HP ML350 - ProLiant - G6 Specifications

HP ML350 - ProLiant - G6 Specifications
HP ProLiant ML350 G6 Server
Maintenance and Service Guide
Abstract
This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing
hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
Part Number: 513502-008 B
August 2011
Edition: 8
© Copyright 2009, 2011 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation.
Intel and Xeon are trademarks of Intel Corporation in the U.S and other countries.
Contents
Customer self repair ...................................................................................................................... 5
Parts only warranty service ............................................................................................................................ 5
Illustrated parts catalog ............................................................................................................... 16
Mechanical components ............................................................................................................................. 16
System components .................................................................................................................................... 20
Removal and replacement procedures ........................................................................................... 27
Required tools ............................................................................................................................................ 27
Preparation procedures ............................................................................................................................... 27
Power down the server ..................................................................................................................... 27
Extend the server from the rack .......................................................................................................... 28
Remove the server from the rack ........................................................................................................ 29
Access the server rear panel (rack model) ........................................................................................... 29
Safety considerations .................................................................................................................................. 29
Preventing electrostatic discharge ...................................................................................................... 29
Server warnings and cautions............................................................................................................ 29
Front bezel ................................................................................................................................................ 30
Tower foot ................................................................................................................................................. 31
Access panel ............................................................................................................................................. 31
Rack bezel ................................................................................................................................................ 32
Rack rails .................................................................................................................................................. 32
Large redundant fan air baffle ..................................................................................................................... 33
DIMM baffle .............................................................................................................................................. 34
Fan blank .................................................................................................................................................. 35
Fan ........................................................................................................................................................... 35
Power supply blank .................................................................................................................................... 36
Hot-plug power supply ................................................................................................................................ 37
SAS hard drive blank ................................................................................................................................. 37
SAS/SATA hard drive ................................................................................................................................ 38
Hard drive cages ....................................................................................................................................... 38
Standard hard drive cage ................................................................................................................. 39
Optional eight-bay SFF hard drive cage ............................................................................................. 39
Optional two-bay LFF hard drive cage ................................................................................................ 41
Standard hard drive cage backplane ........................................................................................................... 43
Expansion slot cover ................................................................................................................................... 44
Expansion board........................................................................................................................................ 45
Media bay blank ....................................................................................................................................... 46
Battery-backed write cache procedures ......................................................................................................... 47
Battery-backed write cache module .................................................................................................... 47
BBWC battery pack ......................................................................................................................... 48
Recovering data from the battery-backed write cache .......................................................................... 49
Flash-backed write cache procedures ........................................................................................................... 50
Flash-backed write cache module....................................................................................................... 50
Flash-backed write cache capacitor pack............................................................................................ 51
PCI-X expansion cage ................................................................................................................................. 52
Half-height or full-height media device .......................................................................................................... 54
Contents
3
DIMM ....................................................................................................................................................... 56
Heatsink .................................................................................................................................................... 57
Processor................................................................................................................................................... 59
System board ............................................................................................................................................ 65
Power supply backplane ............................................................................................................................. 73
Battery ...................................................................................................................................................... 74
HP Trusted Platform Module......................................................................................................................... 75
Diagnostic tools .......................................................................................................................... 76
Troubleshooting resources ........................................................................................................................... 76
HP ROM-Based Setup Utility ........................................................................................................................ 76
HP Insight Diagnostics ................................................................................................................................ 76
HP Insight Diagnostics survey functionality .................................................................................................... 77
Integrated Management Log ........................................................................................................................ 77
Array Diagnostic Utility ............................................................................................................................... 77
HP Insight Remote Support software ............................................................................................................. 78
HP Insight Server Migration software for ProLiant ........................................................................................... 78
Component identification ............................................................................................................. 79
Front panel components .............................................................................................................................. 79
Front panel LEDs and buttons ....................................................................................................................... 80
Rear panel components .............................................................................................................................. 81
Rear panel LEDs and buttons ....................................................................................................................... 82
System board components .......................................................................................................................... 83
System board LEDs ..................................................................................................................................... 85
System maintenance switch ............................................................................................................... 86
NMI functionality ............................................................................................................................. 86
DIMM identification .................................................................................................................................... 87
SAS/SATA device numbers ......................................................................................................................... 88
SAS and SATA hard drive LEDs ................................................................................................................... 89
SAS and SATA hard drive LED combinations ................................................................................................ 90
Battery pack LEDs ....................................................................................................................................... 91
FBWC module LEDs .................................................................................................................................... 92
Fan locations and configurations ................................................................................................................. 93
Optional hard drive cage jumper location and configuration settings .............................................................. 97
Specifications ............................................................................................................................. 98
Environmental specifications ........................................................................................................................ 98
Mechanical specifications ........................................................................................................................... 98
Power supply specifications ......................................................................................................................... 98
Acronyms and abbreviations ...................................................................................................... 101
Index ....................................................................................................................................... 103
Contents
4
Customer self repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will
ship that part directly to you for replacement. There are two categories of CSR parts:
•
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,
you will be charged for the travel and labor costs of this service.
•
Optional—Parts for which customer self repair is optional. These parts are also designed for customer
self repair. If, however, you require that HP replace them for you, there may or may not be additional
charges, depending on the type of warranty service designated for your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the
Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective
part back to HP within a defined period of time, normally five (5) business days. The defective part must be
returned with the associated documentation in the provided shipping material. Failure to return the defective
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping
and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service provider. For the
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).
Parts only warranty service
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty
service, HP will provide replacement parts free of charge.
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts,
you will be charged for the travel and labor costs of this service.
Réparation par le client (CSR)
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:
Customer self repair 5
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à
votre produit.
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de
retour, et détermine la société de courses ou le transporteur à utiliser.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
(http://www.hp.com/go/selfrepair).
Service de garantie "pièces seules"
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de
rechange fournies par HP ne sont pas facturées.
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per
la sostituzione. Vi sono due categorie di parti CSR:
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un "No" nel Catalogo illustrato dei componenti.
Customer self repair 6
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il
corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).
Servizio di garanzia per i soli componenti
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia
del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da
parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione
e di manodopera per il servizio.
Customer Self Repair
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche
Kosten anfallen.
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das
Customer self repair 7
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den
Kurier-/Frachtdienst.
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
(http://www.hp.com/go/selfrepair).
Parts-only Warranty Service (Garantieservice
ausschließlich für Teile)
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich
für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur
Verfügung.
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch
dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service
berechnet.
Reparaciones del propio cliente
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se
clasifican en dos categorías:
•
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de
desplazamiento y de mano de obra de dicho servicio.
•
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de
servicio de garantía correspondiente al producto.
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el
catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no
Customer self repair 8
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite
la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Servicio de garantía exclusivo de componentes
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las
condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin
cargo adicional alguno.
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por
parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
Customer Self Repair
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het
product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Customer self repair 9
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).
Garantieservice "Parts Only"
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van
de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening
gebracht.
Reparo feito pelo cliente
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.
Existem duas categorias de peças CSR:
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço
postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
(http://www.hp.com/go/selfrepair).
Serviço de garantia apenas para peças
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do
serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 10
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 11
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Illustrated parts catalog
Mechanical components
Item
Description
Spare part
number
Customer self repair
(on page 5)
1
Access panel
511769-001
Mandatory1
2
DIMM baffle
511773-001
Mandatory1
3
Large redundant fan air baffle
511772-001
Mandatory1
4
Front bezel, rack model
511771-001
Mandatory1
5
Front bezel, tower model
511770-001
Mandatory1
Illustrated parts catalog
16
Item
Description
Spare part
number
Customer self repair
(on page 5)
6
Standard SAS/SATA 8-bay hard drive cage, SFF
511782-001
Mandatory1
7
Standard SAS/SATA 6-bay hard drive cage, LFF*
511784-001
Mandatory1
8
Plastics and hardware kit
511788-001
Mandatory1
a) Removable media blank
—
—
b) Retainer card guide
—
—
c) Power supply blank
—
—
d) Foot, carbonite*
—
—
N/A
—
N/A
—
11
Optional SAS/SATA 8-bay hard drive expansion
cage, SFF
(Option kit 507803-B21)
Optional SAS/SATA 2-bay hard drive expansion
cage, LFF*
(Option kit 487936-B21)
Hard drive blank, SFF
392613-001
Mandatory1
12
Hard drive blank, LFF*
389015-001
Mandatory1
9
10
*Not shown
1
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be
charged for the travel and labor costs of this service.
2
Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type
of warranty service designated for your product.
3
No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
2
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.
3
No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.
1
Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
2
Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.
3
No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate
da un “No” nel Catalogo illustrato dei componenti.
1
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
2
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.
3
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.
„Nein“ gekennzeichnet.
1
Illustrated parts catalog
17
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano
de obra de dicho servicio.
2
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al
producto.
3
No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.
1
1
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
3
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
2
Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.
3
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”
(Não), no catálogo de peças ilustrado.
