RClamp0502BA Ultra-Low Capacitance TVS for ESD and CDE Protection PROTECTION PRODUCTS - RailClamp

RClamp0502BA Ultra-Low Capacitance TVS for ESD and CDE Protection PROTECTION PRODUCTS - RailClamp
RClamp0502BA
Ultra-Low Capacitance TVS
for ESD and CDE Protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
‹ Transient protection for high-speed data lines to
RailClamp® TVS diodes are specifically designed to
protect sensitive components which are connected to
high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE
(cable discharge events), and EFT (electrical fast
transients).
The RClamp®0502BA has a typical capacitance of only
0.60pF (pin 1 to 2). This means it can be used on
circuits operating in excess of 3GHz with minimal signal
attenuation. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). Each device can
be configured to protect 1 bidirectional line or two
unidirectional lines.
These devices are in a small SC-75 (SOT-523) package
and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where
board space is at a premium. The combination of small
size, low capacitance, and high level of ESD protection
makes them a flexible solution for applications such as
HDMI, MDDI, antenna circuits, Automatic Test Equipment,
USB 2.0, and Infiniband circuits.
‹
‹
‹
‹
‹
‹
‹
IEC 61000-4-2 (ESD) ±18kV (air), ±12kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Protects up to two I/O lines
Ultra-Low capacitance (<1pF)
No insertion loss to >3.0GHz
Low profile (<1mm)
Low leakage current and clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
Mechanical Characteristics
‹
‹
‹
‹
‹
SC-75 (SOT-523) package
Lead Finish: Matte Tin
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Molding compound flammability rating: UL 94V-0
Packaging: Tape and Reel
Applications
‹
‹
‹
‹
‹
‹
Dimensions
Mobile Display Digital Interface (MDDI)
USB 2.0
Firewire Ports
GaAs Photodetector Protection
HBT Power Amp Protection
Infiniband Transceiver Protection
Schematic & PIN Configuration
1.60
0.50 BSC
3
0.80
1
1.60
2
1.00
BSC
0.75
Nominal Dimensions (mm)
Revision 4/19/2010
SC-75 3L (Top View)
1
www.semtech.com
RClamp0502BA
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
125
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
5
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
VESD
18
12
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
Reverse Breakdown Voltage
V BR
It = 1mA
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
1
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
Pi n 1 to Pi n 2
15
V
Clamping Voltage
VC
IPP = 5A, tp = 8/20μs
Pin 1 or Pin 2 to Pin 3
22
V
Clamping Voltage
VC
IPP = 5A, tp = 8/20μs
Pi n 1 to Pi n 2
25
V
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Pi n 1 to Pi n 2
0.9
pF
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Pin 1 or Pin 2 to Pin 3
1.2
pF
© 2010 Semtech Corp.
2
Minimum
Typical
Maximum
Units
5
V
6
V
0.60
www.semtech.com
RClamp0502BA
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (μs)
Clamping Voltage vs. Peak Pulse Current
Pin 1 to Pin 2
Clamping Voltage vs. Peak Pulse Current
Pin 1 or Pin 2 to Pin 3
20
25
Clamping Voltage - VC (V)
Clamping Voltage - VC (V)
18
20
15
10
Waveform
Parameters:
tr = 8μs
td = 20μs
5
16
14
12
10
8
6
Waveform
Parameters:
tr = 8μs
td = 20μs
4
2
0
0
0
1
2
3
4
5
0
6
1
Normalized Capacitance vs. Reverse Voltage
Pin 1 or Pin 2 to Pin 3
3
4
5
6
Normalized Capacitance vs. Reverse Voltage
Pin 1 to Pin 2
1.2
1.4
f = 1 MHz
1.2
1
1
CJ(VR) / CJ(VR=0)
CJ(VR) / CJ(VR=0)
2
Peak Pulse Current - IPP (A)
Peak Pulse Current - IPP (A)
0.8
0.6
0.4
0.8
0.6
0.4
0.2
f = 1 MHz
0.2
0
0
1
© 2010 Semtech Corp.
2
3
Reverse Voltage - VR (V)
4
0
5
3
1
2
3
Reverse Voltage - VR (V)
4
5
www.semtech.com
RClamp0502BA
PROTECTION PRODUCTS
Typical Characteristics
Insertion Loss S21 (Pin 1 to Pin 2)
CH1 S21
LOG
Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3)
6 dB / REF 0 dB
CH1 S21
3
LOG
6 dB / REF 0 dB
1: .03430 dB
900 MHz
1: .00460 dB
900 MHz
2: .07870 dB
1.8 GHz
2: .02010 dB
1.8 GHz
3: .28040 dB
2.5 GHz
3
0 dB
3: -.08180 dB
2.5 GHz
0 dB
1
2
1
-6 dB
-6 dB
-12 dB
-12 dB
-18 dB
-18 dB
-24 dB
-24 dB
-30 dB
-30 dB
-36 dB
1
MHz
10
MHz
100
MHz
-36 dB
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
1
MHz
START . 030 MHz
ESD Clamping
(4kV Contact per IEC 61000-4-2)
10
MHz
100
MHz
2
3
1
GHz GHz
STOP 3000. 000000 MHz
ESD Clamping
(8kV Contact per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
Analog Crosstalk
CH1 S21
LOG
START . 030 MHz
© 2010 Semtech Corp.
20 dB /REF 0 dB
STOP 3000. 000000 MHz
4
www.semtech.com
RClamp0502BA
PROTECTION PRODUCTS
Applications Information
Figure 1. Pin Configuration
Device Connection Options
This device is optimized for protection of 1 line
operating in excess of 3GHz. It may also be used to
protect two lines operating in excess of 2.0GHz. The
device is connected as follows:
Protection for one line with <1pF capacitance can be
achieved by connecting one data line to either pin 1 or
pin 2 with the other pin connected to ground. Pin 3 is
not connected. The connection to ground should be
made directly to a ground plane. The path length
should also be kept as short as possible to minimize
parasitic inductance.
Protection of two lines is achieved by connecting data
lines at pins 1 & 2. Pin 3 is connected to ground. The
connection to ground should be made directly to a
ground plane. The path length should also be kept as
short as possible to minimize parasitic inductance.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
© 2010 Semtech Corp.
5
www.semtech.com
RClamp0502BA
PROTECTION PRODUCTS
Outline Drawing -SC-75 (SOT-523)
A
D
DIM
e1
B
A
A1
A2
b
c
D
E
E1
e
e1
L
N
0
aaa
bbb
3
E
E1
1
2
bxN
bbb
e
A
C A B
A2
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.023
.035
.000
.004
.023 .030 .031
.005
.012
.003
.008
.059 .063 .067
.057 .063 .069
.029 .031 .033
.039 BSC
.020 BSC
(.009)
3
0°
8°
.004
.008
0.60
0.00
0.60
0.15
0.10
1.50
1.45
0.75
0.75
-
0.90
0.10
0.80
0.30
0.20
1.60 1.70
1.60 1.75
0.80 0.85
1.00 BSC
0.50 BSC
(0.22)
3
0°
8°
0.10
0.20
aaa C
SEATING PLANE
A1
C
H
SEE DETAIL A
0
SEATING
PLANE
C
SIDE VIEW
c
L
DETAIL A
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B-
TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern -SC-75 (SOT-523)
X
Y
Z
C
DIM
C
P
p1
G
X
Y
Z
G
Y
DIMENSIONS
INCHES
MILLIMETERS
(.055)
.039
.020
.024
.016
.031
.087
(1.40)
1.00
0.50
0.60
0.40
0.80
2.20
p1
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2010 Semtech Corp.
6
www.semtech.com
RClamp0502BA
PROTECTION PRODUCTS
Marking
YW
P5
Ordering Information
Part Number
Lead
Finish
Qty per
Reel
Reel
Size
RClamp 0502BATCT
Pb Free
3,000
7 Inch
RailClamp and RClamp are registered marks of Semtech Corporation
YW = Date Code
Tape and Reel Specification
Device Orientation in Tape
A0
1.85 +/-0.15 mm
B0
K0
1.85 +/-0.15 mm
0.87 +/-0.15 mm
Tape
Width
B, (Max)
D
D1
( M IN )
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
(.039)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.3 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2010 Semtech Corp.
7
www.semtech.com
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertisement