-_----_-_,_ ,. . I.,..
-_----_-_,_ ,. .
I.,..
-
_’ .
VerowirP is a new kind of wiring system which enables prototype circuits
to be rapidly and nilably constructed. it allows high packing density to be
echleved, trrespective of whether integrated circuits or dircreta components
or a mixture of both are employed. This kit cantalns sufficient materials
ard basic toots to enable you to assass the System’s general application. in
eddidon, a miniature wIderIng iron with tip temperature of 38O’C to 400°C
(Wabber No. 8 bit) will be required, A suitable Iron, Order Code,
2%0176E is available as an optional extra. See page 11.
While the Verowire System can be used with a wide range of different
typas of board, we have introduced a range of Thr&Piane High Density
D.I.P. Boer&, which will enable extremely high packing densities to ba
achieved. Brief details of these boards are shown on the feting page and
full cataioeue information is availabte on request.
SECTiON 1 - VERO l-HREE PLANE HIGH DENSITY BOARDS
These boards contain a doubl&ded copper pattern which has be-en
specially designed for this system but they can also be used as general
purpose breadboards employing integrated circuits or discrete
components.
The pattern consists of a ground plane (marked GNDI which is directiy
under I.C. devices for screening and/or grounding purposes. The
reverse lor wiring) side of the board contains a power rail (marked Vcc)
and as%condary (unmarked) power rail. This second power rail could
be used as secondary voitqe line or for reference ground purposes.
EurcIGard -O&r Code
Inmrnatlond Card -Older Coda 06-1631F
10-666 IS
‘-l143omm--I
k-1~--4
it will be noticed that the board layout issuitable for use with discrete
components and for D.I.L. devices with 29 mm. x 7,62 mm. or lfj,24 mm.
pitch leads.
165,
In order to achieve maximum packing density whilst maintaining ease and
tidiness of win’ng, you should give consideration to the placement of
components before fixing them in place. With current logic practice, it is
wisa to place logic integrated circuits such that speed critical leads are kept
as short as posslbfe and to group component elements tilch form functlonal
blocks. It It also wise to produce a wiring schedule such that all common
connections can be delenined before you commence wiring when this is
not obvious from the wiring diagram.
43 f 43 Gold Plated Contacts
29 mm. pitch
Reference Key in Position 37
Suitable for use with
64 Way Connector to DIN41612
fNDEX
Description of Hi& Density D.I.P. Boards
Component Piscing and Fixing (using the High Density Board1
The wire
How lo use the Verowlre@ Pen
Tips and Recommendations
List of Contents of Introductory Kit
Soldering Iron
Compatible Proctucls
Section 1
Section 2
Section 3
Section 4
Section 5
Section 6
S0ctIon 7
Section 8
MAX IMUM NU.
OF D.19.s
14 WAYS 16 WAYS
ORDER CODE
10-058; B
I
*a .nrrr
I
I
30
30
mr.
JO
I”
?R
COMPATIBLE
CONNECTOR
1
Indirect (64 ways)
Order Code: 39-3 704F
<Modular 43 + 43 way
Order Code: ?4-10008
Direct 22 + 22 way
Order Code
Verowim* is a registered trade mark of Vero Electronics Limited
*Dimensions as 06-l 631 f, but with alternative plug-in tongue.
3
3
15-0204L
.
SECTION 2 - COMPONENT PLACEMENT AND FIXING
2.2. Dual-in-line integrated circuiti
AIt components should be mounted on the ground (GNDDI side i e. the
side v&h lea copper. With practice and planning, It is possible’t~
achieve hi& component density becauorr the Verowire connection
method is In effect a rapaireble multilayer wiring system. Wiring is
“point to point”, 8f In wire.wrapping, via the speclaily designed comb,
tiich facilitates neat retention of the interconnection wire loom.
The bwrd will accept 7.62 and 15,24 pitch devices in the following
positions:-
21. Connections to power pbmes
Ground plane connections - usa Pin 18-0223K
COPPER
PLASTIC COMB
PLAS?X &MB
2.3. Lead deformation tool
-184223K
Voltage plsne connfxtions - us8 Pin 18-3994L
”
After the IC.t have been positioned in the board the assembly should
be turned over on to a clean, flat surface. The I.C. leads are then
bunt to 120’ inclusive using the lead deformation tool, Order Code
79-17338, as Illustraled below. It will be noted thst tfts lead
deformation tool is designed to accommodate 1.C.s with a pitch
betvvwn leedr 7,62 mm. or 15,24 mm. Because of the novel nature of
the dulgn, deformation till always be correct, since the tool has an
internal built-in stop.
SOI
GENTlE
l8--3894
These pins should ba fitted before any other components.
4
2.4. The wiring comb
SECTION 3 - THE WIRE
Having attached the 1.C.s and other discrete components, a number of
plastic wiring combs, Order Code 79-1735C. should be fitted between
the deformed leads of the integrated circuits. The combs would
normally be fitted adjacent to each other, in between the deformed
legs of the I.C.s, down the complete length or width of the board? The
plastic comb has staggered projections which are a push fit into 1 mm.
holes.
Wire specification
Diameter of Wire
Insulation
Insulation thickness
Proof Voltage
Current rating
Resistance 8 20°C
Length of wire/spool
Colours
l
- 0,15 mm
- Self-fluxing Polyurethane*
- 0,005 mm
- eoov D.C.
- 0.030 Amps
- 0.8575 Wm
- 40 m
- Pink, Green,
Gold Violet
Warning: Polyurethane produces toxic fumes when in contact with
molten solder.
SECflON 4 - USING THE VEROWIRE@ PEN
2.5. Dircfeta components
Components such 65 resistors and capacitors can be wtachd to the
board by soldering them to terminal pins {see Section 2.1 .I or
alternatively the wire ends can be inserted through appropriate holaa
in the board and deformed to approximate the angle on the I .C.s.
These ends are thaw cut to suitable lengths so that they can be wired
utiiislng the wiring pen.
The Verowlre Pen, Order Code 79-17326, comes to you complete
with 8 spool of wire fitted. Note how the wire is threaded (see Section
5.3).
step 1
With approximataty 3 mm, of wire protruding from the tip, insert wire
in hole containing I.C. lead where first connection is to be made.
1&0223K
COPPER
WIRE
SOLDER
BOARD
.
2.6. Attaching moulded D.I.P. sockets, etc.
D.I.P. Sockets with solder terminals can be attached in a similar manner
to that described in Section 2.3. Although it is not always possible to
form these leads m for t.C.s, it is still possible to apply Verowire
techniques by omitting the wiring combs so that the wires lay
horizontally across the board. To hold the sockets in position, two
pins should be soldered to copper pads. The use of moulded sockets
il rtcommendad where fast replacement of I.C.s, transistors, etc., Is
required.
step 2
Wind at least two turns of wire around I.C. lead to make your first
joint. Keep the Verowire pen tip asclose to the I.C. lead as possible to
ensure a ti&t wrap.
SW3
Wind two turns around nearest peg on the wiring comb.
SECTION 5 - TIPS AND RECOMMENDATIONS
6.1. Replacament of componenis
This can be done without disturbing wiring, using the following
procedures: -
step
1
Ensure all componenl leads are soldered to the copper pads on the
wiring side of the boerd.
step 4
From now onwards you may praesd to route the wire to the
appropriate plns of the components to be connected. Use the Wiring
Comb as a rne.anP of holding and controlling the wire so ensuring a
neat layout. Wherever possible, tile wire Is muted tirou& a gap in the
Cumb adjacent to the component to be connected. Generally speaking,
multiple turns are on!y required at the start and the end of a number
of common interconnection points. Howear, where connections are
being made to terminal pins or the wire ends of discrete components, at
Using a peir of side cutters, cut the component leads as near to the
componevrt body BS posslbte.
least two wraps are recommended.
Step 3
Bemove the component b&y and place a new device in the correct
position so that the new leads sit over the origlnal leads.
Your finished board will then hava its wiring loams laid neatly either
side of the wiring comb. The fact that the wire is also wrapped around
the pegs on the wiring comb obviates the need for loom tying.
To complets the joints, a miniature soldering iron with a tip
temperature of 330°C to 4OO’C is required together with resin cored
solder. Every point around which the wire has been wrapped should
now be soldered. It will b found that reasonable application of the
soldering iron and an approprieta quantity of su!der will ensure that the
polyurethane insulation on the wire melts and an effective solder joint
is achieved between the wire, the component terminal and the pad on
the board.
If the height of the replaced component, as illustrated above, is an
embarrassment, the original cut leads may be bent down to the surface
of the board, enabling tie new component, with leads deformed
throu& 90*, to be soldered in posit ion.
step4
Solder in place.
!I
502. Changing wiring
SECTION 6 - CONTENTS OF KIT
Cut the relevant wireIs near to the termination(s) and remove, then
re-wine as In Section 3.
5.3. Replacing the wire spool in pen
*
step 1
Remove empty spool in the foIlowIng manner:Gendy spread spool support fianm Withdraw spool fmm retaining
pips. Replace with a new reel In the same manner; making sure the
wire lays BE follows:WIRE
sw2
Thread wire through hole at point ‘A’ to exit ‘B’.
Wiring Pen
Circuit Board
tnterflational
Euro
U.S.A.
Spools of Wire {Pink)
tone fitted to pen)
I:=:’
(Violet)
Lead Form Tool
Inspection Magnifier
Plastic Wiring Combs
Half Pin
Shouldered
Terminal Pin
Pin tnsertlon Tool
Cutters
79-17326
1
1
1
1
06-1631F
lO-05818
fx-012&f
79-t 737D
t
:
1
1
?
79-1235E
79-173aE
79-1790 L l7%1733El
79-1734H
79--173%
18--Q223K
I
1
20
100
loo
1
I
I
Pack
of4
:
100
Mm
18-3?BaL
22-0230H
74-047x
--4
Recommended soldering temperature: 3Bo’C to 4OO’C
step3
Pass wire thraugh slider/clamp and through the nozzle. If difficulty
is experienced the clamp may be removed to assist threading by
depressing tongue and sliding towards spool.
SECTION 7 - SOLDERING IROY ORDER CODE 22-0176E
Vero now offer a-soldering iron suitable for use with the
Verowire System. A notable feature is its very low current leakage.
Wattage
VOltn~
Leakam current
Capacitance
Bit size
Step 4
Then pult the wire taut. The pen is now ready for use.
- 15 watts
- 230/24OV SOHrs
- Less than 1clA
(measured under working conditions)
- 3qPF (nominal)
- 2,3 mm
The iron is fitted with 1,8 metres of twin-core mains cable.
SECTiON 8 - COMPATIBLE VERO PRODlJm
Vero Electronics manufacture a complele range of Electronic Packaging
Systems. For catalogue telephone Chandler’s Ford (042151 2956.
11
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