MC74LVX245 D

MC74LVX245 D
MC74LVX245
Octal Bus Transceiver
With 5 V−Tolerant Inputs
The MC74LVX245 is an advanced high speed CMOS octal bus
transceiver.
It is intended for two−way asynchronous communication between
data buses. The direction of data transmission is determined by the
level of the T/R input. The output enable pin (OE) can be used to
disable the device, so that the buses are effectively isolated.
All inputs are equipped with protection circuits against static
discharge.
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SOIC−20
DW SUFFIX
CASE 751D
Features
•
•
•
•
•
•
•
•
•
High Speed: tPD = 4.7 ns (Typ) at VCC = 3.3 V
Low Power Dissipation: ICC = 4 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: VOLP = 0.8 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance: Human Body Model > 2000 V;
Machine Model > 200 V
These Devices are Pb−Free and are RoHS Compliant
TSSOP−20
DT SUFFIX
CASE 948E
PIN ASSIGNMENT
OE
19
B0
18
B1
17
B2
16
B3
15
B4
14
B5
13
B6
12
1
2
T/R A0
3
A1
4
A2
5
A3
6
A4
7
A5
8
A6
9 10
A7 GND
VCC
20
20−Lead (Top View)
Application Notes
MARKING DIAGRAMS
• Do Not Force a Signal on an I/O Pin when it is an Active Output,
20
•
•
Damage May Occur
All Floating (High Impedance) Input or I/O Pins must be Fixed by
Means of Pullup or Pulldown Resistors or Bus Terminator ICs
A Parasitic Diode is Formed between the Bus and VCC Terminals
Therefore, the LVX245 cannot be Used to Interface 5.0 V to 3.0 V
Systems Directly
B7
11
LVX245
AWLYYWWG
1
SOIC−20
20
LVX
245
ALYWG
G
1
TSSOP−20
LVX245
A
WL, L
Y
WW, W
G or G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 5
1
Publication Order Number:
MC74LVX245/D
MC74LVX245
OE 19
T/R 1
2
A0
18
B0
3
A1
17
B1
4
A2
16
B2
5
A3
15
B3
6
A4
14
B4
7
A5
13
B5
8
A6
12
B6
9
A7
11
B7
Figure 1. Logic Diagram
Table 1. PIN NAMES
Pins
Function
OE
T/R
A0−A7
Bo−B7
Output Enable Input
Transmit/Receive Input
Side A 3−State Inputs or 3−State Outputs
Side B 3−State Inputs or 3−State Outputs
INPUTS
OPERATING MODE
Non−Inverting
OE
T/R
L
L
B Data to A Bus
L
H
A Data to B Bus
H
X
Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State;
X = High or Low Voltage Level and Transitions are Acceptable; For ICC
reasons, Do Not Float Inputs
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2
MC74LVX245
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Parameter
–0.5 to +7.0
V
Vin
DC Input Voltage (T/R, OE)
–0.5 to +7.0
V
VI/O
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
DC Supply Voltage
Vin
DC Input Voltage (T/R, OE)
VI/O
DC Output Voltage
TA
Dt/DV
Operating Temperature, All Package Types
Input Rise and Fall Time
Min
Max
Unit
2.0
3.6
V
0
5.5
V
0
VCC
V
−40
+85
°C
0
100
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
TA = 25°C
VCC
V
Min
1.5
2.0
2.4
VIH
High−Level Input Voltage
2.0
3.0
3.6
VIL
Low−Level Input Voltage
2.0
3.0
3.6
VOH
High−Level Output Voltage
(Vin = VIH or VIL)
IOH = −50 mA
IOH = −50 mA
IOH = −4 mA
2.0
3.0
3.0
VOL
Low−Level Output Voltage
(Vin = VIH or VIL)
IOL = 50 mA
IOL = 50 mA
IOL = 4 mA
2.0
3.0
3.0
Iin
Input Leakage Current
Vin = 5.5 V or GND
(T/R, OE)
IOZ
Maximum 3−State Leakage Current
ICC
Quiescent Supply Current
Typ
TA = −40 to 85°C
Max
Min
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.58
