance, supply lines should be placed with a large distance from charging terminals, display, headset connector and other electrical terminals with direct contact to the ESD source.
On a two-layer PCB application it is important to keep a simulated one layer ground. With a stable ground the ESD and TDD noise performance will always improve.
• Clearance around test patterns
Pins 81 to 88 are used for production test purposes.
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
25 of 36
In order to avoid any interference or disturbance the area around these signal pins must be kept clear of any signal and/or GND. The recommended clear-
ance is at least 1 mm, as shown in Figure 13
.
0.9 mm
Test pattern
1.0 mm
GND Pattern
Figure 13: Clearance around test patterns
FINAL
7.2 MODULE PLACEMENT ON THE MAIN BOARD
In order to ensure FCC compliance, proper coverage and to avoid detuning of the antennas, it is required to place the module on the main board free from other surrounding materials.
Keep a distance of at least 10 mm from the antenna elements to conducting objects and at least 5 mm to non-conducting objects.
Keep in mind that electrically shielding objects, even partly surrounding the antennas, will normally cause a significant degradation of the coverage.
Place the module at the edge of the main-board as shown in Figure
When the module has to be placed away from the edge of the main board, avoid any conducting areas in front of the antennas and make a cut-out in the main board underneath the antennas as shown in the figure.
See
and Figure 21 for the detailed package
outline.
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
No PCB area
> 10 mm
> 10 mm
> 10 mm
No GND area
79 antenna extension
Module Main board
GND
1
GND
78
2 77
3 76
Figure 14: Module placement on the main board (top view)
7.3 PATTERN FOR PIN 79 ON THE MAIN BOARD
The copper pattern for pin 79 on the main board is very important because it is part of the internal antenna of the module. It is used to extend the internal antenna for optimum RF performance.
The PCB pattern shown in
was used for pin 79 on the main board during module certification.
7.4 PRECAUTIONS REGARDING UNINTENDED
COUPLING
The SC14WAMDECT SF includes an internal antenna, so at integration on the main board precautions shall be taken in order to avoid any kind of coupling from the main board to the RF part of the module.
If there is any doubt about this, a brief radio test should be performed.
GND
FINAL
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
26 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
8.0 Example application diagrams
FINAL
Battery Supply
2.1 - 3.45VDC
J6
2 pole male
1
2
TP1
1
TP28
F3
+3V0_BAT
2
J4
3 pin header
1
2
3
TP3
+VBAT
SW8-A SW8-B Region
OFF OFF EU
OFF ON JP
ON ON US
OFF = High RF power
ON = Low RF power
1
SW8-A
8
2
SW8-B
7
3
SW8-C
6
Debug interface
VDDIO
JTAG
UTX
URX
GND
+1V8
J9
5 pole male
3
4
1
2
5
TP44 TP45 TP46
TP18
C3
100uF/10V
+VBAT_SW
C2
1u0
TP41
C6
100n
+1V8
TP29 TP31 TP32
LED_RED2
+1V8
TP19
R3
1K5
JTAG
53
47
48
JTAG
UART_RX
UART_TX
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
51
60
70
71
38
45
49
50
20
28
30
31
1
6
14
19
77
78
80
43
42
41
40
RF_POWER
LED_RED2
REGION2
REGION1
57
56
55
54
39
NC
NC
NC
NC
NC
26
CP_VOUT1
37
NC
65
15
69
68
67
66
ACCESS_0
ACCESS_1
ACCESS_2
ACCESS_3
ACCESS_4
ACCESS_5
52
RSTN
64
63
VBATIN
VBATIN
21
NC
22
CHARGE_CTRL
17
18
SOCP
SOCN
62
VBATSW
25
NC
61
VDDOUT
IC2
SC14WAMDECT
Only mounted in PP mode
SW2
1
2
4 3
PON_PP
TP42
5
PON_PP
TP22
PP = VOL_UP
FP = MUTE
1
2
4 3
SW3
5
Only mounted in PP mode
TP23
1
2
PP = VOL_DN
SW4
4 3
5
TP24
SW5
1
2
4 3
PP = ACC_
5
RFP0
3
GND
72
RF1
73
GND
74
RF0
75
GND
76
PP/FP
PON
29
CHG_DET/PON
23
VOL_UP/MUTE
36
VOL_DN
35
ACC_IN
16
ACC_OUT
32
MAS_SLV
33
FP_PP
34
R8
0R0
A1
Antenna
R6
N.M.
