SP3012 Series 0.5pF Diode Array for USB3.0 TVS Diode Arrays (SPA

SP3012 Series 0.5pF Diode Array for USB3.0 TVS Diode Arrays (SPA
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
SP3012 Series 0.5pF Diode Array for USB3.0
RoHS
Pb GREEN
The SP3012 Series integrates either 3, 4 or 6 channels of
ultra low capacitance rail-to-rail diodes and an additional
zener diode to provide protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust devices can safely absorb repetitive
ESD strikes above the maximum level specified in the
IEC61000-4-2 international standard (±8kV contact
discharge) without performance degradation.
The extremely low loading capacitance also makes it ideal
for protecting high speed signal lines such as USB3.0,
HDMI2.0, USB2.0, and eSATA.
Pinout
Features
4
5
6
3
2
1
*Pins 6, 7, 9, 10 are not internally connected
but should be connected to the trace.
SP3012-03UTG
6
7
8
9
10
5
4
3
2
1
8
• EFT, IEC61000-4-4, 40A
(tP=5/50ns)
• Lightning, IEC61000-4-5,
4A (tP=8/20μs)
SP3012-04UTG (AEC-Q101 Qualified)
6
5
• ESD, IEC61000-4-2,
±12kV contact, ±25kV air
4
• Low capacitance of 0.5pF
(TYP) per I/O
• Low leakage current of
14
1.5μA (MAX) at 5V
• Small form factor μDFN
(JEDEC MO-229) and
SOT23-6 (JEDEC MO178AB) packages provide
flow through routing to
simplify PCB layout
• AEC-Q101 Qaulified
(μDFN10 and μDFN14)
Applications
7
1
SP3012-06UTG (AEC-Q101 Qualified)
*Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected
but should be connected to the opposite pin
with the PCB trace.
1
2
3
SP3012-04HTG
• LCD/PDP TVs
• Set Top Boxes
• External Storages
• Smartphones
• DVD/Blu-ray Players
• Ultrabooks/Notebooks
• Desktops
• Digital Cameras
• MP3/PMP
Functional Block Diagram
SP3012-03UTG
Application Example for USB3.0
SP3012-06UTG
USB Port
PIN 1
PIN 11
PIN 12
PIN 13
PIN 14
PIN 4
PIN 5
PIN 8
USB Controller
VBUS
PIN 9
GND (PIN 2)
SSTX+
PIN 10
SP3012-04UTG
SSTX-
SP3012-04HTG
IC
SSRX+
PIN 1
PIN 2
PIN 4
PIN 5
SSRX-
PIN 1
PIN 3
PIN 4
PIN 6
GND (PIN 3, 8)
GND
SP3012-06UTG
D+
GND (PIN 2)
D-
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
Signal GND
SP3012
Description
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Absolute Maximum Ratings
Parameter
Value
Peak Current (tp=8/20μs)
TOP
TSTOR
Units
4.0
A
Operating Temperature
-40 to 125
°C
Storage Temperature
-55 to 150
°C
SP3012
Symbol
IPP
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
VRWM
IR ≤ 1µA
Reverse Standoff Voltage
Reverse Breakdown Voltage
VBR
IR =1mA
Reverse Leakage Current
ILEAK
VR=5V, Any I/O to GND
Clamp Voltage1
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1
Diode Capacitance
Diode Capacitance1
Typ
Max
Units
5.0
V
1.5
µA
6
IPP=1A, tp=8/20µs, Fwd
6.6
7.9
V
IPP=2A, tp=8/20µs, Fwd
7.0
8.4
V
(VC2 - VC1) / (IPP2 - IPP1)
VESD
1
Min
0.4
Ω
IEC61000-4-2 (Contact)
±12
kV
IEC61000-4-2 (Air)
±25
kV
CI/O-GND
Reverse Bias=0V, f=1 MHz
0.5
0.65
pF
CI/O-/O
Reverse Bias=0V, f=1 MHz
0.3
0.4
pF
Note: 1 Parameter is guaranteed by design and/or device characterization.
