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LM117, LM317-N www.ti.com
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
LM117/LM317A/LM317 3-Terminal Adjustable Regulator
Check for Samples: LM117 , LM317-N
1
FEATURES
2
• Guaranteed 1% output voltage tolerance
(LM317A)
• Guaranteed max. 0.01%/V line regulation
(LM317A)
• Guaranteed max. 0.3% load regulation (LM117)
• Guaranteed 1.5A output current
• Adjustable output down to 1.2V
• Current limit constant with temperature
• P
+
Product Enhancement tested
• 80 dB ripple rejection
• Output is short-circuit protected
DESCRIPTION
The LM117 series of adjustable 3-terminal positive voltage regulators is capable of supplying in excess of 1.5A
over a 1.2V to 37V output range. They are exceptionally easy to use and require only two external resistors to set the output voltage. Further, both line and load regulation are better than standard fixed regulators. Also, the
LM117 is packaged in standard transistor packages which are easily mounted and handled.
In addition to higher performance than fixed regulators, the LM117 series offers full overload protection available only in IC's. Included on the chip are current limit, thermal overload protection and safe area protection. All overload protection circuitry remains fully functional even if the adjustment terminal is disconnected.
Normally, no capacitors are needed unless the device is situated more than 6 inches from the input filter capacitors in which case an input bypass is needed. An optional output capacitor can be added to improve transient response. The adjustment terminal can be bypassed to achieve very high ripple rejection ratios which are difficult to achieve with standard 3-terminal regulators.
Besides replacing fixed regulators, the LM117 is useful in a wide variety of other applications. Since the regulator is “floating” and sees only the input-to-output differential voltage, supplies of several hundred volts can be regulated as long as the maximum input to output differential is not exceeded, i.e., avoid short-circuiting the output.
Also, it makes an especially simple adjustable switching regulator, a programmable output regulator, or by connecting a fixed resistor between the adjustment pin and output, the LM117 can be used as a precision current regulator. Supplies with electronic shutdown can be achieved by clamping the adjustment terminal to ground which programs the output to 1.2V where most loads draw little current.
For applications requiring greater output current, see LM150 series (3A) and LM138 series (5A) data sheets. For the negative complement, see LM137 series data sheet.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2004–2011, Texas Instruments Incorporated
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Typical Applications
Figure 1. 1.2V–25V Adjustable Regulator www.ti.com
Full output current not available at high input-output voltages
*Needed if device is more than 6 inches from filter capacitors.
†Optional—improves transient response. Output capacitors in the range of 1 μ F to 1000 μ F of aluminum or tantalum electrolytic are commonly used to provide improved output impedance and rejection of transients.
Table 1. LM117/LM317A/LM317 Package Options
Part
Number
LM117, LM317
LM317A, LM317
LM317
LM317A, LM317
LM117, LM317A, LM317
LM117
LM317A, LM317
Suffix
K
T
S
EMP
H
E
MDT
Package
TO-3
TO-220
TO-263
SOT-223
TO-39
LCC
TO-252
SOT-223 vs. TO-252 (D-Pak) Packages
Output
Current
1.5A
1.5A
1.5A
1.0A
0.5A
0.5A
0.5A
Figure 2. Scale 1:1
Connection Diagrams
CASE IS OUTPUT
Figure 3. TO-3 (K)
Metal Can Package
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CASE IS OUTPUT
Figure 4. TO-39 (H)
Metal Can Package
Figure 5. TO-263 (S)
Surface-Mount Package
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 6. TO-220 (T)
Plastic Package
Figure 7. TO-263 (S)
Surface-Mount Package
Figure 8. Ceramic Leadless
Chip Carrier (E)
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LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 9. 4-Lead SOT-223 (EMP) www.ti.com
Figure 10. TO-252 (MDT)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Power Dissipation
Input-Output Voltage Differential
Storage Temperature
Lead Temperature
Metal Package (Soldering, 10 seconds)
Plastic Package (Soldering, 4 seconds)
ESD Tolerance
(2)
Internally Limited
+40V, − 0.3V
− 65°C to +150°C
300°C
260°C
3 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
(2) Human body model, 100 pF discharged through a 1.5 k
Ω resistor.
