TSC695FL - Datasheet

TSC695FL - Datasheet
Features
• Integer Unit Based on SPARC V7 High-performance RISC Architecture
• Optimized Integrated 32/64-bit Floating-point Unit
• On-chip Peripherals
•
•
•
•
•
•
•
•
•
•
•
– EDAC and Parity Generator and Checker
– Memory Interface
Chip Select Generator
Waitstate Generation
Memory Protection
– DMA Arbiter
– Timers
General Purpose Timer (GPT)
Real-time Clock Timer (RTCT)
Watchdog Timer (WDT)
– Interrupt Controller With 5 External Inputs
– General Purpose Interface (GPI)
– Dual UART
Speed Optimized Code RAM Interface
8- or 40-bit boot-PROM (Flash) Interface
IEEE 1149.1 Test Access Port (TAP) for Debugging and Test Purposes
Fully Static Design
Performance: 12 MIPs/3 MFlops (Double Precision) at SYSCLK = 15 MHz
Core Consumption: 0.3W Typ. at 12 MIPs
Operating Range: 3.15V to 3.45V -55°C to +125°C
Tested up to a Total Dose of 300 Krds (si) according toMIL STD 883 Method 1019
No Single Event Latch-up Below an LET Threshold of 80 MeV/mg/cm2
Single Event Upsets Error Rate Better than:
– 2 E-7 Error/Component/Day in GEO Orbit
– 5 E-5 Error/Component/Day in LEO Orbit (53°, 1000 km)
Quality Grades: ESCC, and QMLQ or V with 5962-03246
Package: 256 MQFPF; Bare Die
Low-Voltage
Rad-Hard 32-bit
SPARC
Embedded
Processor
TSC695FL
Description
The TSC695FL (ERC32 Single-Chip) is a highly integrated, high-performance 32-bit
RISC embedded processor implementing the SPARC architecture V7 specification. It
has been developed with the support of the ESA (European Space Agency), and
offers a full development environment for embedded space applications.
The processor is manufactured using the Atmel 0.5 µm radiation tolerant (≥ 300
KRADs (Si)) CMOS enhanced process (RTP). It can operate at a low voltage for optimized power consumption (see datasheet TSC695FL). It has been specially designed
for space, as it has on-chip concurrent transient and permanent error detection.
The TSC695FL includes an on-chip Integer Unit (IU), a Floating Point Unit (FPU), a
Memory Controller and a DMA arbiter. For real-time applications, the TSC695FL
offers a high security watchdog, two timers, an interrupt controller, parallel and serial
interfaces. Fault tolerance is supported using parity on internal/external buses and an
EDAC on the external data bus. The design is highly testable with the support of an
On-Chip Debugger (OCD), and a boundary scan through JTAG interface.
The TSC695FL is a selection of the TSC5695F performed for a narrow 3.3V biasing
voltage range (± 0.15V), as such, this specification can be only met by the products
solds as TSC695FL. Where computing power is not the key factor, it allows for a dramatic power consumption reduction (70%).
Rev. 4204C–AERO–05/05
Block Diagram
Figure 1. TSC695FL Block Diagram
32-bit
Integer
Unit
TAP
32/64-bit
Floating-Point
Unit
Parity
Gen./Chk.
Clock
&
Parity
Reset
Managt Gen./Chk.
Error
Managt
General Purpose
Timer
General Purpose
Interface
UART B
UART A
GPI bits
RxD, TxD
Pin Descriptions
Signal
Real Time Clock
Timer
Type
RA[31:0]
I/O,
RAPAR
I/O
RASI[3:0]
RSIZE[1:0]
Watch
Dog
Interrupt
Controller
DMA
Arbiter
DMA Ctrl
Access
Controller
Mem Ctrl
Wait State
Controller
Ready/Busy
Address
Interface
Add.+Size+ASI
EDAC
Data+Check bits
Parity
Gen./Check.
Parities
Interrupts
For pin assignment, refer to package section.
Active
Description
32-bit registered address bus
High
Output buffer: 400 pF
Registered address bus parity
-
I/O
4-bit registered address space identifier
-
I/O
2-bit registered bus transaction size
-
RASPAR
I/O
High
Registered ASI and SIZE parity
-
CPAR
I/O
High
Control bus parity
-
D[31:0]
I/O
32-bit data bus
-
CB[6:0]
I/O
7-bit check-bit bus
-
DPAR
I/O
High
Data bus parity
-
RLDSTO
I/O
High
Registered atomic load-store
-
ALE
O
Low
Address latch enable
-
DXFER
I/O
High
Data transfer
-
LOCK
I/O
High
Bus lock
-
RD
I/O
High
Read access
-
WE
I/O
Low
Write enable
-
WRT
I/O
High
Advanced write
-
MHOLD
O
Low
Memory bus hold
MDS
O
Low
Memory data strobe
-
MEXC
O
Low
Memory exception
-
PROM8
I
Low
BA[1:0]
O
MHOLD+FHOLD
+BHOLD+FCCV
Select 8-bit wide PROM
-
Latched address used for 8-bit wide boot PROM
-
ROMCS
O
Low
PROM chip select
-
ROMWRT
I
Low
ROM write enable
-
MEMCS[9:0]
O
Low
Memory chip select
Output buffer: 400 pF
MEMWR
O
Low
Memory write strobe
Output buffer: 400 pF
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TSC695FL
Signal
Type
Active
Description
OE
O
Low
Memory output enable
BUFFEN
O
Low
Data buffer enable
Output buffer: 400 pF
-
DDIR
O
High
Data buffer direction
-
DDIR
O
Low
Data buffer direction
-
IOSEL[3:0]
O
Low
I/O chip select
-
IOWR
O
Low
I/O and exchange memory write strobe
-
EXMCS
O
Low
Exchange memory chip select
-
BUSRDY
I
Low
Bus ready
-
BUSERR
I
Low
Bus error
-
DMAREQ
I
Low
DMA request
-
DMAGNT
O
Low
DMA grant
-
DMAAS
I
High
DMA address strobe
-
DRDY
O
Low
Data ready during DMA access
-
IUERR
O
Low
IU error
-
CPUHALT
O
Low
Processor (IU & FPU) halt and freeze
-
SYSERR
O
Low
System error
-
SYSHALT
I
Low
System halt
SYSAV
O
High
System availability
-
NOPAR
I
Low
No parity
-
INULL
O
High
Integer unit nullify cycle
INST
O
High
Instruction fetch
FPU instruction flush
FLUSH
O
High
DIA
O
High
Delay instruction annulled
RTC
O
High
Real Time Clock Counter output
RxA/RxB
I
Receive data UART ’A’ and ’B’
TxA/TxB
O
Transmit data UART ’A’ and ’B’
GPI[7:0]
I/O
GPI input/output
GPIINT
O
EXTINT[4:0]
I
EXTINTACK
O
High
External interrupt acknowledge
IWDE
I
High
Internal watch dog enable
EWDINT
I
High
External watch dog input interrupt
High
GPI interrupt
External interrupt
Used to check the execute
stage of IU
instruction pipeline
Input trigger
Input trigger
Input trigger
Input trigger
WDCLK
I
Watch dog clock
-
CLK2
I
Double frequency clock
-
SYSCLK
O
System clock
-
RESET
O
Low
Output reset
SYSRESET
I
Low
System input reset
Input trigger
Factory test mode
Functional mode=00
High
Software debug mode
TMODE[1:0]
I
DEBUG
I
TCK
I
TRST
I
TMS
-
-
Test (JTAG) clock
-
Test (JTAG) reset
pull-up ≈ 37 kΩ
I
Test (JTAG) mode select
pull-up ≈ 37 kΩ
TDI
I
Test (JTAG) data input
pull-up ≈ 37 kΩ
TDO
O
Test (JTAG) data output
-
VCCI/VSSI
Main internal power
-
VCCO/VSSO
Output driver power
-
Note:
Low
If not specified, the output buffer type is 150 pF, the input buffer type is TTL.
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System Architecture
The TSC695FL is to be used as an embedded processor requiring only memory and
application specific peripherals to be added to form a complete on-board computer. All
other system support functions are provided by the core.
Figure 2. System Architecture Based on TSC695FL
DMA Unit
Boot PROM
Ax[31:0]
Xtd PROM
Master
Xchg Mem
Glue
Logic
Local
Memory
Xtd RAM
I/O 0
to
I/O 3
DMAGNT
DMAREQ
DMAAS
DPAR
Xtd I/O
(BUFFEN, DDIR)
Xtd general
Memory
Interface
FPU
CB[6:0]
RA[31:0]
MEMCtrl
(ROMCS, EXMCS, IOSEL[3:0], MEMWR, IOWR, OE, BUSRDY,...)
RAMCtrl
DMA
A[31:0]
IU
DMA
Peripherals
RAM
Memory
D[31:0]
SYSCLK
ALE
(MEMCS[9:0], MEMWR, OE)
(0 ws)
User
Application
TSC695FL
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TSC695FL
Product Description
Integer Unit
The IU is designed for highly dependable space and military applications, and includes
support for error detection. The RISC architecture makes the creation of a processor
that can execute instructions at a rate approaching one instruction per processor clock
possible.
To achieve that rate of execution, the IU employs a four-stage instruction pipeline that
permits parallel execution of multiple instructions.
•
Fetch - The processor outputs the instruction address to fetch the instruction.
•
Decode - The instruction is placed in the instruction register and is decoded. The
processor reads the operands from the register file and computes the next
instruction address.
•
Execute - The processor executes the instruction and saves the results in temporary
registers. Pending traps are prioritized and internal traps are taken during this stage.
•
Write - If no trap is taken, the processor writes the result to the destination register.
All four stages operate in parallel, working on up to four different instructions at a time. A
basic ’single-cycle’ instruction enters the pipeline and completes in four cycles.
By the time it reaches the write stage, three more instructions have entered and are
moving through the pipeline behind it. So, after the first four cycles, a single-cycle
instruction exits the pipeline and a single-cycle instruction enters the pipeline on every
cycle. Of course, a ’single-cycle’ instruction actually takes four cycles to complete, but
they are called single cycle because with this type of instruction the processor can complete one instruction per cycle after the initial four-cycle delay.
Floating-point Unit
The FPU is designed to provide execution of single and double-precision floating-point
instructions concurrently with execution of integer instructions by the IU. The FPU is
compliant to the ANSI/IEEE-754 (1985) floating-point standard.
The FPU is designed for highly dependable space and military applications, and
includes support for concurrent error detection and testability.
The FPU uses a four stage instruction pipeline consisting of fetch, decode, execute and
write stages (F, D, E and W). The fetch unit captures instructions and their addresses
from the data and address busses. The decode unit contains logic to decode the floating-point instruction opcodes. The execution unit handles all instruction execution. The
execution unit includes a floating-point queue (FP queue), which contains stored floating-point operate (FPop) instructions under execution and their addresses. The
execution unit controls the load unit, the store unit, and the datapath unit. The FPU
depends upon the IU to access all addresses and control signals for memory access.
Floating-point loads and stores are executed in conjunction with the IU, which provides
addresses and control signals while the FPU supplies or stores the data. Instruction
fetch for integer and floating-point instructions is provided by the IU.
The FPU provides three types of registers: f registers, FSR, and the FP queue. The FSR
is a 32-bit status and control register. It keeps track of rounding modes, floating-point
trap types, queue status, condition codes, and various IEEE exception information. The
floating-point queue contains the floating-point instruction currently under execution,
along with its corresponding address.
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Instruction Set
TSC695FL instructions fall into six functional categories: load/store, arithmetic/logical/shift, control transfer, read/write control register, floating-point, and miscellaneous.
Please refer to SPARC V7 Instruction-set Manual.
Note:
The execution of IFLUSH will cause an illegal instruction trap.
On-chip Peripherals
Memory Interface
The TSC695FL is designed to allow easy interfacing to internal/external memory
resources.
Table 1. Memory Mapping
Memory Contents
Boot PROM
Start Address
0x 0000 0000
Size (bytes)
128K → 16M
Data Size and Parity Options
8-bit mode
No parity/-No EDAC/-Only byte write
40-bit mode
Parity + EDAC mandatory/-Only word write
8-bit mode
No parity/-No EDAC/-Only byte write
Parity + EDAC mandatory/-Only word write
Extended PROM
0x 0100 0000
Max: 15M
40-bit mode
Exchange Memory
0x 01F0 0000
4K → 512K
Parity + EDAC option/-Only word write
System Registers
0x 01F8 0000
512K (124 used)
Parity/-Only word read/write access
RAM (8 blocks)
0x 0200 0000
8*32K → 8*4M
Extended RAM
0x 0400 0000
Max: 192M
I/O Area 0
0x 1000 0000
0 → 16M
I/O Area 1
0x 1100 0000
0 → 16M
I/O Area 2
0x 1200 0000
0 → 16M
I/O Area 3
0x 1300 0000
0 → 16M
Extended I/O Area
0x 1400 0000
Max: 1728M
Parity option/-All data sizes allowed
Extended General
0x 8000 0000
Max: 2G
No parity/-All data sizes allowed
System Registers
Parity + EDAC option/-All data sizes allowed
The system registers are only writeable by IU in the supervisor mode or by DMA during
halt mode.
Table 2. System Registers Address Map
System Register Name
6
Address
System Control Register
SYSCTR
0x 01F8 0000
Software Reset
SWRST
0x 01F8 0004
Power Down
PDOWN
0x 01F8 0008
System Fault Status Register
SYSFSR
0x 01F8 00A0
Failing Address Register
FAILAR
0x 01F8 00A4
Error & Reset Status Register
ERRRSR
0x 01F8 00B0
Test Control Register
TESCTR
0x 01F8 00D0
TSC695FL
4204C–AERO–05/05
TSC695FL
Table 2. System Registers Address Map (Continued)
System Register Name
Wait-state and Time-out
Generator
Address
Memory Configuration Register
MCNFR
0x 01F8 0010
I/O Configuration Register
IOCNFR
0x 01F8 0014
Waitstate Configuration Register
WSCNFR
0x 01F8 0018
Access Protection Segment 1 Base Register
APS1BR
0x 01F8 0020
Access Protection Segment 1 End Register
APS1ER
0x 01F8 0024
Access Protection Segment 2 Base Register
APS2BR
0x 01F8 0028
Access Protection Segment 2 End Register
APS2ER
0x 01F8 002C
Interrupt Shape Register
INTSHR
0x 01F8 0044
Interrupt Pending Register
INTPDR
0x 01F8 0048
Interrupt Mask Register
INTMKR
0x 01F8 004C
Interrupt Clear Register
INTCLR
0x 01F8 0050
Interrupt Force Register
INTFCR
0x 01F8 0054
Watchdog Timer Register
WDOGTR
0x 01F8 0060
Watchdog Timer Trap Door Set
WDOGST
0x 01F8 0064
Real Time Clock Timer <Counter> Register
RTCCR
0x 01F8 0080
Real Time Clock Timer <Scaler> Register
RTCSR
0x 01F8 0084
General Purpose Timer <Counter> Register
GPTCR
0x 01F8 0088
General Purpose Timer <Scaler> Register
GPTSR
0x 01F8 008C
Timers Control Register
TIMCTR
0x 01F8 0098
General Purpose Interface Configuration Register
GPICNFR
0x 01F8 00A8
General Purpose Interface Data Register
GPIDATR
0x 01F8 00AC
UART ’A’ Rx & Tx Register
UARTAR
0x 01F8 00E0
UART ’B’ Rx & Tx Register
UARTBR
0x 01F8 00E4
UART Status Register
UARTSR
0x 01F8 00E8
It is possible to control the wait state generation by programming a Waitstate Configuration Register. The maximum programmable number of wait-states is applied by default
at reset.
