LM158/LM258/LM358/LM2904 Low Power Dual Operational Amplifiers LM158-N, FEATURES ADVANTAGES

LM158/LM258/LM358/LM2904 Low Power Dual Operational Amplifiers LM158-N, FEATURES ADVANTAGES
LM158-N, LM258-N, LM2904-N, LM358-N
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LM158/LM258/LM358/LM2904 Low Power Dual Operational Amplifiers
Check for Samples: LM158-N, LM258-N, LM2904-N, LM358-N
FEATURES
ADVANTAGES
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2
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Available in 8-Bump DSBGA ChipSized Package, (See AN-1112 (SNVA009))
Internally Frequency Compensated for Unity
Gain
Large DC Voltage Gain: 100 dB
Wide Bandwidth (Unity Gain): 1 MHz
(Temperature Compensated)
Wide Power Supply Range:
– Single Supply: 3V to 32V
– Or Dual Supplies: ±1.5V to ±16V
Very Low Supply Current Drain (500
μA)—Essentially Independent of Supply
Voltage
Low Input Offset Voltage: 2 mV
Input Common-Mode Voltage Range Includes
Ground
Differential Input Voltage Range Equal to the
Power Supply Voltage
Large Output Voltage Swing
UNIQUE CHARACTERISTICS
•
•
•
In the Llinear Mode the Input Common-Mode
Voltage Range Includes Ground and the
Output Voltage Can Also Swing to Ground,
even though Operated from Only a Single
Power Supply Voltage.
The Unity Gain Cross Frequency is
Temperature Compensated.
The Input Bias Current is also Temperature
Compensated.
•
•
Two Internally Compensated Op Amps
Eliminates Need for Dual Supplies
Allows Direct Sensing Near GND and VOUT
Also Goes to GND
Compatible with All Forms of Logic
Power Drain Suitable for Battery Operation
DESCRIPTION
The LM158 series consists of two independent, high
gain, internally frequency compensated operational
amplifiers which were designed specifically to operate
from a single power supply over a wide range of
voltages. Operation from split power supplies is also
possible and the low power supply current drain is
independent of the magnitude of the power supply
voltage.
Application areas include transducer amplifiers, dc
gain blocks and all the conventional op amp circuits
which now can be more easily implemented in single
power supply systems. For example, the LM158
series can be directly operated off of the standard
+5V power supply voltage which is used in digital
systems and will easily provide the required interface
electronics without requiring the additional ±15V
power supplies.
The LM358 and LM2904 are available in a chip sized
package (8-Bump DSBGA) using TI's DSBGA
package technology.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM158-N, LM258-N, LM2904-N, LM358-N
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Voltage Controlled Oscillator (VCO)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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ABSOLUTE MAXIMUM RATINGS (1) (2)
LM158/LM258/LM358
LM2904
LM158A/LM258A/LM3
58A
Supply Voltage, V+
32V
Differential Input Voltage
26V
32V
26V
−0.3V to +32V
−0.3V to +26V
PDIP (P)
830 mW
830 mW
TO-99 (LMC)
550 mW
SOIC (D)
530 mW
Input Voltage
Power Dissipation (3)
DSBGA (YPB)
Output Short-Circuit to GND
Amplifier) (4)
530 mW
435mW
(One
V+ ≤ 15V and TA = 25°C
Continuous
Continuous
50 mA
50 mA
LM358
0°C to +70°C
−40°C to +85°C
LM258
−25°C to +85°C
LM158
−55°C to +125°C
Input Current (VIN < −0.3V) (5)
Operating Temperature Range
−65°C to +150°C
−65°C to +150°C
260°C
260°C
300°C
300°C
260°C
260°C
Vapor Phase (60 seconds)
215°C
215°C
Infrared (15 seconds)
220°C
220°C
250V
250V
Storage Temperature Range
Lead Temperature, PDIP (P)
(Soldering, 10 seconds)
Lead Temperature, TO-99 (LMC)
(Soldering, 10 seconds)
Soldering Information
PDIP Package (P)
Soldering (10 seconds)
SOIC Package (D)
ESD Tolerance (6)
(1)
(2)
(3)
(4)
(5)
(6)
Refer to RETS158AX for LM158A military specifications and to RETS158X for LM158 military specifications.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
For operating at high temperatures, the LM358/LM358A, LM2904 must be derated based on a +125°C maximum junction temperature
and a thermal resistance of 120°C/W for PDIP, 182°C/W for TO-99, 189°C/W for SOIC package, and 230°C/W for DSBGA, which
applies for the device soldered in a printed circuit board, operating in a still air ambient. The LM258/LM258A and LM158/LM158A can be
derated based on a +150°C maximum junction temperature. The dissipation is the total of both amplifiers—use external resistors, where
possible, to allow the amplifier to saturate or to reduce the power which is dissipated in the integrated circuit.
Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,
the maximum output current is approximately 40 mA independent of the magnitude of V+. At values of supply voltage in excess of +15V,
continuous short-circuits can exceed the power dissipation ratings and cause eventual destruction. Destructive dissipation can result
from simultaneous shorts on all amplifiers.
This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of
the input PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is
also lateral NPN parasitic transistor action on the IC chip. This transistor action can cause the output voltages of the op amps to go to
the V+voltage level (or to ground for a large overdrive) for the time duration that an input is driven negative. This is not destructive and
normal output states will re-establish when the input voltage, which was negative, again returns to a value greater than −0.3V (at 25°C).
Human body model, 1.5 kΩ in series with 100 pF.
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ELECTRICAL CHARACTERISTICS
V+ = +5.0V, unless otherwise stated
Parameter
Conditions
LM158A
Min Typ
Input Offset Voltage
(1)
Input Bias Current
IIN(+) or IIN(−), TA = 25°C,
, TA = 25°C
LM358A
Max
Min Typ
LM158/LM258
Max
Min Typ
Units
Max
1
2
2
3
2
5
mV
20
50
45
100
45
150
nA
2
10
5
30
3
30
nA
V+−1.5
V
VCM = 0V, (2)
Input Offset Current
IIN(+) − IIN(−), VCM = 0V, TA = 25°C
Input Common-Mode
V+ = 30V, (3)
Voltage Range
(LM2904, V+ = 26V), TA = 25°C
Supply Current
Over Full Temperature Range
V+−1.5
0
V+−1.5
0
0
RL = ∞ on All Op Amps
V+ = 30V (LM2904 V+ = 26V)
+
V = 5V
(1)
(2)
(3)
1
2
1
0.5
1.2
0.5
+
2
1
2
mA
1.2
0.5
1.2
mA
+
VO ≃ 1.4V, RS = 0Ω with V from 5V to 30V; and over the full input common-mode range (0V to V −1.5V) at 25°C. For LM2904, V+ from
5V to 26V.
The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the
state of the output so no loading change exists on the input lines.
The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V (at 25°C). The
upper end of the common-mode voltage range is V+ −1.5V (at 25°C), but either or both inputs can go to +32V without damage (+26V for
LM2904), independent of the magnitude of V+.
ELECTRICAL CHARACTERISTICS
V+ = +5.0V, unless otherwise stated
Parameter
Conditions
LM358
Min
LM2904
Typ
Max
Min
Units
Typ
Max
Input Offset Voltage
See (1) , TA = 25°C
2
7
2
7
mV
Input Bias Current
IIN(+) or IIN(−), TA = 25°C,
VCM = 0V, See (2)
45
250
45
250
nA
Input Offset Current
IIN(+) − IIN(−), VCM = 0V, TA = 25°C
5
50
5
50
nA
+
(3)
Input Common-Mode
Voltage Range
V = 30V, See
(LM2904, V+ = 26V), TA = 25°C
Supply Current
Over Full Temperature Range
+
V −1.
5
0
+
0
V −1.
5
V
RL = ∞ on All Op Amps
V+ = 30V (LM2904 V+ = 26V)
V+ = 5V
(1)
(2)
(3)
4
+
1
2
1
2
mA
0.5
1.2
0.5
1.2
mA
+
VO ≃ 1.4V, RS = 0Ω with V from 5V to 30V; and over the full input common-mode range (0V to V −1.5V) at 25°C. For LM2904, V+ from
5V to 26V.
The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the
state of the output so no loading change exists on the input lines.
The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V (at 25°C). The
upper end of the common-mode voltage range is V+ −1.5V (at 25°C), but either or both inputs can go to +32V without damage (+26V for
LM2904), independent of the magnitude of V+.
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ELECTRICAL CHARACTERISTICS
V+ = +5.0V, See (1), unless otherwise stated
Parameter
Conditions
Large Signal Voltage
Gain
V+ = 15V, TA = 25°C,
RL ≥ 2 kΩ, (For VO = 1V to 11V)
Common-Mode
TA = 25°C,
Rejection Ratio
VCM = 0V to V+−1.5V
Power Supply
V+ = 5V to 30V
Rejection Ratio
(LM2904, V+ = 5V to 26V), TA = 25°C
Amplifier-to-Amplifier
Coupling
f = 1 kHz to 20 kHz, TA = 25°C (Input
Referred), See (2)
Output Current
LM158A
LM358A
Max
LM158/LM258
Min
Typ
Min
Typ
Min
Typ
50
100
25
100
50
100
V/mV
70
85
65
85
70
85
dB
65
100
65
100
65
100
dB
−120
dB
−120
Max
Units
−120
Max
+
Source VIN = 1V,
VIN− = 0V,
V+ = 15V,
20
40
20
40
20
40
mA
10
20
10
20
10
20
mA
12
50
12
50
12
50
μA
VO = 2V, TA = 25°C
Sink VIN− = 1V, VIN+ = 0V
V+ = 15V, TA = 25°C,
VO = 2V
VIN− = 1V,
VIN+ = 0V
TA = 25°C, VO = 200 mV,
V+ = 15V
Short Circuit to Ground
TA = 25°C, See (3), V+ = 15V
40
60
7
15
(4)
40
60
7
20
4
40
Input Offset Voltage
See
Input Offset Voltage Drift
RS = 0Ω
5
Input Offset Current
IIN(+) − IIN(−)
Input Offset Current Drift
RS = 0Ω
10
200
10
300
10
Input Bias Current
IIN(+) or IIN(−)
40
100
40
200
40
Input Common-Mode
Voltage Range
V+ = 30 V, See (5) (LM2904, V+ = 26V)
Large Signal Voltage
Gain
V+ = +15V
30
(VO = 1V to 11V)
V+−2
0
25
7
V+−2
15
100
0
mA
mV
μV/°C
7
75
0
60
nA
pA/°C
300
nA
V+−2
V
25
V/mV
RL ≥ 2 kΩ
Output
Voltage
Swing
(1)
(2)
(3)
(4)
(5)
VOH V+ = +30V
(LM2904, V+ = 26V)
VOL V+ = 5V, RL = 10 kΩ
RL = 2 kΩ
26
RL = 10 kΩ
27
26
28
5
27
20
26
28
5
27
20
V
28
5
V
20
mV
These specifications are limited to −55°C ≤ TA ≤ +125°C for the LM158/LM158A. With the LM258/LM258A, all temperature
specifications are limited to −25°C ≤ TA ≤ +85°C, the LM358/LM358A temperature specifications are limited to 0°C ≤ TA ≤ +70°C, and
the LM2904 specifications are limited to −40°C ≤ TA ≤ +85°C.
Due to proximity of external components, insure that coupling is not originating via stray capacitance between these external parts. This
typically can be detected as this type of capacitance increases at higher frequencies.
Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,
the maximum output current is approximately 40 mA independent of the magnitude of V+. At values of supply voltage in excess of +15V,
continuous short-circuits can exceed the power dissipation ratings and cause eventual destruction. Destructive dissipation can result
from simultaneous shorts on all amplifiers.
VO ≃ 1.4V, RS = 0Ω with V+ from 5V to 30V; and over the full input common-mode range (0V to V+ −1.5V) at 25°C. For LM2904, V+ from
5V to 26V.
The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V (at 25°C). The
upper end of the common-mode voltage range is V+ −1.5V (at 25°C), but either or both inputs can go to +32V without damage (+26V for
LM2904), independent of the magnitude of V+.
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ELECTRICAL CHARACTERISTICS (continued)
V+ = +5.0V, See(1), unless otherwise stated
Parameter
Output Current
Conditions
Source VIN+ = +1V, VIN− = 0V,
V+ = 15V, VO = 2V
Sink VIN− = +1V, VIN+ = 0V,
V+ = 15V, VO = 2V
LM158A
Min
Typ
LM358A
Max
Min
Typ
LM158/LM258
Max
Min
Typ
Units
Max
10
20
10
20
10
20
mA
10
15
5
8
5
8
mA
ELECTRICAL CHARACTERISTICS
V+ = +5.0V, See (1), unless otherwise stated
Parameter
Conditions
Large Signal Voltage
V+ = 15V, TA = 25°C,
Gain
RL ≥ 2 kΩ, (For VO = 1V to 11V)
Common-Mode
Rejection Ratio
TA = 25°C,
Power Supply
Rejection Ratio
V+ = 5V to 30V
Amplifier-to-Amplifier Coupling
f = 1 kHz to 20 kHz, TA = 25°C
(Input Referred), See (2)
Output Current
VCM = 0V to V+−1.5V
LM358
Min
Typ
25
LM2904
Max
Units
Min
Typ
Max
100
25
100
V/mV
65
85
50
70
dB
65
100
50
100
dB
−120
dB
(LM2904, V+ = 5V to 26V), TA = 25°C
−120
+
Source VIN = 1V,
VIN− = 0V,
V+ = 15V,
20
40
20
40
mA
10
20
10
20
mA
12
50
12
50
μA
VO = 2V, TA = 25°C
Sink VIN− = 1V, VIN+ = 0V
V+ = 15V, TA = 25°C,
VO = 2V
VIN− = 1V,
VIN+ = 0V
TA = 25°C, VO = 200 mV,
V+ = 15V
Short Circuit to Ground
TA = 25°C, See (3), V+ = 15V
Input Offset Voltage
See (4)
Input Offset Voltage Drift
RS = 0Ω
Input Offset Current
IIN(+) − IIN(−)
Input Offset Current Drift
RS = 0Ω
10
Input Bias Current
IIN(+) or IIN(−)
40
Input Common-Mode
Voltage Range
V+ = 30 V, See (5) (LM2904, V+ = 26V)
(1)
(2)
(3)
(4)
(5)
6
40
60
40
9
10
7
45
200
10
500
V+−2
40
0
mA
mV
μV/°C
7
150
0
60
nA
pA/°C
500
nA
V+ −2
V
These specifications are limited to −55°C ≤ TA ≤ +125°C for the LM158/LM158A. With the LM258/LM258A, all temperature
specifications are limited to −25°C ≤ TA ≤ +85°C, the LM358/LM358A temperature specifications are limited to 0°C ≤ TA ≤ +70°C, and
the LM2904 specifications are limited to −40°C ≤ TA ≤ +85°C.
Due to proximity of external components, insure that coupling is not originating via stray capacitance between these external parts. This
typically can be detected as this type of capacitance increases at higher frequencies.
Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,
the maximum output current is approximately 40 mA independent of the magnitude of V+. At values of supply voltage in excess of +15V,
continuous short-circuits can exceed the power dissipation ratings and cause eventual destruction. Destructive dissipation can result
from simultaneous shorts on all amplifiers.
VO ≃ 1.4V, RS = 0Ω with V+ from 5V to 30V; and over the full input common-mode range (0V to V+ −1.5V) at 25°C. For LM2904, V+ from
5V to 26V.
The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V (at 25°C). The
upper end of the common-mode voltage range is V+ −1.5V (at 25°C), but either or both inputs can go to +32V without damage (+26V for
LM2904), independent of the magnitude of V+.