Operating Temperature Range
LM117
LM317A
LM317
− 55°C ≤ T
J
≤ +150°C
− 40°C ≤ T
J
≤ +125°C
0°C ≤ T
J
≤ +125°C
Preconditioning
Thermal Limit Burn-In All Devices 100%
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SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
LM117 Electrical Characteristics
(1)
Specifications with standard type face are for T
J
= 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, V
IN
− V
OUT
= 5V, and I
OUT
= 10 mA.
LM117
(2)
Parameter Conditions
Min Typ Max
Reference Voltage
3V ≤ (V
IN
10 mA ≤ I
− V
OUT
OUT
≤ I
) ≤ 40V,
(1)
MAX
1.20
1.25
1.30
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
3V ≤ (V
IN
− V
OUT
) ≤ 40V
(3)
10 mA ≤ I
OUT
≤ I
MAX
(1) (3)
20 ms Pulse
0.01
0.02
0.1
0.3
0.03
50
0.02
0.05
0.3
1
0.07
100
Adjustment Pin Current Change
Temperature Stability
Minimum Load Current
Current Limit
RMS Output Noise, % of V
OUT
Ripple Rejection Ratio
Long-Term Stability
Thermal Resistance, θ
JC
Junction-to-Case
Thermal Resistance, θ
JA
Junction-to-Ambient
(No Heat Sink)
10 mA ≤ I
OUT
3V ≤ (V
IN
− V
≤ I
MAX
OUT
(1)
) ≤ 40V
T
MIN
≤ T
J
≤ T
MAX
(V
IN
− V
OUT
) = 40V
(V
IN
− V
OUT
) ≤ 15V
K Package
H, E Package
(V
IN
− V
OUT
) = 40V
K Package
H, E Package
10 Hz ≤ f ≤ 10 kHz
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 0 μ F
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 10 μ F
T
J
= 125°C, 1000 hrs
K (TO-3) Package
H (TO-39) Package
E (LCC) Package
K (TO-3) Package
H (TO-39) Package
E (LCC) Package
1.5
0.5
0.3
0.15
66
0.2
1
3.5
2.2
0.8
0.4
0.20
0.003
65
80
0.3
2
21
12
39
186
88
5
5
3.4
1.8
1
Units
V
%/V
%
%/W
μ A
μ A
% mA
A
A
% dB dB
%
°C/W
°C/W
(1) I
MAX
= 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. I
MAX
= 1.0A for the EMP (SOT-223) package. I
(TO-39), MDT (TO-252), and E (LCC) packages. Device power dissipation (P
D
) is limited by ambient temperature (T
MAX
A
= 0.5A for the H
), device maximum junction temperature (T
J
), and package thermal resistance ( θ
JA
). The maximum allowable power dissipation at any temperature is :
P
D(MAX)
= ((T
J(MAX)
- T
A
)/ θ
JA
). All Min. and Max. limits are guaranteed to National's Average Outgoing Quality Level (AOQL).
(2) Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
(3) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation.
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LM317A and LM317 Electrical Characteristics
(1)
Specifications with standard type face are for T
J
= 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, V
IN
− V
OUT
= 5V, and I
OUT
= 10 mA.
LM317A LM317
Parameter Conditions
Min Typ Max Min Typ Max Units
1.238
1.250
1.262
1.25
V
Reference Voltage
3V ≤ (V
IN
10 mA ≤ I
− V
OUT
OUT
≤ I
) ≤ 40V,
(1)
MAX
1.225
1.250
1.270
1.20
1.25
1.30
V
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
3V
≤
(V
IN
−
V
OUT
)
≤
40V
(2)
10 mA ≤ I
OUT
≤ I
MAX
(1) (2)
20 ms Pulse
0.005
0.01
0.01
0.02
0.1
0.3
0.04
50
0.5
1
0.07
100
0.01
0.04
0.02
0.07
%/V
0.1
0.3
0.5
1.5
%
0.04
0.07
%/W
50 100
μ A
Adjustment Pin Current Change
Temperature Stability
Minimum Load Current
Current Limit
RMS Output Noise, % of V
OUT
Ripple Rejection Ratio
Long-Term Stability
Thermal Resistance, θ
JC
Junction-to-Case
Thermal Resistance, θ
JA
Junction-to-Ambient
(No Heat Sink)
10 mA ≤ I
OUT
3V ≤ (V
IN
− V
≤ I
MAX
OUT
(1)
) ≤ 40V
T
MIN
≤ T
J
≤ T
MAX
(V
IN
− V
OUT
) = 40V
(V
IN
− V
OUT
) ≤ 15V
K, S Packages
EMP, T Packages
H, MDT Packages
(V
IN
− V
OUT
) = 40V
K, S Packages
EMP, T Packages
H, MDT Packages
10 Hz ≤ f ≤ 10 kHz
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 0 μ F
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 10 μ F
T
J
= 125°C, 1000 hrs
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package
EMP (SOT-223) Package
H (TO-39) Package
MDT (TO-252) Package
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package
(3)
EMP (SOT-223) Package
H (TO-39) Package
MDT (TO-252) Package
(3)
(3)
-
1.5
0.5
0.2
1
3.5
-
2.2
0.8
-
0.112
0.30
0.075
0.20
66
0.003
65
80
0.3
-
50
-
140
186
103
-
4
-
23.5
21
12
5
10
-
3.4
1.8
1
1.5
1.5
0.5
0.2
1
3.5
2.2
2.2
0.8
0.15
0.40
0.112
0.30
0.075
0.20
66
0.003
65
80
0.3
39
50
50
140
186
103
2
4
4
23.5
21
12
5
10
3.4
3.4
1.8
1
μ A
% mA
A
A
% dB dB
%
°C/W
°C/W
(1) I
MAX
= 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. I
MAX
= 1.0A for the EMP (SOT-223) package. I
(TO-39), MDT (TO-252), and E (LCC) packages. Device power dissipation (P
D
) is limited by ambient temperature (T
MAX
A
= 0.5A for the H
), device maximum junction temperature (T
J
P
D(MAX)
= ((T
J(MAX)
- T
A
), and package thermal resistance ( θ
JA
)/ θ
JA
). The maximum allowable power dissipation at any temperature is :
). All Min. and Max. limits are guaranteed to National's Average Outgoing Quality Level (AOQL).
(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation.
(3) When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink techniques.
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SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Typical Performance Characteristics
Output Capacitor = 0 μ F unless otherwise noted
Load Regulation Current Limit
Adjustment Current
V
OUT vs
V
IN
, V
OUT
= V
REF
Dropout Voltage
V
OUT vs
V
IN
, V
OUT
= 5V
Temperature Stability
Ripple Rejection
Minimum Operating Current
Ripple Rejection
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LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Typical Performance Characteristics (continued)
Output Capacitor = 0 μ F unless otherwise noted
Ripple Rejection Output Impedance www.ti.com
Line Transient Response Load Transient Response
Application Hints
In operation, the LM117 develops a nominal 1.25V reference voltage, V
REF
, between the output and adjustment terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is constant, a constant current I
1 then flows through the output set resistor R2, giving an output voltage of
(1)
Since the 100 μ A current from the adjustment terminal represents an error term, the LM117 was designed to minimize I
ADJ and make it very constant with line and load changes. To do this, all quiescent operating current is returned to the output establishing a minimum load current requirement. If there is insufficient load on the output, the output will rise.
EXTERNAL CAPACITORS
An input bypass capacitor is recommended. A 0.1
μ F disc or 1 μ F solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the possibility of problems.
The adjustment terminal can be bypassed to ground on the LM117 to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. With a 10 μ F bypass capacitor
80dB ripple rejection is obtainable at any output level. Increases over 10 μ F do not appreciably improve the ripple rejection at frequencies above 120Hz. If the bypass capacitor is used, it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device.
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In general, the best type of capacitors to use is solid tantalum. Solid tantalum capacitors have low impedance even at high frequencies. Depending upon capacitor construction, it takes about 25 μ F in aluminum electrolytic to equal 1 μ F solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01
μ F disc may seem to work better than a 0.1
μ F disc as a bypass.
Although the LM117 is stable with no output capacitors, like any feedback circuit, certain values of external capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1 μ F solid tantalum (or 25 μ F aluminum electrolytic) on the output swamps this effect and insures stability. Any increase of the load capacitance larger than 10 μ F will merely improve the loop stability and output impedance.
LOAD REGULATION
The LM117 is capable of providing extremely good load regulation but a few precautions are needed to obtain maximum performance. The current set resistor connected between the adjustment terminal and the output terminal (usually 240 Ω ) should be tied directly to the output (case) of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 15V regulator with 0.05
Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05
Ω × I
L
. If the set resistor is connected near the load the effective line resistance will be
0.05
Ω (1 + R2/R1) or in this case, 11.5 times worse.
shows the effect of resistance between the regulator and 240 Ω set resistor.
Figure 11. Regulator with Line Resistance in Output Lead
With the TO-3 package, it is easy to minimize the resistance from the case to the set resistor, by using two separate leads to the case. However, with the TO-39 package, care should be taken to minimize the wire length of the output lead. The ground of R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation.
PROTECTION DIODES
When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to prevent the capacitors from discharging through low current points into the regulator. Most 10 μ F capacitors have low enough internal series resistance to deliver 20A spikes when shorted. Although the surge is short, there is enough energy to damage parts of the IC.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and the rate of decrease of V
IN
. In the LM117, this discharge path is through a large junction that is able to sustain 15A surge with no problem. This is not true of other types of positive regulators. For output capacitors of 25
μ
F or less, there is no need to use diodes.
The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs when either the input, or the output, is shorted. Internal to the LM117 is a 50
Ω resistor which limits the peak discharge current. No protection is needed for output voltages of 25V or less and 10 μ F capacitance.
shows an LM117 with protection diodes included for use with outputs greater than 25V and high values of output capacitance.
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D1 protects against C1
D2 protects against C2
Figure 12. Regulator with Protection Diodes
HEATSINK REQUIREMENTS
The LM317 regulators have internal thermal shutdown to protect the device from over-heating. Under all operating conditions, the junction temperature of the LM317 should not exceed the rated maximum junction temperature (T
J
) of 150°C for the LM117, or 125°C for the LM317A and LM317. A heatsink may be required depending on the maximum device power dissipation and the maximum ambient temperature of the application.
To determine if a heatsink is needed, the power dissipated by the regulator, P
D
, must be calculated:
P
D
= ((V
IN
− V
OUT
) × I
L
) + (V
IN
× I
G
) (2)
shows the voltage and currents which are present in the circuit.
The next parameter which must be calculated is the maximum allowable temperature rise, T
R(MAX)
:
T
R(MAX)
= T
J(MAX)
− T
A(MAX)
(3) where T
J(MAX) is the maximum allowable junction temperature (150°C for the LM117, or 125°C for the
LM317A/LM317), and T
A(MAX) is the maximum ambient temperature which will be encountered in the application.
Using the calculated values for T
R(MAX) resistance ( θ
JA
) can be calculated: and P
D
, the maximum allowable value for the junction-to-ambient thermal
θ
JA
= (T
R(MAX)
/ P
D
) (4)
Figure 13. Power Dissipation Diagram
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If the calculated maximum allowable thermal resistance is higher than the actual package rating, then no additional work is needed. If the calculated maximum allowable thermal resistance is lower than the actual package rating either the power dissipation (P
D needs to be reduced, the thermal resistance ( θ
) needs to be reduced, the maximum ambient temperature T
A(MAX)
JA
) must be lowered by adding a heatsink, or some combination of these.
If a heatsink is needed, the value can be calculated from the formula:
θ
HA
≤ ( θ
JA
- ( θ
CH
+ θ
JC
)) (5) where ( θ
CH
θ
JC is the thermal resistance of the contact area between the device case and the heatsink surface, and is thermal resistance from the junction of the die to surface of the package case.
When a value for θ
(H − A) is found using the equation shown, a heatsink must be selected that has a value that is less than, or equal to, this number.
The θ
(H − A) rating is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink.
HEATSINKING SURFACE MOUNT PACKAGES
The TO-263 (S), SOT-223 (EMP) and TO-252 (MDT) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.
HEATSINKING THE SOT-223 PACKAGE
and
show the information for the SOT-223 package.
assumes a θ
(J − A) of 74°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Please see
AN-1028 for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.
Figure 14.
θ
(J − A) vs Copper (2 ounce) Area for the SOT-223 Package
Figure 15. Maximum Power Dissipation vs T
AMB for the SOT-223 Package
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HEATSINKING THE TO-263 PACKAGE
shows for the TO-263 the measured values of θ
(J − A) for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking.
As shown in
Figure 16 , increasing the copper area beyond 1 square inch produces very little improvement. It
should also be observed that the minimum value of θ
(J − A) for the TO-263 package mounted to a PCB is 32°C/W.
Figure 16.
θ
(J − A) vs Copper (1 ounce) Area for the TO-263 Package
As a design aid,
shows the maximum allowable power dissipation compared to ambient temperature for the TO-263 device (assuming θ
(J − A) is 35°C/W and the maximum junction temperature is 125°C).