1
Illustrated parts catalog
18
Illustrated parts catalog
19
System components
Item
Description
Spare part
number
Customer self
repair (on page
5)
Hot-plug power supply
—
—
a) AC, 460 W
511777-001
Mandatory1
b) AC, 750 W
511778-001
Mandatory1
c) AC, 1200 W
498152-001
Mandatory1
14
Fan assembly, 92 mm
511774-001
Mandatory1
15
Heatsink
508876-001
Optional2
16
Processor with thermal grease and alcohol pad
—
—
a) 2.26-GHz Intel® Xeon® processor L5520, 60 W**
504584-001
Optional2
b) 2.13-GHz Intel® Xeon® processor L5506, 60 W* **
513597-001
Optional2
c) 1.86-GHz Intel® Xeon® processor E5502, 80 W* **
490075-001
Optional2
d) 2.00-GHz Intel® Xeon® processor E5504, 80 W* **
490074-001
Optional2
e) 2.13-GHz Intel® Xeon® processor E5506, 80 W* **
506013-001
Optional2
System components
13
Illustrated parts catalog
20
Item
17
Description
Spare part
number
Customer self
repair (on page
5)
f) 2.26-GHz Intel® Xeon® processor E5520, 80 W* **
490073-001
Optional2
g) 2.40-GHz Intel® Xeon® processor E5530, 80 W* **
490072-001
Optional2
h) 2.53-GHz Intel® Xeon® processor E5540, 80 W* **
490071-001
Optional2
i) 2.66-GHz Intel® Xeon® processor X5550, 95 W* **
490070-001
Optional2
j) 2.80-GHz Intel® Xeon® processor X5560, 95 W* **
490069-001
Optional2
k) 2.93-GHz Intel® Xeon® processor X5570, 95 W* **
506012-001
Optional2
l) 3.20-GHz Intel® Xeon® processor X5672, 95 W* **
638135-001
Optional2
m) 3.06-GHz Intel® Xeon® processor X5675, 95 W* **
638134-001
Optional2
n) 1.60-GHz Intel® Xeon® processor E5603, 80 W* **
628700-001
Optional2
o) 2.13-GHz Intel® Xeon® processor E5606, 80 W* **
628699-001
Optional2
p) 2.26-GHz Intel® Xeon® processor E5607, 80 W* **
628698-001
Optional2
q) 2.40-GHz Intel® Xeon® processor E5645, 80 W* **
628696-001
Optional2
r) 2.53-GHz Intel® Xeon® processor E5649, 80 W* **
628695-001
Optional2
s) 2.66-GHz Intel® Xeon® processor E5640, 80 W* **
594885-001
Optional2
t) 2.53-GHz Intel® Xeon® processor E5630, 80 W* **
594886-001
Optional2
u) 2.40-GHz Intel® Xeon® processor E5620, 80 W* **
594887-001
Optional2
v) 2.26-GHz Intel® Xeon® processor E5507, 80 W* **
594888-001
Optional2
w) 2.13-GHz Intel® Xeon® processor L5630, 40 W* **
594891-001
Optional2
x) 2.00-GHz Intel® Xeon® processor E5503, 80 W* **
594889-001
Optional2
y) 2.66-GHz Intel® Xeon® processor X5650, 95 W* **
594884-001
Optional2
z) 2.8-GHz Intel® Xeon® processor X5660, 95 W* **
594883-001
Optional2
aa) 2.93-GHz Intel® Xeon® processor X5670, 95 W* **
594882-001
Optional2
3-V lithium battery
234556-001
Mandatory1
Memory
18
19
RDIMM
—
—
a) 2-GB PC3-10600 (DDR3-1333) (RoHS)
501533-001
Mandatory1
b) 4-GB PC3-10600 (DDR3-1333) (RoHS)*
501534-001
Mandatory1
c) 4-GB PC3-8500 (DDR3-1066) (RoHS)*
595424-001
Mandatory1
d) 8-GB PC3-10600 (DDR3-1066) (RoHS)*
501536-001
Mandatory1
e) 16-GB PC3-8500 (DDR3-1066) (RoHS)
501538-001
Mandatory1
f) PC3L-8500 (DDR3-1333) 4-GB (low voltage)* ***
595422-001
Mandatory1
g) PC3L-8500 (DDR3-1333) 8-GB (low voltage)* ***
595423-001
Mandatory1
h) 16-GB 2RX4 PC3L-10600R-9
632204-001
Mandatory1
UDIMM
—
—
Illustrated parts catalog
21
Item
Description
Spare part
number
Customer self
repair (on page
5)
a) 1-GB PC3-10600 (DDR3-1333) (RoHS)*
501539-001
Mandatory1
b) 2-GB PC3-10600 (DDR3-1333) (RoHS)*
501540-001
Mandatory1
c) 4-GB PC3-10600 (DDR3-1333) (RoHS)*
501541-001
Mandatory1
System board
—
—
a) For systems using Intel 5500 series processors
511775-001
Optional2
b) For systems using Intel 5500 and 5600 series processors*
606019-001
Optional2
21
Power supply backplane
511776-001
Optional2
22
511785-001
Optional2
23
SAS/SATA 8-bay hard drive cage backplane board
assembly, SFF*
SAS/SATA 6-bay hard drive cage backplane board
assembly, LFF*
Optical drives
511787-001
Optional2
24
SATA DVD-ROM drive, 48x
397931-001
Mandatory1
25
SATA DVD-RW drive, 48x*
399404-001
Mandatory1
Boards
20
Miscellaneous
26
Power switch board with cable
511781-001
Optional2
27
DVD-ROM drive signal cable*
413987-001
Mandatory1
28
AC power cord, 1.83 m (6 ft)*
142258-001
Mandatory1
LFF SATA hard drive
—
—
a) 80-GB, 7200-rpm, hot-plug
397551-001
Mandatory1
b) 160-GB, 7200-rpm, hot-plug*
397552-001
Mandatory1
c) 160-GB, 7200-rpm, hot-plug, NCQ*
483095-001
Mandatory1
d) 250-GB, 7200-rpm, hot-plug*
397553-001
Mandatory1
e) 250-GB, 7200-rpm, hot-plug, NCQ*
459318-001
Mandatory1
f) 500-GB, 7200-rpm, hot-plug*
395501-001
Mandatory1
g) 500-GB, 7200-rpm, hot-plug*
495319-001
Mandatory1
h) 750-GB, 7200-rpm, hot-plug, NCQ*
432401-001
Mandatory1
i) 750-GB, 7200-rpm, hot-plug, 3G, NCQ*
459320-001
Mandatory1
j) 1-TB, 7200-rpm, hot-plug, 3G, NCQ*
454273-001
Mandatory1
k) 2-TB, 7200-rpm, hot-plug, 3G, NCQ*
508040-001
Mandatory1
LFF SAS hard drive*
—
—
a) 72-GB, 15,000-rpm, hot-plug
376594-001
Mandatory1
b) 72-GB, 15,000-rpm, hot-plug, dual-port
389343-001
Mandatory1
c) 146-GB, 15,000-rpm, hot-plug
376595-001
Mandatory1
d) 146-GB, 15,000-rpm, hot-plug, dual-port
389344-001
Mandatory1
Options
29
30
Illustrated parts catalog
22
Item
31
32
Description
Spare part
number
Customer self
repair (on page
5)
e) 300-GB, 15,000-rpm, hot-plug, dual-port
416248-001
Mandatory1
f) 300-GB, 15,000-rpm, hot-plug, dual-port
432146-001
Mandatory1
g) 400-GB, 10,000-rpm, hot-plug
456896-001
Mandatory1
h) 450-GB, 15,000-rpm, hot-plug, dual-port
454274-001
Mandatory1
i) 750-GB, 15,000-rpm, hot-plug
461288-001
Mandatory1
j) 1-TB, 15,000-rpm, hot-plug
461289-001
Mandatory1
k) 1-TB, 7200-rpm, hot-plug
508011-001
Mandatory1
l) 2-TB, 7200-rpm, hot-plug
508010-001
Mandatory1
m) 300-GB, 6G/s
586875-001
Mandatory1
n) 450-GB, 6G/s
586876-001
Mandatory1
o) 600-GB, 6G/s
586877-001
Mandatory1
p) 1-TB, 6G/s
601884-001
Mandatory1
q) 2-TB, 6G/s
601883-001
Mandatory1
SFF SATA hard drives*
—
—
a) 120-GB, 5400-rpm
459616-001
Mandatory1
b) 160-GB, 5400-rpm
390158-018
Mandatory1
c) 500-GB, 5400-rpm
390158-016
Mandatory1
d) 60-GB, 5400-rpm, 1.5G, hot-plug
405419-001
Mandatory1
e) 120-GB, 5400-rpm, 1.5G, hot-plug
431908-001
Mandatory1
f) 120-GB, 5400-rpm, hot-plug
459322-001
Mandatory1
g) 250-GB, 5400-rpm, hot-plug
460427-001
Mandatory1
h) 36-GB, SSD
461332-001
Mandatory1
i) 64-GB, SSD
461333-001
Mandatory1
SFF SAS hard drives*
—
—
a) 36-GB, 10,000-rpm, hot-plug, 3G
376596-001
Mandatory1
b) 36-GB, 15,000-rpm, hot-plug, dual-port, 3G
418397-001
Mandatory1
c) 36-GB, 15,000-rpm, hot-plug, 3G
432322-001
Mandatory1
d) 72-GB, 10,000-rpm, hot-plug, 3G
434916-001
Mandatory1
e) 72-GB, 10,000-rpm, hot-plug, dual-port
389346-001
Mandatory1
f) 72-GB, 15,000-rpm, hot-plug, dual-port
418398-001
Mandatory1
g) 72-GB, 10,000-rpm, hot-plug, dual-port, 3G
389346-001
Mandatory1
h) 72-GB, 15,000-rpm, hot-plug, 3G
432321-001
Mandatory1
i) 146-GB, 10,000-rpm, hot-plug, dual-port
418399-001
Mandatory1
j) 146-GB, 10,000-rpm, hot-plug, 3G
432320-001
Mandatory1
Illustrated parts catalog
23
Item
Description
Spare part
number
Customer self
repair (on page
5)
k) 146-GB, 10,000-rpm, hot-plug, dual-port, 6G
507283-001
Mandatory1
l) 300-GB, 10,000-rpm, hot-plug, dual-port
493083-001
Mandatory1
m) 300-GB, 10,000-rpm, hot-plug, dual-port, 6G
507284-001
Mandatory1
n) 72-GB 6GB/s, 15,000-rpm
586871-001
Mandatory1
o) 146-GB 6GB/s, 10,000-rpm
507129-002
Mandatory1
p) 146-GB 6GB/s, 15,000-rpm
507129-010
Mandatory1
q) 300-GB 6GB/s, 10,000-rpm
507129-004
Mandatory1
r) 450-GB 6GB/s, 10,000-rpm
507129-012
Mandatory1
s) 500-GB 6GB/s, 7,200-rpm
507129-006
Mandatory1
t) 600-GB 6GB/s, 10,000-rpm
507129-014
Mandatory1
SATA Midline (MDL) Solid State Drive
—
—
a) 60-GB, hot-plug*
539557-008
Mandatory1
b) 120-GB, hot-plug*
539557-010
Mandatory1
34
Keyboard*
355630-001
Mandatory1
35
Mouse*
344704-001
Mandatory1
36
PCI-X expansion cage, two-slot assembly*
439400-001
Optional2
37
Smart Array P410i Controller cache module, 256-MB
462974-001
Optional2
38
Smart Array P410i Controller cache module, 512-MB*
562975-001
Optional2
39
Smart Array P410i Controller battery pack*
488138-001
Optional2
40
Optional2
42
Smart Array P410i Controller battery cable assembly, 0.3 m
409124-001
(11.5 in)*
Smart Array P410i Controller battery cable assembly, 0.6 m (24 462976-001
in)*
Trusted Platform Module*
505836-001
43
Battery cable, 0.6 m (24 in)*
488138-001
Mandatory1
44
Miscellaneous cable kit *
511789-001
Mandatory1
a) SATA data, 0.76 (30 in)
—
—
b) SATA power
—
—
c) Mini-SAS to Mini-SAS, 0.46 m (18 in)
—
—
d) BBWC battery power, 0.6 m (24 in)*
—
—
45
FBWC capacitor pack*
587324-001
Mandatory1
46
FBWC cache module, 512-MB*
578882-001
Mandatory1
47
FBWC cache module, 1-GB*
505908-001
Mandatory1
33
41
Optional2
No³
*Not shown
** Do not mix single-, dual-, or quad-core processors or processors with different speeds or cache sizes.
*** If LVDIMMs are mixed with standard DDR3 DIMMs on the same server, the LVDIMMs operate at 1.5V. LVDIMMs are
only supported for use with the Intel® Xeon® 5600 series of processors.
1
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be
charged for the travel and labor costs of this service.
Illustrated parts catalog
24
Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type
of warranty service designated for your product.
3
No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.
2
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
2
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.
3
No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.
1
Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
2
Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.
3
No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate
da un “No” nel Catalogo illustrato dei componenti.
1
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
2
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.
3
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.
„Nein“ gekennzeichnet.
1
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano
de obra de dicho servicio.
2
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al
producto.
3
No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.
1
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
3
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
1
Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
1
Illustrated parts catalog
25
Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.
3
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”
(Não), no catálogo de peças ilustrado.
2
Illustrated parts catalog
26
Removal and replacement procedures
Required tools
You need the following items for some procedures:
•
T-10/T-15 Torx screwdriver
•
HP Insight Diagnostics software ("HP Insight Diagnostics" on page 76)
Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the
following procedures:
•
Extend the server from the rack (on page 28).
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet,
you can use the locking feature of the rack rails to support the server and gain access to internal
components.
For more information about telco rack solutions, refer to the RackSolutions.com website
(http://www.racksolutions.com/hp).
•
Power down the server (on page 27).
If you must remove a server from a rack or a non-hot-plug component from a server, power down the
server.
•
Remove the server from the rack (on page 29).
If the rack environment, cabling configuration, or the server location in the rack creates awkward
conditions, remove the server from the rack.
•
Access the product rear panel ("Access the server rear panel (rack model)" on page 29).
If you are performing certain service procedures, access the product rear panel.
Power down the server
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
1.
Back up the server data.
2.
Shut down the operating system as directed by the operating system documentation.
Removal and replacement procedures
27
NOTE: If the operating system automatically places the server in Standby mode, omit the next
step.
3.
Press the Power On/Standby button to place the server in Standby mode. When the server activates
Standby power mode, the system power LED changes to amber.
IMPORTANT: Pressing the UID button illuminates the blue UID LEDs on the front and rear panels.
In a rack environment, this feature facilitates locating a server when moving between the front and
rear of the rack.
4.
Disconnect the power cords.
The system is now without power.
Extend the server from the rack
1.
Power down the server (on page 27).
2.
Pull down the quick-release levers on each side of the server to release the server from the rack.
IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access
internal components.
3.
Extend the server on the rack rails until the server rail-release latches engage.
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is
adequately stabilized before extending a component from the rack.
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release
latches and sliding the server into the rack. The sliding rails could pinch your fingers.
4.
After performing the installation or maintenance procedure, press the rail-release latches and slide the
server back into the rack.
Removal and replacement procedures
28
Remove the server from the rack
To remove the server from an HP, Compaq branded, telco, or third-party rack:
1.
Power down the server (on page 27).
2.
Extend the server from the rack (on page 28).
3.
Disconnect the cabling and remove the server from the rack. For more information, refer to the
documentation that ships with the rack mounting option.
4.
Place the server on a sturdy, level surface.
Access the server rear panel (rack model)
If the procedure requires accessing the server rear panel, unlock the cable management arm and swing the
arm away from the server. For information on unlocking the cable management arm, refer to the installation
instructions that ship with the 3-7U Quick Deploy Rail System.
Safety considerations
Before performing service procedures, review all the safety information.
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system
or handling parts. A discharge of static electricity from a finger or other conductor may damage system
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
•
Avoid hand contact by transporting and storing products in static-safe containers.
•
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
•
Place parts on a grounded surface before removing them from their containers.
•
Avoid touching pins, leads, or circuitry.
•
Always be properly grounded when touching a static-sensitive component or assembly.
Server warnings and cautions
Before installing a server, be sure that you understand the following warnings and cautions.
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all
times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed against it.
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from
the server.
Removal and replacement procedures
29
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
Front bezel
This server has a removable bezel that must be unlocked and opened before accessing the front panel
components. The bezel should be kept closed during normal server operations.
Use the key provided with the server to unlock the bezel with a clockwise turn.
If necessary, remove the bezel.
CAUTION: To avoid breaking the bezel, remove the bezel before placing the server on its side.
Removal and replacement procedures
30
For operations involving removable media bay access, the media bay panel can be removed from the bezel.
Tower foot
To remove the component:
1.
Power down the server (on page 27).
2.
Remove the tower bezel ("Front bezel" on page 30).
3.
Place the server on its side.
4.
Remove the foot.
To replace the component, reverse the removal procedure.
Access panel
Removal and replacement procedures
31
CAUTION: Do not operate the server with the access panel removed. Operating the server in this
manner results in improper airflow and improper cooling that can lead to thermal damage.
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Extend the server from the rack (on page 28).
o
Remove the tower front bezel. ("Front bezel" on page 30)
3.
If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.
4.
Slide the access panel back about 1.5 cm (0.5 in).
5.
Lift and remove the access panel.
Turn the access panel over to locate labeling with information about options installation, LEDs, and
switch settings.
To replace the component, reverse the removal procedure.
Rack bezel
To remove the component:
1.
Power down the server (on page 27).
2.
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Remove the bezel.
To replace the component, reverse the removal procedure.
Rack rails
To remove the component:
Removal and replacement procedures
32
1.
Power down the server (on page 27).
2.
Remove the server from the rack (on page 29).
3.
Use a flat-head screwdriver to lift the spring tab.
4.
Slide the rail forward and remove it from the server.
5.
Repeat the steps above to remove the other rail.
To replace the component, reverse the removal procedure.
Large redundant fan air baffle
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
3.
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
Remove the access panel ("Access panel" on page 31).
Removal and replacement procedures
33
4.
Remove the large redundant fan air baffle.
To replace the component, reverse the removal procedure.
DIMM baffle
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Remove the large redundant fan air baffle, if installed ("Large redundant fan air baffle" on page 33).
5.
Remove the DIMM baffle.
Removal and replacement procedures
34
To replace the component, reverse the removal procedure.
Fan blank
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Remove the large redundant fan air baffle, if installed ("Large redundant fan air baffle" on page 33).
5.
Remove the fan blank.
To replace the component, reverse the removal procedure.
Fan
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Remove the large redundant fan air baffle, if installed ("Large redundant fan air baffle" on page 33).
5.
Disconnect the fan cable.
Removal and replacement procedures
35
6.
Remove the fan.
To replace the component, reverse the removal procedure.
Power supply blank
To remove the component:
1.
Access the product rear panel ("Access the server rear panel (rack model)" on page 29).
2.
Remove the power supply blank.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or
power supply blank to cool before touching it.
To replace the component, reverse the removal procedure.
Removal and replacement procedures
36
Hot-plug power supply
WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt
to repair it. Replace it only with the specified spare part.
CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless
both bays are populated with power supplies.
To remove the component:
1.
Access the product rear panel ("Access the server rear panel (rack model)" on page 29).
2.
Disconnect the power cord from the AC source.
3.
Disconnect the power cord from the power supply.
4.
Remove the power supply.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To replace the component, reverse the removal procedure.
SAS hard drive blank
CAUTION: For proper cooling do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
Removal and replacement procedures
37
Remove the component as indicated.
To replace the blank, slide the blank into the bay until it locks into place.
SAS/SATA hard drive
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To remove the component:
1.
Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and
SATA hard drive LED combinations" on page 90).
2.
Back up all server data on the hard drive.
3.
Remove the hard drive.
To replace the component, reverse the removal procedure.
Hard drive cages
The server supports the following hard drive cages:
•
Standard six-bay LFF or eight-bay SFF hard drive cage ("Standard hard drive cage" on page 39)
•
Optional eight-bay SFF hard drive cage (on page 39)
•
Optional two-bay LFF hard drive cage (on page 41)
For jumper settings, see "Optional hard drive cage jumper location and configuration settings (on page
97)."
Removal and replacement procedures
38
Standard hard drive cage
The procedure is the same for both the standard six-bay LFF hard drive cage and the standard eight-bay SFF
hard drive cage.
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Place the tower server on its side.
4.
Remove the access panel ("Access panel" on page 31).
5.
Disconnect all cables from the rear of the hard drive cage.
6.
Remove the hard drive cage.
7.
Remove all hard drives ("SAS/SATA hard drive" on page 38).
To replace the component, reverse the removal procedure.
Optional eight-bay SFF hard drive cage
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Place the tower server on its side.
4.
Remove the access panel ("Access panel" on page 31).
5.
Remove all hard drives ("SAS/SATA hard drive" on page 38).
6.
Disconnect all cables from the rear of the hard drive cage.
Removal and replacement procedures
39
NOTE: Remove the shipping screw, if installed, before removing the hard drive cage.
7.
Remove the hard drive cage.
To replace the component:
1.
Using a T-15 Torx screwdriver, remove the sleeve from the spare hard drive cage.
Removal and replacement procedures
40
2.
Install the SFF hard drive cage into the server.
3.
Connect all cables to the spare hard drive cage.
CAUTION: Always populate each media bay with either a device or a blank. Proper airflow can
only be maintained when the bays are populated. Unpopulated drive bays can lead to improper
cooling and thermal damage.
4.
Install any hard drives or blanks.
5.
Install the access panel.
6.
Do one of the following:
7.
o
Close or install the tower bezel, as needed.
o
Slide the server back into the rack.
Power up the server.
Optional two-bay LFF hard drive cage
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Place the tower server on its side.
4.
Remove the access panel ("Access panel" on page 31).
5.
Remove all hard drives ("SAS/SATA hard drive" on page 38).
6.
Disconnect all cables from the rear of the hard drive cage.
NOTE: Remove the shipping screw, if installed, before removing the hard drive cage.
Removal and replacement procedures
41
7.
Remove the hard drive cage.
To replace the component:
1.
Slide the spare hard drive cage about three-fourths of the way into the bay, leaving room to connect
cables at the back of the drive cage.
2.
Connect all cables to the spare hard drive cage.
3.
Slide the optional hard drive cage fully into the bay until it clicks.
CAUTION: Always populate each media bay with either a device or a blank. Proper airflow can
only be maintained when the bays are populated. Unpopulated drive bays can lead to improper
cooling and thermal damage.
4.
Install any hard drives or blanks.
5.
Install the access panel.
6.
Do one of the following:
o
Close or install the tower bezel, as needed.
Removal and replacement procedures
42
o
7.
Slide the server back into the rack.
Power up the server.
Standard hard drive cage backplane
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Place the tower server on its side.
4.
Remove the access panel ("Access panel" on page 31).
5.
Disconnect all cables from the rear of the hard drive cage.
6.
Remove the hard drive cage ("Standard hard drive cage" on page 39).
7.
Remove all hard drives ("SAS/SATA hard drive" on page 38).
8.
Remove the hard drive cage backplane:
o
Six-bay LFF hard drive cage backplane
Removal and replacement procedures
43
o
Eight-bay SFF hard drive cage backplane
To replace the component, reverse the removal procedure.
Expansion slot cover
To remove the component:
1.
Do one of the following:
o
Unlock and remove the bezel ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
2.
Remove the access panel ("Access panel" on page 31).
3.
Push the release latches on the expansion board retainer, and then open the retainer.
Removal and replacement procedures
44
4.
Remove the expansion slot cover.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all PCI slots have either an expansion slot cover or an expansion board installed.
To replace the component, reverse the removal procedure.
Expansion board
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the expansion boards.
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Unlock and remove the bezel ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Disconnect any internal or external cables from the expansion board.
Removal and replacement procedures
45
5.
Push the release latches on the expansion board retainer, and then open the retainer.
6.
Remove the T-15 Torx screw securing the expansion board, if necessary.
7.
Remove the expansion board.
To replace the component, reverse the removal procedure.
Media bay blank
To remove the component:
1.
Open or remove the tower bezel ("Front bezel" on page 30).
Removal and replacement procedures
46
2.
Remove the media bay blank.
To replace the component, reverse the removal procedure.
Battery-backed write cache procedures
Two types of procedures are provided for the BBWC option:
•
•
Removal and replacement of failed components:
o
Removing the cache module ("Battery-backed write cache module" on page 47)
o
Removing the battery pack ("BBWC battery pack" on page 48)
Recovery of cached data from a failed server ("Recovering data from the battery-backed write cache"
on page 49)
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
Battery-backed write cache module
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
3.
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
Remove the access panel ("Access panel" on page 31).
Removal and replacement procedures
47
4.
Remove the cache module.
To replace the component, reverse the removal procedure.
BBWC battery pack
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Disconnect the BBWC cable from the cache module.
Removal and replacement procedures
48
5.
Remove the battery pack.
To replace the component, reverse the removal procedure.
Recovering data from the battery-backed write cache
If the server fails, use the following procedure to recover data temporarily stored in the BBWC.
CAUTION: Before starting this procedure, read the information about protecting against
electrostatic discharge ("Preventing electrostatic discharge" on page 29).
1.
2.
Perform one of the following:
o
Set up a recovery server station using an identical server model. Do not install any internal drives or
BBWC in this server. (HP recommends this option.)
o
Find a server that has enough empty drive bays to accommodate all the drives from the failed server
and that meets all the other requirements for drive and array migration.
Power down the failed server ("Power down the server" on page 27). If any data is stored in the cache
module, a green LED on the module flashes every 2 seconds.
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
3.
Transfer the hard drives from the failed server to the recovery server station.
4.
Perform one of the following:
5.
o
If the array controller has failed, remove the cache module ("Battery-backed write cache module" on
page 47) and battery pack ("BBWC battery pack" on page 48) from the failed array controller, and
install the cache module and battery pack on an array controller in the recovery server.
o
If the server has failed, remove the controller, cache module ("Battery-backed write cache module"
on page 47), and battery pack ("BBWC battery pack" on page 48) from the failed server, and
install the controller, cache module, and battery pack in the recovery server.
Power up the recovery server. A 1759 POST message is displayed, stating that valid data was flushed
from the cache. This data is now stored on the drives in the recovery server. You can now transfer the
drives (and controller, if one was used) to another server.
Removal and replacement procedures
49
Flash-backed write cache procedures
Two types of procedures are provided for the FBWC option:
•
•
Removal and replacement of failed components:
o
Removing the cache module ("Flash-backed write cache module" on page 50)
o
Removing the capacitor pack ("Flash-backed write cache capacitor pack" on page 51)
Recovery of cached data from a failed server ("Recovering data from the battery-backed write cache"
on page 49)
CAUTION: Do not detach the cable that connects the battery pack or capacitor pack to the cache
module. Detaching the cable causes any unsaved data in the cache module to be lost.
Flash-backed write cache module
To remove the component:
CAUTION: Do not use this controller with cache modules designed for other controller models,
because the controller can malfunction and you can lose data. Also, do not transfer this cache
module to a different controller module, because you can lose data.
1.
Back up all data.
2.
Close all applications.
3.
Power down the server (on page 27).
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be
powered down and the last to be powered back up. Taking this precaution ensures that the system
does not erroneously mark the drives as failed when the server is powered up.
