LM117/LM317A/LM317 3-Terminal Adjustable Regulator LM117 FEATURES

LM117/LM317A/LM317 3-Terminal Adjustable Regulator LM117 FEATURES
LM117, LM317-N
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LM117/LM317A/LM317 3-Terminal Adjustable Regulator
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FEATURES
1
•
2
•
•
Guaranteed 1% output voltage tolerance
(LM317A)
Guaranteed max. 0.01%/V line regulation
(LM317A)
Guaranteed max. 0.3% load regulation (LM117)
•
•
•
•
•
•
Guaranteed 1.5A output current
Adjustable output down to 1.2V
Current limit constant with temperature
P+ Product Enhancement tested
80 dB ripple rejection
Output is short-circuit protected
DESCRIPTION
The LM117 series of adjustable 3-terminal positive voltage regulators is capable of supplying in excess of 1.5A
over a 1.2V to 37V output range. They are exceptionally easy to use and require only two external resistors to
set the output voltage. Further, both line and load regulation are better than standard fixed regulators. Also, the
LM117 is packaged in standard transistor packages which are easily mounted and handled.
In addition to higher performance than fixed regulators, the LM117 series offers full overload protection available
only in IC's. Included on the chip are current limit, thermal overload protection and safe area protection. All
overload protection circuitry remains fully functional even if the adjustment terminal is disconnected.
Normally, no capacitors are needed unless the device is situated more than 6 inches from the input filter
capacitors in which case an input bypass is needed. An optional output capacitor can be added to improve
transient response. The adjustment terminal can be bypassed to achieve very high ripple rejection ratios which
are difficult to achieve with standard 3-terminal regulators.
Besides replacing fixed regulators, the LM117 is useful in a wide variety of other applications. Since the regulator
is “floating” and sees only the input-to-output differential voltage, supplies of several hundred volts can be
regulated as long as the maximum input to output differential is not exceeded, i.e., avoid short-circuiting the
output.
Also, it makes an especially simple adjustable switching regulator, a programmable output regulator, or by
connecting a fixed resistor between the adjustment pin and output, the LM117 can be used as a precision current
regulator. Supplies with electronic shutdown can be achieved by clamping the adjustment terminal to ground
which programs the output to 1.2V where most loads draw little current.
For applications requiring greater output current, see LM150 series (3A) and LM138 series (5A) data sheets. For
the negative complement, see LM137 series data sheet.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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LM117, LM317-N
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Typical Applications
Figure 1. 1.2V–25V Adjustable Regulator
Full output current not available at high input-output voltages
*Needed if device is more than 6 inches from filter capacitors.
†Optional—improves transient response. Output capacitors in the range of 1μF to 1000μF of aluminum or tantalum
electrolytic are commonly used to provide improved output impedance and rejection of transients.
Table 1. LM117/LM317A/LM317 Package Options
Part
Number
Suffix
Package
Output
Current
LM117, LM317
K
TO-3
1.5A
LM317A, LM317
T
TO-220
1.5A
LM317
S
TO-263
1.5A
LM317A, LM317
EMP
SOT-223
1.0A
LM117, LM317A, LM317
H
TO-39
0.5A
LM117
E
LCC
0.5A
LM317A, LM317
MDT
TO-252
0.5A
SOT-223 vs. TO-252 (D-Pak) Packages
Figure 2. Scale 1:1
Connection Diagrams
CASE IS OUTPUT
Figure 3. TO-3 (K)
Metal Can Package
2
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CASE IS OUTPUT
Figure 4. TO-39 (H)
Metal Can Package
Figure 5. TO-263 (S)
Surface-Mount Package
Figure 6. TO-220 (T)
Plastic Package
Figure 7. TO-263 (S)
Surface-Mount Package
Figure 8. Ceramic Leadless
Chip Carrier (E)
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Figure 9. 4-Lead SOT-223 (EMP)