Figure 17. Maximum Power Dissipation vs T
AMB for the TO-263 Package
HEATSINKING THE TO-252 PACKAGE
If the maximum allowable value for θ
JA is found to be ≥ 103°C/W (Typical Rated Value) for TO-252 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θ
JA falls below these limits, a heatsink is required.
As a design aid,
shows the value of the θ
JA that we used to measure these θ of TO-252 for different heatsink area. The copper patterns
JA s are shown at the end of the Application Notes Section.
reflects the same test results as what are in
shows the maximum allowable power dissipation vs. ambient temperature for the TO-252 device.
shows the maximum allowable power dissipation vs. copper area (in
2
) for the TO-252 device. Please see AN-1028 for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.
Layout
1
2
3
Top Side (in
2
)*
0.0123
0.066
0.3
Table 2.
θ
JA
Different Heatsink Area
Copper Area
Bottom Side (in
2
)
0
0
0
Thermal Resistance
( θ
JA
°C/W) TO-252
103
87
60
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13
14
15
16
10
11
12
Layout
4
5
6
7
8
9
Table 2.
θ
JA
Different Heatsink Area (continued)
Copper Area
0.53
0.76
1.0
0.066
0.066
0.066
0.066
0.066
0.066
0.175
0.284
0.392
0.5
0
0
0
0.2
0.4
0.6
0.8
1.0
0.066
0.175
0.284
0.392
0.5
NOTE
* Tab of device attached to topside of copper.
Thermal Resistance
54
52
47
84
70
63
72
61
55
53
57
57
89
Figure 18.
θ
JA vs 2oz Copper Area for TO-252
Figure 19. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
Figure 20. Maximum Allowable Power Dissipation vs. 2oz Copper Area for TO-252
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SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
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Figure 21. Top View of the Thermal Test Pattern in Actual Scale
Figure 22. Bottom View of the Thermal Test Pattern in Actual Scale
14
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LM117 LM317-N
Copyright © 2004–2011, Texas Instruments Incorporated
www.ti.com
Schematic Diagram
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Typical Applications
Figure 23. 5V Logic Regulator with Electronic Shutdown*
*Min. output ≊ 1.2V
Figure 24. Slow Turn-On 15V Regulator
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links:
LM117 LM317-N
Submit Documentation Feedback
15
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 25. Adjustable Regulator with Improved Ripple Rejection www.ti.com
†Solid tantalum
*Discharges C1 if output is shorted to ground
Figure 26. High Stability 10V Regulator
Figure 27. High Current Adjustable Regulator
‡Optional—improves ripple rejection
†Solid tantalum
*Minimum load current = 30 mA
16
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LM117 LM317-N
Copyright © 2004–2011, Texas Instruments Incorporated
www.ti.com
Figure 28. 0 to 30V Regulator
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Full output current not available at high input-output voltages
Figure 29. Power Follower
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links:
LM117 LM317-N
Submit Documentation Feedback
17
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 30. 5A Constant Voltage/Constant Current Regulator www.ti.com
†Solid tantalum
*Lights in constant current mode
Figure 31. 1A Current Regulator
Figure 32. 1.2V–20V Regulator with Minimum Program Current
*Minimum load current ≊ 4 mA
18
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LM117 LM317-N
Copyright © 2004–2011, Texas Instruments Incorporated
www.ti.com
Figure 33. High Gain Amplifier
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 34. Low Cost 3A Switching Regulator
†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links:
LM117 LM317-N
Submit Documentation Feedback
19
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 35. 4A Switching Regulator with Overload Protection www.ti.com
†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Figure 36. Precision Current Limiter
Figure 37. Tracking Preregulator
20
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Product Folder Links:
LM117 LM317-N
Copyright © 2004–2011, Texas Instruments Incorporated
www.ti.com
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 38. Current Limited Voltage Regulator
(Compared to LM117's higher current limit)
—At 50 mA output only ¾ volt of drop occurs in R
3 and R
4
Figure 39. Adjusting Multiple On-Card Regulators with Single Control*
*All outputs within ±100 mV
†Minimum load—10 mA
Figure 40. AC Voltage Regulator
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links:
LM117 LM317-N
Submit Documentation Feedback
21
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 41. 12V Battery Charger www.ti.com
Use of R
S allows low charging rates with fully charged battery.
