TVS Diode Arrays Low Capacitance ESD Protection - SRV05 Series (SPA

TVS Diode Arrays  Low Capacitance ESD Protection - SRV05 Series (SPA
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
SRV05 Series 6V 10A Diode Array
RoHS
Pb GREEN
Description
The SRV05 integrates low capacitance rail-to-rail diodes with
an additional zener diode to protect each I/O pin against
ESD and high surge events. This robust device can safely
absorb surge current per IEC61000-4-5 (tP=8/20µs) without
performance degradation and a minimum ±20kV ESD
per IEC61000-4-2. Their very low loading capacitance also
makes them ideal for protecting high speed signal pins.
Features
• ESD, IEC61000-4-2,
±20kV contact, ±30kV air
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Lightning, IEC61000-4-5,
10A (8/20μs)
I/O 4
GND
VCC
I/O 2
I/O 3
Applications
•
•
•
•
•
•
•
•
LCD/PDP TVs
Monitors
Notebooks
10/100/1000 Ethernet
Functional Block Diagram
Firewire
Set Top Boxes
Flat Panel Displays
Portable Medical
10/100 Ethernet Differential Protection
6
5
Application Examples
4
10/100
Ethernet
PHY
Unused
TX +
USB Dual Port Protection
1
RT
TX -
USB
RX +
Controller
RT
2
5
3
4
VCC
R
VCC
CT
Additional Information
GND
75
VBUS
T
D+
D-
CT
Resources
Samples
TX -
RX +
USB
Port
RJ45
Unused
TX +
Datasheet
Unused
GND
10/100/1000 Ethernet Protection
10/100/1000
Ethernet
PHY
USB
Port
RX RX +
75 VBUS75
RT
GND
3
D+
D-
Unused
75
2
VBUS
SRV05-4HTG
CT
RX -
1
TX -
VBUS
6
SRV05-4HTG
VBUS
CT
RJ45
Unused
TX +
To Twisted-Pair Network
I/O 1
Unused
TX +
TX -
1
6
2
5
3
4
RX +
RX -
SRV05-4HTG
Unused
To Twisted-Pair Network
Pinout
• L
ow capacitance of 2pF
(TYP) per I/O
• Low leakage current of
0.5μA (MAX) at 5V
• S
mall SOT23-6 (JEDEC
MO-178) packaging
Unused
75
75
75
75
RX VCC
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
VCC
GND
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Parameter
Rating
Units
–55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Units
IPP
Peak Current (tp=8/20μs)
10
A
PPK
Peak Pulse Power (tp=8/20μs)
150
W
TOP
Operating Temperature
–40 to 125
°C
TSTOR
Storage Temperature
–55 to 150
°C
1
Storage Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Non-repetitive pulse per waveform on page 3
1
Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR ≤ 1µA
VR
IR = 1mA
ILEAK
VR=5V
Reverse Voltage Drop
Reverse Leakage Current
Min
Clamp Voltage
VC
RDYN
ESD Withstand Voltage1
VESD
CI/O-GND
Diode Capacitance1
CI/O-I/O
V
V
0.5
µA
IPP=1A, tp=8/20µs, I/O to GND
8.8
10.0
V
IPP=5A, tp=8/20µs, I/O to GND
11.5
13.0
V
IPP=8A, tp=8/20µs, I/O to GND
13.2
15.0
V
(VC2 - VC1) / (IPP2 - IPP1)
0.7
2
Diode Capacitance1
Units
6.0
0.1
2
Dynamic Resistance
Max
8.0
2
1
Typ
Ω
IEC61000-4-2 (Contact)
±20
kV
IEC61000-4-2 (Air)
±30
kV
Reverse Bias=0V
2.4
3.0
pF
Reverse Bias=1.65V
2.0
pF
Reverse Bias=0V
1.2
pF
Notes: 1 Parameter is guaranteed by design and/or device characterization.
2
Repetitive pulse per waveform on page 3.
Product Characteristics
Clamping Voltage vs. IPP
20.0
18.0
Clamp Voltage (VC )
16.0
14.0
12.0
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
10.0
8.0
6.0
4.0
Notes :
2.0
1. All dimensions are in millimeters
0.0
1
2
3
4
5
6
7
Peak Pulse Current-IPP (A)
8
9
10
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
Capacitance vs. Reverse Bias
Pulse Waveform
3.0
110%
100%
2.5
90%
2.0
80%
VCC =3.3V
Percent of IPP
Capacitance (pF)
VCC=Float
VCC =5V
1.5
1.0
70%
60%
50%
40%
30%
20%
0.5
10%
0%
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
5.0
10.0
DC Bias (V)
15.0
20.0
25.0
30.0
Time (μs)
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tP
TP
Temperature
Reflow Condition
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
L*4
SRV05 – 4 H T G
L*4
G= Green
Product Series
L = SRV05
S
Package
H: SOT23-6
Number of Channels
Assembly Site
(Varies)
T= Tape & Reel
Number of
Channels
Time
Part Marking System
Part Numbering System
Series
Critical Zone
TL to TP
Ramp-up
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SRV05-4HTG
SOT23-6
L*4
3000
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
Package Dimensions — SOT23-6
Package
SOT23-6
Pins
6
JEDEC
MO-178
Millimeters
Min
Max
Max
0.900
1.450
0.035
0.057
-
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 ref
e1
1.9 Ref
0.0748 Ref
a
0.100
0.600
0.004
10º
0º
6
0º
-
0.023
6
R
O
6
10º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
1.5mm
DIA. HOLE
ACCESS HOLE
14.4mm
4.0mm
1.75mm
2.0mm
CL
8mm
4.0mm
13mm
GENERAL INFORMATION
SOT-23 (8mm POCKET PITCH)
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
60mm
8.4mm
USER DIRECTION OF FEED
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
4,5
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
P
180mm
Notes
A
N
M
Min
A1
L
Recommended Solder Pad Layout
Inches
PIN 1
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Littelfuse:
SRV05-4HTG
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