It is possible to program the number of wait states for the following combinations:
–
RAM read and write
–
PROM read and write (i.e. EEPROM or Flash write)
–
Exchange Memory read/write
–
Four individual I/O peripherals read/write
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A bus time-out function of 256 system clock cycles is provided for the bus ready controlled memory areas, i.e. the Extended PROM, Exchange Memory, Extended RAM,
Extended I/O and the Extended General areas.
EDAC
The TSC695FL includes a 32-bit EDAC (Error Detection And Correction). Seven bits
(CB[6:0]) are used as check bits over the data bus. The Data Bus Parity signal (DPAR)
is used to check and generate the odd parity over the 32-bit data bus. This means that
altogether 40 bits are used when the EDAC is enabled.
The TSC695FL EDAC uses a 7-bit Hamming code which detects any double bit error on
the 40-bit bus as a non-correctable error. In addition, the EDAC detects all bits stuck-atone and stuck-at-zero failure for any nibble in the data word as a non-correctable error.
Stuck-at-one and stuck-at-zero for all 32 bits of the data word is also detected as a noncorrectable error.
Memory and I/O Parity
The TSC695FL handles parity towards memory and I/O in a special way. The processor
can be programmed to use no parity, only parity or parity and EDAC protection towards
memory and to use parity or no towards I/O. The signal used for the parity bit is DPAR.
Memory Redundancy
Programming the Memory Configuration Register, the TSC695FL provides chip selects
for two redundant memory banks for replacement of faulty banks.
Memory Access Protection
•
Unimplemented Areas - Access to all unimplemented memory areas are handled by
the TSC695FL and detected as illegal.
•
RAM Write Access Protection - The TSC695FL can be programmed to detect and
mask write accesses in any part of the RAM. The protection scheme is enabled only
for data area, not for the instruction area. The programmable write access
protection is based on two segments.
•
Boot PROM Write Protection - The TSC695FL supports a qualified PROM write for
an 8-bit wide PROM and/or for a 40-bit wide PROM.
DMA
DMA Interface
The TSC695FL supports Direct Memory Access (DMA). The DMA unit requests access
to the processor bus by asserting the DMA request signal (DMAREQ). When the DMA
unit receives the DMAGNT signal in response, the processor bus is granted. In case the
processor is in the power-down mode the processor is permanent tri-stated, and a
DMAREQ will directly give a DMAGNT. The TSC695FL includes a DMA session timeout function.
Bus Arbiter
The TSC695FL always has the lowest priority on the system bus.
Traps
A trap is a vectored transfer of control to the supervisor through a special trap table that
contains the first four instructions of each trap handler. The base address of the table is
established by supervisor and the displacement, within the table, is determined by the
trap type. Two categories of traps can appear.
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4204C–AERO–05/05
TSC695FL
Synchronous Traps
Table 3. Synchronous Traps
Trap
Priority
Reset
1
-
Sources: SYSRESET* pin
software reset
watchdog reset
IU or System error reset
Non-restartable, imprecise
error
2.1
64h
Severe error requiring a re-boot
TSC695FL enters (if not masked) in halt or reset mode.
Non-restartable,
precise error
2.2
62h
Error not removable, PC & nPC OK
TSC695FL enters (if not masked) in halt or reset mode.
2.3
65h
Special case of non-restartable, precise error.
TSC695FL enters (if not masked) in halt or reset mode.
Restartable, late error
2.4
63h
Retrying instruction but PC & nPC have to be re-adjusted
TSC695FL enters (if not masked) in halt or reset mode.
Restartable,
precise error
2.5
61h
Retrying instruction
TSC695FL enters (if not masked) in halt or reset mode.
Register file error
Hardware Error
Trap Type (tt) Comments
2
Parity error on control bus
Parity error on data bus
Parity error on address bus
Access to protected or unimplemented area
Uncorrectable error in memory
Bus time out
Bus error
Instruction access
(Error on instruction fetch)
3
Illegal Instruction
4
02h
-
Privileged instruction
5
03h
-
FPU disabled
6
04h
-
05h
During SAVE instruction or trap taken
06h
During RESTORE instruction or RETT instruction
07h
-
Overflow
Window
7
Underflow
Memory address not aligned
FPU exception
01h
8
Non-restartable error
9.1
Severe error, cannot restart the instruction.
Data bus error
9.2
Parity error on FPU data bus.
Restartable error
9.3
Can be removed restarting the instruction.
Sequence error
9.4
-
Unimplemented FPop
9.5
-
IEEE exceptions:
9
9.6
08h
Invalid operation
Division by zero
Overflow
Underflow
Inexact
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Table 3. Synchronous Traps (Continued)
Trap
Priority
Trap Type (tt) Comments
Data access exception
(Error on data load)
10
09h
Idem “instruction access”
System register access violation
Tag overflow
11
0Ah
TADDccTV and TSUBccTV instructions
Trap instructions
12
80h to FFh
Trap on integer condition codes (Ticc)
Table 4. Interrupts or Asynchronous Traps
Trap
Priority
Trap Type (tt) Comments
Watchdog time-out
13
1Fh
Internal or external (EWDINT pin)
External INT 4
14
1Eh
EXTINTAK on only one of EXTINT[4:0]
Real time clock timer
15
1Dh
-
General purpose timer
16
1Ch
-
External INT 3
17
1Bh
EXTINTAK on only one of EXTINT[4:0]
External INT 2
18
1Ah
EXTINTAK on only one of EXTINT[4:0]
DMA time-out
19
19h
-
DMA access error
20
18h
-
UART Error
21
17h
-
Correctable error in memory
22
16h
Data read OK but source not updated
UART B
Data ready
Transmitter ready
23
15h
-
UART A
Data ready
Transmitter ready
24
14h
-
External INT 1
25
13h
EXTINTAK on only one of EXTINT[4:0]
External INT 0
26
12h
EXTINTAK on only one of EXTINT[4:0]
11h
Logical OR of:
IU hardware error masked
IU error mode masked
System hardware error masked
Masked hardware errors
27
It is possible to mask each individual interrupt (except Watchdog time-out). The interrupts in the Interrupt Pending Register
are cleared automatically when the interrupt is acknowledged.
By programming the Interrupt Shape Register, it is possible to define the external interrupts to be either active low or active
high and to define the external interrupts to be either edge or level sensitive.
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TSC695FL
Timers
In software debug mode the timers are controlled by a system register bit and the external pin DEBUG.
General Purpose Timer
The General Purpose Timer (GPT) provides, in addition to a generalized counter function, a mechanism for setting the step size in which actual time counts are performed.
GPT is clocked by the internal system clock. They are possible to program to be either
of single-shot type or periodical type and in both cases generate an interrupt when the
delay time has elapsed. The current value of the scaler and counter of the GPT can be
read.
Real Time Clock Timer
The only functional differences between the two timers are that the Real Time Clock
Timer (RTCT) has an 8-bit scaler (16-bit scaler for GPT) and that the RTCT interrupt has
higher priority than the GPT interrupt.
RTCT information is available on RTC output pin.
Watchdog Timer
Setting the external pin IWDE to Vcc enables the internal watchdog timer. Otherwise the
watchdog function must be externally provided.
The watchdog is supplied from a separate external input (WDCLK). After reset, the timer
is enabled and starts running with the maximum range. If the timer is not refreshed
(reprogrammed) before the counter reaches zero value, an interrupt is sent. Simultaneously, the timer starts counting a reset time-out period. If the timer is not
acknowledged before the reset time-out period elapses, a reset is applied to TSC695FL.
UARTs
Two full duplex asynchronous receiver transmitters (UART) are included. In software
debug mode the UART’s are controlled by system register bits.
The data format of the UART’s is eight bits. It is possible to choose between even or odd
parity, or no parity, and between one and two stop bits. The UART’s provide double buffering, i.e. each UART consists of a transmitter holding register, a receiver holding
register, a transmitter shift register, and a receiver shift register. Each of these registers
are 8-bit wide. For each UART a RX and TX Register is provided. The UART’s generate
an interrupt each time a byte has been received or a byte has been sent. There is
another interrupt to indicate errors.
