PS8802-1,
DATA SHEET
PHOTOCOUPLER
PS8802-1,-2
1 Mbps HIGH CMR ANALOG OUTPUT TYPE
8-PIN SSOP (SO-8)
HIGH-SPEED PHOTOCOUPLER
−NEPOC Series−
DESCRIPTION
The PS8802-1, -2 are optically coupled isolators containing a GaAlAs LED on the light emitting diode (input side)
and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
The PS8802-1, -2 are designed specifically for high common mode transient immunity (CMR), the PS8802-2 is
suitable for high density applications.
FEATURES
PIN CONNECTION
• 40% reduction of mounting area (5-pin SOP × 2)
(Top View)
• High common mode transient immunity (CMH, CML = ±15 kV/μs MIN.)
• High supply voltage (VCC = 35 V)
8
7
1
2
PS8802-1
5
1. NC
2. Anode
3. Cathode
4. NC
5. GND
6. VO
7. NC
8. VCC
3 4
8
7
6
1
2
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High-speed response (tPHL = 0.8 μs MAX., tPLH = 1.2 μs MAX.)
• Ordering number of tape product: PS8802-1-F3, F4: 1 500 pcs/reel
: PS8802-2-F3, F4: 1 500 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved (option)
APPLICATIONS
• Computer and peripheral manufactures
• General purpose inverter
• Substitutions for relays and pulse transformers
• Power supply
6
PS8802-2
5
1. Anode1
2. Cathode1
3. Cathode2
4. Anode2
5. GND
6. VO2
7. VO1
8. VCC
3 4
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10418EJ07V0DS (7th edition)
Date Published August 2008 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2003, 2008
PS8802-1,-2
PACKAGE DIMENSIONS (UNIT: mm)
5.21±0.25
6.0±0.2
0.1±0.1
0.15 +0.10
–0.05
3.27±0.2
3.95±0.1
2
1.27
0.4 +0.10
–0.05
0.5±0.3
0.10 S
0.25 M
Data Sheet PN10418EJ07V0DS
PS8802-1,-2
<R>
MARKING EXAMPLE
SnBi PLATING
PS8802-1
8802-1
NL831
PS8802-2
8802-2
NL831
Type Number
Assembly Lot
Type Number
Assembly Lot
N
N
N L 8 31
N L 8 31
Week Assembled
Year Assembled
(Last 1 Digit)
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Week Assembled
Year Assembled
(Last 1 Digit)
No. 1 pin Mark
Initial of NEC
(Engraved mark)
In-house Code
(L: Pb-Free)
In-house Code
(L: Pb-Free)
Rank Code
Rank Code
Ni/Pd/Au PLATING
PS8802-1
8802-1
NT831
PS8802-2
8802-2
NT831
Type Number
Assembly Lot
Assembly Lot
N
N
N T 8 31
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Type Number
N T 8 31
Week Assembled
Year Assembled
(Last 1 Digit)
No. 1 pin Mark
Initial of NEC
(Engraved mark)
In-house Code
(T: Pb-Free)
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
(T: Pb-Free)
Rank Code
Rank Code
Data Sheet PN10418EJ07V0DS
3
PS8802-1,-2
<R>
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
PS8802-1
PS8802-1-A
Pb-Free
20 pcs (Tape 20 pcs cut)
Standard products
PS8802-1-F3
PS8802-1-F3-A
(SnBi)
Embossed Tape 1 500 pcs/reel
(UL approved)
PS8802-1-F4
PS8802-1-F4-A
PS8802-2
PS8802-2-A
20 pcs (Tape 20 pcs cut)
PS8802-2-F3
PS8802-2-F3-A
Embossed Tape 1 500 pcs/reel
PS8802-2-F4
PS8802-2-F4-A
PS8802-1-V
PS8802-1-V-A
20 pcs (Tape 20 pcs cut)
DIN EN60747-5-2
PS8802-1-V-F3
PS8802-1-V-F3-A
Embossed Tape 1 500 pcs/reel
(VDE0884 Part2)
PS8802-1-V-F4
PS8802-1-V-F4-A
PS8802-2-V
PS8802-2-V-A
20 pcs (Tape 20 pcs cut)
PS8802-2-V-F3
PS8802-2-V-F3-A
Embossed Tape 1 500 pcs/reel
PS8802-2-V-F4
PS8802-2-V-F4-A
PS8802-1
PS8802-1-AX
Pb-Free
20 pcs (Tape 20 pcs cut)
Standard products
PS8802-1-F3
PS8802-1-F3-AX
(Ni/Pd/Au)
Embossed Tape 1 500 pcs/reel
(UL approved)
PS8802-1-F4
PS8802-1-F4-AX
PS8802-2
PS8802-2-AX
20 pcs (Tape 20 pcs cut)
PS8802-2-F3
PS8802-2-F3-AX
Embossed Tape 1 500 pcs/reel
PS8802-2-F4
PS8802-2-F4-AX
PS8802-1-V
PS8802-1-V-AX
20 pcs (Tape 20 pcs cut)
DIN EN60747-5-2
PS8802-1-V-F3
PS8802-1-V-F3-AX
Embossed Tape 1 500 pcs/reel
(VDE0884 Part2)
PS8802-1-V-F4
PS8802-1-V-F4-AX
PS8802-2-V
PS8802-2-V-AX
20 pcs (Tape 20 pcs cut)
PS8802-2-V-F3
PS8802-2-V-F3-AX
Embossed Tape 1 500 pcs/reel
PS8802-2-V-F4
PS8802-2-V-F4-AX
PS8802-1
PS8802-2
PS8802-1
Approved (Option)
PS8802-2
PS8802-1
PS8802-2
PS8802-1
Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
4
Application
*1
Part Number
Data Sheet PN10418EJ07V0DS
PS8802-2
PS8802-1,-2
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
IF
25
mA/ch
VR
5.0
V/ch
Power Dissipation
PD
45
mW/ch
Supply Voltage
VCC
35
V
Output Voltage
VO
35
V/ch
IO
8.0
mA/ch
PC
100
mW/ch
BV
2 500
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +100
°C
Storage Temperature
Tstg
–55 to +125
°C
Diode
Forward Current
Reverse Voltage
*1
Detector
Output Current
*2
Power Dissipation
Isolation Voltage
*3
*1 Reduced to 0.45 mW/°C at TA = 25°C or more.
*2 Reduced to 1.00 mW/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
Data Sheet PN10418EJ07V0DS
5
PS8802-1,-2
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
Conditions
Forward Voltage
VF
IF = 16 mA
Reverse Current
IR
VR = 3 V
Forward Voltage
Temperature Coefficient
Terminal Capacitance
Detector
Symbol
ΔVF/ΔTA
Ct
MIN.
TYP.
MAX.
Unit
1.7
2.2
V
10
μA
−2.1
mV/°C
V = 0 V, f = 1 MHz
30
pF
10
IF = 16 mA
High Level Output Current
IOH (1)
IF = 0 mA, VCC = VO = 5.5 V
High Level Output Current
IOH (2)
IF = 0 mA, VCC = VO = 30 V
Low Level Output Voltage
VOL
IF = 16 mA, VCC = 4.5 V, IOL = 1.2 mA
High Level Supply Current
ICCH
IF = 0 mA, VO = open, VCC = 30 V
500
nA
100
μA
0.1
0.4
V
0.1
2
μA
0.2
4
(PS8802-1)
High Level Supply Current
(PS8802-2)
Low Level Supply Current
ICCL
IF = 16 mA, VO = open, VCC = 30 V
100
(PS8802-1)
Low Level Supply Current
(PS8802-2)
Coupled
Current Transfer Ratio
Input-Output
200
CTR
IF = 16 mA, VCC = 4.5 V, VO = 0.4 V
15
25
45
RI-O
VI-O = 1 kVDC, RH = 40 to 60%
10
RI-I
VI-I = 1 kVDC, RH = 40 to 60%
10
CI-O
V = 0 V, f = 1 MHz
%
Ω
11
Isolation Resistance
Insulation Resistance
10
(Input-Input), (PS8802-2)
Input-Output
0.6
pF
Isolation Capacitance
Insulation Capacitance
CI-I
0.3
(Input-Input), (PS8802-2)
6
Propagation Delay Time
*1
(H → L)
tPHL
Propagation Delay Time
*1
(L → H)
tPLH
Common Mode
Transient Immunity at
*2
High Level Output
CMH
IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
15
Common Mode
Transient Immunity at
*2
Low Level Output
CML
IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
−15
IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ,
CL = 15 pF
Data Sheet PN10418EJ07V0DS
0.3
0.8
0.6
1.2
μs
kV/μs
PS8802-1,-2
*1 Test circuit for propagation delay time
VCC = 5 V
PS8802-1
(PW = 1μs,
Pulse input (IF)
Duty cycle = 1/10)
Input
(Monitor)
47 Ω
0.1 μ F
RL = 2.2 kΩ
VO (Monitor)
CL = 15 pF
(IF = 7.5 mA)
50%
Input
Output
VCC = 5 V
PS8802-2
Pulse input (IF)
(PW = 1μs,
Duty cycle = 1/10)
Input
(Monitor)
tPHL
1.5 V
VOL
tPLH
RL = 2.2 kΩ
VO (Monitor)
0.1 μF
CL = 15 pF
47 Ω
Remark CL is approximately 15 pF which includes probe and stray wiring capacitance.
*2 Test circuit for common mode transient immunity
PS8802-1
VCC = 5 V
RL = 4.1 kΩ
0.1 μF
VO (Monitor)
CL = 15 pF
1.5 kV
VCM 90%
IF
10%
VCM
0V
tr
VO
(IF = 0 mA)
PS8802-2
SW IF
VCC = 5 V
RL = 4.1 kΩ
0.1 μF
VO (Monitor)
CL = 15 pF
VO
(IF = 16 mA)
tf
VOH
2V
0.8 V
VOL
VCM
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between
the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
Data Sheet PN10418EJ07V0DS
7
PS8802-1,-2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
40
30
20
10
25
0
50
75
60
40
20
50
75
100
FORWARD CURRENT vs.
FORWARD VOLTAGE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
TA = +100˚C
+50˚C
+25˚C
1
0˚C
–25˚C
0.1
1.2
1.4
1.6
1.8
2.0
2.2
IF = 0 mA
1 000
100
10
1
0.1
–25
2.4
VCC = VO = 30 V
VCC = VO = 5.5 V
0
25
50
75
100
Forward Voltage VF (V)
Ambient Temperature TA (˚C)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
80
VCC = 4.5 V,
VO = 0.4 V
70
60
50
40
30
20
10
0
0.5
1
5
10
50
1.6
Remark
Normalized to 1.0
at TA = 25˚C, IF = 16 mA,
VCC = 4.5 V, VO = 0.4 V
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–50
–25
0
25
50
75
Ambient Temperature TA (˚C)
Forward Current IF (mA)
8
25
Ambient Temperature TA (˚C)
High Level Output Current IOH (nA)
Forward Current IF (mA)
80
10 000
0.01
1.0
Current Transfer Ratio CTR (%)
100
Ambient Temperature TA (˚C)
100
10
120
0
100
Normalized Current Transfer Raio CTR
Diode Power Dissipation PD (mW)
50
The graphs indicate nominal characteristics.
Data Sheet PN10418EJ07V0DS
100
PS8802-1,-2
OUTPUT VOLTAGE vs.
FORWARD CURRENT
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
10
6
25 mA
5
Output Voltage VO (V)
Output Current IO (mA)
20 mA
8
15 mA
6
10 mA
4
IF = 5 mA
2
4
RL = 2.2 kΩ
3
2
1
5.6 kΩ
2
4
6
8
10 12
14 16
0
18 20
4
6
8
10
12
14 16
18 20
Forward Current IF (mA)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
PROPAGATION DELAY TIME vs.
LOAD RESISTANCE
3.0
VCC = 5 V,
RL = 2.2 kΩ,
CTR : 25%
2.0
1.0
tPHL
tPLH
0
5
10
15
20
25
10
VCC = 5 V,
IF = 16 mA,
CTR : 25%
tPLH
1
tPHL
0.1
1k
Forward Current IF (mA)
Normalized Propagation Delay Time tPHL, tPLH
2
Output Voltage VO (V)
Propagation Delay Time tPHL, tPLH (μs)
Propagation Delay Time tPHL, tPLH (μs)
0
10 k
100 k
Load Resistance RL (Ω)
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
5
Normalized to 1.0
at TA = 25˚C,
IF = 16 mA, VCC = 5 V,
RL = 2.2 kΩ
4
3
2
tPLH
tPHL
1
0
–50
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
Remark
The graphs indicate nominal characteristics.
Data Sheet PN10418EJ07V0DS
9
PS8802-1,-2
TAPING SPECIFICATIONS (UNIT: mm)
1.7±0.1
5.56±0.1
5.5±0.1
1.5+0.1
–0
12.0±0.2
2.0±0.05
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.05 MAX.
3.6±0.1
6.4±0.1
0.3±0.05
8.0±0.1
Taping Direction
PS8802-1-F4
PS8802-2-F4
PS8802-1-F3
PS8802-2-F3
Outline and Dimensions (Reel)
2.0±0.5
φ 13.0±0.2
φ 21.0±0.8
φ 100±1.0
R 1.0
φ 330±2.0
2.0±0.5
φ13.0±0.2
13.5±1.0
17.5±1.0
11.9 to 15.4
Outer edge of
flange
Packing: 1 500 pcs/reel
10
Data Sheet PN10418EJ07V0DS
PS8802-1,-2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.27
0.8
1.45
5.25
Data Sheet PN10418EJ07V0DS
11
PS8802-1,-2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
12
Data Sheet PN10418EJ07V0DS
PS8802-1,-2
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10418EJ07V0DS
13
PS8802-1,-2
<R>
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Speck
Unit
Application classification (DIN EN 60664-1 VDE0110 Part 1)
for rated line voltages ≤ 300 Vr.m.s.
for rated line voltages ≤ 600 Vr.m.s.
IV
III
Climatic test class (DIN EN 60664-1 VDE0110)
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
UIORM
Upr
566
849
Vpeak
Vpeak
Upr
1 061
Vpeak
UTR
4 000
Vpeak
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
2
Clearance distance
>4.0
mm
Creepage distance
>4.0
mm
Comparative tracking index (DIN IEC 112/VDE 0303 Part 1)
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +125
°C
Operating temperature range
TA
–55 to +100
°C
Ris MIN.
Ris MIN.
10
11
10
Package temperature
Tsi
150
°C
Current (input current IF, Psi = 0)
Isi
150
mA
Power (output or total power dissipation)
Psi
600
mW
Ris MIN.
10
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
12
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Isolation resistance
VIO = 500 V dc at TA = Tsi
14
Data Sheet PN10418EJ07V0DS
9
Ω
PS8802-1,-2
• The information in this document is current as of August, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
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redundancy, fire-containment and anti-failure features.
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
Data Sheet PN10418EJ07V0DS
15
PS8802-1,-2
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
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All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”:
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Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
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