BCR3AM-14B Datasheet

BCR3AM-14B Datasheet

To our customers,

Old Company Name in Catalogs and Other Documents

On April 1

st

, 2010, NEC Electronics Corporation merged with Renesas Technology

Corporation, and Renesas

Electronics Corporation

took over all the business of both companies.

Therefore, although the old company name remains in this document, it is a valid

Renesas

Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1

st

, 2010

Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation ( http://www.renesas.com

)

Send any inquiries to http://www.renesas.com/inquiry .

Notice

1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.

2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information.

5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas

Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations.

6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.

7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and

“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc.

“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support.

“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.

8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges.

9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,

Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a

Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you.

10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS

Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas

Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

BCR3AM-14B

Triac

Low Power Use

Features

I

T (RMS)

V

DRM

I

FGT I

: 3 A

: 800 V (Tj = 125

°

C)

, I

RGT I

, I

RGT III

: 30 mA

Outline

Preliminary

REJ03G1806-0100

Rev.1.00

Jul 22, 2009

The Product guaranteed maximum junction temperature 150

°

C

Planar Passivation Type

RENESAS Package code: PRSS0003EA-A

(Package name: TO-92)

2

1. T

1

Terminal

2. T

2

Terminal

3. Gate Terminal

3

1

1

3

2

Applications

Heater control, other general controlling devices

Maximum Ratings

Voltage class

Parameter Symbol

14

Repetitive peak off-state voltage

Note1

V

DRM

Unit Conditions

I

Non-repetitive peak off-state voltage

Note1

RMS on-state current

Surge on-state current

2 t for fusing

V

DSM

840 V

Conditions

I

T (RMS)

3 A

360° conduction, non-continuous

I

TSM non-repetitive

I

2 t 3.7 A

2 s Value corresponding to 1 cycle of half wave 60Hz, surge on-state current

Peak gate power dissipation

Average gate power dissipation

Peak gate voltage

Peak gate current

Junction temperature

Storage temperature

P

GM

3 W

P

G (AV)

0.3 W

V

GM

6 V

I

GM

0.5 A

Tj

Tstg

– 40 to +150

– 40 to +150

°C

°C

Notes: 1. Gate open.

REJ03G1806-0100 Rev.1.00 Jul 22, 2009

Page 1 of 7

BCR3AM-14B

Electrical Characteristics

Preliminary

Repetitive peak off-state current

On-state voltage

Gate trigger voltage

Gate trigger current

Note2

Note2

Gate non-trigger voltage

ΙΙ

ΙΙΙ

Ι

Ι

ΙΙ

ΙΙΙ

I

DRM

— — 2.0 mA Tj = 150°C, V

DRM

applied

V

TM

— — 1.6 V

TM

= 4.5 A,

Instantaneous measurement

V

FGT

Ι

Tj = 25°C, V

D

= 6 V, R

L

= 6

,

V

RGT

Ι

R

G

= 330

V

RGT

ΙΙΙ

— — 1.5 V

I

FGT

Ι

I

RGT

Ι

Tj = 25°C, V

— — 30 mA

= 330

D

= 6 V, R

L

= 6

,

I

RGT

ΙΙΙ

— — 30 mA

V

GD

0.2/0.1 — — V Tj = 125°C/150

°

C,

R th (j-c)

— — 50 °C/W

V

D

= 1/2 V

DRM

Junction to case

Note3

(dv/dt)c 5/1 — — V/

µ

125°C/150°C

Thermal resistance

Critical-rate of rise of off-state commutating voltage

Note4

Notes: 2. Measurement using the gate trigger characteristics measurement circuit.

3. Case temperature is measured at the T

2

terminal 1.5 mm away from the molded case.

4. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below.

Test conditions

Commutating voltage and current waveforms

(inductive load)

1. Junction temperature

Tj = 125°C/150°C

2. Rate of decay of on-state commutating current

(di/dt)c = – 4.0 A/ms

3. Peak off-state voltage

V

D

= 400 V

Supply Voltage

Main Current

Main Voltage

(dv/dt)c

Time

(di/dt)c

Time

Time

V

D

REJ03G1806-0100 Rev.1.00 Jul 22, 2009

Page 2 of 7

BCR3AM-14B

Performance Curves

Maximum On-State Characteristics

10

1

7

5

3

2

10

2

7

5

3

2

10

0

7

5

3

2

10

–1

0.5

1.0

Tj = 25°C

1.5

2.0

2.5

Tj = 150°C

3.0

3.5

4.0

On-State Voltage (V)

10

2

Gate Characteristics (I, II and III)

10

1

V

GM

= 6 V

P

G(AV)

= 0.3 W

P

GM

= 3 W

V

GT

= 1.5 V

10

0

I

FGT I

, I

RGT I

,

I

RGT III

= 30 mA

10

–1

V

GD

= 0.1 V

10

–2

10

0

I

GM

= 0.5 A

10

1

10

2

Gate Current (mA)

10

3

Gate Trigger Voltage vs.