Figure 10. TO-252 (MDT)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Power Dissipation
Internally Limited
+40V, −0.3V
Input-Output Voltage Differential
−65°C to +150°C
Storage Temperature
Lead Temperature
Metal Package (Soldering, 10 seconds)
300°C
Plastic Package (Soldering, 4 seconds)
260°C
ESD Tolerance
(1)
(2)
(2)
3 kV
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Operating Temperature Range
LM117
−55°C ≤ TJ ≤ +150°C
LM317A
−40°C ≤ TJ ≤ +125°C
0°C ≤ TJ ≤ +125°C
LM317
Preconditioning
Thermal Limit Burn-In
4
All Devices 100%
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LM117 Electrical Characteristics (1)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
Parameter
Conditions
Reference Voltage
3V ≤ (VIN − VOUT) ≤ 40V,
10 mA ≤ IOUT ≤ IMAX (1)
Line Regulation
3V ≤ (VIN − VOUT) ≤ 40V
Load Regulation
10 mA ≤ IOUT ≤ IMAX (1)
Thermal Regulation
20 ms Pulse
LM117
Min
Typ
Max
Units
1.20
1.25
1.30
V
0.01
0.02
0.02
0.05
%/V
0.1
0.3
0.3
1
%
0.03
0.07
%/W
50
100
μA
0.2
5
μA
(3)
(3)
Adjustment Pin Current
Adjustment Pin Current Change
10 mA ≤ IOUT ≤ IMAX (1)
3V ≤ (VIN − VOUT) ≤ 40V
Temperature Stability
TMIN ≤ TJ ≤ TMAX
Minimum Load Current
(VIN − VOUT) = 40V
(2)
1
%
3.5
5
mA
1.5
0.5
2.2
0.8
3.4
1.8
A
0.3
0.15
0.4
0.20
(VIN − VOUT) ≤ 15V
Current Limit
K Package
H, E Package
(VIN − VOUT) = 40V
K Package
H, E Package
RMS Output Noise, % of VOUT
Ripple Rejection Ratio
10 Hz ≤ f ≤ 10 kHz
VOUT = 10V, f = 120 Hz, CADJ = 0 μF
VOUT = 10V, f = 120 Hz, CADJ = 10 μF
66
A
0.003
%
65
dB
80
dB
Long-Term Stability
TJ = 125°C, 1000 hrs
0.3
Thermal Resistance, θJC
Junction-to-Case
K (TO-3) Package
H (TO-39) Package
E (LCC) Package
2
21
12
°C/W
Thermal Resistance, θJA
Junction-to-Ambient
(No Heat Sink)
K (TO-3) Package
H (TO-39) Package
E (LCC) Package
39
186
88
°C/W
(1)
(2)
(3)
1
%
IMAX = 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. IMAX = 1.0A for the EMP (SOT-223) package. IMAX = 0.5A for the H
(TO-39), MDT (TO-252), and E (LCC) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum
junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is :
PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are guaranteed to National's Average Outgoing Quality Level (AOQL).
Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
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LM317A and LM317 Electrical Characteristics (1)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
Parameter
Conditions
Reference Voltage
3V ≤ (VIN − VOUT) ≤ 40V,
10 mA ≤ IOUT ≤ IMAX (1)
Line Regulation
3V ≤ (VIN − VOUT) ≤ 40V
Load Regulation
10 mA ≤ IOUT ≤ IMAX (1)
Thermal Regulation
20 ms Pulse
LM317A
Typ
Max
Min
Typ
Max
Units
1.238
1.250
1.262
-
1.25
-
V
1.225
1.250
1.270
1.20
1.25
1.30
V
0.005
0.01
0.01
0.02
0.01
0.02
0.04
0.07
%/V
0.1
0.3
0.5
1
0.1
0.3
0.5
1.5
%
0.04
0.07
0.04
0.07
%/W
50
100
50
100
μA
0.2
5
0.2
5
μA
3.5
10
3.5
10
mA
1.5
0.5
2.2
0.8
3.4
1.8
1.5
1.5
0.5
2.2
2.2
0.8
3.4
3.4
1.8
A
0.112
0.075
0.30
0.20
0.15
0.112
0.075
0.40
0.30
0.20
A
0.003
%
65
dB
(2)
(2)
Adjustment Pin Current
Adjustment Pin Current Change
10 mA ≤ IOUT ≤ IMAX (1)
3V ≤ (VIN − VOUT) ≤ 40V
Temperature Stability
TMIN ≤ TJ ≤ TMAX
Minimum Load Current
(VIN − VOUT) = 40V
LM317
Min
1
1
%
(VIN − VOUT) ≤ 15V
Current Limit
K, S Packages
EMP, T Packages
H, MDT Packages
(VIN − VOUT) = 40V
K, S Packages
EMP, T Packages
H, MDT Packages
RMS Output Noise, % of VOUT
Ripple Rejection Ratio
10 Hz ≤ f ≤ 10 kHz
0.003
VOUT = 10V, f = 120 Hz, CADJ = 0 μF
VOUT = 10V, f = 120 Hz, CADJ = 10 μF
65
66
80
66
TJ = 125°C, 1000 hrs
0.3
Thermal Resistance, θJC
Junction-to-Case
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package
EMP (SOT-223) Package
H (TO-39) Package
MDT (TO-252) Package
4
23.5
21
12
2
4
4
23.5
21
12
°C/W
Thermal Resistance, θJA
Junction-to-Ambient
(No Heat Sink)
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package (3)
EMP (SOT-223) Package (3)
H (TO-39) Package
MDT (TO-252) Package (3)
50
140
186
103
39
50
50
140
186
103
°C/W
(2)
(3)
6
0.3
dB
Long-Term Stability
(1)
1
80
1
%