4.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 31).
6.
If the existing cache module is connected to a capacitor pack, observe the FBWC module LEDs (on
page 92):
o
If the amber LED is flashing, data is trapped in the cache. Restore system power, and restart this
procedure from step 1.
o
If the amber LED is not illuminated, remove the controller from the server, and then continue with the
next step.
Removal and replacement procedures
50
7.
Open the ejector latches on each side of the cache module connector. Normally, the cache module is
ejected from the cache module connector. If the module is not ejected automatically, remove the cache
module.
8.
If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the
connector on the top of the cache module.
To replace the component, reverse the removal procedure.
CAUTION: To prevent damage to the cache module during installation, be sure the cache
module is fully inserted before pressing down.
Flash-backed write cache capacitor pack
To remove the component:
1.
Back up all data.
2.
Close all applications.
3.
Power down the server (on page 27).
Removal and replacement procedures
51
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be
powered down and the last to be powered back up. Taking this precaution ensures that the system
does not erroneously mark the drives as failed when the server is powered up.
4.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 31).
6.
If the capacitor pack is connected to the cache module, disconnect the capacitor pack cable from the
connector on the top of the cache module.
7.
Remove the capacitor pack.
To replace the component, reverse the removal procedure.
PCI-X expansion cage
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the PCI expansion cage.
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Unlock and remove the bezel ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Remove the rack bezel (rack servers only) ("Rack bezel" on page 32).
Removal and replacement procedures
52
5.
Remove the four T-15 screws from the hard drive cage, and then slide the hard drive cage partially out
of the chassis.
6.
Disconnect any external cables from the PCI-X expansion boards.
7.
Disconnect the power cable extension and the signal cable from the PCI-X expansion cage.
8.
Pull the spring-loaded locking pin out of its socket.
Removal and replacement procedures
53
9.
Remove the PCI-X expansion cage.
10.
Remove any expansion boards.
To replace the components, reverse the removal procedure.
Half-height or full-height media device
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
3.
o
Unlock and remove the bezel ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
Remove the access panel ("Access panel" on page 31).
Removal and replacement procedures
54
4.
Disconnect data and power cables:
5.
Remove the device:
o
Half-height
Removal and replacement procedures
55
o
Full-height
To replace the component, reverse the removal procedure.
IMPORTANT: Be sure to connect the right-angle end of the SATA data cable to the system board.
Connecting it to the SATA drive may interfere with other installed media bay devices.
IMPORTANT: If both SATA and PATA optical devices are installed simultaneously, only one can
boot at a time. Boot priority will go to SATA if media is inserted into the SATA optical drive. Boot
priority for PATA is not configurable. To boot PATA, remove the media from the SATA optical
device, or remove the SATA optical device.
DIMM
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix
these two types causes the server to halt during BIOS initialization.
To identify the DIMMs installed in the server, see "DIMM identification (on page 87)."
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Unlock and remove the bezel ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Remove the large redundant fan air baffle, if installed ("Large redundant fan air baffle" on page 33).
5.
Remove the DIMM baffles ("DIMM baffle" on page 34).
6.
Remove a fan, if necessary ("Fan" on page 35).
7.
Open the DIMM slot latches.
Removal and replacement procedures
56
8.
Remove the DIMM.
To replace the component, reverse the removal procedure.
For DIMM configuration information, see the server user guide.
Heatsink
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Place the tower server on its side.
4.
Remove the access panel ("Access panel" on page 31).
5.
Remove the large redundant fan air baffle, if installed ("Large redundant fan air baffle" on page 33).
6.
Open the heatsink locking levers.
Removal and replacement procedures
57
7.
Remove the heatsink.
To replace the component:
1.
Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to
evaporate before continuing.
2.
Remove the heatsink protective cover.
3.
Install the heatsink.
Removal and replacement procedures
58
4.
Close the heatsink locking levers.
5.
Install the large redundant fan air baffle, if removed.
6.
Install the access panel.
7.
Do one of the following:
o
Close or install the tower bezel, as needed.
o
Slide the server back into the rack.
Processor
The server supports single- and dual-processor operation. With two processors installed, the server supports
boot functions through the processor installed in processor socket 1. However, if processor 1 fails, then the
system boots automatically from processor 2 and displays a processor failure message.
CAUTION: To avoid damage to the processor and system board, only authorized personnel
must replace or install the processor in this server.
CAUTION: To help avoid damage to the processor and system board, do not install the
processor without using the processor installation tool.
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor
configurations must contain processors with the same part number.
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Place the tower server on its side.
4.
Remove the access panel ("Access panel" on page 31).
5.
Remove the large redundant fan air baffle, if installed ("Large redundant fan air baffle" on page 33).
Removal and replacement procedures
59
6.
Remove the heatsink.
7.
Open the processor locking lever and the processor socket retaining bracket.
8.
Using the processor tool, remove the processor from the system board:
a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly.
b. Press in on the plastic tabs, and then place the tool on the processor.
Removal and replacement procedures
60
c.
9.
Release the tabs, and then carefully lift the processor and tool straight up.
Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool.
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,
especially the contact area.
To replace a processor:
Removal and replacement procedures
61
1.
Carefully insert the processor into the processor installation tool. Handle the processor by the edges
only, and do not touch the bottom of the processor, especially the contact area.
Removal and replacement procedures
62
2.
Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install
the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To
avoid damage to the system board:
• Never install or remove a processor without using the processor installation tool.
• Do not touch the processor socket contacts.
• Do not tilt or slide the processor when lowering the processor into the socket.
Removal and replacement procedures
63
3.
Press and hold the tabs on the processor installation tool to separate it from the processor, and then
remove the tool.
4.
Close the processor socket retaining bracket and the processor locking lever.
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor
locking lever. The lever should close without resistance. Forcing the lever closed can damage the
processor and socket, requiring system board replacement.
5.
Install the heatsink.
Removal and replacement procedures
64
6.
Close the heatsink locking levers.
7.
Install the large redundant fan air baffle, if removed.
8.
Install the access panel.
9.
Do one of the following:
10.
o
Close or install the tower bezel, as needed.
o
Slide the server back into the rack.
Power up the server.
System board
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
3.
Remove the access panel ("Access panel" on page 31).
4.
Disconnect all cables connected to the system board ("System board components" on page 83).
5.
Remove all expansion boards ("Expansion board" on page 45).
6.
Remove the large redundant fan air baffle, if installed ("Large redundant fan air baffle" on page 33).
7.
Remove the DIMM baffles ("DIMM baffle" on page 34).
8.
Remove all fans ("Fan" on page 35).
9.
Remove all DIMMs ("DIMM" on page 56).
10.
Remove the battery-backed write cache module, if installed ("Battery-backed write cache module" on
page 47).
Removal and replacement procedures
65
11.
Remove the heatsink ("Heatsink" on page 57).
CAUTION: To avoid damage to the processor:
• Handle the processor only by the edges.
• Do not touch the bottom of the processor, especially the contact area.
CAUTION: To avoid damage to the system board:
• Do not touch the processor socket contacts.
• Always install the processor socket cover after removing the processor from the socket.
• Do not tilt or slide the processor when lowering the processor into the socket.
CAUTION: Removal of the processor or heatsink renders the thermal layer between the
processor and heatsink useless. Clean the component with the provided alcohol swab, then add
thermal grease.
12.
Open the processor locking lever and the processor socket retaining bracket.
13.
Using the processor tool, remove the processor from the system board:
Removal and replacement procedures
66
a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly.
b. Press in on the plastic tabs, and then place the tool on the processor.
c.
14.
Release the tabs, and then carefully lift the processor and tool straight up.
Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool.
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,
especially the contact area.
15.
Loosen the two system board thumbscrews.
Removal and replacement procedures
67
16.
Using the system board tray handles, slide the tray forward and remove the failed system board.
To replace the component:
1.
Install the spare system board in the server before installing the processor.
CAUTION: Failure to completely open the processor locking lever prevents the processor from
seating during installation, leading to hardware damage.
Removal and replacement procedures
68
2.
Open the processor locking lever and the processor socket retaining bracket. Do not remove the
processor socket cover.
IMPORTANT: Be sure the processor remains inside the processor installation tool.
3.
If the processor has separated from the installation tool, carefully re-insert the processor in the tool.
Handle the processor by the edges only, and do not touch the bottom of the processor, especially the
contact area.
Removal and replacement procedures
69
4.
Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To
avoid damage to the system board:
• Never install or remove a processor without using the processor installation tool.
• Do not touch the processor socket contacts.
• Do not tilt or slide the processor when lowering the processor into the socket.
Removal and replacement procedures
70
5.
Press the tabs on the processor installation tool to separate it from the processor, and then remove the
tool.
6.
Close the processor socket retaining bracket and the processor locking lever. The processor socket
cover is automatically ejected. Remove the cover.
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor
locking lever. The lever should close without resistance. Forcing the lever closed can damage the
processor and socket, requiring system board replacement.
7.
Install the processor socket cover onto the processor socket of the failed system board.
8.
Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.
Allow the alcohol to evaporate before continuing.
Removal and replacement procedures
71
9.
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.
10.
Install the heatsink.
11.
Close the heatsink locking levers.
IMPORTANT: Install all components with the same configuration that was used on the failed
system board.
12.
Install all components removed from the failed system board.
13.
Connect the cables to the system board.
14.
Install the access panel.
15.
Do one of the following:
16.
o
Install and lock the bezel.
o
Slide the server back into the rack.
Power up the server.
After you replace the system board, you must re-enter the server serial number and the product ID.
1.
During the server startup sequence, press the F9 key to access RBSU.
Removal and replacement procedures
72
2.
Select the Advanced Options menu.
3.
Select Service Options.
4.
Select Serial Number. The following warnings appear:
WARNING! WARNING! WARNING! The serial number is loaded into the system during
the manufacturing process and should NOT be modified. This option should only
be used by qualified service personnel. This value should always match the
serial number sticker located on the chassis.
Warning: The serial number should ONLY be modified by qualified personnel.
This value should always match the serial number located on the chassis.
5.
Press the Enter key to clear the warning.
6.
Enter the serial number and press the Enter key.
7.
Select Product ID. The following warning appears:
Warning: The Product ID should ONLY be modified by qualified personnel. This
value should always match the Product ID on the chassis.
8.
Enter the product ID and press the Enter key.
9.
Press the Esc key to close the menu.
10.
Press the Esc key to exit RBSU.
11.
Press the F10 key to confirm exiting RBSU. The server automatically reboots.
Power supply backplane
To remove the component:
1.
Power down the server (on page 27).
2.
Remove the power supplies ("Hot-plug power supply" on page 37).
3.
Do one of the following:
o
Unlock and remove the bezel ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
4.
Remove the access panel ("Access panel" on page 31).
5.
Remove the large redundant fan air baffle ("Large redundant fan air baffle" on page 33).
6.
Remove the DIMM baffles ("DIMM baffle" on page 34).
7.
Remove all fans ("Fan" on page 35).
8.
Remove all expansion boards ("Expansion board" on page 45).
9.
Remove the system board ("System board" on page 65).
For this procedure, removing the processors, heatsinks, DIMMs, and cache module from the system
board is not required.
10.
Disconnect the cables from the power supply backplane.
Removal and replacement procedures
73
11.
Remove the power supply backplane.
To replace the component, reverse the removal procedure.
Battery
If the server no longer automatically displays the correct date and time, you may need to replace the battery
that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
•
•
•
•
Do not attempt to recharge the battery.
Do not expose the battery to temperatures higher than 60°C (140°F).
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Replace only with the spare designated for this product.
To remove the component:
1.
Power down the server (on page 27).
2.
Do one of the following:
3.
o
Open or remove the tower bezel, as needed ("Front bezel" on page 30).
o
Extend the server from the rack (on page 28).
Remove the access panel ("Access panel" on page 31).
Removal and replacement procedures
74
4.
Remove the battery.
IMPORTANT: Replacing the system board battery resets the system ROM to its default
configuration. After replacing the battery, reconfigure the system through RBSU.
To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
HP Trusted Platform Module
The TPM is not a customer-removable part.
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,
administrators should consider the system compromised and take appropriate measures to ensure
the integrity of the system data.
If you suspect a TPM board failure, leave the TPM installed and remove the system board ("System board" on
page 65). Contact an HP authorized service provider for a replacement system board and TPM board.
Removal and replacement procedures
75
Diagnostic tools
Troubleshooting resources
The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and
comprehensive courses of action for fault isolation and identification, error message interpretation, issue
resolution, and software maintenance on ProLiant servers and server blades. This guide includes
problem-specific flowcharts to help you navigate complex troubleshooting processes. To view the guide,
select a language:
•
English (http://www.hp.com/support/ProLiant_TSG_en)
•
French (http://www.hp.com/support/ProLiant_TSG_fr)
•
Italian (http://www.hp.com/support/ProLiant_TSG_it)
•
Spanish (http://www.hp.com/support/ProLiant_TSG_sp)
•
German (http://www.hp.com/support/ProLiant_TSG_gr)
•
Dutch (http://www.hp.com/support/ProLiant_TSG_nl)
•
Japanese (http://www.hp.com/support/ProLiant_TSG_jp)
HP ROM-Based Setup Utility
RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration
activities that can include the following:
•
Configuring system devices and installed options
•
Enabling and disabling system features
•
Displaying system information
•
Selecting the primary boot controller
•
Configuring memory options
•
Language selection
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or
the HP website (http://www.hp.com/support/smartstart/documentation).
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server
installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS
is not running. To run this utility, launch the SmartStart CD.
Diagnostic tools
76
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft® Windows® and Linux
versions, the utility helps to ensure proper system operation.
For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).
HP Insight Diagnostics survey functionality
HP Insight Diagnostics (on page 76) provides survey functionality that gathers critical hardware and software
information on ProLiant servers.
This functionality supports operating systems that may not be supported by the server. For operating systems
supported by the server, see the HP website (http://www.hp.com/go/supportos).
If a significant change occurs between data-gathering intervals, the survey function marks the previous
information and overwrites the survey data files to reflect the latest changes in the configuration.
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be
installed through the HP PSP.
NOTE: The current version of SmartStart provides the memory spare part numbers for the server.
To download the latest version, see the HP website (http://www.hp.com/support).
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event
with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
•
From within HP SIM
•
From within Survey Utility
•
From within operating system-specific IML viewers
o
For NetWare: IML Viewer
o
For Windows®: IML Viewer
o
For Linux: IML Viewer Application
•
From within the iLO 2 user interface
•
From within HP Insight Diagnostics (on page 76)
For more information, see the Management CD in the HP Insight Foundation suite for ProLiant.
Array Diagnostic Utility
The HP Array Diagnostics Utility is a web-based application that creates a report of all HP storage controllers
and disk drives. This report provides vital information to assist in identifying faults or conditions that may
require attention. ADU can be accessed from the SmartStart CD or downloaded from the HP website
(http://www.hp.com).
Diagnostic tools
77
HP Insight Remote Support software
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if
configured and available in your country. The software is available in two variants:
•
HP Insight Remote Support Standard: This software supports server and storage devices and is
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive
notification but do not need proactive service delivery and integration with a management platform.
•
HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight
Remote Support Advanced.
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).
To download the software, go to Software Depot (http://www.software.hp.com).
Select Insight Remote Support from the menu on the right.
HP Insight Server Migration software for ProLiant
The HP Insight Server Migration software for ProLiant (SMP) enables administrators to upgrade or replace an
existing server through server migration. SMP provides an automated, accurate, and affordable method of
migrating existing servers and their content to the latest server technologies.
SMP automates the migration of the operating system, applications, and data from one server to another
without errors, eliminating the need for manual redeployment of these elements on the new server. During the
migration process, the software automatically loads new drivers, required for boot, on the destination server.
The wizard-based user interface simplifies the migration process and requires little experience or training.
For more information about the SMP, see the HP website (http://www.hp.com/go/migrate).
Diagnostic tools
78
Component identification
Front panel components
Item
Description
1
Power On/Standby button
2
UID button
3
USB connectors (2)
4
Hot-plug hard drive bays (8-bay SFF drive cage model)
5
Removable media bays
6
Optical drive
Component identification
79
Front panel LEDs and buttons
Item
Description
Status
1
System power LED
Green = Power on
Flashing green = Waiting for power due to group power capping
Amber = System in standby, but power still applied
Off = Power cord not attached or power supply failure
2
Health LED
Green = Normal
Amber = System degraded. To identify the component in a degraded
state, see the system board LEDs (on page 85).
Red = System critical. To identify the component in a critical state, see
the system board LEDs (on page 85).
Off = Normal (when in standby mode)
3
Power cap LED
Green = Power cap configured
Flashing amber = Power cap exceeded
Off = Server in standby or power cap disabled
4
NIC 1 activity LED
Green = Network link
Flashing = Network link and activity
Off = No link to network. If power is off, view status on the rear panel
RJ­45 LEDs ("Rear panel LEDs and buttons" on page 82).
5
NIC 2 activity LED
Green = Network link
Flashing = Network link and activity
Off = No link to network. If power is off, view status on the rear panel
RJ­45 LEDs ("Rear panel LEDs and buttons" on page 82).
6
UID LED
Blue = Activated
Flashing = System managed remotely
Off = Deactivated
Component identification
80
Rear panel components
Item
Description
1
Power supply bay 2
2
Keyboard connector
3
Power supply bay 1 (populated)
4
Video connector
5
USB connectors (2)
6
RJ-45 Ethernet connectors (2)
7
Slot 1 PCIe2 x8 (4, 2, 1)¹
8
Slot 2 PCIe2 x8 (4, 2, 1)²
9
Slot 3 PCIe2 x8 (8, 4, 2, 1)³
10
Slot 4 PCIe2 x16 (8, 4, 2, 1) 75W +EXT 75W4
11
Slot 5 PCIe2 x8 (4, 2, 1)
12
Slot 6 PCIe2 x8 (4, 2, 1)
13
RJ-45 Ethernet connector (dedicated iLO 2 management)
14
Serial connector
15
Mouse connector
¹The SAS expander and the HP NC522SFP Dual Port 10GbE Server Adapter are not supported in slot 1.
²HP recommends the SAS expander is installed in slot 2.
³The HP NC522SFP Dual Port 10GbE Server Adapter is only supported in slot 3.
Component identification
81
To support options beyond 75W, install the 150W PCIe video/graphics controller power cable option.
4
Rear panel LEDs and buttons
Item
Description
Status
1
Power supply 2 LED
Green = Power supply is on and functioning.
Off = AC power is not available or AC power supply has failed.
2
UID LED
Blue = Activated
Flashing blue = System managed remotely
Off = Deactivated
3
Power supply 1 LED
Green = Power supply is on and functioning.
Off = AC power is not available or AC power supply has failed.
4
iLO 2 link LED
Green = Linked to network
Off = Not linked to network
5
iLO 2 activity LED
Green or flashing = Network activity
Off = No network activity
6
NIC 2 link LED
Green = Linked to network
Off = Not linked to network
7
NIC 2 activity LED
Green or flashing = Network activity
Off = No network activity
Component identification
82
Item
Description
Status
8
NIC 1 link LED
Green = Linked to network
Off = Not linked to network
9
NIC 1 activity LED
Green or flashing = Network activity
Off = No network activity
System board components
Item
Description
1
Processor 1 DIMM slots
2
Power supply backplane connector
3
Processor socket 2
4
System fan 4 connector
5
System power connectors
6
Processor 2 DIMM slots
7
System fan 3 connector
8
SD card slot (non-hot-plug)
9
System maintenance switch
10
Front panel LED board connector
11
SAS connector B
12
SAS connector A
13
HP Smart Array P410i memory connector
Component identification
83
Item
Description
14
TPM connector
15
SATA connectors (6)
16
Slot 1 PCIe2 x8 (4, 2, 1)¹
17
Slot 2 PCIe2 x8 (4, 2, 1)²
18
10Gb sideband connector (MII 24-pin)
19
Slot 3 PCIe2 x8 (8, 4, 2, 1)³
20
Slot 4 PCIe2 x16 (8, 4, 2, 1) 75W +EXT 75W4
21
Slot 5 PCIe2 x8 (4, 2, 1)
22
Slot 6 PCIe2 x8 (4, 2, 1)
23
Internal USB connector
24
Internal USB tape connector
25
System battery
26
System fan 2 connector
27
Processor socket 1
28
System fan 1 connector
¹The SAS expander and the HP NC522SFP Dual Port 10GbE Server Adapter are not supported in slot 1.
²HP recommends the SAS expander is installed in slot 2.
³The HP NC522SFP Dual Port 10GbE Server Adapter is only supported in slot 3.
4
To support options beyond 75W, install the 150W PCIe video/graphics controller power cable option.
Component identification
84
System board LEDs
Item
Description
Status
1
Power supply 1
Amber = No AC power or failed power supply
Off = Power supply is on and functioning.
2
Power supply 2
Amber = No AC power or failed power supply
Off = Power supply is on and functioning.
3
Processor 2
Amber = Processor 2 failed.
Off = Processor 2 is functioning.
4
System fan 4
Amber = Fan is missing or has failed.
Off = Fan is functioning.
5
AMP status
Green = AMP mode is enabled.
Amber = Failover has occurred, or the
configuration is not valid.
Off = AMP mode is disabled.
6
Processor 2 DIMMs
Amber = An error has occurred.
Off = Normal operation
7
System fan 3
Amber = Fan is missing or has failed.
Off = Fan is functioning.
8
Overtemperature
Amber = System temperature threshold exceeded
Off = Normal operation
9
System fan 2
Amber = Fan is missing or has failed.
Off = Fan is functioning.
Component identification
85
Item
Description
Status
10
Processor 1
Amber = Processor 1 failed.
Off = Processor 1 is functioning.
11
System fan 1
Amber = Fan is missing or has failed.
Off = Fan is functioning.
12
Processor 1 DIMMs
Amber = An error has occurred.
Off = Normal operation
System maintenance switch
Position
Default
Function
S1
Off
Off = iLO 2 security is enabled.
On = iLO 2 security is disabled.
S2
Off
Off = System configuration can be
changed.
On = System configuration is locked.
S3
Off
Reserved
S4
Off
Reserved
S5
Off
Off = Power-on password is enabled.
On = Power-on password is disabled.
S6
Off
Off = No function
On = Clear NVRAM
S7
—
Reserved
S8
—
Reserved
S9
—
Reserved
S10
—
Reserved
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all
system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to
properly configure the server or data loss could occur.
NMI functionality
An NMI crash dump enables administrators to create crash dump files when a system is hung and not
responding to traditional debug mechanisms.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for
administrators is to cycle the system power. Resetting the system erases any information that could support
problem analysis, but the NMI feature preserves that information by performing a memory dump before a
hard reset.
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can do any of
the following:
•
Short the NMI jumper pins
•
Press the NMI switch
Component identification
86
•
Use the iLO Virtual NMI feature
For additional information, see the whitepaper on the HP website
(http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf).
DIMM identification
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix
these two types causes the server to halt during BIOS initialization.
The memory subsystem may be populated with either RDIMMs or UDIMMs, but mixing the two types is not
supported. To determine DIMM characteristics, use the label attached to the DIMM and the following
illustration and table.
Item
Description
Definition
1
Size
—
2
Rank
1R = Single-rank
2R = Dual-rank
4R = Quad-rank
3
Data width
x4 = 4-bit
x8 = 8-bit
4
Memory speed
10600 = 1333-MHz
8500 = 1066-MHz
5
DIMM type
R = RDIMM (registered)
E = UDIMM (unbuffered with ECC)
For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com).
Component identification
87
SAS/SATA device numbers
•
SFF configuration with an optional SAS expander
•
SFF configuration with a second SAS controller
Component identification
88
•
LFF configuration
SAS and SATA hard drive LEDs
Item
Description
1
Fault/UID LED (amber/blue)
2
Online LED (green)
Component identification
89
SAS and SATA hard drive LED combinations
Online/activity
LED (green)
Fault/UID LED
(amber/blue)
Interpretation
On, off, or flashing Alternating amber
and blue
The drive has failed, or a predictive failure alert has been received
for this drive; it also has been selected by a management
application.
On, off, or flashing Steadily blue
The drive is operating normally, and it has been selected by a
management application.
On
Amber, flashing
regularly (1 Hz)
A predictive failure alert has been received for this drive.
Replace the drive as soon as possible.
On
Off
The drive is online, but it is not active currently.
Flashing regularly
(1 Hz)
Amber, flashing
regularly (1 Hz)
Do not remove the drive. Removing a drive may terminate the
current operation and cause data loss.
The drive is part of an array that is undergoing capacity expansion
or stripe migration, but a predictive failure alert has been received
for this drive. To minimize the risk of data loss, do not replace the
drive until the expansion or migration is complete.
Flashing regularly
(1 Hz)
Off
Do not remove the drive. Removing a drive may terminate the
current operation and cause data loss.
The drive is rebuilding, erasing, or it is part of an array that is
undergoing capacity expansion or stripe migration.
Flashing irregularly Amber, flashing
regularly (1 Hz)
The drive is active, but a predictive failure alert has been received
for this drive. Replace the drive as soon as possible.
Flashing irregularly Off
Steadily amber
Off
The drive is active, and it is operating normally.
A critical fault condition has been identified for this drive, and the
controller has placed it offline. Replace the drive as soon as
possible.
Off
Amber, flashing
regularly (1 Hz)
A predictive failure alert has been received for this drive. Replace
the drive as soon as possible.
Off
Off
The drive is offline, a spare, or not configured as part of an array.
Component identification
90
Battery pack LEDs
Item ID
Color
Description
1
Green
System Power LED. This LED glows steadily when the system
is powered up and 12 V system power is available. This
power supply is used to maintain the battery charge and
provide supplementary power to the cache microcontroller.
2
Green
Auxiliary Power LED. This LED glows steadily when 3.3V
auxiliary voltage is detected. The auxiliary voltage is used
to preserve BBWC data and is available any time that the
system power cords are connected to a power supply.
3
Amber
Battery Health LED. To interpret the illumination patterns of
this LED, see the following table.
4
Green
BBWC Status LED. To interpret the illumination patterns of
this LED, see the following table.
LED3 pattern
LED4 pattern
Interpretation
—
One blink every
two seconds
The system is powered down, and the cache contains data that has not
yet been written to the drives. Restore system power as soon as
possible to prevent data loss.
Data preservation time is extended any time that 3.3 V auxiliary
power is available, as indicated by LED 2. In the absence of auxiliary
power, battery power alone preserves the data. A fully-charged
battery can normally preserve data for at least two days.
The battery lifetime also depends on the cache module size. For further
information, refer to the controller QuickSpecs on the HP website
(http://www.hp.com).
—
Double blink, then The cache microcontroller is waiting for the host controller to
pause
communicate.
Component identification
91
LED3 pattern
LED4 pattern
Interpretation
—
One blink per
second
The battery pack is below the minimum charge level and is being
charged. Features that require a battery (such as write cache, capacity
expansion, stripe size migration, and RAID migration) are temporarily
unavailable until charging is complete. The recharge process takes
between 15 minutes and two hours, depending on the initial capacity
of the battery.
—
Steady glow
The battery pack is fully charged, and posted write data is stored in the
cache.