The baud rate of both the UART’s is programmable. The clock is derived either from the
system clock or can use the watchdog clock.
General Purpose Interface
The General Purpose Interface (GPI) is an 8-bit parallel I/O port. Each pin can be configured as an input or an output.
A falling or rising edge detection is made on each selected GPI inputs. Every input transition on GPI generates an external positive pulse on GPIINT pin of two SYSCLK width.
Execution Modes
Reset Mode
Reset mode is entered when:
–
The SYSRES input is asserted
–
Software reset which is caused by the software writing to a Software Reset
Register,
–
Watchdog reset which is caused by a Watchdog counter time-out
–
Error reset which is caused by a hardware parity error
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This RESET output has a minimum of 1024 SYSCLK width to allow the usage of flash
memories.
The error and Reset Status Register contain the source of the last processor reset.
Run Mode
In this mode the IU/FPU is executing, while all peripherals are running (if software
enabled).
System Halt Mode
System Halt mode is entered when the SYSHALT input is asserted. In this mode, the IU
and FPU are frozen, while the timers (includeing the internal watchdog timer) and
UART’s are stopped.
Power Down Mode
This mode is entered by writing to the Power Down Register. In this mode, the IU and
FPU are frozen. The TSC695FL leaves the power-down mode if an external interrupt is
asserted.
Error Halt Mode
Error Halt mode is entered under the following circumstances:
–
A internal hardware parity error.
–
The IU enters error mode.
The only way to exit Error Halt Mode is through Cold Reset by asserting SYSRESET.
Error Handler
The TSC695FL has one error output signal (SYSERR) which indicates that an
unmasked error has occurred. Any error signalled on the error inputs from the IU and
the FPU is latched and reflected in the Error and Reset Status Register. By default, an
error leads to a processor halt.
Parity Checking
The TSC695FL includes:
–
Parity checking and generation (if required) on the external data bus,
–
Parity checking on the external address bus,
–
Parity checking on ASI and SIZE,
–
Parity checking and generation on all system registers,
–
Parity generation and checking on the internal control bus to the IU,
All external parity checking can be disabled using the NOPAR signal.
System Clock
The TSC695FL uses CLK2 clock input directly and creates a system clock signal by
dividing CLK2 by two. It drives SYSCLK pin with a nominal 50% duty cycle for the application. It is highly recommended that only SYSCLK rising edge is used as reference as
far as possible.
System Availability
The SYSAV bit in the Error and Reset Status Register can be used by software to indicate system availability.
Test Mode
The TSC695FL includes a number of software test facilities such as EDAC test, Parity
test, Interrupt test, Error test and a simple Test Access Port. These test functions are
controlled using the Test Control Register.
12
TSC695FL
4204C–AERO–05/05
TSC695FL
Test and Diagnostic
Hardware Functions
A variety of TSC695FL test and diagnostic hardware functions, including boundary
scan, internal scan, clock control and On-chip Debugger, are controlled through an
IEEE 1149.1 (JTAG) standard Test Access Port (TAP).
Test Access Port
The TAP interfaces to the JTAG bus via 5 dedicated pins on the TSC695FL chip. These
pins are:
Instruction Register
Debugging
–
TCK (input): Test Clock
–
TMS (input): Test Mode Select
–
TDI (input): Test Data Input
–
TDO (output): Test Data Output
–
TRST (input): Test Reset
Five standard instructions are supported by the TSC695FL TAP.
Binary Value
Name of Instruction
Data Register
Scan Chain Accessed
00. 0000
EXTEST
Boundary Scan
Register
Boundary scan chain
00. 0001
SAMPLE/PRELOAD
Boundary Scan
Register
Boundary scan chain
00. 0011
INTEST
Boundary Scan
Register
Boundary scan chain
11. 1111
BYPASS
Bypass Register
Bypass register
10. 0000
IDCODE
Device ID Register
ID register scan chain
The design is highly testable with the support of an On-Chip Debugger (OCD), an internal and boundary scan through JTAG interface.
13
4204C–AERO–05/05
Electrical Characteristics
Absolute Maximum Ratings
Note: Stresses at or above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Military Range............................................... -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
Supply Voltage...................................................-0.5V to +7.0V
Input Voltage......................................................-0.5V to +7.0V
DC Characteristics
Table 5. DC Characteristics at VDD 3.3V ± 0.15V
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
VIL trigger
Input Low Voltage
for trigger input
–
–
1
V
VCC = 3.15 to 3.45V
VIH trigger
Input High Voltage
for trigger input
1.5
–
–
V
VCC = 3.15 to 3.45V
∆VT
Input Hysteresis
for trigger input
–
0.3
–
V
VCC = 3.15 to 3.45V
VIL TTL
Input Low Voltage
for TTL input
–
–
0.8
V
VCC = 3.15 to 3.45V
VIH TTL
Input High Voltage
for TTL input
2
–
–
V
VCC = 3.15 to 3.45V
VOL400 pF
Output Low Voltage
for 400 pF buffer
–
–
0.4
V
VCC = 3.15 to 3.45V
IOL = 9 mA
VOH400 pF
Output High Voltage
for 400 pF buffer
2.4
–
–
V
VCC = 3.15 to 3.45V
IOH = -6 mA
VOL150 pF
Output Low Voltage
for 150 pF buffer
–
–
0.4
V
VCC = 3.15 to 3.45V
IOL = 3 mA
VOH150 pF
Output High Voltage
for 150 pF buffer
2.4
–
–
V
VCC = 3.15 to 3.45V
IOH = -2 mA
IccOP
Operating Supply Current
for core processor
–
–
100
mA
VCC = 3.45V, f = 15 MHz
IccPD
Power Down Supply Current
for core processor
–
–
10
mA
VCC = 3.45V, f = 15 MHz
IIL
Low Level Input Current
-10
–
10
µA
VCC = 3.45V, VIN = 0
IIH
High-Level Input Current
-10
–
10
µA
VCC = 3.45V; VIN = VCC
IILPU
Low Level Input Pull-up Current
10
–
350
µA
VCC = 3.45V; VIN = 0
14
TSC695FL
4204C–AERO–05/05
TSC695FL
Capacitance Ratings
Parameter
Description
Max
CIN
Input Capacitance
7 pF
COUT
Output Capacitance
8 pF
CIO
Input/Output Capacitance
8 pF
AC Characteristics
Table 6. AC Characteristics (SYSCLK Freq. = 15 MHz - 3.3V ± 0.15V) Cload = 50 pF, Vref = VCC/2
Parameter
Min
(ns)
Max
(ns)
t1
33
t2
Comment
Reference Edge
–
CLK2 period
–
66
–
SYSCLK period
–
t3
16
–
CLK2 high and low pulse width
–
t4_1
–
10
RA(31:0) RAPAR RSIZE RLDSTO output delay
SYSCLK+
t4_2
–
16
LOCK Output delay
SYSCLK+
t5
–
18
MEMCS*(9:0) ROMCS* EXMCS* output delay
SYSCLK+
t6
–
18
DDIR DDIR* output delay
SYSCLK+
t7
–
36.5
MEMWR* IOWR*output delay
formula: 20 ns + 1/4 t2
SYSCLK- or SYSCLK+
t8
–
31.5
OE* HL output delay
formula: 15 ns + 1/4 t2
SYSCLK+
t9_1
16
–
Data setup time during load
SYSCLK+
t9_2
13
–
Data setup time during load NOPAR = 0 rpa = rec = either 0 or
1
SYSCLK+
t10
7
–
Data hold time during load
SYSCLK+
t11
–
44
Data output delay
SYSCLK-
t12
18
–
Data output valid to HZ – guaranteed by design
SYSCLK+
t13
–
30
CB output delay
SYSCLK+
t14
–
25
ALE* output delay
SYSCLK-
t15
–
32.5
BUFFEN* HL output delay
formula: 16 ns + 1/4 t2
SYSCLK+
t16
–
20
MHOLD* output delay – guaranteed by design
SYSCLK+
t17
–
20
MDS* DRDY* output delay
SYSCLK+
t20
–
20
MEXC* output delay
SYSCLK-
t21
15
–
RASI(3:0) RSIZE(1:0) RASPAR setup time
SYSCLK+
t22
0
–
RASI(3:0) RSIZE(1:0) RASPAR hold time
SYSCLK+
15
4204C–AERO–05/05
Table 6. AC Characteristics (SYSCLK Freq. = 15 MHz - 3.3V ± 0.15V) Cload = 50 pF, Vref = VCC/2 (Continued)
Parameter
Min
(ns)
Max
(ns)
t23
–
t24
16
Comment
Reference Edge
20
BOOT PROM address output delay
SYSCLK+
15
–
BUSRDY* setup time
SYSCLK+
t25
0
–
BUSRDY* hold time
SYSCLK+
t27
–
20
IOSEL output delay
SYSCLK+ HL
SYSCLK- LH
t28
15
33
DMAAS setup time
formula of max: 1/2 t2
SYSCLK+
t29
0
33
DMAAS hold time
formula of max: 1/2 t2
SYSCLK-
t30
15
–
DMAREQ* setup time
SYSCLK+
t31
–
20
DMAGNT* output delay
SYSCLK+
t32
15
–
RA(31:0) RAPAR CPAR setup time
SYSCLK+
t33
0
–
RA(31:0) RAPAR CPAR hold time
SYSCLK+
t36
100
–
TCK period
–
t37
10
–
TMS setup time
TCK+
t38
4
–
TMS hold time
TCK+
t39
10
–
TDI setup time
TCK+
t40
10
–
TDI hold time
TCK+
t41
–
20
TDO output delay
TCK-
t46
–
35
INULL output delay
SYSCLK+
t48
–
35
RESET* CPUHALT* output delay
SYSCLK+
t49
–
20
SYSERR* SYSAV output delay
SYSCLK+
t50
–
35
IUERR* output delay
SYSCLK+
t52
15
–
EXTINT(4:0) setup time
SYSCLK-
t53
0
–
EXTINT(4:0) hold time
SYSCLK+
t54
–
20
EXTINTACK output delay
SYSCLK+
t56
–
14
OE* LH output delay (no DMA mode)
SYSCLK+
t57
–
15
BUFFEN* LH output delay
SYSCLK+
t60
–
35
INST output delay
SYSCLK+
t61
30.5
–
Data output delay to low-Z – guaranteed by design
formula: 14 ns + 1/4 t2
SYSCLK+
TSC695FL
4204C–AERO–05/05
TSC695FL
Table 1 : Pad 150pF - 3,15V up to 3,45V
Cload
DTplh min
DTplh typ
DTplh max
50
0
0
0
100
2,7
4,05
7,25
150
5,2
8,4
14,35
200
7,95
12,5
21,45
250
10,65
16,75
28,55
DTphl (Vref Vcc/2)
Table 2 : Pad 150pF - 3,15V up to 3,45V
Cload
DTphl min
DTphl typ
DTphl max
50
0
0
0
100
2,65
3,5
5,7
150
5
6,95
11,15
200
7,35
10,45
15,6
250
9,95
13,85
18,45
30
25
DTplh Typ
20
15
10
DTplh Min
DTplh Max
5
0
50
100 150 200 250
Cload (pF)
Tphl derating vs 50pF
(ns)
DTplh (Vref Vcc/2)
Tplh derating vs 50pF
(ns)
Figure 3. 150 pF Buffer Response (Data from simulation)
20
15
DTphl Min
10
DTphlTyp
DTphl Max
5
0
50
100
150
200
250
Cload (pF)
Trise (Vref 10%-90%Vcc)
60
50
Trise (ns)
Table 3 : Pad 150pF - 3,15V up to 3,45V
Cload
Trise min
Trise typ
Trise max
50
4,95
7,3
12,55
100
8,4
13,15
23,5
150
12,25
19,3
34,3
200
15,9
25,55
45,3
250
19,85
31,8
56,4
Trise Min
40
30
20
Trise Typ
Trise Max
10
0
50
100 150 200 250
Cload (pF)
Tfall (Vref 10%-90%Vcc)
Tfall (ns)
60
Table 4 : Pad 150pF - 3,15V up to 3,45V
Cload
Tfall min
Tfall typ
Tfall max
50
4,45
6,1
11,45
100
7,2
12
21,85
150
11,35
18,25
32,45
200
15,8
24,8
43,1
250
20,35
31,4
53,65
50
40
Tfall Min
30
20
Tfall Typ
Tfall Max
10
0
50
100 150 200 250
Cload (pF)
17
4204C–AERO–05/05
Table 5 : Pad 400pF - 3,15V up to 3,45V
Cload
DTplh min
DTplh typ
DTplh max
50
0
0
0
100
2,8
3,65
5,4
150
5,1
6,55
10,4
200
6,95
9,65
15,2
250
8,9
12,5
20,05
DTphl (Vref Vcc/2)
Table 6 : Pad 400pF - 3,15V up to 3,45V
Cload
DTphl min
DTphl typ
DTphl max
50
0
0
0
100
3,6
3,9
5,1
150
6,3
6,95
9,7
200
8,85
10
14,1
250
11,5
12,95
18,25
25
20
DTplh Min
10
DTplh Max
5
0
150 250 350 450
Cload (pF)
20
15
DTphl Min
10
DTphlTyp
DTphl Max
5
0
50
150 250 350 450
Cload (pF)
Trise (Vref 10%-90%Vcc)
40
Trise (ns)
Table 7 : Pad 400pF - 3,15V up to 3,45V
Cload
Trise min
Trise typ
Trise max
50
3
3,9
5,7
100
5,8
7,7
12,2
150
8,1
11,6
19,15
200
10,7
15,5
26,25
250
13,15
19,5
33,65
DTplh Typ
15
50
Tphl derating vs 50pF
(ns)
DTplh (Vref Vcc/2)
Tplh derating vs 50pF
(ns)
Figure 4. 400 pF Buffer Response (Data from simulation)
30
Trise Min
20
Trise Typ
10
Trise Max
0
50 150 250 350 450
Cload (pF)
Table 8 : Pad 400pF - 3,15V up to 3,45V
Cload
Tfall min
Tfall typ
Tfall max
50
2,95
3,55
5
100
5,5
6,85
10,9
150
7,85
10,35
17,75
200
10,5
14,3
25
250
13,45
18,55
32,35
Tfall (ns)
Tfall (Vref 10%-90%Vcc)
35
30
25
20
15
10
5
0
Tfall Min
Tfall Typ
Tfall Max
50 150 250 350 450
Cload (pF)
18
TSC695FL
4204C–AERO–05/05
TSC695FL
Table 9 : Pad 400pF - OE* - 3,15V up to 3,45V
Cload
DTplh min
DTplh typ
DTplh max
50
0
0
0
100
2,75
3,7
5,35
150
5,1
6,6
10,35
200
6,95
9,7
15,2
250
8,9
12,55
20,05
DTphl (Vref Vcc/2)
Table 10 : Pad 400pF - OE* - 3,15V up to 3,45V
Cload
DTphl min
DTphl typ
DTphl max
50
0
0
0
100
2,95
3,45
4,7
150
5,1
6,1
8,75
200
6,95
8,6
12,7
250
8,7
11,1
16,45
25
20
DTplh Max
5
0
150 250 350 450
Cload (pF)
20
15
DTphl Min
10
DTphlTyp
DTphl Max
5
0
50
150 250 350 450
Cload (pF)
Trise (ns)
40
30
Trise Min
20
Trise Typ
10
Trise Max
0
50 150 250 350 450
Cload (pF)
Tfall (ns)
Tfall (Vref 10%-90%Vcc)
Table 12 : Pad 400pF - OE* - 3,15V up to 3,45V
Cload
Tfall min
Tfall typ
Tfall max
50
2,45
3,25
4,7
100
4,7
6,1
10,05
150
6,4
9,15
16,25
200
8,5
12,45
23,15
250
10,55
16,2
30,2
DTplh Min
10
Trise (Vref 10%-90%Vcc)
Table 11 : Pad 400pF - OE* - 3,15V up to 3,45V
Cload
Trise min
Trise typ
Trise max
50
3
3,9
5,7
100
5,8
7,7
12,2
150
8,1
11,6
19,15
200
10,7
15,5
26,25
250
13,15
19,5
33,65
DTplh Typ
15
50
Tphl derating vs 50pF
(ns)
DTplh (Vref Vcc/2)
Tplh derating vs 50pF
(ns)
Figure 5. OE*/400 pF Buffer Response (Data from simulation)
35
30
25
20
15
10
5
0
Tfall Min
Tfall Typ
Tfall Max
50 150 250 350 450
Cload (pF)
19
4204C–AERO–05/05
20
MDS*
MHOLD*
t17
FC1
CB [6:0]
t60
FP1
DPAR
INST
FD1
t14
FA1
n ws
D [31:0]
OE*
BUFFEN*
MEMWR*
DDIR
ROMCS*
MEMCS* [1]
MEMCS* [0]
ALE
RA [31:0]
SYSCLK
CLK2
1 (RAM fetch)
t14
t1
t8
t17
t4_1
t60
t17
t16
LC1
t9
LP1
t9
LD1
t9
LA1
n ws
2 (RAM load)
t10
t10
t10
t17
t16
t56
t4_1
t2
t60
FA2
t17
FC2
FP2
FD2
n ws
3 (RAM fetch)
t3
t11
t61
t7
SA1
t17
previous stored checkbyte
t61
previous stored parity
t11
t61
previous stored data
t56
t6
t5
t5
t4_1
t13
m ws
4 (RAM store)
SC1
SP1
SD1
t7
t3
t60
t12
t12
t12
t8
t6
t5
t5
t4_1
t17
FC3
FP3
FD3
FA3
n ws
5 (RAM fetch)
Timing Diagrams
Figure 6. RAM Fetch, RAM Load and RAM Store Sequence - n Waitstates for Read, m Waitstates for Write
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
FC1
CB [6:0]
t4_2
FP1
DPAR
LOCK
RLDSTO
INULL
MDS*
MHOLD*
INST
FD1
FA1
D [31:0]
OE*
BUFFEN*
MEMWR*
DDIR
MEMCS* [1]
MEMCS* [0]
ALE*
RA [31:0]
SYSCLK
1 (RAM fetch)
t8
t4_1
t60
t5
t5
t4_1
t10
t4_2
checkbyte from RAM
t9
parity from RAM
t9
t46
t16
held to update the full word
checkbyte from RAM
parity from RAM
t10
t61
t9
t9
t10
t9
t10
t61
t56
t10
t61
t8
t6
word from RAM
t56
t6
ALSA
2 (RAM atomic load store)
byte from RAM
t9
t10
t6
t2
t11
t11
t7
t16
checkbyte to RAM
t13
parity to RAM
word to RAM
t7
t4_1
t46
t60
t12
t12
t12
t8
t6
t5
t5
t4_1
FC5
FP5
FD5
FA5
3 (RAM fetch)
TSC695FL
Figure 7. RAM “Atomic-load-store” byte Sequence - 0 Waitstate
21
22
LOCK
INULL
MDS*
MHOLD*
INST
CB [6:0]
DPAR
D [31:0]
OE*
BUFFEN*
MEMWR*
DDIR
MEMCS* [1]
MEMCS* [0]
ALE*
RA [31:0]
SYSCLK
FA1
1 (RAM fetch)
FC1
FP1
FD1
t4_2
t60
t8
t5
t5
t4_1
LA1
t2
t9
t9
t9
LC1
LP1
LD1
t56
t4_1
2 (RAM double load)
LA2
LC2
t4_2
t10
LP2
t10
LD2
t10
t8
t5
t5
t4_1
FA2
3 (RAM fetch)
FC2
FP2
FD2
t56
t61
t61
t61
t6
t5
t5
t4_1
t11
t11
t7
t46
t13
SA1
t7
t46
t16
SC1
SP1
SD1
t4_1
4 (RAM double store)
t11
t11
t7
t13
SA2
t16
SC2
SP2
SD2
t7
t60
t12
t12
t12
t8
t6
t5
t5
t4_1
FA3
FC3
FP3
FD3
5 (RAM fetch)
Figure 8. RAM Load-double and RAM Store-double Sequence - 0 Waitstate
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
FP1
DPAR
INULL
INST
MDS*
MEXC*
MHOLD*
FC1
CB[6-0]
t9
FD1
FA1
D[31-0]
BUFFEN*
OE*
IOWR*
MEMWR*
DDIR
MEMCS*[1]
MEMCS*[0]
RA[31-0]
ALE*
SYSCLK
1 (RAM fetch)
t8
t60
t10
t5
t5
t4_1
LA1
t9
LC1
t10
LD1
t5
t5
t56
t4_1
t16
t60
t14
t17
FP2
FC2
FD2
t56
internal error correction
2 (RAM load correctable data)
LP1
1-bit error on 40-bit data
load
t8
t17
t16
made inside
data correction
FA2
t14
t2
3 (RAM fetch)
FP2
FC2
FD2
t4_1
FA3
4 (RAM fetch)
FP3
FC3
FD3
TSC695FL
Figure 9. RAM Load with Correctable Error - 0 Waitstate
23
24
FP1
DPAR
INULL
INST
MDS*
MEXC*
MHOLD*
FC1
CB[6-0]
t8
t9
LC1
LD1
t10
t5
t5
t56
t4_1
t60
t16
FP2
FC2
FD2
t14
internal error detection
2 (RAM load)
LP1
2-bit error on 40-bit data