IMAX = 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. IMAX = 1.0A for the EMP (SOT-223) package. IMAX = 0.5A for the H
(TO-39), MDT (TO-252), and E (LCC) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum
junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is :
PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are guaranteed to National's Average Outgoing Quality Level (AOQL).
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by
increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink
techniques.
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Typical Performance Characteristics
Output Capacitor = 0 μF unless otherwise noted
Load Regulation
Current Limit
Adjustment Current
Dropout Voltage
VOUT
vs
VIN, VOUT = VREF
VOUT
vs
VIN, VOUT = 5V
Temperature Stability
Minimum Operating Current
Ripple Rejection
Ripple Rejection
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Typical Performance Characteristics (continued)
Output Capacitor = 0 μF unless otherwise noted
Ripple Rejection
Output Impedance
Line Transient Response
Load Transient Response
Application Hints
In operation, the LM117 develops a nominal 1.25V reference voltage, VREF, between the output and adjustment
terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is constant, a
constant current I1 then flows through the output set resistor R2, giving an output voltage of
(1)
Since the 100μA current from the adjustment terminal represents an error term, the LM117 was designed to
minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating current is
returned to the output establishing a minimum load current requirement. If there is insufficient load on the output,
the output will rise.
EXTERNAL CAPACITORS
An input bypass capacitor is recommended. A 0.1μF disc or 1μF solid tantalum on the input is suitable input
bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when
adjustment or output capacitors are used but the above values will eliminate the possibility of problems.
The adjustment terminal can be bypassed to ground on the LM117 to improve ripple rejection. This bypass
capacitor prevents ripple from being amplified as the output voltage is increased. With a 10 μF bypass capacitor
80dB ripple rejection is obtainable at any output level. Increases over 10 μF do not appreciably improve the
ripple rejection at frequencies above 120Hz. If the bypass capacitor is used, it is sometimes necessary to include
protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the
device.
8
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In general, the best type of capacitors to use is solid tantalum. Solid tantalum capacitors have low impedance
even at high frequencies. Depending upon capacitor construction, it takes about 25 μF in aluminum electrolytic to
equal 1μF solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some
types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01 μF disc may
seem to work better than a 0.1 μF disc as a bypass.
Although the LM117 is stable with no output capacitors, like any feedback circuit, certain values of external
capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1 μF solid
tantalum (or 25 μF aluminum electrolytic) on the output swamps this effect and insures stability. Any increase of
the load capacitance larger than 10 μF will merely improve the loop stability and output impedance.
LOAD REGULATION
The LM117 is capable of providing extremely good load regulation but a few precautions are needed to obtain
maximum performance. The current set resistor connected between the adjustment terminal and the output
terminal (usually 240Ω) should be tied directly to the output (case) of the regulator rather than near the load. This
eliminates line drops from appearing effectively in series with the reference and degrading regulation. For
example, a 15V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to
line resistance of 0.05Ω × IL. If the set resistor is connected near the load the effective line resistance will be
0.05Ω (1 + R2/R1) or in this case, 11.5 times worse.
Figure 11 shows the effect of resistance between the regulator and 240Ω set resistor.
Figure 11. Regulator with Line Resistance in Output Lead
With the TO-3 package, it is easy to minimize the resistance from the case to the set resistor, by using two
separate leads to the case. However, with the TO-39 package, care should be taken to minimize the wire length
of the output lead. The ground of R2 can be returned near the ground of the load to provide remote ground
sensing and improve load regulation.
PROTECTION DIODES
When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to
prevent the capacitors from discharging through low current points into the regulator. Most 10 μF capacitors have
low enough internal series resistance to deliver 20A spikes when shorted. Although the surge is short, there is
enough energy to damage parts of the IC.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge
into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage
of the regulator, and the rate of decrease of VIN. In the LM117, this discharge path is through a large junction that
is able to sustain 15A surge with no problem. This is not true of other types of positive regulators. For output
capacitors of 25 μF or less, there is no need to use diodes.
The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs
when either the input, or the output, is shorted. Internal to the LM117 is a 50Ω resistor which limits the peak
discharge current. No protection is needed for output voltages of 25V or less and 10 μF capacitance. Figure 12
shows an LM117 with protection diodes included for use with outputs greater than 25V and high values of output
capacitance.
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D1 protects against C1
D2 protects against C2
Figure 12. Regulator with Protection Diodes
HEATSINK REQUIREMENTS
The LM317 regulators have internal thermal shutdown to protect the device from over-heating. Under all
operating conditions, the junction temperature of the LM317 should not exceed the rated maximum junction
temperature (TJ) of 150°C for the LM117, or 125°C for the LM317A and LM317. A heatsink may be required
depending on the maximum device power dissipation and the maximum ambient temperature of the application.
To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be calculated:
PD = ((VIN − VOUT) × IL) + (VIN × IG)
(2)
Figure 13 shows the voltage and currents which are present in the circuit.
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX):
TR(MAX) = TJ(MAX) − TA(MAX)
(3)
where TJ(MAX) is the maximum allowable junction temperature (150°C for the LM117, or 125°C for the
LM317A/LM317), and TA(MAX) is the maximum ambient temperature which will be encountered in the application.
Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (θJA) can be calculated:
θJA = (TR(MAX) / PD)
(4)
Figure 13. Power Dissipation Diagram
10
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If the calculated maximum allowable thermal resistance is higher than the actual package rating, then no
additional work is needed. If the calculated maximum allowable thermal resistance is lower than the actual
package rating either the power dissipation (PD) needs to be reduced, the maximum ambient temperature TA(MAX)
needs to be reduced, the thermal resistance (θJA) must be lowered by adding a heatsink, or some combination of
these.
If a heatsink is needed, the value can be calculated from the formula:
θHA ≤ (θJA - (θCH + θJC))
(5)
where (θCH is the thermal resistance of the contact area between the device case and the heatsink surface, and
θJC is thermal resistance from the junction of the die to surface of the package case.
When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is
less than, or equal to, this number.
The θ(H−A) rating is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that
plots temperature rise vs power dissipation for the heatsink.
HEATSINKING SURFACE MOUNT PACKAGES
The TO-263 (S), SOT-223 (EMP) and TO-252 (MDT) packages use a copper plane on the PCB and the PCB
itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to
the plane.
HEATSINKING THE SOT-223 PACKAGE
Figure 14 and Figure 15 show the information for the SOT-223 package. Figure 15 assumes a θ(J−A) of 74°C/W
for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Please see
AN-1028 for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.
Figure 14. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package
Figure 15. Maximum Power Dissipation vs TAMB for the SOT-223 Package
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HEATSINKING THE TO-263 PACKAGE
Figure 16 shows for the TO-263 the measured values of θ(J−A) for different copper area sizes using a typical PCB
with 1 ounce copper and no solder mask over the copper area used for heatsinking.
As shown in Figure 16, increasing the copper area beyond 1 square inch produces very little improvement. It
should also be observed that the minimum value of θ(J−A) for the TO-263 package mounted to a PCB is 32°C/W.
Figure 16. θ(J−A) vs Copper (1 ounce) Area for the TO-263 Package
As a design aid, Figure 17 shows the maximum allowable power dissipation compared to ambient temperature
for the TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C).
Figure 17. Maximum Power Dissipation vs TAMB for the TO-263 Package
HEATSINKING THE TO-252 PACKAGE
If the maximum allowable value for θJA is found to be ≥103°C/W (Typical Rated Value) for TO-252 package, no
heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the
calculated value for θJA falls below these limits, a heatsink is required.
As a design aid, Table 2 shows the value of the θJA of TO-252 for different heatsink area. The copper patterns
that we used to measure these θJAs are shown at the end of the Application Notes Section. Figure 18 reflects the
same test results as what are in Table 2.
Figure 19 shows the maximum allowable power dissipation vs. ambient temperature for the TO-252 device.
Figure 20 shows the maximum allowable power dissipation vs. copper area (in2) for the TO-252 device. Please
see AN-1028 for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.
Table 2. θJA Different Heatsink Area
Layout
Copper Area
2
12
Thermal Resistance
2
Top Side (in )*
Bottom Side (in )
(θJA°C/W) TO-252
1
0.0123
0
103
2
0.066
0
87
3
0.3
0
60
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Table 2. θJA Different Heatsink Area (continued)
Layout
Copper Area
Thermal Resistance
4
0.53
0
54
5
0.76
0
52
6
1.0
0
47
7
0.066
0.2
84
8
0.066
0.4
70
9
0.066
0.6
63
10
0.066
0.8
57
11
0.066
1.0
57
12
0.066
0.066
89
13
0.175
0.175
72
14
0.284
0.284
61
15
0.392
0.392
55
16
0.5
0.5
53
NOTE
* Tab of device attached to topside of copper.
Figure 18. θJA vs 2oz Copper Area for TO-252
Figure 19. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
Figure 20. Maximum Allowable Power Dissipation vs. 2oz Copper Area for TO-252
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Figure 21. Top View of the Thermal Test Pattern in Actual Scale
Figure 22. Bottom View of the Thermal Test Pattern in Actual Scale
14
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Schematic Diagram
Typical Applications
Figure 23. 5V Logic Regulator with Electronic Shutdown*
*Min. output ≊ 1.2V
Figure 24. Slow Turn-On 15V Regulator
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Figure 25. Adjustable Regulator with Improved Ripple Rejection
†Solid tantalum
*Discharges C1 if output is shorted to ground
Figure 26. High Stability 10V Regulator
Figure 27. High Current Adjustable Regulator
‡Optional—improves ripple rejection
†Solid tantalum
*Minimum load current = 30 mA
16
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
LM117, LM317-N
www.ti.com
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 28. 0 to 30V Regulator
Full output current not available at high input-output voltages
Figure 29. Power Follower
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
17
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
www.ti.com
Figure 30. 5A Constant Voltage/Constant Current Regulator
†Solid tantalum
*Lights in constant current mode
Figure 31. 1A Current Regulator
Figure 32. 1.2V–20V Regulator with Minimum Program Current
*Minimum load current ≊ 4 mA
18
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
LM117, LM317-N
www.ti.com
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 33. High Gain Amplifier
Figure 34. Low Cost 3A Switching Regulator
†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
19
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
www.ti.com
Figure 35. 4A Switching Regulator with Overload Protection
†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Figure 36. Precision Current Limiter
Figure 37. Tracking Preregulator
20
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Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
LM117, LM317-N
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SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 38. Current Limited Voltage Regulator
(Compared to LM117's higher current limit)
—At 50 mA output only ¾ volt of drop occurs in R3 and R4
Figure 39. Adjusting Multiple On-Card Regulators with Single Control*
*All outputs within ±100 mV
†Minimum load—10 mA
Figure 40. AC Voltage Regulator
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
21
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
www.ti.com
Figure 41. 12V Battery Charger
Use of RS allows low charging rates with fully charged battery.