—
Off
The battery pack is fully charged, and there is no posted write data in
the cache.
One blink per
second
One blink per
second
An alternating green and amber blink pattern indicates that the cache
microcontroller is executing from within its boot loader and receiving
new flash code from the host controller.
Steady glow
—
There is a short circuit across the battery terminals or within the battery
pack. BBWC features are disabled until the battery pack is replaced.
The life expectancy of a battery pack is typically more than three
years.
One blink per
second
—
There is an open circuit across the battery terminals or within the
battery pack. BBWC features are disabled until the battery pack is
replaced. The life expectancy of a battery pack is typically more than
three years.
FBWC module LEDs
The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse side
of the cache module to facilitate status viewing.
Green LED
Amber LED
Interpretation
Off
On
A backup is in progress.
Flashing (1 Hz)
On
A restore is in progress.
Flashing (1 Hz)
Off
The capacitor pack is charging.
On
Off
The capacitor pack has completed charging.
Component identification
92
Green LED
Amber LED
Interpretation
Flashing (2 Hz)
Alternating with
amber LED
Flashing (2 Hz)
Alternating with
green LED
•
•
On
On
The flash code image failed to load.
Off
Off
The flash code is corrupt.
One of the following conditions exists:
The charging process has timed out.
The capacitor pack is not connected.
Fan locations and configurations
CAUTION: To maintain proper cooling, all fan bays must be populated with a fan or a fan blank.
•
Fan locations
Item
Description
1
Rear fan 1
2
Rear fan 2
3
Front fan 3
4
Front fan 4
Component identification
93
•
Single-processor, standard fan configuration
Item
Description
1
Rear fan 1
2
Rear fan 2
3
Front fan 3
4
Processor 1
5
DIMM baffle
•
Single-processor, redundant fan configuration
Item
Description
1
Rear fan 1
2
Rear fan 2
Component identification
94
Item
Description
3
Front fan 3
4
Front fan 4
5
Processor 1
6
DIMM baffle
7
Large redundant fan air baffle
•
Dual-processor, non-redundant fan configuration
Item
Description
1
Rear fan 1
2
Rear fan 2
3
Front fan 3
4
Processor 1
5
Processor 2
6
DIMM baffles
Component identification
95
•
Dual-processor, redundant fan configuration
Item
Description
1
Rear fan 1
2
Rear fan 2
3
Front fan 3
4
Front fan 4
5
Processor 1
6
Processor 2
7
DIMM baffles
8
Large redundant fan air baffle
Component identification
96
Optional hard drive cage jumper location and
configuration settings
•
Optional two-bay LFF backplane
•
Optional eight-bay SFF backplane
Drive cage
Installation
Pin setting
1
Standard
No jumper
2
Optional
1-2*
*Optional drive cages ship with the jumper set across pins 1 and 2.
Component identification
97
Specifications
Environmental specifications
Specification
Value
Temperature range*
Operating
10°C t o 35°C (50°F to 95°F)
Shipping
-40°C t o 70°C (-40°F to 158°F)
Maximum wet bulb temperature
28°C (82.4°F)
Relative humidity
(noncondensing)**
Operating
10% to 90%
Non-operating
5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for
storage corresponds to a pressure minimum of 70 kPa.
Mechanical specifications
Specification
Value
Dimension
Height (without tower feet)
44.45 cm (17.50 in)
Height (with tower feet)
46.70 cm (18.38 in)
Depth (with tower bezel)
60.00 cm (23.60 in)
Width
22.00 cm (8.66 in)
Weight (no drives installed)
27.22 kg (60.00 lb)
Power supply specifications
Depending on installed options, the server is configured with one of the following power supplies:
•
HP ProLiant 1200 W Power Supply
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
10 A at 100 VAC
4.9 A at 200 VAC
Specifications
98
Rated input power
930 W at 100V AC input
1348 W at 200V AC input
BTUs per hour
3530 at 120V AC input
4600 at 200V to 240V AC input
Power supply output
Rated steady-state power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
Maximum peak power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
•
HP ProLiant 750 W Power Supply
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
8.9 A at 100 VAC
4.3 A at 200 VAC
Rated input power
857 W at 100V AC input
824 W at 200V AC input
BTUs per hour
2925 at 100V AC input
2812 at 200V AC input
Power supply output
Rated steady-state power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
Maximum peak power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
•
HP ProLiant 460 W Power Supply
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
5.5 A at 100 VAC
2.6 A at 200 VAC
Rated input power
526 W at 100V AC input
505 W at 200V AC input
BTUs per hour
1794 at 100V AC input
1725 at 200V AC input
Power supply output
Rated steady-state power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
Specifications
99
Maximum peak power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
Specifications
100
Acronyms and abbreviations
ADU
Array Diagnostics Utility
AMP
Advanced Memory Protection
FBWC
flash-backed write cache
iLO
Integrated Lights-Out
IML
Integrated Management Log
LFF
large form-factor
LV DIMM
Low voltage DIMM
NCQ
Native Command Queuing
NMI
non-maskable interrupt
PATA
parallel ATA
PCIe
peripheral component interconnect express
PCI-X
peripheral component interconnect extended
Acronyms and abbreviations
101
POST
Power-On Self Test
PSP
ProLiant Support Pack
RBSU
ROM-Based Setup Utility
RDIMM
Registered Dual In-line Memory Module
SAS
serial attached SCSI
SATA
serial ATA
SFF
small form-factor
SIM
Systems Insight Manager
SMP
Server Migration Pack
TPM
trusted platform module
UDIMM
Unregistered Dual In-Line Memory Module
UID
unit identification
Acronyms and abbreviations
102
Index
A
access panel 31
accessing servers 29
adapter LEDs 79, 80, 82, 85
additional information 76
ADU (Array Diagnostic Utility) 77
air baffle 33
B
battery 74, 86
battery-backed write cache (BBWC) 47, 49, 91
battery-backed write cache battery pack 47, 48
BBWC (battery-backed write cache) 47, 91
BBWC battery pack 48
blanks 46
buttons 79, 80
C
capacitor pack 51, 92
cautions 29
components 16, 27, 75, 79, 81, 83
connectors 79, 80, 81, 83, 85
CSR (customer self repair) 5
customer self repair (CSR) 5
D
device numbers 88
diagnostic tools 76
diagnostics utility 76
DIMM baffles 34
DIMM slot locations 83
DIMM slots 83, 85
DIMMs 56, 85, 87
drive LEDs 89
E
electrostatic discharge 29
environmental requirements 98
environmental specifications 98
expansion boards 45
expansion slot covers 44
extending server from rack 28
external health LED 79, 80
F
fan 35
fan bay numbering 93
fan blank 35
fan configurations 93
FBWC capacitor pack 51
FBWC module 50, 92
FBWC module LEDs 92
features 79
feet, server 31
flash-backed write cache procedures 50
front bezel 30
front panel components 79
front panel LEDs 80
H
hard drive backplane 43
hard drive cage 38, 39, 41
hard drive LEDs 89, 90
hard drives 38, 90
hard drives, determining status of 90
health LEDs 79, 80, 86, 90
heatsink 57
HP Insight Diagnostics 76, 77
HP Insight Remote Support software 78
HP Insight Server Migration Pack software for
ProLiant 78
I
IML (Integrated Management Log) 77
Insight Diagnostics 76, 77
Integrated Management Log (IML) 77
internal health LED 79, 80, 90
J
jumper settings 97
Index 103
L
ROM-Based Setup Utility (RBSU) 76
Large redundant air baffle 33
LED, health 79, 80
LED, system power 80
LED, UID 80, 82
LEDs 79, 89, 90
LEDs, front panel 80
LEDs, hard drive 89, 90
LEDs, NIC 79, 80, 82, 85
LEDs, rear panel 82
LEDs, system board 85
LEDs, unit identification (UID) 79, 80, 82
S
M
management tools 76
mechanical components 16
mechanical specifications 98
media bay blank 46
media devices 54
N
NMI jumper 86
O
optional eight-bay SFF hard drive cage 39
optional two-bay LFF hard drive cage 41
P
PATA optical drive 54
PCI-X expansion cage 52
power LEDs, system 79, 80, 85, 91
Power On button 79, 80
power supplies 37, 98
power supply backplane 73
power supply blank 36
power supply specifications 98
powering down 27
preparation procedures 27
processor 59
safety considerations 29
SAS drives 90
SAS hard drive blank 37
SATA hard drive 90
SATA optical drive 54
server warnings and cautions 29
specifications, environmental 98
specifications, mechanical 98
specifications, power 98
specifications, server 98
standard hard drive cage 39
static electricity 29
system battery 74
system board 65, 83, 85
system board LEDs 85
system components 79, 83
system maintenance switch 83, 86
system power LED 80, 91
T
telco racks 29
tools 27, 76
tower bezel, removing 30
TPM (Trusted Platform Module) 75
troubleshooting 76
Trusted Platform Module (TPM) 75
U
UID LED 80, 82, 86
USB connectors 79, 80, 81
utilities 76
utilities, deployment 76
W
warnings 29
R
rack bezel 32
rails, removing 32
RBSU (ROM-Based Setup Utility) 76
rear panel components 81
rear panel LEDs 82
removing server from rack 29
Index 104
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