Analog Devices ROHS Compliance Information

Analog Devices ROHS Compliance Information
ADI General RoHS Compliance Information
1. RoHS compliant definition
ADI defines RoHS compliant to mean Pb, Hg, Cd, Cr(+6), PBB, and PBDE are not intentionally added during
the manufacturing process and have upper concentration limits as defined below. In addition, RoHS compliant
indicates the packages can withstand a peak reflow temperature of 255 +5/-0 deg C.
RoHS Banned Substance
CAS
Number
Maximum Concentration Value
Hg (Mercury)
7439-92-1
1000 ppm
Pb (Lead)
7439-97-6
1000 ppm
Cd (Cadmium)
7440-43-9
100 ppm
Cr(+6) (Hexavalent Chromium)
18540-29-9
1000 ppm
PBB (Polybrominated Biphenyl)
-
1000 ppm
PBDE (Polybrominated Diethyl Ether)
-
1000 ppm
2. RoHS compliant package materials and terminal finishes
ADI offers RoHS compliant solutions for most of its products. Material sets have been qualified to withstand a
+255°C (+5/-0°C) peak reflow temperature. The primary terminal finishes for plastic encapsulated and hermetic
products are matte Sn plating with a post plating bake (1 hour at 150°C within 24 hours of plating, implemented
between EIA date code 0518-0522), SnAgCu solder spheres, and Au plating. NiPdAu is also available for
select products.
3. Part naming convention for RoHS compliance
The standard naming convention for RoHS compliant products requires the letter "Z" as a suffix to the existing
part number. The Z suffix generally appears at the end of the part name (i.e. after the character that denotes
the package style). For example:
Standard Part Name
ADM1024ARU-REEL
AD648KR
AD7528KP-REEL7
ADP3522ACP-1.8-RL7
RoHS Compliant Part Name
ADM1024ARUZ-REEL
AD648KRZ
AD7528KPZ-REEL7
ADP3522ACPZ-1.8RL7
Certain products introduced to the market as RoHS compliant only (i.e. there is no standard SnPb or SnPbAg
finish on these parts) do not carry a "Z" suffix, but the data sheet, web product page, part marking, and labeling
clearly indicate these products as RoHS compliant.
All models intended to be offered as RoHS compliant are visible to customers through the WWW ordering
guide. Customers should contact Local Sales or Distributors with any new product transition requests.
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ADI General RoHS Compliance Information
4. Part marking convention for RoHS compliance
RoHS compliant devices have a "#" symbol marked on the top or bottom of the package. Smaller packages,
such as SOT23, SC70 and TSOT, are too small to accommodate an additional character, and as a result, there
is no "#" marking on the package. For these smaller packages, a unique brand code is used to denote RoHS
compliance.
5. Labeling for RoHS compliance
Shipping containers for products compliant with RoHS regulations are labeled with “RoHS Compliant” and
China environment-friendly logos. The labels also contain the Pb free external finish code (i.e., e3, e1, etc) as
specified in JEDEC JESD97 standard and MSL ratings.
Shipping
Label
RoHS
China Environment-Friendly or EFUP *
LOGOS
RoHS
Compliant
RoHS
Exempt
Example
* EFUP = environment-friendly-use-period, 50 years for components and 25 years for components containing a
PCB
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ADI General RoHS Compliance Information
6. RoHS compliance transition history
ADI transitioned products to RoHS compliance under PCN #02_0011 and #04_0065.
PCN #02_0011 (closed 2004): LFCSP, LQFP, MQFP, miniSO, PDIP, QSOP, SOIC, SOT-23, SSOP, TQFP,
TSSOP
PCN #04_0065 (closed 2007): CSP_BGA, Header, LQFP 24x24, LQFP integrated heat sink, MQFP 32x32,
MQFP integrated heat sink, PBGA, PLCC, PSOP, QSOP exposed pad, SBDIP, SBGA, SC70, SOIC exposed
pad, SOT-143, SOT-223, TO-92, TQFP exposed pad, TSSOP exposed pad, TSOT, WLCSP
7. Support for materials with Pb
ADI encourages customers to transition to RoHS compliant products but will continue to support SnPb plating
and SnPbAg solder spheres where manufacturing capability exists at our supplier base. ADI has no plan to
make cerdip or cerpack packages RoHS compliant.