Junction Temperature

10

2

7

5

3

2

10

3

7

5

3

2

Typical Example

10

1

–60 –40–20 0 20 40 60 80 100 120 140 160

Junction Temperature (°C)

REJ03G1806-0100 Rev.1.00 Jul 22, 2009

Page 3 of 7

Preliminary

Rated Surge On-State Current

40

35

30

25

20

15

10

5

0

10

0

2 3 5 7 10

1

2 3 5 7 10

2

Conduction Time (Cycles at 60Hz)

Gate Trigger Current vs.

Junction Temperature

10

3

7

5

3

2

I

RGT III

10

2

7

5

I

FGT I,

I

RGT I

3

2

Typical Example

10

1

–60 –40–20 0 20 40 60 80 100 120 140 160

Junction Temperature (°C)

Maximum Transient Thermal

Impedance Characteristics

(Junction to case, Junction to ambient)

5 7 10

3

2 3 5 7 10

4

2 3 5 7 10

5

10

3

7

5

10

2

3

2

2 3

Junction to ambient

10

2

7

5

3

2

Junction to case

10 1

7

5

3

2

10

0

10 –1 2 3 5 7 10 0 2 3 5 7 10 1 2 3 5 7 10 2

Conduction Time (Cycles at 60Hz)

BCR3AM-14B

Maximum On-State Power Dissipation

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

360° Conduction

Resistive, inductive loads

1.0

0.5

0

0 0.5 1.0 1.5 2.0

2.5

3.0

3.5

4.0

RMS On-State Current (A)

Breakover Voltage vs.

Junction Temperature

160

140

120

Typical Example

100

80

60

40

20

0

–60 –40–20 0 20 40 60 80 100 120 140 160

Junction Temperature (°C)

Holding Current vs.

Junction Temperature

10

2

7

5

3

2

10

3

7

5

3

2

Typical Example

10

1

–60 –40–20 0 20 40 60 80 100 120 140 160

Junction Temperature (°C)

REJ03G1806-0100 Rev.1.00 Jul 22, 2009

Page 4 of 7

Preliminary

Allowable Case Temperature vs.

RMS On-State Current

160

140

120

100

80

60

40

20

Curves apply regardless of conduction angle

360° Conduction

Resistive, inductive loads

0

0 0.5 1.0 1.5 2.0

2.5

3.0

3.5

4.0

RMS On-State Current (A)

Repetitive Peak Off-State Current vs.

Junction Temperature

10

6

7

5

10

7

5

3

3

2

5

2

4

10

7

5

10

7

5

3

2

3

3

2

Typical Example

2

10

–60 –40–20 0 20 40 60 80 100 120 140 160

Junction Temperature (°C)

Latching Current vs.

Junction Temperature

10

3

7

5

3

2

Distribution

T

2

+, G–

Typical Example

10

2

7

5

3

2

10

1

7

5

3

2

T

2

T

2

+, G+

–, G– Typical Example

10

0

–60 –40–20 0 20 40 60 80 100 120 140 160

Junction Temperature (°C)

BCR3AM-14B

Breakover Voltage vs.

Rate of Rise of Off-State Voltage (Tj=125°C)

160

140

120

Typical Example

Tj = 125°C

100

80

III Quadrant

60

40

I Quadrant

20

0

10

1

2 3 5 710

2

2 3 5 710

3

2 3 5 710

4

Rate of Rise of Off-State Voltage (V/

µs)

Commutation Characteristics (Tj=125°C)

10

2

7

5

3

2

Main Voltage

(dv/dt)c

Main Current

I

T

τ

Time

Time

V

D

(di/dt)c

Typical Example

Tj = 125°C

I

T

= 4A

τ = 500µs

V

D

= 200V f = 3Hz

10

1

7

5

3

2

Minimum

Characteristics

Value

I Quadrant

III Quadrant

10

0

10

0

2 3 5 7 10

1

2 3 5 7 10

2

2 3 5 7 10

3

Rate of Decay of On-State

Commutating Current (A/ms)

Gate Trigger Current vs.