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ELECTRICAL CHARACTERISTICS (continued)
V+ = +5.0V, See(1), unless otherwise stated
Parameter
Conditions
Large Signal Voltage Gain
LM358
Min
Typ
LM2904
Max
Min
Typ
Units
Max
V+ = +15V
(VO = 1V to 11V)
15
15
V/mV
RL ≥ 2 kΩ
Output
Voltage
Swing
Output Current
VOH V+ = +30V
(LM2904, V+ = 26V)
RL = 2 kΩ
26
RL = 10 kΩ
27
VOL V+ = 5V, RL = 10 kΩ
Source VIN+ = +1V, VIN− = 0V,
V+ = 15V, VO = 2V
Sink VIN− = +1V, VIN+ = 0V,
V+ = 15V, VO = 2V
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22
28
5
23
20
V
24
5
V
100
mV
10
20
10
20
mA
5
8
5
8
mA
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TYPICAL PERFORMANCE CHARACTERISTICS
8
Input Voltage Range
Input Current
Figure 1.
Figure 2.
Supply Current
Voltage Gain
Figure 3.
Figure 4.
Open Loop Frequency Response
Common-Mode Rejection Ratio
Figure 5.
Figure 6.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Voltage Follower Pulse Response
Voltage Follower Pulse Response (Small Signal)
Figure 7.
Figure 8.
Large Signal Frequency Response
Output Characteristics Current Sourcing
Figure 9.
Figure 10.
Output Characteristics Current Sinking
Current Limiting
Figure 11.
Figure 12.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
10
Input Current (LM2902 only)
Voltage Gain (LM2902 only)
Figure 13.
Figure 14.
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APPLICATION HINTS
The LM158 series are op amps which operate with only a single power supply voltage, have true-differential
inputs, and remain in the linear mode with an input common-mode voltage of 0 VDC. These amplifiers operate
over a wide range of power supply voltage with little change in performance characteristics. At 25°C amplifier
operation is possible down to a minimum supply voltage of 2.3 VDC.
Precautions should be taken to insure that the power supply for the integrated circuit never becomes reversed in
polarity or that the unit is not inadvertently installed backwards in a test socket as an unlimited current surge
through the resulting forward diode within the IC could cause fusing of the internal conductors and result in a
destroyed unit.
Large differential input voltages can be easily accommodated and, as input differential voltage protection diodes
are not needed, no large input currents result from large differential input voltages. The differential input voltage
may be larger than V+ without damaging the device. Protection should be provided to prevent the input voltages
from going negative more than −0.3 VDC (at 25°C). An input clamp diode with a resistor to the IC input terminal
can be used.
To reduce the power supply current drain, the amplifiers have a class A output stage for small signal levels which
converts to class B in a large signal mode. This allows the amplifiers to both source and sink large output
currents. Therefore both NPN and PNP external current boost transistors can be used to extend the power
capability of the basic amplifiers. The output voltage needs to raise approximately 1 diode drop above ground to
bias the on-chip vertical PNP transistor for output current sinking applications.
For ac applications, where the load is capacitively coupled to the output of the amplifier, a resistor should be
used, from the output of the amplifier to ground to increase the class A bias current and prevent crossover
distortion. Where the load is directly coupled, as in dc applications, there is no crossover distortion.
Capacitive loads which are applied directly to the output of the amplifier reduce the loop stability margin. Values
of 50 pF can be accommodated using the worst-case non-inverting unity gain connection. Large closed loop
gains or resistive isolation should be used if larger load capacitance must be driven by the amplifier.
The bias network of the LM158 establishes a drain current which is independent of the magnitude of the power
supply voltage over the range of 3 VDC to 30 VDC.
Output short circuits either to ground or to the positive power supply should be of short time duration. Units can
be destroyed, not as a result of the short circuit current causing metal fusing, but rather due to the large increase
in IC chip dissipation which will cause eventual failure due to excessive function temperatures. Putting direct
short-circuits on more than one amplifier at a time will increase the total IC power dissipation to destructive
levels, if not properly protected with external dissipation limiting resistors in series with the output leads of the
amplifiers. The larger value of output source current which is available at 25°C provides a larger output current
capability at elevated temperatures (see TYPICAL PERFORMANCE CHARACTERISTICS) than a standard IC
op amp.
The circuits presented in the TYPICAL SINGLE-SUPPLY APPLICATIONS emphasize operation on only a single
power supply voltage. If complementary power supplies are available, all of the standard op amp circuits can be
used. In general, introducing a pseudo-ground (a bias voltage reference of V+/2) will allow operation above and
below this value in single power supply systems. Many application circuits are shown which take advantage of
the wide input common-mode voltage range which includes ground. In most cases, input biasing is not required
and input voltages which range to ground can easily be accommodated.
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
www.ti.com
CONNECTION DIAGRAM
Figure 15. PDIP/CDIP/SOIC Package – Top View
(See Package Number P, NAB0008A, or D)
Figure 16. TO-99 Package – Top View
(See Package Number LMC)
Figure 17. 8-Bump DSBGA - Top View, Bump Side Down
(See Package Number YPB0008AAA)
TYPICAL SINGLE-SUPPLY APPLICATIONS
(V+ = 5.0 VDC)
Figure 18. Non-Inverting DC Gain (0V Output)
*R not needed due to temperature
independent IIN
12
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
Where: VO = V1 + V2 − V3 − V4
(V1 + V2) ≥ (V3 + V4) to keep VO > 0 VDC
Figure 19. DC Summing Amplifier
(VIN'S ≥ 0 VDC and VO ≥ 0 VDC)
VO = 0 VDC for VIN = 0 VDC
AV = 10
Figure 20. Power Amplifier
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
www.ti.com
fo = 1 kHz
Q = 50
Av = 100 (40 dB)
Figure 21. “BI-QUAD” RC Active Bandpass Filter
Figure 22. Fixed Current Sources
Figure 23. Lamp Driver
14
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
Figure 24. LED Driver
*(Increase R1 for IL small)
VL ≤ V+ −2V
Figure 25. Current Monitor
Figure 26. Driving TTL
VO = VIN
Figure 27. Voltage Follower
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
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Figure 28. Pulse Generator
Figure 29. Squarewave Oscillator
Figure 30. Pulse Generator
HIGH ZIN
LOW ZOUT
Figure 31. Low Drift Peak Detector
16
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
IO = 1 amp/volt VIN
(Increase RE for IO small)
Figure 32. High Compliance Current Sink
Figure 33. Comparator with Hysteresis
*WIDE CONTROL VOLTAGE RANGE: 0 VDC ≤ VC ≤ 2 (V+ −1.5V DC)
Figure 34. Voltage Controlled Oscillator (VCO)
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Figure 35. AC Coupled Inverting Amplifier
Figure 36. Ground Referencing a Differential Input Signal
Av = 11 (As Shown)
Figure 37. AC Coupled Non-Inverting Amplifier
18
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
fo = 1 kHz
Q=1
AV = 2
Figure 38. DC Coupled Low-Pass RC Active Filter
fo = 1 kHz
Q = 25
Figure 39. Bandpass Active Filter
Figure 40. High Input Z, DC Differential Amplifier
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www.ti.com
Figure 41. Photo Voltaic-Cell Amplifier
Figure 42. Bridge Current Amplifier
Figure 43. High Input Z Adjustable-Gain DC Instrumentation Amplifier
20
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
Figure 44. Using Symmetrical Amplifiers to Reduce Input Current (General Concept)
SCHEMATIC DIAGRAM
(Each Amplifier)
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SNOSBT3H – JANUARY 2000 – REVISED MARCH 2013
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REVISION HISTORY
Changes from Revision G (March 2013) to Revision H
•
22
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 21
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM158AH
ACTIVE
TO-99
LMC
8
500
TBD
Call TI
Call TI
-55 to 125
LM158AH
LM158AH/NOPB
ACTIVE
TO-99
LMC
8
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 125
LM158AH
LM158H
ACTIVE
TO-99
LMC
8
500
TBD
Call TI
Call TI
-55 to 125
LM158H
LM158H/NOPB
ACTIVE
TO-99
LMC
8
