WM0011 Product Brief

WM0011 Product Brief
WM0011
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General Purpose Low-Power Audio DSP
DESCRIPTION
FEATURES
WM0011 Audio DSP provides Wolfson HD audio quality,
with a power-budget targeted at handheld battery-powered
audio devices.

Tensilica HiFi EP™ 24-bit audio digital signal processor
- C-programmable with advanced debugging and profiling
tool set
WM0011 combines the advanced Tensilica HiFi EP™ audio
DSP with an I/O and peripheral set optimized for flexible
integration into smartphones, tablets and other portable
consumer electronics devices. WM0011 is ideal for
extremely power-efficient implementations of advanced
voice enhancement, telephony noise reduction, voice and
music CODECs and general audio enhancement.
-
Local RAM memory
-
Instruction / Data cache memories
-
General-purpose system RAM
-
Flexible boot options supported within ROM
-
32 Channel DMA
-
XTAL or CMOS clock input
A very wide range of audio CODECs, voice CODECs and
third-party algorithms from such companies as Waves
Audio, SRS Labs and Dolby are available, providing a rich
portfolio of audio-processing options that can be integrated
into a device with no additional software development.
-
Low power programmable PLL
WM0011 comes in a space-saving 3x3mm 49-ball W-CSP
package with 0.4mm pitch.

Security
-

Support for HW Authentication
Random Number Generator (RNG) to assist security
algorithms
Peripherals
-
SPI Master / Slave interface
-
3 x multi-channel serial digital interface (I S, TDM)
APPLICATIONS
-
UART
I C Master

-
Wireless audio devices – headsets, microphones,
speakerphones
-
I C Slave

Portable media devices
-
3 x 32-bit general-purpose timer modules


Automotive
General purpose digital signal processor for consumer
audio applications.
-
Watchdog timer
-
On-chip JTAG debug unit and trace buffer
-
GPIO

Smartphones
WOLFSON MICROELECTRONICS plc

2
2
2
Software-defined standby modes for extended battery life
Product Brief, August 2013, Rev 4.1
Copyright 2013 Wolfson Microelectronics plc
WM0011
Product Brief
TDI
TDO
TMSDFT
TCK
TRST
TDEBUG / TMSDEBUG
UARTTX / SCLK1 /
SCLK2 / GPIO23
UARTRX / SDA1 /
SDA2 / GPIO22
PROGVDD
AVDD
DGND
DGND
DCVDD
DBVDD1
DBVDD2
DBVDD3
BLOCK DIAGRAM
MUX 2 (UART with I2CM and I2CS)
32kB Boot ROM
64kB Instruction RAM 1
I2C
Module 1
(Slave)
Timer
Module
I2C
Module 2
(Master)
UART
JTAG Module
Watchdog
Module
64kB Instruction RAM 2
64kB Data RAM 2
RESET
STANDBY
IRQ
DMA
Module
with
SHA-256
Fuses
TRAX Trace Buffer Module
On-Chip Debug Module
12kB Instruction Cache
24kB Data Cache
CLKOUT / GPIO28
RNG
AIF2TXDAT
AIF2RXDAT
AIF2LRCLK
AIF2BCLK
Bypass
AIF1TXDAT
AIF1RXDAT
AIF1LRCLK
AIF1BCLK
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AIF2
Module
AIF3
Module
SPI
Module
PLL
XTI
XTO
PLLC
GPIO
MUX 1 (I2S and SPI)
AIF3LRCLK / SPISS / GPIO17
AIF3TXDAT / SPIMOSI / GPIO18
AIF3RXDAT / SPIMISO / GPIO19
AIF3BCLK / SPISCLK
AIF1
Module
WM0011
Chip Config
Module
Tensilica Hi-Fi EP™
DSP Core
PKA
384kB System RAM
TOCDRST
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
64kB Data RAM 1
Product Brief, Rev 4.1, August 2013
2
WM0011
Product Brief
PIN CONFIGURATION
ORDERING INFORMATION
DEVICE
CUSTOM
FUSES
TEMPERATURE
RANGE
PACKAGE
MOISTURE
SENSITIVITY
LEVEL
PEAK
SOLDERING
TEMPERATURE
WM0011ECS/R
Un-programmed
-40 to +85°C
49-ball W-CSP
(Pb-free, Tape and reel)
MSL1
260°C
WM0011xxxECS/R
CustomProgrammed
-40 to +85°C
49-ball W-CSP
(Pb-free, Tape and reel)
MSL1
260°C
Note:
Reel quantity = 5000
* xxx = Unique Custom Fuse part number
** Custom programmed minimum order quantity 50,000.
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Product Brief, Rev 4.1, August 2013
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WM0011
Product Brief
PACKAGE DIAGRAM
B: 49 BALL W-CSP PACKAGE 3.055 X 3.055 X 0.636mm BODY, 0.40 mm BALL PITCH
DM114.B
3
D
A
DETAIL 1
g
7
A2
5
6
4
3
1
2
A
A1
CORNER
2
A
B
C
e
4
D
E1
E
3
E
F
G
2X
ddd
e
DETAIL 2
M
Z AB
2X
4
aaa B
B
aaa A
TOP VIEW
D1
BOTTOM VIEW
f1
SOLDER BALL
bbb Z
f2
h
1
Z
ccc
Z
A1
DETAIL 2
Symbols
A
A1
A2
D
D1
E
E1
e
MIN
0.592
0.175
0.381
3.000
3.000
Dimensions (mm)
NOM
MAX
0.681
0.636
0.205
0.190
0.406
0.432
3.055
3.080
2.400 BSC
3.080
3.055
2.400 BSC
0.400 BSC
0.328
f1
0.300
f2
0.300
h
g
0.216
0.270
0.324
0.036
0.040
0.10
0.10
0.044
aaa
bbb
ccc
ddd
0.328
DETAIL 1
NOTE
4
Bump centre to
die edge
Bump centre to
die edge
0.03
0.015
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
3. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
4. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
5. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
6. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
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Product Brief, Rev 4.1, August 2013
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Product Brief
WM0011
IMPORTANT NOTICE
Wolfson Microelectronics plc (“Wolfson”) products and services are sold subject to Wolfson’s terms and conditions of sale, delivery
and payment supplied at the time of order acknowledgement.
Wolfson warrants performance of its products to the specifications in effect at the date of shipment. Wolfson reserves the right to
make changes to its products and specifications or to discontinue any product or service without notice. Customers should therefore
obtain the latest version of relevant information from Wolfson to verify that the information is current.
Testing and other quality control techniques are utilised to the extent Wolfson deems necessary to support its warranty. Specific
testing of all parameters of each device is not necessarily performed unless required by law or regulation.
In order to minimise risks associated with customer applications, the customer must use adequate design and operating safeguards
to minimise inherent or procedural hazards. Wolfson is not liable for applications assistance or customer product design. The
customer is solely responsible for its selection and use of Wolfson products. Wolfson is not liable for such selection or use nor for
use of any circuitry other than circuitry entirely embodied in a Wolfson product.
Wolfson’s products are not intended for use in life support systems, appliances, nuclear systems or systems where malfunction can
reasonably be expected to result in personal injury, death or severe property or environmental damage. Any use of products by the
customer for such purposes is at the customer’s own risk.
Wolfson does not grant any licence (express or implied) under any patent right, copyright, mask work right or other intellectual
property right of Wolfson covering or relating to any combination, machine, or process in which its products or services might be or
are used. Any provision or publication of any third party’s products or services does not constitute Wolfson’s approval, licence,
warranty or endorsement thereof. Any third party trade marks contained in this document belong to the respective third party owner.
Reproduction of information from Wolfson datasheets is permissible only if reproduction is without alteration and is accompanied by
all associated copyright, proprietary and other notices (including this notice) and conditions.
Wolfson is not liable for any
unauthorised alteration of such information or for any reliance placed thereon.
Any representations made, warranties given, and/or liabilities accepted by any person which differ from those contained in this
datasheet or in Wolfson’s standard terms and conditions of sale, delivery and payment are made, given and/or accepted at that
person’s own risk. Wolfson is not liable for any such representations, warranties or liabilities or for any reliance placed thereon by
any person.
ADDRESS:
Wolfson Microelectronics plc
Westfield House
26 Westfield Road
Edinburgh
EH11 2QB
Tel :: +44 (0)131 272 7000
Fax :: +44 (0)131 272 7001
Email :: [email protected]
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Product Brief, Rev 4.1, August 2013
5
WM0011
Product Brief
REVISION HISTORY
DATE
REV
17/07/12
1.1
First Release
DESCRIPTION OF CHANGES
19/10/12
2.0
Pin G4 and E1 names updated
PH
07/02/13
3.0
Change to document title, aligning with datasheet
Block diagram updated (CLK DIV now labeled as Chip Config Module)
PH
20/05/13
4.0
Pin Description updates (name changes only)
PH
21/08/13
4.1
Front page description updated
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PAGE
CHANGED BY
RR/RD
JMacD
Product Brief, Rev 4.1, August 2013
6
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