Figure 42. 50mA Constant Current Battery Charger
Figure 43. Adjustable 4A Regulator
22
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Product Folder Links:
LM117 LM317-N
Copyright © 2004–2011, Texas Instruments Incorporated
www.ti.com
LM117, LM317-N
SNVS774L – MAY 2004 – REVISED FEBRUARY 2011
Figure 44. Current Limited 6V Charger
*Sets peak current (0.6A for 1 Ω )
**The 1000 μ F is recommended to filter out input transients
Figure 45. Digitally Selected Outputs
*Sets maximum V
OUT
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links:
LM117 LM317-N
Submit Documentation Feedback
23
KTT0003B
MECHANICAL DATA
BOTTOM SIDE OF PACKAGE
TS3B (Rev F)
www.ti.com
www.ti.com
PACKAGING INFORMATION
Orderable Device
LM117GW/883
LM117H
LM117H/NOPB
LM117K
LM117K STEEL
LM117K STEEL/NOPB
LM317AEMP
LM317AEMP/NOPB
LM317AEMPX/NOPB
LM317AH
LM317AH/NOPB
LM317AMDT
LM317AMDT/NOPB
LM317AMDTX
LM317AMDTX/NOPB
LM317AT
LM317AT/NOPB
LM317EMP
LM317EMP/NOPB
LM317EMPX/NOPB
PACKAGE OPTION ADDENDUM
16-Nov-2012
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Type Package
Drawing
Pins Package Qty
CLGA
TO
NAC
NDT
16
3
42
500
TO
TO-3
TO-3
TO-3
SOT-223
SOT-223
SOT-223
TO
TO
PFM
PFM
PFM
PFM
TO-220
TO-220
SOT-223
SOT-223
SOT-223
NDT
NDS
NDS
NDS
DCY
DCY
DCY
NDT
NDT
NDP
NDP
NDP
NDP
NDE
NDE
DCY
DCY
DCY
3
2
2
2
4
4
4
3
3
3
3
3
3
3
3
4
4
4
500
50
50
50
1000
1000
2000
500
500
75
75
2500
2500
45
45
1000
1000
2000
Eco Plan
(2)
TBD
Green (RoHS
& no Sb/Br)
Lead/Ball Finish MSL Peak Temp
(3)
CU SNPB Level-1-NA-UNLIM
POST-PLATE Level-1-NA-UNLIM
POST-PLATE Level-1-NA-UNLIM Green (RoHS
& no Sb/Br)
TBD
TBD
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
POST-PLATE Level-1-NA-UNLIM
POST-PLATE Level-1-NA-UNLIM
CU SNPB Level-1-260C-UNLIM
CU SN Level-1-260C-UNLIM
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
TBD
CU SN Level-1-260C-UNLIM
POST-PLATE Level-1-NA-UNLIM
POST-PLATE Level-1-NA-UNLIM
CU SNPB
CU SN
CU SNPB
CU SN
Level-1-235C-UNLIM
Level-2-260C-1 YEAR
Level-1-235C-UNLIM
Level-2-260C-1 YEAR Green (RoHS
& no Sb/Br)
TBD
Pb-Free (RoHS
Exempt)
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU SNPB
CU SN
CU SNPB
CU SN
CU SN
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Samples
(Requires Login)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2012
Orderable Device
LM317H
LM317H/NOPB
LM317K STEEL
LM317K STEEL/NOPB
LM317MDT/NOPB
LM317MDTX/NOPB
LM317S/NOPB
LM317SX/NOPB
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Type Package
Drawing
Pins Package Qty
TO NDT 3 500
TO
TO-3
TO-3
PFM
PFM
DDPAK/
TO-263
DDPAK/
TO-263
TO-220
NDT
NDS
NDS
NDP
NDP
KTT
KTT
NDE
3
2
2
3
3
3
3
3
500
50
50
75
2500
45
500
45
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/Ball Finish MSL Peak Temp
(3)
POST-PLATE Level-1-NA-UNLIM
POST-PLATE Level-1-NA-UNLIM Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM
POST-PLATE Level-1-NA-UNLIM
CU SN Level-2-260C-1 YEAR
Green (RoHS
& no Sb/Br)
Pb-Free (RoHS
Exempt)
Pb-Free (RoHS
Exempt)
TBD
CU SN
CU SN
CU SN
CU SNPB
Level-2-260C-1 YEAR
Level-3-245C-168 HR
Level-3-245C-168 HR
Level-1-NA-UNLIM
Samples
(Requires Login)
LM317T ACTIVE
LM317T/LF01 ACTIVE TO-220 NDG 3 45 Pb-Free (RoHS
Exempt)
CU SN Level-4-260C-72 HR
LM317T/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br)
CU SN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Level-1-NA-UNLIM
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2012
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
www.ti.com
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
15-Nov-2012
*All dimensions are nominal
Device
LM317AEMP
LM317AEMP/NOPB SOT-223 DCY
LM317AEMPX/NOPB SOT-223 DCY
LM317AMDTX
LM317AMDTX/NOPB
LM317EMP
LM317EMP/NOPB
LM317SX/NOPB
Package
Type
Package
Drawing
SOT-223 DCY
PFM
PFM
SOT-223
SOT-223
DDPAK/
TO-263
NDP
NDP
DCY
DCY
LM317EMPX/NOPB SOT-223 DCY
LM317MDTX/NOPB PFM NDP
KTT
Pins
4
4
4
3
3
4
4
4
3
3
SPQ
1000
1000
2000
2500
2500
1000
1000
2000
2500
500
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
330.0
16.4
330.0
330.0
16.4
16.4
A0
(mm)
7.0
7.0
7.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
6.9
6.9
7.0
7.0
B0
(mm)
7.5
7.5
7.5
10.5
10.5
7.5
7.5
330.0
330.0
330.0
K0
(mm)
2.2
P1
(mm)
12.0
W
(mm)
16.0
2.2
12.0
16.0
2.2
12.0
16.0
2.7
2.7
8.0
16.0
8.0
16.0
2.2
12.0
16.0
2.2
12.0
16.0
16.4
16.4
7.0
6.9
7.5
10.5
2.2
2.7
12.0
8.0
16.0
16.0
24.4
10.75
14.85
5.0
16.0
24.0
Pin1
Quadrant
Q3
Q2
Q2
Q3
Q3
Q3
Q2
Q2
Q3
Q3
Pack Materials-Page 1
www.ti.com
PACKAGE MATERIALS INFORMATION
15-Nov-2012
*All dimensions are nominal
Device
LM317AEMP
LM317AEMP/NOPB
LM317AEMPX/NOPB
LM317AMDTX
LM317AMDTX/NOPB
LM317EMP
LM317EMP/NOPB
LM317EMPX/NOPB
LM317MDTX/NOPB
LM317SX/NOPB
Package Type Package Drawing Pins
SOT-223
SOT-223
SOT-223
PFM
PFM
SOT-223
SOT-223
SOT-223
PFM
DDPAK/TO-263
DCY
DCY
DCY
NDP
NDP
DCY
DCY
DCY
NDP
KTT
4
4
3
3
3
4
4
3
4
4
SPQ
1000
1000
2000
2500
2500
1000
1000
2000
2500
500
Length (mm) Width (mm) Height (mm)
349.0
349.0
354.0
354.0
358.0
349.0
349.0
354.0
358.0
358.0
337.0
337.0
340.0
340.0
343.0
337.0
337.0
340.0
343.0
343.0
45.0
45.0
35.0
35.0
63.0
45.0
45.0
35.0
63.0
63.0
Pack Materials-Page 2
NAC0016A
MECHANICAL DATA www.ti.com
WG16A (RevG)
NDT0003A
MECHANICAL DATA
H03A (Rev D)
www.ti.com
NDS0002A
MECHANICAL DATA www.ti.com
NDE0003B
MECHANICAL DATA www.ti.com
NDG0003F
MECHANICAL DATA www.ti.com
T03F (Rev B)
NDP0003B
MECHANICAL DATA
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
PLASTIC SMALL-OUTLINE DCY (R-PDSO-G4)
6,70 (0.264)
6,30 (0.248)
4
3,10 (0.122)
2,90 (0.114)
0,10 (0.004) M
7,30 (0.287)
6,70 (0.264)
3,70 (0.146)
3,30 (0.130)
2,30 (0.091)
1 2
4,60 (0.181)
3
0,84 (0.033)
0,66 (0.026)
0,10 (0.004) M
0
°
–10
°
Gauge Plane
1,80 (0.071) MAX
1,70 (0.067)
1,50 (0.059)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
0,25 (0.010)
0,75 (0.030) MIN
0,35 (0.014)
0,23 (0.009)
4202506/B 06/2002
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
IMPORTANT NOTICE
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
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