LD1
load
t4_1
t60
t5
t5
FD1
FA1
D[31-0]
BUFFEN*
OE*
IOWR*
MEMWR*
DDIR
MEMCS*[1]
MEMCS*[0]
RA[31-0]
ALE*
SYSCLK
1 (RAM fetch)
t17
FA2
t20
FP2
FC2
FD2
t14
t8
t17
t16
exception
3 (RAM fetch)
t9
t20
FP2
FC2
FD2
t46
t60
t10
t56
t4_1
t2
FA3
4 (null cycle)
FP3
FC3
FD3
t46
t60
t4_1
TA1
5 (RAM fetch)
TP1
TC1
TA2
TP2
TC2
TD2
6 (RAM fetch)
TD1
trap
Figure 10. RAM Load with Uncorrectable Error - 0 Waitstate
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
INULL
INST
MDS*
MEXC*
MHOLD*
D[31-0]
OE*
BUFFEN*
IOWR*
MEMWR*
DDIR
MEMCS*[1]
MEMCS*[0]
RA[31-0]
ALE*
SYSCLK
t2
FA1
t9
1 (RAM fetch)
t60
t10
FD1
t5
t60
t16
t56
t17
no data
t5
t20
t17
t8
FA2
3 (RAM fetch)
internal error
unimplemented address
LA1
2 (RAM load)
t16
t20
fetch
t9
t46
t60
t10
FD2
t8
t4_1
FA3
4 (null cycle)
FD3
t46
t60
t56
t4_1
TA1
5 (RAM fetch)
TD1
trap
TA2
TD2
6 (RAM fetch)
TSC695FL
Figure 11. RAM Load with Unimplemented Area Access - 0 Waitstate
25
26
MDS*
MHOLD*
INST
D[31-0]
OE*
BUFFEN*
IOWR*
MEMWR*
DDIR
BUSRDY*
IOSEL*[0]
MEMCS*[0]
RA[31-0]
ALE*
SYSCLK
t4_1
FA1
t9
1 (RAM fetch)
FD1
t60
t10
t61
t56
t15
t6
t5
t4_1
start of cycle
t11
t7
t16
previous stored data
t27
t2
(n-1) ws
t24
SA1
t24
rdy waiting
2 (i/o store)
SD1
t25
t7
end of cycle
t16
t27
t57
t60
t12
t8
t6
t5
t4_1
FA2
FD2
3 (RAM fetch)
Figure 12. I/O Store Sequence with BUSRDY* and n Waitstates (Timing for 0 Waitstate = Timing for 1 Waitstates)
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
MDS*
MHOLD*
INST
D[31-0]
OE*
BUFFEN*
IOWR*
MEMWR*
DDIR
BUSRDY*
IOSEL*[0]
MEMCS*[0]
RA[31-0]
ALE*
SYSCLK
t56
FA1
t9
1 (RAM fetch)
FD1
t60
t10
t8
t15
t5
t4_1
start of cycle
t27
t24
t16
t60
data driven by external buffers (c.f BUFFEN*)
t14
t2
(n-1) ws
LA1
t24
rdy waiting
2 (i/o load)
t25
LD1
t17
t9
t57
t10
t17
t56
end of cycle
t27
t14
t5
t8
FA2
t16
t4_1
FD2
3 (RAM fetch)
TSC695FL
Figure 13. I/O Load Sequence with BUSRDY* and n Waitstates (Timing for 0 ws = Timing for 1 ws)
27
28
MDS*
MHOLD*
INST
D[31-0]
BUSRDY*
OE*
BUFFEN*
IOWR*
MEMWR*
DDIR
EXMCS*
MEMCS*[0]
RA[31-0]
ALE*
SYSCLK
FA1
1 (RAM fetch)
FD1
t60
t61
t56
t15
t6
t5
t5
t4_1
start of cycle
t16
t24
SA1
previous stored data
t2
t24
t25
in between
2 (xchgram store)
rdy waiting
t11
t7
t7
n ws
SD1
t7
t16
t7
end of cycle
t57
t60
t12
t8
t6
t5
t5
t4_1
FA2
FD2
3 (RAM fetch)
Figure 14. EXCHANGE RAM Store with BUSDRY* and n Waitstates
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
MDS*
MHOLD*
INST
D[31-0]
BUSRDY*
OE*
BUFFEN*
IOWR*
MEMWR*
DDIR
EXMCS*
MEMCS*[0]
RA[31-0]
ALE*
SYSCLK
FA1
1 (RAM fetch)
FD1
t60
t56
t15
t5
t5
t4_1
t14
t2
t16
t60
start of cycle
t24
t25
n ws
t24
data driven by external buffers (c.f BUFFEN*)
t24
LA1
rdy waiting
2 (xchgRAM load)
t17
t25
t9
t14
LD1
end of cycle
t8
t17
FA2
t16
t57
t10
t5
t5
t4_1
FD2
3 (RAM fetch)
TSC695FL
Figure 15. EXCHANGE RAM Load with BUSDRY* and n Waitstates
29
30
MDS*
MHOLD*
INST
D[7-0]
D[31-8]
OE*
BUFFEN*
MEMWR*
DDIR
MEMCS*[0]
ROMCS*
BA[0,1]
RA[31-0]
RSIZE[0,1]
ALE*
SYSCLK
FA1
1 (rom fetch)
t8
t17
t60
t15
t16
t5
t4_1
t4_1
start of
cycle
t14
t16
t5
0
t23
1
FA2
byte 1
(n-1) ws
t23
10
t2
t9
(1 = fetch,
FD2-0
t10
0 = load word)
t9
FD2-1
t10
2
byte 2
(n-1) ws
2 (8-bit rom fetch or load word)
data driven by external buffers (c.f BUFFEN*)
byte 0
(n-1) ws
t9
3
t10
FD2-2
t23
(address mod. 4)
byte 3
(n-1) ws
t10
t9
FD2-3
t4
0
t17
t56
t57
t23
end of
cycle
t8
t17
t60
t15
FA2
t16
t5
t4_1
t4_1
3 (rom fetch)
Figure 16. 8-bit BOOT PROM Fetch (or Load Word) - n Waitstates
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
MDS*
MHOLD*
INST
D[31-0]
OE*
BUFFEN*
IOWR*
MEMWR*
DDIR
ROMCS*
MEMCS*[0]
RSIZE[0,1]
BA[0,1]
RA[31-0]
ALE*
SYSCLK
10
t9
FA1
start of
cycle
t60
t56
t15
t61
t6
t5
t4_1
t4_1
FD1
1 (RAM fetch)
t16
t5
SA1
t11
t7
00
00
(n-1) ws
2 (8-bit rom write)
t16
byte D[7:0]
SD1
t7
addr.=mod. 4
t60
t12
t8
t57
t6
t5
t5
t4_1
t4_1
t2
10
t9
FA2
3 (RAM fetch)
t60
FD2
t56
t15
t61
t6
t5
t4_1
t23
t4_1
start of
cycle
t16
t5
SA2
t11
t7
00
01
t16
byte D[7:0]
SD2
t7
addr.=mod. 4 +1
(n-1) ws
4 (8-bit rom write)
t12
t57
t6
t5
t5
t4_1
00
10
t23
t4_1
FA3
5 (RAM fetch)
TSC695FL
Figure 17. 8-bit BOOT PROM 2x Store byte - n Waitstate
31
32
t4_1
FZ2
FS1
FZ1
RASI[3-0]
RSIZE[1-0]
t10
t9
FC1
DPAR
CB[7-0]
MHOLD*
t10
t9
FP1
D[31-0]
t5
t16
(pull-up on WE*)
t10
t9
FD1
DDIR
MEMWR*
OE*
DRDY*
MEMCS*[9-0]
WRT
RD
DMAAS
DMAGNT*
DMAREQ*
t4_1
FS2
FA1
RA[31-0]
t30
t4_1
FA2
ALE*
SYSCLK
t14
t31
t31
t31
t4_1
t4_1
t4_1
1 (RAM fetch)
2 (RAM fetch)
(null cycle)lead-in
t14
t33
t32
t32
t28
t33
t33
t8
t56
t17
t17
t14
t32
t32
t33
t33
t22
t6
t5
t7
t29
t21
10
(only word access)
t28
t33
t7
t17
t30
t4_1
FZ2
t4_1
FS2
t4_1
FA2
FZ3
FS3
FA3
4 (RAM fetch)
5 (RAM fetch)
cont'
t17
t31
t31
t8
t6
t5
t56
t5
early time for DMAREQ* desassertion
t31
D SAn
(held to the end of RAM access)
t22
t21
D SSn
t32
lead-out
t10
t10
t9
t9
t10
t9
t11
t12
D LD1
D LD1
FD2
D SDn
(from RAM)
(from TSC695FL)
(held to the end of RAM access)
t10
t10
t9
t9
t11
t12
t13
t13
D LP1
D LP1
FP2
DSPn
(from RAM)
Parity generated by TSC695FL if dpe =1,
(from TSC695FL)
else, same timing as D[31-0]