Capacitance vs. Bias Voltage
Insertion Loss (S21) I/O to GND
0
1.0
-1
-2
Attenuation (dB)
Capacitance (pF)
0.8
0.6
0.4
-3
-4
-5
-6
-7
0.2
-8
-9
0.0
0.0
1.0
2.0
3.0
4.0
-10
5.0
Clamping Voltage vs. IPP
TLP Current (A)
8.0
Clamp Voltage (V)
6.0
4.0
2.0
1
2
1000
Transmission Line Pulsing(TLP) Plot
10.0
0.0
100
Frequency (MHz)
10
Bias Voltage (V)
Current (A)
3
4
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
TLP Voltage (V)
9
10
11
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Pulse Waveform
110%
100%
90%
70%
SP3012
Percent of IPP
80%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Part Number
Package
Marking
Min. Order Qty.
Time 25°C to peak Temperature (TP)
8 minutes Max.
SP3012-03UTG
µDFN-6
V*3
3000
Do not exceed
260°C
SP3012-04UTG
µDFN-10
V*4
3000
SP3012-06UTG
µDFN-14
V*6
3000
SP3012-04HTG
SOT23-6
V*4
3000
Product Characteristics
Lead Plating
Pre-Plated Frame (µDFN)
Matte Tin (SOT23)
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
Ordering Information
Part Numbering System
SP 3012 – xx x T G
TVS Diode Arrays
(SPA® Diodes)
G= Green
T= Tape & Reel
Series
Package
Number of
Channels
U= µDFN-6 (1.6x1.6mm)
µDFN-10 (2.5x1.0mm)
03 = 3 channel
04 = 4 channel
06 = 6 channel
µDFN-14 (3.5x1.35mm)
H= SOT23-6 (3.0x1.75mm)
Part Marking System
V* *
Number of
Product Series
Channels
V = SP3012
Assembly Site 3 = 3 channel
4 = 4 channel
6 = 6 channel
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Application Information
Signal Integrity of High-Speed Data Interfaces
Figure 1: PCB Layout of the SP3012-06UTG for USB 3.0
Adding external ESD protection to a high-speed data port is
not trivial for a variety of reasons.
J1
1. ESD protection devices will add parasitic capacitance
to each data line from line to GND and line to line causing
impedance mismatches between the differential pairs. This
ultimately affects the signal eye-diagram and whether or
not the transceiver can distinguish a “1” from a “0”.
2. ESD devices should be placed as close as possible
to the port being protected to maximize their effect (i.e.
clamping capability) and minimize the effect that PCB trace
inductance can have during an ESD transient. Depending
on the package size and pinout this could be challenging
and the bigger the package, the larger the land pattern
must be, which adds more parasitic capacitance.
U1
Figure 2 shows the USB 3.0 eye diagram that resulted
from the PCB layout above with the SP3012-06UTG
soldered on the landing pattern.
3. Stub traces can add another element of discontinuity
adversely affecting signal integrity so ESD protection is
best employed when it’s “overlaid” on the data lines or
when the signals can simply pass underneath the device.
500
Taking all of this into account Littelfuse developed
the SP3012 Series which was designed specifically
for protection of high-speed data ports such as HDMI
1.3/1.4 and USB 3.0. They present less than 0.5pF from
line to GND and only 0.3pF from line to line minimizing
impedance mismatch between the differential pairs.
Furthermore, the SP3012 is rated up to ±12kV (contact
discharge) which far exceeds the maximum requirement of
the IEC 61000-4-2 standard.
There are two options available (4 channel and 6 channel)
and both are housed in leadless µDFN packages so the
data lines can pass directly underneath the device to
reduce discontinuities and maintain signal integrity.
0
Wfrms:500
-500
Base: 27.0000 ns
Scale:33.0 ps/div
Figure 2: USB 3.0 Eye Diagram with the SP3012-06UTG
Using a similar layout as above, Figure 3 shows the eye
diagram that resulted using the SP3012-04UTG to protect
the Super-Speed data lines and the SP3003-02UTG to
protect the legacy data pair.