ADI continues to use Pb in die attach adhesives, glass, and flip chip interconnection where regulations allow an
exemption until reliable alternatives are available.
8. Reflow profile
ADI advises reflow profiles should conform to JEDEC J-STD-020 standard which can be downloaded from the
JEDEC website under “Free Standards”.
http://www.jedec.org/
9. Backward and forward compatibility
Backward compatibility for matte Sn, NiPdAu and Au: ADI products with matte Sn, NiPdAu, and Au finishes are
backward compatible with optimized SnPb reflow processes.
Backward compatibility for SnAgCu: ADI products with SnAgCu solder finishes are not backward compatible
with SnPb reflow processes.
Forward compatibility for SnPb: ADI products with SnPb finish are not forward compatible with +255°C (+5/0°C) reflow processes. Concerns include weak solder joints caused by Bi in the solder paste reacting with Pb
delamination resulting from package material sets that are not +255°C (+5/-0°C) compatible, and solder ball
voiding caused by Pb free solder paste outgassing into the solder ball.
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ADI General RoHS Compliance Information
10. Matte Sn whisker data
Matte Sn is a widely available industry standard that has been in production for many years with excellent
quality and reliability. All matte Sn plated devices undergo a post plating bake for 1 hour at 150 degrees C
within 24 hours of plating to mitigate Sn whisker growth. Sn whisker testing is done based on the test
methodology outlined in JEDEC JESD22A121 standard (Test Method for Measuring Whisker Growth on Tin
and Tin Alloy Surface Finishes) with read-point intervals of 1000 hours or 500 cycles. Test results are in the
table below.
Criteria 
Package
LFCSP
LQFP
MQFP
MINISO
PDIP
PLCC
PSOP
QSOP
SC70/
SOT143/
SOT23-3Ld
SOIC_N
SOIC_W
SOT223
SOT23
Maximum 20 um
(Class 1a)
Preconditioning
Temperature Humidity
Storage
(30/60%RH, 4000 Hrs)
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
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Maximum 40 um
(Class 2)
Maximum 45 um
(Class 2)
High Temperature
Humidity Storage
(55'C/85%RH, 4000 Hrs)
Temperature Cycle
(-55/+85'C,1500 Cyc)
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
ADI General RoHS Compliance Information
Maximum 20 um
(Class 1a)
Criteria 
Preconditioning
Temperature Humidity
Storage
(30/60%RH, 4000 Hrs)
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Package
SSOP
TQFP
TSSOP
Maximum 40 um
(Class 2)
Maximum 45 um
(Class 2)
High Temperature
Humidity Storage
(55'C/85%RH, 4000 Hrs)
Temperature Cycle
(-55/+85'C,1500 Cyc)
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
11. Pentabromodiphenylether and octabromodiphenylether
ADI products do not contain pentabromodiphenylether and octabromodiphenylether.
12. Bromine and chlorine free material sets
ADI is going beyond RoHS compliance to improve product recyclability by converting to bromine (Br) free and
chlorine (Cl) free material sets. Bromine free and chlorine free is also referred to in the industry as halogen free
or low halogen. ADI defines halogen free within a homogeneous material to mean the maximum concentration
of Br is 900 ppm, the maximum concentration of Cl is 900 ppm, and the maximum concentration of total Br + Cl
is 1500 ppm.
All new products are released with halogen free material sets.
Customers are notified by PCN for products undergoing conversion to halogen free material sets. ADI is close
to completing the transition for lead-framed packages. Nearly all laminate based products are assembled with
halogen free die attach adhesives and mold compounds, but older laminate designs might contain bromine and
chlorine.
13. RoHS Compliance for Evaluation Boards
Analog Devices evaluation boards are specifically designed for the purpose of research and development and
are made available solely on a business-to-business basis and are therefore excluded from the scope of the
RoHS 2 Directive.
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