t10
t10
corrected parity if needed t13
t9
t9
t13
D SCn
D LC1
FC2
(from RAM)
t16
corrected data if needed
t5
t29
t21
10
(only word access)
t22
D LA1
(held to the end of RAM access)
t22
t21
D LS1
t32
t14
t2
3 (DMA session)
(0 cycle min) 1st DMA load (0 ws)
(0 cycle min) nth DMA store (0 ws)
Figure 18. DMA RAM load with or without Correctable Error and DMA RAM Store - 0 Waitstates
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
EXTINTACK
EXTINT[i]
INULL
D[31:0]
ALE*
RA[31:0]
SYSCLK
t52
FD(-1)
FA(-1)
t53
FD0
FA0
FD1
FA1
Sampled
FD2
FA2
Latched
FD3
FA3
Prioritized
FD4
FA4
Taken
t54
TD0
TTA0
t54
TD1
TTA1
TSD0
TSA0
TSA2
TSD1
TSA1
TSC695FL
Figure 19. Edge Triggered Interrupt Timing
33
34
10
RSIZE[1:0]
D[31:0]
CPUHALT*
SYSAV
MHOLD*
SYSHALT*
FDn-1
09H
RASI[3:0]
ALE*
FAn-1
RA[31:0]
SYSCLK
FDn
10
09H
FAn
t16
10
09H
t14
FAn+1
t48
t49
t48
t49
t14
t16
FDn+1
10
09H
FAn+1
FDn+2
10
09H
FAn+2
Figure 20. Halt Timing
TSC695FL
4204C–AERO–05/05
4204C–AERO–05/05
D[31:0]
CPUHALT*
SYSAV
MHOLD*
SYSERR*
IUERR*
FDn-1
10
RSIZE[1:0]
t50
09H
RASI[3:0]
ALE*
FAn-1
RA[31:0]
SYSCLK
t50
10
09H
FAn
FDn
t49
t16
t14
10
09H
FAn+1
t48
t49
TSC695FL
Figure 21. External Error with Halt Timing
35
36
RESET*
INULL
ALE*
RSIZE[1:0]
RASI[3:0]
RA[31:0]
SYSRESET*
SYSCLK
FA n
t46
t14
t48
FA n+1
t48
t14
t47
0H
4H
8H
Figure 22. Reset Timing
TSC695FL
4204C–AERO–05/05
TSC695FL
Figure 23. External Error signaling with BUSERR* and BUSRDY*
1
2
3
4
SYSCLK
t24
t25
t24
t25
BUSRDY*
t100
BUSERR*
t20
MEXC*
37
4204C–AERO–05/05
TSC695FL
Package
Drawings
256-lead MQFP-F
37
4204C–AERO–05/05
256-lead MQFP-F Pin
Assignments
38
Table 7. Pin Assignments
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
1
GPIINT
65
D[0]
129
RA[0]
193
DXFER
2
GPI[7]
66
RSIZE[1]
130
VCCO
194
MEXC
3
VCCO
67
RSIZE[0]
131
VSSO
195
VCCO
4
VSSO
68
RASI[3]
132
RAPAR
196
VSSO
5
GPI[6]
69
VCCO
133
RASPAR
197
RESET
6
GPI[5]
70
VSSO
134
DPAR
198
SYSRESET
7
GPI[4]
71
RASI[2]
135
VCCO
199
BA[1]
8
GPI[3]
72
RASI[1]
136
VSSO
200
BA[0]
9
VCCO
73
RASI[0]
137
SYSCLK
201
CB[6]
10
VSSO
74
RA[31]
138
TDO
202
CB[5]
11
GPI[2]
75
RA[30]
139
TRST
203
VCCO
12
GPI[1]
76
VCCO
140
TMS
204
VSSO
13
GPI[0]
77
VSSO
141
TDI
205
CB[4]
14
D[31]
78
RA[29]
142
TCK
206
CB[3]
15
D[30]
79
RA[28]
143
CLK2
207
CB[2]
16
VCCO
80
RA[27]
144
DRDY
208
CB[1]
17
VSSO
81
VCCO
145
DMAAS
209
VCCO
18
D[29]
82
VSSO
146
VCCO
210
VSSO
19
D[28]
83
RA[26]
147
VSSO
211
CB[0]
20
VCCI
84
RA[25]
148
DMAGNT
212
ALE
21
VSSI
85
RA[24]
149
EXMCS
213
VCCI
22
D[27]
86
VCCI
150
VCCI
214
VSSI
23
D[26]
87
VSSI
151
VSSI
215
PROM8
24
VCCO
88
VCCO
152
DMAREQ
216
ROMCS
25
VSSO
89
VSSO
153
BUSERR
217
MEMCS[9]
26
D[25]
90
RA[23]
154
BUSRDY
218
VCCO
27
D[24]
91
RA[22]
155
ROMWRT
219
VSSO
28
D[23]
92
RA[21]
156
NOPAR
220
MEMCS[8]
29
D[22]
93
VCCO
157
SYSHALT
221
MEMCS[7]
30
VCCO
94
VSSO
158
CPUHALT
222
MEMCS[6]
31
VSSO
95
RA[20]
159
VCCO
223
MEMCS[5]
32
D[21]
96
RA[19]
160
VSSO
224
MEMCS[4]
33
D[20]
97
RA[18]
161
SYSERR
225
MEMCS[3]
TSC695FL
4204C–AERO–05/05
TSC695FL
Table 7. Pin Assignments (Continued)
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
34
D[19]
98
VCCO
162
SYSAV
226
VCCO
35
D[18]
99
VSSO
163
EXTINT[4]
227
VSSO
36
VCCO
100
RA[17]
164
EXTINT[3]
228
MEMCS[2]
37
VSSO
101
RA[16]
165
EXTINT[2]
229
MEMCS[1]
38
D[17]
102
RA[15]
166
EXTINT[1]
230
MEMCS[0]
39
D[16]
103
VCCO
167
EXTINT[0]
231
VCCI
40
VCCI
104
VSSO
168
VCCI
232
VSSI
41
VSSI
105
RA[14]
169
VSSI
233
OE
42
D[15]
106
VCCI
170
EXTINTACK
234
VCCO
43
D[14]
107
VSSI
171
IUERR
235
VSSO
44
VCCO
108
RA[13]
172
VCCO
236
MEMWR
45
VSSO
109
RA[12]
173
VSSO
237
BUFFEN
46
D[13]
110
VCCO
174
CPAR
238
DDIR
47
D[12]
111
VSSO
175
TXA
239
VCCO
48
D[11]
112
RA[11]
176
RXA
240
VSSO
49
D[10]
113
RA[10]
177
RXB
241
DDIR
50
VCCO
114
RA[9]
178
TXB
242
MHOLD
51
VSSO
115
VCCO
179
IOWR
243
MDS
52
D[9]
116
VSSO
180
IOSEL[3]
244
WDCLK
53
D[8]
117
RA[8]
181
VCCO
245
IWDE
54
D[7]
118
RA[7]
182
VSSO
246
EWDINT
55
D[6]
119
RA[6]
183
IOSEL[2]
247
TMODE[1]
56
VCCO
120
VCCO
184
IOSEL[1]
248
TMODE[0]
57
VSSO
121
VSSO
185
IOSEL[0]
249
DEBUG
58
D[5]
122
RA[5]
186
WRT
250
INULL
59
D[4]
123
RA[4]
187
WE
251
DIA
60
D[3]
124
RA[3]
188
VCCO
252
VCCO
61
D[2]
125
VCCO
189
VSSO
253
VSSO
62
VCCO
126
VSSO
190
RD
254
FLUSH
63
VSSO
127
RA[2]
191
RLDSTO
255
INST
64
D[1]
128
RA[1]
192
LOCK
256
RTC
39
4204C–AERO–05/05
Ordering
Information
Table 8. Possible Order Entries
Part Number
Supply Voltage
Operating
Temperature (°C)
Max Speed
Packaging
Quality Flow
TSC695FL-15MA-E
3.3V
25
15
MQFP-F256
Engineering Samples
TSC695FL-15MA
3.3V
-55 to 125
15
MQFP-F256
Standard Mil.
5962-0324601QXC
3.3V
-55 to 125
15
MQFP-F256
QML Q
5962-0324601VXC
3.3V
-55 to 125
15
MQFP-F256
QML V
TSC695FL-15SASB
3.3V
-55 to 125
15
MQFP-F256
ESCC
TSC695FL-15MB-E
3.3V
25
15
Die
Engineering Samples
5962-0324601Q9A
3.3V
-55 to 125
15
Die
QML Q
5962-0324601V9A
3.3V
-55 to 125
15
Die
QML V
40
TSC695FL
4204C–AERO–05/05
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4204C–AERO–05/05
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