Documentatie tehnica integrat HT8970, placa de ecou Bytrex

Documentatie tehnica integrat HT8970, placa de ecou Bytrex
HT8970
Voice Echo
Features
· Operating voltage: 4.5V~5.5V
· Built-in 20Kb SRAM
· ADM algorithm
· Automatic reset function
· Low noise
- Echo mode: -85dB
- Surround mode: -90dB
· 16-pin DIP/SOP package
Applications
· Television
· Video disc player
· Karaoke systems
· Sound equipments
General Description
The HT8970 is an echo/surround effect processor. It is
designed for various audio systems including karaoke,
television, sound equipments, etc. The chip consists of
a built-in pre-amplifier, VCO or Voltage Control OSC,
20Kb SRAM, A/D and D/A converters as well as delay
time control logic.
Its built-in 20Kb SRAM can generate delay time effect
and can control the delay time value through the external VCO resistor.
The VCO circuit can reduce external components and
make it easy to adjust the delay time.
Block Diagram
L P F 1 _ IN
L P F 1 _ O U T
L P F 2 _ O U T
L P F 2 _ IN
O P 2 _ O U T
O P 2 _ IN
4 .7 k W
4 .7 k W
C O M P
O P 1 _ IN
O P 1 _ O U T
C C 0
C C 1
M O D
D E M
L P F 2
L P F 1
1 /2 V C C
D I
D O 0
M O
A U T O
R E S E T
V C C
Rev. 1.10
R E F
A G N D
M I
2 0 K B its
R A M
D G N D
D O 1
C L O C K
V C O
O S C _ O
1
V C O
May 2, 2008
HT8970
Pin Assignment
V C C
1
1 6
L P F 1 _ IN
R E F
2
1 5
L P F 1 _ O U T
A G N D
3
1 4
L P F 2 _ O U T
D G N D
4
1 3
L P F 2 _ IN
O S C _ O
5
1 2
O P 2 _ O U T
V C O
6
1 1
O P 2 _ IN
C C 1
7
1 0
O P 1 _ IN
C C 0
8
9
O P 1 _ O U T
H T 8 9 7 0
1 6 D IP -A /S O P -A
Pad Assignment
1 4
1 3 1 2
L P F 2 _ IN
L P F 2 _ O U T
L P F 1 _ IN
L P F 1 _ O U T
D G N D
V C C
R E F
A G N D
1 5
1 1 1 0
1 6
1
(0 ,0 )
O S C _ O
V C O
3
7
8
9
O P 2 _ IN
O P 2 _ O U T
6
O P 1 _ IN
5
O P 1 _ O U T
4
C C 0
C C 1
2
Chip size: 73 ´ 86 (mil)2
The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.10
2
May 2, 2008
HT8970
Pad Coordinates
Unit: mm
Pad No.
X
Y
1
-730.950
688.300
2
-668.800
-652.050
3
-668.800
-755.050
4
-642.650
-951.700
5
-344.900
-951.700
6
-134.150
-951.700
7
135.100
-951.700
8
406.400
-951.700
9
687.400
-951.700
10
735.950
941.950
11
640.950
941.950
12
537.950
941.950
13
442.950
941.950
14
-94.000
920.850
15
-256.650
868.650
16
-578.400
749.850
Pad Description
Pad No.
Pad Name
I/O
Description
1
DGND
I
Digital ground
2
OSC_O
O
System oscillator output
3
VCO
I
System oscillator input, system frequency adjustable pin
4
CC1
¾
Current control 1
5
CC0
¾
Current control 0
6
OP1_OUT
O
OP1 output
7
OP1_IN
I
OP1 input
8
OP2_IN
I
OP2 input
9
OP2_OUT
O
OP2 output
10
LPF2_IN
I
Low pass filter 2 input
11
LPF2_OUT
O
Low pass filter 2 output
12
LPF1_OUT
O
Low pass filter 1 output
13
LPF1_IN
I
Low pass filter 1 input
14
VCC
I
Analog and positive power supply
15
REF
I
Analog reference voltage
16
AGND
I
Analog ground
Rev. 1.10
3
May 2, 2008
HT8970
Absolute Maximum Ratings
Supply Voltage..............................VSS-0.3V to VDD+6V
Storage Temperature ............................-50°C to 125°C
Input Voltage..............................VSS-0.3V to VDD+0.3V
Operating Temperature...........................-20°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
Symbol
Ta=25°C
Test Conditions
Parameter
VDD
Conditions
Min.
Typ.
Max.
Unit
VCC
Operating Voltage
¾
¾
4.5
5.0
5.5
V
ICC
Operating Current
5V
¾
¾
15
30
mA
GV
Voltage Gain
5V
RL=47kW
¾
-0.9
2.5
dB
VOMAX
Maximum Output Voltage
5V
THD=10%
0.9
1.8
¾
Vrms
NO
Output Noise Voltage
5V
DIN Audio
¾
-85
-60
dBV
PSRR
Power Supply Rejection Ratio
5V
DVCC=-20dBV (0.1Vrms)
f=100Hz
¾
-40
-30
dB
Functional Description
· Echo mode
The HT8970 is an echo/surround effect generator with
built-in 20Kb SRAM. The chip provides two playing
modes (echo and surround) and the playing function
block diagrams are shown as follows.
V
V
IN
L P F 1
A /D
O U T
D e la y
D /A
L P F 2
· Surround mode
V
IN
L P F 1
A /D
D e la y
D /A
V
L P F 2
O U T
ROSC-fOSC-Delay_time Cross Table
ROSC
56.6
44.8
36.2
30.4
26.0
23.2
20.6
kW
fOSC
2.0
2.5
3.0
3.5
4.0
4.5
5.0
MHz
Td
326
260
218
188
162
146
130
ms
ROSC
18.3
16.6
15
14.2
13.4
12.5
11.6
kW
fOSC
5.5
6.0
6.5
7.0
7.5
8.0
8.5
MHz
Td
119
110
102
94.4
88
82.4
76.8
ms
ROSC
10.8
9.5
8.4
7.6
6.8
6.3
5.6
kW
fOSC
9
10
11
12
13
14
15
MHz
Td
73.2
64.8
59.2
54.4
50.0
46.4
42.8
ms
ROSC
5.00
4.09
3.68
3.42
3.08
2.84
2.65
kW
fOSC
16
17
18
19
20
21
22
MHz
Td
40.4
38.4
36.4
34.2
32.8
31.0
29.6
ms
Rev. 1.10
4
May 2, 2008
HT8970
Application Circuits
Echo Mode
0 .6 8 m F
1 m F
1 k W
9 V
1 k W
3
M IC
2
8
4 .7 k W
4 .7 k W
4 7 k W
1 0 0 m F
4 .7 k W
9 V
1
5 V
0 .1 m F
V C C
2
1 0 0 m F
4 .7 m F
3
R E F
4
A G N D
2 0 k W
5
O S C _ O
6
V C O
7
8
0 .1 m F
0 .1 m F
2 0 k W
4 7 k W
2 2 m F
3 9 p F
5 6 0 0 p F
1 6
L P F 1 _ IN
1 5
L P F 1 _ O U T
1 0 k W
4 .7 m F
1 5 k W
1 0 0 k W
4 .7 m F
5 6 0 p F
4 .7 k W
1 2 k W
D G N D
R
4
5 6 0 W
4 .7 k W
4 .7 m F
1
4 5 5 8
1 3 k W
1 0 m F
1 0 m F
O u tp u t
1 5 k W
0 .0 3 3 m F
L P F 2 _ O U T
1 4
L P F 2 _ IN
1 3
O P 2 _ O U T
1 2
C C 1
O P 2 _ IN
C C 0
O P 1 _ IN
1 5 k W
5 6 0 p F
5 6 0 p F
1 0 k W
1 5 k W
1 1
0 .0 4 7 m F
1 0
9
O P 1 _ O U T
0 .0 4 7 m F
H T 8 9 7 0
Note:
: Analog ground,
: Digital ground
When the value of the ROSC increases, the range of the Delay time also increases. Please refer to the
ROSC - fOSC - Delay_time Cross table for the ROSC & Delay time values.
Rev. 1.10
5
May 2, 2008
HT8970
Surround Mode
0 .6 8 m F
1 m F
1 k W
9 V
1 k W
3
M IC
2
8
4 .7 k W
4 .7 k W
4 7 k W
1 0 0 m F
4 .7 k W
9 V
4
2 0 k W
5 6 0 W
4 7 k W
2 2 m F
3 9 p F
5 6 0 0 p F
4 .7 k W
4 .7 m F
1
4 5 5 8
1 5 k W
4 .7 m F
1 0 0 k W
1
5 V
0 .1 m F
V C C
2
1 0 0 m F
3
4 .7 m F
A G N D
4
2 0 k W
1 6
L P F 1 _ IN
R E F
D G N D
O S C _ O
6
V C O
R
5
5 6 0 p F
L P F 1 _ O U T
1 5
1 2 k W
8
0 .1 m F
0 .1 m F
L P F 2 _ IN
1 3
O P 2 _ O U T
1 2
C C 1
O P 2 _ IN
C C 0
O P 1 _ IN
O P 1 _ O U T
1 0 m F
1 4
L P F 2 _ O U T
7
1 0 k W
5 6 0 p F
1 0 k W
3 k W
O u tp u t
1 5 k W
5 6 0 p F
1 5 k W
1 1
0 .0 4 7 m F
9
1 0
0 .0 4 7 m F
H T 8 9 7 0
Note:
: Analog ground,
: Digital ground
When the value of the ROSC increases, the range of the Delay time also increases. Please refer to the
ROSC - fOSC - Delay_time Cross table for the ROSC & Delay time values.
Rev. 1.10
6
May 2, 2008
HT8970
Package Information
16-pin DIP (300mil) Outline Dimensions
A
B
1 6
9
8
1
H
C
D
a
G
E
I
F
Symbol
Rev. 1.10
Dimensions in mil
Min.
Nom.
Max.
A
745
¾
775
B
240
¾
260
C
125
¾
135
D
125
¾
145
E
16
¾
20
F
50
¾
70
G
¾
100
¾
H
295
¾
315
I
335
¾
375
a
0°
¾
15°
7
May 2, 2008
HT8970
16-pin SOP (300mil) Outline Dimensions
1 6
9
A
B
1
8
C
C '
G
H
D
E
Symbol
Rev. 1.10
a
F
Dimensions in mil
Min.
Nom.
Max.
A
394
¾
419
B
290
¾
300
C
14
¾
20
C¢
390
¾
413
D
92
¾
104
E
¾
50
¾
F
4
¾
¾
G
16
¾
50
H
4
¾
12
a
0°
¾
10°
8
May 2, 2008
HT8970
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 16W (300mil)
Symbol
Description
A
Reel Outer Diameter
B
Reel Inner Diameter
C
Spindle Hole Diameter
D
Key Slit Width
Dimensions in mm
330±1
62±1.5
13.0±0.5
-0.2
2±0.5
T1
Space Between Flange
16.8+0.3
-0.2
T2
Reel Thickness
22.2±0.2
Rev. 1.10
9
May 2, 2008
HT8970
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
C
D 1
B 0
P
K 0
A 0
SOP 16W (300mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
16±0.2
P
Cavity Pitch
12±0.1
E
Perforation Position
F
Cavity to Perforation (Width Direction)
7.5±0.1
D
Perforation Diameter
1.5+0.1
D1
Cavity Hole Diameter
1.5+0.25
P0
Perforation Pitch
4±0.1
P1
Cavity to Perforation (Length Direction)
2±0.1
A0
Cavity Length
10.9±0.1
B0
Cavity Width
10.8±0.1
K0
Cavity Depth
3±0.1
t
Carrier Tape Thickness
C
Cover Tape Width
Rev. 1.10
1.75±0.1
0.3±0.05
13.3
10
May 2, 2008
HT8970
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor Inc. (Shanghai Sales Office)
7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233
Tel: 86-21-6485-5560
Fax: 86-21-6485-0313
http://www.holtek.com.cn
Holtek Semiconductor Inc. (Shenzhen Sales Office)
5F, Unit A, Productivity Building, Gaoxin M 2nd, Middle Zone Of High-Tech Industrial Park, ShenZhen, China 518057
Tel: 86-755-8616-9908, 86-755-8616-9308
Fax: 86-755-8616-9722
Holtek Semiconductor Inc. (Beijing Sales Office)
Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031
Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752
Fax: 86-10-6641-0125
Holtek Semiconductor Inc. (Chengdu Sales Office)
709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016
Tel: 86-28-6653-6590
Fax: 86-28-6653-6591
Holtek Semiconductor (USA), Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com
Copyright Ó 2008 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.10
11
May 2, 2008
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