Max
2.0
3.0
0.0
0.0
Unit
V
0.5
0.8
0.8
1.9
2.9
2.48
V
V
0.1
0.1
0.36
0.1
0.1
0.44
V
3.6
±0.1
±1.0
mA
Vin = VIL or VIH
Vout = VCC or GND
3.6
±0.2
5
±2.5
mA
Vin = VCC or GND
3.6
4.0
40.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
MC74LVX245
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA = 25°C
Symbol
tPLH,
tPHL
tPZL,
tPZH
tPLZ,
tPHZ
tOSHL
tOSLH
Parameter
Propagation Delay
Input to Output
Output Enable Time to
High and Low Level
Output Disable Time From
High and Low Level
Output−to−Output Skew
(Note 1)
Test Conditions
Min
TA = −40 to 85°C
Typ
Max
Min
Max
Unit
ns
VCC = 2.7 V
CL = 15 pF
CL = 50 pF
6.1
8.6
10.7
14.2
1.0
1.0
13.5
17.0
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
4.7
7.2
6.6
10.1
1.0
1.0
8.0
11.5
VCC = 2.7 V
RL = 1 kW
CL = 15 pF
CL = 50 pF
9.0
11.5
16.9
20.4
1.0
1.0
20.5
24.0
VCC = 3.3 ± 0.3 V
RL = 1 kW
CL = 15 pF
CL = 50 pF
7.1
9.6
11.0
14.5
1.0
1.0
13.0
16.5
VCC = 2.7 V
RL = 1 kW
CL = 50 pF
11.5
18.0
1.0
21.0
VCC = 3.3 ± 0.3 V
RL = 1 kW
CL = 50 pF
9.6
12.8
1.0
14.5
VCC = 2.7 V
VCC = 3.3 ± 0.3 V
CL = 50 pF
CL = 50 pF
1.5
1.5
1.5
1.5
ns
ns
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
TA = 25°C
Symbol
Min
Parameter
TA = −40 to 85°C
Typ
Max
4
10
Min
Max
Unit
10
pF
Cin
Input Capacitance (T/R, OE)
CI/O
Maximum 3−State I/O Capacitance
8
pF
CPD
Power Dissipation Capacitance (Note 2)
21
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 8 (per bit). CPD is used to determine the no−load
dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package)
TA = 25°C
Characteristic
Symbol
Typ
Max
Unit
VOLP
Quiet Output Maximum Dynamic VOL
0.5
0.8
V
VOLV
Quiet Output Minimum Dynamic VOL
−0.5
−0.8
V
VIHD
Minimum High Level Dynamic Input Voltage
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
0.8
V
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4
MC74LVX245
SWITCHING WAVEFORMS
VCC
T/R
50%
GND
VCC
VCC
Input
A or B
OE
50%
GND
tPZL
GND
tPLH
Output
B or A
50% VCC
50% VCC
tPLZ
HIGH
IMPEDANCE
tPHL
A or B
50% VCC
50% VCC
tPZH
A or B
VOL +0.3V
tPHZ
VOH -0.3V
50% VCC
Figure 2.
HIGH
IMPEDANCE
Figure 3.
TEST CIRCUITS
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
1 kW
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 4. Propagation Delay Test Circuit
Figure 5. 3−State Test Circuit
ORDERING INFORMATION
Package
Shipping†
MC74LVX245DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74LVX245DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
MC74LVX245
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
S
J J1
11
B
−U−
L
PIN 1
IDENT
SECTION N−N
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
N
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
F
DETAIL E
−W−
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC74LVX245
PACKAGE DIMENSIONS
SOIC−20
CASE 751D−05
ISSUE G
20
11
X 45 _
h
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
A
B
M
D
1
10
20X
B
B
0.25
M
T A
S
B
S
L
A
18X
e
A1
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
SEATING
PLANE
C
T
ON Semiconductor and the
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For additional information, please contact your local
Sales Representative
MC74LVX245/D
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