LM117/LM317A/LM317 3-Terminal Adjustable Regulator LM117 FEATURES

Add to my manuals
37 Pages

advertisement

LM117/LM317A/LM317 3-Terminal Adjustable Regulator LM117 FEATURES | Manualzz

LM117, LM317-N www.ti.com

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

LM117/LM317A/LM317 3-Terminal Adjustable Regulator

Check for Samples: LM117 , LM317-N

1

FEATURES

2

• Guaranteed 1% output voltage tolerance

(LM317A)

• Guaranteed max. 0.01%/V line regulation

(LM317A)

• Guaranteed max. 0.3% load regulation (LM117)

• Guaranteed 1.5A output current

• Adjustable output down to 1.2V

• Current limit constant with temperature

• P

+

Product Enhancement tested

• 80 dB ripple rejection

• Output is short-circuit protected

DESCRIPTION

The LM117 series of adjustable 3-terminal positive voltage regulators is capable of supplying in excess of 1.5A

over a 1.2V to 37V output range. They are exceptionally easy to use and require only two external resistors to set the output voltage. Further, both line and load regulation are better than standard fixed regulators. Also, the

LM117 is packaged in standard transistor packages which are easily mounted and handled.

In addition to higher performance than fixed regulators, the LM117 series offers full overload protection available only in IC's. Included on the chip are current limit, thermal overload protection and safe area protection. All overload protection circuitry remains fully functional even if the adjustment terminal is disconnected.

Normally, no capacitors are needed unless the device is situated more than 6 inches from the input filter capacitors in which case an input bypass is needed. An optional output capacitor can be added to improve transient response. The adjustment terminal can be bypassed to achieve very high ripple rejection ratios which are difficult to achieve with standard 3-terminal regulators.

Besides replacing fixed regulators, the LM117 is useful in a wide variety of other applications. Since the regulator is “floating” and sees only the input-to-output differential voltage, supplies of several hundred volts can be regulated as long as the maximum input to output differential is not exceeded, i.e., avoid short-circuiting the output.

Also, it makes an especially simple adjustable switching regulator, a programmable output regulator, or by connecting a fixed resistor between the adjustment pin and output, the LM117 can be used as a precision current regulator. Supplies with electronic shutdown can be achieved by clamping the adjustment terminal to ground which programs the output to 1.2V where most loads draw little current.

For applications requiring greater output current, see LM150 series (3A) and LM138 series (5A) data sheets. For the negative complement, see LM137 series data sheet.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 2004–2011, Texas Instruments Incorporated

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Typical Applications

Figure 1. 1.2V–25V Adjustable Regulator www.ti.com

Full output current not available at high input-output voltages

*Needed if device is more than 6 inches from filter capacitors.

†Optional—improves transient response. Output capacitors in the range of 1 μ F to 1000 μ F of aluminum or tantalum electrolytic are commonly used to provide improved output impedance and rejection of transients.

Table 1. LM117/LM317A/LM317 Package Options

Part

Number

LM117, LM317

LM317A, LM317

LM317

LM317A, LM317

LM117, LM317A, LM317

LM117

LM317A, LM317

Suffix

K

T

S

EMP

H

E

MDT

Package

TO-3

TO-220

TO-263

SOT-223

TO-39

LCC

TO-252

SOT-223 vs. TO-252 (D-Pak) Packages

Output

Current

1.5A

1.5A

1.5A

1.0A

0.5A

0.5A

0.5A

Figure 2. Scale 1:1

Connection Diagrams

CASE IS OUTPUT

Figure 3. TO-3 (K)

Metal Can Package

2

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

www.ti.com

CASE IS OUTPUT

Figure 4. TO-39 (H)

Metal Can Package

Figure 5. TO-263 (S)

Surface-Mount Package

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 6. TO-220 (T)

Plastic Package

Figure 7. TO-263 (S)

Surface-Mount Package

Figure 8. Ceramic Leadless

Chip Carrier (E)

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

3

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 9. 4-Lead SOT-223 (EMP) www.ti.com

Figure 10. TO-252 (MDT)

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

Power Dissipation

Input-Output Voltage Differential

Storage Temperature

Lead Temperature

Metal Package (Soldering, 10 seconds)

Plastic Package (Soldering, 4 seconds)

ESD Tolerance

(2)

Internally Limited

+40V, − 0.3V

− 65°C to +150°C

300°C

260°C

3 kV

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.