Gate Current Pulse Width

10

3

7

5

3

2

10

2

7

5

3

2

I

RGT III

I

RGT I

I

FGT I

Typical Example

10

1

10

0

2 3 5 7 10

1

2 3 5 7 10

2

Gate Current Pulse Width (

µs)

REJ03G1806-0100 Rev.1.00 Jul 22, 2009

Page 5 of 7

Preliminary

Breakover Voltage vs.

Rate of Rise of Off-State Voltage (Tj=150°C)

160

140

120

100

Typical Example

Tj = 150°C

80

60

40

III Quadrant

20

I Quadrant

0

10

1

2 3 5 710

2

2 3 5 710

3

2 3 5 710

4

Rate of Rise of Off-State Voltage (V/

µs)

Commutation Characteristics (Tj=150°C)

10

2

7

5

3

Main Voltage

(dv/dt)c

Main Current

I

T

τ

2

Time

Time

V

D

(di/dt)c

Typical Example

Tj = 150°C

I

T

= 4A

τ = 500µs

V

D

= 200V f = 3Hz

10

1

7

5

III Quadrant

I Quadrant

3

2

Minimum

Characteristics

Value

10

0

10

0

2 3 5 7 10

1

2 3 5 7 10

2

2 3 5 7 10

3

Rate of Decay of On-State

Commutating Current (A/ms)

BCR3AM-14B

Gate Trigger Characteristics Test Circuits

6

6

6V

A

V

Test Procedure I

6

330

6V

V

A

Test Procedure II

330

6V

V

A

Test Procedure III

330

Preliminary

Recommended Circuit Values Around The Triac

Load

C

1

R

1

C

0

R

0

C

1

R

1

= 0.1 to 0.47

µF

= 47 to 100

C

0

R

0

= 0.1

µF

= 100

REJ03G1806-0100 Rev.1.00 Jul 22, 2009

Page 6 of 7

BCR3AM-14B

Package Dimensions

Package Name

TO-92*

JEITA Package Code

SC-43A

RENESAS Code

PRSS0003EA-A

Previous Code

MASS[Typ.]

0.23g

φ5.0Max

4.4

Preliminary

Unit: mm

1.25

1.25

Circumscribed circle

φ0.7

Order Code

Lead form Standard packing Quantity Standard order code

Straight type

Lead form

Form A8

Vinyl sack

Vinyl sack

Taping

500

500

2000

Type name

Type name – Lead forming code

Type name – TB

Note : Please confirm the specification about the shipping in detail.

Standard order code example

BCR3AM-14B

BCR3AM-14B-A6

BCR3AM-14B-TB

REJ03G1806-0100 Rev.1.00 Jul 22, 2009

Page 7 of 7

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Notes:

1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes

warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property

rights or any other rights of Renesas or any third party with respect to the information in this document.

2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,

but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.

3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass

destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws

and regulations, and procedures required by such laws and regulations.

4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this

document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,

please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be

disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )

5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a

result of errors or omissions in the information included in this document.

6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability

of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular

application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.

7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications

or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality

and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or

undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall

have no liability for damages arising out of the uses set forth above.

8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:

(1) artificial life support devices or systems

(2) surgical implantations

(3) healthcare intervention (e.g., excision, administration of medication, etc.)

(4) any other purposes that pose a direct threat to human life

Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing

applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all

damages arising out of such applications.

9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,

movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages

arising out of the use of Renesas products beyond such specified ranges.

10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain

rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage

caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and

malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software

alone is very difficult, please evaluate the safety of the final products or system manufactured by you.

11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as

swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.

Renesas shall have no liability for damages arising out of such detachment.

12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.

13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have

any other inquiries.

RENESAS SALES OFFICES

http://www.renesas.com

Refer to "http://www.renesas.com/en/network" for the latest and detailed information.

Renesas Technology America, Inc.

450 Holger Way, San Jose, CA 95134-1368, U.S.A

Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501

Renesas Technology Europe Limited

Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.

Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900

Renesas Technology (Shanghai) Co., Ltd.

Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120

Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898

Renesas Technology Hong Kong Ltd.

7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong

Tel: <852> 2265-6688, Fax: <852> 2377-3473

Renesas Technology Taiwan Co., Ltd.

10th Floor, No.99, Fushing North Road, Taipei, Taiwan

Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399

Renesas Technology Singapore Pte. Ltd.

1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632

Tel: <65> 6213-0200, Fax: <65> 6278-8001

Renesas Technology Korea Co., Ltd.

Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea

Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145

Renesas Technology Malaysia Sdn. Bhd

Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia

Tel: <603> 7955-9390, Fax: <603> 7955-9510

© 2009. Renesas Technology Corp., All rights reserved. Printed in Japan.

Colophon .7.2

Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement