MAX8881

MAX8881
MAX8881EUT33+
RELIABILITY REPORT
FOR
MAX8881EUT33+
PLASTIC ENCAPSULATED DEVICES
April 9, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX8881EUT33+
Conclusion
The MAX8881EUT33+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX8880/MAX8881 are ultra-low supply current, low-dropout linear regulators, capable of delivering up to 200mA. They are designed for
battery-powered applications where reverse battery protection and long battery life are critical. These regulators' low 3.5µA supply current extends
battery life in applications with long standby periods. Unlike PNP-based designs, a 2 PMOS device maintains ultra-low supply current throughout the
entire operating range and in dropout. The parts are internally protected from output short circuits, reverse battery connection, and thermal overload.
An internal power-OK (POK) comparator indicates when the output is out of regulation. The MAX8880 output is adjustable from 1.25V to 5V using an
external resistor-divider. The MAX8881 provides only factory-preset output voltages of 1.8V, 2.5V, 3.3V, or 5V (see Ordering Information in the full
data sheet). The devices are available in 6-pin SOT23 and 6-pin TDFN packages.
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MAX8881EUT33+
II. Manufacturing Information
A. Description/Function:
12V, Ultra-Low-I<sub>Q</sub>, Low-Dropout Linear Regulators with POK
B. Process:
B8
C. Number of Device Transistors:
D. Fabrication Location:
Texas
E. Assembly Location:
UTL Thailand
F. Date of Initial Production:
April 22, 2000
III. Packaging Information
A. Package Type:
6-pin SOT23
B. Lead Frame:
Cu Alloy
C. Lead Finish:
100% matte Tin
D. Die Attach:
Non Conductive Epoxy
E. Bondwire:
Au (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Jb:
115*°C/W
K. Single Layer Theta Jc:
80°C/W
L. Multi Layer Theta Ja:
74.6°C/W
M. Multi Layer Theta Jc:
6.1°C/W
IV. Die Information
A. Dimensions:
41 X 60 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX8881EUT33+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 240 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 4.5 x 10
= 4.5 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at
http://www.maxim-ic.com/. Current monitor data for the B8 Process results in a FIT Rate of 2.71 @ 25C and 17.30 @ 55C
(0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PY17-3 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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MAX8881EUT33+
Table 1
Reliability Evaluation Test Results
MAX8881EUT33+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
240
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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