MAX5084

MAX5084
MAX5084
RELIABILITY REPORT
FOR
MAX5084ATT+
PLASTIC ENCAPSULATED DEVICES
January 11, 2011
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Don Lipps
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX5084
Conclusion
The MAX5084ATT+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX5084/MAX5085 high-voltage linear regulators operate from an input voltage range of 6.5V to 65V and deliver up to 200mA of output current.
These devices consume only 50µA (typ) of quiescent current with no load and 6µA (typ) in shutdown (EN pulled low). Both devices include a SET
input, which when connected to ground, selects a preset output voltage of 5V (MAX5084) or 3.3V (MAX5085). Alternatively, the output voltage can be
adjusted from 2.54V to 11V by connecting the SET pin to the regulator's output through a resistive divider network. The MAX5084/MAX5085 also
include an OUT_SENSE pin, which allows remote voltage sensing right at the load, thus eliminating the voltage drop caused by the line impedance.
Both devices are short-circuit protected and include thermal shutdown. The MAX5084/MAX5085 operate over the -40°C to +125°C automotive
temperature range and are available in a space-saving 3mm x 3mm thermally enhanced 6-pin TDFN package.
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MAX5084
II. Manufacturing Information
A. Description/Function:
65V, 200mA, Low-Quiescent-Current Linear Regulators in TDFN
B. Process:
BCD8
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
Thailand
F. Date of Initial Production:
January 21, 2006
III. Packaging Information
A. Package Type:
6-pin TDFN 3x3
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-1597
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
55°C/W
K. Single Layer Theta Jc:
8.5°C/W
L. Multi Layer Theta Ja:
42°C/W
M. Multi Layer Theta Jc:
8.5°C/W
IV. Die Information
A. Dimensions:
70 X 94 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
F. Minimum Metal Spacing:
3.0 microns (as drawn)
3.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX5084
V. Quality Assurance Information
A. Quality Assurance Contacts:
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
__1__
MTTF
=
= 22.9 x 10
______1.83______
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the BCD8 Process results in a FIT Rate of 0.06 @ 25C and 1.08 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot NYH0BQ001, D/C 0547)
The NP77 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1500V per JEDEC
JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250mA.
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MAX5084
Table 1
Reliability Evaluation Test Results
MAX5084ATT+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
48
0
NYH0BQ001H, D/C 0551
Note 1: Life Test Data may represent plastic DIP qualification lots.
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