MAX3420E

MAX3420E
MAX3420EECJ+
RELIABILITY REPORT
FOR
MAX3420EECJ+
PLASTIC ENCAPSULATED DEVICES
November 30, 2008
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX3420EECJ+
Conclusion
The MAX3420EECJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX3420E contains the digital logic and analog circuitry necessary to implement a full-speed USB peripheral compliant to USB specification rev
2.0. A built-in full-speed transceiver features ±15kV ESD protection and programmable USB connect and disconnect. An internal serial-interface
engine (SIE) handles low-level USB protocol details such as error checking and bus retries. The MAX3420E operates using a register set accessed by
an SPI(tm) interface that operates up to 26MHz. Any SPI master (microprocessor, ASIC, DSP, etc.) can add USB functionality using the simple 3- or
4-wire SPI interface. Internal level translators allow the SPI interface to run at a system voltage between 1.71V and 3.6V. USB timed operations are
done inside the MAX3420E with interrupts provided at completion so an SPI master does not need timers to meet USB timing requirements. The
MAX3420E includes four general-purpose inputs and outputs so any microprocessor that uses I/O pins to implement the SPI interface can reclaim the
I/O pins and gain additional ones. The MAX3420E operates over the extended -40°C to +85°C temperature range and is available in a 32-pin LQFP
package (7mm x 7mm) and a space-saving 24-pin TQFN package (4mm x 4mm).
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MAX3420EECJ+
II. Manufacturing Information
A. Description/Function:
USB Peripheral Controller with SPI Interface
B. Process:
S4
C. Number of Device Transistors:
0
D. Fabrication Location:
Texas
E. Assembly Location:
Anam Korea, Carsem Malaysia
F. Date of Initial Production:
July 23, 2005
III. Packaging Information
A. Package Type:
32-pin LQFP
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-1669
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
L. Multi Layer Theta Ja:
48.4°C/W
M. Multi Layer Theta Jc:
12°C/W
IV. Die Information
A. Dimensions:
95 X 90 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX3420EECJ+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the S4 Process results in a FIT Rate of 0.28 @ 25C and 4.85 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The RT86 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1500 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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MAX3420EECJ+
Table 1
Reliability Evaluation Test Results
MAX3420EECJ+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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