CAN4311851042453K
ANTENNA PRODUCTS
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
Feb, 2008 Ver.5
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 1
sheet 190-1
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
5010 Ceramic Chip Antenna for
Bluetooth/Wimax Application
Quick Reference Data
Centre Frequency
2.45 GHz
Bandwidth
2.38 ~ 2.59 GHz
VSWR
2.0 (Max.)
Polarization
Linear
Azimuth Beamwidth
Omni-directional
Peak Gain
2.45 dBi
Impedance
50Ω
Operating Temperature
-25~85 oC
Termination
Ni / Sn (Environmentally-Friendly Leadless)
Resistance to soldering heats
260℃ , 10sec.
Maximum Power
1W
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 2
sheet 190-2
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
1. Mechanical Data (5.1 x 1x 1 mm³)
Top-Side View
1.0 mm
1.0 mm
5.1 mm
Bottom-Side View
CAN4311851002453K
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 3
sheet 190-3
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
2. Dimension of Footprint
6.1 mm
1.4 mm
1.3 mm
5.1+- 0.1mm
1.05+- 0.1 mm
Bottom Side
R&D
Justin Liu
Oscar Lu
0.80+- 0.15mm
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 4
sheet 190-4
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
3. Evaluation Board Dimension and Outlook
π-shape match
circuit (0 ohm)
50 ohm Line
Ground plane in
backside
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 5
sheet 190-5
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
4. Measured S-parameter
S11
VSWR
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 6
sheet 190-6
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
5.The Definition of X-Y-Z Plane
Z
X
Y
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 7
sheet 190-7
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
6. The Environment of Antenna Radiation Pattern
Anechoic Chamber Dimension=10(m) × 6(m) × 6(m)
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 8
sheet 190-8
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
7. Radiation Pattern
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Yageo Taiwan / High Frequency
Page 9
sheet 190-9
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
8. Reliability Test
IEC
384-10/
CECC 32
100
CLAUSE
4.4
IEC
60068-2
TEST
METHOD
TEST
Mounting
4.5
4.6.1
Visual inspection
and dimension
check
Antenna
4.8
Adhesion
4.9
Bond strength of
plating on end face
4.10
R&D
Justin Liu
Oscar Lu
20(Tb)
PROCEDURE
REQUIREMENTS
The antenna can be
mounted on printed-circuit
boards or ceramic
substrates by applying
wave soldering, reflow
soldering (including vapour
phase soldering) or
conductive adhesive
Any applicable method
using × 10 magnification
Central Frequency
o
at 20 C
A force of 3 N applied for
10 s to the line joining the
terminations and in a
plane parallel to the
substrate
Mounted in accordance
with CECC 32 100,
paragraph 4.4
No visible damage
In accordance with
specification (chip off
4mm)
Standard test board in
page 4
No visible damage
No visible damage
Conditions: bending 0.5
mm at a rate of 1mm/s,
radius jig. 340 mm, 2mm
warp on FR4 board of 90
mm length
No visible damage
Resistance to
soldering heat
260 ± 5 °C for 10 ± 0.5 s in
a static solder bath
Resistance to
leaching
260 ± 5 °C for 30 ± 1 s in a
static solder bath
Satisfy the original
electrical specification
after soldering.
Using visual
enlargement of × 10,
dissolution of the
termination shall not
exceed 10%
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Page 10
Yageo Taiwan / High Frequency
sheet 19010
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
IEC
384-10/
CECC 32
100
CLAUSE
4.11
IEC
60068-2
TEST
METHOD
TEST
20(Ta)
Solderability
4.12
4(Na)
Rapid change of
temperature
4.14
3(Ca)
Damp heat
4.15
Endurance
PROCEDURE
REQUIREMENTS
Zero hour test, and test
after storage (20 to 24
months) in original
atmosphere; un-mounted
chips completely
immersed for 2 ± 0.5 s in
235 ± 5°C.
-25 °C (30 minutes) to +85
°C (30 minutes); 100
cycles
500 ± 12 hours at 60 °C;
90 to 95 % RH
The termination must
be well tinned, at least
75% is well tinned at
termination
500 ± 12 hours at 85 °C;
No visible damage
Central Freq. Change
± 6%
No visible damage
2 hours recovery
Central Freq. Change
± 6%
No visible damage
2 hours recovery
Central Freq. Change
± 6%
■ Notice (shipping and storage during transportation)
In order to ensure some quality, it is suggested to follow the condition during shipping :
•
Temperature : -40~70℃
•
Humidity : 45~75%
■ Notice (storage condition)
In order to ensure the solderability of the termination, it is suggested to follow the
condition for storage :
•
Temperature : 15~30℃
•
Humidity : 45~75%
•
Prevent corrosive gas (SO2, NOX, NH3, Cl2, ..etc)
•
It is better to use products within 6 months. Solderability should be confirmed
again if exceed 6 months.
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Page 11
Yageo Taiwan / High Frequency
sheet 19011
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
9. Soldering Condition (Suggestion)
* Customers should alter the profile according to realistic tin paste in use.
Typical value (solid line)
Process limits (dotted line)
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Page 12
Yageo Taiwan / High Frequency
sheet 19012
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
10. Ordering Information
The antennas may be ordered by using the Yageo ordering code. These code numbers can be
determined by the following rules:
CAN43 11 8 51 04 245 3K
Family Code
CAN 43 = Yageo Part No. for Antenna
Packing Type Code
11 = 180 mm/ 7" reel , blister taping
Materials Code
8 = High Frequency Material (White)
Size Code
51 = 5.0 * 1.0 * 1.0 mm
Antenna type
00 = Normal type
01 = type 01
02 = type 02
03 = type 03
04 = type 04
05 = type 05
06 = type 06
07 = type 07
08 = type 08
Working Frequency
245 = 2.45 GHz
Packing Type Code
3K = 3000 pcs for taping per reel
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Page 13
Yageo Taiwan / High Frequency
sheet 19013
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
11. Taping Blister Tape
R&D
Justin Liu
Oscar Lu
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Page 14
Yageo Taiwan / High Frequency
sheet 19014
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
12. Taping Reel - 7”(180mm) Specifications
Product size Units per Tape Width
code
Reel
(mm)
Antenna
R&D
Justin Liu
Oscar Lu
1000
16
C
(mm)
D
(mm)
W1
(mm)
W2
(mm)
180.0±1.0
62±0.5
16.0±1.0
20.5±1.0
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Page 15
Yageo Taiwan / High Frequency
sheet 19015
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
11. Tape Revision Control:
Revision
Date
V1
Jan, 2008
New Issue
V2
May, 2008
Increase type 1~4, 8.
V3
June, 2008
Increase normal type
V4
Sept, 2008
To modify the spec of end-termination
V5
Feb,2009
To modify the suggestion of footprint
R&D
Justin Liu
Oscar Lu
Content
Remark
Print date 09/02/24
5010 Ceramic Chip Antenna
for Bluetooth/Wimax Application
CAN4311 851 XX 245 3K
Tommy Chen
Page 16
Yageo Taiwan / High Frequency
sheet 19016
June, 2008
v3
Sept, 2008
v4
Feb, 2009
v5
A4
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising