TVS Diode Arrays General Purpose ESD Protection - SP724 Series (SPA Diodes)

TVS Diode Arrays General Purpose ESD Protection - SP724 Series (SPA Diodes)
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP724 Series
SP724 Series 3pF 8kV Diode Array
RoHS
Pb GREEN
Description
The SP724 is a quad array of transient voltage clamping
circuits designed to suppress ESD and other transient overvoltage events. The SP724 is used to help protect sensitive
digital or analog input circuits on data, signal, or control
lines operating on power supplies up to 20VDC.
The SP724 is comprised of bipolar SCR/diode structures
to protect up to four independent lines by clamping
transients of either polarity to the power supply rails. The
SP724 offers very low leakage (1nA Typical) and low input
capacitance (3pF Typical). Additionally, the SP724 is rated
to withstand the IEC 61000-4-2 ESD specification for both
contact and air discharge methods to level 4.
Pinout
I/O
V+
I/O
6
5
4
SP724
(SOT-23)
TOP VIEW
1
2
3
I/O
V–
I/O
• ESD Capability per HBM Standards
V+ 5
3, 4 AND 6
1
Features
• An Array of 4 SCR/Diode Pairs in 6-Lead SOT-23
Functional Block Diagram
IN
The SP724 is connected to the sensitive input line and its
associated power supply lines. Clamping action occurs
during the transient pulse, turning on the diode and fast
triggering SCR structures when the voltage on the input
line exceeds one VBE threshold above the V+ supply (or one
VBE threshold below the V- supply). Therefore, the SP724P
operation is unaffected by poor power supply regulation or
voltage fluctuations within its operating range.
IN
- IEC 61000-4-2, Direct Discharge........... 8kV (Level 4)
- IEC 61000-4-2, Air Discharge................15kV (Level 4)
- MIL STD 3015.7................................................. >8kV
• Input Protection for Applications with Power Supplies Up
to +20V (Single-Ended Voltage), and ±10V (Differential
Voltage)
• Peak Current Capability
V-
2
Notes:
NOTES:
1. The
design of the SP724 SCR/Diode ESD Protection Arrays are covered by Littelfuse
patent 4567500.
1. The design of the SP724 SCR/Diode ESD Protection Arrays are
2. The full
ESD capability
of the SP724
is achieved
when wired in a circuit that includes
covered
by Littelfuse
patent
4567500.
connection to both the V+ and V- pins. When handling individual devices, follow proper
2. The full
ESD capability
of the SP724 is achieved when wired in a
procedures
for electrostatic
discharge.
circuit that includes connection to both the V+ and V- pins. When
handling individual devices, follow proper procedures for
electrostatic discharge.
- IEC 61000-4-5 (8/20µs)........................................ ±3A
- Single Pulse, 100µs Pulse Width...................... ±2.2A
• Low Input Leakage........................................... 1nA Typical
• Low Input Capacitance......................................3pF Typical
• Operating Temperature Range....................-40ºC to 105ºC
Applications
• Microprocessor/Logic
Input Protection
• Analog Device Input
Protection
• Data Bus Protection
• Voltage Clamp
Additional Information
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
Datasheet
Resources
Samples
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP724 Series
Thermal Information
Absolute Maximum Ratings
Parameter
Continuous Supply Voltage, (V+) - (V-)
Forward Peak Current, IIN to VCC , GND
(Refer to Figure 5)
Rating
+20
Units
V
±2.2, 100µs
A
Parameter
Thermal Resistance (Typical, Note 3)
SOT Package
Maximum Junction Temperature
Maximum Lead Temperature
(Soldering 20-40s) (SOT - Lead Tips Only)
C/W
o
C
-65 to 150
o
150
o
260
o
C
C
Note: 3. θJA is measured with the component mounted on an evaluation PC board in free air.
ESD Ratings and Capability - See Figure 1, Table 1
Electrical Characteristics
Units
oC/W
220
Maximum Storage Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Note:
Rating
θJA
TA = -40oC to 105oC, VIN = 0.5VCC , Unless Otherwise Specified
Parameter
Symbol
Operating Voltage Range,
VSUPPLY = [(V+) - (V-)] (Notes 4, 5)
Test Conditions
Min
Typ
Max
Units
1
-
20
V
-
2
-
V
VFWDH
-
2
-
V
IIN
-10
1
10
nA
V+ = 20V, V- = GND
-
-
100
nA
(Note 6)
-
1.1
-
V
VFWD/IFWD (Note 6)
-
1.0
-
Ω
-
3
-
pF
VSUPPLY
Forward Voltage Drop
Forward Voltage Drop
IN to V-
VFWDL
IN to V+
Input Leakage Current
Quiescent Supply Current
IIN = 1A (Peak Pulse)
IQUIESCENT
Equivalent SCR ON Threshold
Equivalent SCR ON Resistance
Input Capacitance
CIN
Notes:
4. In automotive and other battery charging systems, the SP724 power supply lines should be externally protected for load dump and reverse battery. When the V+ and V- Pins are connected
to the same supply voltage source as the device or control line under protection, a current limiting resistor should be connected in series between the external supply and the SP724
supply pins to limit reverse battery current to within the rated maximum limits.
5. Bypass capacitors of typically 0.01µF or larger should be connected closely between the V+ and V- Pins for all applications.
6. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance”. These characteristics are given here for information to determine peak current and
dissipation under EOS conditions.
Typical Application of the SP724
Application as an Input Clamp for Over-voltage, Greater than 1VBE
Above V+ or less than -1VBE below V-)
+VCC
+VCC
INPUT
DRIVERS
OR
SIGNAL
SOURCES
LINEAR OR
DIGITAL IC
INTERFACE
IN 1, 3, 4 AND 6
TO +VCC
V+
0.001µF
SP724
V-
SP724 INPUT PROTECTION CIRCUIT (1 OF 4 SHO WN)
FIGURE 4. TYPICAL APPLICATION OF THE SP724 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATER THAN 1VBE ABOVE V+ OR
LESS THAN -1V BE BELOW V-
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP724 Series
ESD Capability
ESD rating is dependent on the defined test standard. The
evaluation results for various test standards and methods
based on Figure 1 are shown in Table 1.3
Figure 1: Electrostatic Discharge Test
R1
The SP724 has a Level 4 rating when tested to the IEC
61000-4-2 Human Body Model (HBM) standard and
connected in a circuit in which the V+ and V- pins have
a return path to ground. Level 4 specifies a required
capability greater than 8kV for direct discharge and greater
than 15kV for air discharge.
RD
CHARGE
SWITCH
DISCHARGE
SWITCH
CD
H.V.
SUPPLY
VD
IN
DUT
IEC 1000-4-2: R 1 50 to 100M
MIL STD 3015.7: R 1 1 to 10M
The “Modified” MIL-STD-3015.7 condition is defined as an
“in-circuit” method of ESD testing, the V+ and V- pins have
a return path to ground.The SP724 ESD capability is greater
than 8kV with 100pF discharged through 1.5kΩ. By strict
definition of the standard MIL-STD-3015.7 method using
“pin-to-pin” device testing, the ESD voltage capability is
greater than 2kV.
FIGURE 1. ELECTR OSTATIC DISCHARGE TEST
Table 1: ESD Test Conditions
Standard
Type/Mode
RD
CD
±VD
330 Ω
150pF
15kV
HBM, Direct Discharge 330 Ω
Modified HBM
1.5k Ω
Standard HBM
1.5k Ω
150pF
100pF
100pF
8kV
8kV †
2kV
EIAJ IC121
Machine Model
0k Ω
200pF
400V
US ESD DS 5.3
Charged Device
Model
0k Ω
NA
3kV
HBM, Air Discharge
IEC 61000-4-2
(Level 4)
For the SP724 EIAJ IC121 Machine Model (MM) standard,
the ESD capability is typically greater than 1.8kV with
200pF discharged through 0kΩ.
MIL-STD-3015.7
The Charged Device model is based upon the selfcapacitance of the SOT-23 package through 0kΩ.
†Upper limit of laboratory test set.
Figure 2: Low Current SCR Forward Voltage Drop Curve
TA = 25°C
200
80
40
SINGLE PULSE
FORWARD SCR CURRENT (A)
120
FORWARD SCR CURRENT (mA)
FORWARD SCR CURRENT (mA)
SINGLE PULSE
160
5
TA = 25°C
160
120
80
40
0
0
600
600
5
TA = 25°C
TA = 25°C
SINGLE PULSE
SINGLE PULSE
FORWARD SCR CURRENT (A)
200
Figure 3: High Current SCR Forward Voltage Drop Curve
4
3
2
800
1000
1000
1200
FORWARD SCRFORWARD
VOLTAGE DROP
SCR VOLTAGE
(mV)
DROP (mV)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
3
2
EQUIV. SAT. ON
EQUIV. SAT. ON
THRESHOLD ~ 1.1VTHRESHOLD ~ 1.1V
1
1
0
800
4
0
0
1200
0
1
1
2
2
FORWARD SCR FORWARD
VOLTAGE DROP
SCR VOLTAGE
(V)
DROP (V)
3
3
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP724 Series
Peak Transient Current Capability for Long Duration Surges
The peak transient current capability is inversely
proportional to the width of the current pulse. Testing was
done to fully evaluate the SP724’s ability to withstand long
duration current pulses using the circuit of Figure 4. Figure
5 shows the point of overstress as defined by increased
leakage in excess of the data sheet published limits.
The safe operating range of the transient peak current
should be limited to no more than 75% of the measured
overstress level for any given pulse width as shown in the
curve of Figure 5.
Figure 4: T
ypical SP724 Peak Current Test Circuit
with a Variable Pulse Width Input
+
VX
CURRENT
SENSE
-
(-)
(+)
SP724
+
-
5
2
4
3
R 1 ~ 10 TYPICAL
VX ADJ. 10V/ATYPICAL
C1 ~ 100 µF
6
1
The test circuit of Figure 4 is shown with a positive pulse
input. For a negative pulse input, the (-) current pulse input
goes to an SP724 ‘IN’ input pin and the (+) current pulse
input goes to the SP724 V- pin. The V+ to V- supply of the
SP724 must be allowed to float. (i.e., It is not tied to the
ground reference of the current pulse generator.)
VOLTAGE
PROBE
C1
TYPICALNonrepetitive
SP724 PEAK CURRENT
CIRCUIT
Figure 5: FIGURE
S
P7245.Typical
PeakTEST
Current
WITH A VARIABLE PULSE WIDTH INPUT
Pulse Capability
Showing the Measured Point of Overstress in Amperes vs
pulse width time in milliseconds
8
NOTE: TO ENSURE SAFE OPERATION LIMIT
THE MAXIMUM PEAK CURRENT FOR A GIVEN
PULSE WIDTH TO BE NO GREATER THAN 75%
OF THE VALUES SHOWN.
TA = 25ºC
V+ TO V-SUPPLY = 15V
7
PEAK CURRENT (A)
Note that two input pins of the SP724 may be paralleled to
improve current (and ESD) capability. The sustained peak
current capability is increased to nearly twice that of a
single pin.
VARIABLE TIME DURATION
CURRENT PULSE GENERATOR
R1
6
5
4
3
2
1
0
0.001
0.01
0.1
1
10
SQUARE WAVE PULSE WIDTH (ms)
100
1000
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP724 Series
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
5°C/second max
TS(max) to TL - Ramp-up Rate
5°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
Package Dimensions — Small Outline Transistor Plastic Packages (SOT23-6)
Package
SOT23-6
Pins
6
JEDEC
MO-178
Millimeters
Min
M
Min
Max
Notes
A
0.900
1.450
0.035
0.057
-
A1
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 ref
e1
1.9 Ref
0.0748 Ref
L
Recommended Solder Pad Layout
Max
Inches
0.100
0.004
10º
0º
6
N
a
0.600
0º
-
0.023
6
4,5
6
10º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
P
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
R
O
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP724 Series
Part Numbering System
Product Characteristics
SP 724 AH T G
TVS Diode Arrays
(SPA® Diodes)
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Tape and Reel
Lead Coplanarity
0.004 inches (0.102mm)
Package Type
AH: SOT-23
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
“Green”
RoHS Compliant
Series
Ordering Information
Part Number
Temp.
Range (ºC)
Package
Marking
Min.
Order
Qty.
SP724AHTG
-40 to 105
Tape and Reel
724G
3000
Notes:
1. All dimensions are in millimeters.
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
1.5mm
DIA. HOLE
ACCESS HOLE
14.4mm
4.0mm
1.75mm
2.0mm
CL
8mm
4.0mm
13mm
180mm
GENERAL INFORMATION
SOT-23 (8mm POCKET PITCH)
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
60mm
8.4mm
USER DIRECTION OF FEED
PIN 1
COVER TAPE
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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SP724AHT SP724AHTG SP724AHTP
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