datasheet for BXCE2424452- 7

datasheet for BXCE2424452- 7
BRIDGELUX BLUE POWER DIE
BXCE 24 x 24 mil
PRODUCT DATA SHEET DS-C13
The Bridgelux family of blue power die enables high performance and cost effective solutions to
serve solid state lighting market. This next generation chip technology delivers improved
efficiency and performance to enable increased light output for a variety of lighting, signaling and
display applications.
Features
Applications
•
High lumen output and efficiency
•
General Illumination
•
Long operating life
•
Street Lights
•
Increased current spreading traces for
highly efficient and uniform illumination
•
Portable Lighting
•
Architectural Lighting
•
100% Tested and sorted by wavelength,
power and forward voltage
•
Directional Lighting
•
Lambertian emission pattern
•
Wide Area Lighting
•
Compatible with Solder paste, solder
preform or silver epoxy die attach
•
Display Backlighting
•
Digital Camera Flash
•
Delivered on medium tack blue tape
(20cm±10mm ×20 cm±10mm)
•
Automotive Lighting
•
White LEDs
LED Chip Diagram
1 0 1 P ort ol a A ven u e, L i ve r mo re , CA 9 45 51 • Te l: (9 25 ) 58 3- 840 0 • Fa x: ( 92 5) 5 83 -8 40 1 •
w w w. b ri d ge lu x. c om
BRIDGELUX BLUE POWER DIE
BXCE 24 X 24 MIL
Part Numbering and Bin Definitions
Bridgelux LED chips are sorted into the brightness and dominant wavelength bins shown below at If =
120 mA. Each blue tape contains die from only one brightness bin and one wavelength bin.
Each blue tape contains chips with 0.2 V forward voltage bins: 3.0 - 3.2 V, 3.2 - 3.4 V and 3.4 - 3.6 V.
The typical forward voltage is 3.30 V and the maximum forward voltage (Vf max) = 3.6 V.
Dominant
Power Bin 7
Power Bin 8
Wavelength
(95 – 110 mW)
(110 – 130 mW)
445 to 447.5nm
BXCE2424445- 7-z
BXCE2424445- 8-z
447.5 to 450nm
BXCE2424447- 7-z
BXCE2424447- 8-z
450 to 452.5nm
BXCE2424450- 7-z
BXCE2424450- 8-z
452.5 to 455nm
BXCE2424452- 7-z
BXCE2424452- 8-z
455 to 457.5nm
BXCE2424455- 7-z
BXCE2424455- 8-z
457.5 to 460nm
BXCE2424457- 7-z
BXCE2424457- 8-z
460 to 462.5nm
BXCE2424460- 7-z
BXCE2424460- 8-z
462.5 to 465nm
BXCE2424462- 7-z
BXCE2424462- 8-z
Product Nomenclature
BXCE 2424 XXX – YY– Z
Where:
BXCE: Designates product family
2424:
Designates die size (24 mil x 24 mil)
XXX:
Designates dominant wavelength bin
YY:
Designates radiometric power bin
Z:
Designates forward voltage bin
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BRIDGELUX BLUE POWER DIE
BXCE 24 X 24 MIL
Mechanical Dimensions
Chip Size
625 +30/-15 m × 625 +30/-15 m (24 mil x 24 mil)
Chip Thickness
150 ± 10 m (5.9 mil)
Au Pad Thickness
4.2 ± 0.2 m
Au Pad Diameter
P Pad: 100 m
N Pad: 100 m
Absolute Maximum Ratings
Parameter
DC Forward Current
Symbol
Maximum Rating
If
200 mA
Peak Pulsed Forward Current
Condition
1
Tj = 125°C
400 mA
2
Tj = 65°C
If = 120 mA
Forward Voltage
Vf
3.6 V
Junction Temperature
Tj
150°C
Reverse Voltage
Vr
-5 V
Ta = 25°C
Reverse Current
Ir
<2.0 µA
Vr = -5 V
Assembly Process Temperature
Storage Conditions (chip on tape)
325°C for < 5 seconds
7
0°C to +40°C ambient, RH < 65%
Notes:
1.
2.
3.
4.
5.
6.
7.
Maximum drive current depends on junction temperature, die attach methods/materials, and lifetime
requirements of the application.
Peak forward current is specified at 65ºC junction temperature using a 400 ms pulse at 20% duty cycle.
Bridgelux LED chips are Class 1 ESD sensitive.
The typical spectra half-width of the BXCE2424 blue power die is < 25 nm.
Please consult the Bridgelux technical support team for information on how to optimize the light output
of our chips in your package.
Brightness values are measured in an integrating sphere using gold plated TO39 headers without
encapsulation.
Tapes should be stored in a vertical orientation, not horizontally stacked. Stacking of tapes can place
excessive pressure on the bond pads of the LED, resulting in reduced wire bonding strength.
Environmental Compliance
Bridgelux is committed to providing environmentally friendly products to the solid state lighting
market. Bridgelux BXCE2424 blue power die are compliant to the European Union directives on the
restriction of hazardous substances in electronic equipment, namely the RoHS directive. Bridgelux
will not intentionally add the following restricted materials to BXCE2424 die products: lead, mercury,
cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers
(PBDE).
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BRIDGELUX Blue Power Die
BXCE 24 x 24 mil
Performance vs. Current
The following curves represent typical performance of the BXCE2424 blue power die. Actual
performance will vary slightly for different power and dominant wavelength bins.
Relative Luminous Intensity
Normalized at 120 mA
2.5
2.0
1.5
1.0
0.5
0.0
0
50
100
150
200
250
300
350
Forward Current, If (mA)
Figure 1: Relative Luminous Intensity vs. Forward Current (device tested on a probe station)
For wa rd Curren t, If ( mA )
100 0
10 0
10
1
0
1
2
3
4
5
Forwar d Voltag e, V f (V )
Figure 2: Forward Current vs. Forward Voltage (Tj = 25°C)
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BRIDGELUX Blue Power Die
BXCE 24 x 24 mil
3
Wavelength Shift (nm)
Normalized at 120mA,Tj25°C
2
1
0
-1
-2
-3
0
50
100
150
200
250
300
Forward Current, If (mA)
Figure 3: Dominant Wavelength Shift vs. Forward Current (Tj = 25°C)
Performance vs. Junction Temperature
The following curves represent typical performance of the BXCE2424 blue power die. Actual
performance will vary slightly for different power and dominant wavelength bins.
Forward Voltag e Shift (V)
Normali zed at 120mA,Tj25°C
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
25
50
75
100
125
150
Junction Temperature (ºC)
Figure 4: Forward Voltage vs. Junction Temperature
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BRIDGELUX Blue Power Die
BXCE 24 x 24 mil
1 10%
Rela tive Li ght Inten si ty
Normal ized at 1 20mA ,Tj25 °C
1 00%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
25
50
75
100
125
150
Junction Tempe rature (ºC)
Figure 5: Relative Light Output vs. Junction Temperature
Wavel ength Sh ift (nm)
Normal ized at 1 20mA ,Tj25 °C
6
5
4
3
2
1
0
25
50
75
100
12 5
150
Junction Temper ature (ºC)
Figure 6: Wavelength Shift vs. Junction Temperature
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BRIDGELUX Blue Power Die
BXCE 24 x 24 mil
Typical Radiation Pattern
Figure 7: Typical Radiation Pattern (120 mA Operation)
Current Derating Curves
Rja = 40 Deg C/W
Rja = 60 Deg C/W
Forward Curr ent, I f (mA)
25 0
20 0
15 0
10 0
50
0
0
10
20
30
40
50
60
70
80
90
10 0
110
120
o
Ambien t Tempe rature, Ta ( C)
Figure 8: Current Derating Curve vs. Ambient Temperature (derating based on Tj max = 150°C)
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About Bridgelux
Bridgelux is a leading developer and manufacturer of technologies and solutions transforming the $40
billion global lighting industry into a $100 billion market opportunity. Based in Livermore, California,
Bridgelux is a pioneer in solid-state lighting (SSL), expanding the market for light-emitting diode (LED)
technologies by driving down the cost of LED lighting systems. Bridgelux’s patented light source
technology replaces traditional technologies (such as incandescent, halogen, fluorescent and high
intensity discharge lighting) with integrated, solid-state lighting solutions that enable lamp and
luminaire manufacturers to provide high performance and energy-efficient white light for the rapidly
growing interior and exterior lighting markets, including street lights, commercial lighting and
consumer applications. With more than 650 patent applications filed or granted worldwide, Bridgelux
is the only vertically integrated LED manufacturer and developer of solid-state light sources that
designs its solutions specifically for the lighting industry.
For more information about the company, please visit www.bridgelux.com
© 2012 Bridgelux, Inc. All rights reserved. Product specifications are subject to change without
notice.
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