J1
SMA connector
1
PON_PP
PON_FP
LED_RED1
58
LED_GRN
59
NC
27
NC
24
LSRP
12
LSRN
13
VREFP
7
MICP
8
NC
9
NC
10
VREFM
11
RFP0N
5
P0
2
P0N
4
TP1
79
TP9
2
D1
1
Red
+VBAT_SW
TP8
2
D3
1
Green
Only mounted in FP mode
LED_RED2
2
D2
1
Red
R2
39R
+1V8
GP1
R9
10K
AGND
+1V8
Place Close to Module
C14
10p
C28
10p
Only mounted in FP mode
SW1
1
2
4 3
PON_FP
TP14
5
Only mounted in FP mode
TP10
C10
220uF/10V
R17
N.M.
C42
C146
10p
N.M.
Only mounted in PP mode
R59
100R
C26
220n
R62
2K2
PON_FP
C43
10p
R61
100R
L1
C44
N.M.
2500R
C27
10p
L3
2500R
R7
100R
TP33
Only mounted in FP mode
J3
2 pole male
B
TP25
TP26
C
R20
100R
T4
DTC1
E
TP16
R19
1K0
+1V8
J2
3 pin header
1
2
3
PP / FP selection
+1V8 = PP
GND = FP
TP20
C46
470p
R5
0R0
TP21
1
3
Audio - OUT
J8
3.5mm Jack
2
AGND
C1
N.M.
1
3
2
AGND
Audio - IN
J7
3.5mm Jack
Datasheet
CFR0011-120-00-FM Rev 5
Figure 15: Example application diagram: Public Address mode
Revision 3.0
27 of 36
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© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
Battery Supply
2.1 - 3.45VDC
J6
2 pole male
1
2
TP1
TP28
1
F3
+3V0_BAT
2
J4
3 pin header
TP3
1
2
3
RF Power setting
OFF = High RF power
ON = Low RF power
SW8-A SW8-B Region
OFF OFF EU
OFF ON JP
ON ON US
Access code setting
1
SW6-A
8
1
SW8-A
8
2
SW8-B
7
3
SW8-C
6
4
SW8-D
5
1
SW9-A
8
2
SW9-B
7
3
SW9-C
6
4
SW9-D
5
VDDIO
JTAG
UTX
URX
GND
+1V8
J9
5 pole male
3
4
1
2
5
TP44 TP45 TP46
TP18
Control / Debug interface
+VBAT
C3
+VBAT_SW
+1V8
C2
100uF/10V
TP41
C6
100n
TP31 TP32 TP29
+1V8
TP19
R3
1K5
JTAG
53
47
48
JTAG
UART_RX
UART_TX
38
45
49
50
20
28
30
31
1
6
14
19
51
60
70
71
77
78
80
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
43
42
41
40
RF_POWER
LED_RED2
REGION2
REGION1
57
56
55
54
39
NC
NC
NC
NC
NC
26
CP_VOUT1
37
NC
65
15
69
68
67
66
ACCESS_0
ACCESS_1
ACCESS_2
ACCESS_3
ACCESS_4
ACCESS_5
52
RSTN
64
63
VBATIN
VBATIN
21
NC
22
CHARGE_CTRL
17
18
SOCP
SOCN
62
VBATSW
25
NC
61
VDDOUT
IC2
SC14WAMDECT
RFP0
3
GND
72
RF1
73
GND
74
RF0
75
GND
76
PP/FP
PON
29
CHG_DET/PON
23
VOL_UP/MUTE
36
VOL_DN
35
ACC_IN
16
ACC_OUT
32
MAS_SLV
33
FP_PP
34
LED_RED1
58
LED_GRN
59
NC
27
NC
24
LSRP
12
LSRN
13
VREFP
7
MICP
8
NC
9
NC
10
VREFM
11
RFP0N
5
P0
2
P0N
4
TP1
79
Only mounted in PP mode
SW2
1
2
4 3
PON_PP
TP42
5
Only mounted in PP mode
PON_PP
PP = VOL_UP
FP = MUTE
TP22
SW3
1
2
4 3
5
TP23
SW4
1
2
4 3
PP = VOL_DN
5
R6
0R0
A1
Antenna
R4
N.M.
J14
SMA connector
1
Only mounted in FP mode
SW1
1
2
4 3
PON_FP
TP14
5
PON_FP
PON_PP
PON_FP
B
J3
2 pole male
C
TP25
TP26
R20
100R
T4
DTC143X
E
Only mounted in FP mode
TP24
SW5
1
2
4 3
FP = ACC_IN
5
TP16
R19
1K0
+1V8
J2
3 pin header
1
2
3
+1V8 = PP
GND = FP
TP9
TP8
2
D1
1
Red
+VBAT_SW
2
D3
1
Green
Only mounted in PP mode
TP10
C10
220uF/10V
R17
N.M.
C42
C146
10p
N.M.
C43
10p
L1
C44
N.M.
2500R
R7
100R
TP20
C46
470p
R5
0R0
TP21
1
3
Audio - OUT
J8
3.5mm Jack
2
AGND
Place Close to Module
C14
10p
C28
10p
Only mounted in FP mode
R59
100R
C26
220n
R62
2K2
R61
100R
C27
10p
L3
2500R
TP33
C1
N.M.
1
3
2
AGND
Audio - IN
J7
3.5mm Jack
GP1
AGND
Figure 16 Example application diagram: Tour Guide mode
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
28 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
9.0 Notices to OEM
The end product has to be certified again when it has been programmed with other software than the
Dialog standard software stack for portable part and/or uses one or two external antenna(s). (See
[
] for more detailed information).
The literature provided to the end user must include the following wording:
FCC compliance statement
This device complies with Part 15 of the FCC Rules for
only portable part.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation of the device.
Module transmetteur ID IC: 9576A-SC14S.
Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d’interférences nuisibles et (2) appareil doit accepter toute interférence reçue, y compris les interférences qui peuvent perturber le fonctionnement.
• Increase the separation between the equipment and receiver
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Privacy of communications may not be ensured when using this phone.
9.1 FCC REQUIREMENTS REGARDING THE END
PRODUCT AND THE END USER
The end product that the module is integrated into must be marked as follows:
“Contains Transmitter Module FCC ID: Y82-SC14S /
IC: 9576A-SC14S”
Changes or modifications to the equipment not expressly approved by the Party responsible for compliance could void the user's authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna
Datasheet
9.2 INDUSTRY CANADA REQUIREMENTS
REGARDING THE END PRODUCT AND THE END
USER
The host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 9576A-SC14S
L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent.
L'étiquette de certification d'Industrie Canada d'un module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une etiquette donnant le numéro de certification du module d'Industrie Canada, précédé des mots " Contient un module d'émission ", du mot " Contient " ou d'une formulation similaire exprimant le même sens, comme suit :
Contient le module d'émission IC: 9576A-SC14S
This device complies with Industry Canada licenceexempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie
Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
CAN ICES-3 (B)/NMB-3(B)
Revision 3.0
23-Jul-2015
CFR0011-120-00-FM Rev 5 29 of 36 © 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
9.3 END APPLICATION APPROVAL
The module is intended to be used in an end application. Type approval concerning the end product, except for the module, should of course be done. Please contact a test house in order to clarify what is needed.
9.4 SAFETY REQUIREMENTS
This section provides of an overview of the safety requirements that must be adhered to when working with the SC14WAMDECT SF.
• The specific external power supply for the
SC14WAMDECT SF has to fulfil the requirements according to clause 2.5 (Limited power source) of this standard EN 60950-1:2006.
• Interconnection circuits shall be selected to provide continued conformance to the requirements of clause 2.2 for SELV (Safety Extra Low Voltage) circuits according to EN 60950-1:2006 after making connections.
• Interface type: not subjected to overvoltages (i.e. does not leave the building).
• Requirements additional to those specified in this standard may be necessary for:
• Equipment intended for operation in special environments (for example, extremes of temperature, excessive dust, moisture or vibration, flammable gases and corrosive or explosive atmospheres).
• Equipment intended to be used in vehicles, on board ships or aircraft, in tropical countries or at altitudes greater than 2000 m.
• Equipment intended for use where ingress of water is possible.
• Installation by qualified personnel only!
• The product is a component intended for installation and use in complete equipment. The final acceptance of the component is dependent upon its installation and use in complete equipment.
FINAL
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
30 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
10.0 Package information
10.1 SOLDERING PROFILE
The SC14WAMDECT SF should be soldered using a lead-free reflow soldering profile as shown below.
Adjustments to the profile may be necessary depending on process requirements.
FINAL
Recommended solder paste for lead-free soldering:
Sn 96.5 % - Ag 3.0 % - Cu 0.5 %.
Temperature
Slope: 1~2 °C/s max.
(217 °C to peak)
Peak temperature:
250 °C +5/-0 °C
245 °C
Ramp down rate: max. 3 °C/s
217 °C
Preheat:
150 ~ 200 °C
>30 s
60 ~ 120 s 60 ~ 150 s
25 °C
Time
Figure 17: Reflow profile (lead-free)
10.2 MOISTURE SENSITIVITY LEVEL (MSL)
The MSL is an indicator for the maximum allowable time period (floor life time) in which a moisture sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a maximum temperature of 30 °C and a maximum relative humidity of
60 % RH. before the solder reflow process.
The SC14WAMDECT SF is qualified to MSL 3.