Figure 42. 50mA Constant Current Battery Charger
Figure 43. Adjustable 4A Regulator
22
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
LM117, LM317-N
www.ti.com
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 44. Current Limited 6V Charger
*Sets peak current (0.6A for 1Ω)
**The 1000μF is recommended to filter out input transients
Figure 45. Digitally Selected Outputs
*Sets maximum VOUT
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
23
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
CU SNPB
MSL Peak Temp
Samples
(3)
(Requires Login)
LM117GW/883
ACTIVE
CLGA
NAC
16
42
TBD
Level-1-NA-UNLIM
LM117H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM117H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM117K
ACTIVE
TO-3
NDS
2
50
TBD
POST-PLATE Level-1-NA-UNLIM
LM117K STEEL
ACTIVE
TO-3
NDS
2
50
TBD
POST-PLATE Level-1-NA-UNLIM
LM117K STEEL/NOPB
ACTIVE
TO-3
NDS
2
50
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM317AEMP
ACTIVE
SOT-223
DCY
4
1000
TBD
CU SNPB
Level-1-260C-UNLIM
LM317AEMP/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM317AEMPX/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM317AH
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM317AH/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM317AMDT
ACTIVE
PFM
NDP
3
75
TBD
CU SNPB
Level-1-235C-UNLIM
LM317AMDT/NOPB
ACTIVE
PFM
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
LM317AMDTX
ACTIVE
PFM
NDP
3
2500
TBD
CU SNPB
Level-1-235C-UNLIM
LM317AMDTX/NOPB
ACTIVE
PFM
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
LM317AT
ACTIVE
TO-220
NDE
3
45
TBD
CU SNPB
Level-1-NA-UNLIM
LM317AT/NOPB
ACTIVE
TO-220
NDE
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
LM317EMP
ACTIVE
SOT-223
DCY
4
1000
TBD
CU SNPB
Level-1-260C-UNLIM
LM317EMP/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM317EMPX/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2012
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Samples
(3)
(Requires Login)
LM317H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM317H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM317K STEEL
ACTIVE
TO-3
NDS
2
50
TBD
POST-PLATE Level-1-NA-UNLIM
LM317K STEEL/NOPB
ACTIVE
TO-3
NDS
2
50
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
LM317MDT/NOPB
ACTIVE
PFM
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
LM317MDTX/NOPB
ACTIVE
PFM
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
LM317S/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
LM317SX/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
LM317T
ACTIVE
TO-220
NDE
3
45
TBD
CU SNPB
LM317T/LF01
ACTIVE
TO-220
NDG
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-4-260C-72 HR
LM317T/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
Level-1-NA-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
(3)
16-Nov-2012
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM317AEMP
SOT-223
DCY
4
1000
330.0
16.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
7.0
7.5
2.2
12.0
16.0
Q3
LM317AEMP/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317AEMPX/NOPB
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317AMDTX
PFM
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM317AMDTX/NOPB
PFM
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM317EMP
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317EMP/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317EMPX/NOPB
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317MDTX/NOPB
PFM
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM317SX/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM317AEMP
SOT-223
DCY
4
1000
349.0
337.0
45.0
LM317AEMP/NOPB
SOT-223
DCY
4
1000
349.0
337.0
45.0
LM317AEMPX/NOPB
SOT-223
DCY
4
2000
354.0
340.0
35.0
LM317AMDTX
PFM
NDP
3
2500
354.0
340.0
35.0
LM317AMDTX/NOPB
PFM
NDP
3
2500
358.0
343.0
63.0
LM317EMP
SOT-223
DCY
4
1000
349.0
337.0
45.0
LM317EMP/NOPB
SOT-223
DCY
4
1000
349.0
337.0
45.0
LM317EMPX/NOPB
SOT-223
DCY
4
2000
354.0
340.0
35.0
LM317MDTX/NOPB
PFM
NDP
3
2500
358.0
343.0
63.0
LM317SX/NOPB
DDPAK/TO-263
KTT
3
500
358.0
343.0
63.0
Pack Materials-Page 2
MECHANICAL DATA
NAC0016A
WG16A (RevG)
www.ti.com
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDS0002A
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDG0003F
T03F (Rev B)
www.ti.com
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
1,80 (0.071) MAX
3
0°–10°
0,10 (0.004) M
0,25 (0.010)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters (inches).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.
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• DALLAS, TEXAS 75265
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