TVS Diode Arrays Low Capacitance ESD Protection - SP3002 Series (SPA Diodes)

TVS Diode Arrays Low Capacitance ESD Protection - SP3002 Series (SPA Diodes)
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3002 Series
SP3002 Series 0.85pF Diode Array
RoHS
Pb GREEN
Description
The SP3002 has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
I/O 1
I/O 4
GND
VCC
I/O 2
I/O 3
I/O 1
1
NC
2
I/O 2
3
Gnd
6
I/O 4
5
V CC
4
I/O 3
μDFN-6
(1.6x1.6x0.5mm)
SC70-6 and SOT23-6
Functional Block Diagram
I/O2
• L
ow capacitance of
0.85 pF (TYP) per I/O
• L
ow leakage current of
0.5μA (MAX) at 5V
• E
SD protection of
±12kV contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• Small packaging options
saves board space
• E
FT protection,
IEC61000-4-4, 40A
(5/50ns)
• L
ightning Protection,
IEC61000-4-5, 4.5A
(8/20µs)
Applications
I/O4
VCC
• Computer Peripherals
• Network Hardware/Ports
• Mobile Phones
• Test Equipment
• PDA’s
• Medical Equipment
• Digital Cameras
Application Example
GND
I/O1
I/O3
+5V
D2+
Additional Information
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
Datasheet
Resources
Samples
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/15
A single 4 channel SP300x-04
device can be used to protect
four of the data lines in a
HDMI/DVI interface. Two (2)
SP300x-04 devices provide
protection for the main data
lines. Low voltage ASIC
HDMI/DVI drivers can also be
protected with the SP300x-04,
the +VCC pins on the SP300x-04
can be substituted with a
suitable bypass capacitor or in
some backdrive applications the
+VCC of the SP300x-04 can be
floated or NC.
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3002 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
IPP
Peak Current (tp=8/20μs)
4.5
A
TOP
Operating Temperature
–40 to 125
°C
TSTOR
Storage Temperature
–55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Parameter
Rating
Units
Storage Temperature Range
–55 to
150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1µA
6.0
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
µA
Clamp Voltage1
VC
ESD Withstand Voltage1
VESD
Diode Capacitance1
CI/O-GND
Diode Capacitance
CI/O-I/O
1
Min
Typ
IPP=1A, tp=8/20µs, Fwd
9.5
11.0
V
IPP=2A, tp=8/20µs, Fwd
10.6
13.0
V
IEC61000-4-2 (Contact)
±12
kV
IEC61000-4-2 (Air)
±15
kV
Reverse Bias=0V
0.95
1.1
1.25
pF
Reverse Bias=1.65V
0.7
0.85
1.0
pF
Reverse Bias=0V
0.5
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.50
0
1.40
I/O Capacitance (pF)
Insertion Loss [dB]
1.30
-5
-10
-15
1.20
VCC = Float
1.10
1.00
VCC = 3.3V
0.90
0.80
VCC = 5V
0.70
0.60
-20
1.E+06
0.50
1.E+07
1.E+08
Frequency [Hz]
1.E+09
1.E+10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3002 Series
Capacitance vs. Frequency
Product Characteristics
2E-12
Lead Plating
SC70 & SOT23: Matte Tin
μDFN: Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
1.8E-12
1.6E-12
Capacitance [F]
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
2E-13
0
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/15
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3002 Series
Package Dimensions — SC70-6
6
Package
Pins
JEDEC
e
e
5
4
E
1
2
SC70-6
6
MO-203
Millimeters
Min
Max
0.80
1.10
0.00
0.10
0.70
1.00
0.15
0.30
0.08
0.25
1.85
2.25
1.15
1.35
0.65 BSC
2.00
2.40
0.26
0.46
HE
3
A
A1
A2
B
c
D
E
e
HE
L
B
D
A2 A
A1
C
Solder Pad Layout
L
Inches
Min
Max
0.031
0.043
0.000
0.004
0.028
0.039
0.006
0.012
0.003
0.010
0.073
0.089
0.045
0.053
0.026 BSC
0.079
0.094
0.010
0.018
Package Dimensions — SOT23-6
Package
SOT23-6
Pins
6
JEDEC
MO-178
Millimeters
Min
Notes
0.900
1.450
0.035
0.057
-
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 Ref
e1
1.9 Ref
0.0748 Ref
a
P
Max
A
0.100
0.600
0.004
10º
0º
6
N
M
Inches
Min
A1
L
Recommended Solder Pad Layout
Max
0º
0.023
6
4,5
6
10º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
R
O
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3002 Series
Package Dimensions — μDFN-6 (1.6x1.6x0.5mm)
Bottom View
Top View
D
6
5
D2
A
0.05 C
L
4
4
6
5
0.05 C
E
E2
Pin 1 Index Area
1
2
3
2
3
B
1
Pin 1 chamfer
0.10 x 45’
℮
Side View
0.05 C
A1
A
A3
Seating plane
C
Package
μDFN-6 (1.6x1.6x0.5mm)
JEDEC
MO-229
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
0.45
0.55
0.018
0.022
A1
0.00
0.05
0.000
0.127 Ref
A3
0.002
0.005 Ref
b
0.20
0.30
0.008
0.012
D
1.50
1.70
0.060
0.067
D2
1.05
1.30
0.042
0.052
E
1.50
1.70
0.060
0.067
E2
0.40
0.65
0.016
0.50 Ref
e
L
0.25
0.026
0.020 Ref
0.40
0.010
0.016
b
0.10 M C A B
0.05 M C
Ordering Information
Part Numbering System
SP3002-04* TG
TVS Diode Arrays
(SPA® Diodes)
G= Green
Series
Number of Channels
Package
H = SOT23-6
J = SC70-6
U = μDFN-6
T= Tape & Reel
-04 = 4 channel
Part Marking System
E*4
E*4
Product Series
Number of Channels
E = SP3002 series
Assembly Site
(varies)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/15
Part Number
Package
Marking
Min. Order
Qty.
SP3002-04HTG
SOT23-6
E*4
3000
SP3002-04JTG
SC70-6
E*4
3000
SP3002-04UTG
μDFN-6
(1.6x1.6x0.5mm)
E*4
3000
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3002 Series
Embossed Carrier Tape & Reel Specification — SC70-6
Millimetres
Symbol
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
40.0± 0.20
10P0
USER DIRECTION OF FEED
PIN 1
Inches
Min
1.574±0.008
W
7.70
8.10
0.303
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.096
K0
1.12
1.32
0.044
0.052
0.27 Max
t
0.318
0.010 Max
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
1.5mm
DIA. HOLE
ACCESS HOLE
14.4mm
4.0mm
1.75mm
2.0mm
CL
8mm
4.0mm
13mm
GENERAL INFORMATION
SOT-23 (8mm POCKET PITCH)
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
60mm
180mm
8.4mm
USER DIRECTION OF FEED
PIN 1
D
Embossed Carrier Tape & Reel Specification — μDFN-6 (1.6x1.6x0.5mm)
t
B0
F
W
E
P2
D1
P0
K0
A0
User Feeding Direction
Symbol
Millimetres
Min
Inches
Max
Min
Max
E
1.65
1.85
0.06
0.07
F
3.45
3.55
0.14
0.14
D1
1.00
1.25
0.04
1.50 MIN
D
P0
10P0
3.90
0.05
0.06 MIN
4.10
40.0± 0.20
0.15
0.16
1.57±0.01
W
7.90
8.30
0.31
0.33
P2
1.95
2.05
0.08
0.08
A0
1.78
1.88
0.07
0.07
B0
1.78
1.88
0.07
0.07
K0
0.84
0.94
0.03
0.04
COVER
TAPE
t
0.25 TYP
0.01 TYP
Pin 1 Location
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/15
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