(2) Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

Operating Temperature Range

LM117

LM317A

LM317

− 55°C ≤ T

J

≤ +150°C

− 40°C ≤ T

J

≤ +125°C

0°C ≤ T

J

≤ +125°C

Preconditioning

Thermal Limit Burn-In All Devices 100%

4

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

LM117, LM317-N www.ti.com

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

LM117 Electrical Characteristics

(1)

Specifications with standard type face are for T

J

= 25°C, and those with boldface type apply over full Operating

Temperature Range. Unless otherwise specified, V

IN

− V

OUT

= 5V, and I

OUT

= 10 mA.

LM117

(2)

Parameter Conditions

Min Typ Max

Reference Voltage

3V ≤ (V

IN

10 mA ≤ I

− V

OUT

OUT

≤ I

) ≤ 40V,

(1)

MAX

1.20

1.25

1.30

Line Regulation

Load Regulation

Thermal Regulation

Adjustment Pin Current

3V ≤ (V

IN

− V

OUT

) ≤ 40V

(3)

10 mA ≤ I

OUT

≤ I

MAX

(1) (3)

20 ms Pulse

0.01

0.02

0.1

0.3

0.03

50

0.02

0.05

0.3

1

0.07

100

Adjustment Pin Current Change

Temperature Stability

Minimum Load Current

Current Limit

RMS Output Noise, % of V

OUT

Ripple Rejection Ratio

Long-Term Stability

Thermal Resistance, θ

JC

Junction-to-Case

Thermal Resistance, θ

JA

Junction-to-Ambient

(No Heat Sink)

10 mA ≤ I

OUT

3V ≤ (V

IN

− V

≤ I

MAX

OUT

(1)

) ≤ 40V

T

MIN

≤ T

J

≤ T

MAX

(V

IN

− V

OUT

) = 40V

(V

IN

− V

OUT

) ≤ 15V

K Package

H, E Package

(V

IN

− V

OUT

) = 40V

K Package

H, E Package

10 Hz ≤ f ≤ 10 kHz

V

OUT

= 10V, f = 120 Hz, C

ADJ

= 0 μ F

V

OUT

= 10V, f = 120 Hz, C

ADJ

= 10 μ F

T

J

= 125°C, 1000 hrs

K (TO-3) Package

H (TO-39) Package

E (LCC) Package

K (TO-3) Package

H (TO-39) Package

E (LCC) Package

1.5

0.5

0.3

0.15

66

0.2

1

3.5

2.2

0.8

0.4

0.20

0.003

65

80

0.3

2

21

12

39

186

88

5

5

3.4

1.8

1

Units

V

%/V

%

%/W

μ A

μ A

% mA

A

A

% dB dB

%

°C/W

°C/W

(1) I

MAX

= 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. I

MAX

= 1.0A for the EMP (SOT-223) package. I

(TO-39), MDT (TO-252), and E (LCC) packages. Device power dissipation (P

D

) is limited by ambient temperature (T

MAX

A

= 0.5A for the H

), device maximum junction temperature (T

J

), and package thermal resistance ( θ

JA

). The maximum allowable power dissipation at any temperature is :

P

D(MAX)

= ((T

J(MAX)

- T

A

)/ θ

JA

). All Min. and Max. limits are guaranteed to National's Average Outgoing Quality Level (AOQL).

(2) Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.

(3) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation.

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

5

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

www.ti.com

LM317A and LM317 Electrical Characteristics

(1)

Specifications with standard type face are for T

J

= 25°C, and those with boldface type apply over full Operating

Temperature Range. Unless otherwise specified, V

IN

− V

OUT

= 5V, and I

OUT

= 10 mA.

LM317A LM317

Parameter Conditions

Min Typ Max Min Typ Max Units

1.238

1.250

1.262

1.25

V

Reference Voltage

3V ≤ (V

IN

10 mA ≤ I

− V

OUT

OUT

≤ I

) ≤ 40V,

(1)

MAX

1.225

1.250

1.270

1.20

1.25

1.30

V

Line Regulation

Load Regulation

Thermal Regulation

Adjustment Pin Current

3V

(V

IN

V

OUT

)

40V

(2)

10 mA ≤ I

OUT

≤ I

MAX

(1) (2)

20 ms Pulse

0.005

0.01

0.01

0.02

0.1

0.3

0.04

50

0.5

1

0.07

100

0.01

0.04

0.02

0.07

%/V

0.1

0.3

0.5

1.5

%

0.04

0.07

%/W

50 100

μ A

Adjustment Pin Current Change

Temperature Stability

Minimum Load Current

Current Limit

RMS Output Noise, % of V

OUT

Ripple Rejection Ratio

Long-Term Stability

Thermal Resistance, θ

JC

Junction-to-Case

Thermal Resistance, θ

JA

Junction-to-Ambient

(No Heat Sink)

10 mA ≤ I

OUT

3V ≤ (V

IN

− V

≤ I

MAX

OUT

(1)

) ≤ 40V

T

MIN

≤ T

J

≤ T

MAX

(V

IN

− V

OUT

) = 40V

(V

IN

− V

OUT

) ≤ 15V

K, S Packages

EMP, T Packages

H, MDT Packages

(V

IN

− V

OUT

) = 40V

K, S Packages

EMP, T Packages

H, MDT Packages

10 Hz ≤ f ≤ 10 kHz

V

OUT

= 10V, f = 120 Hz, C

ADJ

= 0 μ F

V

OUT

= 10V, f = 120 Hz, C

ADJ

= 10 μ F

T

J

= 125°C, 1000 hrs

K (TO-3) Package

T (TO-220) Package

S (TO-263) Package

EMP (SOT-223) Package

H (TO-39) Package

MDT (TO-252) Package

K (TO-3) Package

T (TO-220) Package

S (TO-263) Package

(3)

EMP (SOT-223) Package

H (TO-39) Package

MDT (TO-252) Package

(3)

(3)

-

1.5

0.5

0.2

1

3.5

-

2.2

0.8

-

0.112

0.30

0.075

0.20

66

0.003

65

80

0.3

-

50

-

140

186

103

-

4

-

23.5

21

12

5

10

-

3.4

1.8

1

1.5

1.5

0.5

0.2

1

3.5

2.2

2.2

0.8

0.15

0.40

0.112

0.30

0.075

0.20

66

0.003

65

80

0.3

39

50

50

140

186

103

2

4

4

23.5

21

12

5

10

3.4

3.4

1.8

1

μ A

% mA

A

A

% dB dB

%

°C/W

°C/W

(1) I

MAX

= 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. I

MAX

= 1.0A for the EMP (SOT-223) package. I

(TO-39), MDT (TO-252), and E (LCC) packages. Device power dissipation (P

D

) is limited by ambient temperature (T

MAX

A

= 0.5A for the H

), device maximum junction temperature (T

J

P

D(MAX)

= ((T

J(MAX)

- T

A

), and package thermal resistance ( θ

JA

)/ θ

JA

). The maximum allowable power dissipation at any temperature is :

). All Min. and Max. limits are guaranteed to National's Average Outgoing Quality Level (AOQL).

(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation.

(3) When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink techniques.

6

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

www.ti.com

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Typical Performance Characteristics

Output Capacitor = 0 μ F unless otherwise noted

Load Regulation Current Limit

Adjustment Current

V

OUT vs

V

IN

, V

OUT

= V

REF

Dropout Voltage

V

OUT vs

V

IN

, V

OUT

= 5V

Temperature Stability

Ripple Rejection

Minimum Operating Current

Ripple Rejection

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

7

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Typical Performance Characteristics (continued)

Output Capacitor = 0 μ F unless otherwise noted

Ripple Rejection Output Impedance www.ti.com

Line Transient Response Load Transient Response

Application Hints

In operation, the LM117 develops a nominal 1.25V reference voltage, V

REF

, between the output and adjustment terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is constant, a constant current I

1 then flows through the output set resistor R2, giving an output voltage of

(1)

Since the 100 μ A current from the adjustment terminal represents an error term, the LM117 was designed to minimize I

ADJ and make it very constant with line and load changes. To do this, all quiescent operating current is returned to the output establishing a minimum load current requirement. If there is insufficient load on the output, the output will rise.

EXTERNAL CAPACITORS

An input bypass capacitor is recommended. A 0.1

μ F disc or 1 μ F solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the possibility of problems.

The adjustment terminal can be bypassed to ground on the LM117 to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. With a 10 μ F bypass capacitor

80dB ripple rejection is obtainable at any output level. Increases over 10 μ F do not appreciably improve the ripple rejection at frequencies above 120Hz. If the bypass capacitor is used, it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device.

8

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

LM117, LM317-N www.ti.com

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

In general, the best type of capacitors to use is solid tantalum. Solid tantalum capacitors have low impedance even at high frequencies. Depending upon capacitor construction, it takes about 25 μ F in aluminum electrolytic to equal 1 μ F solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01

μ F disc may seem to work better than a 0.1

μ F disc as a bypass.

Although the LM117 is stable with no output capacitors, like any feedback circuit, certain values of external capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1 μ F solid tantalum (or 25 μ F aluminum electrolytic) on the output swamps this effect and insures stability. Any increase of the load capacitance larger than 10 μ F will merely improve the loop stability and output impedance.

LOAD REGULATION

The LM117 is capable of providing extremely good load regulation but a few precautions are needed to obtain maximum performance. The current set resistor connected between the adjustment terminal and the output terminal (usually 240 Ω ) should be tied directly to the output (case) of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 15V regulator with 0.05

Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05

Ω × I

L

. If the set resistor is connected near the load the effective line resistance will be

0.05

Ω (1 + R2/R1) or in this case, 11.5 times worse.

Figure 11

shows the effect of resistance between the regulator and 240 Ω set resistor.

Figure 11. Regulator with Line Resistance in Output Lead

With the TO-3 package, it is easy to minimize the resistance from the case to the set resistor, by using two separate leads to the case. However, with the TO-39 package, care should be taken to minimize the wire length of the output lead. The ground of R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation.

PROTECTION DIODES

When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to prevent the capacitors from discharging through low current points into the regulator. Most 10 μ F capacitors have low enough internal series resistance to deliver 20A spikes when shorted. Although the surge is short, there is enough energy to damage parts of the IC.

When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and the rate of decrease of V

IN

. In the LM117, this discharge path is through a large junction that is able to sustain 15A surge with no problem. This is not true of other types of positive regulators. For output capacitors of 25

μ

F or less, there is no need to use diodes.

The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs when either the input, or the output, is shorted. Internal to the LM117 is a 50

Ω resistor which limits the peak discharge current. No protection is needed for output voltages of 25V or less and 10 μ F capacitance.

Figure 12

shows an LM117 with protection diodes included for use with outputs greater than 25V and high values of output capacitance.

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

9

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

www.ti.com

D1 protects against C1

D2 protects against C2

Figure 12. Regulator with Protection Diodes

HEATSINK REQUIREMENTS

The LM317 regulators have internal thermal shutdown to protect the device from over-heating. Under all operating conditions, the junction temperature of the LM317 should not exceed the rated maximum junction temperature (T

J

) of 150°C for the LM117, or 125°C for the LM317A and LM317. A heatsink may be required depending on the maximum device power dissipation and the maximum ambient temperature of the application.

To determine if a heatsink is needed, the power dissipated by the regulator, P

D

, must be calculated:

P

D

= ((V

IN

− V

OUT

) × I

L

) + (V

IN

× I

G

) (2)

Figure 13

shows the voltage and currents which are present in the circuit.

The next parameter which must be calculated is the maximum allowable temperature rise, T

R(MAX)

:

T

R(MAX)

= T

J(MAX)

− T

A(MAX)

(3) where T

J(MAX) is the maximum allowable junction temperature (150°C for the LM117, or 125°C for the

LM317A/LM317), and T

A(MAX) is the maximum ambient temperature which will be encountered in the application.

Using the calculated values for T

R(MAX) resistance ( θ

JA

) can be calculated: and P

D

, the maximum allowable value for the junction-to-ambient thermal

θ

JA

= (T

R(MAX)

/ P

D

) (4)

Figure 13. Power Dissipation Diagram

10

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

LM117, LM317-N www.ti.com

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

If the calculated maximum allowable thermal resistance is higher than the actual package rating, then no additional work is needed. If the calculated maximum allowable thermal resistance is lower than the actual package rating either the power dissipation (P

D needs to be reduced, the thermal resistance ( θ

) needs to be reduced, the maximum ambient temperature T

A(MAX)

JA

) must be lowered by adding a heatsink, or some combination of these.

If a heatsink is needed, the value can be calculated from the formula:

θ

HA

≤ ( θ

JA

- ( θ

CH

+ θ

JC

)) (5) where ( θ

CH

θ

JC is the thermal resistance of the contact area between the device case and the heatsink surface, and is thermal resistance from the junction of the die to surface of the package case.

When a value for θ

(H − A) is found using the equation shown, a heatsink must be selected that has a value that is less than, or equal to, this number.

The θ

(H − A) rating is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink.

HEATSINKING SURFACE MOUNT PACKAGES

The TO-263 (S), SOT-223 (EMP) and TO-252 (MDT) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.

HEATSINKING THE SOT-223 PACKAGE

Figure 14

and

Figure 15

show the information for the SOT-223 package.

Figure 15

assumes a θ

(J − A) of 74°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Please see

AN-1028 for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.

Figure 14.

θ

(J − A) vs Copper (2 ounce) Area for the SOT-223 Package

Figure 15. Maximum Power Dissipation vs T

AMB for the SOT-223 Package

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

11

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

www.ti.com

HEATSINKING THE TO-263 PACKAGE

Figure 16

shows for the TO-263 the measured values of θ

(J − A) for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking.

As shown in

Figure 16 , increasing the copper area beyond 1 square inch produces very little improvement. It

should also be observed that the minimum value of θ

(J − A) for the TO-263 package mounted to a PCB is 32°C/W.

Figure 16.

θ

(J − A) vs Copper (1 ounce) Area for the TO-263 Package

As a design aid,

Figure 17

shows the maximum allowable power dissipation compared to ambient temperature for the TO-263 device (assuming θ

(J − A) is 35°C/W and the maximum junction temperature is 125°C).

Figure 17. Maximum Power Dissipation vs T

AMB for the TO-263 Package

HEATSINKING THE TO-252 PACKAGE

If the maximum allowable value for θ

JA is found to be ≥ 103°C/W (Typical Rated Value) for TO-252 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θ

JA falls below these limits, a heatsink is required.

As a design aid,

Table 2

shows the value of the θ

JA that we used to measure these θ of TO-252 for different heatsink area. The copper patterns

JA s are shown at the end of the Application Notes Section.

Figure 18

reflects the same test results as what are in

Table 2 .

Figure 19

shows the maximum allowable power dissipation vs. ambient temperature for the TO-252 device.

Figure 20

shows the maximum allowable power dissipation vs. copper area (in

2

) for the TO-252 device. Please see AN-1028 for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.

Layout

1

2

3

Top Side (in

2

)*

0.0123

0.066

0.3

Table 2.

θ

JA

Different Heatsink Area

Copper Area

Bottom Side (in

2

)

0

0

0

Thermal Resistance

( θ

JA

°C/W) TO-252

103

87

60

12

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

LM117, LM317-N www.ti.com

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

13

14

15

16

10

11

12

Layout

4

5

6

7

8

9

Table 2.

θ

JA

Different Heatsink Area (continued)

Copper Area

0.53

0.76

1.0

0.066

0.066

0.066

0.066

0.066

0.066

0.175

0.284

0.392

0.5

0

0

0

0.2

0.4

0.6

0.8

1.0

0.066

0.175

0.284

0.392

0.5

NOTE

* Tab of device attached to topside of copper.

Thermal Resistance

54

52

47

84

70

63

72

61

55

53

57

57

89

Figure 18.

θ

JA vs 2oz Copper Area for TO-252

Figure 19. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252

Figure 20. Maximum Allowable Power Dissipation vs. 2oz Copper Area for TO-252

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

13

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

www.ti.com

Figure 21. Top View of the Thermal Test Pattern in Actual Scale

Figure 22. Bottom View of the Thermal Test Pattern in Actual Scale

14

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

www.ti.com

Schematic Diagram

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Typical Applications

Figure 23. 5V Logic Regulator with Electronic Shutdown*

*Min. output ≊ 1.2V

Figure 24. Slow Turn-On 15V Regulator

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

15

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 25. Adjustable Regulator with Improved Ripple Rejection www.ti.com

†Solid tantalum

*Discharges C1 if output is shorted to ground

Figure 26. High Stability 10V Regulator

Figure 27. High Current Adjustable Regulator

‡Optional—improves ripple rejection

†Solid tantalum

*Minimum load current = 30 mA

16

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

www.ti.com

Figure 28. 0 to 30V Regulator

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Full output current not available at high input-output voltages

Figure 29. Power Follower

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

17

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 30. 5A Constant Voltage/Constant Current Regulator www.ti.com

†Solid tantalum

*Lights in constant current mode

Figure 31. 1A Current Regulator

Figure 32. 1.2V–20V Regulator with Minimum Program Current

*Minimum load current ≊ 4 mA

18

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

www.ti.com

Figure 33. High Gain Amplifier

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 34. Low Cost 3A Switching Regulator

†Solid tantalum

*Core—Arnold A-254168-2 60 turns

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

19

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 35. 4A Switching Regulator with Overload Protection www.ti.com

†Solid tantalum

*Core—Arnold A-254168-2 60 turns

Figure 36. Precision Current Limiter

Figure 37. Tracking Preregulator

20

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

www.ti.com

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 38. Current Limited Voltage Regulator

(Compared to LM117's higher current limit)

—At 50 mA output only ¾ volt of drop occurs in R

3 and R

4

Figure 39. Adjusting Multiple On-Card Regulators with Single Control*

*All outputs within ±100 mV

†Minimum load—10 mA

Figure 40. AC Voltage Regulator

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

21

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 41. 12V Battery Charger www.ti.com

Use of R

S allows low charging rates with fully charged battery.

Figure 42. 50mA Constant Current Battery Charger

Figure 43. Adjustable 4A Regulator

22

Submit Documentation Feedback

Product Folder Links:

LM117 LM317-N

Copyright © 2004–2011, Texas Instruments Incorporated

www.ti.com

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

Figure 44. Current Limited 6V Charger

*Sets peak current (0.6A for 1 Ω )

**The 1000 μ F is recommended to filter out input transients

Figure 45. Digitally Selected Outputs

*Sets maximum V

OUT

Copyright © 2004–2011, Texas Instruments Incorporated

Product Folder Links:

LM117 LM317-N

Submit Documentation Feedback

23

KTT0003B

MECHANICAL DATA

BOTTOM SIDE OF PACKAGE

TS3B (Rev F)

www.ti.com

www.ti.com

PACKAGING INFORMATION

Orderable Device

LM117GW/883

LM117H

LM117H/NOPB

LM117K

LM117K STEEL

LM117K STEEL/NOPB

LM317AEMP

LM317AEMP/NOPB

LM317AEMPX/NOPB

LM317AH

LM317AH/NOPB

LM317AMDT

LM317AMDT/NOPB

LM317AMDTX

LM317AMDTX/NOPB

LM317AT

LM317AT/NOPB

LM317EMP

LM317EMP/NOPB

LM317EMPX/NOPB

PACKAGE OPTION ADDENDUM

16-Nov-2012

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package Type Package

Drawing

Pins Package Qty

CLGA

TO

NAC

NDT

16

3

42

500

TO

TO-3

TO-3

TO-3

SOT-223

SOT-223

SOT-223

TO

TO

PFM

PFM

PFM

PFM

TO-220

TO-220

SOT-223

SOT-223

SOT-223

NDT

NDS

NDS

NDS

DCY

DCY

DCY

NDT

NDT

NDP

NDP

NDP

NDP

NDE

NDE

DCY

DCY

DCY

3

2

2

2

4

4

4

3

3

3

3

3

3

3

3

4

4

4

500

50

50

50

1000

1000

2000

500

500

75

75

2500

2500

45

45

1000

1000

2000

Eco Plan

(2)

TBD

Green (RoHS

& no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

CU SNPB Level-1-NA-UNLIM

POST-PLATE Level-1-NA-UNLIM

POST-PLATE Level-1-NA-UNLIM Green (RoHS

& no Sb/Br)

TBD

TBD

Green (RoHS

& no Sb/Br)

POST-PLATE Level-1-NA-UNLIM

POST-PLATE Level-1-NA-UNLIM

POST-PLATE Level-1-NA-UNLIM

CU SNPB Level-1-260C-UNLIM

CU SN Level-1-260C-UNLIM

TBD

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

TBD

Green (RoHS

& no Sb/Br)

TBD

CU SN Level-1-260C-UNLIM

POST-PLATE Level-1-NA-UNLIM

POST-PLATE Level-1-NA-UNLIM

CU SNPB

CU SN

CU SNPB

CU SN

Level-1-235C-UNLIM

Level-2-260C-1 YEAR

Level-1-235C-UNLIM

Level-2-260C-1 YEAR Green (RoHS

& no Sb/Br)

TBD

Pb-Free (RoHS

Exempt)

TBD

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

CU SNPB

CU SN

CU SNPB

CU SN

CU SN

Level-1-NA-UNLIM

Level-1-NA-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Samples

(Requires Login)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

16-Nov-2012

Orderable Device

LM317H

LM317H/NOPB

LM317K STEEL

LM317K STEEL/NOPB

LM317MDT/NOPB

LM317MDTX/NOPB

LM317S/NOPB

LM317SX/NOPB

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package Type Package

Drawing

Pins Package Qty

TO NDT 3 500

TO

TO-3

TO-3

PFM

PFM

DDPAK/

TO-263

DDPAK/

TO-263

TO-220

NDT

NDS

NDS

NDP

NDP

KTT

KTT

NDE

3

2

2

3

3

3

3

3

500

50

50

75

2500

45

500

45

Eco Plan

(2)

Green (RoHS

& no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

POST-PLATE Level-1-NA-UNLIM

POST-PLATE Level-1-NA-UNLIM Green (RoHS

& no Sb/Br)

TBD

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

POST-PLATE Level-1-NA-UNLIM

POST-PLATE Level-1-NA-UNLIM

CU SN Level-2-260C-1 YEAR

Green (RoHS

& no Sb/Br)

Pb-Free (RoHS

Exempt)

Pb-Free (RoHS

Exempt)

TBD

CU SN

CU SN

CU SN

CU SNPB

Level-2-260C-1 YEAR

Level-3-245C-168 HR

Level-3-245C-168 HR

Level-1-NA-UNLIM

Samples

(Requires Login)

LM317T ACTIVE

LM317T/LF01 ACTIVE TO-220 NDG 3 45 Pb-Free (RoHS

Exempt)

CU SN Level-4-260C-72 HR

LM317T/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br)

CU SN

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

Level-1-NA-UNLIM

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

16-Nov-2012

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3

www.ti.com

TAPE AND REEL INFORMATION

PACKAGE MATERIALS INFORMATION

15-Nov-2012

*All dimensions are nominal

Device

LM317AEMP

LM317AEMP/NOPB SOT-223 DCY

LM317AEMPX/NOPB SOT-223 DCY

LM317AMDTX

LM317AMDTX/NOPB

LM317EMP

LM317EMP/NOPB

LM317SX/NOPB

Package

Type

Package

Drawing

SOT-223 DCY

PFM

PFM

SOT-223

SOT-223

DDPAK/

TO-263

NDP

NDP

DCY

DCY

LM317EMPX/NOPB SOT-223 DCY

LM317MDTX/NOPB PFM NDP

KTT

Pins

4

4

4

3

3

4

4

4

3

3

SPQ

1000

1000

2000

2500

2500

1000

1000

2000

2500

500

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

330.0

16.4

330.0

330.0

16.4

16.4

A0

(mm)

7.0

7.0

7.0

330.0

330.0

330.0

330.0

16.4

16.4

16.4

16.4

6.9

6.9

7.0

7.0

B0

(mm)

7.5

7.5

7.5

10.5

10.5

7.5

7.5

330.0

330.0

330.0

K0

(mm)

2.2

P1

(mm)

12.0

W

(mm)

16.0

2.2

12.0

16.0

2.2

12.0

16.0

2.7

2.7

8.0

16.0

8.0

16.0

2.2

12.0

16.0

2.2

12.0

16.0

16.4

16.4

7.0

6.9

7.5

10.5

2.2

2.7

12.0

8.0

16.0

16.0

24.4

10.75

14.85

5.0

16.0

24.0

Pin1

Quadrant

Q3

Q2

Q2

Q3

Q3

Q3

Q2

Q2

Q3

Q3

Pack Materials-Page 1

www.ti.com

PACKAGE MATERIALS INFORMATION

15-Nov-2012

*All dimensions are nominal

Device

LM317AEMP

LM317AEMP/NOPB

LM317AEMPX/NOPB

LM317AMDTX

LM317AMDTX/NOPB

LM317EMP

LM317EMP/NOPB

LM317EMPX/NOPB

LM317MDTX/NOPB

LM317SX/NOPB

Package Type Package Drawing Pins

SOT-223

SOT-223

SOT-223

PFM

PFM

SOT-223

SOT-223

SOT-223

PFM

DDPAK/TO-263

DCY

DCY

DCY

NDP

NDP

DCY

DCY

DCY

NDP

KTT

4

4

3

3

3

4

4

3

4

4

SPQ

1000

1000

2000

2500

2500

1000

1000

2000

2500

500

Length (mm) Width (mm) Height (mm)

349.0

349.0

354.0

354.0

358.0

349.0

349.0

354.0

358.0

358.0

337.0

337.0

340.0

340.0

343.0

337.0

337.0

340.0

343.0

343.0

45.0

45.0

35.0

35.0

63.0

45.0

45.0

35.0

63.0

63.0

Pack Materials-Page 2

NAC0016A

MECHANICAL DATA www.ti.com

WG16A (RevG)

NDT0003A

MECHANICAL DATA

H03A (Rev D)

www.ti.com

NDS0002A

MECHANICAL DATA www.ti.com

NDE0003B

MECHANICAL DATA www.ti.com

NDG0003F

MECHANICAL DATA www.ti.com

T03F (Rev B)

NDP0003B

MECHANICAL DATA

TD03B (Rev F)

www.ti.com

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

PLASTIC SMALL-OUTLINE DCY (R-PDSO-G4)

6,70 (0.264)

6,30 (0.248)

4

3,10 (0.122)

2,90 (0.114)

0,10 (0.004) M

7,30 (0.287)

6,70 (0.264)

3,70 (0.146)

3,30 (0.130)

2,30 (0.091)

1 2

4,60 (0.181)

3

0,84 (0.033)

0,66 (0.026)

0,10 (0.004) M

0

°

–10

°

Gauge Plane

1,80 (0.071) MAX

1,70 (0.067)

1,50 (0.059)

Seating Plane

0,08 (0.003)

0,10 (0.0040)

0,02 (0.0008)

0,25 (0.010)

0,75 (0.030) MIN

0,35 (0.014)

0,23 (0.009)

4202506/B 06/2002

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio

Amplifiers

Data Converters

DLP® Products

DSP

Clocks and Timers

Interface

Logic

Power Mgmt

Microcontrollers

RFID

OMAP Applications Processors

Wireless Connectivity www.ti.com/audio amplifier.ti.com

dataconverter.ti.com

www.dlp.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

Medical

Security www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security

Space, Avionics and Defense www.ti.com/space-avionics-defense

Video and Imaging

TI E2E Community

www.ti.com/wirelessconnectivity www.ti.com/video e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2012, Texas Instruments Incorporated

advertisement

Was this manual useful for you? Yes No
Thank you for your participation!

* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project