500
USB 3.0 Eye Diagram Data
Figure 1 shows the layout used for the SP3012-06UTG in a
USB 3.0 application. The traces routed toward the top are
the two legacy USB 2.0 lines (D+/D-) that run at the slower
speed of 480Mbps and therefore are not as critical as the
5Gbps Super-Speed traces.
0
Wfrms:850
-500
Base: 27.0000 ns
Scale:33.0 ps/div
Figure 3: USB 3.0 Eye Diagram with the SP3012-04UTG
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — μDFN-6
6
5
D2
A
D
0.05 C
L
4
4
6
5
0.05 C
E
E2
1
Pin 1 Index Area
2
3
2
3
B
1
Pin 1 chamfer
0.10 x 45’
℮
Side View
0.05 C
A3
A1
A
Seating plane
Package
μDFN-6 (1.6x1.6x0.5mm)
JEDEC
MO-229
Symbol
Millimeters
Max
Min
Max
A
0.45
0.55
0.018
0.022
A1
0.00
0.05
0.000
0.152Ref
A3
0.002
0.006 Ref
b
0.20
0.30
0.008
0.012
D
1.55
1.65
0.061
0.065
D2
1.05
1.30
0.042
0.052
E
1.50
1.70
0.060
0.067
E2
0.40
0.65
0.016
0.026
0.50 BSC
e
C
Inches
Min
L
0.164
0.020BSC
0.316
0.006
0.012
b
0.10 M C A B
0.05 M C
D
Embossed Carrier Tape & Reel Specification — μDFN-6
t
W
E
P2
Symbol
Millimetres
Min
Max
Min
Max
E
1.65
1.85
0.06
0.07
F
3.45
3.55
0.14
0.14
D1
1.00
1.25
0.04
0.05
1.50 MIN
D
P0
B0
F
D1
P0
K0
A0
10P0
Pin 1 Location
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
3.90
0.06 MIN
4.10
40.0+/- 0.20
0.15
0.16
1.57+/-0.01
W
7.90
8.30
0.31
0.33
P2
1.95
2.05
0.08
0.08
A0
1.78
1.88
0.07
0.07
B0
1.78
1.88
0.07
0.07
K0
0.84
0.94
0.03
t
User Feeding Direction
Inches
0.25 TYP
0.04
0.01 TYP
SP3012
Bottom View
Top View
TVS Diode Arrays (SPA® Diodes)
Top View
Low Capacitance ESD Protection - SP3012 Series
A
D
E
B
Side View
Package Dimensions— µDFN-10 (2.5x1.0x0.5mm)
0.05 C
JEDEC
Top View
Symbol
A
D
B
0.05 C
0.05 C
b1
C
Millimeters
A
0.48
0.515
0.55
M C
0.019 0.050.020
0.024
A1
0.00
--
0.05
0.000
Min
0.022
0.125 Ref
0.005 Ref
Bottom View
b
0.15
0.20
0.25
b1
0.35
0.40
0.45
0.008
0.014 R0.125
0.016
D
2.40
2.50
2.60
0.094
0.098
0.102
E
0.90
1.00
1.10
0.035
0.039
0.043
0.28
0.365
0.006
L
0.50 BSC
0.48
Soldering Pad Layout Dimensions
Inch
Millimeter
C
(0.034)
(0.875)
0.10 M C A B
G
0.008
0.20
0.05 M C
P
0.020
0.50
P1
0.039
1.00
X
0.008
0.20
R0.125
Inches
M C A B Max
0.10Nom
Max
b
Bottom View
0.05 C
b1
Nom
L
A1 A3
A
b
Min
e
Side View
Seating
Plane
C
A3
E
A1 A3
A
µDFN-10
Seating(2.5x1.0x0.5mm)
Plane
MO-229
Package
X1
0.016
0.40
Y
0.027
0.675
Y1
(0.061)
(1.55)
Z
0.061
1.55
0.012
0.018
0.020 BSC
2xR0.075mm
(7x)
0.014
0.019
0.012
e
Recomended
Soldering Pad Layout
P1
P
Y
(Y1)
Z (C) G
X
X1
Alternative
Soldering Pad Layout
L
P1
P
2xR0.075mm (7x)
e
Y
(Y1)
Z (C) G
Recomended
Soldering Pad Layout
X
P1
X1
P
Embossed Carrier Tape & Reel YSpecification— µDFN-10
(Y1)
Z (C) G
Package
P0
T
D
0
P1
P2
Symbol
E
X
B0
F
W
X1
D1
A0
K0
5º Max
5º Max
µDFN-10 (2.5x1.0x0.5mm)
User Feeding Direction
Pin 1 Location
Millimeters
Min
Max
A0
1.15
1.55
B0
2.65
2.93
D0
1.50
1.60
D1
0.45
1.25
E
1.65
1.85
F
3.40
3.60
K0
0.55
0.75
P0
3.00
5.00
P1
3.00
5.00
P2
1.95
2.05
T
0.17
0.30
W
7.70
8.30
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — µDFN-14 (3.5x1.35x0.5mm)
µDFN-14 (3.5x1.35x0.5mm)
Top View
A
JEDEC MO-229
Millimeters
E
PIN 1 Index Area
Symbol
1 2 3 4
B
A
Side View
Seating
Plane
A
b
C
Inches
Min
Max
Min
Max
0.40
0.60
0.016
0.024
b
0.15
0.25
0.006
0.010
D
3.40
3.60
0.134
0.142
E
1.25
1.45
0.050
0.500 BSC
e
0.25
L
0.058
0.020BSC
0.45
0.010
0.018
Notes:
Bottom View
1. Dimension and tolerancing comform to ASME Y14.5M-1994.
2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily
exact.
Pin 1 Identification
Chamfer 0.10X45º
Recomended
Soldering Pad Layout
Soldering Pad Layout Dimensions
Symbol
Millimeter
Symbol
D
Millimeters
Inches
Inches
Min
Nom
Max
Min
Nom
Max
3.29
3.30
3.31
0.1295
0.1299
0.1303
E
1.44
1.45
1.46
0.0567
0.0571
0.0575
b
0.29
0.30
0.31
0.0114
0.0118
0.0122
L
0.39
0.40
0.41
0.0154
0.0158
0.0161
0.50 typ
e
0.020 typ
s
0.19
0.20
0.21
0.0075
0.0078
0.0083
s1
0.64
0.65
0.66
0.0252
0.0256
0.0260
Embossed Carrier Tape & Reel Specification — µDFN-14
P1
P2
P0
D0
User Feeding Direction
E
F
W
Pin 1 Location
D1
A0
T
K0
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
B0
Symbol
Millimeters
A0
1.58 +/- 0.10
B0
3.73 +/- 0.10
D0
0.60 + 0.05
D1
Ø 0.60 + 0.05
E
1.75 +/- 0.10
F
5.50 +/- 0.05
K0
0.68 +/- 0.10
P0
2.00 +/- 0.05
P1
4.00 +/- 0.10
P2
4.00 +/- 0.10
T
0.28 +/- 0.02
W
12.00 + 0.30 /- 0.10
SP3012
D
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — SOT23-6
Package
SOT23
Pins
6
JEDEC
MO-178AB
Millimeters
Min
Max
Max
Notes
A
0.900
1.450
0.035
0.057
-
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 ref
e1
1.9 Ref
0.0748 Ref
0.30
0.600
0.012
8º
0º
6
N
a
M
Min
A1
L
Recommended Solder Pad Layout
Inches
0º
-
0.023
6
4,5
6
8º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Notes:
1. Dimensioning and tolerancing Per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Foot length L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
P
R
O
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
14.4mm
ACCESS HOLE
13mm
180mm
4.0mm
2.0mm
1.5mm
DIA. HOLE
1.75mm
CL
8mm
4.0mm
60mm
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
SOT-23 (8mm POCKET PITCH)
8.4mm
USER DIRECTION OF FEED
COVER TAPE
PIN 1
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/30/15
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