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 125
LM158H
LM158J
ACTIVE
CDIP
NAB
8
40
TBD
Call TI
Call TI
-55 to 125
LM158J
LM258H
ACTIVE
TO-99
LMC
8
500
TBD
Call TI
Call TI
-25 to 85
LM258H
LM258H/NOPB
ACTIVE
TO-99
LMC
8
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-25 to 85
LM258H
LM2904ITP/NOPB
ACTIVE
DSBGA
YPB
8
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
A
09
LM2904ITPX/NOPB
ACTIVE
DSBGA
YPB
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
A
09
LM2904M
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LM
2904M
LM2904M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
-40 to 85
LM
2904M
LM2904MX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
LM
2904M
LM2904MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
-40 to 85
LM
2904M
LM2904N
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
-40 to 85
LM
2904N
LM2904N/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-NA-UNLIM
-40 to 85
LM
2904N
LM358AM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM
358AM
LM358AM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
0 to 70
LM
358AM
LM358AMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM
358AM
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM358AMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
0 to 70
LM
358AM
LM358AN
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
0 to 70
LM
358AN
LM358AN/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 70
LM
358AN
LM358H/NOPB
ACTIVE
TO-99
LMC
8
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
0 to 70
LM358H
LM358M
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM
358M
LM358M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
0 to 70
LM
358M
LM358MX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM
358M
LM358MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
0 to 70
LM
358M
LM358N
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
0 to 70
LM
358N
LM358N/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-NA-UNLIM
0 to 70
LM
358N
LM358TP/NOPB
ACTIVE
DSBGA
YPB
8
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 70
A
07
LM358TPX/NOPB
ACTIVE
DSBGA
YPB
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 70
A
07
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM2904ITP/NOPB
DSBGA
YPB
8
250
178.0
LM2904ITPX/NOPB
DSBGA
YPB
8
3000
LM2904MX
SOIC
D
8
2500
LM2904MX/NOPB
SOIC
D
8
LM358AMX
SOIC
D
LM358AMX/NOPB
SOIC
LM358MX
SOIC
LM358MX/NOPB
B0
(mm)
K0
(mm)
P1
(mm)
8.4
1.5
1.5
0.66
4.0
178.0
8.4
1.5
1.5
0.66
330.0
12.4
6.5
5.4
2.0
2500
330.0
12.4
6.5
5.4
8
2500
330.0
12.4
6.5
D
8
2500
330.0
12.4
D
8
2500
330.0
12.4
SOIC
D
8
2500
330.0
LM358TP/NOPB
DSBGA
YPB
8
250
LM358TPX/NOPB
DSBGA
YPB
8
3000
W
Pin1
(mm) Quadrant
8.0
Q1
4.0
8.0
Q1
8.0
12.0
Q1
2.0
8.0
12.0
Q1
5.4
2.0
8.0
12.0
Q1
6.5
5.4
2.0
8.0
12.0
Q1
6.5
5.4
2.0
8.0
12.0
Q1
12.4
6.5
5.4
2.0
8.0
12.0
Q1
178.0
8.4
1.5
1.5
0.66
4.0
8.0
Q1
178.0
8.4
1.5
1.5
0.66
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2904ITP/NOPB
DSBGA
YPB
8
250
210.0
185.0
35.0
LM2904ITPX/NOPB
DSBGA
YPB
8
3000
210.0
185.0
35.0
LM2904MX
SOIC
D
8
2500
367.0
367.0
35.0
LM2904MX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM358AMX
SOIC
D
8
2500
367.0
367.0
35.0
LM358AMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM358MX
SOIC
D
8
2500
367.0
367.0
35.0
LM358MX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM358TP/NOPB
DSBGA
YPB
8
250
210.0
185.0
35.0
LM358TPX/NOPB
DSBGA
YPB
8
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NAB0008A
J08A (Rev M)
www.ti.com
MECHANICAL DATA
YPB0008
D
0.5±0.045
E
TPA08XXX (Rev A)
D: Max = 1.337 mm, Min =1.276 mm
E: Max = 1.337 mm, Min =1.276 mm
4215100/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
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