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AOZ8205DI
Five-line TVS Diode Array
General Description
Features
The AOZ8205 is a transient voltage suppressor (TVS)
diode array designed to protect data lines from high
transient conditions and ESD. This state-of-the-art device
utilizes AOS leading edge Trench Vertical Structure
[TVS]2 ™ technology for superior clamping performance.
 ESD protection for high-speed data lines:
This device incorporates five TVS diodes in a single
package. Due to the flexibility of the design, the package
can be configured as a four channel bidirectional TVS
array or five channel unidirectional TVA array. During
transient conditions, the TVS diodes direct the transient
to ground. They may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (± 15kV air,
±8 kV contact discharge).
The AOZ8205 comes in an RoHS compliant
DFN 1.6 mm x 1.6 mm package and is rated over a
-40 °C to +85 °C ambient temperature range.
– Exceeds: IEC 61000-4-2 (ESD) ±30 kV (air),
±30 kV (contact)
– Human Body Model (HBM) ±30 kV
 Trench Vertical Structure [TVS]2 ™ based technology






used to achieve excellent ESD clamping performance
Small package saves board space
Low insertion loss
Protects five unidirectional or four bidirectional I/O
lines
Low clamping voltage
Low operating voltage: 5.0 V
Green product, Pb-free
Applications
 Portable handheld devices
The very small DFN package makes the AOZ8205 ideal
for applications where PCB space is a premium. The
small size and high ESD protection makes it ideal for
protecting high speed video and data communication
interfaces.
Typical Applications
 Keypads, data lines
 Notebook computers
 Digital Cameras
 Portable GPS
 MP3 players
Pin Configuration
I/O1
I/O2
I/O3
I/O4
I/O5
Unidirection Protection of Five Lines
I/O1
I/O2
1
6
2
5
3
4
Top View
3
2
1
4
5
6
I/O3
I/O4
Bidirection Protection of Four Lines
Rev. 2.0 October 2015
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Page 1 of 7
AOZ8205DI
Ordering Information
Part Number
Ambient Temperature Range
Package
Environmental
AOZ8205DI
-40 °C to +85 °C
DFN 1.6 mm x 1.6 mm
Green Product
RoHS Compliant
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Absolute Maximum Ratings
Exceeding the Absolute Maximum ratings may damage the device.
Parameter
Rating
VP – VN
5V
Peak Pulse Current (IPP), tP = 8/20 µs
5A
Storage Temperature (TS)
-65 °C to +150 °C
ESD Rating per IEC61000-4-2, Contact
±30 kV
Air(1)
±30 kV
Model(2)
±30 kV
ESD Rating per IEC61000-4-2,
ESD Rating per Human Body
(1)
Notes:
1. IEC 61000-4-2 discharge with CDischarge = 150pF, RDischarge = 330Ω.
2. Human Body Discharge per MIL-STD-883, Method 3015 CDischarge = 100pF, RDischarge = 1.5kΩ.
Maximum Operating Ratings
Parameter
Rating
Junction Temperature (TJ)
-40 °C to +125 °C
Electrical Characteristics
TA = 25°C unless otherwise specified. Specifications in BOLD indicate a temperature range of -40°C to +85°C.
Symbol
VRWM
VBR
Parameter
Reverse Working Voltage
Conditions
Min.
Between pin 5 and 2(3)
2(4)
Reverse Breakdown
Voltage
IT = 1 mA, between pins 5 and
IR
Reverse Leakage Current
VRWM = 5 V, between pins 5 and 2
VF
Diode Forward Voltage
IF = 15 mA
VCL
Channel Clamp Voltage
Positive Transients
Negative Transient
IPP = 15 A, tp = 100 ns, any I/O pin to Ground
Channel Clamp Voltage
Positive Transients
Negative Transient
IPP = 25 A, tp = 100 ns, any I/O pin to Ground
Junction Capacitance
VR = 0V , f = 1 MHz, any I/O pin to Ground
Cj
Typ.
Max.
Units
5.0
V
6.0
0.70
V
0.1
µA
1
V
7.0
-6.75
V
V
7.50
-10.25
V
V
17
pF
0.85
15
Notes:
3. The working peak reverse voltage, VRWM, should be equal to or greater than the DC or continuous peak operating voltage level.
4. VBR is measured at the pulse test current IT.
Rev. 2.0 October 2015
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Page 2 of 7
AOZ8205DI
Typical Performance Characteristics
Clamping Voltage vs. Peak Pulse Current
Clamping Voltage vs. Current
12
11
10
9
8
7
6
5
4
3
2
1
0
(tperiod = 100ns, tr = 1ns)
14
Clamping Voltage (V)
Clamping Voltage, VCL (V)
(tperiod = 100ns, tr = 1ns)
12
10
8
6
4
2
5
10
15
20
25
0
30
5
10
20
25
30
Current (A)
Peak Pulse Current, IPP (A)
I/O – Gnd Insertion Loss (S21) vs. Frequency
Capacitance vs. Reverse Bias
(Vp = 3.3V)
5
20
0
18
Capacitance (pF)
Insertion Loss (dB)
15
-5
-10
-15
-20
16
14
12
10
8
6
-25
1
10
100
1000
10000
1
2
3
4
5
Reverse Bias (Volts)
Frequency (MHz)
Rev. 2.0 October 2015
0
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Page 3 of 7
AOZ8205DI
Applications Information
Device Connection for Protection of Five
Unidirectional Data Lines
I/O1
I/O2
These devices are designed to protect up to five
unidirectional data lines. The device is connected as
follows.
1. Unidirectional protection of five I/O lines is achieved
by connecting pins 1, 3, 4, 5 and 6 to the data lines.
Connect pin 2 to ground. The ground connection
should be made directly to the ground plane for best
results. The path length is kept as short as possible
to reduce the effects of parasitic inductance in the
board traces.
I/O3
1
3
4
5
6
6
2
5
3
4
I/O4
2
Circuit Diagram
Device Connection for Protection of Four
Bidirectional Data Lines
I/O5
Protection of Five Unidirectional Lines
I/O1
These devices are designed to protect up to four
bidirectional data lines. The device is connected as
follows.
1. Bidirectional protection of four I/O lines is achieved
by connecting pins 1, 3, 4, and 6 to the data lines.
Connect pin 5 to ground. The ground connection
should be made directly to the ground plane for best
results. The path length is kept as short as possible
to reduce the effects of parasitic inductance in the
board traces.
1
I/O2
1
3
4
1
6
2
5
3
4
6
I/O3
5
Circuit Diagram
I/O4
Protection of Four Bidirectional Lines
Circuit Board Layout Recommendations for
Suppression of ESD
Good circuit board layout is critical for the suppression of
ESD induced transients. The following guidelines are
recommended:
 Place the TVS near the input terminals or connectors
to restrict transient coupling.
 Minimize the path length between the TVS and the
protected line.
 Minimize all conductive loops including power and
ground loops.
 The ESD transient return path to ground should be
kept as short as possible.
 Never run critical signals near board edges.
 Use ground planes whenever possible.
Rev. 2.0 October 2015
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Page 4 of 7
AOZ8205DI
Package Dimensions, DFN 1.6 x 1.6, 6L
D
e
b
E
L
1
1
2e
Ref.
Pin 1 ID
TOP VIEW
BOTTOM VIEW
A
c
A1
SIDE VIEW
RECOMMENDED LAND PATTERN
0.50
Dimensions in millimeters
Symbols
A
Min.
0.50
A1
b
Max.
0.60
0.00
---
0.05
A1
0.22
0.25
0.28
b
1.60
1.65
D
0.061
1.60
1.65
E
0.061
1.55
E
1.55
L
0.30
0.35
Max.
0.024
0.000
---
0.002
0.009
0.010
0.011
0.006 Ref.
e
0.50 BSC
0.30
Nom.
0.022
c
0.152 Ref.
D
e
0.45
Symbols Min.
A
0.020
Nom.
0.55
c
1.25
Dimensions in inches
0.40
L
0.063
0.065
0.063
0.065
0.020 BSC
0.012
0.014
0.016
UNIT: mm
Notes:
1. Controlling dimension is millimeter. Converted inch dimentions are not necessarily exact.
Rev. 2.0 October 2015
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Page 5 of 7
AOZ8205DI
Tape and Reel Dimensions, DFN 1.6 x 1.6, 6L
Carrier Tape
P2
P1
D1
D0
E1
K0
E2 E
B0
5 Max.
A0
P0
T
Feeding Direction
UNIT: mm
Package
DFN 1.6x1.6
A0
1.78
±0.05
B0
1.78
±0.05
K0
0.69
±0.05
D0
ø1.50
±0.10
D1
E
E1
ø0.50
8.00
1.75
±0.05 +0.30 / -0.10 ±0.10
Reel
E2
3.50
±0.05
P0
4.00
±0.10
P1
4.00
±0.10
P2
2.00
±0.05
T
0.20
±0.02
W1
S
M
K
N
G
R
H
W
UNIT: mm
Tape Size Reel Size
8mm
ø178
M
ø178.0
±1.0
N
ø60.0
±1.0
W
11.80
±0.5
W1
9.0
±0.5
H
ø13.0
+0.5 / –0.2
S
2.40
±0.10
K
10.25
±0.2
E
ø9.8
R
—
Leader / Trailer & Orientation
Trailer Tape
300mm Min.
Rev. 2.0 October 2015
Components Tape
Orientation in Pocket
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Leader Tape
500mm Min.
Page 6 of 7
AOZ8205DI
Park Marking
AOZ8205DI
(DFN 1.6 x 1.6)
EWL
Product Number Code
Assembly Lot Code
Week Code
LEGAL DISCLAIMER
Alpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or
completeness of the information provided herein and takes no liabilities for the consequences of use of such
information or any product described herein. Alpha and Omega Semiconductor reserves the right to make changes
to such information at any time without further notice. This document does not constitute the grant of any intellectual
property rights or representation of non-infringement of any third party’s intellectual property rights.
LIFE SUPPORT POLICY
ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
Rev. 2.0 October 2015
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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