MSL Level
MSL 4
MSL 3
MSL 2A
MSL 2
MSL 1
Floor Life Time
72 hours
168 hours
4 weeks
1 year
Unlimited at 30 °C/85 % RH
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
31 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
10.3 COPPER PAD, SOLDER OPENING AND STEN-
CIL
For the stencil a thickness of 0.130 mm is recommended. Recommended copper pad, solder mask opening and stencil are shown below.
FINAL
Datasheet
CFR0011-120-00-FM Rev 5
Figure 18: Pad types and dimensions
Revision 3.0
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© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
C
A
Figure 19: Copper pad, solder mask opening and stencil
A
D
Datasheet
CFR0011-120-00-FM Rev 5
B
A2
Figure 20: Solder stencil
Revision 3.0
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A2
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
10.4 MECHANICAL DIMENSIONS
FINAL
Datasheet
CFR0011-120-00-FM Rev 5
Figure 21: Package outline drawing
Revision 3.0
34 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
11.0 Revision history
19-Nov-2013 v1.0:
• Initial version
27-Nov-2013 v1.1:
• Antenna diversity description updated in sections
14-Jan-2014 v1.11:
• Updated connection diagram, Pin description,
Speaker configuration (
• Added
14-Jan-2014 v1.12:
• Corrected Pin description.
• Updated Table 5 and Battery low/empty voltage in
.
• Updated
.
11-Feb-2014 v1.13:
• Corrected
18-Mar-2014 v1.20:
• Corrected system diagram.
• Corrected pin description for pin #26.
• Description for pin RED_LED2 updated.
• Added
"Example application diagrams" on page
27-Mar-2014 v1.21:
• Feature list updated.
29-Aug-2014 v1.22:
• Text changed for J-DECT certify as “Pre-certified”.
• Explanation for the Pin description changed.
• Volume control section updated.
• Low battery indication added in
• Added explanation for RF1 in section 5.6
.
• KDECT explanation added.
• PTT changed to AIPP and AOFP.
• Accessory Input (AIPP) and output (AOPP) sec-
• Wire registration added to
• Usage Guidelines (
10-Oct-2014 v1.23:
• Updated latency value for TG mode.
• Added low power mode.
FINAL
23-Jul-2015 v3.0 (Final):
• Product status: Production.
• Korean DECT mode removed: not supported.
• Connection diagram updated (
).
• PP and FP removed from pin names.
• Unused pins changed to NC.
• Pins AIPP and AOFP renamed to ACC_IN and
ACC_OUT.
• Pin 11 (GND) renamed to VREFm.
• Added pins ACCESS_0 to ACCESS_5 (pins
65, 15, 69 to 66).
• Removed battery management section (charging is not supported).
• Supply currents moved from section
section
• Updated supply currents ( Table 12
).
• Example application diagrams added for PA and
TG mode.
:
• Reflow soldering profile updated ( Figure 17 ).
• Soldering stencil thickness changed to
0.130 mm.
• Package outline drawing updated (
• Back page:
• Status definition table updated.
• Contact information updated.
• Template updated to latest version.
Datasheet
CFR0011-120-00-FM Rev 5
Revision 3.0
35 of 36
23-Jul-2015
© 2013 Dialog Semiconductor
SC14WAMDECT SF
Wireless Audio Module
FINAL
Status definitions
Version Datasheet status
1.<n> Target
2.<n>
3.<n>
4.<n>
Preliminary
Final
Obsolete
Product status
Development
Qualification
Production
Archived
Definition
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains the specifications and preliminary characterisation data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design.
This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via
Customer Product Notifications.
This datasheet contains the specifications for discontinued products. The information is provided for reference only.
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Phone: +44 1793 757700
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Email:
Datasheet
CFR0011-120-00-FM Rev 5
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Phone: +81 3 5425 4567
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Revision 3.0
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Key Features
- Pre-programmed ready-to-use module
- Antenna embedded, support for external antennas
- High quality audio sampled at 25.6 kHz
- Supports 1.9 GHz and 1.7 GHz DECT bands
- Public Address System with one or two microphones and one loudspeaker
- Tour Guide System with one microphone and up to 128 headsets
- Small form factor (19.6 mm x 18.0 mm x 2.7 mm)
- Supports NiMH and Alkaline batteries
Related manuals
Frequently Answers and Questions
What is the SC14WAMDECT SF used for?
What is the maximum number of receivers the SC14WAMDECT SF can support in Tour Guide mode?
Does the SC14WAMDECT SF support external antennas?
What types of batteries are supported by the SC14WAMDECT SF?
What is the operating temperature range for the SC14WAMDECT SF?
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