MAX6957

MAX6957
MAX6957
RELIABILITY REPORT
FOR
MAX6957ATL+
PLASTIC ENCAPSULATED DEVICES
January 13, 2010
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX6957
Conclusion
The MAX6957ATL+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6957 compact, serial-interfaced LED display driver general-purpose I/O (GPIO) peripheral provides microprocessors with up to 28 ports.
Each port is individually user configurable to either a logic input, logic output, or common-anode (CA) LED constant-current segment driver. Each port
configured as an LED segment driver behaves as a digitally controlled constantcurrent sink, with 16 equal current steps from 1.5mA to 24mA. The
LED drivers are suitable for both discrete LEDs and CA numeric and alphanumeric LED digits. Each port configured as a GPIO can be either a
push-pull logic output capable of sinking 10mA and sourcing 4.5mA, or a Schmitt logic input with optional internal pullup. Seven ports feature
configurable transition detection logic, which generates an interrupt upon change of port logic level. The MAX6957 is controlled through an
SPI(tm)-compatible 4-wire serial interface. The MAX6957AAX and MAX6957ATL have 28 ports and are available in 36-pin SSOP and 40-pin TQFN
(6mm x 6mm) packages, respectively. The MAX6957AAI and MAX6957ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP packages,
respectively. For a 2-wire interfaced version, refer to the MAX6956 data sheet. For a lower cost pin-compatible port expander without the
constant-current LED drive capability, refer to the MAX7301 data sheet.
Maxim Integrated Products. All rights reserved.
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MAX6957
II. Manufacturing Information
A. Description/Function:
4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port LED Display Driver and
I/O Expander
B. Process:
TS50
C. Number of Device Transistors:
D. Fabrication Location:
Taiwan
E. Assembly Location:
China, Thailand
F. Date of Initial Production:
April 27, 2002
III. Packaging Information
A. Package Type:
40-pin TQFN 6x6
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-0424
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
38°C/W
K. Single Layer Theta Jc:
1.4°C/W
L. Multi Layer Theta Ja:
27°C/W
M. Multi Layer Theta Jc:
1.4°C/W
IV. Die Information
A. Dimensions:
122 X 104 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
0.50µm
F. Minimum Metal Spacing:
0.50µm
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
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MAX6957
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 45 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 23.9 x 10
= 23.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the TS50 Process results in a FIT Rate of 0.25 @ 25C and 6.11 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The DW43-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-100 mA.
Maxim Integrated Products. All rights reserved.
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MAX6957
Table 1
Reliability Evaluation Test Results
MAX6957ATL+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
45
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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