AD670S Space Qualified Die Document PDF

AD670S Space Qualified Die Document PDF
This specification documents the detailed requirements for Analog Devices space qualified die including die
qualification as described for Class K in MIL-PRF-38534, Appendix C, Table C-II except as modified herein.
The manufacturing flow described in the STANDARD DIE PRODUCTS PROGRAM brochure at
http://www.analog.com/marketSolutions/militaryAerospace/pdf/Die_Broc.pdf is to be considered a part of this
specification.
This data sheet specifically details the space grade version of this product. A more detailed operational
description and a complete data sheet for commercial product grades can be found at
www.analog.com/AD670
The complete part number(s) of this specification follow:
Part Number
Description
AD670-000C
8-Bit Low Cost Signal Conditioning ADC
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
D0 (LSB)
D1
D2
D3
D4
D5
D6
D7 (MSB)
STATUS
POWER GROUND
BPO/UPO*
FORMAT
R/W*
CE*
CS*
-VIN HI
-VIN LOW
+VIN HI
+VIN LOW
+VCC
* = Active Low
AD670
1/
VCC to Ground .................................................................. 0V to +7.5V
Digital Inputs (Pin 11 – 15) .............................................. -0.5V to VCC +0.5V
Digital Outputs (Pin 1 – 9)................................................. Momentary Short to VCC or ground
Analog Inputs (Pin 16 – 19) ............................................. ±30V
Storage Temperature Range .......................................... -65°C to +150°C
Junction Temperature (TJ)…………………..………………..+150C
Operating Temperature Range......................................... -55°C to +125°C
Absolute Maximum Ratings Notes:
1./
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels
may degrade performance and affect reliability.
In accordance with class-K version of Mil-Prf-38534, Appendix C, Table C-II, except as modified herein.
(a) Qual Samples Size and Qual Acceptance Criteria – 25/2
(b) Qual Sample Package – DIP
(c) Pre-screen electrical test over temperature performed post-assembly prior to die qualification.
Table I Notes:
1/ VCC = +5V, TA = 25°C, unless otherwise specified.
2/ Tested on both 2.55V full scale and -1.28V to 1.27V full scale.
3/ Minimum resolution for which there are no missing codes.
4/ Parameter is tested at VCC = +5V, but is guaranteed from VCC = 4.5V to VCC = 5.5V.
AD670
Table II Notes:
1/ VCC = +5V, unless otherwise specified.
2/ Tested on both 2.55V full scale and -1.28V to 1.27V full scale.
3/ Minimum resolution for which there are no missing codes.
4/ Parameter is tested at VCC = +5V, but is guaranteed from VCC = 4.5V to VCC = 5.5V.
AD670
5.1
HTRB is not applicable for this drawing.
5.2
Burn-in is per MIL-STD-883 Method 1015 test condition B or C.
5.3
Steady state life test is per MIL-STD-883 Method 1005.
AD670
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